Heat dissipation module

Abstract

The invention provides a heat dissipation module suitable for an electronic device. The electronic device is provided with a fan which is provided with an air outlet. The heat dissipation module comprises a vapor chamber and a communicating pipe. The uniform temperature plate is provided with a first cavity and a second cavity communicated with the first cavity. The first cavity is provided with an evaporation area, and the position, corresponding to the evaporation area, of the surface of the vapor chamber is thermally coupled to a heat source. The communicating pipe comprises a first pipeline and a second pipeline communicated with the first pipeline, the first pipeline is communicated with the first cavity, and the inner wall face of the first pipeline is a smooth face. The second pipeline is communicated with the second cavity, and a capillary structure is arranged on the inner wall face of the second pipeline. A hollow area is defined by the first cavity, the second cavity and the communicating pipe, the fan is suitable for being arranged in the hollow area, and the air outlet faces the second pipeline.

Description

Technical Field

[0001] The invention relates to a heat dissipation technology, and in particular to a heat dissipation module. Background Art

[0002] As the computing performance of the CPU or GPU in a notebook computer increases, the CPU or GPU generates a large amount of heat during operation. To quickly dissipate the heat, the notebook computer is usually equipped with a fan, a heat pipe, and a vapor chamber as a heat dissipation module.

[0003] In detail, the temperature vaporizer is thermally coupled to the heat source, and the area of ​​the temperature vaporizer that is in contact with the heat source or overlaps with the heat source is used as the evaporation zone. When the evaporation zone absorbs heat from the heat source, the liquid working fluid in the cavity of the temperature vaporizer evaporates into a gaseous working fluid and flows to the relatively low temperature area outside the evaporation zone. The gaseous working fluid releases heat in the relatively low temperature area and condenses into a liquid working fluid, and flows back to the evaporation zone through capillary force.

[0004] On the other hand, the heat pipe includes an evaporation section and a condensation section, wherein the evaporation section is welded to the temperature equalizing plate, and the condensation section is arranged corresponding to the air outlet of the fan. When the liquid working fluid in the evaporation section of the heat pipe absorbs heat from the temperature equalizing plate, the liquid working fluid evaporates into a gaseous working fluid and flows to the condensation section. The heat dissipation airflow blown out from the air outlet of the fan blows toward the condensation section of the heat pipe, and exchanges heat with the gaseous working fluid in the condensation section, so that the gaseous working fluid releases heat and condenses into a liquid working fluid, and flows back to the evaporation section through capillary force.

[0005] Since the temperature spreader and the heat pipe are not connected to each other, poor welding quality will cause the heat conduction efficiency between the temperature spreader and the heat pipe to decline. In addition, due to the structural design of the heat pipe, it is difficult for the gaseous working fluid to flow to the far end of the condensation section, causing excessive heat concentration at the near end of the condensation section (i.e., the area close to the evaporation section), resulting in poor heat pipe utilization efficiency. Therefore, the common heat dissipation module composed of a fan, a heat pipe and a temperature spreader has the problem of poor heat dissipation performance. Summary of the invention

[0006] According to an embodiment of the present invention, a heat dissipation module is suitable for an electronic device. The electronic device has a fan, and the fan has an air outlet. The heat dissipation module includes a temperature-averaging plate and a connecting pipe. The temperature-averaging plate has a first cavity and a second cavity connected to the first cavity. The first cavity has an evaporation zone, wherein the surface of the temperature-averaging plate is thermally coupled to a heat source at a position corresponding to the evaporation zone. The connecting pipe includes a first pipeline and a second pipeline connected to the first pipeline, wherein the first pipeline is connected to the first cavity, and the inner wall surface thereof is a smooth surface. The second pipeline is connected to the second cavity, and a capillary structure is provided on the inner wall surface thereof. The first cavity, the second cavity and the connecting pipe surround a hollow area, wherein the fan is suitable for being arranged in the hollow area, and the air outlet faces the second pipeline.

