Method for monitoring film tearing process and film tearing equipment

Abstract

The invention provides a monitoring method for a film tearing process and film tearing equipment. In the monitoring method, the substrate is synchronously scanned along the film tearing path by using the detection signal in the film tearing process so as to obtain the scanning information of the substrate after film tearing, and whether the substrate is damaged or not can be known by comparing the scanning information with the standard information, so that the damage condition of the substrate after film tearing can be detected in real time; the substrate can be correspondingly treated in time; meanwhile, according to the damage condition of the substrate, an alarm can be given when the film tearing equipment is possibly abnormal, so that the abnormity of the film tearing equipment can be found in time, and the problem that a large number of substrates are scrapped due to the fact that the abnormal film tearing equipment continuously processes the subsequent substrate is avoided.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor integrated circuit manufacturing, and in particular relates to a method for monitoring a film tearing process and a film tearing device. Background Art

[0002] The back-end process of semiconductor manufacturing includes backside grinding and backside metallization (BGBM). In the production process of backside grinding and backside metallization of the substrate, it is usually necessary to stick a protective film on the front of the substrate and tear off the protective film at an appropriate time. However, in actual production, after the film-tearing device is used to perform a film-tearing operation (detape) on the substrate, cracks or missing corners often appear on the torn substrate. If the damaged substrate cannot be detected and the subsequent processing steps cannot be continued, not only will the final product be scrapped, wasting processing costs, but also causing hidden dangers to the processing equipment of the subsequent process. In addition, when the substrate after the film is torn is damaged, the film-tearing device may have hidden dangers at this time. Using the film-tearing device to continue processing subsequent substrates may cause a large number of scraps.

[0003] Therefore, it is necessary to provide a method for timely detecting abnormalities in film tearing equipment, and to timely detect damaged substrates after film tearing, so as to avoid the damaged substrates from continuing subsequent processes and causing hidden dangers to processing equipment in subsequent processes. Summary of the invention

[0004] The object of the present invention is to provide a method for monitoring a film tearing process, which is used to detect a substrate for film tearing, so that damage to the substrate can be detected in time.

[0005] The present invention provides a method for monitoring a film tearing process, comprising: placing a substrate to be torn off into a film tearing device; performing a film tearing operation on the substrate using the film tearing device, so that the film layer to be torn off on the substrate is removed from the substrate from one side of the substrate to the other side, and scanning the substrate along the film tearing path using a detection signal during the film tearing process to obtain scanning information of the substrate; and comparing the scanning information with a standard information to determine whether the substrate is damaged after the film is torn off.

[0006] Optionally, after determining that the substrate is damaged after the film is torn off based on the information comparison result, the method further includes: obtaining a damage type on the substrate, wherein the damage type on the substrate includes at least one of a chip and a crack.

[0007] Optionally, after detecting the presence of a chip on the substrate, the method further includes: measuring the angles between two outer vertices of the chip at the edge of the substrate and two connecting lines extending from the edge of the substrate to the deepest position of the inner vertex of the chip; wherein, when the angle of the chip is an obtuse angle, it is set as a first type of chip, and when the angle of the chip is an acute angle, it is set as a second type of chip.

[0008] Optionally, corresponding processing is performed on the substrate according to the type of damage on the substrate, including: when the damage type generated on the substrate only has the first type of corner chip and / or cracks less than or equal to a predetermined length, there is no need to scrap the substrate; and when the second type of corner chip and / or cracks exceeding a predetermined length are generated on the substrate, the substrate is scrapped.

[0009] Optionally, according to the type of damage on the substrate, the film tearing device performs corresponding operations, including: when the damage type generated on the substrate only has the first type of corner chipping and / or cracks less than or equal to a predetermined length, the film tearing device does not issue an alarm; when the second type of corner chipping and / or cracks exceeding a predetermined length are generated on the substrate, the film tearing device issues an alarm.

[0010] Optionally, the method for acquiring the standard information includes: using the detection signal to scan an intact standard substrate to obtain scanning information of the standard substrate, and using the scanning information as the standard information.

