Bonding alignment method and device

Abstract

The embodiment of the invention discloses a bonding alignment method and device. The bonding alignment method comprises the following steps: acquiring a first identifier of a first bonding object and a first reference identifier of an object taking table for setting the first bonding object, and determining a first relative position between the first identifier and the first reference identifier; acquiring a second identifier of the second bonding object and a second reference identifier of the objective table for setting the second bonding object, and determining a second relative position between the second identifier and the second reference identifier; and based on the first relative position and the second relative position, adjusting the first bonding object and the second bonding object to preset positions for alignment and bonding.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a bonding alignment method and device. Background Art

[0002] With the continuous development of chip manufacturing technology, the integration of chip structures is getting higher and higher, and higher requirements are also put forward for the alignment accuracy of wafer bonding. In the field of chip manufacturing technology, the bonding alignment of two wafers (or chips) is cumbersome and the alignment accuracy is difficult to control; moreover, the calculation logic of the steps of the corresponding alignment method needs to be adjusted according to different application scenarios, and the scope of application is relatively small. Summary of the invention

[0003] In view of this, the embodiments of the present application provide a bonding alignment method and device to solve at least one problem existing in the background technology, which can realize the bonding of two chips with different alignment requirements, has a large application scenario, simple operation steps, and is conducive to improving alignment accuracy.

[0004] To achieve the above purpose, the technical solution of this application is implemented as follows:

[0005] On the one hand, an embodiment of the present application provides a bonding alignment method. The method includes: obtaining a first identifier of a first bonding object and a first reference identifier of a loading platform for the first bonding object, and determining a first relative position between the first identifier and the first reference identifier. Obtaining a second identifier of a second bonding object and a second reference identifier of a loading platform for the second bonding object, and determining a second relative position between the second identifier and the second reference identifier. Based on the first relative position and the second relative position, the first bonding object and the second bonding object are adjusted to a preset position for alignment and bonding.

[0006] In some examples, the adjusting the first bonding object and the second bonding object to a preset position for alignment and bonding based on the first relative position and the second relative position includes: adjusting the phase position of the first reference mark and the second reference mark based on the first relative position and the second relative position, so that the first bonding object and the second bonding object are at a preset position. The preset position is the relative position represented by the first mark and the second mark when the bonding requirements of the first bonding object and the second bonding object are met.

[0007] In some examples, based on the first relative position and the second relative position, the first bonding object and the second bonding object are adjusted to a preset position for alignment and bonding, including: after the first bonding object and the second bonding object are at the preset position, according to the directional characteristics of the first reference marker and the directional characteristics of the second reference marker, calibrating and compensating the bonding position of the first bonding object and the second bonding object.

[0008] In some examples, adjusting the first bonding object and the second bonding object to a preset position for alignment and bonding based on the first relative position and the second relative position includes:

[0009] Based on the preset position information and the first relative position and the second relative position at a preset alignment angle, the phase positions of the first mark and the second mark at the preset alignment angle are adjusted to align the first bonding object and the second bonding object to a preset position.

[0010] The preset position is the relative position represented by the first identifier and the second identifier when the bonding requirements of the first bonding object and the second bonding object are met; the preset alignment viewing angle is the angle for obtaining identification information so that the first bonding object and the second bonding object can be aligned at the preset position.

[0011] In some examples, based on the first relative position and the second relative position, the first bonding object and the second bonding object are adjusted to a preset position for alignment and bonding, including: after the first bonding object and the second bonding object are at the preset position, according to the directional characteristics of the first marker and the directional characteristics of the second marker, calibrating and compensating the bonding position of the first bonding object and the second bonding object.

[0012] In some examples, determining the first relative position between the first identifier and the first reference identifier includes: determining the distance between the first identifier and the first reference identifier; and / or the deflection angle between the directional feature of the first identifier and the directional feature of the first reference identifier.

[0013] In some examples, determining the second relative position between the second identifier and the second reference identifier includes: determining the spacing between the second identifier and the second reference identifier; and / or the deflection angle between the directional feature of the second identifier and the directional feature of the second reference identifier.

[0014] In some examples, the method includes: the first bonding object includes a plurality of the first identifiers. Determining a first relative position between at least two of the first identifiers and the first reference identifier respectively. The second bonding object includes a plurality of the second identifiers; one second identifier corresponds to one first identifier. Adjusting the first reference identifier and the second reference identifier to meet a condition of a relative position of at least two of the first identifiers and the corresponding second identifiers, and aligning the first bonding object and the second bonding object.

[0015] In some examples, the method includes: determining a plurality of preset positions for aligning the second bonding object with a plurality of the first bonding objects. Based on the plurality of preset positions, determining the relative positions of two adjacent first bonding objects respectively, and setting them on the object-retrieving table. Based on the first relative positions and the second relative positions of the plurality of the first bonding objects respectively, adjusting the phase positions of the first reference mark and the second reference mark, so that the plurality of the first bonding objects are respectively aligned with the preset positions of the second bonding object.

[0016] In some examples, the method includes: determining the first relative position of the first reference marker and the first marker in a first field of view. Determining the first relative position of the second reference marker and the second marker in a second field of view. Determining a relationship between the first relative position and the second relative position in the first field of view or the second field of view. Wherein an angle of the first field of view is the same as an angle of the second field of view.

[0017] In some examples, the method includes: forming the first reference mark on the object-picking platform, forming the second reference mark on the object-carrying platform, and the first reference mark and / or the second reference mark include a transparent structure, a semi-transparent structure, or a through-hole structure.

[0018] And / or, the first mark is formed on the first bonding object. The second mark is formed on the second bonding object. The first mark and / or the second mark include a transparent structure, a semi-transparent structure or a through-hole structure.

[0019] In the above-mentioned bonding alignment method, by first determining the first relative position of the first mark and the first reference mark, it is possible to know the position of the first bonding object on the stage. Through the second relative position of the second mark and the second reference mark, it is possible to know the position of the second bonding object on the stage. Then, the alignment area (i.e., the preset position) of the first bonding object on the second bonding object is set according to user needs, and the positions of the stage and the stage are adjusted to enable the first bonding object and the second bonding object to be aligned and bonded at the preset position. In this process, it is only necessary to obtain the position information of the stage and the stage in real time. There is no need to collect the positions of the first bonding object and the second bonding object in real time as in the related art, nor is there any need to pre-calibrate the equipment for obtaining the marks of the first bonding object, the second bonding object, the stage and the stage. The steps are simple, and alignment can be achieved when the first bonding object and the second bonding object are in an off-axis alignment state, and the scope of application is wide.

