Rapid cooling device for semiconductor chilling plate processing

Abstract

The invention discloses a rapid cooling device for semiconductor chilling plate processing, and relates to the technical field of semiconductor chilling plate processing and cooling. The rapid cooling device for semiconductor chilling plate processing comprises a cooling table, strip-shaped sliding frames are fixedly connected to the upper end face of the cooling table in a front-back symmetry mode through fixing rods, electric sliding blocks are slidably connected to the interiors of the strip-shaped sliding frames, and rotating shafts are rotatably connected to the two electric sliding blocks; the liquid storage tank and the electric sliding block located on the rear portion are jointly provided with a chip collecting mechanism used for filtering and collecting chips falling into the liquid cooling mechanism in the machining process, the two cooling modes of liquid cooling and air cooling are combined, liquid cooling provides efficient heat transfer to rapidly take away heat, air cooling cools liquid cooling while cooling is conducted, and the chip collecting mechanism is used for filtering and collecting the chips falling into the liquid cooling mechanism in the machining process. Temperature rise in circulation is avoided, so that the stable cooling effect is kept, then grinding chips on the surface of the semiconductor chilling plate are removed, cooling liquid is filtered, temperature fluctuation caused by grinding chip accumulation and liquid pollution is reduced, and temperature control uniformity in the machining process is ensured.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor refrigeration chip processing and cooling, in particular to a rapid cooling device for semiconductor refrigeration chip processing. Background Art

[0002] Semiconductor refrigerators, also known as thermoelectric refrigerators, are refrigeration devices based on the thermoelectric effect. They are mainly used to achieve heat conduction and cooling. They are composed of several N-type and P-type semiconductor materials arranged alternately. When working, the flow of current produces a temperature difference at both ends, thereby achieving a cooling effect. Semiconductor refrigerators are usually used in electronic component cooling, small air-conditioning systems, medical equipment and other fields. The semiconductor refrigerator processing process is a complex multi-step process involving material selection, cutting, doping, grinding, assembly, packaging and other links; among them, the grinding of semiconductor refrigerators is a very important step in the manufacturing process, which is mainly used for precision processing of the size, shape and surface quality of semiconductor refrigerators. Due to the special material of semiconductor refrigerators, the grinding process not only needs to consider the material properties, but also needs to control the temperature to prevent thermal damage or material deformation during processing.

[0003] However, the existing cooling methods are usually liquid cooling or air cooling or other single cooling methods. Each single cooling method has different disadvantages. For example, the coolant in the liquid cooling system will usually gradually heat up during multiple cycles, resulting in a decrease in cooling performance. Although the air cooling system has a simple structure and low cost, it usually cannot provide sufficient cooling effect in high-load processing. Especially under the narrow space limitations of the fin-type cooling plate, air cooling is often not enough to meet the heat dissipation needs.

[0004] During the grinding process of fin-type semiconductor refrigerators, grinding chips often accumulate on the workpiece surface and gaps and enter the coolant. Since traditional cooling equipment is not convenient for cleaning grinding chips in time, grinding chips will accumulate on the surface of the refrigerator, resulting in a decrease in cooling effect. Grinding chips mixed in the coolant will also cause the coolant performance to decrease, further causing the cooling effect to deteriorate. Summary of the invention

[0005] The present invention provides a rapid cooling device for semiconductor refrigeration plate processing, which solves the technical problem that existing cooling methods such as liquid cooling and air cooling each have their own shortcomings. In the liquid cooling system, the coolant temperature rises during multiple cycles, resulting in performance degradation, and although the air cooling system has low cost and simple structure, the cooling effect is insufficient under high load or narrow space constraints. In addition, in the grinding process of the semiconductor refrigeration plate, grinding chips are easily accumulated on the workpiece surface and gap, or mixed into the coolant, resulting in a decrease in cooling effect, and traditional equipment is difficult to clean these grinding chips in time, further affecting the cooling performance.

[0006] The present invention provides a rapid cooling device for processing semiconductor refrigeration plates, comprising a cooling table, wherein the upper end surface of the cooling table is symmetrically fixedly connected with a strip sliding frame through a fixing rod, the strip sliding frames are slidably connected with electric sliders, two of the electric sliders are rotatably connected with a rotating shaft, and a clamping portion for clamping and placing the semiconductor refrigeration plate is commonly provided between the proximal ends of the two rotating shafts, the right part of the upper end surface of the cooling table is fixedly connected with a liquid storage tank through a supporting plate, the liquid storage tank is provided with a liquid cooling mechanism for liquid cooling the semiconductor refrigeration plate, the left part of the liquid storage tank is provided with an air cooling mechanism for further cooling the semiconductor refrigeration plate and synchronously cooling the liquid cooling mechanism so that the liquid cooling mechanism maintains a low temperature state during operation, a swing mechanism for driving the rotating shaft to swing back and forth so that the semiconductor refrigeration plate being processed can quickly discharge debris is commonly provided between the strip sliding frame and the cooling table located at the rear, and a chip collecting mechanism for filtering and collecting debris falling into the liquid cooling mechanism during processing is commonly provided between the liquid storage tank and the electric slider located at the rear.

