Camera module and electronic equipment

Abstract

The invention relates to a camera module and electronic equipment. The camera module comprises an optical conduction element, a lens, an image sensor and a first circuit element. The image sensor and the lens are arranged on the same side of the optical conduction element and at least partially coincide with the lens in the axial direction of the lens, and the optical conduction element is configured to be capable of conducting at least part of light emitted by the lens to the image sensor; the first circuit element comprises a connecting part and a wiring part, the connecting part is electrically connected to the image sensor and fixed relative to the image sensor, and the wiring part is electrically connected to the connecting part and at least partially located between the lens and the image sensor. According to the camera module, the space between the lens and the image sensor can be fully utilized for wiring, and the space utilization efficiency of the camera module is improved, so that the occupied space of the camera module is favorably compressed.

Description

Technical Field

[0001] The present application relates to the technical field of camera equipment, and in particular to a camera module and electronic equipment. Background Art

[0002] With the rapid development of camera technology, more and more electronic devices such as smartphones, tablets, and e-readers are equipped with camera modules to realize camera functions. Among them, there are electronic devices equipped with telephoto camera modules. The telephoto camera module has a sufficiently long focal length, which makes it easy to capture distant objects, present the details of distant objects, and has a strong background blur capability, which can meet the needs of long-distance shooting. However, due to the long focal length of the telephoto camera module, the anti-shake travel required to achieve optical image stabilization is also large, which easily leads to an increase in the size of the camera module, which is not conducive to the miniaturization design of electronic equipment. Summary of the invention

[0003] The embodiments of the present application provide a camera module and an electronic device to solve the problem that the anti-shake travel of the telephoto camera module is long, which easily leads to an increase in the size of the camera module.

[0004] A camera module, comprising:

[0005] Optical transmission elements;

[0006] Lens;

[0007] an image sensor, wherein the image sensor and the lens are disposed on the same side of the optical transmission element and at least partially overlap with the lens in the axial direction of the lens, and the optical transmission element is configured to transmit at least part of the light emitted by the lens to the image sensor; and

[0008] The first circuit element includes a connecting portion and a routing portion, wherein the connecting portion is electrically connected to the image sensor and fixed relative to the image sensor, and the routing portion is electrically connected to the connecting portion and is at least partially located between the lens and the image sensor.

[0009] An electronic device comprises the above-mentioned camera module.

[0010] In the above-mentioned camera module, the lens and the image sensor are arranged on the same side of the optical transmission element, and the optical transmission element can transmit at least part of the light emitted by the lens to the image sensor. It can be seen that the light is deflected at least once during the transmission process in the optical transmission element, and the optical transmission element can play a role in folding the optical path, which is conducive to realizing the telephoto design of the camera module. At the same time, the image sensor at least partially overlaps with the lens in the axial direction of the lens, which is conducive to compressing the space occupied by the image sensor and the lens in the axial direction of the lens while realizing the telephoto design, thereby facilitating the compression of the space occupied by the camera module. In addition, in order to adapt to the design of the optical path, so that the image sensor can receive the light deflected by the optical transmission element, there is usually a gap between the image sensor and the lens, and the wiring portion of the first circuit element electrically connected to the image sensor is at least partially located between the image sensor and the lens, which can make full use of the space between the lens and the image sensor for wiring, so that the layout of the wiring portion is adapted to the layout of the lens, the image sensor and the optical transmission element, thereby improving the space utilization efficiency of the camera module, thereby facilitating further compression of the space occupied by the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0012] Figure 1 A schematic diagram of the structure of an electronic device.

[0013] Figure 2 Schematic diagram of the structure of the camera module in some embodiments.

[0014] Figure 3 for Figure 2 A schematic structural diagram of the camera module shown in FIG.

[0015] Figure 4 for Figure 3 The cross-sectional schematic diagram of the camera module shown is along the AA direction.

[0016] Figure 5 Schematic diagram of the optical path of the camera module in some embodiments.

[0017] Figure 6 for Figure 2 An exploded schematic diagram of the camera module is shown.

[0018] Figure 7 for Figure 2 The camera module shown is a structural schematic diagram in which the cover is omitted.

[0019] Figure 8 for Figure 7 The structural schematic diagram of the anti-shake bracket of the camera module is shown.

[0020] Fig. 9 Schematic diagram of the structure of the camera module in some other embodiments.

[0021] Fig.10 for Fig. 9 A schematic structural diagram of the first circuit element in the camera module shown.

[0022] Fig.11 Schematic diagram of the structure of the camera module in some other embodiments.

[0023] Fig.12 for Fig.11 A schematic structural diagram of the first circuit element in the camera module shown.

[0024] Fig.13 for Figure 2 An exploded schematic diagram of some components of the camera module is shown.

[0025] Fig.14 for Figure 2 The schematic diagram of the structure of the anti-shake drive mechanism in the camera module shown.

[0026] Fig.15 for Fig.14 An exploded schematic diagram of some components of the anti-shake drive mechanism is shown.

[0027] Fig.16 Schematic diagram of the structure of the camera module in some further embodiments.

[0028] Fig.17 for Fig.16 An exploded schematic diagram of the camera module is shown.

[0029] Fig.18 for Fig.16 The structural schematic diagram of some components of the camera module is shown.

[0030] Fig.19 Schematic diagram of the structure of a camera module provided with an anti-shake circuit carrier in some embodiments.

[0031] Fig. 20 for Fig.19 An exploded schematic diagram of the camera module is shown.

[0032] Fig.21 for Fig.19 The schematic diagram of the structure of some components of the camera module is shown.

[0033] Fig. 22 for Fig.21 An exploded schematic diagram of some components of the camera module is shown.

[0034] Fig.23 for Fig.19 A schematic diagram of the structure of the flexible support member in the camera module shown.

[0035] Fig.24 for Fig.19 Schematic diagram of the structure of the elastic conductive cantilever in the camera module shown.

[0036] Fig.25 This is a schematic diagram of the structure in which the electronic device further includes other components in some embodiments.

[0037] Reference numerals:

[0038] 10. electronic device; 11. light inlet; 20. camera module; 21. lens; 211. first lens group; 212. second lens group; 22. image sensor; 23. optical transmission element; 231. light transmission surface; 2311. light entry area; 2312. light exit area; 232. first reflection surface; 233. second reflection surface; 234. bottom surface; 24. first circuit element; 241. connection part; 242. wiring part; 2421. first circuit structure; 2422. second circuit structure; 2423. corner; 2424. winding part; 25. anti-shake drive mechanism; 251. first carrier; 2511. first groove; 252. second carrier; 2521. second groove; 253. first drive Component; 254, second drive component; 255, limiting structure; 256, sliding support; 26, anti-shake bracket; 261, base; 2611, hollow groove; 262, first shell; 263, isolation member; 264, cover; 27, prism bracket; 28, reinforcement structure; 29, second circuit element; 31, filter; 32, sensor bracket; 33, focus drive mechanism; 331, shell; 332, moving part; 34, anti-shake circuit carrier; 35, flexible support; 351, deformation part; 3511, deformation body; 3512, fixed structure; 352, bearing part; 36, drive module; 37, anti-shake seat; 38, elastic conductive cantilever; 391, first direction; 392, second direction. DETAILED DESCRIPTION

[0039] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0040] As used herein, "electronic device" refers to a device that can receive and / or send communication signals, including but not limited to a device that is connected via any one or more of the following connection methods:

[0041] (1) Connection via wired lines, such as Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, and direct cable connection;

[0042] (2) Via wireless interfaces, such as cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, and AM-FM broadcast transmitters.