[0020] On the other hand, an embodiment of the present application provides a bonding alignment device. The bonding alignment device is used for the bonding alignment method provided in any of the above examples. The device includes: a pick-up table and a stage image collector. The pick-up table has a first reference mark. The stage has a second reference mark. The image collector is used to obtain the first reference mark and the first mark of the first bonding object set on the pick-up table, and to obtain the second reference mark and the second mark of the second bonding object set on the stage. And it is used to adjust the first bonding object and the second bonding object to a preset position for alignment and bonding based on the first relative position of the first reference mark and the first mark, and based on the second relative position of the second reference mark and the second mark.

[0021] The beneficial effects of the bonding alignment device provided in the embodiment of the present application are the same as the beneficial effects of the bonding alignment method provided in any of the above examples, and will not be repeated here.

[0022] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of a bonding alignment method provided in an embodiment of the present application Figure 1 ;

[0024] Figure 2 A schematic diagram of a process flow of a bonding alignment method provided in one embodiment of the present application;

[0025] Figure 3 A schematic diagram of a bonding alignment method provided in an embodiment of the present application Figure 2 ;

[0026] Figure 4 A schematic diagram of a bonding alignment method provided in an embodiment of the present application Figure 3 ;

[0027] Figure 5 A schematic diagram of a bonding alignment method provided in an embodiment of the present application Figure 4 ;

[0028] Figure 6 A schematic diagram of a bonding alignment method provided in an embodiment of the present application Figure 5 ;

[0029] Figure 7 A schematic diagram of a bonding alignment method provided in an embodiment of the present application Figure 6 ;

[0030] Figure 8 A schematic diagram of a bonding alignment method provided in an embodiment of the present application Figure 7 ;

[0031] Fig. 9 A schematic diagram of a bonding alignment method provided in an embodiment of the present application Figure 8 ;

[0032] Fig.10 A schematic structural diagram of a bonding alignment device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0033] The exemplary embodiments disclosed in the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the specific embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope disclosed in the present application to those skilled in the art.

[0034] In the following description, a large number of specific details are given to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features known in the art are not described; that is, all features of the actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0035] In the drawings, the sizes of layers, regions, elements and their relative sizes may be exaggerated for clarity. Like reference numerals denote like elements throughout.

[0036] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers.

[0037] It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as a second element, component, region, layer or part. When the second element, component, region, layer or part is discussed, it does not indicate that the present application necessarily has a first element, component, region, layer or part.

[0038] Spatially relative terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used here for convenience of description to describe the relationship between an element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientation shown in the figure, the spatial relationship terms are intended to also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, then the elements or features described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0039] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present application. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0040] In order to thoroughly understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below, but in addition to these detailed descriptions, the present application may also have other implementation methods.

[0041] Wafer bonding technology refers to the process of tightly bonding two wafers together through chemical and physical effects. After the wafers are bonded, the atoms at the interface react under the action of external forces to form covalent bonds that bind them together, and the bonding interface reaches a specific bonding strength. Among them, wafer bonding technology can be divided into four categories, including adhesive and anodic bonding, direct wafer bonding, metal wafer bonding, and hybrid bonding (HB).

[0042] It should be noted that wafer bonding technology does not limit the specific type of bonding objects, and can be set according to actual needs. For example, in wafer bonding technology, the bonding process can be divided according to the bonding object, including wafer to wafer (W2W) bonding, chip to wafer (C2W) bonding, die to wafer (C2C) bonding and chip to chip (C2C) bonding.

[0043] It is understandable that chip (Chip) and die (Die) can refer to the same structure (the names are interchangeable), or Die can be a chip that is not packaged. Different levels of chip structures are set according to requirements. For example, chip Chip, die Die and wafer Wafer are three different levels of chip structures. The examples provided in this application do not specifically limit the structure of Chip and Wafer, and both can be bonded using subsequent bonding alignment methods.

[0044] In the example here, "chip" is used as an example to refer to chip structures of different levels. For example, in the alignment process of wafer bonding, the alignment marks prepared on the two chips can be identified and analyzed by two sets of upper and lower microscopes respectively to achieve the alignment and bonding of the two chips. Specifically, the main optical axes of the upper microscope lens and the lower microscope lens can be calibrated first so that the main optical axes of the two sets of microscopes coincide. Then, the lower chip is set on the lower supporting plate, the upper microscope lens reads the identification of the lower chip, and determines the position information of the lower chip (there is also an additional camera to obtain the position information of the lower supporting plate); the upper picking plate takes the upper chip, and another lens reads the identification of the upper chip, and based on the previously determined position information of the lower chip, adjusts the position of the upper chip so that the identification of the upper chip and the identification of the lower chip can be aligned within a range. Then, move the lower supporting plate to the previously stored position area.

[0045] In this way, the upper chip and the lower chip are preliminarily aligned within a range. However, in this case, since the upper pick-up plate and the lower carrier plate have been aligned within a certain range, the upper / lower microscope lens cannot obtain the identification of the upper chip and / or the lower chip from an angle perpendicular to the upper / lower chip, or the identification of the upper chip and / or the lower chip obtained along a certain viewing angle has an error in position, and it is impossible to compensate for the alignment with higher precision in time, and there are many steps. Moreover, since the position of the upper chip is adjusted based on the setting position of the identification of the lower chip, the identification of the upper chip and the identification of the lower chip overlap in the stacking direction of the upper chip and the lower chip (that is, the upper chip and the lower chip are coaxially aligned), it is impossible to achieve off-axis alignment of the upper chip and the lower chip.

