Waste gas recovery device and chemical vapor deposition equipment

Abstract

The invention relates to a waste gas recovery device and chemical vapor deposition equipment, the waste gas recovery device comprises an ion separation mechanism and a material return pipeline, the ion separation mechanism is provided with a mechanism inner cavity, the mechanism inner cavity is provided with a gas inlet and a gas outlet which are opposite in a spaced mode, and the gas inlet is communicated with the interior of the chemical vapor deposition device; the ion separation mechanism comprises two recovery electrodes which are arranged on the two opposite sides of the mechanism inner cavity respectively, the polarities of the two recovery electrodes are opposite, the recovery electrodes are provided with through separation channels, the separation channels are communicated with the mechanism inner cavity, and the separation channels are communicated with the mechanism inner cavity. The gas inlet, the gas outlet and the two recycling electrodes are located on the different sides of the mechanism inner cavity respectively, and the material returning pipeline communicates with the two separation channels and the interior of the chemical vapor deposition device, so that plasma in waste gas can be recycled, the utilization rate of film forming raw materials is increased, and the manufacturing cost of the panel is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of chemical vapor deposition, and in particular to a waste gas recovery device and chemical vapor deposition equipment. Background Art

[0002] like Figure 1 As shown, the chemical vapor deposition equipment in the related art, when coating the surface of the panel, often needs to continuously introduce reaction gas including film-forming raw materials into the chemical vapor deposition device 300', so that the reaction gas is converted into plasma in the chemical vapor deposition device 300', so that the film-forming raw materials react and deposit uniformly on the surface of the panel to form a film layer. At the same time, it is also necessary to continuously extract the gas inside the chemical vapor deposition device 300' through the exhaust device 200', so as to timely discharge the waste gas after the reaction and provide space for new reaction gas to enter.

[0003] However, in order to ensure that the new reaction gas can smoothly enter the chemical vapor deposition device 300', the exhaust power of the exhaust device 200' is usually relatively large, which will cause a large amount of plasma formed by film-forming raw materials to be extracted by the exhaust device 200' before the deposition reaction, thereby causing a large amount of film-forming raw materials to be wasted and the manufacturing cost of the panel to be relatively high. Summary of the invention

[0004] The purpose of the present invention is to provide a waste gas recovery device and a chemical vapor deposition device, which can recover and reuse the plasma in the waste gas, improve the utilization rate of film-forming raw materials, and reduce the manufacturing cost of the panel.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] In a first aspect, a waste gas recovery device is provided for recovering waste gas extracted from the interior of a chemical vapor deposition device by a gas extraction device, the waste gas recovery device comprising:

[0007] An ion separation mechanism, wherein the ion separation mechanism has an inner cavity of the mechanism, wherein the inner cavity of the mechanism has an air inlet and an air outlet spaced opposite to each other, wherein the air inlet is connected to the interior of the chemical vapor deposition device, and the air outlet is connected to the exhaust device, wherein the ion separation mechanism comprises at least two recovery electrodes respectively arranged on two opposite sides of the inner cavity of the mechanism, wherein the polarities of the two recovery electrodes are opposite, and the recovery electrodes have a through separation channel, wherein the separation channel is connected to the inner cavity of the mechanism, wherein the air inlet, the air outlet and the two recovery electrodes are respectively located on different sides of the inner cavity of the mechanism; and,

[0008] A feed return pipe is connected to the two separation channels and the interior of the chemical vapor deposition device.

[0009] As a preferred solution of the waste gas recovery device, the separation channel has a first opening and a second opening relative to each other, the first opening is connected to the inner cavity of the mechanism, the second opening is connected to the return pipe, and the opening area of ​​the second opening is smaller than the opening area of ​​the first opening.

[0010] As a preferred solution of the waste gas recovery device, a filter screen is provided on the side of the recovery electrode facing the inner cavity of the mechanism, and the separation channel is connected to the inner cavity of the mechanism through the filter holes of the filter screen.

[0011] As a preferred solution of the waste gas recovery device, the waste gas recovery device also includes two magnetic acceleration mechanisms, which are respectively connected to the two recovery electrodes, and the magnetic acceleration mechanism includes a mechanism tube body and a magnetic part. The mechanism tube body has an acceleration channel, and the two ends of the acceleration channel are respectively connected to the separation channel and the return pipe. The magnetic part is arranged in the mechanism tube body, and the magnetic part can form a magnetic field in the acceleration channel. When the charged particles move along the extension direction of the acceleration channel, they can obtain a Lorentz force including at least an upward component along the direction of gravity.

[0012] As a preferred solution of the exhaust gas recovery device, the return pipe includes a first sub-pipe and two second sub-pipes, the two second sub-pipes are respectively connected between the two acceleration channels and the first sub-pipe, and at least part of the second sub-pipes is bent and extended along the movement direction of the charged particles ejected from the acceleration channels.

