PCB edge warping processing device and method

Abstract

The invention is suitable for the technical field of PCBs, and particularly relates to a PCB edge warping processing device and method, and the PCB edge warping processing method, and the method comprises the following steps: obtaining a PCB image which comprises a front image and a side image; analyzing according to the PCB image to obtain PCB characteristic information, the PCB characteristic information being used for reflecting warping information of the PCB; analyzing according to the warping information to obtain a heating parameter, a pressure applying parameter and a cooling parameter; and controlling a warping machine to perform leveling treatment on the PCB based on the heating parameter, the pressure applying parameter and the cooling parameter.

Description

Technical Field

[0001] The present application relates to the technical field of PCB circuit boards, and in particular to a device and method for processing warping of PCB circuit boards. Background Art

[0002] PCB (Printed Circuit Board) is prone to deformation during manufacturing or use. This can easily make it impossible to install SMT electronic components, or electronic components (including integrated blocks) have poor contact with the solder joints of the printed circuit board, or some of the legs of the electronic components cannot be cut or will be cut to the substrate when cutting the legs after installation; some pads on the substrate cannot contact the solder surface during wave soldering and cannot be soldered.

[0003] The warping of PCB boards is a headache for PCB factories. Therefore, some leveling methods are used in existing technical means to restore the flatness of PCB boards. The bent and warped PCB boards are restored to a flat state by heating and mechanical roller pressure. However, there are many factors that cause warping. One aspect is that the substrate (copper clad board) used may warp, but during the processing of printed circuit boards, thermal stress, chemical factors, and improper production processes may also cause the printed circuit boards to warp. Therefore, the warping conditions of different PCB boards are not exactly the same, and the current technical means often cannot make adaptive adjustments to the leveling parameters according to the corresponding conditions. They all use a consistent leveling method. The setting of the leveling parameters has errors for PCB boards with different warping conditions, which will cause the final PCB to not be restored to an ideal flat state. In view of this, the present invention is proposed. Summary of the invention

[0004] The present invention provides a PCB circuit board warping processing device and method, which can solve the problem that the warping conditions of different PCB boards are not completely the same, and the current technical means often cannot make adaptive adjustment settings for leveling parameters according to corresponding conditions, and all adopt a consistent leveling method. The setting of the leveling parameters has errors for PCB boards with different warping conditions, which will lead to the technical problem that the final PCB cannot be restored to an ideal flat state.

[0005] In a first aspect, an embodiment of the present application provides a method for processing warping of a PCB circuit board, comprising the following steps:

[0006] Acquire a PCB circuit board image, wherein the PCB circuit board image includes a front image and a side image;

[0007] Analyze the PCB circuit board image to obtain PCB circuit board feature information, wherein the PCB circuit board feature information is used to reflect the warping information of the PCB circuit board;

[0008] Analyzing the warpage information to obtain heating parameters, pressure parameters, and cooling parameters;

[0009] Based on the heating parameter, the pressure parameter, and the cooling parameter, a leveling device is controlled to level the PCB circuit board.

[0010] The above technical solutions in the embodiments of the present application have at least the following technical effects:

[0011] The PCB circuit board warping treatment method provided by the present application can grasp the actual warping condition of the PCB circuit board by obtaining a PCB circuit board image including a front image and a side image used to reflect the PCB circuit board before the leveling treatment; then analyze the PCB circuit board image to obtain PCB circuit board feature information that can reflect the warping information of the PCB circuit board; then analyze the warping information to obtain heating parameters, pressure parameters, and cooling parameters; based on the heating parameters, pressure parameters, and cooling parameters, the leveling device is controlled to level the PCB circuit board. The method enables the leveling device to set reasonable working parameters according to the actual warping condition of the PCB circuit board, avoids the waste of resources caused by excessive leveling or insufficient leveling, and can level PCB circuit boards with various warping conditions with parameters that are more in line with themselves, which is conducive to ensuring the final leveling state of the PCB circuit board, and can meet the leveling of the warped PCB circuit board while avoiding new quality problems caused by the leveling process to the PCB circuit.

[0012] In a possible implementation manner of the first aspect, the analyzing according to the PCB circuit board image to obtain the PCB circuit board feature information includes:

[0013] Analyze the front image to obtain warping area distribution information;

[0014] Analyze the warped area distribution information to obtain area information and key side information; the area information is used to reflect the number and area of ​​the warped areas, as well as the proportion of the warped areas in the entire front image; the key side information is used to reflect the distribution of the warped areas, as well as the area proportion of the warped areas located on each side under the viewing angle of the front image;

[0015] Analyze the area information to obtain the pressure time in the pressure parameter;

[0016] Analyze the key side information to obtain heating parameters and cooling parameters of different sides;

[0017] Analyze the side image to obtain height information, where the height information is used to reflect the height difference of a single warped area;

[0018] According to the height information, the warping and distortion corresponding to the warping area are obtained;

[0019] Based on the warpage and the distortion, a pressure application intensity among the pressure application parameters is determined.

[0020] In a possible implementation manner of the first aspect, analyzing according to the area information to obtain the pressure time in the pressure parameter includes:

[0021] Determine whether a first number of warped regions in a first area interval in the area information exceeds a first preset number;

[0022] If the first number of warped areas in the first area interval in the area information exceeds the first preset number, the first total area value of all the warped areas is calculated, and the pressure application time is determined according to the first total area value and the first number.

[0023] In a possible implementation manner of the first aspect, analyzing according to the area information to obtain the pressure time in the pressure parameter further includes:

[0024] If the first number of warped areas in the area information in the first area interval does not exceed the first preset number, determining whether the second number of warped areas in the area information in the second area interval exceeds the second preset number; wherein the first area interval and the second area interval are adjacent intervals, and the minimum area reflected by the first area interval is greater than the maximum area of ​​the second area interval;

[0025] If the second number of warped areas in the area information in the second area interval exceeds the second preset number, the area average value is calculated based on the second area interval, wherein the area average value is used to reflect the middle value of the second area interval; and the pressure application time is determined based on the area average value and the second number.

