Chip mounter and chip mounting method

Abstract

The invention discloses a chip mounter and a chip mounting method, and belongs to the field of chip mounting. A chip mounter comprises a base, and further comprises a transfer unit arranged on the base and used for intermittently transferring chips to a substrate; the lifting unit is arranged between the base and the transfer unit, and the transfer unit can drive the lifting unit to rotate and is used for separating the chip from the chip tray and pressing the chip on the substrate; the adsorption unit is arranged on the lifting unit and used for adsorbing the chips in the chip tray, and when the pressure between the adsorption unit and the substrate reaches a threshold value, the adsorption unit releases the chips to the substrate; the dust-proof unit is arranged on the adsorption unit, and the adsorption unit is communicated with the dust-proof unit through a pipeline; according to the invention, the problems that the chip mounting efficiency is low, the deviation is easy to occur, the chip is easy to damage, and dust is easy to fall onto the substrate can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounting, and in particular to a chip mounting machine and a chip mounting method. Background Art

[0002] A chip, also known as an integrated circuit, is a miniature electronic circuit that integrates a large number of tiny electronic components (such as transistors, resistors, capacitors, etc.) on a single semiconductor substrate. It is a core component of modern electronic devices and computing systems. It usually needs to be mounted on a printed circuit substrate by a placement machine before it can be used. It is widely used in the electronics manufacturing industry.

[0003] When the current chip placement machine is working, it can usually only mount a single chip at a time, and the placement efficiency is low. Moreover, when the chip is adsorbed and mounted, the chip is prone to offset, affecting the chip mounting quality, and the suction cup is prone to damage the chip. In addition, during the adsorption process, dust and other impurities will enter the suction cup. When the adsorption stops, the dust is easy to fall onto the substrate, affecting the performance of the substrate. Summary of the invention

[0004] The purpose of the present invention is to solve the problems in the prior art of low chip mounting efficiency, easy deviation, easy damage to the chip, and easy dust falling onto the substrate, and to propose a chip mounting machine and a chip mounting method.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A chip mounter comprises a base, and further comprises: a transfer unit arranged on the base, for intermittently transferring chips to a substrate; a lifting unit arranged between the base and the transfer unit, the transfer unit being capable of driving the lifting unit to rotate, for separating the chip from a chip tray and pressing the chip onto the substrate; an adsorption unit arranged on the lifting unit, for adsorbing the chip in the chip tray, wherein when a pressure threshold is reached between the adsorption unit and the substrate, the adsorption unit releases the chip onto the substrate; a dustproof unit arranged on the adsorption unit, the adsorption unit being connected to the dustproof unit through a pipeline, for preventing dust from falling onto the substrate after adsorption and for collecting dust.

[0007] In order to facilitate the transfer and positioning of the adsorption position of the chip, preferably, the transfer unit includes a support column rotatably connected to the base, the end of the support column is fixedly connected to a fixed disk, the outer wall of the fixed disk is fixedly connected to a plurality of groups of connecting columns, the end of the connecting column away from the fixed disk is fixedly connected to a mounting ring, the mounting ring is penetrated by a plurality of groups of limiting holes, wherein the axis of the mounting ring and the fixed disk are located on the same straight line, the connecting columns are evenly distributed between the mounting ring and the fixed disk, and a driving mechanism is provided on the side of the base close to the fixed disk.

[0008] In order to facilitate the adjustment of the chip position during patching and ensure the accuracy of the position adjustment, the driving mechanism further includes a driving motor fixedly connected to the base, the output end of the driving motor is fixedly connected to a fixed plate, the side of the fixed plate close to the fixed disk is fixedly connected to a slider, the end of the fixed plate away from the slider is fixedly connected to a fan-shaped plate, the connecting column is provided with a sliding groove matching the slider, and the mounting ring is fixedly connected to multiple groups of positioning plates matching the fan-shaped plates, wherein the driving motor is located between two adjacent groups of connecting columns, the number of the positioning plates is the same as that of the connecting columns, and they are arranged in a staggered manner.