[0007] In one possible implementation, the liquid cooling mechanism includes an output pipe connected to the lower part of the liquid storage tank, a pump body is arranged on the output pipe, one end of the output pipe away from the liquid storage tank is connected to a horizontal pipe located directly above the liquid storage tank, a plurality of nozzles are connected to the lower part of the horizontal pipe at equal distances along the axial direction, and the outside of the output pipe is connected to a diversion pipe group.

[0008] In one possible implementation, the air cooling mechanism includes an L-shaped tube fixedly connected to the left end surface of the cooling platform by a connecting rod, the rear end of the transverse section of the L-shaped tube is connected to an annular tube, the lower part of the annular tube is circumferentially equidistantly connected to a plurality of nozzles, the lower end of the L-shaped tube is connected to an air intake pipe, an air pump is arranged outside the air intake pipe, and the end of the air intake pipe away from the L-shaped tube is connected to an air gathering bucket mounted on the outside of the separation tube group.

[0009] In a possible implementation, the flow-dividing pipe group includes two U-shaped pipes symmetrically connected to the outside of the output pipe and a plurality of branch pipes equidistantly connected between the left and right sections of the U-shaped pipe.

[0010] In a possible implementation, the chip collection mechanism includes two arc-shaped seat plates respectively embedded and fixedly connected to the front and rear wall plates of the liquid storage tank, an arc-shaped screen is fixedly connected between the two arc-shaped seat plates, mounting grooves are provided at the lower portions of the left and right wall plates of the liquid storage tank, and collection boxes are fixedly connected in the mounting grooves, a scraping and sweeping assembly for sweeping debris filtered by the arc-shaped screen into the collection box is provided on the arc-shaped seat at the rear, and a reciprocating shifting unit for driving the scraping and sweeping assembly to operate is provided between the electric slider at the rear and the liquid storage tank.

[0011] In a possible implementation, the scraping assembly includes an arc groove opened on an arc seat, an arc slider is slidably connected in the arc groove, a return spring is fixedly connected between the arc slider and the arc groove, and a strip scraper is fixedly connected to the front end surface of the arc slider.

[0012] In a possible implementation, the reciprocating shifting unit includes a sliding column fixedly connected to the rear end face of the arc-shaped slider, a sliding rod group fixedly connected to the rear end face of the liquid storage tank through a fixed block, and a strip frame slidably connected to the outside of the sliding rod group and movably sleeved on the outside of the sliding column, the upper end face of the strip frame is fixedly connected to a rack 1, the rear end face of the liquid storage tank is provided with a sliding groove, the sliding groove is slidably connected to an axle rod, the outside of the axle rod is fixedly connected to a gear meshing with the rack 1, the rear end face of the liquid storage tank is fixedly connected to a rack 2 meshing with the upper part of the gear through a connecting block, the left end face of the rack 1 is fixedly connected to a limiting block, the lower end face of the electric slider is fixedly connected to a T-shaped plate, and the lower end face of the transverse section of the T-shaped plate is equidistantly provided with a plurality of shifting rod members cooperating with the axle rod.

[0013] In one possible implementation, the swing mechanism includes a slip ring fixedly connected to the rear end face of the bar-shaped sliding frame, a rod column is slidably connected in the slip ring, a shift bar is fixedly connected to the outside of the rotating shaft at the rear, a waist-shaped groove is provided on the shift bar, a push-pull column slidably connected to the front part of the outer wall of the rod column is fixedly connected to the front part of the outer wall of the rod column, the upper end face of the cooling table is fixedly connected to the S-shaped frame through a vertical rod, and a shift column slidably arranged in the S-shaped frame is fixedly connected to the rear part of the outer wall of the rod column.

[0014] In a possible implementation, limiting grooves are provided on the upper and lower groove walls of the sliding groove, and a limiting ring slidably connected in the limiting groove is fixedly connected to the outside of the shaft rod.