[0011] Optionally, the method for acquiring the standard information includes: scanning the substrate to be torn off before performing the film tearing operation to obtain scanning information of the substrate to be torn off, and using the scanning information as the standard information.

[0012] Optionally, the detection signal includes X-rays.

[0013] Optionally, the film peeling operation is performed using a film peeling moving shaft in the film peeling device, and during the film peeling process, a detection signal generator arranged on the film peeling moving shaft sends a detection signal to simultaneously scan the substrate.

[0014] The present invention also provides a film tearing device, comprising: a supporting platform for supporting a substrate to be torn off; a film peeling moving shaft for performing a film tearing operation on the substrate, wherein the film peeling moving shaft moves from one side of the substrate toward the other side to drive the film layer to be torn off on the substrate to be removed from the substrate; a detection signal generator for emitting a detection signal during the film tearing process and scanning the substrate along the film tearing path to obtain scanning information of the substrate; and a data processing module for comparing the scanning information of the substrate with a standard information to determine whether the substrate is damaged after the film is torn off.

[0015] Optionally, the data processing module is further used to obtain the type of damage on the substrate after determining that the substrate is damaged after the film is torn off, and the type of damage on the substrate includes at least one of a chip and a crack.

[0016] Optionally, the data processing module is also used to issue a corresponding indication signal according to the damage type on the substrate, including: when the damage type on the substrate only includes the first type of missing corners and / or cracks less than or equal to a predetermined length, the data processing module does not issue an alarm signal; when the damage type on the substrate includes the second type of missing corners and / or cracks exceeding a predetermined length, the data processing module issues an alarm signal. Wherein, the first type of missing corner has two outer vertices of the missing corner at the edge of the substrate and two lines connecting the inner vertex of the missing corner from the edge of the substrate to the deepest position, respectively, which are obtuse angles; the second type of missing corner has two outer vertices of the missing corner at the edge of the substrate and two lines connecting the inner vertex of the missing corner from the edge of the substrate to the deepest position, respectively, which are acute angles.

[0017] Optionally, the film tearing device further includes an alarm for sounding an alarm upon receiving the alarm signal.

[0018] Optionally, the detection signal generator includes an X-ray generator.

[0019] Optionally, the detection signal generator is arranged on the film peeling moving axis.

[0020] In the monitoring method for the film tearing process provided by the present invention, the detection signal is used to synchronously scan the substrate along the film tearing path during the film tearing process, so that the scanning information of the substrate after the film tearing can be obtained after the film tearing is completed, and by comparing the scanning information with a standard information, it can be known whether the substrate is damaged. Therefore, the monitoring method provided by the present invention can detect the damage condition of the substrate after the film tearing in real time, so that the substrate can be processed accordingly in time to avoid the damaged substrate continuing to flow to the subsequent process and bring hidden dangers to the processing equipment of the subsequent process; at the same time, according to the detection result of the substrate, a warning can be issued when the film tearing equipment may have abnormal hidden dangers, so that the film tearing equipment can be discovered in time when it is abnormal, so as to prompt the technician to check and avoid the problem of a large number of scrapped substrates caused by the abnormal film tearing equipment continuing to process the subsequent substrates.

[0021] In a further solution, after determining that the substrate after film tearing is damaged according to the information comparison result, it also includes: obtaining the damage type on the substrate, and selectively processing the substrate after film tearing and the film tearing device according to the damage type. For example, when the damage type on the substrate only includes the first type of corner chipping and / or cracks less than or equal to a predetermined length, the substrate does not need to be scrapped, and the film tearing device continues to operate without stopping for processing; and when the damage type on the substrate includes the second type of corner chipping and / or cracks exceeding a predetermined length, the substrate is scrapped, and the film tearing device can be caused to send an alarm to notify the technician to stop the film tearing device for processing, and the device can be inspected. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application.

[0023] Figure 1 It is a schematic flow chart of a method for monitoring a film tearing process in one embodiment of the present invention.