[0043] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0044] (1) Satellite phone or cellular phone;

[0045] (2) Personal Communications System (PCS) terminals that can combine cellular radio telephones with data processing, fax, and data communications capabilities;

[0046] (3) Radiotelephone, pager, Internet / intranet access, Web browser, notepad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0047] (4) conventional laptop and / or palmtop receivers;

[0048] (5) Conventional laptop and / or palmtop radio telephone transceivers, etc.

[0049] See also Figure 1-Figure 4As shown, in some embodiments of the present application, a camera module 20 is provided, and the camera module 20 can be applied to an electronic device 10, for example, in any applicable electronic device 10 such as a smart phone, a tablet computer, an e-reader, etc. The camera module 20 includes a lens 21, an image sensor 22, and an optical transmission element 23. The lens 21 may include one or more lenses with optical focal length, the optical transmission element 23 may be a prism made of plastic or glass, and the image sensor 22 includes but is not limited to a charge-coupled device (CCD) or a complementary metal oxide semiconductor (CMOS). The back cover of the electronic device 10 may be provided with a light inlet 11, and the lens 21 is opposite to the light inlet 11, and collects ambient light through the light inlet 11. The optical transmission element 23 can transmit at least part of the light emitted by the lens 21 to the image sensor 22, so that the image sensor 22 converts the optical signal into an electrical signal and transmits it to the control element such as the central processor of the electronic device 10 to realize the shooting function.

[0050] Combination Figure 4 and 5 As shown, in some embodiments, the image sensor 22 and the lens 21 are arranged on the same side of the optical transmission element 23, and at least partially overlap with the lens 21 in the axial direction of the lens 21. For example, the optical transmission element 23 has a light-transmitting surface 231, and the light-transmitting surface 231 has a light-entering area 2311 and a light-exiting area 2312. The lens 21 is opposite to the light-entering area 2311 of the light-transmitting surface 231, and the image sensor 22 is opposite to the light-exiting area 2312 of the lens 21. The optical transmission element 23 can emit light incident from the light-entering area 2311 from the light-exiting area 2312 after multiple reflections, so as to be transmitted to the image sensor 22. In other words, the optical transmission element 23 can deflect the light by 180° through multiple reflections, thereby achieving the effect of folding the optical path, which is conducive to realizing the telephoto design of the camera module 20 and compressing the occupied space of the camera module 20 through the periscope design.

[0051] At the same time, the optical transmission element 23 deflects the light by 180°, so that the lens 21 and the image sensor 22 are located on the same side of the optical transmission element 23, and the image sensor 22 and the lens 21 at least partially overlap in the axial direction of the lens 21, which is conducive to reducing the space occupied by the lens 21 and the image sensor 22 in the height direction of the camera module 20, thereby compressing the size of the camera module 20 in the thickness direction of the electronic device 10, which is conducive to the miniaturization design of the electronic device 10. In addition, in the direction of light propagation, the lens 21, the optical transmission element 23 and the image sensor 22 are arranged in sequence. When the camera module 20 is arranged in the electronic device 10, the lens 21 can be opposite to the light inlet 11 of the electronic device 10, while the non-optical transmission element 23 is opposite to the light inlet 11, so that the light inlet 11 can be set to be circular instead of square to adapt to the shape of the lens 21, which is conducive to the shape of the light inlet 11 to adapt to the shape of other hole structures of the electronic device 10, and improve the appearance integrity of the electronic device 10.

[0052] refer to Figure 5 As shown, in some embodiments, the optical conductive element 23 can emit at least part of the light incident from the light incident area 2311 from the light exit area 2312 after five reflections. For example, the optical conductive element 23 also includes a first reflective surface 232, a second reflective surface 233 and a bottom surface 234. The first reflective surface 232 is obliquely opposite to the light incident area 2311 of the light transmitting surface 231, the second reflective surface 233 is obliquely opposite to the light exit area 2312 of the light transmitting surface 231, and the bottom surface 234 is connected to the first reflective surface 232 and the second reflective surface 233 and is opposite to the light transmitting surface 231. At least part of the light incident from the light incident area 2311 can be reflected by the first reflection surface 232 onto the light transmission surface 231, then reflected by the light transmission surface 231 onto the bottom surface 234, then reflected by the bottom surface 234 onto the light transmission surface 231 again, then reflected by the light transmission surface 231 onto the second reflection surface 233, and then emitted from the light exit area 2312 after being reflected by the second reflection surface 233. Of course, the above five reflections are only examples of light deflection by the optical transmission element 23 in one embodiment. In other embodiments, according to the size of the optical transmission element 23, the angles between the light transmission surface 231 and the first reflection surface 232 and the second reflection surface 233, the light can also be emitted after being reflected twice, three times, or other numbers in the optical transmission element 23, as long as the optical transmission element 23 can deflect the light by 180° to transmit at least part of the light collected by the lens 21 to the image sensor 22. It can be understood that the more times the light is reflected in the optical transmission element 23, the longer the equivalent optical path of the light in the optical transmission element 23, and the lens 21 design with a longer focal length can be adapted. The number of reflections can be specifically designed according to the focal length requirements of the camera module 20, and is not limited in this application.

[0053] Combination Figure 4, Figure 5 and Figure 6 As shown, it can be seen that when the optical transmission element 23 deflects the light through multiple reflections, in order to adapt to the transmission light path, there is usually a gap between the light input area 2311 and the light output area 2312, that is, there is a gap between the lens 21 and the image sensor 22, in order to improve the utilization efficiency of the space between the lens 21 and the image sensor 22. In some embodiments, the camera module 20 also includes a first circuit element 24, the first circuit element 24 can be a flexible circuit board, or a soft-hard combination board formed by connecting a flexible circuit board and a printed circuit board, the first circuit element 24 is used to realize the electrical connection between the image sensor 22 and external components, for example, to realize the electrical connection between the image sensor 22 and the central processor of the electronic device 10, or with the control chip and other components in the electronic device 10 that are specifically used to realize the communication of the image sensor 22. The first circuit element 24 includes a connecting portion 241 and a wiring portion 242, the connecting portion 241 is electrically connected to the image sensor 22 and fixed relative to the image sensor 22, and the wiring portion 242 is electrically connected to the connecting portion 241 and is at least partially located between the lens 21 and the image sensor 22. As a result, the wiring portion 242 is at least partially located between the image sensor 22 and the lens 21, and the space between the lens 21 and the image sensor 22 can be fully utilized for wiring, so that the layout of the wiring portion 242 is adapted to the layout of the lens 21, the image sensor 22 and the optical transmission element 23, which is beneficial to improving the space utilization efficiency of the camera module 20, thereby helping to further compress the occupied space of the camera module 20.

