Near field communication test device and system
By designing a near -field communication test device including the first coil, the second coil, and the test circuit board, the problem of the high cost and time of testing the station in the existing technology has been solved. Mode and card simulation mode test reduces labor costs and testing time.
Patent Information
- Application Number
- CN202411482093.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2025-01-24
AI Technical Summary
In the prior art, when testing the card reading mode and card simulation mode for products with near field communication functions, it is necessary to conduct it in different test stations respectively, resulting in high cost of setting up test stations, long test time and high labor costs. .
Design a near -field communication test device, which contains the first coil, the second coil and the test circuit board. The first function test circuit and the second function test circuit are located on the same test circuit board. Test of the card mode mode. The positive projection of the first coil and the second coil sets the positive projection in the set plane at least partly to ensure that two modes of testing in the same test station.
This technical solution can reduce the total time to set up the test station, thereby reducing testing time, reducing labor costs, and improving testing efficiency.
Smart Images

Figure CN119364416A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of wireless communication technology, and in particular to a near field communication test device and system. Background Art
[0002] With the development of communication technology, the application of Near Field Communication (NFC) technology is becoming more and more widespread.
[0003] NFC application modes can be classified into three modes, namely, Reader Mode: can read cards and tags, and obtain information about the tag content. Card Emulation Mode: can virtualize physical cards on electronic devices. Peer-to-Peer Mode: can exchange information between two NFC devices. In the prior art, when testing products with NFC functions, it is necessary to test the product's card reader mode and card emulation mode separately.
[0004] However, the card reading mode and the card simulation mode need to be tested separately at corresponding test stations. The cost of setting up the test station is high, and the test time is long and the labor cost is high. Summary of the invention
[0005] The present invention provides a near field communication test device and system to reduce the cost of setting up a test station, shorten the test time, and reduce the labor cost.
[0006] According to one aspect of the present invention, there is provided a near field communication test device, comprising a first coil, a second coil and a test circuit board;
[0007] The test circuit board includes a first function test circuit and a second function test circuit; wherein, when the object to be tested is tested in a first function mode, the first function test circuit is electrically connected to the first coil, and when the object to be tested is tested in a second function mode, the second function test circuit is electrically connected to at least the second coil;
[0008] The orthographic projection of the first coil in the setting plane at least partially overlaps with the orthographic projection of the second coil in the setting plane, and the setting plane is perpendicular to the thickness direction of the test circuit board.
[0009] Optionally, the center of the orthographic projection of the second coil in the set plane coincides with the center of the orthographic projection of the first coil in the set plane.
[0010] Optionally, the near field communication testing device also includes a conversion module; the conversion module is electrically connected to the first functional test circuit, the first coil, the second functional test circuit and the second coil, respectively, and the conversion module is configured to electrically connect the first functional test circuit and the two ends of the first coil when the first functional mode test is performed on the object to be tested, and is configured to connect the first coil and the second coil in series to form a series coil when the second functional mode test is performed on the object to be tested, and to electrically connect the two ends of the series coil to the second functional test circuit, respectively.
[0011] Optionally, the conversion module includes a first conversion switch and a second conversion switch;
[0012] The first conversion switch includes a first common terminal, a first selection terminal, and a second selection terminal, the first common terminal of the first conversion switch is electrically connected to the first terminal of the first coil, the first selection terminal is electrically connected to the first terminal of the first functional test circuit, and the second selection terminal is electrically connected to the first terminal of the second coil;
[0013] The second conversion switch includes a second common terminal, a third selection terminal and a fourth selection terminal, the second common terminal is electrically connected to the second end of the first coil, the third selection terminal is electrically connected to the second end of the first functional test circuit, the fourth selection terminal is electrically connected to the first end of the second functional test circuit, and the second end of the second functional test circuit is electrically connected to the second end of the second coil.
[0014] Optionally, the length of the second coil is smaller than the length of the first coil.
[0015] Optionally, the first coil and the second coil are located outside the test circuit board.
[0016] Optionally, the first function test mode is a card reading mode, and the second function test mode is a card simulation mode.