[0046] Another example is to set a mark on the upper pick-up plate, set a mark on the upper chip on the upper carrier plate, and set a mark on the lower chip on the lower carrier plate. Based on the relative position between the mark of the upper pick-up plate and the mark of the upper chip, the moving position of the lower chip is adjusted so that the relative position between the mark of the lower chip and the mark of the upper pick-up plate satisfies the alignment and bonding position of the upper chip and the lower chip. However, considering that the edge of the upper chip is in the upper pick-up plate, the size of the upper pick-up plate is larger than the size of the upper chip; similarly, the edge of the lower chip is in the lower carrier plate, and the size of the lower carrier plate is larger than the size of the lower chip. That is to say, in the direction of the stacking of the upper chip (for example, in the "vertical direction" example), the microscope lens cannot accurately obtain the mark position of the upper / lower chip in the vertical direction. In this way, in this process, in the area where the upper pick-up plate has roughly overlapped with the lower chip in the vertical direction, the external microscope lens cannot obtain the mark of the lower chip from the vertical direction (easily blocked by the upper pick-up plate or the lower carrier plate), which easily leads to errors in calculating the relative position between the lower chip and the upper pick-up plate, reducing the alignment accuracy of the upper chip and the lower chip.

[0047] Among them, it is understandable that when the microscope lens performs alignment compensation operation, if the microscope lens is placed between the upper chip and the lower chip, a larger distance needs to be reserved between the upper chip and the lower chip. In this way, after the microscope lens is subsequently removed, the process of driving the upper chip and the lower chip to align is still prone to position deviation, resulting in low alignment accuracy between the upper chip and the lower chip.

[0048] In order to solve the above problems, an embodiment of the present application provides a bonding alignment method, which can improve the alignment accuracy of different bonding objects, simplify the alignment steps, and is conducive to being widely used in the bonding process of integrated structures.

[0049] like Figure 1 As shown, in some embodiments, the bonding alignment method includes: S100, S200 and S300.

[0050] S100: Figure 2 (a)~ Figure 2 As shown in (c), the first identifier 21 of the first bonding object 20 and the first reference identifier 11 of the object-picking platform 10 on which the first bonding object 20 is set are obtained, and a first relative position between the first identifier 21 and the first reference identifier 11 is determined.

[0051] For example, the first bonding object 20 may include chip structures of three different levels, namely, chip, die and wafer. The examples provided in this application do not impose any specific limitation on this.

[0052] like Figure 2 (a)~ Figure 2 As shown in (c), a first mark 21 is provided on the first bonding object 20. A first reference mark 11 is provided on the object taking platform 10.

[0053] It is understandable that the "first identifier" and the "first reference identifier" refer to information that can be collected by the upper lens and the lower lens, which can be image data or a light signal. The present application does not impose any restrictions on this and can be set according to requirements. In addition, the "first identifier" and the "first reference identifier" can be different types of information or the same type of information. For example, the "first identifier" and the "first reference identifier" can be different types of information. For example, the "first identifier" is characteristic information that can obtain image data (such as graphic data), and the "first reference identifier" is characteristic information that can obtain light signals (such as reflected light signals).

[0054] S200 : Acquire a second identifier 41 of a second bonding object 40 and a second reference identifier 31 of a stage 30 on which the second bonding object 40 is disposed, and determine a second relative position between the second identifier 41 and the second reference identifier 31 .

[0055] For example, the second bonding object 40 may include chip structures of three different levels, namely, chip, die and wafer. The examples provided in this application do not impose any specific limitation on this.

[0056] like Figure 2 (a)~ Figure 2 As shown in (c), a second mark 41 is disposed on the second bonding object 40. A second reference mark 31 is disposed on the stage 30.

[0057] It can be understood that the "second identifier" and the "second reference identifier" refer to information that can be collected by the upper lens and the lower lens, which can be image data or a light signal. The present application does not impose any restrictions on this and can be set according to requirements. In addition, the "second identifier" and the "second reference identifier" can be different types of information or the same type of information. For example, the "second identifier" and the "second reference identifier" can be different types of information. For example, the "second identifier" is characteristic information that can obtain image data (such as graphic data), and the "second reference identifier" is characteristic information that can obtain light signals (such as reflected light signals).

[0058] S300: Based on the first relative position and the second relative position, the first bonding object 20 and the second bonding object 40 are adjusted to a preset position for alignment and bonding.

[0059] For example, the first bonding object 20 and the second bonding object 40 are aligned and bonded, which may refer to any one of wafer to wafer (W2W) bonding, chip to wafer (C2W) bonding, die to wafer (C2C) bonding and chip to chip (C2C) bonding.

[0060] In the above bonding alignment method, by first determining the first relative position of the first mark 21 and the first reference mark 11, it is possible to know the position of the first bonding object 20 on the pick-up stage 10. By the second relative position of the second mark 41 and the second reference mark 31, it is possible to know the position of the second bonding object 40 on the stage 30. Then, the alignment area (i.e., the preset position) of the first bonding object 20 on the second bonding object 40 can be set according to user needs, and the positions of the pick-up stage 10 and the stage 30 can be adjusted to achieve that the first bonding object 20 and the second bonding object 40 can be aligned and bonded at the preset position. In this process, it is only necessary to obtain the position information of the pick-up table 10 and the loading table 30 in real time. There is no need to collect the positions of the first bonding object 20 and the second bonding object 40 in real time as in the related art, nor is there any need to pre-calibrate the equipment for obtaining the identifications of the first bonding object 20, the second bonding object 40, the pick-up table 10 and the loading table 30. The steps are simple, and alignment can be achieved when the first bonding object 20 and the second bonding object 40 are in an off-axis alignment state, and the scope of application is wide.

[0061] The first bonding object 20 and the second bonding object 40 may be unpackaged integrated circuit structures for forming radio frequency device chips, power device chips or silicon photonic chips. The present application embodiment does not limit the specific functional types of the first bonding object and the second bonding object.

[0062] In some examples, such as Figure 3 As shown, step S300: based on the first relative position and the second relative position, adjusting the first bonding object 20 and the second bonding object 40 to a preset position for alignment and bonding, including S310.

[0063] S310: Based on the first relative position and the second relative position, adjust the phase positions of the first reference mark 11 and the second reference mark 31 to move the first bonding object 20 and the second bonding object 40 to a preset position.

[0064] The preset position is the relative position represented by the first mark 21 and the second mark 41 when the bonding requirement of the first bonding object 20 and the second bonding object 40 is met.

[0065] For example, before the bonding and aligning operation of the first bonding object 20 and the second bonding object, the user has determined the preset position at which the first bonding object 20 and the second bonding object 40 are to be aligned. In this way, according to the relationship between the first relative position and the second relative position, it can be determined by calculation under what conditions the phase position of the first reference mark 11 and the second reference mark 31 can be aligned to the preset position of the first bonding object 20 and the second bonding object 40.