[0007] Based on the above, the temperature plate can diffuse heat from the evaporation area to the outside to prevent heat concentration. In addition, the temperature plate can disperse part of the heat to the connecting pipe and discharge it outward from the connecting pipe. Therefore, the heat dissipation module can accelerate the gas-liquid two-phase change process of the working fluid to improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a schematic diagram of a heat dissipation module according to a first embodiment of the present invention;

[0009] Figure 2 is a schematic diagram of a heat dissipation module according to a second embodiment of the present invention;

[0010] Figure 3 is a schematic diagram of a heat dissipation module according to a third embodiment of the present invention;

[0011] Figure 4 is a schematic diagram of a heat dissipation module according to a fourth embodiment of the present invention. DETAILED DESCRIPTION

[0012] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0013] Figure 1 is a schematic diagram of a heat dissipation module according to the first embodiment of the present invention. Figure 1 In this embodiment, the heat dissipation module 100 is disposed in the electronic device 10, and the electronic device 10 has a heat source 11 and a fan 12. For example, the electronic device 10 may be a part of a notebook computer (eg, a host with logic computing capabilities), but is not limited thereto.

[0014] In detail, the heat dissipation module 100 includes a temperature vaporizer 110 and a connecting pipe 120, wherein the temperature vaporizer 110 has a first cavity 111 and a second cavity 113, and the second cavity 113 is connected to the first cavity 111. The first cavity 111 has an evaporation area 112, and the surface of the temperature vaporizer 110 is thermally coupled to the heat source 11 at a position corresponding to the evaporation area 112. For example, the heat source 11 can be a central processing unit or a graphics processing unit.

[0015] When the evaporation zone 112 absorbs heat from the heat source 11, the liquid working fluid 102 in the first cavity 111 of the vapor chamber 110 evaporates into the gaseous working fluid 101 and flows to the relatively low temperature area outside the evaporation zone 112. On the other hand, the gaseous working fluid 101 releases heat in the relatively low temperature area and condenses into the liquid working fluid 102, and flows back to the evaporation zone 112 by capillary force. For example, the second cavity 113 may be a relatively low temperature area, and the gaseous working fluid 101 may flow from the first cavity 111 to the second cavity 113, and release heat in the second cavity 113 and condense into the liquid working fluid 102, so as to flow back to the evaporation zone 112 by capillary force.

[0016] like Figure 1 As shown, the connecting pipe 120 includes a first pipe 121 and a second pipe 122 connected to the first pipe 121, wherein the first pipe 121 is connected to the first cavity 111, and the second pipe 122 is connected to the second cavity 113. In detail, the inner wall surface of the first pipe 121 is a smooth surface, and the inner wall surface of the second pipe 122 is provided with a capillary structure 123. For example, the connecting pipe 120 can be a hollow tube welded to the temperature plate 110 or a hollow tube integrally formed on the temperature plate 110.

[0017] The first pipeline 121 serves as a vapor delivery pipeline, and the second pipeline 122 serves as a condensation pipeline. When the liquid working fluid 102 in the first cavity 111 of the temperature homogenizing plate 110 evaporates into a gaseous working fluid 101, the gaseous working fluid 101 can flow to the first pipeline 121, and flow to the second pipeline 122 via the first pipeline 121. The gaseous working fluid 101 can release heat and condense into a liquid working fluid 102 in the second pipeline 122, and the capillary structure 123 can guide the liquid working fluid 102 to flow to the second cavity 113 to prevent the liquid working fluid 102 from flowing back to the first pipeline 121. After the liquid working fluid 102 flows from the second pipeline 122 into the second cavity 113, the liquid working fluid 102 can flow back to the evaporation area 112 by capillary force. In other words, the working fluid can undergo a gas-liquid two-phase change in the connecting tube 120 and maintain a unidirectional flow to improve the heat dissipation efficiency.

