Multi-channel single-frequency VCSEL chip test base

Abstract

The invention provides a multi-channel single-frequency VCSEL chip testing base, and relates to the technical field of laser chip testing, the multi-channel single-frequency VCSEL chip testing base comprises a bottom plate, a placement assembly is arranged at the center of the top of the bottom plate, the placement assembly comprises a heating base, a TEC refrigeration sheet is fixed at the top of the heating base, a heat conduction seat is arranged in the TEC refrigeration sheet, and a heat conduction groove is formed in the heat conduction seat. Supporting plates are arranged at the positions, located on the two sides of the containing assembly, of the bottom plate, testing bases are arranged on the heat conduction base and the supporting plate on one side, and a plurality of containing grooves are formed in the surfaces of the testing bases at equal intervals. Compared with the prior art, multiple VCSEL chips can be loaded at a time through the testing bases, one-time loading is carried out after all measurement is completed, the measurement efficiency can be greatly improved, and the measurement accuracy is improved. Aiming at the current-temperature-wavelength working point test of the VCSEL chip, a temperature control range with an adjustable room temperature can be provided, through the cooperation of the lifting assembly and the supporting plate, the two groups of test bases can be conveniently switched for use, and the test efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of laser chip testing, in particular to a multi-channel single-frequency VCSEL chip testing base. Background Art

[0002] VCSEL (Vertical Cavity Surface Emitting Laser) is a semiconductor laser that emits light vertically from the surface of the chip. Compared with traditional edge-emitting lasers, VCSEL has shown a wide range of applications in optical communications, sensing, 3D imaging, LiDAR and other fields.

[0003] Conventional tests on VCSEL chips are mainly PIV tests and modulation tests. In spectral applications, in addition to power, light spot and modulation bandwidth, the spectrum and temperature-current-wavelength operating point output by the VCSEL chip also need to be tested, and the test base needs to have temperature regulation and precise temperature control functions.

[0004] The existing VCSEL chip test base usually includes an electrical connection structure, an optical detection device and a heat dissipation structure that are docked with the chip. The design of these traditional test systems is relatively complex, and it is often necessary to connect the chip to the external test circuit through welding, clamps or wires. For example, the patent CN202122146104.1 proposes a Vcsel chip test fixture. Usually, during the chip testing process, the test base needs to manually reload the chip after each measurement is completed, which reduces the measurement efficiency. Summary of the invention

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a multi-channel single-frequency VCSEL chip test base to solve the problems raised in the above background technology. The present invention has a novel structure. Multiple VCSEL chips can be loaded at one time through the test base, and they can be loaded at one time after all measurements are completed, which can greatly improve the measurement efficiency. For the current-temperature-wavelength operating point test of the VCSEL chip, a wide tunable temperature control range from near room temperature to ℃ can be provided. Through the cooperation of the lifting assembly and the support plate, it is convenient to switch between the two groups of test bases, thereby improving the test efficiency.

[0006] In order to achieve the above-mentioned purpose, the present invention is implemented through the following technical scheme: a multi-channel single-frequency VCSEL chip test base, comprising a base plate, a placement component is provided at the center of the top of the base plate, the placement component comprises a heating base, a TEC cooling plate is fixed on the top of the heating base, a heat conducting seat is arranged inside the TEC cooling plate, the base plate is provided with support plates on both sides of the placement component, and a test seat is arranged on the heat conducting seat and one side of the support plate, a plurality of placement grooves are equidistantly provided on the surface of the test seat, a lifting component is provided on the surface of the base plate at the bottom of the two support plates, the lifting component comprises a telescopic column, and the bottom of the telescopic column is fixed to the base plate, The extended end of the telescopic column is fixed to the outer side of the support plate, a support rod is provided on the bottom plate, and the support rod is rotatably connected to the bottom of the support plate, a detection component is provided on the outer side of the placement component, and the detection component includes a transverse movable slide rail, a longitudinal movable slide rail is installed on the top of the transverse movable slide rail, a telescopic plate is installed on the transverse movable slide rail, the other end of the telescopic plate is connected to the longitudinal movable slide rail, and a probe seat is installed on the surface of the longitudinal movable slide rail, a side frame is fixed on the side of the support plate close to the detection component, the two test seats slide along the side frame, and a limiting block is fixed at the top of the thermal conductive seat corresponding to the four corners of the test seat, and the limiting block is provided with an inlet and outlet along the direction of the side frame.

[0007] Furthermore, the lifting assembly also includes a movable groove, a movable groove is opened at a position of the base plate corresponding to the support rod, and a bidirectional screw rod is rotatably installed inside the movable groove through a bearing, a first motor is fixed to the outside of the base plate, and the output end of the first motor is meshingly connected to the bidirectional screw rod, a slider is rotatably installed at the bottom of the support rod through a rotating shaft, and the slider at the bottom of the support rod is threadedly sleeved on the bidirectional screw rod.