[0026] In a possible implementation manner of the first aspect, analyzing according to the area information to obtain the pressure time in the pressure parameter further includes:

[0027] If the second number of the warped areas in the second area interval in the area information does not exceed the second preset number, the second total area value of all the warped areas is calculated, and the pressure application time is determined according to the second total area value.

[0028] In a possible implementation manner of the first aspect, analyzing according to the key side information to obtain heating parameters and cooling parameters of different sides includes:

[0029] Analyze the area size ratio of the warped area on each side to obtain specific gravity difference information, and perform specific gravity sorting to obtain sorting information, wherein the specific gravity difference information is used to reflect the specific gravity difference between two adjacent levels in the sorting information;

[0030] Determining step by step whether the specific gravity difference in each adjacent level exceeds the specific gravity difference of the first level;

[0031] If it does not exceed, the two adjacent levels have the same heating parameters and cooling parameters;

[0032] If it exceeds, the heating parameters and cooling parameters are confirmed according to the ratio of the specific gravity difference to the primary ratio difference.

[0033] In a possible implementation of the first aspect, controlling the warping machine to level the PCB circuit board based on the heating parameter, the pressure parameter, and the cooling parameter includes:

[0034] After a preset pressing time, a flattened image is acquired, wherein the flattened image is used to reflect an image of the PCB circuit board being flattened by the pressing parameters;

[0035] matching the flattened image with a preset image group;

[0036] Whether to adjust the leveling parameters is determined according to the matched preset images in the preset image group.

[0037] In a possible implementation manner of the first aspect, controlling the warping machine to level the PCB circuit board based on the heating parameter, the pressure parameter, and the cooling parameter further includes:

[0038] If the leveling degree reflected by the matched preset image is lower than the preset effect, the preset image is compared with the final leveling image, and a first information difference value is calculated, wherein the final leveling image is used to reflect an image of the PCB circuit board being leveled to an ideal state;

[0039] Obtaining a pressure intensity adjustment value according to the first information difference, and adjusting the pressure intensity of the pressure parameter based on the pressure intensity adjustment value;

[0040] If the leveling degree reflected by the matched preset image is higher than the preset effect, the preset image is compared with the final leveling image, and a second information difference value is calculated;

[0041] Obtaining a pressure time adjustment value according to the second information difference, and adjusting the pressure time of the pressure parameter based on the pressure time adjustment value;

[0042] If the leveling degree reflected by the matched preset image meets the preset effect, no adjustment is performed.

[0043] In a second aspect, an embodiment of the present application provides a PCB circuit board warping processing device, comprising:

[0044] An acquisition module is used to acquire a PCB circuit board image, wherein the PCB circuit board image includes a front image and a side image;

[0045] A first analysis module is used to analyze the PCB circuit board image to obtain PCB circuit board feature information, wherein the PCB circuit board feature information is used to reflect the warping information of the PCB circuit board;

[0046] A second analysis module is used to analyze the warpage information to obtain heating parameters, pressure parameters, and cooling parameters;

[0047] The control module is used to control the warping machine to level the PCB circuit board based on the heating parameter, the pressure parameter, and the cooling parameter.

[0048] In the third aspect, an embodiment of the present application provides a PCB circuit board warping processing device, including a leveling device and a control device; the leveling device is electrically connected to the control device; the control device includes a memory, a processor, and a computer program stored in the memory and executable on the processor, and when the processor executes the computer program, it implements the method described in any one of claims 1 to 8.

[0049] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method described in any one of the above-mentioned first aspects is implemented.

[0050] In a fifth aspect, an embodiment of the present application provides a computer program product. When the computer program product is run on a PCB circuit board warping processing device, the metal smelting control device executes the metal smelting control method described in any one of the first aspects above.

[0051] It can be understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 A schematic diagram of a process for processing a warped edge of a PCB circuit board provided in an embodiment of the present application;

[0053] Figure 2A schematic diagram of the implementation process of step S200 in the PCB circuit board warping processing method provided in an embodiment of the present application;

[0054] Figure 3 A schematic diagram of the implementation process of step S300 in the PCB circuit board warping processing method provided in an embodiment of the present application;

[0055] Figure 4 A schematic diagram of the implementation process of step S310 in the PCB circuit board warping processing method provided in an embodiment of the present application;

[0056] Figure 5 A schematic diagram of the implementation process of step S320 in the PCB circuit board warping processing method provided in an embodiment of the present application;

[0057] Figure 6 A schematic diagram of the implementation process of step S400 in the PCB circuit board warping processing method provided in an embodiment of the present application;

[0058] Figure 7 A schematic diagram of the implementation process after step S430 in the PCB circuit board warping processing method provided in an embodiment of the present application;

[0059] Figure 8 A schematic diagram of the structure of a PCB circuit board warping processing device provided in an embodiment of the present application;

[0060] Fig. 9 A schematic diagram of the structure of a control device for a PCB circuit board warping processing device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0061] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0062] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0063] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0064] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0065] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0066] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0067] PCB board warping is a headache for PCB factories, so some leveling methods are used in existing technical means to restore the PCB board to a flat state. By heating and mechanical roller pressure, the bent and warped PCB board is restored to a flat state. However, there are many factors that cause warping. One aspect is that the substrate (copper clad board) used may be warped, but in the process of printed circuit board processing, thermal stress, chemical factors, and improper production process can also cause printed circuit boards to warp. Therefore, the warping conditions of different PCB boards are not exactly the same, and current technical means often cannot make adaptive adjustments to the leveling parameters according to the corresponding conditions. They all use a consistent leveling method. There are errors in the setting of leveling parameters for PCB boards with different warping conditions, which will cause the final PCB to not be restored to an ideal flat state.