[0017] According to another aspect of the present invention, there is provided a near field communication test system, comprising the near field communication test device of any embodiment of the present invention; further comprising a control module, a test module and a test bench;
[0018] The control module is electrically connected to the test module and the test circuit board respectively, and the control module is used to control the first function test circuit to be electrically connected to the first coil according to the first function mode of the test, and control the test module to output a first test signal to the object under test through the first function test circuit and the first coil; and to control the second function test circuit to be electrically connected to at least the second coil according to the second function mode of the test, and control the test module to output a second test signal to the object under test through at least the second function test circuit and the second coil;
[0019] The test module is further used to receive a first return signal of the object under test through the first coil and the first functional test circuit, and is used to receive a second return signal of the object under test through at least the second coil and the second functional test circuit;
[0020] The test bench is used to carry the object to be tested; wherein, when the object to be tested is tested, the test bench is located on one side of the first coil and the second coil.
[0021] Optionally, the near field communication test device further includes a conversion module, and the conversion module is electrically connected to the control module;
[0022] The control module is used to control the conversion module to electrically connect the first functional test circuit and the two ends of the first coil when the first functional mode test is performed on the object to be tested, and to control the conversion module to connect the first coil and the second coil in series to form a series coil when the second functional mode test is performed on the object to be tested, and to electrically connect the two ends of the series coil to the second functional test circuit respectively.
[0023] Optionally, when the object to be tested is tested, the second coil is located on a side of the first coil away from the test bench.
[0024] The near field communication test device and system of the embodiment of the present invention, by setting the first function test circuit and the second function test circuit on the same test circuit board, can realize the connection between the first function test circuit and the second function test circuit and the external test equipment by setting up a test station. By setting that when the first function mode is tested on the object to be tested, the first function test circuit is electrically connected to the first coil, and when the second function mode is tested on the object to be tested, the second function test circuit is at least electrically connected to the second coil, and the orthographic projection of the first coil in the set plane and the orthographic projection of the second coil in the set plane at least partially overlap, so that the first function mode and the second function mode of the object to be tested can be tested at the same test station. The technical solution of the present invention can reduce the total time of setting up a test station, thereby reducing the test time and reducing the labor cost.
[0025] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0027] Figure 1is a structural schematic diagram of a near field communication test device provided by an embodiment of the present invention;
[0028] Figure 2 is a schematic diagram of the positional relationship between the first coil, the second coil and the object to be measured provided by an embodiment of the present invention;
[0029] Figure 3 It is a schematic diagram of the connection structure of another near field communication test device provided by an embodiment of the present invention when performing a first functional mode test on an object to be tested;
[0030] Figure 4 It is a schematic diagram of the connection structure of another near field communication test device provided by an embodiment of the present invention when performing a second functional mode test on an object to be tested;
[0031] Figure 5 It is a schematic diagram of the structure of a near-field general test system provided by an embodiment of the present invention. DETAILED DESCRIPTION
[0032] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.
[0033] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0034] Figure 1 is a schematic diagram of the structure of a near field communication test device provided by an embodiment of the present invention, Figure 2 : is a schematic diagram of the positional relationship between the first coil, the second coil and the object to be tested provided by an embodiment of the present invention. The near field communication test device can be used to test the object to be tested with NFC function. The object to be tested can be a wearable device, such as a watch. Figure 1 and Figure 2The near field communication test device includes a first coil 110, a second coil 120 and a test circuit board 130; the test circuit board 130 includes a first function test circuit 131 and a second function test circuit 132; wherein, when the object under test 200 is tested in a first function mode, the first function test circuit 131 is electrically connected to the first coil 110, and when the object under test 200 is tested in a second function mode, the second function test circuit 132 is at least electrically connected to the second coil 120; the orthographic projection of the first coil 110 in a set plane at least partially overlaps with the orthographic projection of the second coil 120 in the set plane, and the set plane is perpendicular to the thickness direction y of the test circuit board 130.