[0008] Furthermore, the placement component also includes a negative pressure air source, the bottom of which is installed on the base plate, and the top of the negative pressure air source is fixed to the heating base, a connecting pipe is fixed to the air outlet end of the negative pressure air source, and the connecting pipe penetrates into the interior of the thermal conductive seat, and an air cavity is opened on the top of the thermal conductive seat corresponding to the position where the connecting pipe passes through.

[0009] Furthermore, ceramic heating plates are installed around the heating base, and temperature sensors are installed inside the heating base and the test seat.

[0010] Furthermore, two connecting plates are provided on the top of the thermal seat parallel to the side frame, and the connecting plates are located on both sides of the test seat, and the position of the limit block corresponding to the connecting plate is provided with a vertical groove, and the two ends of the connecting plate slide along the vertical groove.

[0011] Furthermore, an inserting strip is fixed on the inner surface of the connecting plate, and sliding grooves are provided on both sides of the test seat, and the inserting strip slides along the sliding grooves.

[0012] Furthermore, an air hole is provided at the bottom of the placement groove, and the air hole is communicated with the air cavity.

[0013] Furthermore, the test seat is fixed with connecting columns at the middle positions on both sides parallel to the side frames, and connecting plates are fixed on the outer sides of the connecting columns, and the connecting plates are on the outer sides of the limiting blocks.

[0014] Furthermore, a screw is rotatably installed inside the side frame through a bearing, and a moving block is threadedly sleeved on the surface of the screw, a second motor is fixed to one end of the side frame, an output end of the second motor is fixedly connected to the screw, and the moving block is fixedly connected to the connecting plate.

[0015] Furthermore, the probe seat comprises two probe contacts, one of the probe contacts of the probe seat contacts the positive electrode of the front surface of the single-frequency VCSEL chip, and the other probe contact of the probe seat directly contacts the surface of the chip seat.

[0016] Beneficial effects of the present invention:

[0017] 1. The present invention adopts TEC bipolar temperature control as the direct temperature control unit of the single-frequency VCSEL chip, and cooperates with the ceramic heater as the environmental temperature control method, which can achieve temperature control in the range of 10°C below the ambient temperature to 150°C high temperature. It not only realizes the high-precision temperature control function of TEC, but also avoids the difficulty in achieving high temperature due to limited TEC power. It can meet the test requirements of single-frequency VCSEL chip working wavelength scanning. The two-stage temperature control function can realize the flexible setting of the test working temperature point. Through the combination of the ceramic heater and the TEC cooling plate, the working temperature point can be arbitrarily set in the range of 10 degrees Celsius below room temperature to 150°C high temperature.

[0018] 2. The array chip placement slot of the present invention is based on vacuum adsorption, which can measure the working status of the chip without the influence of additional clamping stress; and in conjunction with visual and automated measuring devices, multiple chips can be loaded and measured at one time, thereby improving screening efficiency.

[0019] 3. The present invention raises the support plate and two test seats to the position of the inlet and outlet through a lifting assembly, and then the second motor drives the screw to rotate, and the moving block cooperates with the screw thread to slide along the inside of the side frame. Because the moving block is connected to the connecting plate, it will drive the two groups of test seats to move synchronously and switch between use. In this technical content, the test seat will move toward the side of the vacant support plate, and after taking out the tested chip, the new chip can be placed in the placement slot of the test seat during the process of testing the chip by another group of test seats, thereby improving the detection efficiency. Before the test seat moves into the detection area, the slide slots on both sides of the test seat will first be plugged into the plug, and then guided by the sliding of the connecting plate along the vertical slot, so that it can accurately fall into the detection area without position displacement, and the four corners of the test seat are limited by four limit blocks during the detection process, and the horizontal direction of the test seat sending out and sending in is guided by the connecting plate and the insert.

[0020] 4. The present invention connects the negative pressure gas source through the connecting tube to generate negative pressure adsorption on the test seat through the air cavity and the air hole to complete the chip adsorption action. At this time, the movable probe seat can perform power-on test on each chip at a time.

[0021] 5. Compared with the prior art, the present invention can load multiple VCSEL chips at one time through the test socket, and can load them at one time after all measurements are completed, which can greatly improve the measurement efficiency. For the current-temperature-wavelength operating point test of the VCSEL chip, it can provide an adjustable temperature control range near room temperature. Through the cooperation of the lifting component and the support plate, it is convenient to switch between two groups of test sockets, thereby improving the test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of a multi-channel single-frequency VCSEL chip test base of the present invention;

[0023] Figure 2 This is a schematic diagram of the position relationship of two groups of test sockets of a multi-channel single-frequency VCSEL chip test socket of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of a lifting assembly of a multi-channel single-frequency VCSEL chip test base of the present invention;

[0025] Figure 4 This is a schematic diagram of the internal structure of a side frame of a multi-channel single-frequency VCSEL chip test base of the present invention;

[0026] Figure 5 This is a schematic diagram of the structure of a placement component of a multi-channel single-frequency VCSEL chip test base of the present invention;

[0027] Figure 6 The present invention provides a cross-sectional view of the interior of a placement component of a multi-channel single-frequency VCSEL chip test base.

