Packaging test device for integrated circuit chip processing

Abstract

The invention relates to the technical field of integrated circuit chip packaging test, and discloses a packaging test device for integrated circuit chip processing, which comprises a workbench, a support frame fixedly connected to the top of the workbench, an environment simulation assembly arranged on one side of the support frame, and a test mechanism arranged on the top of the workbench, the testing mechanism comprises a testing table fixedly connected to the top of the workbench, the inner wall of the testing table is rotationally connected with a driving threaded rod, a power source of the driving threaded rod is arranged in the workbench, the driving threaded rod is driven by the power source in the workbench to rotate, and a movable base moves above the testing table along with the driving threaded rod. During movement, the spherical table shakes in the shaking groove, the packaged chip can be tested in a shaking environment through supporting of the supporting spring, the miniature vibration machine is started, the packaged chip is driven by the vibration table to be tested in a vibration environment, and the effect of improving the reliability and stability of chip testing is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit chip packaging and testing, and in particular to a packaging and testing device for integrated circuit chip processing. Background Art

[0002] After wafer manufacturing and dicing, integrated circuit chips need to be packaged and tested to ensure their normal functions and protect the chips from damage by the external environment. The packaging and testing equipment used for integrated circuit chip processing is generally used to test the electrical performance, connection quality and other aspects of the chip after packaging, to ensure the quality and performance of the final product while improving production efficiency.

[0003] A packaging and testing device for integrated circuit chips is disclosed in the patent publication number CN116626475A, which relates to the technical field of integrated circuit chip packaging and testing. Through the cooperation between the supporting box and the first cover and the second cover, it is convenient to perform performance testing operations on the packaged integrated circuit chip under low and high temperature conditions in a sealed space, and can test the sealing effect of the packaged integrated circuit chip under both high and low temperature conditions, and can test the conductive performance of the integrated circuit chip when the temperature changes suddenly, effectively improving the convenience and efficiency of testing the integrated circuit chip at two extreme temperatures.

[0004] The prior art has the following defects:

[0005] Unable to detect the performance of packaged chips under dynamic conditions: Most existing test equipment is designed based on static conditions, mainly detecting the performance of chips under constant current, voltage, and temperature. These devices lack the ability to evaluate chips under complex dynamic conditions and cannot simulate variables in the actual working environment, such as rapid temperature changes or mechanical vibrations. Therefore, it is necessary to conduct comprehensive performance tests under dynamic conditions to discover and solve potential defects and problems in advance, so as to improve the reliability and stability of chip testing.

[0006] Energy waste during environmental simulation testing: Environmental simulation testing plays an important role in verifying the reliability and performance of packaged chips. Existing environmental simulation testing usually has only one environmental simulation chamber, which requires continuous cooling or heating during high and low temperature test cycles, resulting in a lot of energy waste. In addition, the existing environmental simulation chamber cannot apply vibration stress while simulating the environment. Therefore, by setting up two environmental simulation chambers, the test frame can shuttle between the two environmental simulation chambers, and apply vibration stress to reduce the company's operating costs and expand the simulation range.

[0007] Unable to adapt to packaged chips of different specifications: Many test equipment only have fixed fixtures and interfaces, and can only be applied to packaged chips of specific sizes and shapes. Each time you switch to packaged chips of different specifications, you need to readjust or replace the test equipment and fixtures, resulting in a waste of time. Therefore, it is necessary to set up fixtures that can clamp packaged chips of different specifications to improve test efficiency and product quality. Summary of the invention

[0008] In view of the problems in the prior art, such as the inability to detect the dynamic performance of packaged chips, energy waste during environmental simulation testing, and inability to adapt to packaged chips of different specifications, a packaging test device for integrated circuit chip processing is proposed.

[0009] The present application provides a packaging and testing device for integrated circuit chip processing, the purpose of which is to: by setting a testing mechanism that can move and vibrate freely, so as to be suitable for packaged chips of different specifications, and to detect the performance of the packaged chips under dynamic conditions, so as to improve the reliability and stability of chip testing; by setting an environmental simulation component, setting two environmental simulation chambers, allowing the test frame to shuttle between the two environmental simulation chambers, and applying vibration stress, the effect of reducing the enterprise's operating costs and expanding the simulation range is achieved.