[0068] In order to solve the above technical problems, the embodiment of the present application provides a PCB circuit board warping processing device and method, in which the actual warping condition of the PCB circuit board can be grasped by obtaining a PCB circuit board image including a front image and a side image for reflecting the PCB circuit board before the leveling process; then the PCB circuit board image is analyzed to obtain PCB circuit board characteristic information that can reflect the warping information of the PCB circuit board; then the heating parameters, pressure parameters, and cooling parameters are analyzed according to the warping information; based on the heating parameters, pressure parameters, and cooling parameters, the leveling device is controlled to level the PCB circuit board. The method enables the leveling device to set reasonable working parameters according to the actual warping condition of the PCB circuit board, avoids the waste of resources caused by excessive leveling or insufficient leveling, and can level PCB circuit boards with various warping conditions with parameters that are more in line with themselves, which is conducive to ensuring the final leveling state of the PCB circuit board, and can meet the leveling of the warped PCB circuit board while avoiding new quality problems caused by the leveling process to the PCB circuit.

[0069] The PCB circuit board warping processing method provided in the embodiment of the present application can be applied to a PCB circuit board warping processing device. At this time, the PCB circuit board warping processing device is the executor of the PCB circuit board warping processing method provided in the embodiment of the present application. The embodiment of the present application does not impose any restrictions on the specific type of the PCB circuit board warping processing device.

[0070] For example, the PCB circuit board warping processing equipment may include a leveling device, a control device, and a storage device. The leveling device and the storage device are electrically connected to the control device. The leveling device is used to level the PCB circuit board with warping and transfer the leveled device to the storage device. The leveling device can be a warping machine, a roller leveling machine, or a hot press leveling machine, but is not limited to this. The storage device is arranged at the rear end of the leveling device, and is used to store the finished product neatly and safely after the leveling is completed, so as to avoid secondary warping of the PCB circuit board. The control device monitors and controls the entire leveling process and the storage process.

[0071] For example, the control device can be a mobile phone, a tablet computer, a wearable device, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), a desktop computer, a smart screen, a smart TV, a handheld device with wireless communication function, a computing device or other processing device connected to a wireless modem, a laptop computer, a handheld communication device, a handheld computing device, a satellite wireless device, customer premise equipment (CPE) and / or other devices for communicating on a wireless system and a next-generation communication system, such as a mobile terminal in a 5G network or a mobile terminal in a future evolved public land mobile network (PLMN) network, etc.

[0072] In order to better understand the PCB circuit board warping processing method provided in the embodiment of the present application, the specific implementation process of the PCB circuit board warping processing method provided in the embodiment of the present application is exemplarily introduced below.

[0073] Figure 1 A schematic flow chart of a PCB circuit board warping processing method provided in an embodiment of the present application is shown, and the PCB circuit board warping processing method includes:

[0074] S100, acquiring a PCB circuit board image, wherein the PCB circuit board image includes a front image and a side image.

[0075] It is understood that the appearance image of the PCB circuit board can be captured by a camera or other optical equipment, or the three-dimensional data of the PCB circuit board can be obtained by using a high-precision laser sensor or an optical scanning imaging system to generate an electronic image. Optionally, the PCB circuit board can be placed in the leveling device through an adaptive carrier tool, and the PCB circuit board image needs to be obtained before the leveling device works, and can be obtained before or after the carrier tool is placed.

[0076] S200, analyzing the PCB circuit board image to obtain PCB circuit board feature information, wherein the PCB circuit board feature information is used to reflect the warping information of the PCB circuit board.

[0077] It can be understood that the texture and color of the PCB circuit board in the image can be identified to obtain the characteristic information of the PCB circuit board, but it is not limited to this. For example, in the image of the PCB circuit board in a normal flat state, its texture and color are relatively uniform, and once some parts are warped, the surface characteristics of these parts will change, the roughness of the squeezed part will increase, the color will deepen and the texture will be concentrated, the roughness of the opened part will decrease, the color will become lighter and the texture will be more diffused, these visual features have a certain correlation with the warping state, different warping states, different colors and textures are presented, of course, there are some other surface features, here only take color and texture as an example. First, the PCB circuit board image is pre-processed by denoising, enhancing, segmenting, etc. to highlight the characteristic information of the PCB circuit board; then the color features (such as RGB values, HSV values, etc.) and texture features (such as grayscale co-occurrence matrix, texture energy, etc.) in the image are extracted by computer vision algorithm; the extracted features are trained by machine learning or deep learning models (such as support vector machines, neural networks, etc.) to establish a relationship model between the features and the warping information of the PCB circuit board. The training process uses labeled sample data sets that contain PCB circuit board images and their corresponding warpage information labels. The trained model is used to predict new PCB circuit board images and identify their warpage information.

[0078] As an optional embodiment of this application, please refer to Figure 2 In step S200, the PCB circuit board image is analyzed to obtain the PCB circuit board feature information including:

[0079] S210, analyzing the front image to obtain warping area distribution information.

[0080] It can be understood that the front image refers to the image that can show the length and width of the PCB circuit board in the normal placement state, such as the image of a tablet placed on a table and seen from a top-down angle. Therefore, from the front image, the distribution information of the warpage area can be obtained according to the distribution of the texture and color of the circuit board.

[0081] S220, analyze the warped area distribution information to obtain area information and key side information; the area information is used to reflect the number and area of ​​the warped areas, as well as the proportion of the warped areas in the entire front image; the key side information is used to reflect the distribution of the warped areas, as well as the area size proportion of the warped areas on each side from the perspective of the front image.

[0082] It can be understood that the warping area distribution information obtained by means of the circuit board feature information can be used to analyze the warping conditions of various areas of the PCB circuit board. The areas with relatively uniform texture and color are normal areas, and the areas with changed texture and color are warping areas. Based on these differences, the front image of the PCB circuit board is framed, and the computer is used to count the framed data to obtain quantity information, and the framed part is integrated to obtain area information; based on the framed situation, it can be obtained how many warping areas there are on each side of the PCB circuit board from the perspective of the front image, thereby obtaining the area size ratio of the warping areas on each side. For example, the PCB circuit board has four side parts, and the four side parts are first divided into regions, and then the warping areas framed in the front image are seen to see how much area each side part falls into, and then the comparison is performed to obtain the area size ratio of the warping areas on each side.