[0054] In some embodiments, the camera module 20 further includes an anti-shake driving mechanism 25 and an anti-shake bracket 26. The anti-shake bracket 26 is fixed relative to the optical conductive element 23. For example, the anti-shake bracket 26 is directly fixedly arranged on the optical conductive element 23. Alternatively, the camera module 20 further includes a prism bracket 27 for accommodating the optical conductive element 23. The anti-shake bracket 26 is fixedly arranged on the prism bracket 27. The image sensor 22 is arranged on the anti-shake driving mechanism 25. The anti-shake driving mechanism 25 is arranged on the anti-shake bracket 26. The anti-shake driving mechanism 25 is configured to drive the image sensor 22 to move relative to the optical conductive element 23 to achieve an optical anti-shake function. For example, the anti-shake driving mechanism 25 can drive the image sensor 22 to move in at least one direction of a first direction 391 and a second direction 392 that are perpendicular to each other. The planes where the first direction 391 and the second direction 392 are located are parallel to the light-transmitting surface 231, and the second direction 392 is parallel to the vertical connection line between the lens 21 and the image sensor 22. The image sensor 22 is driven by the anti-shake drive mechanism 25 to realize optical image stabilization of the camera module 20. Since the axial size of the image sensor 22 in the lens 21 is usually smaller than the size of the lens 21, such a configuration can make the axial size of the anti-shake drive mechanism 25 in the lens 21 coincide with that of the lens 21, thereby effectively reducing the space occupied by the anti-shake drive mechanism 25 in the axial direction of the lens 21. While realizing optical image stabilization, it is beneficial to compress the axial size of the camera module 20 in the lens 21, thereby helping to compress the thickness of the electronic device 10.

[0055] In some embodiments, the connection portion 241 is fixedly disposed on the anti-shake drive mechanism 25 and electrically connected to the image sensor 22. At least the routing portion 242 in the first circuit element 24 is made of a flexible material, and at least a portion of the routing portion 242 can be deformed as the anti-shake drive mechanism 25 moves relative to the anti-shake bracket 26. For example, the routing portion 242 and the connection portion 241 are both flexible circuit boards, or the routing portion 242 is a flexible circuit board, and the connection portion 241 is a printed circuit board. Such a configuration can improve the reliability of the electrical connection between the connection portion 241 and the image sensor 22. At the same time, while the routing portion 242 is electrically connected to the connection portion 241, it can also adapt to deformation as the anti-shake drive mechanism 25 moves relative to the anti-shake bracket 26, and is not easily damaged during movement, which is beneficial to improving the structural reliability of the first circuit element 24.

[0056] Combination Figure 6 and Figure 7As shown, in some embodiments, the wiring portion 242 includes a first circuit structure 2421 and a second circuit structure 2422 that are connected to each other, the first circuit structure 2421 is fixedly disposed on the anti-shake bracket 26 and is located between the lens 21 and the image sensor 22, and the two ends of the second circuit structure 2422 are respectively connected to the first circuit structure 2421 and the connecting portion 241. Therefore, the two ends of the second circuit structure 2422 are respectively limited by the first circuit structure 2421 and the connecting portion 241, so that the second circuit structure 2422 is not easy to separate from the anti-shake bracket 26 during the deformation caused by the movement of the anti-shake driving mechanism 25, which is conducive to improving the structural reliability of the wiring portion 242.

[0057] In some embodiments, one end of the second circuit structure 2422 is connected to one of the two edges of the connecting portion 241 that are opposite to each other in the first direction 391, and the other end is connected to the first circuit structure 2421 between the lens 21 and the image sensor 22, so that the second circuit structure 2422 has at least one corner 2423 in the extension direction, and the first direction 391 is perpendicular to the axial direction of the lens 21 and the vertical connection line between the lens 21 and the image sensor 22. In other words, the second circuit structure 2422 has at least a portion extending along the first direction 391 and a portion extending along the second direction 392. Figure 7 In the illustrated embodiment, the second circuit structure 2422 is composed of two parts extending along the first direction 391 and the second direction 392, respectively, and a corner 2423 is formed between the two parts. Therefore, when the anti-shake driving mechanism 25 drives the image sensor 22 to move relative to the anti-shake bracket 26 along the first direction 391, the part of the second circuit structure 2422 extending along the second direction 392 will be driven to deform in the first direction 391, and the part of the second circuit structure 2422 extending along the first direction 391 is the lifting structure support of the second circuit structure 2422, and when the anti-shake driving mechanism 25 drives the image sensor 22 to move relative to the anti-shake bracket 26 along the second direction 392, the part of the second circuit structure 2422 extending along the second direction 392 will be driven to deform in the first direction 391. Therefore, by rationally planning the shape of the second circuit structure 2422, the stability and reliability of the second circuit structure 2422 moving in the first direction 391 and the second direction 392 with the anti-shake driving mechanism 25 can be improved, and the risk of damage to the second circuit structure 2422 can be reduced.

[0058] Combination Figure 6 , Figure 7 and Figure 8As shown, in some embodiments, the anti-shake bracket 26 includes a base 261, a first shell 262, and an isolating member 263. The base 261 is disposed on the optical transmission element 23. The first shell 262 is disposed on the base 261 and is disposed around the image sensor 22 in the circumferential direction. The second circuit structure 2422, the image sensor 22, and the anti-shake driving mechanism 25 can all be located in the space surrounded by the first shell 262. The isolating member 263 is disposed on the base 261 and is located in the space surrounded by the first shell 262. The isolating member 263 is located between the lens 21 and the image sensor 22, and at least one end of the isolating member 263 in the first direction 391 is spaced from the first shell 262. The isolating member 263 is spaced from the first shell 262 in the second direction 392. The portion of the second circuit structure 2422 extending along the second direction 392 passes through the gap between the end of the isolating member 263 and the first shell 262, and the rest of the second circuit structure 2422, including the portion having the corner 2423, is located between the first shell 262 and the isolating member 263 in the second direction 392. In this way, the gap between the end of the isolating member 263 and the first shell 262 can guide and limit the sliding of the portion of the second circuit structure 2422 passing through the gap in the second direction 392, and can also limit the sliding of the portion in the first direction 391, so that it is not easy to escape from the gap between the end of the isolating member 263 and the first shell 262, and the space formed by the isolating member 263 and the second shell in the second direction 392 can limit the main part of the second circuit structure 2422, and the main part of the second circuit structure 2422 is not easy to escape from the space during the deformation process, which is conducive to preventing the second circuit structure 2422 from damaging or interfering with the shaking of the image sensor 22 during the deformation process, and improving the structural reliability of the camera module 20.