[0010] The technical solution of the present invention is: a packaging test device for integrated circuit chip processing, comprising a workbench, a support frame fixedly connected to the top of the workbench, an environmental simulation component arranged on one side of the support frame, and a test mechanism arranged on the top of the workbench, the test mechanism comprising a test table fixedly connected to the top of the workbench, a driving threaded rod rotatably connected to the inner wall of the test table, a power source of the driving threaded rod is arranged inside the workbench, and a moving component, a test base component and a test cover plate component are arranged in sequence above the test table;

[0011] The moving assembly comprises a moving base threadedly connected to the outer wall of the driving threaded rod, the top of the moving base is fixedly connected to a fixed plate, the top of the fixed plate is fixedly connected to a spherical table, and the top of the fixed plate is fixedly connected to a plurality of supporting springs;

[0012] The test base assembly includes a test base fixedly connected to the top of multiple support springs. A shaking groove is opened at the bottom of the test base. The bottom center of the shaking groove overlaps with the top center of the spherical table. The spherical table can shake slightly in the shaking groove.

[0013] By adopting the above scheme, the threaded rod is driven to rotate by the power source inside the workbench, and the movable base moves above the test bench accordingly. The spherical table will shake in the shaking groove during movement, and the packaged chip can be tested in a shaking environment through the support of the supporting spring, thereby achieving the effect of improving the reliability and stability of chip testing.

[0014] Furthermore, the test base assembly also includes a sealing strip and a probe station fixedly connected to the top of the test base, and a plurality of slots opened on the inner wall of the test base, and a plurality of probes are evenly distributed on the surface of the probe station.

[0015] Furthermore, the test cover assembly includes a sealing cover overlapped on the top of the test seat, the inner wall of the sealing cover is provided with a sealing groove, the inner wall of the sealing groove is clamped with the outer wall of the sealing strip, and the bottom of the sealing cover is fixedly connected with a plurality of clamping blocks, and the outer walls of the plurality of clamping blocks are respectively clamped with the inner walls of the plurality of clamping grooves.

[0016] Furthermore, the test cover assembly also includes a chip base plate overlapped on the top of the probe station, the top of the chip base plate is overlapped with a packaged chip, the outer wall of the packaged chip is evenly and fixedly connected with a plurality of packaged pins, and the bottoms of the plurality of packaged pins are respectively overlapped with the tops of a plurality of probes.

[0017] Furthermore, the inner wall of the sealing cover plate is provided with a plurality of pin pressing grooves, and the inner walls of the plurality of pin pressing grooves are respectively overlapped with the tops of the plurality of packaging pins.

[0018] By adopting the above scheme, an appropriate test cover assembly is selected by selecting packaged chips of different specifications. First, the chip base plate is used to cover some of the probes on the probe station, and then the packaged chip is placed on the top of the chip base plate. At this time, the packaged pins around the packaged chip are in contact with the tops of the probes around the chip base plate. Then, the sealing cover plate is covered, and the card block at the bottom of the sealing cover plate is engaged with the card groove in the test socket, and the sealing groove in the sealing cover plate is engaged with the sealing strip on the top of the test socket. At the same time, the pin pressing groove in the middle of the sealing cover plate presses the package pins to prevent the package pins from loosening the contact with the tops of the probes. At this point, the assembly of packaged chips of different specifications is completed, thereby achieving the effect of improving test efficiency and product quality.

[0019] Furthermore, a vibration component is also provided on the top of the workbench, and the vibration component includes a plurality of vibration springs fixedly connected to the top of the workbench, the tops of the plurality of vibration springs are fixedly connected to a vibration table, and the bottom of the vibration table is fixedly connected to a symmetrically arranged micro-vibrator.