[0035] The test circuit board 130 may be a printed circuit board (PCB). The first function test circuit 131 and the second function test circuit 132 are integrated on the PCB. When the object under test 200 is tested in the first function mode, the first function test circuit 131 is electrically connected to the first coil 110, and when the object under test 200 is tested in the second function mode, the second function test circuit 132 is electrically connected to at least the second coil 120. Figure 1 As shown, in an optional embodiment, the first function test circuit 131 is always electrically connected to the first coil 110, and the second function test circuit 132 is always electrically connected to the second coil 120; in this case, the first function test circuit 131 and the first coil 110 can be used to test the object under test 200 in the first function mode; and the second function test circuit 132 and the second coil 120 can be used to test the object under test 200 in the second function mode. In another optional embodiment, the test circuit board 130 can be configured to include a conversion module, and when the conversion module controls the object under test 200 to be tested in the first function mode, the first function test circuit 131 and the first coil 110 are electrically connected. When the second functional mode of the object under test 200 is tested, the second functional test circuit 132 is electrically connected to the second coil 120; or when the second functional mode of the object under test 200 is tested, the second functional test circuit 132 is electrically connected to both the first coil 110 and the second coil 120, and the second functional mode of the object under test 200 is tested through the second functional test circuit 132, the first coil 110 and the second coil 120.
[0036] When the first functional mode is tested on the object under test 200, the first coil 110 can be coupled with the antenna of the object under test 200, thereby transmitting the radio frequency signal to the object under test 200 and receiving the return signal of the object under test 200. The first functional test circuit 131 can be used to process the signal when the first functional mode is tested on the object under test 200, for example, the signal to be output to the object under test 200 is processed and then output to the first coil 110, and then the radio frequency signal is output to the object under test 200 through the first coil 110; the first functional test circuit 131 can also process the return signal received by the first coil 110 from the object under test 200.
[0037] When the second functional mode of the DUT 200 is tested, the second functional test circuit 132 is electrically connected to the second coil 120. When the second functional mode of the DUT 200 is tested, the second coil 120 can be coupled with the antenna of the DUT 200, thereby transmitting the RF signal to the DUT 200 and receiving the return signal of the DUT 200. The second functional test circuit 132 can be used to process the signal when the second functional mode of the DUT 200 is tested, for example, the signal to be output to the DUT 200 is processed and then output to the second coil 120, and then the RF signal is output to the DUT 200 through the second coil 120; the second functional test circuit 132 can also process the return signal received by the second coil 120 from the DUT 200. When the second functional mode of the object under test 200 is tested, the second functional test circuit 132 is electrically connected to the first coil 110 and the second coil 120. When the second functional mode of the object under test 200 is tested, the first coil 110 and the second coil 120 can be coupled with the antenna of the object under test 200 to send and receive signals.
[0038] When the first functional mode is tested on the object under test 200, the object under test 200 is placed on one side of the first coil 110, wherein the one side of the first coil 110 is the one side of the thickness direction y of the test circuit board 130, so that the first coil 110 can form a good coupling with the antenna of the object under test 200. When the second functional mode is tested on the object under test 200, the object under test 200 is at least placed on one side of the second coil 120, wherein the one side of the second coil 120 is the one side of the thickness direction y of the test circuit board 130, so that the second coil 120 can form a good coupling with the antenna of the object under test 200.
[0039] In this embodiment, the first function test circuit 131 and the second function test circuit 132 are integrated on the same test circuit board 130, and a test station can be set up to achieve the connection between the first function test circuit 131 and the second function test circuit 132 and the external test equipment. In addition, the orthographic projection of the first coil 110 in the set plane and the orthographic projection of the second coil 120 in the set plane at least partially overlap. In this way, when the object under test 200 is in the same position, it can be ensured that the antenna of the object under test 200 is on one side of the first coil 110 and the second coil 120, and then the first function mode and the second function mode test of the object under test 200 can be achieved at the same test station.
[0040] In some optional embodiments of the present invention, the center of the orthographic projection of the second coil 120 in the set plane coincides with the center of the orthographic projection of the first coil 110 in the set plane. In this way, the second coil 120 can correspond to the center of the first coil 110 in the thickness direction y of the test circuit board 130, so that the object under test 200 can be located directly below the first coil 110 and the second coil 120 at the same time, ensuring that when the first functional mode and the second functional mode of the object under test 200 are tested, the antenna of the object under test 200 and the first coil 110 are well coupled, and the antenna of the object under test 200 and the second coil 120 are well coupled without moving the object under test 200, thereby ensuring the test accuracy.