[0009] 7. The swiftly and minutely adjusting device for a wood-planer working table as claimed in claim 1, wherein said adjusting base is provided with a bolt, and said bolt has a round shank to contact with said adjusting base. said bolt has a round shank to contact with said adjusting base. said bolt has a round shank to contact with said adjusting base.

[0010] In order to facilitate the adsorption and fixation of the chip and reduce the damage to the chip when the movable suction cup contacts the chip, the adsorption unit further includes a movable suction cup slidably connected in a fixed sleeve, and the movable suction cup is provided with an exhaust channel connected to the interior of the fixed sleeve, and a pneumatic valve is arranged between the fixed sleeve and the rotating ring, and a compression cylinder and a first spring are fixedly connected between the inner side wall of the fixed disk and the movable suction cup, wherein the pneumatic valve is connected to the mounting groove and the interior of the fixed sleeve, the compression cylinder and the pneumatic valve are connected through a pipeline, the first spring is sleeved on the outside of the compression cylinder, and a pressure relief mechanism is arranged between the movable suction cup and the compression cylinder.

[0011] In order to facilitate the release of the chip onto the substrate, the pressure relief mechanism further includes a pressure relief pipe connected to the compression cylinder, the pressure relief pipe extends to the outside of the fixed sleeve at one end away from the compression cylinder, a pressing valve is arranged on the pressure relief pipe, and a pressing rod is fixedly connected to the side of the movable suction cup close to the pressing valve, wherein when the pressing rod contacts the pressing valve, the pressing valve is in an open state.

[0012] In order to ensure the stability of gas adsorption, it further includes an exhaust pipe fixedly connected to the adjustment ring, the exhaust pipe is connected to the mounting groove, and one end of the exhaust pipe away from the adjustment ring is connected to the exhaust device.

[0013] In order to prevent dust from falling onto the substrate when the gas stops adsorbing, the dust-proof unit further includes an installation cavity opened on the side of the movable suction cup close to the exhaust channel, and a plurality of groups of second springs are fixedly connected to the side of the installation cavity close to the fixed sleeve, and the end of the second spring is fixedly connected to a filter plate tightly fitting the inner wall of the installation cavity, and the side of the installation cavity away from the fixed sleeve is symmetrically connected to a guide plate, and a two-way cylinder is arranged between the two groups of guide plates, wherein the end of the two-way cylinder is rotationally connected to the guide plate, and the two-way cylinder is connected to the compression cylinder through a pipeline.

[0014] In order to facilitate dust cleaning and prevent the filter plate from being blocked, it further includes a dust collecting channel opened on the side of the movable suction cup close to the guide plate, the dust collecting channel is connected with the installation cavity in an inclined state, a collecting chamber is opened on the side of the movable suction cup close to the dust collecting channel, the collecting chamber is connected with the dust collecting channel, and the collecting chamber extends to the outside of the movable suction cup, and a head is provided on the side of the collecting chamber close to the outer wall of the movable suction cup.

[0015] A chip mounting method of a chip mounting machine comprises the following steps:

[0016] Step 1: First, the tray containing the chips and the substrate are transported along the bottom of the adjacent adsorption units by the conveying equipment in turn. The height of the adsorption unit can be adjusted by the lifting unit to achieve the adsorption of the chips;

[0017] Step 2: During the adsorption process, when the adsorption unit is in contact with the substrate and has a certain pressure, the pneumatic valve is triggered to open, and the dust-proof unit is turned on at the same time. At this time, the chip can be adsorbed, and the chip can be separated from the tray after adsorption through the lifting unit;

[0018] Step 3: The transfer unit drives the adsorption unit to rotate intermittently, transfers the adsorbed chip to the top of the substrate, and then moves the chip to the substrate through the lifting unit, and presses the substrate and chip to ensure the quality and stability of the chip placement;

[0019] Step 4: At this time, the pressure relief mechanism is used to relieve the pressure on the adsorption unit, the pneumatic valve and the dustproof unit are closed, the adsorption of the chip is stopped, the chip is attached to the substrate, and the chip bonding is completed;

[0020] Step 5: During the adsorption process, the dustproof unit will vibrate to reduce the adhesion of dust on the dustproof unit. After the dustproof unit is closed, the dust passes through the dustproof unit along the dust collection channel and falls into the collection chamber to prevent the dust from falling onto the substrate when the chip is adsorbed.