[0020] Furthermore, the inner wall of the vibration table is provided with a limiting groove, and when the movable base is moved to the two ends of the test table by driving the threaded rod, the inner wall of the limiting groove overlaps the outer wall of the spherical table.

[0021] By adopting the above scheme, through the vibration assembly, when the mobile base moves to the two ends of the test bench, it can stop moving. At this time, the spherical table contacts the limit groove inside the vibration table, and the micro-vibrator is started. The packaged chip is driven by the vibration table to be tested in a vibration environment, thereby achieving the effect of improving the reliability and stability of chip testing.

[0022] Furthermore, the environmental simulation component includes a rotating cylinder fixedly connected to the top of the support frame, and the output end of the rotating cylinder is fixedly connected to a lifting threaded rod, and the lifting threaded rod is rotatably connected to the inside of the support frame.

[0023] Furthermore, the outer wall of the lifting threaded rod is threadedly connected to a connecting rod, one end of the connecting rod is fixedly connected to an environmental chamber, the top of the environmental chamber is fixedly connected to a temperature and humidity generator, and an anti-leakage curtain is fixedly connected to the outer wall of the environmental chamber on one side away from the support frame.

[0024] The above scheme is adopted, by moving the mobile base to one end of the test bench and placing it above the vibration table, starting the rotating cylinder, and driving the lifting threaded rod to rotate in the support frame through the output end, so that the environmental chamber falls down and covers the part of the test bench driven by the connecting rod, and then starting the temperature and humidity generator, applying different temperature and humidity environments in the two environmental chambers, and moving the mobile base to both ends above the test bench to make the packaged chips be tested in different environments, and when the mobile base is moved out of or into the environmental chamber at one end, the anti-leakage curtain will be opened and closed to avoid air leakage in the environmental chamber, so as to achieve the effect of reducing the operating costs of the enterprise, and the micro-vibrator can be started in the environmental chamber to vibrate the packaged chips, and the mobile base can be used to shuttle between the two environmental chambers to make the packaged chips undergo temperature cycle testing, so as to achieve the effect of expanding the simulation range.

[0025] Beneficial effects of the present invention:

[0026] 1. Through the setting of the moving component, the power source inside the workbench drives the driving threaded rod to rotate, and the moving base moves above the test bench. The spherical table will shake in the shaking groove during movement, and the packaged chip can be tested in a shaking environment through the support of the supporting spring. Through the setting of the vibration component, when the moving base moves to both ends of the test bench, it can stop moving. At this time, the spherical table contacts the limit groove inside the vibration table, and the micro vibration machine is started. The packaged chip is driven by the vibration table to be tested in a vibration environment, thereby improving the reliability and stability of chip testing.

[0027] 2. Move the mobile base to one end of the test bench and place it above the vibration table, start the rotating cylinder, and drive the lifting threaded rod to rotate in the support frame through the output end, so that the environmental chamber falls down and covers the part of the test bench driven by the connecting rod, and then start the temperature and humidity generator, apply different temperature and humidity environments in the two environmental chambers, and move the mobile base to both ends above the test bench to test the packaged chips in different environments. When the mobile base moves out of or into the environmental chamber at one end, the anti-leakage curtain will open and close to prevent air from leaking out of the environmental chamber, thereby reducing the operating costs of the enterprise. The micro-vibrator can be started in the environmental chamber to vibrate the packaged chips, or the mobile base can be used to shuttle between the two environmental chambers to perform temperature cycle tests on the packaged chips, thereby expanding the simulation range.