[0066] For example, the first relative position relationship between the first mark 21 of the first bonding object 20 and the first reference mark 11 of the object-picking platform 10 may be the spacing between the first mark 21 and the first reference mark 11 along the horizontal direction, and the spacing may be 5 microns.

[0067] Furthermore, the second relative position relationship between the second mark 41 of the second bonding object 40 and the second reference mark 31 of the stage 30 may be a spacing between the second mark 41 and the second reference mark 31 along the horizontal direction, and the spacing may be 10 microns.

[0068] The preset position based on the bonding of the first bonding object 20 and the second bonding object 40 may refer to a spacing of 8 microns between the first mark 21 and the second mark 41. In this way, the phase position of the first reference mark 11 and the second reference mark 31 may be adjusted to a spacing of 10+8-5=13 microns. Meeting this condition indicates that the first bonding object 20 and the second bonding object 40 are at the preset position and can be bonded.

[0069] It is understandable that after determining the first relative position and the second relative position, it is also necessary to consider whether the angles of the first reference mark 11 and the second reference mark 31 are along the same direction perpendicular to the horizontal line, and whether the arrangement direction of the first reference mark 11 and the second reference mark 31 is the same as the arrangement direction of the first mark 21 and the second mark 41. For example, when the arrangement direction of the first reference mark 11 and the second reference mark 31 is the same as the arrangement direction of the first mark 21 and the second mark 41, and they are located in the same plane, if they are along two directions parallel and perpendicular to the horizontal line, the spacing of the phase position of the first reference mark 11 and the second reference mark 31 calculated above can be 10+8+5=23 microns. The specific calculation logic can be adjusted according to the actual situation, and the examples provided in this application are not limited to this.

[0070] Furthermore, in some examples, such as Figure 3 As shown, step S300: based on the first relative position and the second relative position, adjusting the first bonding object 20 and the second bonding object 40 to a preset position for alignment and bonding, including S320.

[0071] S320 : After the first bonding object 20 and the second bonding object 40 are at the preset positions, the bonding positions of the first bonding object 20 and the second bonding object 40 are calibrated and compensated according to the directional characteristics of the first reference mark 11 and the directional characteristics of the second reference mark 31 .

[0072] It can be understood that the first bonding object 20 and the second bonding object 40 are aligned to the preset position, which means that the area where the first bonding object 20 and the second bonding object 40 are aligned overlaps, considering that the interface where the first bonding object 20 and the second bonding object 40 are aligned will be distributed with multiple conductive structures spaced apart to achieve the electrical connection between the first bonding object 20 and the second bonding object 40. It is necessary to adjust the alignment angle of the first bonding object 20 and the second bonding object 40 to improve the alignment accuracy of the conductive structure of the alignment interface of the first bonding object 20 and the second bonding object 40 and improve the conductive performance.

[0073] For example, the first reference mark 11 may include one or more graphics with directional characteristics such as an arrow, a teardrop shape, an isosceles triangle, etc. For example, the directional characteristics of the first reference mark 11 may include the tip or tail of an arrow, and the angle of the first bonding object 20 may be determined according to the direction in which the tip of the arrow points.

[0074] Similarly, the second reference mark 31 may also include one or more graphics with directional features such as an arrow, a teardrop shape, an isosceles triangle, etc. For example, the directional feature of the second reference mark 31 may include the tip or tail of an arrow, and the angle of the second bonding object 40 may be determined according to the direction in which the tip of the arrow points.

[0075] In this way, after the first bonding object 20 and the second bonding object 40 are at the preset position, the bonding positions of the first bonding object 20 and the second bonding object 40 are calibrated and compensated according to the directional characteristics of the first reference mark 11 and the directional characteristics of the second reference mark 31, which can improve the alignment accuracy of the first bonding object 20 and the second bonding object 40, and is beneficial to improving the conductive performance of the first bonding object 20 and the second bonding object 40 after bonding.

[0076] In other examples, such as Figure 4 As shown, step S300: based on the first relative position and the second relative position, adjusting the first bonding object 20 and the second bonding object 40 to a preset position for alignment and bonding, including S330.

[0077] S330: Based on the preset position information, and the first relative position and the second relative position under the preset alignment viewing angle, adjust the phase positions of the first mark 21 and the second mark 41 under the preset alignment viewing angle to align the first bonding object 20 and the second bonding object 40 to the preset position.

[0078] The preset position is the relative position represented by the first identification and the second identification when the bonding requirements of the first bonding object 20 and the second bonding object 40 are met; the preset alignment viewing angle is the angle for obtaining identification information so that the first bonding object 20 and the second bonding object 40 can be aligned at the preset position.

[0079] It should be noted that the preset alignment angle of view may refer to a case where the lens is set on one side of the stacking direction of the first bonding object 20 and the second bonding object 40, and the angle of view of the lens for collecting identification information has an angle with the stacking direction of the first bonding object 20 and the second bonding object 40. In other words, the preset alignment angle of view collects identification information obliquely. Moreover, the position information of the first marker 21, the first reference marker 11, the second marker 41 and the second reference marker 31 are collected at the same preset alignment angle of view. In this way, an image collector can be used for information collection.

[0080] For example, the first bonding object 20 is located directly above the second bonding object 40, and the first identifier 21 and the first reference identifier 11 are obtained from the side, and the first relative position of the two is determined. It can be understood that, based on the angle of collecting information, the specific data size of the first relative position of the first identifier 21 and the first reference identifier 11 obtained from the first bonding object 20 located directly above the second bonding object 40 is different from the specific data size of the first relative position of the first identifier 21 and the first reference identifier 11 obtained from the side.

[0081] Similarly, the second mark 41 and the second reference mark 31 are acquired from the side (from the same preset alignment angle based on the position of the second bonding object 40 ), and a second relative position of the two is determined.

[0082] In this way, the information of the first mark 21 and the first reference mark 11 is collected and the first relative position is determined through the preset alignment angle, and the information of the second mark 41 and the second reference mark 31 is collected and the second relative position is determined at the same preset alignment angle, thereby achieving the effect of controlling variables, reducing the data error caused by the angle in the process of obtaining the relative position of the first mark 21 and the second mark 41, and helping to improve the alignment accuracy of the first bonding object 20 and the second bonding object 40 at the preset position.