[0059] Please see again Figure 6 and Figure 7As shown, in some embodiments, the routing portion 242 includes two second circuit structures 2422, the two second circuit structures 2422 are both connected to the first circuit structure 2421, and the two second circuit structures 2422 are respectively connected to two opposite edges of the connecting portion 241 in the first direction 391. Therefore, the provision of the two second circuit structures 2422 can meet the routing travel requirements of the first circuit element 24, and reduce the difficulty of setting the first circuit element 24. At the same time, when the anti-shake driving mechanism 25 drives the image sensor 22 to move, the two second circuit structures 2422 can apply a force to the connecting portion 241 at two opposite edges of the connecting portion 241 in the first direction 391, and maintain the force balance of the two edges of the connecting portion 241, thereby improving the stability of the image sensor 22 moving relative to the optical transmission element 23, which is conducive to improving the accuracy of optical anti-shake. It is understandable that when the routing portion 242 is provided with two second circuit structures 2422 , the two opposite end surfaces of the isolation member 263 are spaced apart from the first shell 262 in the first direction 391 , and the two second circuit structures 2422 pass through the gaps between the two ends of the isolation member 263 and the first shell 262 .

[0060] refer to Fig. 9 and Fig.10 In some embodiments, the routing portion 242 may also be provided with only one second circuit structure 2422, which is beneficial to simplify the structural setting of the first circuit element 24. Fig. 9 In the illustrated embodiment, the second circuit structure 2422 is provided with two corners 2423, one of which is formed between two parts extending along the first direction 391 and the second direction 392, and the other corner 2423 is formed between two parts extending along the second direction 392. Thus, while providing one second circuit structure 2422, the routing path of the second circuit structure 2422 can be extended to meet the routing travel requirements, and the provision of the two corners 2423 is also conducive to improving the reliability of the second circuit structure 2422 being deformed as the anti-shake drive mechanism 25 moves.

[0061] In some embodiments, the camera module 20 further includes a reinforcement structure 28, which is sleeved at the corner 2423 of the second circuit structure 2422. The reinforcement structure 28 may be a flexible plastic support structure. The reinforcement structure 28 can enhance the support effect of the second circuit structure 2422 at the corner 2423, reduce the tensile stress of the second circuit structure 2422 during the deformation process, and thus avoid damage to the second circuit structure 2422 during the deformation. In some embodiments, the second circuit structure 2422 and the connecting portion 241 are both made of flexible materials, and the stiffness of the second circuit structure 2422 is less than that of the connecting portion 241. For example, the stiffness of the second circuit structure 2422 can be made less than that of the connecting portion 241 by reducing the width of the second circuit structure 2422 or reducing the thickness of the substrate layer or the copper layer in the layer structure of the second circuit structure 2422. This is beneficial to improving the reliability of the electrical connection between the connecting portion 241 and the image sensor 22, and can also make the second circuit structure 2422 more easily deformed with the movement of the anti-shake drive mechanism 25, thereby reducing the interference of the second circuit structure 2422 on the anti-shake movement of the image sensor 22, which is beneficial to improving the sensitivity and accuracy of anti-shake.

[0062] Please see again Figure 6 and Figure 7 As shown, in some embodiments, the anti-shake drive mechanism 25 is disposed on the base 261 and is located in the space surrounded by the first shell 262, the first circuit structure 2421 is connected to the second circuit structure 2422 on the side of the first shell 262 facing the image sensor 22, and is wound along the first shell 262 from the side of the first shell 262 facing the image sensor 22 to the side of the first shell 262 facing away from the image sensor 22, that is, the first circuit structure 2421 is led out of the first shell 262 from the position of the first shell 262 between the lens 21 and the image sensor 22. The anti-shake bracket 26 may further include a cover 264, which is disposed on the first shell 262 and covers the anti-shake drive mechanism 25, the second circuit structure 2422 and the image sensor 22 to provide protection for the components in the anti-shake bracket 26, and a gap may be reserved between the cover 264 and the first shell 262 for the first circuit structure 2421 to be wound out.

[0063] In some embodiments, the first circuit element 24 further includes a winding portion 2424, which is connected to the first circuit structure 2421 on the side of the first shell 262 facing away from the image sensor 22, and the end of the winding portion 2424 away from the first circuit structure 2421 in the extension direction is used to be led out from the camera module 20 to be bound with other circuit structures, thereby realizing the electrical connection between the image sensor 22 and external components such as the central processing unit. In some embodiments, the winding portion 2424 is wound along the circumference of the lens 21 to the side of the lens 21 facing away from the image sensor 22, and the end is led out from the side of the lens 21 facing away from the image sensor 22. By winding the wire winding portion 2424 with the help of structural parts such as the lens barrel of the lens 21, or with the help of the outer peripheral surface of the shell 331 of the focus driving mechanism 33 used to drive the lens 21 to move axially to achieve optical focus, the space utilization efficiency of the camera module 20 can be improved, and the space occupied by the camera module 20 can be compressed. At the same time, the wire winding portion 2424 is led out to the side of the lens 21 facing away from the image sensor 22, and the first circuit element 24 does not occupy the space of the camera module 20 in the first direction 391, which is conducive to compressing the size of the camera module 20 in the first direction 391 and improving the flexibility of installing the camera module 20 in the electronic device 10. Reference Fig.11 and Fig.12 As shown, in some embodiments, the winding portion 2424 can also be wound along the side of the first shell 262 facing away from the image sensor 22 to one of the two opposite sides of the first shell 262 in the first direction 391, and the winding is performed with the help of the outer peripheral surface of the first shell 262, which is also beneficial to compressing the size of the camera module 20.

[0064] Combination Figure 6 , Fig.13 , Fig.14 and Fig.15 As shown, in some embodiments, the anti-shake driving mechanism 25 includes a first carrier 251, a second carrier 252, a first driving component 253 and a second driving component 254. The image sensor 22 is disposed on the first carrier 251, the first carrier 251 is disposed on the second carrier 252, and the second carrier 252 is disposed on the anti-shake bracket 26. The first driving component 253 is used to drive the first carrier 251 and the second carrier 252 to move relative to the optical conductive element 23 in the second direction 392, thereby driving the image sensor 22 to move relative to the optical conductive element 23 in the second direction 392. The second driving component 254 is used to drive the first carrier 251 to move relative to the second carrier 252 in the first direction 391, thereby driving the image sensor 22 to move relative to the optical conductive element 23 in the first direction 391.

[0065] In some embodiments, the first driving component 253 and the second driving component 254 both include magnetic elements and electromagnetic elements, the magnetic elements include but are not limited to magnets, etc., and the electromagnetic elements include but are not limited to coils, etc. One of the magnetic element and the electromagnetic element of the first driving component 253, and one of the magnetic element and the electromagnetic element of the second driving component 254 are fixedly disposed on the first carrier 251, and the other of the magnetic element and the electromagnetic element of the first driving component 253, and the other of the magnetic element and the electromagnetic element of the second driving component 254 are fixedly disposed on the base 261. A first groove 2511 extending along the first direction 391 is provided on the side of the first carrier 251 facing the second carrier 252, and a second groove 2521 extending along the second direction 392 is provided on the side of the second carrier 252 facing the base 261. The first carrier 251 and the second carrier 252 may also be provided with a limiting structure 255 respectively. The limiting structure 255 on one of the first carrier 251 and the second carrier 252 is embedded in the limiting structure 255 of the other, so that the first carrier 251 and the second carrier 252 can limit each other in the second direction 392. Fig.15 In the illustrated embodiment, the limiting structure 255 on the first carrier 251 may be a groove structure concavely disposed toward the second carrier 252, the limiting structure 255 on the second carrier 252 may be a protruding structure protruding toward the first carrier 251, and the limiting structure 255 on the second carrier 252 is embedded in the limiting structure 255 on the first carrier 251. The anti-shake driving mechanism 25 may further include a sliding support member 256, the sliding support member 256 includes but is not limited to a ball bearing, the sliding support member 256 is disposed on the first groove 2511 and the second groove 2521 in a one-to-one correspondence, the two opposite sides of the sliding support member 256 disposed on the first groove 2511 are respectively slidably matched with the first carrier 251 and the second carrier 252, and the two opposite sides of the sliding support member 256 disposed on the second groove 2521 are respectively slidably matched with the second carrier 252 and the base 261.