[0028] In the figure: 1. bottom plate; 2. lifting assembly; 21. moving slot; 22. bidirectional screw rod; 23. first motor; 24. support rod; 25. telescopic column; 3. placement assembly; 31. negative pressure air source; 32. heating base; 33. TEC cooling plate; 34. thermal conductive seat; 35. ceramic heating plate; 36. limit block; 37. vertical slot; 38. connecting plate; 39. insert strip; 310. inlet and outlet; 311. air cavity; 312. connecting pipe; 4. test seat; 41. placement slot; 42. air hole; 43. slide slot; 5. support plate; 51. side frame; 52. second motor; 53. screw rod; 54. moving block; 55. connecting plate; 56. connecting column; 6. detection assembly; 61. horizontal moving slide rail; 62. telescopic plate; 63. longitudinal moving slide rail; 64. probe seat. DETAILED DESCRIPTION

[0029] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0030] See also Figures 1 to 6The present invention provides a technical solution: a multi-channel single-frequency VCSEL chip test base, comprising a base plate 1, a placement component 3 is provided at the top center of the base plate 1, the placement component 3 comprises a heating base 32, a TEC cooling plate 33 is fixed on the top of the heating base 32, a heat conducting seat 34 is arranged inside the TEC cooling plate 33, the base plate 1 is provided with supporting plates 5 on both sides of the placement component 3, and the heat conducting seat 34 and one side of the supporting plate 5 are provided with a test seat 4, a plurality of placement grooves 41 are equidistantly provided on the surface of the test seat 4, a lifting component 2 is provided on the surface of the base plate 1 at the bottom of the two supporting plates 5, the lifting component 2 comprises a telescopic column 25, the telescopic column 25 The bottom is fixed to the bottom plate 1, and the extended end of the telescopic column 25 is fixed to the outer side of the support plate 5, the bottom plate 1 is provided with a support rod 24, and the support rod 24 is rotatably connected to the bottom of the support plate 5, the outer side of the placement component 3 is provided with a detection component 6, the detection component 6 includes a transverse movable slide rail 61, a longitudinal movable slide rail 63 is installed on the top of the transverse movable slide rail 61, a telescopic plate 62 is installed on the transverse movable slide rail 61, the other end of the telescopic plate 62 is connected to the longitudinal movable slide rail 63, and a probe seat 64 is installed on the surface of the longitudinal movable slide rail 63, a side frame 51 is fixed to the side of the support plate 5 close to the detection component 6, the two test seats 4 slide along the side frame 51, the thermal conductivity The top of the seat 34 corresponds to the four corners of the test seat 4, and the limit blocks 36 are fixed, and the limit blocks 36 are provided with an inlet and outlet 310 along the direction of the side frame 51. The probe seat 64 includes two probe contacts, one of which contacts the positive electrode of the front electrode of the single-frequency VCSEL chip, and the other contact of the probe seat 64 directly contacts the surface of the chip seat. The test seat 4 has a plurality of chip placement slots 41, each of which has a negative pressure pore 42 for generating a negative pressure vacuum, so that the chip can be firmly adsorbed in the chip placement slot 41, and the bottom of the chip is in good contact with the bottom of the chip placement slot 41. When using the device, the chip is placed in the test seat 4, and a group of test seats 4 It is sent to the detection component 6 along the pallet 5 through the lifting component 2 and contacts the top of the thermal seat 34. The TEC bipolar temperature control is used as the direct temperature control unit of the single-frequency VCSEL chip, and the ceramic heating plate 35 is used as the environmental temperature control method. It can achieve a wide range of temperature control from 10°C below the ambient temperature to 150°C high temperature, which not only realizes the TEC high-precision temperature control function, but also moves the probe seat 64 through the lateral moving slide 61 and the longitudinal moving slide 63 to detect the chip in each placement slot 41. Another group of test seats 4 can be used as a backup, and undetected chips are placed in advance. After the previous group of chips are detected and sent out, the new test seat 4 is sent in for continued detection, thereby improving the overall detection efficiency.