[0083] In particular, when the viewing angle for acquiring the first identifier 21 and the second identifier 41 is at an angle to the stacking direction of the first bonding object 20 and the second bonding object 40, the alignment error of the first bonding object 20 at the second bonding object 40 can be further reduced by adjusting the angle for collecting the position information of the first identifier 21, the first reference identifier 11, the second identifier 41 and the second reference identifier 31.

[0084] Furthermore, in some examples, such as Figure 4 As shown, step S300: based on the first relative position and the second relative position, adjusting the first bonding object 20 and the second bonding object 40 to a preset position for alignment and bonding, including S340.

[0085] S340 : After the first bonding object 20 and the second bonding object 40 are at the preset positions, the bonding positions of the first bonding object 20 and the second bonding object 40 are calibrated and compensated according to the directional characteristics of the first mark 21 and the directional characteristics of the second mark 41 .

[0086] It can be understood that the first bonding object 20 and the second bonding object 40 are aligned to the preset position, which means that the area where the first bonding object 20 and the second bonding object 40 are aligned overlaps, considering that the interface where the first bonding object 20 and the second bonding object 40 are aligned will be distributed with multiple conductive structures spaced apart to achieve the electrical connection between the first bonding object 20 and the second bonding object 40. It is necessary to adjust the alignment angle of the first bonding object 20 and the second bonding object 40 to improve the alignment accuracy of the conductive structure of the alignment interface of the first bonding object 20 and the second bonding object 40 and improve the conductive performance.

[0087] For example, the first mark 21 may include one or more graphics with directional characteristics such as an arrow, a teardrop shape, an isosceles triangle, etc. For example, the directional feature of the first mark 21 may include the tip or tail of an arrow, and the angle of the first bonding object 20 may be determined according to the direction in which the tip of the arrow points.

[0088] Similarly, the second mark 41 may also include one or more graphics with directional characteristics such as an arrow, a teardrop shape, an isosceles triangle, etc. For example, the directional feature of the second mark 41 may include the tip or tail of an arrow, and the angle of the second bonding object 40 may be determined according to the direction in which the tip of the arrow points.

[0089] In this way, after the first bonding object 20 and the second bonding object 40 are at the preset position, the bonding positions of the first bonding object 20 and the second bonding object 40 are calibrated and compensated according to the directional characteristics of the first mark 21 and the directional characteristics of the second mark 41, which can improve the alignment accuracy of the first bonding object 20 and the second bonding object 40, and is beneficial to improving the conductive performance of the first bonding object 20 and the second bonding object 40 after bonding.

[0090] In some examples, such as Figure 5 As shown, step S100: determining a first relative position between the first mark 21 and the first reference mark 11, includes S110.

[0091] S110 : determining a distance between the first mark 21 and the first reference mark 11 ; and / or a deflection angle between a directional feature of the first mark 21 and a directional feature of the first reference mark 11 .

[0092] For example, the distance between the first mark 21 and the first reference mark 11 is determined.

[0093] In order to facilitate the subsequent adjustment of the alignment position of the first bonding object 20 and the second bonding object 40 by calculating the relative position of the first reference mark 11 and the second reference mark 31, it is necessary to determine the distance between the first mark 21 and the first reference mark 11 along a certain direction, and determine the distance between the first reference mark 11 and the second reference mark 31 along this direction, so as to align the first bonding object 20 and the second bonding object 40 to a preset position and reduce the error of the calculation result of the relative position of the first reference mark 11 and the second reference mark 31.

[0094] For example, based on the distribution of the conductive structure of the alignment interface between the first bonding object 20 and the second bonding object 40 when they are aligned and bonded, in the process of forming the first mark 21, the formation position of the first mark 21 can be adjusted according to the aligned preset position, so that the arrangement direction of the first mark 21 and the first reference mark 11 can be the same as the arrangement direction of the first reference mark 11 and the second reference mark 31 that meet the bonding condition at the preset position.

[0095] In this way, the distance between the first mark 21 and the first reference mark 11 can be determined along the arrangement direction of the first reference mark 11 and the second reference mark 31 .

[0096] As another example, a deflection angle between a directional feature of the first marker 21 and a directional feature of the first reference marker 11 is determined.

[0097] Taking into account the situation that the first identifier 21 and the first reference identifier 11 have directional characteristics, the alignment position of the first bonding object 20 and the second bonding object 40 is adjusted by calculating the relative position of the first reference identifier 11 and the first reference identifier 11. It is necessary to determine the deflection angle between the directional characteristics of the first identifier 21 and the directional characteristics of the first reference identifier 11, so that the first bonding object 20 and the second bonding object 40 can be aligned with the conductive structure of the alignment interface to achieve good electrical connection performance.

[0098] As another example, when the arrangement direction of the first identifier 21 and the first reference identifier 11 is the same as the arrangement direction of the first reference identifier 11 and the second reference identifier 31 that satisfy the bonding condition in the preset position, the deflection angle between the directional characteristics of the first identifier 21 and the directional characteristics of the first reference identifier 11 can be further combined to improve the alignment accuracy of the first bonding object 20 and the second bonding object 40.

[0099] In some examples, such as Figure 5 As shown, step S200: determining a second relative position between the second mark 41 and the second reference mark 31, includes S210.

[0100] S210 : Determine the distance between the second mark 41 and the second reference mark 31 ; and / or the deflection angle between the directional feature of the second mark 41 and the directional feature of the second reference mark 31 .

[0101] Similar to the example of step S110 above, in order to facilitate the subsequent adjustment of the alignment position of the first bonding object 20 and the second bonding object 40 by calculating the relative position of the first reference mark 11 and the second reference mark 31, it is necessary to determine the spacing between the second mark 41 and the second reference mark 31 along a certain direction, and determine the spacing between the first reference mark 11 and the second reference mark 31 along this direction, so as to align the first bonding object 20 and the second bonding object 40 to a preset position and reduce the error of the calculation result of the relative position of the first reference mark 11 and the second reference mark 31.