[0041] The near field communication test device of this embodiment, by arranging the first function test circuit and the second function test circuit on the same test circuit board, can realize the connection between the first function test circuit and the second function test circuit and the external test equipment by setting up a test station. By setting that when the first function mode is tested on the object to be tested, the first function test circuit is electrically connected to the first coil, and when the second function mode is tested on the object to be tested, the second function test circuit is at least electrically connected to the second coil, and the orthographic projection of the first coil in the set plane and the orthographic projection of the second coil in the set plane at least partially overlap, so that the first function mode and the second function mode of the object to be tested can be tested at the same test station. The technical solution of the present invention can reduce the total time of setting up a test station, thereby reducing the test time and reducing the labor cost.
[0042] Figure 3 is a schematic diagram of a connection structure of another near field communication test device provided by an embodiment of the present invention when a first functional mode test is performed on an object to be tested, Figure 4 FIG. 1 is a schematic diagram of a connection structure of another near field communication test device provided by an embodiment of the present invention when performing a second functional mode test on an object to be tested, with reference to FIG. Figure 3 and Figure 4The near field communication test device also includes a conversion module 133; the conversion module 133 is electrically connected to the first function test circuit 131, the first coil 110, the second function test circuit 132 and the second coil 120 respectively, and the conversion module 133 is configured to electrically connect the first function test circuit 131 and the two ends of the first coil 110 when the first function mode test is performed on the object to be tested, and is configured to connect the first coil 110 and the second coil 120 in series to form a series coil when the second function mode test is performed on the object to be tested, and electrically connect the two ends of the series coil to the second function test circuit 132 respectively.
[0043] Among them, the conversion module 133 can be integrated on the test circuit board 130. When using the near field communication test device to test the object to be tested, the conversion module 133 can be connected to an external module with a control function (referred to as the control module), and the control module can be a single-chip microcomputer, a host computer, etc., and the embodiment of the present invention is not specifically limited here. When communicating with the object to be tested, the conversion module 133 can switch the connection relationship between the first function test circuit 131, the first coil 110, the second function test circuit 132 and the second coil 120 under the control of the control module. Among them, the control module can control the connection state of the conversion module 133 according to the different functional modes of the object to be tested. When the first functional mode is tested on the object to be tested, the conversion module 133 connects the first functional test circuit 131 to the two ends of the first coil 110, and controls the second coil 120 to be disconnected from the first functional test circuit 131, and controls the second coil 120 and the second functional test circuit 132 to not form a loop, to ensure that when the first functional mode is tested, among the first functional test circuit 131, the first coil 110, the second functional test circuit 132 and the second coil 120, only the first functional test circuit 131 is connected to the first coil 110 to form a loop, thereby realizing the test of the first functional mode of the object to be tested. When the second functional mode is tested on the object to be tested, the conversion module 133 connects the first coil 110 and the second coil 120 in series to form a series coil, and electrically connects the two ends of the series coil to the second functional test circuit 132 respectively, and controls the disconnection between the first coil 110 and the first functional test circuit 131, and controls the second coil 120 to be disconnected from the first functional test circuit 131, so as to ensure that when the second functional mode is tested, among the second functional test circuit 132, the first coil 110, the second functional test circuit 132 and the second coil 120, only the second functional test circuit 132 is connected to the series coil to form a loop, thereby realizing the test of the second functional mode of the object to be tested. Figure 3 and Figure 4As shown, a solder joint C1 is provided on the test circuit board 130, and the second end of the second coil 120 can be electrically connected to the second end of the second functional test circuit 132 through the solder joint C1. The conversion module 133 may include the solder joint C1, and the solder joint C1 may also be independent of the conversion module 133, which is not specifically limited in the embodiment of the present invention.
[0044] In this embodiment, when the object to be tested is tested in the first functional mode, the test is performed through the first coil 110; when the object to be tested is tested in the second functional mode, the test is performed through the first coil 110 and the second coil 120, so that the length of the first coil 110 can be fully utilized, and the length of the second coil 120 can be set shorter, which is conducive to further reducing costs. In some optional embodiments of the present invention, the length of the second coil 120 is less than the length of the first coil 110. In this way, it is not only conducive to reducing costs, but also more conducive to reducing the interference of the second coil 120 on the first coil 110 when the object to be tested is tested in the first functional mode.
[0045] Optionally, the first function test mode is a card reading mode, and the second function test mode is a card emulation mode. In this case, the first coil 110 is a coil corresponding to the card reading mode operating frequency of 14.3 MHz, and the total length is 21.1 m. The first coil 110 and the second coil 120 are coils corresponding to the card emulation mode operating frequency of 13.56 MHz, for example, with a total length of 22.1 m. Correspondingly, the total length of the second coil 120 is 1 m.