[0066] It can be understood that the magnetic force generated by the magnetic element and the electromagnetic element of the first driving component 253 cooperates to drive the first carrier 251 to drive the image sensor 22 to move relative to the optical conductive element 23 in the second direction 392, and due to the setting of the limiting structure 255, the first carrier 251 and the second carrier 252 are mutually limited in the second direction 392, so when the first driving component 253 drives the first carrier 251 to move relative to the optical conductive element 23 in the second direction 392, the second carrier 252 will move along the second direction 392 synchronously with the first carrier 251, so as to slide relative to the base 261 under the setting of the sliding support 256 and the second groove 2521. The magnetic force generated by the magnetic element and the electromagnetic element of the second driving component 254 can drive the first carrier 251 to drive the image sensor 22 to move relative to the second carrier 252 in the first direction 391, and the first carrier 251 slides relative to the second carrier 252 under the setting of the sliding support 256 and the first groove 2511. The anti-shake driving mechanism 25 has a close fit between its components and a compact structure, which can effectively reduce the size of the camera module 20 and improve the sensitivity, accuracy and reliability of the optical anti-shake. Of course, a plurality of first grooves 2511 and second grooves 2521 can be provided to improve the relative sliding stability of the first carrier 251, the second carrier 252 and the base 261. Fig.15 In the illustrated embodiment, two first grooves 2511 are provided and distributed at two corners of the first carrier 251 , and three second grooves 2521 are provided and distributed at two carriers of the second carrier 252 .

[0067] Furthermore, in some embodiments, the first drive assembly 253 is located between the image sensor 22 and the lens 21 , and the space between the image sensor 22 and the lens 21 is used to accommodate the first drive assembly 253 , which is beneficial to improving the space utilization efficiency of the camera module 20 , thereby further compressing the size of the camera module 20 .

[0068] See also Fig.16 , Fig.17 and Fig.18As shown, in some embodiments, when the anti-shake bracket 26 is disposed on the prism bracket 27 for accommodating the optical conductive element 23, the anti-shake bracket 26 is provided with a hollow groove 2611 opposite to the optical conductive element 23, and the hollow groove 2611 can be provided on the base 261, and the optical conductive element 23 is exposed from the hollow groove 2611. One of the magnetic element and the electromagnetic element of the first driving component 253 is disposed on the anti-shake driving mechanism 25, and the other is disposed on the optical conductive element 23 and is disposed corresponding to the hollow groove 2611. In this way, the compactness of the structure of the camera module 20 is improved, the space occupied by the base 261 and the first driving component 253 in the axial direction of the lens 21 is saved, and the arrangement of the first driving component 253 between the lens 21 and the image sensor 22 is conducive to further compressing the size of the camera module 20.

[0069] Combination Figure 4 and Fig.13 As shown, in some embodiments, the camera module 20 further includes a second circuit element 29, a filter 31 and a sensor bracket 32. The image sensor 22 is disposed on the second circuit element 29 and is electrically connected to the second circuit element 29. The connecting portion 241 is electrically connected to the second circuit element 29. The second circuit element 29 may be a printed circuit board of the image sensor 22, and is used to realize signal transmission to the second circuit element 29. The sensor bracket 32 ​​is disposed on the second circuit element 29 and is arranged around the image sensor 22. The filter 31 is located on the side of the image sensor 22 facing the optical transmission element 23 and is disposed on the sensor bracket 32. The filter 31 includes but is not limited to an infrared filter element, which is used to filter out interference light such as infrared light in the light emitted from the light emitting area 2312, so as to prevent the interference light from being emitted to the image sensor 22 and affecting the imaging quality. In some embodiments, the second circuit element 29, the filter 31, the sensor bracket 32 ​​and the image sensor 22 are integrated on the first carrier 251. During the preparation of the camera module 20, the second circuit element 29, the filter 31, the sensor bracket 32 ​​and the image sensor 22 can be integrated into an integrated structure, and then the integration is set on the first carrier 251. This is beneficial to simplify the preparation process of the camera module 20, reduce the preparation difficulty and preparation cost, and is also beneficial to improve the assembly accuracy of the image sensor 22 and other components such as the filter 31, and improve the imaging quality. At the same time, during the assembly process, the image sensor 22 and the filter 31 can be supported and protected by the sensor bracket 32 ​​and the second circuit element 29, reducing the risk of damage to the image sensor 22 and the filter 31, which is beneficial to improving the reliability of the structure.

[0070] Please see again Figure 4 and Figure 6As shown, in some embodiments, the lens 21 includes a first lens group 211 and a second lens group 212 sequentially arranged along the propagation direction of the optical path, the first lens group 211 and the second lens group 212 each include one or more lenses with optical power, the first lens group 211 and the second lens group 212 are coaxially arranged, and the light collected by the lens 21 is sequentially adjusted by the first lens group 211 and the second lens group 212 and then projected onto the optical transmission element 23. The camera module 20 also includes a focus drive mechanism 33, which includes but is not limited to a voice coil motor, etc. The focus drive mechanism 33 includes a housing 331 and a moving part 332, the moving part 332 is arranged in the housing 331, and can move relative to the housing 331 along the axial direction of the lens 21 by means of a magnetic field force. The first lens group 211 is fixedly disposed on the housing 331, and the second lens group 212 is connected to the moving portion 332. When the moving portion 332 moves relative to the housing 331, it can drive the second lens group 212 to move relative to the first lens group 211 and the optical transmission element 23 to change the focal length of the lens group and realize the optical focusing function. Therefore, the camera module 20 divides the lens 21 into two lens groups, and realizes optical focus by driving the second lens group 212 to move, which is beneficial to reducing the load of the focus drive mechanism 33, thereby helping to compress the volume of the focus drive mechanism 33 and the size of the camera module 20. At the same time, mobile focus is realized by the second lens group 212 located between the first lens group 211 and the optical transmission element 23 in the direction of light propagation. The moving stroke of the second lens group 212 and at least part of the size of the focus drive mechanism 33 can utilize the space between the first lens group 211 and the optical transmission element 23, which is beneficial to further compressing the axial stroke of the camera module 20 in the lens 21. In addition, the first lens group 211 is fixedly arranged on the housing 331 of the focus drive mechanism 33. The focus drive mechanism 33 is used to simultaneously carry the first lens group 211 and the second lens group 212, which is also beneficial to improving the structural compactness of the camera module 20 and further compressing the size of the camera module 20. In addition, the focus drive mechanism 33 drives the second lens group 212 to move, and the anti-shake drive mechanism 25 drives the image sensor 22 to move, so that the focus and anti-shake mechanisms can be separated, so that at least part of the size of the focus drive mechanism 33 and the anti-shake drive mechanism 25 in the axial direction of the lens 21 overlap, which is conducive to compressing the size of the camera module 20 in the axial direction of the lens 21, and at the same time, it can also avoid crosstalk between the focus movement and the anti-shake movement process, and improve the operating stability and reliability of the camera module 20. The independent setting of the anti-shake drive mechanism 25 and the focus drive mechanism 33 is also conducive to increasing the focus and anti-shake travel. The design of internal focus is also conducive to the second lens group 212 to form a focus to a macro object distance through a small movement, thereby improving the application range and shooting quality of the camera module 20.