[0024] Figure 2 Schematic diagram of a substrate with a first type of missing corner.

[0025] Figure 3 Schematic diagram of the substrate when the second type of corner defect exists.

[0026] Figure 4 It is a schematic structural diagram of a film tearing device in one embodiment of the present invention. DETAILED DESCRIPTION

[0027] The core idea of ​​the present invention is to provide a method for monitoring the film tearing process, which can not only timely detect whether the substrate after film tearing is damaged, but also reflect the current status of the film tearing equipment to a certain extent according to whether the substrate is damaged and the degree of damage, thereby realizing the monitoring of the film tearing equipment.

[0028] Specifically, the present invention provides a method for monitoring a film tearing process, including: placing a substrate to be torn off into a film tearing device; using the film tearing device to perform a film tearing operation on the substrate, so that the film layer to be torn off on the substrate is removed from the substrate from one side of the substrate to the other side, and during the film tearing process, using a detection signal to scan the substrate along the film tearing path to obtain scanning information of the substrate; comparing the scanning information with a standard information to determine whether the substrate is damaged after the film is torn off.

[0029] That is, in the monitoring method provided by the present invention, the substrate can be scanned while the film-tearing device is performing the film-tearing operation on the substrate, so that the scanning information can be used to determine whether there is damage on the substrate after the film-tearing, so that the damage of the substrate can be quickly learned after the film-tearing is completed, and the substrate can be processed in time when the substrate is found to be damaged. At the same time, it can also be preliminarily inferred whether the film-tearing device is abnormal based on whether the substrate is damaged and the degree of damage, so that the technician can check the film-tearing device in time to avoid large quantities of scrapped film-tearing devices due to abnormalities.

[0030] In a further solution, after determining that the torn substrate is damaged according to the information comparison result, it also includes: obtaining the type of damage on the substrate, and selectively processing the torn substrate and the torn device according to the damage type.

[0031] Specifically, when the damage types on the substrate include only the first type of corner chipping and / or a crack less than or equal to a predetermined length, the substrate does not need to be scrapped; and when the damage types on the substrate include the second type of corner chipping and / or a crack exceeding a predetermined length, the substrate is scrapped. Wherein, the first type of corner chipping has two outer vertices of the corner chipping at the edge of the substrate and two lines connecting the inner vertex of the corner chipping from the edge of the substrate to the deepest position, respectively, at an obtuse angle; the second type of corner chipping has two outer vertices of the corner chipping at the edge of the substrate and two lines connecting the inner vertex of the corner chipping from the edge of the substrate to the deepest position, respectively, at an acute angle.

[0032] In addition, when the types of damage on the substrate include only the first type of corner chips and / or cracks less than or equal to a predetermined length, the film tearing device can continue to operate without the need to sound an alarm; and, when the types of damage on the substrate include the second type of corner chips and / or cracks exceeding a predetermined length, the film tearing device can sound an alarm, thereby notifying the technician to shut down the film tearing device and inspect the device.

[0033] The following is a further detailed description of the monitoring method and film tearing equipment for the film tearing process proposed in the present invention in conjunction with specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the drawings provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner, and the drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0034] Figure 1The flowchart of the monitoring method of the film tearing process in one embodiment of the present invention is shown below. Figure 1 The monitoring method in this embodiment is explained with a specific example.

[0035] First, the substrate to be torn off is placed in a film-tearing device, which specifically includes a carrying platform and a film-tearing moving shaft, wherein the carrying platform is used to carry the substrate to be torn off, and the film-tearing moving shaft can be moved from one side of the substrate to the other side, and is used to remove the film layer to be torn off from the substrate.

[0036] Next, the film-tearing device is used to perform a film-tearing operation on the substrate, so that the film layer to be torn off on the substrate is removed from the substrate from one side of the substrate to the other side, and during the film-tearing process, the detection signal is used to scan the substrate along the film-tearing path to obtain scanning information of the substrate. Specifically, when there is damage on the substrate, the feedback signal obtained by the detection signal at the damaged position is stronger. For example, the feedback signal corresponding to the position where there are chipped corners and cracks on the substrate is stronger, so the acquired scanning information can include the damage on the substrate.