[0021] Step 6: Repeat the above process to continuously mount the chip.

[0022] Compared with the prior art, the present invention provides a chip mounter and a chip mount method, which have the following beneficial effects:

[0023] 1. The chip mounter can adjust the height of the chip during the chip transfer process through the transfer unit and the lifting unit, which can shorten the chip mounting time and improve the chip mounting efficiency of new products. The position of each transfer is fixed to ensure the accuracy of chip mounting.

[0024] 2. The chip mounter can adsorb and fix the chip only when there is a certain pressure between the adsorption unit and the chip, preventing the chip from shifting during the adsorption process, thereby reducing the frequency of chip position adjustment. At the same time, it can play a buffering role when the chip contacts the adsorption unit to avoid damage to the chip by the adsorption unit.

[0025] 3. The chip mounter can release the chip onto the substrate when there is a certain pressure between the chip and the substrate through the pressure relief mechanism to avoid the chip from moving during mounting, so as to ensure the quality and stability of chip mounting, and also avoid excessive mounting pressure and damage to components.

[0026] 4. The chip mounter adjusts the opening status of the dustproof unit according to the working status of the adsorption unit. When the chip is adsorbed, the dust in the air can be filtered, and the filter plate is driven to vibrate through the second spring to avoid clogging of the filter plate. When the chip is stopped from being adsorbed, the dustproof unit is closed, and the dust will fall into the collection chamber through the guide plate to prevent the dust from falling onto the substrate and affecting the performance of the substrate.

[0027] The parts not involved in the device are the same as the existing technology or can be implemented by using the existing technology. The present invention can overcome the problems of low chip mounting efficiency, easy offset, easy damage to the chip, and easy dust falling onto the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 The present invention is a schematic structural diagram of a chip placement machine.

[0029] Figure 2 This is a schematic diagram of the main structure of a chip placement machine proposed by the present invention.

[0030] Figure 3 A schematic diagram of the partial structure of a chip placement machine proposed by the present invention Figure 1 .

[0031] Figure 4 A schematic diagram of the partial structure of a chip placement machine proposed by the present invention Figure 2 .

[0032] Figure 5 The present invention provides a schematic diagram of the partial cross-sectional structure of an adjusting ring, a fixing sleeve and a movable suction cup in a chip placement machine proposed by the present invention.

[0033] Figure 6 The present invention provides a schematic structural diagram of an adjustment shaft in a chip placement machine.

[0034] Figure 7 A chip placement machine proposed by the present invention Figure 5 Schematic diagram of the structure of part A.

[0035] Figure 8 A chip placement machine proposed by the present invention Figure 5 Schematic diagram of the structure of part B.

[0036] In the figure: 1. base; 2. support column; 3. fixed plate; 4. connecting column; 5. mounting ring; 6. slide groove; 7. positioning plate; 8. driving motor; 9. fixing plate; 10. slider; 11. fan-shaped plate; 12. limiting hole; 13. bracket; 14. telescopic rod; 15. adjusting ring; 16. adjusting shaft; 17. limiting groove; 18. shaft hole; 19. protrusion; 20. mounting groove; 21. rotating ring; 22. fixing sleeve; 23. movable suction cup; 24. exhaust pipe; 25. pneumatic valve; 26. compression cylinder; 27. first spring; 28. exhaust pipe; 29. ​​pressing valve; 30. pressing rod; 31. exhaust channel; 32. mounting cavity; 33. second spring; 34. filter plate; 35. guide plate; 36. two-way cylinder; 37. dust collection channel; 38. collecting cavity. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0038] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0039] Embodiment 1:

[0040] Reference Figure 1-Figure 8 A chip mounter comprises a base 1, and also comprises: a transfer unit arranged on the base 1, for intermittently transferring the chip to a substrate; a lifting unit arranged between the base 1 and the transfer unit, the transfer unit can drive the lifting unit to rotate, for separating the chip from the chip tray and pressing the chip onto the substrate; an adsorption unit arranged on the lifting unit, for adsorbing the chip in the chip tray, wherein when a pressure threshold is reached between the adsorption unit and the substrate, the adsorption unit releases the chip onto the substrate; a dustproof unit arranged on the adsorption unit, the adsorption unit and the dustproof unit are connected through a pipeline, for preventing dust from falling onto the substrate after adsorption, and collecting the dust.

[0041] Reference Figure 1-Figure 3 The transfer unit includes a support column 2 rotatably connected to a base 1, a fixed disk 3 is fixedly connected to the end of the support column 2, a plurality of connecting columns 4 are fixedly connected to the outer wall of the fixed disk 3, a mounting ring 5 is fixedly connected to the end of the connecting column 4 away from the fixed disk 3, a plurality of limiting holes 12 are penetrated through the mounting ring 5, wherein the axis of the mounting ring 5 and the fixed disk 3 are located on the same straight line, the connecting columns 4 are evenly distributed between the mounting ring 5 and the fixed disk 3, and a driving mechanism is provided on the side of the base 1 close to the fixed disk 3.

[0042] The number of the limiting holes 12 is not limited here, and the best is four groups, which are used for chip adsorption and mounting respectively, and corresponding chip conveying equipment and substrate conveying devices are arranged under the limiting holes 12. This is a conventional method in the prior art, so it is not elaborated here. During the chip transfer process, the limiting holes 12 can position the fixing sleeve 22 to ensure the accuracy of the chip adsorption and mounting position.

[0043] Reference Figure 3The driving mechanism includes a driving motor 8 fixedly connected to the base 1, the output end of the driving motor 8 is fixedly connected to a fixing plate 9, a side of the fixing plate 9 close to the fixing disk 3 is fixedly connected to a slider 10, and an end of the fixing plate 9 away from the slider 10 is fixedly connected to a fan-shaped plate 11, a connecting column 4 is provided with a slide groove 6 matching the slider 10, and a plurality of positioning plates 7 matching the fan-shaped plates 11 are fixedly connected to the mounting ring 5, wherein the driving motor 8 is located between two adjacent groups of connecting columns 4, and the number of the positioning plates 7 is the same as that of the connecting columns 4, and they are arranged in a staggered manner.

[0044] It needs to be explained that the number of connecting columns 4 and positioning plates 7 is the same as the number of limiting holes 12, and when the fan-shaped plate 11 drives the mounting ring 5 to rotate, the angle of a single rotation is the same as the angle between two adjacent groups of limiting holes 12, that is, the upper fixing sleeve 22 will rotate to the position of the next fixing sleeve 22, thereby improving the accuracy of the chip mounting position, realizing multi-directional and simultaneous chip mounting, and greatly improving the chip mounting efficiency.

[0045] Reference Figure 1 , Figure 4 , Figure 5 and Figure 6 The lifting unit includes an adjusting shaft 16 fixedly connected to the end of the support column 2 away from the base 1, a limiting groove 17 is provided on the outer wall of the adjusting shaft 16, an adjusting ring 15 is arranged on the outside of the adjusting shaft 16, an axial hole 18 matching the adjusting shaft 16 is provided on the adjusting ring 15, and a protrusion 19 matching the limiting groove 17 is fixedly connected on the inner wall of the axial hole 18. A bracket 13 is fixedly connected to the side of the base 1 close to the adjusting shaft 16, a telescopic rod 14 is fixedly connected between the bracket 13 and the adjusting ring 15, and a mounting groove 20 is provided on the side of the adjusting ring 15 away from the telescopic rod 14. A rotating ring 21 is fixedly connected inside the mounting groove 20, and a plurality of fixed sleeves 22 matching the limiting holes 12 are fixedly connected to the rotating ring 21, wherein the rotating ring 21 and the limiting groove 17 are arranged in a W shape connected end to end, and the adjusting ring 15 is driven to move upward first and then move downward to the initial position through the protrusion 19 during the process of the fixing sleeve 22 rotating to the next position.