[0028] 3. Select the appropriate test cover assembly by selecting packaged chips of different specifications. First, use the chip base plate to cover some of the probes on the probe station, and then place the packaged chip on the top of the chip base plate. At this time, the packaged pins around the packaged chip are in contact with the top of the probes around the chip base plate. Then cover the sealing cover plate, and the card block at the bottom of the sealing cover plate is engaged with the card slot in the test socket. The sealing groove in the sealing cover plate is engaged with the sealing strip on the top of the test socket. At the same time, the pin pressing groove in the middle of the sealing cover plate presses the package pins to prevent the package pins from loosening the contact with the top of the probes. At this point, the assembly of packaged chips of different specifications is completed, achieving the effect of improving test efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0030] Figure 2 It is a structural schematic diagram of the testing mechanism of the present invention;

[0031] Figure 3 It is a structural schematic diagram of the test bench of the present invention;

[0032] Figure 4 It is a partial structural schematic diagram of the mobile component of the present invention;

[0033] Figure 5 It is a schematic diagram of the explosion of the structure of the test cover plate assembly of the present invention;

[0034] Figure 6 It is a schematic cross-sectional view of the structure of the sealing cover plate of the present invention;

[0035] Figure 7 It is a cross-sectional view of the structure of the connection between the spherical table and the test seat of the present invention;

[0036] Figure 8 For the present invention Figure 7 The structural diagram of the enlarged part at A in the middle;

[0037] Fig. 9 It is a partial structural schematic diagram of the vibration component of the present invention;

[0038] Fig.10 It is a schematic diagram of the structural cross-section of the environmental simulation component of the present invention;

[0039] Fig.11 It is a partial structural schematic diagram when the environmental chamber of the present invention is placed above the packaged chip.

[0040] In the figure:

[0041] 1. Workbench; 2. Support frame; 3. Environmental simulation component; 31. Rotating cylinder; 32. Lifting threaded rod; 33. Temperature and humidity generator; 34. Connecting rod; 35. Environmental chamber; 36. Anti-leakage curtain; 4. Test mechanism; 41. Test bench; 42. Moving component; 421. Moving base; 422. Fixed plate; 423. Spherical table; 424. Support spring; 43. Test base component; 431. Test seat; 432. Card slot; 433, sealing strip; 434, probe station; 435, shaking slot; 44, test cover assembly; 441, chip base plate; 442, package pin; 443, package chip; 444, sealing cover; 445, card block; 446, sealing slot; 447, pin pressing slot; 45, vibration assembly; 451, vibration table; 452, micro vibrator; 453, limit slot; 454, vibration spring; 46, drive threaded rod. DETAILED DESCRIPTION

[0042] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0043] Example 1, reference Figure 1 - Fig. 9 , which is the first embodiment of the present invention, provides a packaging test device for integrated circuit chip processing, including a workbench 1, a support frame 2 fixedly connected to the top of the workbench 1, an environmental simulation component 3 arranged on one side of the support frame 2, and a test mechanism 4 arranged on the top of the workbench 1, the test mechanism 4 includes a test table 41 fixedly connected to the top of the workbench 1, the inner wall of the test table 41 is rotatably connected with a driving threaded rod 46, the power source of the driving threaded rod 46 is arranged inside the workbench 1, and a moving component 42, a test base component 43 and a test cover component 44 are arranged in sequence above the test table 41.

[0044] Reference Figure 4 - Figure 8The moving assembly 42 includes a moving base 421 threadedly connected to the outer wall of the driving threaded rod 46, the top of the moving base 421 is fixedly connected to a fixed disk 422, the top of the fixed disk 422 is fixedly connected to a spherical table 423, the top of the fixed disk 422 is fixedly connected to a plurality of supporting springs 424, the test base assembly 43 includes a test seat 431 fixedly connected to the top of the plurality of supporting springs 424, a shaking groove 435 is provided at the bottom of the test seat 431, the bottom center of the shaking groove 435 overlaps with the top center of the spherical table 423, and the spherical table 423 can shake slightly in the shaking groove 435.

[0045] Specifically, two support frames 2 are symmetrically arranged at both ends of the top of the workbench 1, and environmental simulation components 3 are arranged in the two support frames 2. A hollow space is arranged between the workbench 1 and the test bench 41 to facilitate the movement of the mobile base 421. Two driving threaded rods 46 are arranged to drive the mobile base 421 to move, which can prevent the mobile base 421 from shaking. A fixed plate 422 is arranged between the mobile base 421 and the spherical table 423, and support springs 424 are evenly arranged on the fixed plate 422, so that the test seat 431 can be stably supported and can be slightly shaken through the spherical table 423 and the shaking groove 435.