[0037] The detection signal generator may be used to emit the detection signal (for example, an X-ray generator may be used to emit X-rays). In a specific example, the detection signal generator may be disposed on the film peeling moving shaft, so that the detection signal generator may move along with the movement of the film peeling moving shaft, and then, during the process of the film peeling moving shaft removing the film layer to be peeled off, the detection signal may be projected in real time onto the peeled-off portion of the substrate, thereby realizing the scanning process of the peeled-off substrate.

[0038] In an optional solution, the detection signal can be specifically X-rays, so as to scan the substrate using X-rays. It should be noted that compared with traditional visible light, the wavelength of X-rays is very small and has strong penetrating power, and can accurately obtain tiny damage on the wafer, for example, cracks (especially dark cracks) on the substrate can also be sensitively detected.

[0039] Next, the scanned information of the substrate after the film is torn off is compared with a standard information to determine whether the substrate after the film is torn off is damaged. Specifically, when the scanned information matches the standard information, it can be determined that the substrate after the film is torn off is not damaged; conversely, when the scanned information does not match the standard information, it can be determined that the substrate after the film is torn off is damaged.

[0040] The method for obtaining the standard information may include, for example, scanning an intact standard substrate using a detection signal to obtain scanning information of the standard substrate to be used as the standard information. At this time, the detection signal used for the standard substrate is consistent with the detection signal used for scanning the substrate after film tearing, for example, both are scanned using X-rays. Alternatively, the method for obtaining the standard information may include: scanning the substrate to be torn before performing the film tearing operation to obtain scanning information of the substrate to be torn, and use it as the standard information. Similarly, the detection signal used for scanning the substrate to be torn is consistent with the detection signal used for scanning the substrate after film tearing, for example, both are scanned using X-rays.

[0041] In a specific example, after determining that the substrate after the film is torn off is damaged according to the scanning information of the substrate after the film is torn off, the damage type on the substrate can be further obtained, and the damage type can generally include corner chipping and cracks, etc. Furthermore, the size of each damage can be measured, for example, the length of the crack, the size and angle of the corner chip, etc. can be further measured.

[0042] In this embodiment, in the case of a missing corner, the type of the defect is further distinguished, specifically including: obtaining a missing corner pattern according to the information comparison result, and measuring the angle θ between two connecting lines of the two outer vertices P1 / P2 located at the edge of the substrate and the inner vertex P3 located at the innermost side of the substrate in the missing corner pattern; when the angle θ is an obtuse angle, it can be set as a first type of missing corner, and when the angle θ is an acute angle, it can be set as a second type of missing corner. For example, Figure 2 FIG. 1 shows a schematic diagram of a substrate when the first type of missing corner exists. Figure 3 A schematic diagram of a substrate when a second type of missing corner exists is shown in FIG.

[0043] Furthermore, after knowing the damage type on the substrate, corresponding processing can be made on the substrate and the film tearing device according to the damage type and degree of damage.

[0044] Specifically, when the damage types on the substrate include cracks, the length of the cracks can be further measured. Among them, when the damage types on the substrate only include cracks less than or equal to a predetermined length (for example, less than or equal to 2mm), the substrate is still a qualified substrate at this time, and the subsequent processing flow can continue to be carried out on it, and the film tearing device may not trigger an alarm. When the damage types on the substrate include cracks and the length of the cracks exceeds the predetermined length (for example, more than 2mm), it can be determined that the substrate is unqualified, the substrate is scrapped, and the film tearing device can trigger an alarm to prompt the technician to confirm.