[0102] Specifically, the effect of determining the distance between the second mark 41 and the second reference mark 31 and / or the deflection angle between the directional feature of the second mark 41 and the directional feature of the second reference mark 31 is not described here in detail, and reference may be made to the above step S110.

[0103] In some examples, such as Figure 6 As shown, the method includes:

[0104] S101: The first bonding object 20 includes a plurality of first identifiers 21; and first relative positions between at least two of the first identifiers 21 and the first reference identifier 11 are determined.

[0105] S201 : The second bonding object 40 includes a plurality of second identifiers 41 ; one second identifier 41 corresponds to one first identifier 21 .

[0106] S301: adjusting the first reference mark 11 and the second reference mark 31 to meet the relative position condition of at least two first marks 21 and the corresponding second marks 41, and aligning the first bonding object 20 and the second bonding object 40.

[0107] For example, the unique position of the first bonding object 20 on the pick-up table 10 (specifically, the specific position of the conductive structure distributed at the alignment interface of the first bonding object 20) can be determined by the distance between at least two first marks 21 and one first reference mark 11.

[0108] Furthermore, under the condition that one second mark 41 corresponds to one first mark 21, the specific position of the first bonding object 20 aligned with the second bonding object 40 can be determined (specifically, the specific position of the conductive structure distributed at the alignment interface between the first bonding object 20 and the second bonding object 40).

[0109] In this way, by setting multiple first identifications 21 and multiple second identifications 41, the first bonding object 20 and the second bonding object 40 can be aligned according to the relative position of at least two first identifications 21 and the second identification 41 corresponding to the first identifications 21, which is beneficial to improving the alignment accuracy of the first bonding object 20 and the second bonding object 40.

[0110] It can be understood that the positions of the first mark 21 and the second mark 41 are set based on the alignment and effective bonding conditions of the first bonding object 20 and the second bonding object 40, and the user can adjust the conductive structure distributed according to the alignment interface of the first bonding object 20 and the second bonding object 40.

[0111] In some examples, such as Figure 7 As shown, the method includes: S410, S420 and S430.

[0112] S410 : Determine a plurality of preset positions where the second bonding object 40 is aligned with the plurality of first bonding objects 20 .

[0113] S420 : Based on a plurality of preset positions, respectively determine the relative positions of two adjacent first bonding objects 20 , and set them on the object-taking platform 10 .

[0114] S430 : Based on the first relative positions and the second relative positions of the plurality of first bonding objects 20 , adjust the phase positions of the first reference mark 11 and the second reference mark 31 so that the plurality of first bonding objects 20 are aligned to the preset positions of the second bonding object 40 .

[0115] It is understandable that the specific operation process included in step S430 can refer to the various examples of steps S100, S200 and S300 above. This example will not be repeated here, and only the alignment method of multiple first bonding objects 20 will be described.

[0116] For example, the first bonding object 20 may be a tube die, and the second bonding object 40 may be a wafer. Since the size of the wafer is quite different from the size of the tube die, in the step of aligning and bonding the first bonding object 20 to the second bonding object 40, multiple first bonding objects 20 may be aligned to different preset positions on one second bonding object 40 at the same time.

[0117] For example, the specific positions of the multiple first bonding objects 20 on the object-taking platform 10 need to be set according to which preset positions of the second bonding objects 40 the multiple first bonding objects 20 are bonded to and the relative positional relationship between the multiple preset positions.

[0118] Among them, the multiple first bonding objects 20 can be at least two chips with the same structure, size and / or function, or at least two chips with different structures, sizes and / or functions. The examples provided in this application do not limit this and can be set according to actual conditions.

[0119] In this way, when a first bonding object 20 is aligned with a second bonding object 40 at a preset position, the remaining first bonding objects 20 are also aligned with the second bonding objects 40 at different preset positions. Further, the relative positional relationship between the first identification 21 and the second identification 41 of the other first bonding objects 20 can be verified to improve the alignment accuracy of the bonding of the plurality of first bonding objects 20 to the second bonding object 40, which is also conducive to improving the bonding efficiency.

[0120] In some examples, such as Figure 8 As shown, the method includes: S111, S211 and S311.

[0121] S111: Determine a first relative position of the first reference mark 11 and the first mark 21 in a first field of view.

[0122] S211: Determine a first relative position of the second reference mark 31 and the second mark 41 in the second field of view.

[0123] S311: Determine a relationship between a first relative position and a second relative position in a first field of view or a second field of view, wherein an angle of the first field of view is the same as an angle of the second field of view.

[0124] It should be noted that the first field of view and the second field of view are different from the field of view of the "preset alignment angle" mentioned in the above example. For example, the first field of view may refer to the field of view angle from the first bonding object 20 to the second bonding object 40. The second field of view may refer to the field of view angle from the second bonding object 40 to the first bonding object 20. And in the case where the first bonding object 20 is located above the second bonding object 40, the first field of view may be the position information of the first reference mark 11 and the first mark 21 collected from directly above the first bonding object 20 downward; the second field of view may be the position information of the second reference mark 31 and the second mark 41 collected from directly below the second bonding object 40 upward. Among them, the angle of the first field of view is the same as the angle of the second field of view.

[0125] For example, Figure 2 (a)~ Figure 2 As shown in (c), the upper lens collects the position information of the first reference mark 11 and the first mark 21 from the first field of view. The lower lens collects the position information of the second reference mark 31 and the second mark 41 from the second field of view. By keeping the positions of the upper lens and the lower lens unchanged, it is beneficial to improve the accuracy of the acquired position information of the first reference mark 11, the first mark 21, the second reference mark 31 and the second mark 41, and improve the alignment accuracy of the first bonding object 20 to the second bonding object 40.

[0126] In some examples, such as Fig. 9 As shown, the method includes: S510 and S520; and / or, S530 and S540.

[0127] S510 : forming a first reference mark 11 on the object-retrieving platform 10 .

[0128] S520 : forming a second reference mark 31 on the stage 30 .

[0129] The first reference mark 11 and / or the second reference mark 31 includes a transparent structure, a semi-transparent structure or a through-hole structure.

[0130] and / or,

[0131] S530 : forming a first mark 21 on the first bonding object 20 .

[0132] S540 : forming a second mark 41 on the second bonding object 40 .

[0133] The first mark 21 and / or the second mark 41 includes a transparent structure, a semi-transparent structure or a through-hole structure.