[0046] In some optional embodiments of the present invention, the conversion module 133 includes a first conversion switch 1331 and a second conversion switch 1332; the first conversion switch 1331 includes a first common terminal A1, a first selection terminal B1 and a second selection terminal B2, the first common terminal A1 of the first conversion switch 1331 is electrically connected to the first end of the first coil 110, the first selection terminal B1 is electrically connected to the first end of the first functional test circuit 131, and the second selection terminal B2 is electrically connected to the first end of the second coil 120;
[0047] The second conversion switch 1332 includes a second common terminal A2, a third selection terminal B3 and a fourth selection terminal B4, the second common terminal A2 is electrically connected to the second end of the first coil 110, the third selection terminal B3 is electrically connected to the second end of the first functional test circuit 131, the fourth selection terminal B4 is electrically connected to the first end of the second functional test circuit 132, and the second end of the second functional test circuit 132 is electrically connected to the second end of the second coil 120.
[0048] When the first functional mode test is performed on the object to be tested, the first common terminal A1 of the first conversion switch 1331 is electrically connected to the first selection terminal B1, and the second common terminal A2 of the second conversion switch 1332 is electrically connected to the third selection terminal B3, so that the first functional test circuit 131 can be connected to the first end of the first coil 110 through the first conversion switch 1331, and connected to the second end of the first coil 110 through the second conversion switch 1332, so that the first functional test circuit 131 forms a loop with the first coil 110. The second functional test circuit 132 will not be connected to the first coil 110, and the second functional test circuit 132 will not form a loop with the second coil 120, thereby achieving the test of the first functional mode of the object to be tested. When testing the second functional mode of the object to be tested, the first common terminal A1 of the first conversion switch 1331 is electrically connected to the second selection terminal B2, and the second common terminal A2 of the second conversion switch 1332 is electrically connected to the fourth selection terminal B4, so that the first coil 110 and the second coil 120 can be connected in series to form a series coil through the first conversion switch 1331 and the second conversion switch 1332, and the second end of the second coil 120 in the series coil is electrically connected to the second end of the second functional test circuit 132, and the first end of the first coil 110 is electrically connected to the first end of the second functional test circuit 132 through the first conversion switch 1331, so that the second functional test circuit 132 is connected to the series coil formed by the first coil 110 and the second coil 120 to form a loop, thereby realizing the test of the second functional mode of the object to be tested. Among them, the connection conversion between the first common terminal A1 of the first conversion switch 1331 and the first selection terminal B1 and the second selection terminal B2, and the connection conversion between the second common terminal A2 of the second conversion switch 1332 and the third selection terminal B3 and the fourth selection terminal B4 can be controlled by an external control module.
[0049] Based on the above embodiments, optionally, the first coil 110 and the second coil 120 are located outside the test circuit board 130 .
[0050] Specifically, since the test circuit board 130 generally includes a substrate, if the first coil 110 and the second coil 120 are disposed on the test circuit board 130, the presence of the substrate may affect the coupling between the first coil 110 and the second coil 120 and the antenna of the object under test. In this embodiment, by arranging the first coil 110 and the second coil 120 outside the test circuit board 130, when the object under test is tested, the first coil 110 and the second coil 120 have a better coupling effect with the antenna of the object under test, which is conducive to ensuring the reliability and test accuracy of the test of the object under test.
[0051] The embodiment of the present invention also provides a near field communication test system. Figure 5is a schematic diagram of a near-field general test system provided by an embodiment of the present invention, with reference to Figure 1 , Figure 2 and Figure 5 The near field communication test system includes the near field communication test device 100 of any of the above embodiments of the present invention; and also includes a control module 300, a test module 400 and a test bench 500; the control module 300 is electrically connected to the test module 400 and the test circuit board 130 respectively, and the control module 300 is used to control the first function test circuit 131 and the first coil 110 to be electrically connected according to the first function mode of the test, and control the test module 400 to output a first test signal to the object under test through the first function test circuit 131 and the first coil 110; and is used to control the second function test circuit 131 and the first coil 110 according to the second function mode of the test. The circuit 132 is at least electrically connected to the second coil 120, and controls the test module 400 to output a second test signal to the object under test at least through the second functional test circuit 132 and the second coil 120; the test module 400 is also used to receive a first return signal of the object under test through the first coil 110 and the first functional test circuit 131, and to receive a second return signal of the object under test at least through the second coil 120 and the second functional test circuit 132; the test bench 500 is used to carry the object under test; wherein, when the object under test is tested, the test bench 500 is located on one side of the first coil 110 and the second coil 120.