[0083] S230, analyzing the side image to obtain height information, where the height information is used to reflect the height difference of a single warped area.

[0084] It can be understood that the side image refers to the side viewing angle of the front image, from which the thickness of the PCB circuit board can be obtained. If the PCB circuit board is warped, the thickness of the corresponding area will increase. Combined with the front image, the height difference of each warped area selected can be obtained, and the degree of warping of each warped area selected can be determined based on the height difference.

[0085] S300, analyzing the warpage information to obtain heating parameters, pressure parameters, and cooling parameters;

[0086] It can be understood that the physical properties of the PCB circuit board, such as internal stress and material fatigue, are different under different warping states, and the parameter requirements for the leveling process are also different. If the warping degree is more serious, the internal stress must be greater, the warping area is larger, and the leveling process will take longer. The location where a whole PCB circuit board warps is also different. During the leveling process, if the entire PCB circuit board is in the same hot pressing environment, as the warped area is gradually restored by hot pressing, if other areas are also kept hot pressing, then the area that has been restored to flatness may be damaged secondary, making the leveling process unable to achieve the desired effect. Therefore, for different areas, the temperature of hot pressing also needs to be controlled. Exemplarily, the warping information can be matched with the PCB circuit board database to obtain the corresponding leveling parameters, but this is not limited to this. PCB circuit board database refers to a database that contains the leveling parameters used for PCB circuit boards in various warping states. These data can be obtained through laboratory experiments, on-site measurements and monitoring, and past experience. After obtaining the data, the collected data will be sorted, classified and archived, useful information and rules will be extracted, and the relevant data will be saved in the database to form a PCB circuit board database.

[0087] As an optional embodiment of this application, please refer to Figure 3 In step S300, the heating parameters, pressure parameters, and cooling parameters are obtained according to the warpage information:

[0088] S310, analyzing the area information to obtain the pressure time in the pressure parameters.

[0089] Based on the area information, we can get the number and area of ​​the warped areas, as well as the proportion of the entire front image. Combining the above data, we can evaluate the condition of the warped areas of the PCB circuit board in many aspects, such as the number of warped areas, the size of each warped area, etc., and use this as the basis for setting the pressure time to ensure the overall leveling consistency of the PCB circuit board.

[0090] In one possible implementation, see Figure 4 In step S310, the pressure time in the pressure parameters is obtained by analyzing the area information, including:

[0091] S311, determining whether a first number of warped regions in a first area interval in the area information exceeds a first preset number.

[0092] It can be understood that by dividing the warping area into multiple area intervals according to the area, each area interval can be divided manually or by a learning model, etc., but is not limited to this. The learning model is trained by inputting multiple sets of training data, each set of training data in the multiple sets of training data includes the warping information of the PCB circuit board and the corresponding area interval group, the first area interval is one of the area interval groups, and the area reflected is the largest, indicating the area of ​​the first echelon. The first preset number is a preset value, which can be set manually, or by inputting the warping information of the PCB circuit board into the learning model to obtain the corresponding first preset number. The first number refers to the number of the area of ​​the warping area in the first area interval in practice.

[0093] S312a, if the first number of warped areas in the first area interval in the area information exceeds the first preset number, the first total area value of all the warped areas is calculated, and the pressure application time is determined according to the first total area value and the first number.

[0094] For example, if the first number of warped areas in the first area interval in the area information exceeds the first preset number, it means that the number of warped areas in the first area interval is large, and the first area interval reflects the area of ​​the first echelon. When the number exceeds the first preset number, it means that the PCB circuit board has a large number of large-area warping. At this time, the pressure time can be set according to the standard for processing large-area warping. The first number refers to the number of warped areas in the first area interval. In more detail, for example, if the first preset number is set to 3, and the first number is 5, the pressure time T is set according to the first standard, that is, the standard for processing large-area warping. T=5m+kS, where k is a coefficient that reflects the influence of the area on the pressure time when the first standard is used, S represents the total value of the first area, and m reflects the influence of the number of warped areas on the pressure time when the first standard is used.

[0095] With this arrangement, the warping of PCB circuit boards is managed in sections, and the leveling process is optimized in a targeted manner to avoid using the same leveling parameters for all PCB circuit boards and a one-size-fits-all treatment. The accuracy and efficiency of leveling are improved. At the same time, the number of warping areas in the first area interval can be grasped, and a more appropriate treatment standard can be selected for PCB circuit boards exceeding the first preset number.

[0096] S312b, if the first number of warped areas in the area information in the first area interval does not exceed the first preset number, determine whether the second number of warped areas in the second area interval in the area information exceeds the second preset number; wherein the first area interval and the second area interval are adjacent intervals, and the minimum area reflected by the first area interval is greater than the maximum area of ​​the second area interval.

[0097] It can be understood that the second area interval is also a group of area intervals, and the area reflected by the second area interval is smaller than the first area interval. The second preset number is a preset value, which can be set manually or by inputting the PCB circuit board warpage information into the learning model to obtain the corresponding second preset number. The second number refers to the number of the area of ​​the actual warpage area in the second area interval.

[0098] S313a, if the second number of warped areas in the second area interval in the area information exceeds the second preset number, the area average value is calculated according to the second area interval, wherein the area average value is used to reflect the middle value of the second area interval; and the pressure application time is determined according to the area average value and the second number.