[0013] As a preferred solution of the exhaust gas recovery device, the exhaust gas recovery device further includes a first pressure sensor, a second pressure sensor and a control module, wherein the first pressure sensor is used to detect the internal air pressure of the chemical vapor deposition device, the second pressure sensor is used to detect the internal air pressure of the inner cavity of the mechanism, and the control module is communicatively connected to the first pressure sensor and the second pressure sensor;

[0014] The ion separation mechanism further includes a first valve disposed between the separation channel and the return pipe, wherein the first valve is communicatively connected to the control module;

[0015] When a first actual difference value obtained by subtracting a first actual pressure value detected by the first pressure sensor from a second actual pressure value detected by the second pressure sensor is less than or equal to a first predetermined difference, the control module controls the first valve to be closed or closed;

[0016] When a first actual difference value obtained by subtracting a first actual pressure value detected by the first pressure sensor from a second actual pressure value detected by the second pressure sensor is greater than a first predetermined difference, the control module controls the first valve to open wider;

[0017] Wherein, the first predetermined difference is greater than or equal to zero.

[0018] As a preferred solution of the waste gas recovery device, the waste gas recovery device further includes a first pressure sensor, a third pressure sensor and a control module, wherein the first pressure sensor is used to detect the internal air pressure of the chemical vapor deposition device, the third pressure sensor is used to detect the internal air pressure of the return pipe, and the control module is communicatively connected to the first pressure sensor and the third pressure sensor;

[0019] The exhaust gas recovery device further includes a second valve and a pressurizing mechanism, wherein the second valve and the pressurizing mechanism are both communicatively connected to the control module, and the second valve is disposed between the pressurizing mechanism and the return material pipeline;

[0020] When a second actual difference value obtained by subtracting a first actual pressure value detected by the first pressure sensor from a third actual pressure value detected by the third pressure sensor is less than or equal to a second predetermined difference, the control module controls the second valve to open wider and controls the pressurizing mechanism to pressurize the return pipe;

[0021] When a second actual difference value obtained by subtracting a first actual pressure value detected by the first pressure sensor from a third actual pressure value detected by the third pressure sensor is greater than a second predetermined difference value, the control module controls the second valve to close and controls the pressurizing mechanism to stop working;

[0022] Wherein, the second predetermined difference is greater than or equal to zero.

[0023] As a preferred embodiment of the waste gas recovery device, the waste gas recovery device also includes a quadrupole mechanism, which is arranged in the return pipe and close to the chemical vapor deposition device. The quadrupole mechanism includes four electrode rods arranged around the central axis of the return pipe, and a screening channel is formed between the four electrode rods, and the screening channel is used for ions with a predetermined charge-to-mass ratio to pass through.

[0024] As a preferred solution of the exhaust gas recovery device, the exhaust gas recovery device further includes a first pressure sensor and a control module, the first pressure sensor is used to detect the internal air pressure of the chemical vapor deposition device, and the control module is communicatively connected to the first pressure sensor;

[0025] The waste gas recovery device also includes a third pressure sensor, which is used to detect the internal air pressure of the return pipe. The control module is communicatively connected to the third pressure sensor. The quadrupole mechanism also includes a third valve, which is communicatively connected to the control module. The third valve is arranged between the screening channel and the interior of the chemical vapor deposition device. When a second actual difference obtained by subtracting a third actual pressure value detected by the third pressure sensor from a first actual pressure value detected by the first pressure sensor is less than or equal to a second predetermined difference, the control module controls the third valve to close. When a second actual difference obtained by subtracting a third actual pressure value detected by the third pressure sensor from a first actual pressure value detected by the first pressure sensor is greater than a second predetermined difference, the control module controls the third valve to open. The second predetermined difference is greater than or equal to zero. And / or,

[0026] The exhaust gas recovery device also includes a second pressure sensor, which is used to detect the internal air pressure of the inner cavity of the mechanism. The control module is communicatively connected to the second pressure sensor. The quadrupole mechanism also includes a fourth valve, which is communicatively connected to the control module. The fourth valve is arranged on a side of the screening channel away from the third valve. When a first actual difference obtained by subtracting a first actual pressure value detected by the first pressure sensor from a second actual pressure value detected by the second pressure sensor is less than or equal to a first predetermined difference, the control module controls the fourth valve to close. When a first actual difference obtained by subtracting a first actual pressure value detected by the first pressure sensor from a second actual pressure value detected by the second pressure sensor is greater than a first predetermined difference, the control module controls the fourth valve to open. The first predetermined difference is greater than or equal to zero.

[0027] In the second aspect, a device is provided, comprising a chemical vapor deposition device, an exhaust device and a waste gas recovery device as described in the first aspect above, wherein the air inlet and the return pipe of the waste gas recovery device are both connected to the interior of the chemical vapor deposition device, and the air outlet of the waste gas recovery device is connected to the exhaust device.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The waste gas recovery device of the present invention connects the inner cavity of the ion separation mechanism to the inside of the chemical vapor deposition device and the exhaust device, so that when the exhaust device extracts the waste gas inside the chemical vapor deposition device, the waste gas can flow through the inner cavity of the mechanism. At the same time, by arranging two recovery electrodes with opposite polarities on two opposite sides of the inner cavity of the mechanism, the recovery electrode formed as the anode can attract negatively charged particles flowing through the inner cavity of the mechanism, and accelerate the negatively charged particles to pass through the separation channel into the return pipe, and the recovery electrode formed as the cathode can attract positively charged particles flowing through the inner cavity of the mechanism, and accelerate the positively charged particles to pass through the separation channel into the return pipe, so as to recover the charged particles that have not completely reacted in the waste gas, and then the two recovery electrodes can be used to jointly separate and recover the plasma in the waste gas, and the recovered plasma can be transported to the inside of the chemical vapor deposition device again through the return pipe, and most of the useless neutral particles in the waste gas can be extracted from the inner cavity of the mechanism by the exhaust device for discharge, so as to realize the recovery and reuse of the plasma in the waste gas, improve the utilization rate of the film-forming raw materials, and reduce the manufacturing cost of the panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic structural diagram of a chemical vapor deposition device provided by the prior art.