[0046] It needs to be explained that when the adjusting shaft 16 rotates, under the action of the limit groove 17 and the protrusion 19, it will drive the rotating ring 21 to rotate between two adjacent groups of limit holes 12, first moving upward and then moving downward, thereby realizing the detachment of the chip after adsorption and the mounting of the chip on the substrate. In this process, the telescopic rod 14 can play a limiting role to prevent the rotating ring 21 from rotating.

[0047] Reference Figure 4-Figure 5The adsorption unit includes a movable suction cup 23 slidably connected in the fixed sleeve 22, and an exhaust channel 31 connected to the interior of the fixed sleeve 22 is opened on the movable suction cup 23. A pneumatic valve 25 is arranged between the fixed sleeve 22 and the rotating ring 21, and a compression cylinder 26 and a first spring 27 are fixedly connected between the inner wall of the fixed sleeve 22 and the movable suction cup 23, wherein the pneumatic valve 25 is connected to the mounting groove 20 and the interior of the fixed sleeve 22, the compression cylinder 26 and the pneumatic valve 25 are connected through a pipeline, the first spring 27 is sleeved on the outside of the compression cylinder 26, and a pressure relief mechanism is arranged between the movable suction cup 23 and the compression cylinder 26, and also includes an exhaust pipe 24 fixedly connected to the adjusting ring 15, the exhaust pipe 24 is connected to the mounting groove 20, and the end of the exhaust pipe 24 away from the adjusting ring 15 is connected to the exhaust device.

[0048] The specific structure of the pneumatic valve 25 can refer to the technical solutions in the prior art, and those skilled in the art can know it. In addition, connecting through pipelines is a conventional means in the prior art, so it will not be elaborated on. During the chip adsorption and mounting process, the first spring 27 can have a buffering effect on the movable suction cup 23 to prevent it from causing damage to the chip. It should be explained that during the transfer of the chip, under the action of gas suction, the first spring 27 and the compression cylinder 26 will maintain the existing state, that is, when the chip is separated from the tray, the compression cylinder 26 will not extend to the initial length under the action of the first spring 27, and the pneumatic valve 25 will always remain in an open state.

[0049] Reference Figure 5 and Figure 7 The pressure relief mechanism includes a relief pipe 28 connected to the compression cylinder 26. One end of the relief pipe 28 away from the compression cylinder 26 extends to the outside of the fixed sleeve 22. A pressing valve 29 is arranged on the relief pipe 28. A pressing rod 30 is fixedly connected to the side of the movable suction cup 23 close to the pressing valve 29. When the pressing rod 30 contacts the pressing valve 29, the pressing valve 29 is in an open state.

[0050] It should be explained that during the transportation process, the height of the substrate is slightly higher than the position where the chip is loaded on the disc, so that when the chip is transferred to the substrate and moves downward the same distance, the pressure between the movable suction cup 23 and the chip is greater. On the one hand, the quality and stability of chip mounting can be ensured, and on the other hand, the gas in the compressed cylinder 26 can be released through the pressing valve 29 to achieve the purpose of closing the pneumatic valve 25, thereby stopping the adsorption of the chip. The pressing valve 29 is a conventional means in the prior art, so it will not be described in detail.

