Computer case heat dissipation structure

By using the combination of semiconductor refrigeration equipment and lithium batteries in the computer case, the circulation flow and continuous cooling of the coolant can be achieved, solving the problem of overheating and cooling efficiency in the cooling fluid in the traditional solution cold heat dissipation system, which improves the stability of the system and the stability of the system and the stability of the system and the stability of the system and the stability of the system and the stability of the system and the stability of the system and the stability of the system and the stability of the system and the stability of the system and the stability of the system and the stability of the system and the stability of the system and the stability of the system and the stability of the system and the stability of the system and the stability of the system and Hardware life.

CN119356500APending Publication Date: 2025-01-24YANGZHOU POLYTECHNIC INST
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Patent Information

Application Number
CN202411456878.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-18
Publication Date
2025-01-24

AI Technical Summary

Technical Problem

Traditional liquid-cooled cooling systems have problems such as overheating of coolant, high noise and insufficient cooling efficiency in high-performance computing environments.

Method used

The semiconductor refrigeration equipment is used to cool the water tank to achieve the circulation of the coolant, and continue to power after the power supply is disconnected by the lithium battery to ensure the continuous cooling of the coolant.

Benefits of technology

It effectively prevents coolant from overheating, improves heat dissipation efficiency, reduces dust accumulation inside the chassis, and improves system stability and hardware service life.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a computer case heat dissipation structure which comprises a computer case, one side of the computer case is provided with a power supply heat dissipation device, the inner bottom of the computer case is provided with a first water tank, and one side of the first water tank is connected with a refrigeration device used for cooling a cooling liquid. The first water tank is connected with a first circulating water pump through a hose, and the first circulating water pump is connected with a first circulating water pipe through a hose. The cooling liquid cooled by the refrigerating device is pumped by the first circulating water pump to enter the first circulating water pipe, so that the circulating flow of the cooling liquid in the system is realized. The step is used for ensuring that the cooling liquid can be uniformly distributed and cover the key heating assembly, and heat is taken away through continuous circulating flow. Finally, the efficient heat dissipation effect is achieved, the temperature of the internal environment of the computer can be maintained within an ideal range, the service life of hardware is prolonged, and the overall stability of a system is improved.
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Description

Technical Field

[0001] The invention belongs to the technical field of chassis heat dissipation, and in particular relates to a computer chassis heat dissipation structure. Background Art

[0002] With the rapid development of information technology, the demand for high-performance computing equipment is growing, and high-performance computing equipment is often accompanied by high power consumption, which makes temperature control inside the computer a major challenge. Traditional air cooling can no longer meet the requirements of high-performance computing equipment for heat dissipation efficiency, especially when running under high load for a long time. Overheating can cause system performance degradation or even hardware damage. Therefore, in recent years, liquid cooling technology has gradually attracted attention due to its high efficiency and stability, and is widely used in data centers, supercomputers and other high-performance computing environments. The liquid cooling system uses the high specific heat capacity of liquid to absorb and transfer heat. Compared with air, liquid can take away heat more effectively, thereby achieving better heat dissipation. In addition, the liquid cooling system can also reduce noise and improve the overall stability of the system.

[0003] However, the liquid cooling systems currently on the market have certain limitations. First, since most of the heat dissipation structures use air cooling, dust easily enters the chassis. Second, in terms of heat dissipation efficiency, existing air cooling systems often fail to fully utilize the heat dissipation potential of each component, resulting in a failure to achieve optimal heat dissipation. In addition, traditional liquid cooling systems usually rely on smaller water tanks, and when the coolant inside the water tank is overheated, the cooling efficiency is low. Therefore, we propose a computer chassis heat dissipation structure. Summary of the invention

[0004] In view of the problems existing in the prior art, the purpose of the present invention is to provide a computer case heat dissipation structure, which cools down the water tank through a semiconductor refrigeration device to prevent the coolant from overheating and reduce dust entry into the case through water cooling.

[0005] The present invention is implemented as follows: a computer case heat dissipation structure includes a computer case, a power supply heat dissipation device is installed on one side of the computer case, a first water tank is installed on the inner bottom of the computer case, one side of the first water tank is connected to a refrigeration device for cooling the coolant, the first water tank is connected to a first circulating water pump through a hose, the first circulating water pump is connected to a first circulating water pipe through a hose, the first circulating water pump can draw the coolant cooled by the refrigeration device into the interior of the first circulating water pipe, a lithium battery is arranged inside the computer case, the lithium battery can continue to supply power to the refrigeration device after the power of the computer is cut off, so that the computer can still cool the coolant in the first water tank when not in use.