[0031] Figure 2 Schematic diagram of the structure of a chemical vapor deposition device according to an embodiment of the present invention.

[0032] Figure 3 Schematic diagram of the structure of the ion separation mechanism according to an embodiment of the present invention.

[0033] Figure 4 It is a schematic diagram of the partial structure of the magnetic acceleration mechanism and the second sub-pipeline according to an embodiment of the present invention.

[0034] Figure 5 It is a schematic structural stereogram of a quadrupole mechanism and a local material return pipeline according to an embodiment of the present invention.

[0035] Figure 1 middle:

[0036] 200', exhaust device; 300', chemical vapor deposition device.

[0037] Figures 2 to 5 middle:

[0038] 100. Waste gas recovery device;

[0039] 1. Ion separation mechanism; 11. Inner cavity of mechanism; 111. Air inlet; 112. Air outlet; 12. Recovery electrode; 121. Separation channel; 1211. First opening; 1212. Second opening; 122. Filter; 13. First valve; 14. Fifth valve; 2. Feed return pipeline; 21. First sub-pipeline; 22. Second sub-pipeline; 31. First pressure sensor; 32. Second pressure sensor; 33. Third pressure sensor; 4. Magnetic acceleration mechanism; 41. Mechanism tube body; 410. Acceleration channel; 42. Magnetic element; 5. Second valve; 6. Pressurization mechanism; 7. Quadrupole mechanism; 71. Electrode rod; 72. Screening channel; 73. Third valve; 74. Fourth valve;

[0040] 200, air extraction device;

[0041] 300. Chemical vapor deposition equipment. DETAILED DESCRIPTION

[0042] The advantages and features of the present invention and methods for achieving them will become apparent with reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms. This embodiment is provided only to complete the disclosure of the present invention and to enable those skilled in the art to fully understand the scope of the present invention, and the present invention is limited only by the scope of the claims. The same reference numerals represent the same constituent elements throughout the specification.

[0043] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0044] like Figure 2 and Figure 3 As shown, the present invention provides a waste gas recovery device 100, which is used to recover the waste gas extracted from the inside of the chemical vapor deposition device 300 by the exhaust device 200. Specifically, the waste gas recovery device 100 includes an ion separation mechanism 1 and a return pipe 2, the ion separation mechanism 1 has a mechanism inner cavity 11, the mechanism inner cavity 11 has an air inlet 111 and an air outlet 112 spaced opposite to each other, the air inlet 111 is connected to the inside of the chemical vapor deposition device 300, and the air outlet 112 is connected to the exhaust device 200, the ion separation mechanism 1 at least includes two recovery electrodes 12 respectively arranged on two opposite sides of the mechanism inner cavity 11, the two recovery electrodes 12 have opposite polarities, the recovery electrode 12 has a through separation channel 121, and the separation channel 121 is connected to the mechanism inner cavity 11, wherein the air inlet 111, the air outlet 112 and the two recovery electrodes 12 are respectively located on different sides of the mechanism inner cavity 11, and the return pipe 2 is connected between the two separation channels 121 and the inside of the chemical vapor deposition device 300.

[0045] By connecting the inner cavity 11 of the ion separation mechanism 1 to the inside of the chemical vapor deposition device 300 and the exhaust device 200, when the exhaust device 200 extracts the exhaust gas inside the chemical vapor deposition device 300, the exhaust gas can flow through the inner cavity 11 of the mechanism. At the same time, by arranging two recovery electrodes 12 with opposite polarities on two opposite sides of the inner cavity 11 of the mechanism, the recovery electrode 12 formed as the anode can attract the negatively charged particles flowing through the inner cavity 11 of the mechanism, and accelerate the negatively charged particles to pass through the separation channel 121 and enter the return pipe 2, and the recovery electrode 12 formed as the cathode can attract the negatively charged particles flowing through the mechanism. The positively charged particles in the inner cavity 11 are accelerated to pass through the separation channel 121 into the return pipe 2 to recover the charged particles that have not completely reacted in the exhaust gas, and then the two recovery electrodes 12 can be used to jointly separate and recover the plasma in the exhaust gas, and the recovered plasma is transported to the interior of the chemical vapor deposition device 300 again through the return pipe 2, and most of the useless neutral particles in the exhaust gas can be extracted from the inner cavity 11 of the mechanism by the exhaust device 200 for discharge, so as to realize the recovery and reuse of the plasma in the exhaust gas, improve the utilization rate of the film-forming raw materials, and reduce the manufacturing cost of the panel.

[0046] In other embodiments, the ion separation mechanism 1 may further include more recovery electrodes 12 , and the multiple recovery electrodes 12 disposed on the same side of the mechanism inner cavity 11 have the same polarity.