[0051] Reference Figure 5 and Figure 8The dustproof unit includes an installation cavity 32 opened on the side of the movable suction cup 23 close to the exhaust channel 31, and a plurality of groups of second springs 33 are fixedly connected to the side of the installation cavity 32 close to the fixed sleeve 22. The end of the second spring 33 is fixedly connected to a filter plate 34 that fits tightly with the inner wall of the installation cavity 32. The side of the installation cavity 32 away from the fixed sleeve 22 is symmetrically connected to a guide plate 35. A two-way cylinder 36 is arranged between the two groups of guide plates 35, wherein the end of the two-way cylinder 36 is connected to the guide plate 35. The two-way air cylinder 36 is connected to the compression air cylinder 26 through a pipeline, and also includes a dust collecting channel 37 opened on the side of the movable suction cup 23 close to the guide plate 35. The dust collecting channel 37 is connected to the installation cavity 32 in an inclined state. A collecting chamber 38 is opened on the side of the movable suction cup 23 close to the dust collecting channel 37. The collecting chamber 38 is connected to the dust collecting channel 37, and the collecting chamber 38 extends to the outside of the movable suction cup 23. A head is provided on the side of the collecting chamber 38 close to the outer wall of the movable suction cup 23.

[0052] When the chip is adsorbed, the guide plate 35 is also in an open state under the action of the two-way cylinder 36. The dust and other impurities in the adsorption will be adsorbed on the filter plate 34, and with the change of the dust on the filter plate 34, the filter plate 34 will be driven to vibrate under the action of the second spring 33 to prevent the dust from clogging the filter plate 34, thereby ensuring the stability of the chip adsorption process. When the chip is stopped being adsorbed, the guide plate 35 is in a closed state, and the dust and other impurities on the filter plate 34 will fall along the guide plate 35 to the dust collecting channel 37, and finally collected in the collecting chamber 38. When the guide plate 35 is opened, the dust collecting channel 37 will be blocked to prevent the dust in the collecting chamber 38 from being re-adsorbed to the filter plate 34.

[0053] Embodiment 2:

[0054] A chip mounting method of a chip mounting machine comprises the following steps:

[0055] Step 1: First, the tray containing the chips and the substrate are transported along the bottom of the adjacent adsorption units by the conveying equipment in turn. The height of the adsorption unit can be adjusted by the lifting unit to achieve the adsorption of the chips;

[0056] The conveying device is a conventional means in the prior art, so it is not described in detail. By adjusting the height of the chip back and forth through the lifting unit, the chip mounting time can be shortened, thereby improving the chip mounting efficiency;

[0057] Step 2: During the adsorption process, when the adsorption unit and the substrate are in contact and have a certain pressure, the pneumatic valve 25 is triggered to open, and the dustproof unit is opened at the same time. At this time, the chip can be adsorbed, and the chip after adsorption can be separated from the tray through the lifting unit;

[0058] This not only ensures the accuracy of the chip adsorption position, but also reduces the amount of dust and other impurities entering during the adsorption process, thereby improving the chip mounting quality and stability;

[0059] Step 3: The transfer unit drives the adsorption unit to rotate intermittently, transfers the adsorbed chip to the top of the substrate, and then moves the chip to the substrate through the lifting unit, and presses the substrate and chip to ensure the quality and stability of the chip placement;

[0060] Step 4: At this time, the adsorption unit is depressurized through the pressure relief mechanism, the pneumatic valve 25 and the dustproof unit are closed, the adsorption of the chip is stopped, the chip is attached to the substrate, and the chip bonding is completed;

[0061] By mechanically monitoring the position of the chip on the substrate, it is not only possible to improve the stability of equipment operation, but also to reduce the equipment construction cost and the equipment maintenance rate;

[0062] Step 5: During the adsorption process, the dustproof unit will vibrate to reduce the adhesion of dust on the dustproof unit. After the dustproof unit is closed, the dust passes through the dustproof unit along the dust collection channel 37 and falls into the collection chamber 38 to prevent the dust from falling onto the substrate when the chip is adsorbed.

[0063] As the amount of dust and other impurities on the filter plate 34 increases, the force applied to the filter plate 34 during the adsorption process will change, thereby causing the filter plate 34 to vibrate under the action of the second spring 33;

[0064] Step 6: Repeat the above process to continuously mount the chip.