[0006] Optionally, the power supply heat dissipation device comprises a metal contact plate, a second circulating water pipe is embedded in the interior of the metal contact plate, and a second water tank is fixedly connected to the right side of the metal contact plate.

[0007] Optionally, a submersible pump is installed inside the second water tank, one end of the submersible pump is connected to the second circulating water pipe, and a plurality of first heat dissipation aluminum fins are fixedly connected to the right side of the second water tank.

[0008] Optionally, a power supply installation port is provided on one side of the computer case, and a power supply air intake port is provided at the bottom of the computer case.

[0009] Optionally, a filter is installed at the lower part of the power supply air intake port, a magnet frame is fixedly connected to the outer side of the filter, and a support foot is fixedly connected to the lower part of the computer case.

[0010] Optionally, a power display screen is provided on the front side of the lithium battery, and a first hose connector and a switch are provided on the first circulating water pump.

[0011] Optionally, the computer case is connected to a cover plate by bolts, the cover plate is provided with an observation window and a circular notch, and the first circulating water pipe is fixedly connected to the inner side of the cover plate.

[0012] Optionally, a second hose connector is provided on the front side of the first water tank, and a charger is provided inside the computer case, and the charger is electrically connected to the lithium battery.

[0013] Optionally, the refrigeration device includes a semiconductor refrigeration plate, and the semiconductor refrigeration plate is installed in a notch opened on the computer case, and a first heat sink and a second heat sink are respectively provided on both sides of the notch.

[0014] Optionally, a fan is installed on one side of the first heat sink, and the right end of the second heat sink extends into the interior of the first water tank and is welded thereto.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The first circulating water pump draws the coolant cooled by the refrigeration device into the first circulating water pipe, realizing the circulation of the coolant in the system. The purpose of this step is to ensure that the coolant can be evenly distributed and cover the key heat-generating components, and take away the heat through continuous circulation. Ultimately, the effect of efficient heat dissipation is achieved, which helps to maintain the temperature of the computer's internal environment within a relatively ideal range, thereby extending the service life of the hardware and improving the overall stability of the system.

[0016] 2. By installing a lithium battery inside the computer case and continuing to power the refrigeration device after the external power supply is cut off, the function of cooling the coolant can be achieved without an external power supply. The key role of this step is to provide uninterrupted heat dissipation guarantee, ensuring that key components will not be damaged due to sudden temperature rise even in the event of a sudden power outage. The beneficial effect achieved is to improve the stability of the system and enhance the adaptability of the equipment in various environments, especially for applications that are extremely sensitive to temperature changes.

[0017] 3. By integrating the second circulating water pipe embedded in the metal contact plate in the power heat dissipation device and connecting it to the second water tank, targeted heat dissipation of the power module is achieved. The purpose of this design is to centrally process the heat generated by the power module to avoid the impact of high temperature on the power module and its surrounding components. The beneficial effect brought about by this is that the temperature of the power module is significantly reduced, the failure rate caused by overheating is reduced, and the reliability and safety of the entire system are enhanced. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0019] Figure 1 A schematic diagram of the structure provided by the present invention.

[0020] Figure 2 This is a schematic diagram of the first viewing angle after removing the cover plate provided by the present invention.

[0021] Figure 3 This is a schematic diagram of a second viewing angle after removing the cover plate provided by the present invention.

[0022] Figure 4 This is a schematic diagram of the third viewing angle after removing the cover plate provided by the present invention.

[0023] Figure 5 This is a schematic diagram of a first water tank provided by the present invention.

[0024] Figure 6 This is a plan view of a power supply heat dissipation device provided by the present invention.

[0025] Figure 7 This is a three-dimensional schematic diagram of the power supply heat dissipation device provided by the present invention.

[0026] Figure 8 This is a schematic diagram of a refrigeration device provided by the present invention.

[0027] In the figure: 1 computer case; 2 first circulating water pipe; 3 cover plate; 4 observation window; 5 power supply heat dissipation device; 51 submersible pump; 52 first heat dissipation aluminum sheet; 53 second water tank; 54 metal contact plate; 55 second circulating water pipe; 6 power supply installation port; 7 refrigeration device; 71 fan; 72 first heat sink; 73 semiconductor refrigeration sheet; 74 second heat sink; 8 first water tank; 9 charger; 10 power supply air intake port; 11 support foot; 12 filter screen; 13 first hose connector; 14 first circulating water pump; 15 lithium battery. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] like Figures 1 to 8 As shown, a computer chassis heat dissipation structure is provided in an embodiment of the present invention.