[0099] Generally, the second preset number is set larger than the first preset number, because the area reflected by the second area interval is smaller than the first area interval. This setting can better reflect that the warping area is mainly in the second area interval when the second number exceeds the second preset number. It can be understood that under the premise that the first number of warping areas in the first area interval in the area information does not exceed the first preset number, it indicates that the number of warping areas in the first area interval is not large, and there are few large-area warping areas. At this time, the second area interval is the main part, and the pressure time is set according to the standard for processing small-area warping. Exemplary, for example, the second preset number is set to 4 and the second number is 6. At this time, the pressure time T is set according to the second standard, that is, the standard for processing small-area warping. The second area interval is (a, b), and the area average s is (a+b) / 2. In this case, the pressure time T=6n+hs, where h is a coefficient that reflects the influence of the area average on the pressure time when the second standard is used, s represents the area average, and n reflects the influence of the number of warping areas on the pressure time when the second standard is used.

[0100] In this way, when the second number exceeds the second preset number, it means that the warping area is basically in the second area interval, and the warping degree of the warping area is relatively uniform. By setting the middle value of the second area interval as the area average, the overall characteristics can be better reflected, the data analysis process is simplified, the management complexity is reduced, and the decision-making speed is accelerated. At the same time, the basic requirements for warping area control are maintained to ensure the overall efficiency and product quality of the leveling operation.

[0101] S313b: If the second number of the warped areas in the second area interval in the area information does not exceed the second preset number, the second total area value of all the warped areas is calculated, and the pressure application time is determined according to the second total area value.

[0102] It can be understood that, under the premise that the first number of warped areas in the first area interval in the area information does not exceed the first preset number, the second number of warped areas in the second area interval in the area information does not exceed the second preset number, which can indicate that the number of warped areas in both intervals is not large, and there is no situation where one area is dominant, and the pressure time T is set according to the third standard. Exemplarily, the first number is 2, the second number is 2, and the pressure time T=jS, where j is a coefficient reflecting the influence of the total area value on the pressure time when the third standard is used for processing, and S represents the second total area value.

[0103] With such a setting, when the number of warping areas in the previous specific area intervals (the first area interval and the second area interval) has not reached the preset number, it can be shown that the warping situation is relatively optimistic and there is not a large amount of warping. At this time, there is no need to consider the specific interval separately. The third standard is adopted and the pressure application time is directly obtained based on the total area value to ensure that the warping areas in the two intervals are taken into account, so that the leveling operation is relatively balanced.

[0104] It should be noted that k, h, and j represent coefficients under three standards respectively. First, a large amount of actual leveling operation data is collected, including actual leveling time records under different warping information conditions. The above model is fitted according to the collected data using statistical methods to calculate the optimal values ​​of coefficients k, h, and j, so that the sum of squares of the error between the model prediction value and the actual leveling time is minimized. In this way, it can be used to predict the crushing time according to the new warping information. The learning model is trained through multiple sets of training data, and each set of training data in the multiple sets of training data includes: warping information and leveling time.

[0105] In one possible implementation, see Figure 5 In step S320, the heating parameters and cooling parameters of different sides are obtained by analyzing the key side information, including:

[0106] S321, analyzing the area size ratio of the warped regions on each side to obtain weight difference information, and performing weight sorting to obtain sorting information, wherein the weight difference information is used to reflect the weight difference between two adjacent levels in the sorting information.

[0107] It can be understood that according to the above exemplary content, the PCB circuit board has four sides. First, the four sides are divided into regions, and then the area of ​​each side is determined by looking at how much area the warped area selected in the front image falls into, and then the area size ratio of the warped area in each side is obtained by comparison. For example, the four sides are the front, back, left, and right sides, which are represented by C1, C2, C3, and C4. The warped areas corresponding to each side are S1, S2, S3, and S4. It is assumed that the area values ​​S1=1, S2=2, S3=4, and S4=1.4; at this time, the weight order is: C1, C4, C2, and C3; the weight difference between each level is: the weight difference between the first and second levels J1=S4-S1=0.4, the weight difference between the second and third levels J2=S2-S4=0.6, and the weight difference between the third and fourth levels J3=S3-S2=2. According to the sorting information and the specific gravity difference information, it is not difficult to figure out which side is the focus side, and to set the corresponding heating parameters and cooling parameters according to the corresponding emphasis. As the sorting is backward, the heating parameters and cooling parameters gradually increase. It should be noted that the heating parameters and cooling parameters are not a fixed value, but can also be an interval, or a degree of change in a range interval, etc. For example, on the side that is sorted backward, the area size of the warped area has a larger proportion, requiring a more complex heating and cooling process. For example, a higher heating temperature is required when applying pressure. During the heating process, the highest temperature is not set directly, but gradually rises to the highest temperature within a certain period of time; after the leveling is completed, a lower cooling temperature is required for shaping. During the cooling process, the lowest temperature is not set directly, but the temperature is slowly lowered. After lowering to the lowest temperature, it is maintained for a certain period of time and then gradually restored to normal temperature.

[0108] S322, determining step by step whether the difference in specific gravity between adjacent levels exceeds the difference of the first level.

[0109] It can be understood that the first-level difference reflects a threshold value, and the value can be set manually or through a learning model, but is not limited thereto. For example, the first-level difference is set to 0.5, and combined with the above-mentioned sorting information and weight difference information, it can be concluded that: J1 does not exceed the first-level difference, J2 exceeds the first-level difference, and J3 exceeds the first-level difference.

[0110] S323: If it does not exceed, the two adjacent levels have the same heating parameters and cooling parameters.

[0111] It can be understood that, combined with the judgment result of the previous step, it can be obtained that C1 and C4 have the same heating parameters and cooling parameters. For example, the heating parameters and cooling parameters of C1 are R and L respectively; then the heating parameters and cooling parameters of C4 are also R and L respectively.

[0112] S324, if exceeded, confirm the heating parameters and cooling parameters according to the ratio of the specific gravity difference to the first-order ratio difference.

[0113] It can be understood that, combined with the judgment results of the previous step, it can be obtained that: C4 and C2 have different heating parameters and cooling parameters; C2 and C3 have different heating parameters and cooling parameters. For example, according to the above results: the heating parameters and cooling parameters of C1 and C4 are R and L respectively, then the heating parameters and cooling parameters of C2 are 6 / 5R and 6 / 5L respectively; the heating parameters and cooling parameters of C3 are 4R and 4L respectively.