[0065] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip mounter, comprising a base (1), characterized in that: Also includes: A transfer unit arranged on the base (1) and used for intermittently transferring the chip to the substrate; A lifting unit is arranged between the base (1) and the transfer unit, and the transfer unit can drive the lifting unit to rotate, so as to separate the chip from the chip tray and press the chip onto the substrate; The adsorption unit disposed on the lifting unit is used to adsorb the chips in the chip tray. Wherein, when the pressure threshold between the adsorption unit and the substrate is reached, the adsorption unit releases the chip onto the substrate; The dustproof unit is arranged on the adsorption unit, and the adsorption unit is connected with the dustproof unit through a pipeline, so as to prevent the dust from falling onto the substrate after adsorption and collect the dust.

2. A chip mounter according to claim 1, characterized in that: The transfer unit comprises a support column (2) rotatably connected to a base (1), the end of the support column (2) being fixedly connected to a fixed disk (3), the outer side wall of the fixed disk (3) being fixedly connected to a plurality of connection columns (4), the end of the connection column (4) away from the fixed disk (3) being fixedly connected to a mounting ring (5), the mounting ring (5) being provided with a plurality of limit holes (12) extending therethrough, The axes of the mounting ring (5) and the fixing disk (3) are located on the same straight line, the connecting columns (4) are evenly distributed between the mounting ring (5) and the fixing disk (3), and a driving mechanism is provided on a side of the base (1) close to the fixing disk (3).

3. A chip mounter according to claim 2, characterized in that: The driving mechanism comprises a driving motor (8) fixedly connected to the base (1); the output end of the driving motor (8) is fixedly connected to a fixing plate (9); a side of the fixing plate (9) close to the fixing plate (3) is fixedly connected to a sliding block (10); an end of the fixing plate (9) away from the sliding block (10) is fixedly connected to a fan-shaped plate (11); a sliding groove (6) matching the sliding block (10) is provided on the connecting column (4); and a plurality of positioning plates (7) matching the fan-shaped plates (11) are fixedly connected to the mounting ring (5). The driving motor (8) is located between two adjacent groups of connecting columns (4), and the number of the positioning plates (7) and the number of the connecting columns (4) are the same and are arranged in a staggered manner.

4. A chip mounter according to claim 2, characterized in that: The lifting unit comprises an adjusting shaft (16) fixedly connected to an end of the support column (2) away from the base (1), a limiting groove (17) is provided on the outer wall of the adjusting shaft (16), an adjusting ring (15) is arranged outside the adjusting shaft (16), an axial hole (18) matching the adjusting shaft (16) is provided on the adjusting ring (15), a protrusion (19) matching the limiting groove (17) is fixedly connected on the inner wall of the axial hole (18), a bracket (13) is fixedly connected to the side of the base (1) close to the adjusting shaft (16), a telescopic rod (14) is fixedly connected between the bracket (13) and the adjusting ring (15), a mounting groove (20) is provided on the side of the adjusting ring (15) away from the telescopic rod (14), a rotating ring (21) is fixedly connected inside the mounting groove (20), and a plurality of fixing sleeves (22) matching the limiting holes (12) are fixedly connected to the rotating ring (21), The rotating ring (21) and the limiting groove (17) are arranged in a W shape with the ends connected, and are used to drive the adjusting ring (15) to move upward first and then downward to the initial position through the protrusion (19) when the fixing sleeve (22) rotates to the next position.

5. A chip mounter according to claim 4, characterized in that: The adsorption unit comprises a movable suction cup (23) slidably connected in a fixed sleeve (22); an air extraction channel (31) communicating with the interior of the fixed sleeve (22) is provided on the movable suction cup (23); a pneumatic valve (25) is provided between the fixed sleeve (22) and the rotating ring (21); a compression cylinder (26) and a first spring (27) are fixedly connected between the inner side wall of the fixed sleeve (22) and the movable suction cup (23); The pneumatic valve (25) is connected to the interior of the mounting groove (20) and the fixing sleeve (22); the compression cylinder (26) is connected to the pneumatic valve (25) via a pipeline; the first spring (27) is sleeved on the outside of the compression cylinder (26); and a pressure relief mechanism is provided between the movable suction cup (23) and the compression cylinder (26).