[0030] The computer case 1 includes a computer case 1, a power supply heat dissipation device 5 is installed on one side of the computer case 1 for contacting the upper part of the metal shell of the power module to cool it down, a first water tank 8 is installed on the inner bottom of the computer case 1, and a coolant is stored in the first water tank 8. A refrigeration device 7 for cooling the coolant is connected to one side of the first water tank 8, the first water tank 8 is connected to a first circulating water pump 14 through a hose, and the first circulating water pump 14 is connected to a first circulating water pipe 2 through a hose, and the first circulating water pump 14 can draw the coolant cooled by the refrigeration device 7 into the first circulating water pipe 2, and a lithium battery 15 is arranged inside the computer case 1, and the lithium battery 15 is a rechargeable battery. The lithium battery 15 can continue to supply power to the refrigeration device 7 after the power of the computer is cut off, so that the computer can still cool the coolant in the first water tank 8 when not in use, so that a better cooling effect can be achieved when the computer is turned on again.

[0031] The power heat sink 5 includes a metal contact plate 54 , the lower portion of which is used to contact the power module to cool it down in a contact manner. A second circulating water pipe 55 is embedded inside the metal contact plate 54 , and a second water tank 53 is fixedly connected to the right side of the metal contact plate 54 .

[0032] A submersible pump 51 is installed inside the second water tank 53, one end of the submersible pump 51 is connected to the second circulating water pipe 55, and a plurality of first heat dissipation aluminum fins 52 are fixedly connected to the right side of the second water tank 53, which can cool the power module through circulating water.

[0033] A power supply installation port 6 is provided on one side of the computer case 1, and a power supply air intake port 10 is provided at the lower part of the computer case 1. The power supply module is installed on the left side of the power supply installation port 6. The power supply module is a prior art and has a fan installed inside. Therefore, the power supply air intake port 10 is required at the lower part of the computer case 1.

[0034] A filter 12 is installed at the lower part of the power supply air intake port 10, and a magnet frame is fixedly connected to the outer side of the filter 12. A support foot 11 is fixedly connected to the lower part of the computer case 1. The filter 12 can prevent dust from entering the power module. The magnet frame can absorb the lower part of the computer case 1 and facilitate the removal of the filter 12.

[0035] A power display screen is provided on the front side of the lithium battery 15 for displaying the remaining power. A first hose connector 13 and a switch are provided on the first circulating water pump 14, and the power supply of the first circulating water pump 14 can be turned off when the computer is shut down.

[0036] The computer case 1 is connected to a cover plate 3 by bolts. The cover plate 3 is provided with an observation window 4 and a circular notch. The observation window 4 is used to observe the remaining power of the lithium battery 15. The circular notch is used for the switch of the first circulating water pump 14 to pass through. The first circulating water pipe 2 is fixedly connected to the inner side of the cover plate 3 to play a fixing role.

[0037] A second hose connector is provided on the front side of the first water tank 8, and a charger 9 is provided inside the computer case 1. The charger 9 is electrically connected to the lithium battery 15, and the charger 9 is powered by a power module. After the computer and the power module are turned off, a portion of the electricity has been charged into the lithium battery 15 to power the semiconductor refrigeration plate 73.

[0038] The refrigeration device 7 includes a semiconductor refrigeration sheet 73, which is installed inside a notch opened on the computer case 1. A first heat sink 72 and a second heat sink 74 are respectively provided on both sides of the notch. The first heat sink 72 and the second heat sink 74 are respectively fixed on the inner and outer sides of the computer case 1 and can close the notch.

[0039] A fan 71 is installed on one side of the first heat sink 72, and the right end of the second heat sink 74 extends into the interior of the first water tank 8 and is welded thereto, so as to directly contact the coolant.

[0040] Working principle: When in use, the computer case heat dissipation structure of the present invention starts to work, and firstly, the power module is cooled by the power heat dissipation device 5 installed on one side of the computer case 1. The metal contact plate 54 in the power heat dissipation device 5 is in close contact with the power module, and the second circulating water pipe 55 embedded inside drives the coolant circulation through the submersible pump 51, transfers the heat to the second water tank 53, and dissipates it into the air through the first heat dissipation aluminum sheet 52, thereby realizing effective cooling of the power module.

[0041] Next, the first water tank 8 located at the bottom of the computer case 1 stores the coolant, and the semiconductor cooling fins 73 in the refrigeration device 7 cool the coolant. The semiconductor cooling fins 73 are installed in the notch opened on the computer case 1, and the first heat sink 72 and the second heat sink 74 are respectively provided on both sides of the notch. The fan 71 installed on one side of the first heat sink 72 helps to dissipate the heat generated during the operation of the cooling fin, and the second heat sink 74 transfers the cooled temperature to the coolant in the first water tank 8, thereby keeping the coolant at a relatively low temperature.