[0114] In a possible implementation, in step S330, the warping and distortion of the corresponding warping area are obtained according to the height information.

[0115] It is understood that the height difference of the PCB circuit board in the warping area can reflect the state of the warping. For example, the warping degree can be the ratio of the height difference of the warping area to the thickness of the PCB circuit board, that is, Q = (H max -H min ) / h*100%, where Q represents the warpage, H max -H min The distortion reflects the degree of rotational deviation of the PCB along a fixed axis (such as the long side or short side). The distortion can be obtained by calculating the actual area of ​​the triangle formed by the three non-collinear points on the PCB board after warping and the theoretical area in the ideal non-warping state. 实 -S 理 ) / S 理 *100%, where N represents the degree of distortion, S represents 实 Indicates the actual area, S 理 Represents the theoretical area.

[0116] S340: Determine the pressure intensity in the pressure parameters based on the warpage and the distortion.

[0117] It can be understood that the greater the warpage, the greater the pressure required, and the greater the distortion, the greater the pressure. Exemplarily, the pressure F is F=dQ+eN, where d and e are coefficients that reflect the effects of the warpage Q and distortion N on the pressure, respectively. Similarly, d and e can be calculated through the learning model.

[0118] S400, controlling a leveling device to level the PCB circuit board based on heating parameters, pressure parameters, and cooling parameters.

[0119] It can be understood that after obtaining the heating parameters, pressure parameters, and cooling parameters, the leveling device can be controlled to level the PCB. By setting reasonable parameters for leveling, the PCB can be flattened under the most suitable pressure to avoid poor leveling effect. Based on these parameters, in order to ensure the final leveling effect, parameter adjustment is required if necessary.

[0120] As an optional embodiment of this application, please refer to Figure 6 In step S400, controlling the leveling device to level the PCB circuit board based on the heating parameters, the pressure parameters, and the cooling parameters includes:

[0121] S410, acquiring a leveling image after a preset pressing time, wherein the leveling image is used to reflect an image when the PCB circuit board is leveled by applying pressure parameters.

[0122] It can be understood that the preset pressing time is a preset value, which can be set manually or obtained using a learning model, but is not limited thereto. The preset pressing time is less than the pressing time, and it represents a certain time point in the leveling process, and the leveling image represents an image of the PCB circuit board obtained at the time point of the preset pressing time.

[0123] S420: Match the flattened image with a preset image group.

[0124] It can be understood that the preset image group includes multiple preset images, which respectively reflect the various different flattening states that the PCB circuit board will appear when the preset pressing time is set, including the preset image of the PCB circuit board not reaching the expected flattening state after the preset time, the preset image of the PCB circuit board just reaching the expected flattening state after the preset time, and the preset image of the PCB circuit board exceeding the expected flattening state after the preset time. The preset image can be obtained in the leveling database, or computer-aided design software and simulation technology can be used to create three-dimensional models with different flattening degrees based on the physical properties of the PCB circuit board, and the corresponding image can be generated by rendering. This method can generate expected flattening images without an actual leveling process, but is not limited to this. The leveling database refers to a database containing preset images corresponding to PCB circuit boards in all warping states in different time periods. These data can be obtained through laboratory experiments, on-site measurements and monitoring, and previous experience. After obtaining, the collected data is sorted, classified and archived, useful information and rules are extracted, and the relevant data is saved in the database to form a leveling database.

[0125] S430: Determine whether to adjust the leveling parameters according to the preset images in the matched preset image group.

[0126] It can be understood that the similarity between the actual state of the current leveling process and the preset state can be determined through image matching technology (such as template matching, deep learning feature matching, etc.), so as to evaluate the leveling effect. This instant feedback mechanism can dynamically adapt to changes in PCB circuit board characteristics, reduce unqualified products, and improve overall production quality and efficiency.

[0127] In one possible implementation, see Figure 7 In step S430, judging whether to adjust the leveling parameters according to the preset images in the matched preset image group includes:

[0128] S440a, if the leveling degree reflected by the matched preset image is lower than the preset effect, the preset image is compared with the final leveling image, and a first information difference is calculated, wherein the final leveling image is used to reflect an image of the PCB circuit board being leveled to an ideal state.

[0129] It can be understood that each preset image corresponds to a flatness level, and the flatness level can be represented by the distribution range of the flatness. For example, a flatness index (Z) can be defined, ranging from 0 to 100, where 0 represents a state of no flatness at all (the original state of warping), and 100 represents full compliance with the preset flatness requirements. The larger the value, the flatter the flatness. The rules between the flatness and the value after leveling can be set according to actual needs. Assuming that after calculating and analyzing the preset image, a preset image with a Z value of 60-70 is obtained, it means that the flatness level of the PCB circuit board is 60-70. The above examples are provided for the convenience of understanding the scheme, and the actual range setting may be different. For example, each preset image can be classified into three sets according to the flatness level. These three different sets respectively represent that the flatness level is lower than the preset effect, the flatness level is equal to the preset effect, and the flatness level is higher than the preset effect. Through the set where the matched preset image is located, the difference between the flatness level reflected by the matched preset image and the preset effect can be obtained. Through image processing technology, the difference between the preset image and the final leveled image is calculated, and this difference can be quantified as a "first information difference". This difference reflects the specific gap between the current leveling state and the ideal leveling state that needs to be achieved in the end, and is the basis for subsequent adjustment of the pressure. Exemplarily, quantification can be performed by pixel difference measurement, such as by calculating the mean absolute difference (MAD), the sum of absolute differences (SAD), the mean square error (MSE), etc. For example, if MSE is used as a metric, the difference can be defined as the absolute value of the MSE values ​​of the two images or the normalized ratio, etc., but is not limited to this.

[0130] S450a, obtaining a pressure intensity adjustment value according to the first information difference, and adjusting the pressure intensity of the pressure parameter based on the pressure intensity adjustment value.