[0047] Optionally, the separation channel 121 has a relative first opening 1211 and a second opening 1212, the first opening 1211 is connected to the mechanism cavity 11, and the second opening 1212 is connected to the return pipe 2, and the opening area of ​​the second opening 1212 is smaller than the opening area of ​​the first opening 1211, so that the recovery electrode 12 has a larger attraction range for the charged particles in the mechanism cavity 11 through the first opening 1211 with a larger opening area, which is beneficial to improving the separation and recovery rate of the charged particles in the mechanism cavity 11, and the charged particles separated into the separation channel 121 can be gathered through the second opening 1212 with a smaller opening area, so that the trajectory consistency and stability of the charged particles passing through the second opening 1212 and entering the return pipe 2 are better.

[0048] It can be understood that the first opening 1211 may be an opening including but not limited to a circle, triangle, quadrilateral, pentagon, hexagon or other shapes, and the second opening 1212 may be an opening including but not limited to a circle, triangle, quadrilateral, pentagon, hexagon or other shapes.

[0049] In order to reduce the energy loss generated when the charged particles move from the first opening 1211 to the second opening 1212, the recovery electrode 12 may be a structure that smoothly transitions from the first opening 1211 to the second opening 1212. For example, the recovery electrode 12 may be a conical tube similar to a horn.

[0050] Since there may be some large foreign particles such as deposited film fragments and component wear fragments that have fallen off the components or panels of the chemical vapor deposition device 300 inside the chemical vapor deposition device 300, in order to prevent the large foreign particles from moving with the airflow and adhering to the recovery electrode 12, thereby affecting the performance of the recovery electrode 12, optionally, a filter 122 is provided on the side of the recovery electrode 12 facing the mechanism inner cavity 11, and the separation channel 121 is connected to the mechanism inner cavity 11 through the filter holes of the filter 122, so that large foreign particles can be filtered through the filter 122 to prevent large foreign particles from contacting the recovery electrode 12.

[0051] When the exhaust device 200 is in normal use, the internal air pressure of the chemical vapor deposition device 300 will be greater than the internal air pressure of the mechanism inner cavity 11, so that the gas inside the chemical vapor deposition device 300 can flow into the interior of the mechanism inner cavity 11. When the exhaust device 200 fails, the internal air pressure of the exhaust device 200 and the mechanism inner cavity 11 may be greater than the internal air pressure of the chemical vapor deposition device 300, and then the gas in the exhaust device 200 may flow back to the mechanism inner cavity 11 and even the chemical vapor deposition device 300. Since the environmental cleanliness inside the exhaust device 200 is relatively low, the gas backflow will cause foreign matter in the exhaust device 200 to flow with the gas to the contact ion separation mechanism 1 and the chemical vapor deposition device 300. Based on this, optionally, the waste gas recovery device 100 also includes a first pressure sensor 31, a second pressure sensor 32 and a control module, the first pressure sensor 31 is used to detect the internal air pressure of the chemical vapor deposition device 300, the second pressure sensor 32 is used to detect the internal air pressure of the mechanism cavity 11, the control module is communicatively connected to the first pressure sensor 31 and the second pressure sensor 32, and the ion separation mechanism 1 also includes a first valve 13 arranged between the separation channel 121 and the return pipe 2, and the first valve 13 is communicatively connected to the control module.

[0052] When the first actual difference value obtained by subtracting the first actual pressure value detected by the first pressure sensor 31 from the second actual pressure value detected by the second pressure sensor 32 is less than or equal to the first predetermined difference value, the control module controls the first valve 13 to be closed or reduced, and when the first actual difference value obtained by subtracting the first actual pressure value detected by the first pressure sensor 31 from the second actual pressure value detected by the second pressure sensor 32 is greater than the first predetermined difference value, the control module controls the first valve 13 to be opened, wherein the first predetermined difference value is greater than or equal to zero, so that the first valve 13 can be reduced or closed before the gas backflow occurs. It can be understood that when the control module controls the first valve 13 to be closed, the gas flow rate from the separation channel 121 to the return pipe 2 can be reduced, thereby allowing more gas to stay in the mechanism cavity 11, thereby playing a certain role in raising the gas pressure in the mechanism cavity 11.

[0053] Among them, when a first actual difference obtained by subtracting a first actual pressure value detected by the first pressure sensor 31 from a second actual pressure value detected by the second pressure sensor 32 is greater than a first predetermined difference, the control module controls the first valve 13 to open to the maximum limit of the first valve 13, and then keeps the first valve 13 in the maximum open state.

[0054] When the first predetermined difference is greater than zero, the first valve 13 can be controlled by the control module to be closed or closed before the first actual difference reaches zero, so as to prevent the occurrence of gas backflow in advance.

[0055] Preferably, when the first actual difference is equal to zero, the control module controls the first valve 13 to close, so as to better prevent the gas from flowing back.

[0056] Optionally, a fifth valve 14 may be further provided between the chemical vapor deposition device 300 and the air inlet 111. The fifth valve 14 is communicatively connected to the control module. When a first actual difference obtained by subtracting a first actual pressure value detected by the first pressure sensor 31 from a second actual pressure value detected by the second pressure sensor 32 is less than or equal to a first predetermined difference, the control module controls the fifth valve 14 to be closed. When a first actual difference obtained by subtracting a first actual pressure value detected by the first pressure sensor 31 from a second actual pressure value detected by the second pressure sensor 32 is greater than the first predetermined difference, the control module controls the fifth valve 14 to be opened, thereby preventing the gas carrying foreign matter from flowing back through the inner cavity 11 of the mechanism to the interior of the chemical vapor deposition device 300.