[0046] The threaded rod 46 is driven to rotate by the power source inside the workbench 1, and the movable base 421 moves above the test bench 41 accordingly. When moving, the spherical table 423 will shake in the shaking groove 435, and with the support of the support spring 424, the packaged chip 443 can be tested in a shaking environment, thereby achieving the effect of improving the reliability and stability of chip testing.

[0047] Reference Figure 5 - Figure 6 The test base assembly 43 also includes a sealing strip 433 and a probe platform 434 fixedly connected to the top of the test seat 431, and a plurality of card slots 432 opened on the inner wall of the test seat 431, and a plurality of probes are evenly distributed on the surface of the probe platform 434. The test cover assembly 44 includes a sealing cover plate 444 overlapped on the top of the test seat 431, and the inner wall of the sealing cover plate 444 is provided with a sealing groove 446, and the inner wall of the sealing groove 446 is clamped with the outer wall of the sealing strip 433. The bottom of the sealing cover plate 444 is fixedly connected with a plurality of card blocks 445, and a plurality of card blocks The outer walls of the block 445 are respectively engaged with the inner walls of the multiple card slots 432. The test cover assembly 44 also includes a chip base plate 441 overlapped on the top of the probe station 434. The top of the chip base plate 441 is overlapped with a packaged chip 443. The outer wall of the packaged chip 443 is evenly fixedly connected with multiple packaged pins 442. The bottoms of the multiple packaged pins 442 are respectively overlapped with the tops of the multiple probes. The inner wall of the sealing cover 444 is provided with multiple pin pressing grooves 447. The inner walls of the multiple pin pressing grooves 447 are respectively overlapped with the tops of the multiple packaged pins 442.

[0048] Specifically, multiple probes are evenly distributed on the probe station 434. According to the range of the probe station 434, any circular, square or rectangular packaged chip 443 smaller than the range can be used, and a chip base plate 441 and a sealing cover plate 444 of the same specifications are equipped. Any sealing cover plate 444 is provided with a card block 445 and a sealing groove 446, which are matched with the card slot 432 and the sealing strip 433 in the test seat 431. Any sealing cover plate 444 is provided with a pin pressing groove 447 adapted to the packaged chip 443, which can press all probes in contact with the packaged pins 442.

[0049] By selecting packaged chips 443 of different specifications and selecting an appropriate test cover assembly 44, first use the chip base plate 441 to cover some probes on the probe station 434, and then place the packaged chip 443 on the top of the chip base plate 441. At this time, the packaged pins 442 around the packaged chip 443 are in contact with the top of the probes around the chip base plate 441, and then cover the sealing cover 444, the block 445 at the bottom of the sealing cover 444 is engaged with the slot 432 in the test socket 431, the sealing slot 446 in the sealing cover 444 is engaged with the sealing strip 433 at the top of the test socket 431, and at the same time, the pin pressing groove 447 in the middle of the sealing cover 444 presses the packaged pins 442 to prevent the packaged pins 442 from loosening the contact with the top of the probe. At this point, the assembly of packaged chips 443 of different specifications is completed, thereby achieving the effect of improving test efficiency and product quality.

[0050] Reference Fig. 9 A vibration assembly 45 is also provided on the top of the workbench 1. The vibration assembly 45 includes a plurality of vibration springs 454 fixedly connected to the top of the workbench 1. A vibration table 451 is fixedly connected to the top of the plurality of vibration springs 454. A symmetrically arranged micro-vibrator 452 is fixedly connected to the bottom of the vibration table 451. A limiting groove 453 is provided on the inner wall of the vibration table 451. When the movable base 421 moves to the two ends of the test table 41 by driving the threaded rod 46, the inner wall of the limiting groove 453 overlaps with the outer wall of the spherical table 423.