[0015] In one possible implementation, the shift rod member includes an upper shift plate fixedly connected to the lower end surface of the transverse section of the T-shaped plate, a lug is fixedly connected to the lower end surface of the upper shift plate, a rotating column is rotatably connected to the lug, a torsion spring is fixedly connected between the rotating column and the lug, and a lower shift plate for shifting the shaft rod is fixedly connected to the outside of the rotating column.

[0016] It can be seen from the above technical solutions that the present invention has the following advantages:

[0017] In the present invention, a cooling method combining liquid cooling and air cooling is adopted, wherein liquid cooling provides efficient heat transfer and can quickly take away heat in a short time, while air cooling further cools the liquid cooling liquid in the circulation process, thereby preventing the temperature of the coolant from rising during multiple cycles, thereby maintaining long-term and efficient cooling of the liquid cooling system. The two complement each other to ensure that a stable cooling effect on the semiconductor refrigeration plate is maintained during long-term operation.

[0018] In the present invention, the semiconductor refrigeration plate in liquid cooling movement is shaken by a swinging mechanism, so that the grinding chips in the processing can be removed in time, avoiding the accumulation of grinding chips on the surface and gaps of the semiconductor refrigeration plate, ensuring that the coolant can flow continuously and effectively and fully contact the surface of the refrigeration plate, ensuring that the cooling performance of the semiconductor refrigeration plate remains stable.

[0019] In the present invention, the grinding chips in the coolant are filtered and collected in real time by a chip collection mechanism, thereby avoiding the accumulation of grinding chips in the coolant, ensuring the cleanliness and performance of the coolant, and further ensuring that the coolant can maintain good heat transfer performance, improving the cooling effect on the semiconductor refrigeration plate, and at the same time extending the service life of the coolant in the liquid cooling mechanism.

[0020] In the present invention, by combining the removal of grinding chips accumulated on the surface of the semiconductor refrigeration plate during processing and cooling liquid filtration, the temperature fluctuation caused by the accumulation of grinding chips and the contamination of the coolant is reduced, ensuring that the semiconductor refrigeration plate can maintain more uniform temperature control during the grinding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0022] Figure 1 This is a schematic structural diagram of a rapid cooling device for semiconductor refrigeration sheet processing provided by the present invention.

[0023] Figure 2 The present invention provides a schematic cross-sectional view of the overall structure.

[0024] Figure 3 This is a schematic diagram of the rear view structure of the liquid storage tank provided by the present invention.

[0025] Figure 4 The present invention provides Figure 3 Schematic diagram of the enlarged structure of part A in the figure.

[0026] Figure 5 This is a schematic diagram of the installation structure of the chip collection mechanism provided by the present invention.

[0027] Figure 6 The present invention provides Figure 5 Schematic diagram of the enlarged structure of part B.

[0028] Figure 7 A schematic cross-sectional view of the connection structure between the limiting groove and the limiting ring provided by the present invention.

[0029] Figure 8 This is a schematic cross-sectional view of the partial structure of the chip collection mechanism provided by the present invention from a front perspective.

[0030] Fig. 9 The present invention provides Figure 8 Schematic diagram of the enlarged structure of part C in the figure.

[0031] Fig.10 This is a schematic diagram of the shape of the working object provided by the present invention.

[0032] The above drawings include the following reference numerals:

[0033] 1. Cooling table; 2. Strip sliding frame; 3. Electric slider; 4. Rotating shaft; 5. Clamping part; 6. Chip collecting mechanism; 61. Arc seat plate; 62. Arc screen; 63. Collecting box; 64. Sweeping assembly; 641. Arc groove; 642. Arc slider; 643. Return spring; 644. Strip scraper; 65. Reciprocating shifting unit; 651. Sliding column; 652. Sliding rod group; 653. Strip frame; 654. Rack 1; 655. Sliding groove; 656. Shaft; 657. Gear; 658. Rack 2; 659. Stop block; 6 510, T-shaped plate; 65a, lever; 65a1, upper lever plate; 65a2, lower lever plate; 7, liquid cooling mechanism; 71, output pipe; 72, horizontal pipe; 73, nozzle; 74, diverter pipe group; 8, air cooling mechanism; 81, L-shaped pipe; 82, annular pipe; 83, nozzle; 84, air intake pipe; 85, air collecting bucket; 9, swing mechanism; 91, slip ring; 92, rod column; 93, lever bar; 94, waist-shaped groove; 95, push-pull column; 96, S-shaped frame; 97, lever column; 10, liquid storage tank; 11, limit groove; 12, limit ring. DETAILED DESCRIPTION