[0057] Since the reaction gas in the chemical vapor deposition device 300 is usually filled from the top along the gravity direction G, and the exhaust gas is usually extracted from the bottom along the gravity direction G, the ion separation mechanism 1 and the exhaust device 200 can usually be located below the chemical vapor deposition equipment along the gravity direction G, and one end of the return pipe 2 is usually connected to the top of the chemical vapor deposition device 300. Therefore, the charged particles separated by the ion separation mechanism 1 need to move in the return pipe 2 toward the top along the gravity direction G and enter the interior of the chemical vapor deposition device 300 from the top of the chemical vapor deposition device 300. Based on this, in order to make the charged particles have a certain kinetic energy during the recycling process so that they can flow back along the recycling pipe 2 more quickly and smoothly, optionally, the waste gas recovery device 100 also includes two magnetic acceleration mechanisms 4, the magnetic acceleration mechanism 4 includes a mechanism tube body 41 and a magnetic member 42, the two magnetic acceleration mechanisms 4 are respectively connected to the two recovery electrodes 12, the mechanism tube body 41 has an acceleration channel 410, and the two ends of the acceleration channel 410 are respectively connected to the separation channel 121 and the recycling pipe 2, the magnetic member 42 is arranged on the mechanism tube body 41, and the magnetic member 42 can form a magnetic field in the acceleration channel 410. When the charged particles move along the extension direction of the acceleration channel 410, they can obtain a Lorentz force including at least an upward component force along the gravity direction G, wherein, Figure 2 The arrow in shows the direction of gravity G.

[0058] Exemplarily, the magnetic acceleration mechanism 4 may include two magnetic members 42 that are spaced apart and arranged opposite to each other, the magnetic poles of the two magnetic members 42 being opposite to each other, the magnetic flux lines of the magnetic field formed by the two magnetic members 42 in the acceleration channel 410 being approximately parallel, and the magnetic flux lines being approximately perpendicular to the extension direction of the acceleration channel 410 and forming an angle with the gravity direction G.

[0059] In other embodiments, the magnetic parts 42 included in the magnetic acceleration mechanism 4 may also include but are not limited to magnetic rings and magnetic blocks, and the magnetic acceleration mechanism 4 may include one or more magnetic parts 42 to form a magnetic field in the acceleration channel 410 through the magnetic parts 42, in which the magnetic flux lines are roughly perpendicular to the extension direction of the acceleration channel 410 and form an angle with the gravity direction G, so that when the charged particles move along the extension direction of the acceleration channel 410, they can obtain a Lorentz force that includes at least an upward component along the gravity direction G.

[0060] In addition, in some embodiments, the magnetic field formed by the magnetic member 42 in the acceleration channel 410 has magnetic flux lines that are approximately perpendicular to the extension direction of the acceleration channel 410 and approximately perpendicular to the gravity direction G, so that when the charged particles move along the extension direction of the acceleration channel 410, the Lorentz force obtained can be approximately upward along the gravity direction G, and the charged particles obtain more kinetic energy upward along the gravity direction G in the magnetic acceleration mechanism 4.

[0061] Optionally, the magnetic component 42 can be an electromagnet, so that the magnetic component 42 can form a strong magnetic field when powered on, which has a better acceleration effect on charged particles, and when the exhaust gas recovery device 100 stops using, the magnetic component 42 can be powered off to prevent the strong magnetic field generated by the magnetic component 42 from affecting adjacent components.

[0062] Since the charged particles are accelerated by the recovery electrode 12 and enter the acceleration channel 410 with similar speeds and moving directions, the moving trajectories of the charged particles after being accelerated by the magnetic acceleration mechanism 4 and ejected from the acceleration channel 410 are also similar.

[0063] Specifically, after being accelerated by the separation channel 121, the charged particles have at least an initial velocity moving in the horizontal direction, and when the charged particles cut the magnetic field in the acceleration channel 410 to obtain at least a Lorentz force including an upward component along the gravity direction G, the charged particles at least obtain an acceleration along the gravity direction G upward, and then, after the charged particles are ejected from the acceleration channel 410, under the influence of the resistance encountered by collisions with other particles during their movement, the motion trajectory of the charged particles is roughly a curved upward shape.

[0064] Based on this, in order to reduce the kinetic energy loss of charged particles during the recycling process and further increase the return speed of charged particles, please combine Figure 4 As shown, optionally, the return pipe 2 includes a first sub-pipe 21 and two second sub-pipes 22, the two second sub-pipes 22 are respectively connected between the two acceleration channels 410 and the first sub-pipe 21, and at least part of the second sub-pipe 22 is bent and extended along the movement direction of the charged particles ejected from the acceleration channel 410, thereby reducing the possibility of collision and friction between the charged particles and the pipe wall of the second sub-pipe 22 during the return process, thereby reducing the kinetic energy loss generated by the charged particles during the return process, wherein, Figure 4 The dashed line in the middle exemplarily shows the motion trajectory of a charged particle after being ejected from the acceleration channel 410 , and shows that at least the portion of the second sub-pipeline 22 close to the acceleration channel 410 bends and extends along the motion direction of the charged particle after being ejected from the acceleration channel 410 .