[0018] In this embodiment, there is a first turning point between the second pipeline 122 and the first pipeline 121, and there is a second turning point between the second pipeline 122 and the second cavity 113. For example, the second pipeline 122 may be perpendicular to the first pipeline 121 and the second cavity 113. In addition, the capillary structure 123 may be distributed on the entire inner wall surface of the second pipeline 122, or the capillary structure 123 may be distributed on a partial inner wall surface of the second pipeline 122, for example, the inner wall surface of the second pipeline 122 may be divided into a first portion close to the first turning point and a second portion extending from the first portion to the second turning point, wherein the first portion may be a smooth surface, and the second portion may be provided with the capillary structure 123.

[0019] like Figure 1 As shown, the fan 12 may be a centrifugal fan, and is surrounded by the first cavity 111, the second cavity 113 and the connecting pipe 120. In detail, the air outlet 12a of the fan 12 faces the second pipe 122, and the heat dissipation airflow blown out from the air outlet 12a of the fan 12 can be blown to the second pipe 122, and perform heat exchange with the gaseous working fluid 101 in the second pipe 122, so that the gaseous working fluid 101 releases heat and condenses into liquid working fluid 102, and flows to the second cavity 113 through capillary force.

[0020] In this embodiment, the second cavity 113 and the first pipe 121 are connected to the same side of the first cavity 111, and the second pipe 122 is located between the second cavity 113 and the first pipe 121. Further, the first cavity 111, the first pipe 121, the second pipe 122 and the second cavity 113 can surround and form a hollow area 103, and the fan 12 can be disposed in the hollow area 103, so as to achieve the purpose of simplifying the structural design and saving the configuration space.

[0021] like Figure 1 As shown, the heat dissipation module 100 further includes heat dissipation fins 140, wherein the heat dissipation fins 140 are disposed corresponding to the air outlet 12a of the fan 12 and are thermally coupled to the second pipe 122. Specifically, the second pipe 122 can conduct heat released from the working fluid to the heat dissipation fins 140 to increase the heat exchange area.

[0022] In this embodiment, the temperature plate 110 can diffuse the heat from the evaporation area 112 outward through the liquid-gas two-phase change of the working fluid to prevent heat concentration. In addition, the temperature plate 110 can disperse a portion of the heat to the connecting pipe 120, that is, the connecting pipe 120 receives part of the gaseous working fluid 101 from the temperature plate 110. Further, the gaseous working fluid 101 can undergo a gas-liquid two-phase change in the connecting pipe 120 to be converted into a liquid working fluid 102, so that the released heat is discharged from the connecting pipe 120. Therefore, the heat dissipation module 100 can accelerate the gas-liquid two-phase change process of the working fluid to improve the heat dissipation efficiency.

[0023] Figure 2 is a schematic diagram of a heat dissipation module according to a second embodiment of the present invention. Figure 2 The heat dissipation module 100A of this embodiment is also applicable to the electronic device 10. It is substantially the same in design as the heat dissipation module 100 of the first embodiment. The main difference between the two is that in this embodiment, there are two connecting tubes 120, and the two connecting tubes 120 are arranged in parallel. Therefore, the gaseous working fluid 101 can be divided into the two connecting tubes 120, and release heat in the two connecting tubes 120 to condense into the liquid working fluid 102, and finally converge into the second cavity 113.

[0024] Figure 3 is a schematic diagram of a heat dissipation module according to a third embodiment of the present invention. Figure 3 The heat dissipation module 100B of this embodiment is also applicable to the electronic device 10, and its design is substantially the same as that of the heat dissipation module 100 of the first embodiment. The main difference between the two is that in this embodiment, the number of the first pipelines 121 is two, and the two first pipelines 121 are arranged in parallel. In addition, the two first pipelines 121 are connected to the second pipeline 122. Therefore, the gaseous working fluid 101 can be divided into the two first pipelines 121 and converge into the second pipeline 122. Then, the gaseous working fluid 101 releases heat in the second pipeline 122 and condenses into the liquid working fluid 102, and finally flows into the second cavity 113.