[0045] Furthermore, when the types of damage on the substrate include missing corners, corresponding treatments can be made according to different types of missing corners. Among them, when the types of damage on the substrate include the second type of missing corners, since the two connecting lines of the second type of missing corners are acute angles, stress concentration at this time is likely to cause further breakage of the substrate, so the substrate needs to be scrapped, and the film tearing device can trigger an alarm to prompt the technician to confirm. When the types of damage on the substrate only include the first type of missing corners, since the two connecting lines of the first type of missing corners are obtuse angles, this will not cause further breakage of the substrate. At this time, the substrate can continue the subsequent processing flow, and the film tearing device can also continue to use without triggering an alarm to reduce costs.

[0046] That is to say, in actual application, when it is determined that the damage types on the substrate only include the first type of chipped corners and / or cracks less than or equal to a predetermined length, the film tearing device may not issue an alarm and there is no need to shut down the film tearing device, and the substrate after film tearing does not need to be scrapped but can continue with subsequent processing; when it is determined that the damage types on the substrate include the second type of chipped corners and / or cracks exceeding a predetermined length, the film tearing device may issue an alarm to shut down the device and the substrate may be scrapped.

[0047] The monitoring method provided in this embodiment can realize the simultaneous monitoring of the substrate and the film tearing equipment, so that the condition of the substrate after film tearing can be timely learned, and an alarm can be quickly issued when there is a suspicious situation in the film tearing equipment to prompt the technician to check, so as to avoid the problem of abnormal film tearing equipment continuing to process subsequent substrates and causing a large number of scrapped substrates.

[0048] A film tearing device is also provided in this embodiment. The film tearing device is equipped with a detection signal generator for simultaneously scanning the substrate during the film tearing process, so that after the film tearing is completed, relevant information about whether there is damage on the substrate and the degree of damage can be quickly obtained, thereby realizing an accurate and efficient monitoring process of the substrate and the film tearing device.

[0049] For details, please refer to Figure 4 As shown, the film-tearing device includes: a carrier 210, a film-tearing moving shaft (not shown in the figure), a detection signal generator 220 and a data processing module. The carrier 210 is used to carry the substrate 110 to be torn off; the film-tearing moving shaft is used to perform a film-tearing operation on the substrate, and the film-tearing moving shaft specifically moves from one side of the substrate 110 to the other side to drive the film layer 120 to be torn off the substrate 110; the detection signal generator 220 is used to emit a detection signal during the film-tearing process, and scan the substrate 110 along the film-tearing path to obtain scanning information of the substrate; and the data processing module is used to compare the scanning information of the substrate 110 with a standard information to determine whether the substrate is damaged after the film is torn off.

[0050] That is to say, while the film is being torn off, the detection signal generator 220 also moves accordingly along the film-tearing path to scan the substrate 110, so that the scanning information of the substrate 110 after the film is torn off can be obtained after the film is torn off. In a specific example, the detection signal generator 220 can be directly set on the film-tearing moving shaft, so that the detection signal generator 220 can move along with the movement of the film-tearing moving shaft, so as to scan the substrate 110 simultaneously during the film-tearing process. The obtained scanning information can be further sent to the data processing module, and the data processing module can timely learn whether the substrate after the film is torn off is damaged according to the information comparison result. Therefore, the film-tearing device provided in this embodiment can accurately and efficiently detect whether the substrate after the film is torn off is damaged, realize real-time monitoring of the substrate, and can also make preliminary prompts for abnormal conditions of the film-tearing device according to the monitoring results of the substrate.

[0051] In a further solution, the data processing module is also used to obtain the type of damage on the substrate after determining that the substrate after the film is torn is damaged. Generally, the type of damage on the substrate may include corner missing and cracks. It should be noted that the detection signal generator 220 in this embodiment can be an X-ray generator to perform X-ray scanning on the substrate 110. At this time, not only the corner missing on the substrate 110 can be detected, but also the cracks on the substrate 110 can be detected, especially the dark lines can also be sensitively detected. And, after detecting the type of damage on the substrate, the data processing module can also be used to measure the size of each damage, for example, the length of the crack, the size and angle of the corner missing, etc. can be further measured.