[0051] Specifically, the limiting groove 453 opened on the vibration table 451 can penetrate all the supporting springs 424 on the fixed plate 422 and fit with the surface of the spherical table 423, so that the vibration table 451 can drive the entire test base assembly 43 and the test cover assembly 44 to vibrate through the spherical table 423.

[0052] By setting up the vibration component 45, when the movable base 421 moves to the two ends of the test table 41, it can stop moving. At this time, the spherical table 423 contacts the limit groove 453 inside the vibration table 451, and the micro vibration machine 452 is started. The packaged chip 443 is driven by the vibration table 451 to be tested in a vibration environment, thereby achieving the effect of improving the reliability and stability of chip testing.

[0053] During use, an appropriate test cover assembly 44 is selected according to the specifications of the packaged chip 443. First, the chip base plate 441 is used to cover some of the probes on the probe station 434, and then the packaged chip 443 is placed on the top of the chip base plate 441. At this time, the packaged pins 442 around the packaged chip 443 are in contact with the tops of the probes around the chip base plate 441. Then, the sealing cover plate 444 is covered, and the block 445 at the bottom of the sealing cover plate 444 is engaged with the slot 432 in the test socket 431, and the sealing slot 446 in the sealing cover plate 444 is engaged with the sealing strip 433 at the top of the test socket 431. At the same time, the pin pressing slot 447 in the middle of the sealing cover plate 444 presses the packaged pins 442 to prevent the packaged pins 442 from loosening the contact with the top of the probe. At this point, the assembly of packaged chips 443 of different specifications is completed, and the quality of the packaged chips 443 is improved. The effect of high test efficiency and product quality is achieved. The electrical performance, connection quality and other aspects are tested through the probe that contacts the package pin 442, and the test structure is recorded; then the threaded rod 46 is driven to rotate by the power source inside the workbench 1, and the movable base 421 moves above the test bench 41. When moving, the spherical table 423 will shake in the shaking groove 435, and with the support of the support spring 424, the packaged chip 443 can be tested in a shaking environment; when the movable base 421 moves to both ends of the test bench 41, it can stop moving. At this time, the spherical table 423 contacts the limit groove 453 inside the vibration table 451, and the micro-vibrator 452 is started. The packaged chip 443 is driven by the vibration table 451 to be tested in a vibration environment, thereby achieving the effect of improving the reliability and stability of chip testing.

[0054] Example 2, reference Fig.10 - Fig.11 , which is the second embodiment of the present invention, and which is different from the first embodiment in that: Fig.10 The environmental simulation component 3 includes a rotating cylinder 31 fixedly connected to the top of the support frame 2, and the output end of the rotating cylinder 31 is fixedly connected to a lifting threaded rod 32, and the lifting threaded rod 32 is rotatably connected to the inside of the support frame 2.

[0055] Reference Fig.10 The outer wall of the lifting threaded rod 32 is threadedly connected with a connecting rod 34, one end of the connecting rod 34 is fixedly connected to an environmental chamber 35, the top of the environmental chamber 35 is fixedly connected to a temperature and humidity generator 33, and an anti-leakage curtain 36 is fixedly connected to the outer wall of the environmental chamber 35 on the side away from the support frame 2.

[0056] Specifically, the temperature and humidity generator 33 provides temperature and humidity to the environmental chamber 35. The environment in the environmental chamber 35 can be a variety of environments such as high temperature and high humidity, low temperature and high humidity, etc. After the environmental chamber 35 falls, it forms a closed space with the test bench 41, and is protected by the anti-leakage curtain 36 to preserve the environment in the environmental chamber 35 under the maximum conditions.