[0065] When the number of charged particles separated and recovered by the ion separation mechanism 1 is small, the gas pressure in the return pipe 2 may be low. When the gas pressure in the return pipe 2 is lower than the gas pressure inside the chemical vapor deposition device 300, the gas inside the chemical vapor deposition device 300 will flow back into the return pipe 2. On the one hand, the reaction gas in the chemical vapor deposition device 300 will overflow. On the other hand, foreign matter in the chemical vapor deposition device 300 will flow into the return pipe 2 with the reverse gas, polluting the environment inside the return pipe 2. Based on this, optionally, in addition to the aforementioned first pressure sensor 31 and control module, the waste gas recovery device 100 may also include a third pressure sensor 33, the third pressure sensor 33 is used to detect the internal gas pressure of the return pipe 2, the control module is communicatively connected to the first pressure sensor 31 and the third pressure sensor 33, and the waste gas recovery device 100 may also include a second valve 5 and a pressurizing mechanism 6, the second valve 5 and the pressurizing mechanism 6 are both communicatively connected to the control module, and the second valve 5 is arranged between the pressurizing mechanism 6 and the return pipe 2.

[0066] When a second actual difference obtained by subtracting a first actual pressure value detected by the first pressure sensor 31 from a third actual pressure value detected by the third pressure sensor 33 is less than or equal to a second predetermined difference, the control module controls the second valve 5 to open wider and controls the pressurizing mechanism 6 to pressurize the return pipe 2. When a second actual difference obtained by subtracting a first actual pressure value detected by the first pressure sensor 31 from a third actual pressure value detected by the third pressure sensor 33 is greater than a second predetermined difference, the control module controls the second valve 5 to close and controls the pressurizing mechanism 6 to stop working, wherein the second predetermined difference is greater than or equal to zero, so that before gas backflow occurs, the pressurizing mechanism 6 can pressurize the return pipe 2 to avoid further decrease in the gas pressure in the return pipe 2. When there is no need to pressurize the return pipe 2, the second valve 5 can be closed to prevent the gas and charged particles in the return pipe 2 from flowing toward the pressurizing mechanism 6.

[0067] The pressurizing mechanism 6 can pressurize the return pipe 2 by delivering clean inert gas into the return pipe 2 , while preventing the delivered gas from reacting with the charged particles in the return pipe 2 .

[0068] When the second predetermined difference is greater than zero, the control module can control the second valve 5 to open wider and control the pressurizing mechanism 6 to pressurize the return pipe 2 before the second actual difference reaches zero, so as to prevent the occurrence of gas backflow in advance.

[0069] Optionally, the waste gas recovery device 100 further includes a quadrupole mechanism 7, which is disposed in the feed return pipe 2 and is close to the chemical vapor deposition device 300. The quadrupole mechanism 7 adopts the principle of an existing quadrupole mass spectrometer. Figure 5As shown, the quadrupole mechanism 7 includes four electrode rods 71 ​​arranged around the central axis of the return pipe 2, and a screening channel 72 is formed between the four electrode rods 71. In other words, the four electrode rods 71 ​​include two groups of electrode rods 71 ​​that are spaced apart and opposite to each other. When the two groups of electrode rods 71 ​​are respectively connected to the positive and negative output voltages of the RF power supply, the screening channel 72 can only allow ions with a predetermined charge-to-mass ratio to pass through, so that the charged particles and gases in the return pipe 2 can be further screened by the quadrupole mechanism 7. On the one hand, only the charged particles that are desired to be recovered can be fed back to the chemical vapor deposition device 300 through the screening channel 72, thereby avoiding the concentration of the film-forming raw materials being diluted by other charged particles and gases. On the other hand, other charged particles and gases can be prevented from passing through the screening channel 72 and remaining in the return pipe 2, so as to keep the return pipe 2 in a state of high gas pressure, so as to avoid the gas from flowing back from the chemical vapor deposition device 300 to the return pipe 2. It should be noted that the screening channel 72 is a section of the inner space of the return pipe 2 .

[0070] It is understandable that after completing the surface coating of a panel, it is necessary to stop using the chemical vapor deposition equipment, take out the coated panel, and put in the next panel that needs to be coated. Therefore, during the period when the chemical vapor deposition equipment is stopped, the waste gas recovery device 100 will also stop using, and the non-recovery target charged particles and gases accumulated in the return pipe 2 can flow back to the exhaust device 200 through the return pipe 2, the separation channel 121 and the mechanism cavity 11 in turn.