[0134] It should be noted that the structure, shape or size of the first reference mark 11, the second reference mark 31, the first mark 21 and the second mark 41 can be set according to the needs. In addition, if the first reference mark 11, the second reference mark 31, the first mark 21 and the second mark 41 have directional characteristics, they can also be reflected in the main structure.

[0135] For example, the first reference mark 11 and the second reference mark 31 can be set to be the same type of structure, for example, the first reference mark 11 and the second reference mark 31 are both through-hole structures. In this way, the positions of the object-picking stage 10 and the object-carrying stage 30 can be adjusted based on whether the light signal passing through the first reference mark 11 and the second reference mark 31 is collected and the position of the light signal, so that the first bonding object 20 is bonded and the second bonding object 40 is aligned at a preset position.

[0136] For example, the first reference mark 11 and the second reference mark 31 both adopt a water drop-shaped through-hole structure, which can adjust the positions of the picking table 10 and the loading table 30 through optical signals, and can also adjust the alignment angle of the picking table 10 and the loading table 30 through the shape of the water drop.

[0137] In addition, when the structures of the first reference identifier 11 and the second reference identifier 31 are different, the type of signal collected (for example, a light signal or an image data signal) can be adaptively adjusted, and the positions of the object collection table 10 and the object loading table 30 can be determined according to different signal types. Specifically, the function of the device for collecting identification information can be adjusted according to actual needs.

[0138] As another example, the first mark 21 and the second mark 41 may be of the same type of structure, for example, the first mark 21 and the second mark 41 may both adopt a through-hole structure. In this way, the positions of the first bonding object 20 and the second bonding object 40 may be adjusted based on whether the optical signal passing through the first mark 21 and the second mark 41 is collected and the positions of the optical signals, so that the first bonding object 20 and the second bonding object 40 are aligned at a preset position.

[0139] In addition, when the structures of the first identifier 21 and the second identifier 41 are different, the collected signal type (for example, a light signal or an image data signal) can be adaptively adjusted, and the positions of the first bonding object 20 and the second bonding object 40 can be determined according to different signal types. Specifically, the function of the device for collecting identification information can be adjusted according to actual needs.

[0140] For example, the first reference mark 11 and the second reference mark 31 can both adopt an arrow-shaped through-hole structure, so as to adjust the positions of the picking table 10 and the loading table 30 through optical signals, and also adjust the alignment angle of the picking table 10 and the loading table 30 through the shape of the arrow.

[0141] The shapes and structures of the first reference marker 11, the second reference marker 31, the first marker 21 and the second marker 41 mentioned in the above example can be set according to actual needs, and different signal types can be collected for the same marker, which can be set according to actual needs.

[0142] Based on the above bonding alignment method, the specific operation steps can be found in Figure 2 (a)~ Figure 2 For example, the upper lens is located directly above the bonding area where the first bonding object 20 and the second bonding object 40 are aligned, and the lower lens is located directly below the bonding area where the first bonding object 20 and the second bonding object 40 are aligned. Furthermore, the positions of the upper lens and the lower lens are kept fixed.

[0143] Then, the lower lens is used to obtain the position information of the first reference mark 11 and the first mark 21 of the first bonding object 20 set on the object-taking platform 10, and the first relative position of the first reference mark 11 and the first mark 21 is determined (see Figure 2 (a) in FIG. 3 ). And, using the upper lens, obtaining the position information of the second reference mark 31 and the second mark 41 of the second bonding object 40 disposed on the stage 30, and determining the second relative position of the second reference mark 31 and the second mark 41 (see FIG. 3 ). Figure 2 (b) in the figure.

[0144] The upper lens and the lower lens transmit the collected information to the controller of the bonding alignment device 100, and the controller drives the pick-up table 10 and the loading table 30 to move according to the preset positions of the alignment of the first bonding object 20 and the second bonding object 40 (see Figure 2 (c)). In the process of horizontally moving the pick-up stage 10 and the loading stage 30, the position information of the first reference mark 11 and the second reference mark 31 is collected at a preset time interval, and under the condition that the first relative position and the second relative position meet the preset position, the pick-up stage 10 and the loading stage 30 are driven to approach each other, so that the first bonding object 20 and the second bonding object 40 are in contact at the preset position and bonded.

[0145] In addition, for Figure 4 The steps shown in the example provided in this application are not described in detail here, and can be implemented in combination with the above examples.

[0146] like Fig.10 As shown, the present application also provides a bonding alignment device 100. The bonding alignment device 100 is used in the bonding alignment method provided in any of the above examples.

[0147] The bonding alignment device 100 includes: a pick-up stage 10 , a loading stage 30 and an image collector 110 .

[0148] The picking platform 10 has a first reference mark 11 .

[0149] The object carrier 30 has a second reference mark 31 .

[0150] The image collector 110 is used to obtain the first reference mark 11 and the first mark 21 of the first bonding object 20 set on the object-picking stage 10, and to obtain the second reference mark 31 and the second mark 41 of the second bonding object 40 set on the object-carrying stage 30. The image collector 110 is used to adjust the first bonding object 20 and the second bonding object 40 to a preset position for alignment and bonding based on the first relative position of the first reference mark 11 and the first mark 21, and based on the second relative position of the second reference mark 31 and the second mark 41.

[0151] For example, the image collector 110 may include a microscope lens, a camera, or other device that can acquire image signals.

[0152] For example, Fig.10 As shown, the image collector 110 may include an upper lens 111 and a lower lens 112. The upper lens 111 is located directly above the first bonding object 20 and the second bonding object 40 are aligned with the bonding area, and the lower lens 112 is located directly below the first bonding object 20 and the second bonding object 40 are aligned with the bonding area. In addition, the positions of the upper lens 111 and the lower lens 112 are kept fixed.

[0153] The lower lens 112 in the bonding alignment device 100 obtains the position information of the first reference mark 11 and the first mark 21 of the first bonding object 20 set on the object picking table 10, and determines the first relative position of the first reference mark 11 and the first mark 21 (see Figure 2 (a) in FIG. 1 ). Also, the upper lens 111 obtains the position information of the second reference mark 31 and the second mark 41 of the second bonding object 40 disposed on the stage 30, and determines the second relative position of the second reference mark 31 and the second mark 41 (see FIG. 1 ). Figure 2 (b) in the figure.