[0071] In some embodiments, the number of lenses in the second lens group 212 is less than the number of lenses in the first lens group 211, and optical focus is achieved by driving the second lens group 212, which has a smaller number of lenses, a smaller volume and a smaller weight, to move, which is beneficial to further reduce the load of the focus drive mechanism 33 and compress the occupied space of the camera module 20. The number of lenses in the first lens group 211 and the second lens group 212 is not limited, and can be specifically set according to the imaging requirements of the camera module 20. For example, in some embodiments, the first lens group 211 includes a glass lens and two plastic lenses sequentially arranged along the propagation direction of the light path, and the second lens group 212 includes a plastic lens.

[0072] See also Fig.19 , Fig. 20 , Fig.21 as well as Fig. 22 As shown, in some embodiments, the camera module 20 also includes an anti-shake circuit carrier 34, a flexible support member 35 and a driving module 36. The flexible support member 35 is arranged on the anti-shake circuit carrier 34, the image sensor 22 is arranged on the flexible support member 35 and is electrically connected to the anti-shake circuit carrier 34, and the driving module 36 is used to drive the image sensor 22 to move relative to the anti-shake circuit carrier 34 in at least one of the first direction 391 and the second direction 392 to achieve optical image stabilization. Figure 19-22 Another method of driving the image sensor 22 to move to achieve optical image stabilization is provided. In the present embodiment, the anti-shake circuit carrier 34 is used to realize communication between external components such as the central processing unit and the image sensor 22. The camera module 20 can be electrically connected to the external components through a flexible circuit board directly led out from the anti-shake circuit carrier 34. Of course, the flexible circuit board in this embodiment can also be replaced by the first circuit element 24 described in any of the above embodiments. With the help of the first circuit element 24 in the space accommodating part between the lens 21 and the image sensor 22, the space utilization efficiency of the camera module 20 can be improved and the size of the camera module 20 can be compressed.

[0073] Combination Fig. 22 and Fig.23 As shown, in some embodiments, the flexible support member 35 includes a deformation portion 351 and a bearing portion 352, the deformation portion 351 is fixedly disposed on the anti-shake circuit carrier 34, the bearing portion 352 is connected to the deformation portion 351 and suspended on the anti-shake circuit carrier 34, and the image sensor 22 is carried on the bearing portion 352. When the driving module 36 drives the image sensor 22 to move relative to the optical transmission element 23, the image sensor 22 will drive the bearing portion 352 to move, thereby driving the deformation portion 351 to deform and move with the image sensor 22.

[0074] In some embodiments, the deformation part 351 includes a deformation body 3511 and a fixing structure 3512. The deformation body 3511 is arranged around the image sensor 22 along the axial direction. The fixing structure 3512 is connected to the inner side of the deformation body 3511 and fixedly connected to the anti-shake circuit carrier 34. The deformation body 3511 is located at the outer portion of the fixing structure 3512 and is spaced apart from the anti-shake circuit carrier 34. The bearing part 352 is connected to the inner side of the deformation body 3511. In this way, the deformation body 3511 can not only effectively support the image sensor 22 and improve the structural reliability of the camera module 20, but also the connection area between the deformation body 3511 and the anti-shake circuit carrier 34 is small, and can be deformed with the movement of the image sensor 22, which is conducive to the realization of the anti-shake function. At the same time, the movement of the image sensor 22 is not easy to interfere with the anti-shake circuit carrier 34.

[0075] The material of the flexible support member 35 includes, but is not limited to, any suitable material that can provide support for the image sensor 22 and has a flexible deformation function, such as titanium copper alloy and stainless steel. The integrated flexible support member 35 is provided to provide support for the image sensor 22, and the deformation body 3511 is arranged around the image sensor 22, which is also conducive to reducing the number of parts of the anti-shake mechanism, simplifying the structural setting of the anti-shake mechanism, reducing the preparation cost of the anti-shake mechanism, and effectively compressing the size of the camera module 20.

[0076] In some embodiments, the flexible support member 35 is provided with two bearing parts 352, and the two bearing parts 352 are respectively connected to two opposite parts of the deformation body 3511 in the second direction 392, and the deformation body 3511 is provided with two fixing structures 3512, and the two fixing structures 3512 are respectively connected to two opposite parts of the deformation body 3511 in the first direction 391. In this way, the connection area between the flexible support member 35 and the anti-shake circuit carrier 34 can be reduced while improving the reliability of the setting of the flexible support member 35 on the anti-shake circuit carrier 34. At the same time, the two bearing parts 352 can also effectively carry the image sensor 22, thereby improving the structural reliability of the camera module 20. In some embodiments, the camera module 20 further includes a second circuit element 29, the image sensor 22 is provided on the second circuit element 29 and is electrically connected to the second circuit element 29, and the second circuit element 29 is provided on the bearing part 352 of the flexible support member 35 and is electrically connected to the anti-shake circuit carrier 34.

[0077] In some embodiments, the camera module 20 further includes an anti-shake seat 37, which is disposed on the optical transmission element 23, and an anti-shake circuit carrier 34 is covered on the anti-shake seat 37. The second circuit element 29, the flexible support member 35 and the image sensor 22 are all located in a space surrounded by the anti-shake circuit carrier 34 and the anti-shake seat 37. The anti-shake seat 37 and the anti-shake circuit carrier 34 can provide protection for components such as the image sensor 22, the second circuit element 29 and the flexible support member 35. The driving module 36 includes a magnetic element and an electromagnetic element that are relatively arranged, one of which is disposed on the anti-shake seat 37 and the other is disposed on the second circuit element 29. The magnetic field force generated by the magnetic element and the electromagnetic element can drive the second circuit element 29 to drive the image sensor 22 to move relative to the optical transmission element 23 to achieve the optical anti-shake function. In some embodiments, the driving modules 36 may be provided in two groups, wherein one group of driving modules 36 is used to drive the image sensor 22 to move relative to the optical conductive element 23 in the first direction 391 , and the other group of driving modules 36 is used to drive the image sensor 22 to move relative to the optical conductive element 23 in the second direction 392 .