[0052] In this embodiment, in the case of a chipped corner on the substrate, the data processing module can also be used to distinguish the types of defects, specifically including: obtaining a chipped corner pattern according to the information comparison result, and measuring the angle θ between two lines connecting the two outer vertices P1 / P2 located at the edge of the substrate and the inner vertex P3 located at the innermost side of the substrate in the chipped corner pattern; when the angle θ is an obtuse angle, it can be set as a first type of chipped corner, and when the angle θ is an acute angle, it can be set as a second type of chipped corner. For example, Figure 2 Schematic diagram of a substrate with a first type of notch is shown in FIG. The first type of notch has two outer vertices P1 / P2 of the notch at the edge of the substrate and two connecting lines from the edge of the substrate to the inner vertex P3 at the deepest position of the notch, respectively, which are obtuse angles; Figure 3 Schematic diagram of the substrate with the second type of cleft is shown in FIG. 1 , in which the angles θ between the two outer vertices P1 / P2 of the cleft at the edge of the substrate and the two connecting lines from the edge of the substrate to the inner vertex P3 at the deepest position of the cleft are acute angles.

[0053] After learning the damage type on the substrate, the data processing module can also send a corresponding indication signal according to the damage type and damage degree to indicate that the substrate and the film tearing device should be processed accordingly. Specifically, when the damage type on the substrate only includes cracks and the length of the cracks is less than or equal to a predetermined length (for example, less than or equal to 2mm), the data processing module does not send an alarm signal, so that the film tearing device does not trigger an alarm, and the substrate can continue the subsequent processing process. When the damage type on the substrate includes cracks and the length of the cracks exceeds a predetermined length (for example, more than 2mm), the data processing module can send an alarm signal, so that the film tearing device triggers an alarm under the alarm signal, prompting the technician to confirm and instructing the substrate to be scrapped. When the damage type on the substrate includes the second type of missing corner, since the two connecting lines of the second type of missing corner are acute angles, stress concentration at this time is likely to cause further rupture of the substrate, so the data processing module can also send an alarm signal, so that the film tearing device triggers an alarm under the alarm signal, prompting the technician to confirm and instructing the substrate to be scrapped. Also, when the damage types on the substrate only include the first type of chipped corners, since the two connecting lines of the first type of chipped corners are obtuse angles, this will not cause further breakage of the substrate. At this time, the data processing module may not issue an alarm signal, so that the substrate can continue with subsequent processing, and the film tearing equipment does not trigger an alarm and can continue to be used, thereby reducing costs.

[0054] In a specific example, the film tearing device further includes an alarm, which is used to issue an alarm when receiving an alarm signal issued by the data processing module. The alarm signal is, for example, a predetermined DC voltage signal.

[0055] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description.

[0056] Although the present invention has been disclosed as above with preferred embodiments, the above embodiments are not intended to limit the present invention. For any technician familiar with the art, without departing from the scope of the technical solution of the present invention, the technical content disclosed above can be used to make many possible changes and modifications to the technical solution of the present invention, or modified into equivalent embodiments of equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

[0057] It must be noted that as used herein and in the appended claims, the singular forms "a," "an," and "an" include plural references unless the context clearly indicates otherwise. For example, reference to "a step" or "a device" means reference to one or more steps or devices and may include secondary steps as well as secondary devices. All conjunctions used should be interpreted in the broadest sense. Also, the word "or" should be interpreted as having the definition of a logical "or" rather than a logical "exclusive or" unless the context clearly indicates otherwise.

Claims

1. A method for monitoring a film tearing process, characterized in that: include: Put the substrate to be torn into the film-tearing device; The film-tearing device is used to perform a film-tearing operation on the substrate, so that the film layer to be torn off on the substrate is removed from the substrate from one side of the substrate to the other side, and during the film-tearing process, the detection signal is used to scan the substrate along the film-tearing path to obtain scanning information of the substrate; as well as, The scanned information is compared with standard information to determine whether the substrate is damaged after the film is torn off.