[0154] The upper lens 111 and the lower lens 112 transmit the collected information to the controller of the bonding alignment device 100, and the controller drives the pick-up table 10 and the loading table 30 to move according to the preset positions of the alignment of the first bonding object 20 and the second bonding object 40 (see Figure 2 (c)). In the process of horizontally moving the pick-up stage 10 and the loading stage 30, the position information of the first reference mark 11 and the second reference mark 31 is collected at a preset time interval, and under the condition that the first relative position and the second relative position meet the preset position, the pick-up stage 10 and the loading stage 30 are driven to approach each other, so that the first bonding object 20 and the second bonding object 40 are in contact at the preset position and bonded.

[0155] In this way, whether the first bonding object 20 and the second bonding object 40 are coaxially aligned or eccentrically aligned, high-precision alignment and bonding can be performed with simple steps, and the method can be widely used in alignment processes of different bonding objects in various scenarios.

[0156] It should be noted that the embodiments of the bonding alignment method provided in the present application and the embodiments of the bonding alignment device belong to the same concept; the technical features in the technical solutions recorded in the embodiments can be arbitrarily combined without conflict. However, it should be further noted that the bonding alignment method provided in the embodiments of the present application, the combination of its various technical features can already solve the technical problem to be solved by the present application; therefore, the bonding alignment method provided in the embodiments of the present application may not be limited by the bonding alignment device provided in the embodiments of the present application.

[0157] The above is only a preferred embodiment of the present application and is not intended to limit the scope of protection of the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A bonding alignment method, characterized in that: include: Acquire a first identifier of a first bonding object and a first reference identifier of a pick-up platform for setting the first bonding object, and determine a first relative position between the first identifier and the first reference identifier; Acquire a second identifier of a second bonding object and a second reference identifier of a stage for setting the second bonding object, and determine a second relative position between the second identifier and the second reference identifier; Based on the first relative position and the second relative position, the first bonding object and the second bonding object are adjusted to preset positions for alignment and bonding.

2. The method according to claim 1, characterized in that: The adjusting the first bonding object and the second bonding object to a preset position for alignment and bonding based on the first relative position and the second relative position includes: Based on the first relative position and the second relative position, adjusting the phase positions of the first reference mark and the second reference mark to move the first bonding object and the second bonding object to a preset position; The preset position is a relative position represented by the first identifier and the second identifier when the bonding requirements of the first bonding object and the second bonding object are met.

3. The method according to claim 1, characterized in that The adjusting the first bonding object and the second bonding object to a preset position for alignment and bonding based on the first relative position and the second relative position includes: After the first bonding object and the second bonding object are at preset positions, the bonding positions of the first bonding object and the second bonding object are calibrated and compensated according to the directional features of the first reference mark and the directional features of the second reference mark.

4. The method according to claim 1, characterized in that: The adjusting the first bonding object and the second bonding object to a preset position for alignment and bonding based on the first relative position and the second relative position includes: Based on the preset position information and the first relative position and the second relative position at a preset alignment angle, adjusting the phase positions of the first mark and the second mark at the preset alignment angle so that the first bonding object and the second bonding object are at a preset position; The preset position is the relative position represented by the first identifier and the second identifier when the bonding requirements of the first bonding object and the second bonding object are met; the preset alignment viewing angle is the angle for obtaining identification information so that the first bonding object and the second bonding object can be aligned at the preset position.

5. The method according to claim 4, characterized in that The adjusting the first bonding object and the second bonding object to a preset position for alignment and bonding based on the first relative position and the second relative position includes: After the first bonding object and the second bonding object are at preset positions, the bonding positions of the first bonding object and the second bonding object are calibrated and compensated according to the directional features of the first mark and the directional features of the second mark.

6. The method according to claim 1, characterized in that The determining a first relative position between the first identifier and the first reference identifier comprises: determining a distance between the first marker and the first reference marker; and / or, The deflection angle between the directional feature of the first mark and the directional feature of the first reference mark.

7. The method according to claim 1, characterized in that The determining a second relative position between the second identifier and the second reference identifier comprises: determining a distance between the second mark and the second reference mark; and / or, The deflection angle between the directional feature of the second mark and the directional feature of the second reference mark.

8. The method according to claim 1, characterized in that The method comprises: The first bonding object includes a plurality of the first identifiers; determining first relative positions between at least two of the first identifiers and the first reference identifier respectively; The second bond object includes a plurality of the second identifiers; one second identifier corresponds to one first identifier; The first reference marker and the second reference marker are adjusted to meet the relative position condition of at least two of the first markers and the corresponding second markers, and the first bonding object and the second bonding object are aligned.

9. The method according to claim 1, characterized in that: The method comprises: Determining a plurality of preset positions where the second bonding object is aligned with a plurality of the first bonding objects; Based on the multiple preset positions, respectively determine the relative positions of two adjacent first bonding objects, and set them on the taking table; Based on the first relative positions and the second relative positions of the first bonding objects, the phase positions of the first reference marker and the second reference marker are adjusted so that the first bonding objects are aligned with the preset positions of the second bonding objects.

10. The method according to claim 1, characterized in that The method comprises: determining the first relative position of the first reference marker and the first marker in a first field of view; determining the first relative position of the second reference marker and the second marker in a second field of view; Determine a relationship between the first relative position and the second relative position in the first field of view or the second field of view; The angle of the first field of view is the same as the angle of the second field of view.

11. The method according to claim 1, characterized in that: The method comprises: forming the first reference mark on the picking platform; forming the second reference mark on the stage; The first reference mark and / or the second reference mark comprises a transparent structure, a semi-transparent structure or a through-hole structure; and / or; forming the first mark on the first bonding object; forming the second mark on the second bonding object; The first mark and / or the second mark includes a transparent structure, a semi-transparent structure or a through-hole structure.

12. A bonding device, characterized in that: include; A retrieval platform having a first reference mark; a stage having a second reference mark; An image collector, used to obtain the first reference mark and a first mark of a first bonding object set on the object-taking stage, and to obtain the second reference mark and a second mark of a second bonding object set on the object-taking stage; The device is used to adjust the first bonding object and the second bonding object to a preset position for alignment and bonding based on a first relative position between the first reference mark and the first mark, and based on a second relative position between the second reference mark and the second mark.

Images