[0034] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0035] See also Figure 1 and Figure 3The present invention provides a technical solution: a rapid cooling device for semiconductor refrigeration sheet processing, comprising a cooling platform 1, the upper end surface of the cooling platform 1 is symmetrically fixedly connected to a strip slide frame 2 through a fixing rod, the strip slide frame 2 is slidably connected to an electric slider 3, the two electric sliders 3 are rotatably connected to a rotating shaft 4, and a clamping portion 5 for clamping and placing the semiconductor refrigeration sheet is commonly provided between the proximal ends of the two rotating shafts 4, the right part of the upper end surface of the cooling platform 1 is fixedly connected to a liquid storage tank 10 through a support plate, and the liquid storage tank 10 is provided with a liquid cooling device for cooling the semiconductor refrigeration sheet. A liquid cooling mechanism 7 is provided, and an air cooling mechanism 8 is provided on the left side of the liquid storage tank 10 for further cooling the semiconductor refrigeration plate and synchronously cooling the liquid cooling mechanism 7 so that the liquid cooling mechanism 7 maintains a low temperature state during operation; a swing mechanism 9 is provided between the strip slide frame 2 at the rear and the cooling table 1 for driving the rotating shaft 4 to swing back and forth so that the semiconductor refrigeration plate being processed can quickly discharge debris; a chip collecting mechanism 6 is provided between the liquid storage tank 10 and the electric slider 3 at the rear for filtering and collecting debris that falls into the liquid cooling mechanism 7 during processing.

[0036] See also Figure 1 and Figure 2 In this embodiment, the liquid cooling mechanism 7 includes an output pipe 71 connected to the lower part of the liquid storage tank 10, and a pump body is arranged on the output pipe 71. One end of the output pipe 71 away from the liquid storage tank 10 is connected to a transverse pipe 72 located directly above the liquid storage tank 10, and a plurality of nozzles 73 are equidistantly connected to the lower part of the transverse pipe 72 along the axial direction. The outside of the output pipe 71 is connected to a diversion pipe group 74, and the diversion pipe group 74 includes two U-shaped pipes symmetrically connected to the outside of the output pipe 71 front and back and a plurality of branch pipes equidistantly connected between the left and right sections of the U-shaped pipe.

[0037] See also Figure 2 The air cooling mechanism 8 includes an L-shaped tube 81 fixedly connected to the left part of the upper end surface of the cooling platform 1 through a connecting rod, the rear end of the transverse section of the L-shaped tube 81 is connected to an annular tube 82, the lower part of the annular tube 82 is connected to a plurality of nozzles 83 at equal intervals in the circumferential direction, the lower end of the L-shaped tube 81 is connected to an air intake pipe 84, an air pump is arranged outside the air intake pipe 84, and the end of the air intake pipe 84 away from the L-shaped tube 81 is connected to a gas collecting bucket 85 which is sleeved on the outside of the separation tube group.

[0038] The initial position of the electric slider 3 is located at the right part of the strip slide frame 2. Before processing the semiconductor refrigeration plate, the coolant is poured into the liquid storage tank 10, and then the semiconductor refrigeration plate is placed in the clamping part 5 for clamping and limiting. Then the electric slider 3 is controlled to drive the clamping part 5 to move slowly to the left, and the clamping part 5 drives the semiconductor refrigeration plate to move synchronously. When the semiconductor refrigeration plate moves to the position above the liquid storage tank 10, the external grinding equipment is controlled to operate, and the side of the semiconductor refrigeration plate is ground. At the same time, the pump body is controlled to operate to draw the coolant into the output pipe 71, and the coolant is then pumped into the diverter pipe group 74. The coolant gradually flows upward in the output pipe 71 and enters the horizontal pipe 72, and finally sprayed from the nozzle 73 onto the surface of the semiconductor refrigeration plate being processed, so as to cool the semiconductor refrigeration plate. The coolant that absorbs the heat during processing from the surface of the semiconductor refrigeration plate flows back downward to the liquid storage tank 10, and then is fully pumped into the output pipe 71 again in the above steps, so that the semiconductor refrigeration plate can be liquid-cooled.