[0057] During use, when an environmental simulation test is required, the mobile base 421 is located at one end of the test bench 41 and placed above the vibration table 451, the rotating cylinder 31 is started, and the lifting threaded rod 32 is driven to rotate in the support frame 2 through the output end, so that the environmental chamber 35 is driven by the connecting rod 34 to fall and cover the part of the test bench 41, and then the temperature and humidity generator 33 is started, and different temperature and humidity environments are applied in the two environmental chambers 35, and the mobile base 421 is moved to both ends above the test bench 41, so that the packaged chip 443 is tested in different environments, and when the mobile base 421 is moved out of or into the environmental chamber 35 at one end, the anti-leakage curtain 36 will be opened and closed to prevent the air in the environmental chamber 35 from leaking out, so as to achieve the effect of reducing the operating cost of the enterprise, and the micro-vibrator 452 can be started in the environmental chamber 35 to vibrate the packaged chip 443, and the mobile base 421 can be used to shuttle between the two environmental chambers 35, so that the packaged chip 443 is subjected to temperature cycle test, so as to achieve the effect of expanding the simulation range. The rest of the structure is the same as that of Example 1.

[0058] Working principle of the present invention:

[0059] During operation, an appropriate test cover assembly 44 is selected according to the specifications of the packaged chip 443. First, the chip base plate 441 is used to cover some of the probes on the probe station 434, and then the packaged chip 443 is placed on the top of the chip base plate 441. At this time, the packaged pins 442 around the packaged chip 443 are in contact with the tops of the probes around the chip base plate 441. Then, the sealing cover plate 444 is covered, and the block 445 at the bottom of the sealing cover plate 444 is engaged with the slot 432 in the test socket 431, and the sealing slot 446 in the sealing cover plate 444 is engaged with the sealing strip 433 at the top of the test socket 431. At the same time, the pin pressing slot 447 in the middle of the sealing cover plate 444 presses the packaged pins 442 to prevent the packaged pins 442 from loosening the contact with the top of the probe. At this point, the assembly of packaged chips 443 of different specifications is completed, thereby achieving the effect of improving test efficiency and product quality.

[0060] The electrical performance, connection quality and other aspects are tested by the probe in contact with the package pin 442, and the test structure is recorded; then the threaded rod 46 is driven to rotate by the power source inside the workbench 1, and the movable base 421 moves above the test bench 41. When moving, the spherical table 423 will shake in the shaking groove 435, and with the support of the support spring 424, the packaged chip 443 can be tested in a shaking environment; when the movable base 421 moves to both ends of the test bench 41, it can stop moving. At this time, the spherical table 423 contacts the limit groove 453 inside the vibration table 451, and the micro-vibrator 452 is started. The packaged chip 443 is driven by the vibration table 451 to be tested in a vibration environment, thereby achieving the effect of improving the reliability and stability of chip testing.

[0061] When an environmental simulation test is required, the mobile base 421 is located at one end of the test bench 41 and placed above the vibration table 451, and the rotating cylinder 31 is started. The lifting threaded rod 32 is driven to rotate in the support frame 2 through the output end, so that the environmental chamber 35 falls down and covers part of the test bench 41 under the drive of the connecting rod 34, and then the temperature and humidity generator 33 is started to apply different temperature and humidity environments in the two environmental chambers 35. The mobile base 421 is moved to both ends above the test bench 41 to make the packaged chip 443 tested in different environments, and when the mobile base 421 is moved out of or into the environmental chamber 35 at one end, the anti-leakage curtain 36 will be opened and closed to prevent the air in the environmental chamber 35 from leaking out, thereby achieving the effect of reducing the operating costs of the enterprise.

[0062] The micro vibrator 452 can be started in the environmental chamber 35 to vibrate the packaged chip 443, or the mobile base 421 can be moved between the two environmental chambers 35 to perform a temperature cycle test on the packaged chip 443, thereby achieving the effect of expanding the simulation range.