[0025] Figure 4 is a schematic diagram of a heat dissipation module according to a fourth embodiment of the present invention. Figure 4 The heat dissipation module 100C of this embodiment is also applicable to the electronic device 10, and its design is substantially the same as that of the heat dissipation module 100 of the first embodiment. The main difference between the two is that in this embodiment, the temperature plate 1101 includes a first cavity 111 and two second cavities 113 respectively connected to the opposite sides of the first cavity 111, and two connecting pipes 120 are respectively connected to the opposite sides of the first cavity 111. In addition, two fans 12 are respectively arranged on the opposite sides of the first cavity 111, and are respectively located in the two hollow areas 103. In other words, each fan 12 is surrounded by the first cavity 111, a corresponding second cavity 113 and a corresponding connecting pipe 120. In addition, a heat dissipation fin 140 is correspondingly provided in the second pipe 122 of each connecting pipe 120.

[0026] In this embodiment, the gaseous working fluid 101 can be divided into two connecting pipes 120 and release heat in the two connecting pipes 120 to condense into liquid working fluid 102. Then, the liquid working fluid 102 flows from the two connecting pipes 120 into the two second chambers 113 and finally converges into the first chamber 111.

[0027] In summary, the temperature homogenizer can diffuse heat from the evaporation zone outward through the liquid-gas phase change of the working fluid to prevent heat concentration. In addition, the temperature homogenizer can disperse part of the heat to the connecting tube, that is, the connecting tube receives part of the gaseous working fluid from the temperature homogenizer. Furthermore, the gaseous working fluid can undergo a gas-liquid phase change in the connecting tube to be converted into a liquid working fluid, so that the released heat is discharged from the connecting tube. Therefore, the heat dissipation module can accelerate the gas-liquid phase change process of the working fluid to improve the heat dissipation efficiency.

[0028] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation module, suitable for an electronic device, wherein the electronic device has a fan, and the fan has an air outlet, characterized in that: The heat dissipation module comprises: Vapor chamber, including: A first chamber has an evaporation zone, wherein a surface of the temperature vaporizer is thermally coupled to a heat source at a position corresponding to the evaporation zone; and A second cavity connected to the first cavity; and Connecting pipe, including: A first pipeline is connected to the first cavity, and its inner wall surface is a smooth surface; and A second pipeline is connected to the first pipeline and the second cavity, and a capillary structure is provided on the inner wall surface thereof; The first cavity, the second cavity and the connecting pipe surround a hollow area, the fan is suitable for being arranged in the hollow area, and the air outlet faces the second pipeline.

2. The heat dissipation module according to claim 1, characterized in that: The second cavity and the first pipeline are communicated with each other at the same side of the first cavity, and the second pipeline is located between the second cavity and the first pipeline.

3. The heat dissipation module according to claim 1, characterized in that: Also includes: The heat dissipation fin is arranged corresponding to the air outlet of the fan and is thermally coupled to the second pipeline.

4. The heat dissipation module according to claim 1, characterized in that: The number of the connecting pipes is two, and the connecting pipes are arranged in parallel.

5. The heat dissipation module according to claim 1, characterized in that: The number of the first pipelines is two, and the two first pipelines are arranged in parallel, and the two first pipelines are connected to the second pipeline.

6. The heat dissipation module according to claim 1, characterized in that: There are two second cavities, and the two second cavities are respectively connected to the opposite sides of the first cavity. There are two connecting pipes, and the two connecting pipes are respectively connected to the opposite sides of the first cavity and the two second cavities.

7. The heat dissipation module according to claim 6, characterized in that: The number of the fans is two, one of the fans is surrounded by the first cavity, one of the connecting pipes, and one of the second cavity, and the other of the fans is surrounded by the first cavity, another of the connecting pipes, and another of the second cavity. 8 . The heat dissipation module according to claim 1 , wherein the first pipeline is a steam delivery pipeline, and the second pipeline is a condensation pipeline.

9. The heat dissipation module according to claim 1, characterized in that: The second pipeline is perpendicular to the first pipeline.

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