[0039] The pump body is running and the air pump is controlled to run at the same time. The air pump draws the external airflow into the air gathering bucket 85 at a high speed. While the air gathering bucket 85 sucks the airflow from the outside, the continuously flowing airflow passes through the outside of the shunt pipe group 74, so that the coolant flowing through the shunt pipe group 74 can be cooled, thereby avoiding the coolant temperature being too high during recycling. When the electric slider 3 drives the semiconductor refrigeration plate to move to the left to the position below the annular tube 82, the airflow pumped into the air inlet pipe 84 by the air pump will enter the L-shaped tube 81, and then the airflow flows upward along the L-shaped tube 81 into the annular tube 82, and finally sprayed out from the nozzle 83 onto the surface of the semiconductor refrigeration plate, which can further cool down the semiconductor refrigeration plate that is about to be processed, and at the same time, it can also blow and evaporate the coolant attached to the surface of the semiconductor refrigeration plate, and blow away some of the residual grinding chips. The cooling is completed while ensuring the smoothness of the surface of the semiconductor refrigeration plate.

[0040] Finally, remove the semiconductor refrigeration piece after cooling, control the electric slider 3 to move rightward and reset, make the electric slider 3 move rightward to the initial position, then put the next semiconductor refrigeration piece into the clamping part 5 for clamping and placing, and control the electric slider 3 again to drive the next semiconductor refrigeration piece to move leftward for cooling treatment during processing.

[0041] See also Figure 3 and Figure 4In this embodiment, the swing mechanism 9 includes a slip ring 91 fixedly connected to the rear end surface of the bar slide frame 2, a rod column 92 is slidably connected in the slip ring 91, a shift bar 93 is fixedly connected to the outside of the rotating shaft 4 located at the rear, a waist-shaped groove 94 is provided on the shift bar 93, a push-pull column 95 slidably connected in the waist-shaped groove 94 is fixedly connected to the front of the outer wall of the rod column 92, an S-shaped frame 96 is fixedly connected to the upper end surface of the cooling table 1 through a vertical rod, an opening is provided on the left part of the S-shaped frame 96, and a shift column 97 slidably set in the S-shaped frame 96 is fixedly connected to the rear of the outer wall of the rod column 92.

[0042] When the electric slider 3 moves to the left, it will also drive the rod column 92 to move synchronously through the slip ring 91. The rod column 92 then drives the lever column 97 to slide in the S-shaped frame 96. The shape of the S-shaped frame 96 makes the lever column 97 in the lateral movement be squeezed and slowly reciprocate up and down. The lever column 97 then drives the rod column 92 to move synchronously up and down. The rod column 92 then pushes the waist-shaped groove 94 through the push-pull column 95, so that the lever bar 93 swings back and forth. The lever bar 93 then drives the shaft 4 at the rear to swing back and forth. The shaft 4 then drives the semiconductor cooling plate to swing back and forth through the clamping part 5, so that the semiconductor cooling plate is shaken during the grinding process, so that the grinding chips can be discharged from the surface of the semiconductor cooling plate in time, avoiding the accumulation of grinding chips and ensuring that the heat on the surface of the semiconductor cooling plate can be discharged without obstruction.

[0043] See also Figure 5 and Figure 8 In this embodiment, the chip collecting mechanism 6 includes two arc-shaped seat plates 61 respectively embedded and fixedly connected to the front and rear wall plates of the liquid storage tank 10, and an arc-shaped blocking net 62 is fixedly connected between the two arc-shaped seat plates 61. The lower parts of the left and right wall plates of the liquid storage tank 10 are provided with installation grooves, and collection boxes 63 are fixedly connected in the installation grooves. A scraping assembly 64 for sweeping the debris filtered by the arc-shaped blocking net 62 into the collection box 63 is arranged on the arc-shaped seat at the rear, and a reciprocating shifting unit 65 for driving the scraping assembly 64 to operate is arranged between the electric slider 3 at the rear and the liquid storage tank 10.

[0044] See also Figure 5 , Figure 6 , Figure 7 , Figure 8 and Fig. 9The scraping assembly 64 includes an arc groove 641 provided on the arc seat, an arc slider 642 is slidably connected in the arc groove 641, a return spring 643 is fixedly connected between the arc slider 642 and the arc groove 641, and a strip scraper 644 is fixedly connected to the front end surface of the arc slider 642. The reciprocating shifting unit 65 includes a slide column 651 fixedly connected to the rear end surface of the arc slider 642, a slide rod group 652 fixedly connected to the rear end surface of the liquid storage tank 10 through a fixed block, and a strip frame 653 slidably connected to the outside of the slide rod group 652 and movably sleeved on the outside of the slide column 651, a rack 654 is fixedly connected to the upper end surface of the strip frame 653, a sliding groove 655 is provided on the rear end surface of the liquid storage tank 10, and a shaft 656 is slidably connected in the sliding groove 655 , the upper and lower groove walls of the sliding groove 655 are provided with limiting grooves 11, the shaft rod 656 is fixedly connected to the outside with a limiting ring 12 which is slidably connected to the limiting groove 11, and the position of the shaft rod 656 is limited by the limiting ring 12 which is slidably engaged in the two limiting grooves 11 to prevent the shaft rod 656 from being separated from the sliding groove 655, the shaft rod 656 is fixedly connected to the outside with a gear 657 which meshes with the rack 1 654, the rear end surface of the liquid storage tank 10 is fixedly connected with a rack 2 658 which meshes with the upper part of the gear 657 through a connecting block, the left end surface of the rack 1 654 is fixedly connected with a limiting block 659, the lower end surface of the electric slider 3 is fixedly connected with a T-shaped plate 6510, and the lower end surface of the transverse section of the T-shaped plate 6510 is equidistantly provided with a plurality of lever members 65a which cooperate with the shaft rod 656.