6. A chip mounter according to claim 5, characterized in that: The pressure relief mechanism comprises a relief pipe (28) connected to the compression cylinder (26), one end of the relief pipe (28) away from the compression cylinder (26) extends to the outside of the fixed sleeve (22), a pressing valve (29) is arranged on the relief pipe (28), and a pressing rod (30) is fixedly connected to a side of the movable suction cup (23) close to the pressing valve (29). When the pressing rod (30) contacts the pressing valve (29), the pressing valve (29) is in an open state.

7. A chip mounter according to claim 4, characterized in that: It also includes an exhaust pipe (24) fixedly connected to the adjustment ring (15), the exhaust pipe (24) is connected to the mounting groove (20), and one end of the exhaust pipe (24) away from the adjustment ring (15) is connected to an exhaust device.

8. A chip mounter according to claim 6, characterized in that: The dustproof unit comprises an installation cavity (32) provided on a side of the movable suction cup (23) close to the air extraction channel (31); a plurality of groups of second springs (33) are fixedly connected to a side of the installation cavity (32) close to the fixed sleeve (22); ends of the second springs (33) are fixedly connected to filter plates (34) that are tightly fitted to the inner wall of the installation cavity (32); a guide plate (35) is symmetrically rotatably connected to a side of the installation cavity (32) away from the fixed sleeve (22); a bidirectional cylinder (36) is provided between two groups of the guide plates (35); The end of the bidirectional cylinder (36) is rotatably connected to the guide plate (35), and the bidirectional cylinder (36) is connected to the compression cylinder (26) via a pipeline.

9. A chip mounter according to claim 8, characterized in that: The invention also comprises a dust collecting channel (37) provided on a side of the movable suction cup (23) close to the guide plate (35); the dust collecting channel (37) is connected to the mounting cavity (32) in an inclined manner; a collecting cavity (38) is provided on a side of the movable suction cup (23) close to the dust collecting channel (37); the collecting cavity (38) is connected to the dust collecting channel (37), and the collecting cavity (38) extends to the outside of the movable suction cup (23); and a sealing head is provided on a side of the collecting cavity (38) close to the outer wall of the movable suction cup (23).

10. A chip bonding method comprising the chip bonding machine according to any one of claims 1 to 9, characterized in that: The following steps are also included: Step 1: First, the tray containing the chips and the substrate are transported along the bottom of the adjacent adsorption units by the conveying equipment in turn. The height of the adsorption unit can be adjusted by the lifting unit to achieve the adsorption of the chips; Step 2: During the adsorption process, when the adsorption unit and the substrate are in contact and have a certain pressure, the pneumatic valve (25) is triggered to open, and the dustproof unit is opened at the same time, and the chip can be adsorbed at this time. The chip after adsorption can be separated from the tray through the lifting unit; Step 3: The transfer unit drives the adsorption unit to rotate intermittently, transfers the adsorbed chip to the top of the substrate, and then moves the chip to the substrate through the lifting unit, and presses the substrate and chip to ensure the quality and stability of the chip placement; Step 4: At this time, the pressure relief mechanism is used to relieve the pressure on the adsorption unit, the pneumatic valve (25) and the dustproof unit are closed, the adsorption of the chip is stopped, and the chip is attached to the substrate, thus completing the chip mounting; Step 5: During the adsorption process, the dustproof unit will vibrate to reduce the adhesion of dust on the dustproof unit. After the dustproof unit is closed, the dust passes through the dustproof unit along the dust collection channel (37) and falls into the collection chamber (38), thereby preventing the dust from falling onto the substrate when the chip is adsorbed. Step 6: Repeat the above process to continuously mount the chip.

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