[0052] refer to Figure 1 , Figure 2 and Figure 5 When testing the object to be tested, the object to be tested can be placed on the test bench 500, wherein the test bench 500 can also be electrically connected to the control module 300. When it is necessary to test the object to be tested, the control module 300 can control the slide rail of the test bench 500 to move out, so that the test bench 500 can be located below the near field communication test device, specifically below the first coil 110 and the second coil 120. Accordingly, when the object to be tested is placed on the test bench 500, the object to be tested will also be located below the first coil 110 and the second coil 120, ensuring that the first coil 110 and the second coil 120 can be well coupled with the antenna of the object to be tested.
[0053] Wherein, the control module 300 can be a single chip microcomputer or a host computer, etc., and the host computer can be a computer. After placing the object to be tested, the control module 300 can control the signal output by the test module 400 according to the test mode of the object to be tested, and control the connection relationship between the first function test circuit 131, the first coil 110, the second function test circuit 132 and the second coil 120. When the object to be tested is tested in the first functional mode, the control module 300 controls the first function test circuit 131 and the first coil 110 to be electrically connected, and controls the test module 400 to output the first test signal to the object to be tested through the first function test circuit 131 and the first coil 110. When the object to be tested is tested in the first functional mode, the control module 300 controls the second function test circuit 132 to be at least electrically connected to the second coil 120, and controls the test module 400 to output the second test signal to the object to be tested at least through the second function test circuit 132 and the second coil 120. In addition, the test module 400 is also used to determine a first test result of the first functional mode according to the first return signal, and to feed back the first test result to the control module 300, and to determine a second test result of the second functional mode according to the second return signal, and to feed back the second test result to the control module 300. The near field communication test device may also include a display module 600, which is electrically connected to the control module 300 and can be used to display the first test result and the second test result.
[0054] Specifically, the control module 300 can control the test module 400 and give instructions to the object to be tested. The test module 400 plays the role of physical layer signal input or output of NFC communication technology. Taking the card reading mode as an example, before the test module 400 outputs the signal, it will modulate the digital information according to the signal requirements of the near field communication forum, and then up-convert it to a 13.56MHz radio frequency signal corresponding to the card reading mode, and send it to the first coil 110. After the first coil 110 is coupled with the NFC antenna of the object to be tested, the radio frequency signal is transmitted to the NFC chip of the object to be tested. Then the NFC chip of the object to be tested returns the signal, and receives the signal through the first coil 110. Then the test module 400 down-converts the radio frequency signal into a baseband signal, and then demodulates it into digital information, and then checks whether the adjustment signal quality of the object to be tested is within the specified parameters, and outputs an inspection report. Then the control module 300 reads back the inspection report. The working principles of the card simulation mode and the card reading mode are the same, but modulation and demodulation signals of different functional modes are generated according to the specified parameters.
[0055] Combination Figure 3-Figure 5On the basis of the above embodiment, optionally, the near field communication test device further includes a conversion module 133, and the conversion module 133 is electrically connected to the control module 300; the control module 300 is used to control the conversion module 133 to electrically connect the first functional test circuit 131 and the two ends of the first coil 110 when the first functional mode test is performed on the object to be tested 200, and to control the conversion module 133 to connect the first coil 110 and the second coil 120 in series to form a series coil, and to electrically connect the two ends of the series coil to the second functional test circuit 132 respectively when the second functional mode test is performed on the object to be tested 200.
[0056] The specific structure of the conversion module 133 is as follows: Figure 3 and Figure 4 As shown, the control process of the control module 300 on the conversion module 133 can refer to the above-mentioned near-field test device embodiment of the present invention, which will not be repeated here.
[0057] In some optional embodiments of the present invention, when the object to be tested is tested, the second coil 120 is located on a side of the first coil 110 away from the test bench 500 .