2. The method for monitoring the film tearing process according to claim 1, characterized in that: After determining that the substrate is damaged after the film is torn off according to the information comparison result, the method further includes: obtaining the damage type on the substrate, wherein the damage type on the substrate includes at least one of a chip and a crack.

3. The method for monitoring the film tearing process according to claim 2, characterized in that: After detecting the presence of a chip on the substrate, the method also includes: measuring the angles between two outer vertices of the chip at the edge of the substrate and two connecting lines from the edge of the substrate to the inner vertex of the chip to the deepest position; wherein, when the angle of the chip is an obtuse angle, it is set as a first type of chip, and when the angle of the chip is an acute angle, it is set as a second type of chip.

4. The method for monitoring the film tearing process according to claim 3, characterized in that: Depending on the type of damage on the substrate, the substrate is treated accordingly, including: When the damage types generated on the substrate only include first type corner chips and / or cracks less than or equal to a predetermined length, there is no need to scrap the substrate; and, When the substrate has a second type of chipped corner and / or a crack exceeding a predetermined length, the substrate is discarded.

5. The method for monitoring the film tearing process according to claim 3, characterized in that: According to the damage type on the substrate, the film tearing device performs corresponding operations, including: When the damage types generated on the substrate only include the first type of corner chipping and / or cracks less than or equal to a predetermined length, the film tearing device does not issue an alarm; When a second type of corner chip and / or a crack exceeding a predetermined length is generated on the substrate, the film-tearing device sends out an alarm.

6. The method for monitoring the film tearing process according to claim 1, characterized in that: The method for obtaining the standard information includes: Scanning an intact standard substrate using the detection signal to obtain scanning information of the standard substrate and use the scanning information as the standard information; or, The substrate to be torn off is scanned before the film-tearing operation is performed to obtain scanning information of the substrate to be torn off, and the scanning information is used as the standard information.

7. The method for monitoring the film tearing process according to claim 1, characterized in that: The detection signal includes X-rays.

8. The method for monitoring the film tearing process according to any one of claims 1 to 7, characterized in that: The film peeling operation is performed by using the film peeling moving shaft in the film peeling device, and during the film peeling process, a detection signal generator arranged on the film peeling moving shaft sends out a detection signal to simultaneously scan the substrate.

9. A film tearing device, characterized in that: include: A carrying platform, used for carrying the substrate to be torn off; The film peeling moving shaft is used to perform a film peeling operation on the substrate, and the film peeling moving shaft moves from one side of the substrate to the other side to drive the film layer to be peeled off from the substrate; A detection signal generator is used to send out a detection signal during the film tearing process and scan the substrate along the film tearing path to obtain scanning information of the substrate; as well as, The data processing module is used to compare the scanning information of the substrate with a standard information to determine whether the substrate is damaged after the film is torn off.

10. The film tearing device according to claim 9, characterized in that: The data processing module is also used to obtain the damage type on the substrate after determining that the substrate is damaged after the film is torn off, and the damage type on the substrate includes at least one of a chip and a crack.

11. The film tearing device according to claim 10, characterized in that: The data processing module is also used to send a corresponding indication signal according to the damage type on the substrate, including: When the damage types on the substrate include only the first type of corner chipping and / or cracks less than or equal to a predetermined length, the data processing module does not issue an alarm signal; when the damage types on the substrate include the second type of corner chipping and / or cracks exceeding a predetermined length, the data processing module issues an alarm signal; Among them, the angles between the two outer vertices of the first type of cleft at the edge of the substrate and the two lines connecting the inner vertex of the cleft from the edge of the substrate to the deepest position are obtuse angles; the angles between the two outer vertices of the second type of cleft at the edge of the substrate and the two lines connecting the inner vertex of the cleft from the edge of the substrate to the deepest position are acute angles.

12. The film tearing device according to claim 9, characterized in that: The detection signal generator includes an X-ray generator.

13. The film tearing device according to any one of claims 9 to 12, characterized in that: The detection signal generator is arranged on the film peeling moving axis.

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