[0131] It can be understood that when the leveling degree reflected by the matched preset image is lower than the preset effect, if the current pressure is continued to be used within the preset pressure time, the leveling effect and efficiency will not meet expectations. By obtaining the pressure adjustment value, excessive processing time caused by insufficient force can be avoided within the expected leveling time, thereby improving overall production efficiency and reducing energy consumption. Exemplarily, the pressure adjustment value ΔF = u(xy) + w, where (xy) represents the first information difference value after calculating and quantifying the difference between the preset image and the final leveled image, and u and w are parameters, reflecting the influence of the first information difference value on the pressure. It should be noted that the determination of ΔF can be done by collecting a large number of samples through historical data or experimental results, recording appropriate pressure adjustment values ​​under different conditions, and fitting the most appropriate u and w values ​​using statistical methods or computer learning algorithms, so that the pressure adjustment value ΔF can be accurately obtained.

[0132] S440b: If the leveling degree reflected by the matched preset image is higher than the preset effect, the preset image is compared with the final leveling image, and a second information difference value is calculated.

[0133] It can be understood that the second information difference value can reflect the specific difference between the current leveling state and the ideal state.

[0134] S450b, obtaining a pressure time adjustment value according to the second information difference, and adjusting the pressure time of the pressure parameter based on the pressure time adjustment value;

[0135] It is understandable that when the leveling effect reflected by the matched preset image exceeds the preset effect, the final leveling effect will be advanced when the current pressure is used to continue the leveling operation, resulting in excessive leveling when the leveling is continued until the end of the time, causing secondary damage to the PCB circuit board and wasting energy. By adjusting the pressure time, the leveling process can be ended in time to improve production efficiency.

[0136] S440c: If the leveling degree reflected by the matched preset image meets the preset effect, no adjustment is performed.

[0137] It can be understood that if the leveling degree reflected by the matched preset image meets the preset effect, it can be shown that the corresponding parameters are preset appropriately. In this case, the leveling operation can be performed according to the set parameters without making any adjustments.

[0138] With respect to the PCB circuit board warping processing method described in the above embodiment, the embodiment of the present application further provides a PCB circuit board warping processing device, and each module of the device can implement each step of the PCB circuit board warping processing method. Figure 8A structural block diagram of a PCB circuit board warping processing device provided in an embodiment of the present application is shown. For ease of explanation, only the parts related to the embodiment of the present application are shown.

[0139] Reference Figure 8 The PCB circuit board warping processing device comprises:

[0140] The acquisition module is used to acquire a PCB circuit board image, wherein the PCB circuit board image includes a front image and a side image.

[0141] The first analysis module is used to analyze the PCB circuit board image to obtain PCB circuit board feature information, wherein the PCB circuit board feature information is used to reflect the warping information of the PCB circuit board.

[0142] The second analysis module is used to analyze the warpage information to obtain heating parameters, pressure parameters, and cooling parameters.

[0143] The control module is used to control the warping machine to level the PCB circuit board based on heating parameters, pressure parameters, and cooling parameters.

[0144] It should be noted that the information interaction, execution process and other contents between the above-mentioned modules are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0145] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above modules is used as an example for illustration. In actual applications, the above functions can be assigned to different modules as needed, that is, the internal structure of the device can be divided into different modules to complete all or part of the functions described above. The modules in the embodiment can be integrated into a processing unit, or each module can exist physically separately, or two or more modules can be integrated into one unit. The above integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the modules in the above device can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0146] The embodiment of the present application also provides a PCB circuit board warping processing device, including a leveling device and a control device; the leveling device is electrically connected to the control device. Fig. 9 A schematic diagram of the structure of a PCB circuit board warping processing device provided in an embodiment of the present application.

[0147] Exemplarily, the computer program 52 may be divided into one or more modules / units, one or more modules / units are stored in the memory 51, and are executed by the processor 50 to complete the present application. One or more modules / units may be a series of computer program instruction segments capable of completing specific functions, and the instruction segments are used to describe the execution process of the computer program 52 in the control device 5.

[0148] The control device 5 can be a computing device such as a desktop computer, a notebook, a PDA, or a cloud server. The PCB circuit board warping processing device can include, but is not limited to, a processor 50 and a memory 51. Those skilled in the art can understand that Fig. 9 It is only an example of the control device 5 and does not constitute a limitation on the control device 5. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, it may also include input and output devices, network access devices, buses, etc.

[0149] The processor 50 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0150] In some embodiments, the memory 51 may be an internal storage unit of the control device 5, such as a hard disk or memory of the control device 5. In other embodiments, the memory 51 may also be an external storage device of the control device 5, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the control device 5. Further, the memory 51 may also include both an internal storage unit of the control device 5 and an external storage device. The memory 51 is used to store an operating system, an application program, a boot loader (BootLoader), data, and other programs, such as program codes of computer programs. The memory 51 may also be used to temporarily store data that has been output or is to be output.

[0151] An embodiment of the present application further provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0152] An embodiment of the present application provides a computer program product. When the computer program product runs on a PCB circuit board warping processing device, the PCB circuit board warping processing device implements the steps in any of the above-mentioned method embodiments.

[0153] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the process in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium. When the computer program is executed by the processor, the steps of the above-mentioned various method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may at least include: any entity or device capable of carrying the computer program code to the PCB circuit board warping processing device, a recording medium, a computer memory, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), an electric carrier signal, a telecommunication signal and a software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals and telecommunication signals.

[0154] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0155] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0156] In the embodiments provided in the present application, it should be understood that the disclosed PCB circuit board warping processing device / equipment and method can be implemented in other ways. For example, the PCB circuit board warping processing device / equipment embodiment described above is only schematic. For example, the division of modules is only a logical function division. There may be other division methods in actual implementation. For example, multiple modules can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or modules, which can be electrical, mechanical or other forms.

[0157] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0158] It should be understood that the above specific embodiments of the present invention are only used to illustrate or explain the principles of the present invention, and do not constitute a limitation of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. In addition, the appended claims of the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the appended claims, or the equivalent forms of such scope and boundaries.