[0071] When the gas inside the chemical vapor deposition device 300 flows back to the return pipe 2, foreign matter in the chemical vapor deposition device 300 will flow with the backflow of gas to adhere to the surface of the quadrupole mechanism 7, resulting in a decrease in the performance of the electrode rod 71 and a decrease in the screening ability of the screening channel 72. Based on this, when the exhaust gas recovery device 100 as described in the aforementioned technical solution also includes a first pressure sensor 31, a third pressure sensor 33 and a control module, optionally, the quadrupole mechanism 7 also includes a third valve 73, the third valve 73 is communicatively connected to the control module, and the third valve 73 is arranged between the screening channel 72 and the interior of the chemical vapor deposition device 300. When a second actual difference obtained by subtracting a third actual pressure value detected by the third pressure sensor 33 from a first actual pressure value detected by the first pressure sensor 31 is less than or equal to a second predetermined difference, the control module controls the third valve 73 to close; when a second actual difference obtained by subtracting a third actual pressure value detected by the third pressure sensor 33 from a first actual pressure value detected by the first pressure sensor 31 is greater than a second predetermined difference, the control module controls the third valve 73 to open, wherein the second predetermined difference is greater than or equal to zero, so that before gas backflow occurs, the third valve 73 can be controlled to close by the control module to prevent foreign matter in the chemical vapor deposition device 300 from flowing with the backflow gas to the surface of the quadrupole mechanism 7.

[0072] In addition, when the vacuum device 200 fails, the gas in the vacuum device 200 may flow back through the mechanism cavity 11 and the return pipe 2 to contact the quadrupole mechanism 7, causing foreign matter carried by the backflow gas to adhere to the quadrupole mechanism 7. Based on this, when the exhaust gas recovery device 100 as described in the aforementioned technical solution also includes a first pressure sensor 31, a second pressure sensor 32 and a control module, optionally, the quadrupole mechanism 7 also includes a fourth valve 74, the fourth valve 74 is communicatively connected to the control module, and the fourth valve 74 is arranged on the side of the screening channel 72 away from the third valve 73. When the first actual difference obtained by subtracting the first actual pressure value detected by the first pressure sensor 31 from the second actual pressure value detected by the second pressure sensor 32 is less than or equal to the first predetermined difference, the control module controls the fourth valve 74 to be closed or closed. When the first actual difference obtained by subtracting the first actual pressure value detected by the first pressure sensor 31 from the second actual pressure value detected by the second pressure sensor 32 is greater than the first predetermined difference, the control module controls the fourth valve 74 to be opened, wherein the first predetermined difference is greater than or equal to zero, so that before gas backflow occurs, the fourth valve 74 can be controlled to be closed by the control module to prevent foreign matter in the chemical vapor deposition device 300 from flowing with the backflow gas to the surface of the quadrupole mechanism 7.

[0073] like Figure 2As shown, the present invention also provides a chemical vapor deposition device, including a chemical vapor deposition device 300, a gas extraction device 200, and a waste gas recovery device 100 as described in the above technical solution, wherein the gas inlet 111 and the return pipe 2 of the waste gas recovery device 100 are both connected to the inside of the chemical vapor deposition device 300, and the gas outlet 112 of the waste gas recovery device 100 is connected to the gas extraction device 200. By using the waste gas recovery device 100 to recycle and reuse the plasma in the waste gas, the utilization rate of the film-forming raw materials can be improved, the cost of coating the panel using the chemical vapor deposition equipment can be reduced, and the manufacturing cost of the panel can be reduced.

[0074] Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments, but can be manufactured in various forms, and those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical spirit or basic features of the present invention. Therefore, it should be understood that the above embodiments are exemplary and not restrictive in all aspects.

Claims

1. A waste gas recovery device for recovering waste gas extracted from the interior of a chemical vapor deposition device by a gas extraction device, characterized in that: The exhaust gas recovery device comprises: An ion separation mechanism, wherein the ion separation mechanism has an inner cavity of the mechanism, wherein the inner cavity of the mechanism has an air inlet and an air outlet spaced opposite to each other, wherein the air inlet is connected to the interior of the chemical vapor deposition device, and the air outlet is connected to the exhaust device, wherein the ion separation mechanism comprises at least two recovery electrodes respectively arranged on two opposite sides of the inner cavity of the mechanism, wherein the polarities of the two recovery electrodes are opposite, and the recovery electrodes have a through separation channel, wherein the separation channel is connected to the inner cavity of the mechanism, wherein the air inlet, the air outlet and the two recovery electrodes are respectively located on different sides of the inner cavity of the mechanism; and, A feed return pipe is connected to the two separation channels and the interior of the chemical vapor deposition device.

2. The exhaust gas recovery device according to claim 1, characterized in that: The separation channel has a first opening and a second opening opposite to each other, the first opening is connected to the inner cavity of the mechanism, the second opening is connected to the return pipe, and the opening area of ​​the second opening is smaller than the opening area of ​​the first opening.

3. The exhaust gas recovery device according to claim 1, characterized in that: A filter screen is provided on the side of the recovery electrode facing the inner cavity of the mechanism, and the separation channel is connected with the inner cavity of the mechanism through the filter holes of the filter screen.

4. The exhaust gas recovery device according to claim 1, characterized in that: The waste gas recovery device also includes two magnetic acceleration mechanisms, which are respectively connected to the two recovery electrodes. The magnetic acceleration mechanism includes a mechanism tube body and a magnetic part. The mechanism tube body has an acceleration channel, and the two ends of the acceleration channel are respectively connected to the separation channel and the return pipe. The magnetic part is arranged in the mechanism tube body. The magnetic part can form a magnetic field in the acceleration channel. When the charged particles move along the extension direction of the acceleration channel, they can obtain a Lorentz force that includes at least an upward component force along the direction of gravity.