[0045] See also Figure 4 , Figure 5 and Figure 7 The lever member 65a includes an upper lever plate 65a1 fixedly connected to the lower end surface of the transverse section of the T-shaped plate 6510, a lug is fixedly connected to the lower end surface of the upper lever plate 65a1, a rotating column is rotatably connected to the lug, a torsion spring is fixedly connected between the rotating column and the lug, and a lower lever plate 65a2 for moving the lever shaft 656 is fixedly connected to the outside of the rotating column.

[0046] The coolant is sprayed on the semiconductor refrigeration plate for cooling, and then flows downward and is mixed with the grinding chips generated during the processing. The coolant mixed with the grinding chips flows downward and passes through the arc-shaped screen 62. The arc-shaped screen 62 intercepts the grinding chips in the coolant on its upper surface, and the coolant is filtered through the arc-shaped screen 62. The electric slider 3 moves to the left and also drives the T-shaped plate 6510 to move synchronously. The T-shaped plate 6510 then drives the lever 65a to move. When the first lever 65a from the left moves to the left and contacts the shaft 656, it pushes the shaft 656 to move to the left synchronously. The shaft 656 then drives the gear 657 to move and rotate on the rack 2 658. The gear 657 rotates under the action of the rack 2 658. The gear 657 moves to the left, and then drives the rack 1 654 meshing with the gear 657 to move to the left. The special distribution combination of rack 2 658, gear 657 and rack 1 654 is used to amplify the lateral movement of gear 657. Rack 1 654 then drives the strip frame 653 to move to the left. The strip frame 653 then pushes the arc-shaped slider 642 to move along the path of the arc-shaped groove 641 through the sliding column 651. The arc block then drives the strip scraper 644 to move on the surface of the arc-shaped blocking net 62, and pushes the grinding chips intercepted on the surface of the arc-shaped blocking net 62 to the left along the arc direction of the arc-shaped blocking net 62 until the strip scraper 644 moves to the left part of the surface of the arc-shaped blocking net 62, and pushes the grinding chips into the collection box 63 on the left.

[0047] At this time, the shaft rod 656 also moves to the left until it contacts the left wall of the sliding groove 655, and the shaft rod 656 stops moving horizontally. The electric slider 3 drives the lever member 65a to continue to move left through the T-shaped plate 6510, and the T-shaped plate 6510 drives the first upper shifting plate 65a1 on the left to continue to move left. Since the first lower shifting plate 65a2 on the left is resisted by the shaft rod 656 and cannot move left synchronously with the upper shifting plate 65a1, the upper shifting plate 65a1 that continues to move left will make the lateral moving force greater than the torsion spring The force causes the lower plate 65a2 to rotate around the rotating column, and then the upper plate 65a1 drives the rotated lower plate 65a2 to cross the shaft 656, and then the lower arc-shaped slider 642 is driven to move to the right by the reset spring 643, and the arc-shaped slider 642 drives the strip scraper 644 to move to the right. During the process of moving right along the surface of the arc-shaped blocking net 62, the strip scraper 644 can once again scrape the intercepted grinding chips and scrape the grinding chips into the collection box 63 on the left.

[0048] The arc-shaped slider 642 is reset and pushed to the right by the reset spring 643, and at the same time, it also drives the strip frame 653 to move to the left through the sliding column 651. The strip frame 653 then drives the rack 1 654 to move to the right. After the rack 1 654 moves to the right for a distance, it drives the limit block 659 to get stuck in the left part of the gear 657, and then drives the gear 657 to move to the right synchronously. The gear 657 then drives the shaft rod 656 to move to the right until the shaft rod 656 moves to the right and hits the right groove wall of the sliding groove 655, that is, the initial position; then the T-shaped plate 6510 which continues to move to the left drives the second lever member 65a from the left to contact the shaft rod 656 after the right movement is reset, and repeats the above-mentioned step of the shaft rod 656 being pushed to the left by the lever member 65a, so that the strip scraper 644 can move on the surface of the arc-shaped screen 62 again, and the filtered grinding chips can be cleaned and collected in time.