[0078] Combination Fig. 22 and Fig.24 As shown, in some embodiments, the camera module 20 further includes an elastic conductive cantilever 38, which is connected to the second circuit element 29 and the anti-shake circuit carrier 34, and is electrically connected to the second circuit element 29 and the anti-shake circuit carrier 34. The elastic conductive cantilever 38 can be deformed with the movement of the second circuit element 29 relative to the anti-shake circuit carrier 34. The elastic conductive cantilever 38 is provided to establish an electrical connection between the second circuit element 29 and the anti-shake circuit carrier 34. The elastic conductive cantilever 38 can be elastically deformed during the movement of the image sensor 22 relative to the optical conductive element 23, thereby maintaining the stability of the electrical connection between the second circuit element 29 and the anti-shake circuit carrier 34 during the movement of the image sensor 22. The material of the elastic conductive cantilever 38 includes but is not limited to silicon wire, for example, it can be a multilayer material composed of silicon material and metal material, as long as it can be elastically deformed with the movement of the second circuit element 29 and has sufficient strength so as not to be easily broken or damaged during the movement.

[0079] In this embodiment, during the assembly process of the camera module 20, the anti-shake circuit carrier 34, the second circuit element 29, the image sensor 22, the flexible support member 35 and the elastic conductive cantilever 38 can be integrated first and then installed on the anti-shake seat 37, which is also beneficial to reduce the difficulty of assembling the camera module 20, improve the assembly accuracy and avoid damage to the image sensor 22, the elastic conductive cantilever 38 and the flexible support member 35 during the assembly process.

[0080] refer to Fig.25 , Fig.25The electronic device 10 is a schematic diagram of the structure of the electronic device 10 provided in the embodiment of the present application. The electronic device 10 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509. Those skilled in the art will understand that Fig.25 The structure of the electronic device 10 shown in the figure does not constitute a limitation on the electronic device 10, and the electronic device 10 may include more or less components than those shown in the figure, or combine certain components, or arrange the components differently.

[0081] The radio frequency circuit 501 can be used to send and receive information, or receive and send signals during a call. In particular, after receiving the downlink information of the base station, it is handed over to one or more processors 508 for processing; in addition, the data related to the uplink is sent to the base station. Usually, the radio frequency circuit 501 includes but is not limited to an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc. In addition, the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to the global system for mobile communications (GSM), the general packet radio service (GPRS), the code division multiple access (CDMA), the wideband code division multiple access (WCDMA), the long term evolution (LTE), email, the short message service (SMS), etc.

[0082] The memory 502 can be used to store applications and data. The applications stored in the memory 502 contain executable codes. The applications can be composed of various functional modules. The processor 508 executes various functional applications and data processing by running the applications stored in the memory 502. The memory 502 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the electronic device 10 (such as audio data, a phone book, etc.), etc. In addition, the memory 502 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the memory 502 can also include a memory controller to provide the processor 508 and the input unit 503 with access to the memory 502.

[0083] The input unit 503 can be used to receive input digital, character information or user feature information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, in a specific embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch display screen or a touch pad, can collect user touch operations on or near it (such as operations performed by users using fingers, styluses, or any other suitable objects or accessories on or near the touch-sensitive surface), and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 508, and can receive and execute commands sent by the processor 508.

[0084] The display unit 504 can be used to display information input by the user or information provided to the user and various graphical user interfaces of the electronic device 10, which can be composed of graphics, text, icons, videos and any combination thereof. The display unit 504 may include a display panel. Optionally, the display panel can be configured in the form of a liquid crystal display (LCD), an organic light-emitting diode (OLED), or the like. Furthermore, the touch-sensitive surface may cover the display panel, and when the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of touch event, and then the processor 508 provides a corresponding visual output on the display panel according to the type of touch event. Although in Fig.25 In the embodiment, the touch-sensitive surface and the display panel are used as two independent components to realize input and output functions, but in some embodiments, the touch-sensitive surface and the display panel can be integrated to realize input and output functions.

[0085] The electronic device 10 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel according to the brightness of the ambient light, and the proximity sensor may turn off the display panel and / or backlight when the electronic device 10 is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors that the electronic device 10 can also be configured with, such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., they will not be repeated here.

[0086] The audio circuit 506 can provide an audio interface between the user and the electronic device 10 through a speaker and a microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit it to the speaker, and convert it into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, and then the audio data is output to the processor 508 for processing, and then sent to another electronic device 10 through the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include an earphone socket to provide communication between an external earphone and the electronic device 10.

[0087] Wireless Fidelity (WiFi) is a short-range wireless transmission technology. The electronic device 10 can help users send and receive emails, browse web pages, and access streaming media through the wireless fidelity module 507, which provides users with wireless broadband Internet access. Fig.25 The wireless fidelity module 507 is shown, but it is understandable that it is not a necessary component of the electronic device 10 and can be omitted as needed without changing the essence of the invention.

[0088] The processor 508 is the control center of the electronic device 10. It uses various interfaces and lines to connect various parts of the entire electronic device 10. By running or executing applications stored in the memory 502 and calling data stored in the memory 502, it executes various functions of the electronic device 10 and processes data, thereby monitoring the electronic device 10 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes wireless communications. It is understandable that the above-mentioned modem processor may not be integrated into the processor 508.

[0089] The electronic device 10 also includes a power supply 509 for supplying power to various components. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so that the power management system can manage charging, discharging, and power consumption. The power supply 509 can also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0090] although Fig.25 Not shown, the electronic device 10 may also include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can refer to the previous method embodiment, which will not be described in detail here.

[0091] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A camera module, characterized in that: include: Optical transmission elements; Lens; an image sensor, wherein the image sensor and the lens are disposed on the same side of the optical transmission element and at least partially overlap with the lens in the axial direction of the lens, and the optical transmission element is configured to transmit at least part of the light emitted by the lens to the image sensor; and The first circuit element includes a connecting portion and a routing portion, wherein the connecting portion is electrically connected to the image sensor and fixed relative to the image sensor, and the routing portion is electrically connected to the connecting portion and is at least partially located between the lens and the image sensor.

2. The camera module according to claim 1, characterized in that: The camera module also includes an anti-shake driving mechanism and an anti-shake bracket. The anti-shake bracket is relatively fixed to the optical transmission element. The image sensor is arranged on the anti-shake driving mechanism. The anti-shake driving mechanism is arranged on the anti-shake bracket and can drive the image sensor to move relative to the optical transmission element to achieve optical image stabilization.

3. The camera module according to claim 2, characterized in that: The connecting portion is fixedly arranged on the anti-shake driving mechanism, at least the wiring portion in the first circuit element is made of a flexible material, and at least a part of the wiring portion can be deformed as the anti-shake driving mechanism moves relative to the anti-shake bracket.

4. The camera module according to claim 3, characterized in that: The wiring portion includes a first circuit structure and a second circuit structure connected to each other, the first circuit structure is fixedly arranged on the anti-shake bracket and located between the lens and the image sensor, and two ends of the second circuit structure are respectively connected to the first circuit structure and the connecting portion.