5. The exhaust gas recovery device according to claim 4, characterized in that: The return pipe includes a first sub-pipe and two second sub-pipes, the two second sub-pipes are respectively connected between the two acceleration channels and the first sub-pipe, and at least a portion of the second sub-pipes is bent and extended along the movement direction of the charged particles ejected from the acceleration channels.

6. The exhaust gas recovery device according to any one of claims 1 to 5, characterized in that: It also includes a first pressure sensor, a second pressure sensor and a control module, wherein the first pressure sensor is used to detect the internal air pressure of the chemical vapor deposition device, the second pressure sensor is used to detect the internal air pressure of the inner cavity of the mechanism, and the control module is communicatively connected to the first pressure sensor and the second pressure sensor; The ion separation mechanism further includes a first valve disposed between the separation channel and the return pipe, wherein the first valve is communicatively connected to the control module; When a first actual difference value obtained by subtracting a first actual pressure value detected by the first pressure sensor from a second actual pressure value detected by the second pressure sensor is less than or equal to a first predetermined difference, the control module controls the first valve to be closed or closed; When a first actual difference value obtained by subtracting a first actual pressure value detected by the first pressure sensor from a second actual pressure value detected by the second pressure sensor is greater than a first predetermined difference, the control module controls the first valve to open wider; Wherein, the first predetermined difference is greater than or equal to zero.

7. The exhaust gas recovery device according to any one of claims 1 to 5, characterized in that: It also includes a first pressure sensor, a third pressure sensor and a control module, wherein the first pressure sensor is used to detect the internal air pressure of the chemical vapor deposition device, the third pressure sensor is used to detect the internal air pressure of the return pipe, and the control module is communicatively connected to the first pressure sensor and the third pressure sensor; The exhaust gas recovery device further includes a second valve and a pressurizing mechanism, wherein the second valve and the pressurizing mechanism are both communicatively connected to the control module, and the second valve is disposed between the pressurizing mechanism and the return material pipeline; When a second actual difference value obtained by subtracting a first actual pressure value detected by the first pressure sensor from a third actual pressure value detected by the third pressure sensor is less than or equal to a second predetermined difference, the control module controls the second valve to open wider and controls the pressurizing mechanism to pressurize the return pipe; When a second actual difference value obtained by subtracting a first actual pressure value detected by the first pressure sensor from a third actual pressure value detected by the third pressure sensor is greater than a second predetermined difference value, the control module controls the second valve to close and controls the pressurizing mechanism to stop working; Wherein, the second predetermined difference is greater than or equal to zero.

8. The exhaust gas recovery device according to any one of claims 1 to 3, characterized in that: The waste gas recovery device also includes a quadrupole mechanism, which is arranged in the return pipe and close to the chemical vapor deposition device. The quadrupole mechanism includes four electrode rods arranged around the central axis of the return pipe, and a screening channel is formed between the four electrode rods. The screening channel is used for allowing ions with a predetermined charge-to-mass ratio to pass through.

9. The exhaust gas recovery device according to claim 8, characterized in that: The exhaust gas recovery device further includes a first pressure sensor and a control module, wherein the first pressure sensor is used to detect the internal air pressure of the chemical vapor deposition device, and the control module is communicatively connected to the first pressure sensor; The waste gas recovery device also includes a third pressure sensor, which is used to detect the internal air pressure of the return pipe. The control module is communicatively connected to the third pressure sensor. The quadrupole mechanism also includes a third valve, which is communicatively connected to the control module. The third valve is arranged between the screening channel and the interior of the chemical vapor deposition device. When a second actual difference obtained by subtracting a third actual pressure value detected by the third pressure sensor from a first actual pressure value detected by the first pressure sensor is less than or equal to a second predetermined difference, the control module controls the third valve to close. When a second actual difference obtained by subtracting a third actual pressure value detected by the third pressure sensor from a first actual pressure value detected by the first pressure sensor is greater than a second predetermined difference, the control module controls the third valve to open. The second predetermined difference is greater than or equal to zero. And / or, The exhaust gas recovery device also includes a second pressure sensor, which is used to detect the internal air pressure of the inner cavity of the mechanism. The control module is communicatively connected to the second pressure sensor. The quadrupole mechanism also includes a fourth valve, which is communicatively connected to the control module. The fourth valve is arranged on a side of the screening channel away from the third valve. When a first actual difference obtained by subtracting a first actual pressure value detected by the first pressure sensor from a second actual pressure value detected by the second pressure sensor is less than or equal to a first predetermined difference, the control module controls the fourth valve to close. When a first actual difference obtained by subtracting a first actual pressure value detected by the first pressure sensor from a second actual pressure value detected by the second pressure sensor is greater than a first predetermined difference, the control module controls the fourth valve to open. The first predetermined difference is greater than or equal to zero.

10. A chemical vapor deposition device, characterized in that: It comprises a chemical vapor deposition device, an exhaust device and a waste gas recovery device as described in any one of claims 1 to 9, wherein the air inlet and the return pipe of the waste gas recovery device are both connected to the interior of the chemical vapor deposition device, and the air outlet of the waste gas recovery device is connected to the exhaust device.

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