[0049] During operation, the electric slider 3 is initially located at the right part of the strip slide frame 2, and the semiconductor refrigeration sheet is placed in the clamping part 5. Then the electric slider 3 is controlled to drive the clamping part 5 to move left, and the clamping part 5 drives the semiconductor refrigeration sheet to move left. When the semiconductor refrigeration sheet moves over the top of the liquid storage tank 10, it can be ground by controlling the external grinding equipment. At the same time, the liquid cooling mechanism 7 is controlled to operate to cool down the semiconductor refrigeration sheet in processing. The swing mechanism 9 will also operate at this time, so that the semiconductor refrigeration sheet in liquid cooling shakes, and the grinding chips attached to the surface of the semiconductor refrigeration sheet during the processing are discharged in time, and then the grinding chips mixed in the coolant are separated and collected by the chip collecting mechanism 6. The air cooling mechanism 8 is controlled to operate synchronously with the liquid cooling mechanism 7. During the operation of the air cooling mechanism 8, the coolant that is continuously circulated in the liquid cooling mechanism 7 is cooled to avoid excessively high temperature of the coolant in the recycling. When the electric slider 3 drives the semiconductor refrigeration sheet to move left to the position below the air cooling mechanism 8, the air cooling mechanism 8 blows air to the surface of the semiconductor refrigeration sheet to further cool the semiconductor refrigeration sheet.

[0050] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0051] In addition, the terms "first", "second", "number one", "number two" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "number one", "number two" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0052] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0053] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, all equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A rapid cooling device for semiconductor refrigeration chip processing, comprising a cooling table (1), characterized in that: The upper end surface of the cooling platform (1) is symmetrically fixedly connected to a strip sliding frame (2) through a fixing rod, and the strip sliding frame (2) is slidably connected to an electric sliding block (3), and the two electric sliding blocks (3) are rotatably connected to a rotating shaft (4), and a clamping portion (5) for clamping and placing a semiconductor cooling plate is commonly provided between the adjacent ends of the two rotating shafts (4); The right part of the upper end surface of the cooling platform (1) is fixedly connected to a liquid storage tank (10) via a support plate, the liquid storage tank (10) is provided with a liquid cooling mechanism (7) for liquid cooling the semiconductor refrigeration plate, and the left part of the liquid storage tank (10) is provided with an air cooling mechanism (8) for further cooling the semiconductor refrigeration plate and synchronously cooling the liquid cooling mechanism (7) so that the liquid cooling mechanism (7) maintains a low temperature state during operation; A swing mechanism (9) is provided between the strip slide frame (2) and the cooling table (1) at the rear to drive the rotating shaft (4) to swing back and forth so that the semiconductor cooling plate being processed can quickly discharge debris. A chip collection mechanism (6) is provided between the liquid storage tank (10) and the electric slider (3) at the rear to filter and collect the debris that falls into the liquid cooling mechanism (7) during processing.

2. A rapid cooling device for semiconductor refrigeration sheet processing according to claim 1, characterized in that: The liquid cooling mechanism (7) comprises an output pipe (71) connected to the lower part of the liquid storage tank (10), a pump body is arranged on the output pipe (71), one end of the output pipe (71) away from the liquid storage tank (10) is connected to a transverse pipe (72) located directly above the liquid storage tank (10), the lower part of the transverse pipe (72) is connected to a plurality of nozzles (73) equidistantly along the axial direction, and the outside of the output pipe (71) is connected to a diversion pipe group (74).

3. A rapid cooling device for semiconductor refrigeration sheet processing according to claim 2, characterized in that: The air cooling mechanism (8) comprises an L-shaped tube (81) fixedly connected to the left part of the upper end surface of the cooling platform (1) through a connecting rod, the rear end of the transverse section of the L-shaped tube (81) is connected to an annular tube (82), the lower part of the annular tube (82) is connected to a plurality of nozzles (83) equidistantly in the circumferential direction, the lower end of the L-shaped tube (81) is connected to an air intake pipe (84), an air pump is arranged outside the air intake pipe (84), and one end of the air intake pipe (84) away from the L-shaped tube (81) is connected to a gas collecting bucket (85) sleeved on the outside of the separation tube group.