5. The camera module according to claim 4, characterized in that: One end of the second circuit structure is connected to one of the two opposite edges of the connecting portion in a first direction, and the other end is connected to the first circuit structure between the lens and the image sensor, so that the second circuit structure has at least one corner in the extension direction, and the first direction is perpendicular to the axial direction of the lens and the vertical connection line between the lens and the image sensor.

6. The camera module according to claim 5, characterized in that: The routing portion includes two second circuit structures, and the two second circuit structures are respectively connected to two opposite edges of the connecting portion in the first direction.

7. The camera module according to claim 5, characterized in that: The anti-shake bracket includes a first shell and an isolation member, the first shell is arranged around the image sensor in a circumferential direction, the isolation member is arranged between the image sensor and the first shell, at least one end of the isolation member in the first direction is spaced from the first shell, and the isolation member is spaced from the first shell in the second direction, the second circuit structure passes between the end of the isolation member and the first shell, and the part of the second circuit structure with a corner is located between the first shell and the isolation member in the second direction, and the second direction is parallel to the vertical connection line between the lens and the image sensor, and perpendicular to the first direction.

8. The camera module according to claim 4, characterized in that: The camera module also includes a reinforcement structure, which is sleeved on the corner of the second circuit structure.

9. The camera module according to claim 4, characterized in that: The second circuit structure and the connecting portion are both made of flexible materials, and the rigidity of the second circuit structure is smaller than that of the connecting portion.

10. The camera module according to claim 4, characterized in that: The anti-shake bracket includes a base and a first shell, the base is arranged on the optical transmission element, the anti-shake driving mechanism is arranged on the base, the first shell is connected to the base and is arranged circumferentially around the image sensor, the first circuit structure is connected to the second circuit structure on a side of the first shell facing the image sensor, and goes around from the side of the first shell facing the image sensor along the first shell to the side of the first shell facing away from the image sensor.

11. The camera module according to claim 10, characterized in that: The first circuit element also includes a winding portion, which is connected to the first circuit structure on a side of the first shell facing away from the image sensor, and one end of the winding portion away from the first circuit structure in an extension direction is led out from the camera module.

12. The camera module according to claim 11, characterized in that: The winding portion is wound along the circumference of the lens to a side of the lens facing away from the image sensor, and an end portion is led out from the side of the lens facing away from the image sensor.

13. The camera module according to claim 11, characterized in that: The winding portion is led out along a side of the first shell facing away from the image sensor to one of two opposite sides of the first shell in a first direction, wherein the first direction is perpendicular to the axial direction of the lens and a vertical line connecting the lens and the image sensor.

14. The camera module according to claim 2, characterized in that: The anti-shake driving mechanism includes a first carrier, a second carrier, a first driving component and a second driving component. The image sensor is arranged on the first carrier, the first carrier is arranged on the second carrier, and the second carrier is arranged on the anti-shake bracket. The first driving component is used to drive the first carrier and the second carrier to move in a second direction relative to the optical transmission element. The second driving component is used to drive the first carrier to move in a first direction relative to the second carrier. The second direction is parallel to a vertical line between the lens and the image sensor, and the first direction is perpendicular to the axial direction of the lens and the second direction.

15. The camera module according to claim 14, characterized in that: The first driving component is located between the image sensor and the lens.

16. The camera module according to claim 14, characterized in that: The anti-shake bracket is provided with a hollow groove opposite to the optical transmission element. The first driving component includes a magnetic element and an electromagnetic element. One of the magnetic element and the electromagnetic element is arranged on the first carrier or the second carrier, and the other is arranged on the optical transmission element and corresponds to the hollow groove.

17. The camera module according to claim 14, characterized in that: The camera module also includes a second circuit element, a filter and a sensor bracket, the image sensor is arranged on the second circuit element, the sensor bracket is arranged on the second circuit element and around the image sensor, the filter is located on the side of the image sensor facing the optical transmission element and is arranged on the sensor bracket, and the second circuit element, the filter, the sensor bracket and the image sensor are integrated and arranged on the first carrier.

18. The camera module according to any one of claims 1 to 17, characterized in that: The lens includes a first lens group and a second lens group arranged in sequence along the propagation direction of the optical path. The camera module also includes a focus drive mechanism, which includes a shell and a moving part. The moving part can move along the axial direction of the lens relative to the shell. The first lens group is fixedly arranged on the shell, and the second lens group is connected to the moving part.

19. The camera module according to claim 18, characterized in that: The number of lenses in the second lens group is less than the number of lenses in the first lens group.

20. The camera module according to claim 1, characterized in that: The camera module also includes an anti-shake circuit carrier, a flexible support member and a driving module. The flexible support member is arranged on the anti-shake circuit carrier, the image sensor is arranged on the flexible support member and is electrically connected to the anti-shake circuit carrier, and the driving module is used to drive the image sensor to move relative to the anti-shake circuit carrier to achieve optical image stabilization.

21. The camera module according to claim 20, characterized in that: The flexible support member includes a deformation part and a bearing part, the deformation part is fixedly arranged on the anti-shake circuit carrier, the bearing part is connected to the deformation part and suspended on the anti-shake circuit carrier, and the image sensor is carried on the bearing part.

22. The camera module according to claim 21, characterized in that: The deformation part includes a deformation body and a fixed structure. The deformation body is arranged around the image sensor in a circumferential direction. The fixed structure is connected to the inner side of the deformation body and is fixedly connected to the anti-shake circuit carrier. The part of the deformation body located outside the fixed structure is spaced apart from the anti-shake circuit carrier, and the bearing part is connected to the inner side of the deformation body.

23. The camera module according to claim 22, characterized in that: The flexible support member is provided with two bearing parts, and the two bearing parts are respectively connected to two parts of the deformable body that are opposite to each other in the second direction. The deformable part is provided with two fixing structures, and the two fixing structures are respectively connected to two parts of the deformable body that are opposite to each other in the first direction. The second direction is parallel to the vertical line between the lens and the image sensor, and the first direction is perpendicular to the axial direction of the lens and the second direction.

24. The camera module according to claim 20, characterized in that: The camera module also includes a second circuit element, the image sensor is arranged on the second circuit element and is electrically connected to the second circuit element, the second circuit element is carried on the flexible support member, and is electrically connected to the anti-shake circuit carrier.

25. The camera module according to claim 24, characterized in that: The camera module also includes an elastic conductive cantilever, which is connected to the second circuit element and the anti-shake circuit carrier. The elastic conductive cantilever is electrically connected to the second circuit element and the anti-shake circuit carrier and can be deformed as the second circuit element moves relative to the anti-shake circuit carrier.

26. The camera module according to claim 24, characterized in that: The camera module also includes an anti-shake seat, which is arranged on the optical transmission element, and the anti-shake circuit carrier is arranged on the anti-shake seat. The driving module includes a magnetic element and an electromagnetic element arranged relatively to each other, one of the magnetic element and the electromagnetic element is arranged on the anti-shake seat, and the other is arranged on the second circuit element.

27. An electronic device, characterized in that: Comprising a camera module as described in any one of claims 1-26.

Images