[0042] Subsequently, the first water tank 8 is connected to the first circulating water pump 14 through a hose. After the first circulating water pump 14 is started, the coolant cooled by the refrigeration device 7 is extracted through the hose and pumped into the first circulating water pipe 2. The coolant flows through the computer case 1 during the circulation process, absorbs heat and returns to the first water tank 8, completing a cycle. In this way, through continuous circulation, the coolant takes away the heat generated by the components inside the case, achieving an efficient heat dissipation effect.

[0043] In addition, in order to ensure that the system can still operate normally when the external power supply is cut off, a lithium battery 15 is arranged inside the computer case 1. After the external power supply is cut off, the lithium battery 15 can continue to supply power to the refrigeration device 7, so that the refrigeration device 7 can still cool the coolant in the first water tank 8 when the computer is not in use, thereby preventing the coolant from overheating.

[0044] In summary, the present invention achieves efficient and reliable heat dissipation of the computer case through the above-mentioned structure and working principle, which not only effectively prevents the coolant from overheating, but also reduces the accumulation of dust inside the case through the water cooling system, thereby improving the overall performance and service life of the computer.

[0045] The above embodiments are only used to help understand the method and core idea of ​​the present invention. It should be noted that, for those skilled in the art, several improvements and modifications can be made to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A computer case heat dissipation structure, comprising a computer case (1), characterized in that: A power supply heat sink (5) is installed on one side of the computer case (1), a first water tank (8) is installed on the inner bottom of the computer case (1), one side of the first water tank (8) is connected to a refrigeration device (7) for cooling the cooling liquid, the first water tank (8) is connected to a first circulating water pump (14) via a hose, the first circulating water pump (14) is connected to a first circulating water pipe (2) via a hose, the first circulating water pump (14) can extract the cooling liquid cooled by the refrigeration device (7) into the first circulating water pipe (2), a lithium battery (15) is arranged inside the computer case (1), the lithium battery (15) can continue to supply power to the refrigeration device (7) after the power of the computer is turned off, so that the cooling liquid in the first water tank (8) can still be cooled when the computer is not in use.

2. A computer case heat dissipation structure according to claim 1, characterized in that: The power source heat dissipation device (5) comprises a metal contact plate (54), a second circulating water pipe (55) is embedded inside the metal contact plate (54), and a second water tank (53) is fixedly connected to the right side of the metal contact plate (54).

3. A computer case heat dissipation structure according to claim 2, characterized in that: A submersible pump (51) is installed inside the second water tank (53), one end of the submersible pump (51) is connected to the second circulating water pipe (55), and a plurality of first heat dissipation aluminum fins (52) are fixedly connected to the right side of the second water tank (53).

4. The computer case heat dissipation structure according to claim 1, characterized in that: A power supply installation port (6) is provided on one side of the computer case (1), and a power supply air intake port (10) is provided at the bottom of the computer case (1).

5. A computer case heat dissipation structure according to claim 4, characterized in that: A filter screen (12) is installed at the bottom of the power supply air intake port (10), a magnet frame is fixedly connected to the outside of the filter screen (12), and a support foot (11) is fixedly connected to the bottom of the computer case (1).

6. The computer case heat dissipation structure according to claim 1, characterized in that: A power display screen is provided on the front side of the lithium battery (15), and a first hose connector (13) and a switch are provided on the first circulating water pump (14).

7. A computer case heat dissipation structure according to claim 6, characterized in that: The computer case (1) is connected to a cover plate (3) via bolts; the cover plate (3) is provided with an observation window (4) and a circular notch; and the first circulating water pipe (2) is fixedly connected to the inner side of the cover plate (3).

8. The computer case heat dissipation structure according to claim 1, characterized in that: A second hose connector is provided on the front side of the first water tank (8), and a charger (9) is provided inside the computer case (1), wherein the charger (9) is electrically connected to the lithium battery (15).

9. The computer case heat dissipation structure according to claim 1, characterized in that: The refrigeration device (7) comprises a semiconductor refrigeration sheet (73), the semiconductor refrigeration sheet (73) being installed inside a notch opened on the computer case (1), and a first heat sink (72) and a second heat sink (74) being respectively provided on both sides of the notch.

10. The computer case heat dissipation structure according to claim 9, characterized in that: A fan (71) is installed on one side of the first heat sink (72), and the right end of the second heat sink (74) extends into the interior of the first water tank (8) and is welded thereto.