4. A rapid cooling device for semiconductor refrigeration sheet processing according to claim 2, characterized in that: The flow dividing pipe group (74) comprises two U-shaped pipes symmetrically connected to the outside of the output pipe (71) in a front-to-back manner and a plurality of branch pipes equidistantly connected between the left and right sections of the U-shaped pipe.

5. A rapid cooling device for semiconductor refrigeration sheet processing according to claim 1, characterized in that: The chip collecting mechanism (6) comprises two arc-shaped seat plates (61) respectively embedded and fixedly connected to the front and rear wall plates of the liquid storage tank (10); an arc-shaped screen (62) is fixedly connected between the two arc-shaped seat plates (61); installation grooves are provided at the lower parts of the left and right wall plates of the liquid storage tank (10); a collection box (63) is fixedly connected in each of the installation grooves; a scraping assembly (64) for sweeping the debris filtered by the arc-shaped screen (62) into the collection box (63) is provided on the arc-shaped seat at the rear; and a reciprocating shifting unit (65) for driving the scraping assembly (64) to operate is provided between the electric slider (3) at the rear and the liquid storage tank (10).

6. A rapid cooling device for semiconductor refrigeration sheet processing according to claim 5, characterized in that: The scraping assembly (64) comprises an arc-shaped groove (641) provided on the arc-shaped seat, an arc-shaped slider (642) being slidably connected in the arc-shaped groove (641), a return spring (643) being fixedly connected between the arc-shaped slider (642) and the arc-shaped groove (641), and a strip-shaped scraper (644) being fixedly connected to the front end surface of the arc-shaped slider (642).

7. A rapid cooling device for semiconductor refrigeration sheet processing according to claim 6, characterized in that: The reciprocating shifting unit (65) comprises a sliding column (651) fixedly connected to the rear end surface of the arc-shaped sliding block (642), a sliding rod group (652) fixedly connected to the rear end surface of the liquid storage tank (10) through a fixed block, and a strip frame (653) slidably connected to the outside of the sliding rod group (652) and movably sleeved on the outside of the sliding column (651), the upper end surface of the strip frame (653) is fixedly connected to a rack (654), the rear end surface of the liquid storage tank (10) is provided with a sliding groove (655), and a shaft is slidably connected in the sliding groove (655). (656), the shaft (656) is externally fixedly connected with a gear (657) meshing with the rack (654), the rear end face of the liquid storage tank (10) is fixedly connected with the rack (658) meshing with the upper part of the gear (657) through a connecting block, the left end face of the rack (654) is fixedly connected with a limiting block (659), the lower end face of the electric slider (3) is fixedly connected with a T-shaped plate (6510), and the lower end face of the transverse section of the T-shaped plate (6510) is equidistantly provided with a plurality of lever members (65a) cooperating with the shaft (656).

8. A rapid cooling device for semiconductor refrigeration sheet processing according to claim 1, characterized in that: The swing mechanism (9) comprises a slip ring (91) fixedly connected to the rear end face of the bar-shaped sliding frame (2), a rod column (92) being slidably connected in the slip ring (91), a shifting bar (93) being fixedly connected to the outside of the rotating shaft (4) at the rear, a waist-shaped groove (94) being provided on the shifting bar (93), a push-pull column (95) being slidably connected in the waist-shaped groove (94) being fixedly connected to the front part of the outer wall of the rod column (92), an S-shaped frame (96) being fixedly connected to the upper end face of the cooling table (1) via a vertical rod, and a shifting column (97) being slidably arranged in the S-shaped frame (96) being fixedly connected to the rear part of the outer wall of the rod column (92).

9. A rapid cooling device for semiconductor refrigeration sheet processing according to claim 7, characterized in that: The upper and lower groove walls of the sliding groove (655) are both provided with limiting grooves (11), and the shaft rod (656) is externally fixedly connected with a limiting ring (12) which is slidably connected in the limiting groove (11).

10. A rapid cooling device for semiconductor refrigeration sheet processing according to claim 7, characterized in that: The lever member (65a) comprises an upper lever plate (65a1) fixedly connected to the lower end surface of the transverse section of the T-shaped plate (6510); a lug is fixedly connected to the lower end surface of the upper lever plate (65a1); a rotating column is rotatably connected to the lug; a torsion spring is fixedly connected between the rotating column and the lug; and a lower lever plate (65a2) for moving the shaft rod (656) is fixedly connected to the outside of the rotating column.

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