[0063] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A packaging and testing device for processing integrated circuit chips, comprising a workbench (1), a support frame (2) fixedly connected to the top of the workbench (1), an environmental simulation component (3) arranged on one side of the support frame (2), and a testing mechanism (4) arranged on the top of the workbench (1), characterized in that: The testing mechanism (4) comprises a testing table (41) fixedly connected to the top of a workbench (1); a driving threaded rod (46) is rotatably connected to the inner wall of the testing table (41); a power source of the driving threaded rod (46) is arranged inside the workbench (1); and a moving assembly (42), a testing base assembly (43) and a testing cover assembly (44) are arranged in sequence above the testing table (41); The moving assembly (42) comprises a moving base (421) threadedly connected to the outer wall of the driving threaded rod (46); the top of the moving base (421) is fixedly connected to a fixed disk (422); the top of the fixed disk (422) is fixedly connected to a spherical table (423); and the top of the fixed disk (422) is fixedly connected to a plurality of supporting springs (424); The test base assembly (43) comprises a test base (431) fixedly connected to the top of a plurality of support springs (424); a shaking groove (435) is provided at the bottom of the test base (431); the bottom center of the shaking groove (435) overlaps the top center of the spherical table (423); and the spherical table (423) can shake slightly in the shaking groove (435).

2. The integrated circuit chip processing packaging and testing device according to claim 1, characterized in that: The test base assembly (43) also includes a sealing strip (433) and a probe platform (434) fixedly connected to the top of the test base (431), and a plurality of slots (432) opened on the inner wall of the test base (431), and a plurality of probes are evenly distributed on the surface of the probe platform (434).

3. The packaging and testing device for integrated circuit chip processing according to claim 2, characterized in that: The test cover assembly (44) comprises a sealing cover (444) overlapped on the top of the test seat (431); the inner wall of the sealing cover (444) is provided with a sealing groove (446); the inner wall of the sealing groove (446) is clamped with the outer wall of the sealing strip (433); the bottom of the sealing cover (444) is fixedly connected with a plurality of clamping blocks (445); the outer walls of the plurality of clamping blocks (445) are respectively clamped with the inner walls of the plurality of clamping grooves (432).

4. The packaging and testing device for integrated circuit chip processing according to claim 3, characterized in that: The test cover assembly (44) also includes a chip base plate (441) overlapped on the top of the probe station (434), the top of the chip base plate (441) is overlapped with a packaged chip (443), the outer wall of the packaged chip (443) is evenly fixedly connected with a plurality of packaged pins (442), and the bottoms of the plurality of packaged pins (442) are respectively overlapped with the tops of the plurality of probes.

5. The packaging and testing device for integrated circuit chip processing according to claim 4, characterized in that: The inner wall of the sealing cover plate (444) is provided with a plurality of pin pressing grooves (447), and the inner walls of the plurality of pin pressing grooves (447) are respectively overlapped with the tops of the plurality of packaging pins (442).

6. The integrated circuit chip processing packaging and testing device according to claim 1, characterized in that: A vibration assembly (45) is also provided on the top of the workbench (1), and the vibration assembly (45) comprises a plurality of vibration springs (454) fixedly connected to the top of the workbench (1), the tops of the plurality of vibration springs (454) are fixedly connected to a vibration table (451), and the bottom of the vibration table (451) is fixedly connected to a symmetrically arranged micro-vibrator (452).

7. The integrated circuit chip processing packaging and testing device according to claim 6, characterized in that: The inner wall of the vibration table (451) is provided with a limiting groove (453), and when the movable base (421) is moved to two ends of the test table (41) by driving the threaded rod (46), the inner wall of the limiting groove (453) overlaps the outer wall of the spherical table (423).

8. The integrated circuit chip processing packaging and testing device according to claim 1, characterized in that: The environmental simulation component (3) comprises a rotating cylinder (31) fixedly connected to the top of the support frame (2), the output end of the rotating cylinder (31) is fixedly connected to a lifting threaded rod (32), and the lifting threaded rod (32) is rotatably connected to the inside of the support frame (2).

9. The integrated circuit chip processing packaging and testing device according to claim 8, characterized in that: The outer wall of the lifting threaded rod (32) is threadedly connected to a connecting rod (34), one end of the connecting rod (34) is fixedly connected to an environmental chamber (35), the top of the environmental chamber (35) is fixedly connected to a temperature and humidity generator (33), and an anti-leakage curtain (36) is fixedly connected to the outer wall of the environmental chamber (35) on a side away from the support frame (2).

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