Claims

1. A method for processing warped edges of a PCB circuit board, characterized in that: The following steps are involved: Acquire a PCB circuit board image, wherein the PCB circuit board image includes a front image and a side image; Analyzing the PCB circuit board image to obtain PCB circuit board feature information, wherein the PCB circuit board feature information is used to reflect the warping information of the PCB circuit board; Analyzing the warpage information to obtain heating parameters, pressure parameters, and cooling parameters; Based on the heating parameter, the pressure parameter, and the cooling parameter, a leveling device is controlled to level the PCB circuit board.

2. A PCB circuit board warping treatment method according to claim 1, characterized in that: The obtaining of PCB circuit board feature information by analyzing the PCB circuit board image includes: Analyze the front image to obtain warping area distribution information; Analyze the warped area distribution information to obtain area information and key side information; the area information is used to reflect the number and area of ​​the warped areas, as well as the proportion of the warped areas in the entire front image; the key side information is used to reflect the distribution of the warped areas, as well as the area proportion of the warped areas located on each side under the viewing angle of the front image; Analyze the side image to obtain height information, where the height information is used to reflect the height difference of a single warped area; The analyzing according to the warping information to obtain the heating parameter, the pressure parameter, and the cooling parameter includes: analyzing according to the area information to obtain the pressure time in the pressure parameter; Analyze the key side information to obtain heating parameters and cooling parameters of different sides; According to the height information, the warping and distortion corresponding to the warping area are obtained; Based on the warpage and the distortion, a pressure application intensity among the pressure application parameters is determined.

3. A PCB circuit board warping treatment method according to claim 2, characterized in that: The pressure time in the pressure parameter obtained by analyzing the area information includes: Determine whether a first number of warped regions in a first area interval in the area information exceeds a first preset number; If the first number of warped areas in the first area interval in the area information exceeds the first preset number, the first total area value of all the warped areas is calculated, and the pressure application time is determined according to the first total area value and the first number.

4. A PCB circuit board warping treatment method according to claim 3, characterized in that: The pressure time in the pressure parameter obtained by analyzing the area information further includes: If the first number of warped areas in the area information in the first area interval does not exceed the first preset number, determining whether the second number of warped areas in the area information in the second area interval exceeds the second preset number; wherein the first area interval and the second area interval are adjacent intervals, and the minimum area reflected by the first area interval is greater than the maximum area of ​​the second area interval; If the second number of warped areas in the area information in the second area interval exceeds the second preset number, the area average value is calculated based on the second area interval, wherein the area average value is used to reflect the middle value of the second area interval; and the pressure application time is determined based on the area average value and the second number.

5. A method for processing warped edges of a PCB circuit board according to claim 4, characterized in that: The pressure time in the pressure parameter obtained by analyzing the area information further includes: If the second number of the warped areas in the second area interval in the area information does not exceed the second preset number, the second total area value of all the warped areas is calculated, and the pressure application time is determined according to the second total area value.

6. A method for processing warped edges of a PCB circuit board according to claim 2, characterized in that: The heating parameters and cooling parameters of different sides obtained by analyzing the key side information include: Analyze the area size ratio of the warped area on each side to obtain specific gravity difference information, and perform specific gravity sorting to obtain sorting information, wherein the specific gravity difference information is used to reflect the specific gravity difference between two adjacent levels in the sorting information; Determining step by step whether the specific gravity difference in each adjacent level exceeds the specific gravity difference of the first level; If not exceeded, the two adjacent levels have the same heating parameters and cooling parameters; If it exceeds, the heating parameters and cooling parameters are confirmed according to the ratio of the specific gravity difference to the primary ratio difference.

7. A method for processing warped edges of a PCB circuit board according to claim 1, characterized in that: The controlling the warping machine to perform a flattening process on the PCB circuit board based on the heating parameter, the pressure parameter, and the cooling parameter includes: After a preset pressing time, a flattened image is acquired, wherein the flattened image is used to reflect an image of the PCB circuit board being flattened by the pressing parameters; matching the flattened image with a preset image group; Whether to adjust the leveling parameters is determined according to the matched preset images in the preset image group.

8. A method for processing warped edges of a PCB circuit board according to claim 7, characterized in that: The controlling the warping machine to perform a flattening process on the PCB circuit board based on the heating parameter, the pressure parameter, and the cooling parameter also includes: If the leveling degree reflected by the matched preset image is lower than the preset effect, the preset image is compared with the final leveling image, and a first information difference value is calculated, wherein the final leveling image is used to reflect an image of the PCB circuit board being leveled to an ideal state; Obtaining a pressure intensity adjustment value according to the first information difference, and adjusting the pressure intensity of the pressure parameter based on the pressure intensity adjustment value; If the leveling degree reflected by the matched preset image is higher than the preset effect, the preset image is compared with the final leveling image, and a second information difference value is calculated; Obtaining a pressure time adjustment value according to the second information difference, and adjusting the pressure time of the pressure parameter based on the pressure time adjustment value; If the leveling degree reflected by the matched preset image meets the preset effect, no adjustment is performed.

9. A PCB circuit board warping processing device, characterized in that: include: An acquisition module is used to acquire a PCB circuit board image, wherein the PCB circuit board image includes a front image and a side image; A first analysis module is used to analyze the PCB circuit board image to obtain PCB circuit board feature information, wherein the PCB circuit board feature information is used to reflect the warping information of the PCB circuit board; A second analysis module is used to analyze the warpage information to obtain heating parameters, pressure parameters, and cooling parameters; The control module is used to control the warping machine to level the PCB circuit board based on the heating parameter, the pressure parameter, and the cooling parameter.

10. A PCB circuit board warping treatment device, characterized in that: It includes a leveling device and a control device; the leveling device is electrically connected to the control device; the control device includes a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements the method according to any one of claims 1 to 8 when executing the computer program.

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