[0058] Specifically, since the first coil 110 is required to be used when the first functional mode and the second functional mode are tested on the object to be tested, and the second coil 120 is not required to be used when the second functional mode is tested on the object to be tested, it is arranged that when the object to be tested is tested, the second coil 120 is located on the side of the first coil 110 away from the test bench 500. This can make it possible for the second coil 120 to be further away from the object to be tested relative to the first coil 110 when the object to be tested is tested in the first functional mode, thereby further reducing the interference of the second coil 120 on the first coil 110, which is beneficial to further improve the test accuracy of the first functional mode of the object to be tested.
[0059] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.
[0060] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims
1. A near field communication test device, characterized in that: It includes a first coil, a second coil and a test circuit board; The test circuit board includes a first function test circuit and a second function test circuit; wherein, when the first function mode test is performed on the object to be tested, the first function test circuit is electrically connected to the first coil, and when the second function mode test is performed on the object to be tested, the second function test circuit is electrically connected to at least the second coil; The orthographic projection of the first coil in a setting plane at least partially overlaps with the orthographic projection of the second coil in a setting plane, and the setting plane is perpendicular to the thickness direction of the test circuit board.
2. The near field communication test device according to claim 1, characterized in that: A center of an orthographic projection of the second coil in the setting plane coincides with a center of an orthographic projection of the first coil in the setting plane.
3. The near field communication test device according to claim 1, characterized in that: Also includes conversion modules; The conversion module is electrically connected to the first functional test circuit, the first coil, the second functional test circuit and the second coil, respectively. The conversion module is configured to electrically connect the first functional test circuit and the two ends of the first coil when the first functional mode test is performed on the object to be tested, and is configured to connect the first coil and the second coil in series to form a series coil when the second functional mode test is performed on the object to be tested. The two ends of the series coil are electrically connected to the second functional test circuit, respectively.
4. The near field communication test device according to claim 3, characterized in that: The conversion module includes a first conversion switch and a second conversion switch; The first conversion switch comprises a first common terminal, a first selection terminal and a second selection terminal, the first common terminal of the first conversion switch is electrically connected to the first terminal of the first coil, the first selection terminal is electrically connected to the first terminal of the first functional test circuit, and the second selection terminal is electrically connected to the first terminal of the second coil; The second conversion switch includes a second common terminal, a third selection terminal and a fourth selection terminal, the second common terminal is electrically connected to the second end of the first coil, the third selection terminal is electrically connected to the second end of the first functional test circuit, the fourth selection terminal is electrically connected to the first end of the second functional test circuit, and the second end of the second functional test circuit is electrically connected to the second end of the second coil.
5. The near field communication test device according to claim 3, characterized in that: The length of the second coil is smaller than the length of the first coil.
6. The near field communication test device according to claim 1, characterized in that: The first coil and the second coil are located outside the test circuit board.
7. The near field communication test device according to any one of claims 1 to 6, characterized in that: The first function test mode is a card reading mode, and the second function test mode is a card simulation mode.
8. A near field communication test system, characterized in that: A near field communication test device comprising any one of claims 1 to 7; further comprising a control module, a test module and a test bench; The control module is electrically connected to the test module and the test circuit board respectively, and is used to control the first functional test circuit and the first coil to be electrically connected according to a first functional mode of the test, and to control the test module to output a first test signal to the object under test through the first functional test circuit and the first coil; and for controlling the second functional test circuit to be at least electrically connected to the second coil according to a second functional mode of the test, and controlling the test module to output a second test signal to the object under test at least through the second functional test circuit and the second coil; The test module is further used to receive a first return signal of the object under test through the first coil and the first functional test circuit, and is used to receive a second return signal of the object under test through at least the second coil and the second functional test circuit; The test bench is used to carry the object to be tested; wherein, when the object to be tested is tested, the test bench is located on one side of the first coil and the second coil.
9. The near field communication test system according to claim 8, characterized in that: The near field communication test device further comprises a conversion module, and the conversion module is electrically connected to the control module; The control module is used to control the conversion module to electrically connect the first functional test circuit and the two ends of the first coil when the first functional mode test is performed on the object under test, and to control the conversion module to connect the first coil and the second coil in series to form a series coil when the second functional mode test is performed on the object under test, and to electrically connect the two ends of the series coil to the second functional test circuit respectively.
10. The near field communication test system according to claim 9, characterized in that: When the object to be tested is tested, the second coil is located at a side of the first coil away from the test bench.