[0031] In this embodiment, the lifting assembly 2 also includes a moving groove 21, and the position of the base plate 1 corresponding to the support rod 24 is provided with a moving groove 21, and a bidirectional screw rod 22 is rotatably installed inside the moving groove 21 through a bearing, and a first motor 23 is fixed to the outside of the base plate 1, and the output end of the first motor 23 is meshed and connected with the bidirectional screw rod 22, and a slider is rotatably installed at the bottom of the support rod 24 through a rotating shaft, and the slider at the bottom of the support rod 24 is threadedly sleeved on the bidirectional screw rod 22. The first motor 23 is turned on to drive the bidirectional screw rod 22 to rotate, and the sliders at the bottom of the support rods 24 on both sides slide along the moving groove 21, and through the guidance of the telescopic column 25, the support rod 24 pushes the support plate 5 to move in the vertical direction, thereby receiving or sending the test seat 4 to the detection position.

[0032] In this embodiment, the placement component 3 also includes a negative pressure air source 31, the bottom of the negative pressure air source 31 is installed on the base plate 1, and the top of the negative pressure air source 31 is fixed to the heating base 32, the air outlet end of the negative pressure air source 31 is fixed with a connecting pipe 312, and the connecting pipe 312 penetrates into the interior of the thermal conductive seat 34, and an air cavity 311 is opened at the top of the thermal conductive seat 34 corresponding to the position where the connecting pipe 312 passes through, and an air hole 42 is opened at the bottom of the placement groove 41, and the air hole 42 is connected to the air cavity 311, and the connecting pipe 312 is connected to the negative pressure air source 31 to generate negative pressure adsorption on the test seat 4 through the air cavity 311 and the air hole 42 to complete the chip adsorption action. At this time, the movable probe seat 64 performs power-on testing on each chip in turn.

[0033] In this embodiment, ceramic heating plates 35 are installed around the heating base 32, and temperature sensors are installed inside the heating base 32 and the test seat 4. The heating base 32 is started to preheat, and the output power of the ceramic heating plate 35 is controlled according to the temperature sampling feedback of the temperature sensor in the heating base 32, so that the temperature of the heating base 32 reaches the preset working temperature. According to the feedback value of the temperature sensor in the test seat 4, the 3TEC cooling plate 33 is controlled to precisely control the chip temperature. The two-stage temperature control function can realize the flexible setting of the test working temperature point. Through the combination of the ceramic heating plate 35 and the TEC cooling plate 33, the working temperature point can be arbitrarily set in the range of 10 degrees Celsius below room temperature to 150 degrees Celsius high temperature, and the two-stage temperature control can significantly improve the temperature control stability.

[0034] In this embodiment, two connecting plates 38 are provided on the top of the heat-conducting seat 34 parallel to the side frame 51, and the connecting plates 38 are located on both sides of the test seat 4. The position of the limit block 36 corresponding to the connecting plate 38 is provided with a vertical groove 37, and the two ends of the connecting plate 38 slide along the vertical groove 37. The inner surface of the connecting plate 38 is fixed with an insertion strip 39, and the two sides of the test seat 4 are provided with a slide groove 43, and the insertion strip 39 slides along the slide groove 43. The test seat 4 is parallel to the middle position of the two sides of the side frame 51. The outer side of the connecting column 56 is fixed with a connecting plate 55, and the connecting plate 55 is fixed at the limit block 36. On the outside, a screw 53 is rotatably installed inside the side frame 51 through a bearing, and a moving block 54 is threadedly sleeved on the surface of the screw 53. A second motor 52 is fixed to one end of the side frame 51, and the output end of the second motor 52 is fixedly connected to the screw 53, and the moving block 54 is fixedly connected to the connecting plate 55. The connection column 56 and the connecting plate 55 are provided to connect two test seats 4 for convenient switching. The position of the connecting plate 55 is set on the outside of the limit block 36, so that when two groups of test seats 4 are switched or one test seat 4 is inserted into four limit blocks 36, no movement interference will occur, and the test bench Only when it is lifted to the position of the limit column inlet and outlet 310 can it be moved horizontally out of the range of the limit block 36. At this time, the height of the connecting column 56 is also at the top of the limit block 36, and there will be no movement. First, the support plate 5 and the two test seats 4 are lifted to the position of the inlet and outlet 310 through the lifting component 2, and then the second motor 52 drives the screw 53 to rotate, and the moving block 54 and the screw 53 thread cooperate to slide along the inside of the side frame 51. Because the moving block 54 is connected to the connecting plate 55, the two groups of test seats 4 will be driven to move synchronously and switch between use. In this technical content, the test seat 4 will move toward the side of the vacant support plate 5, and the test seat 4 will move toward the side of the vacant support plate 5. After the tested chip is taken out, a new chip can be placed in the placement slot 41 of the test socket 4 while another group of test sockets 4 is testing the chip, so as to improve the detection efficiency. Before the test socket 4 moves into the detection area, the slide slots 43 on both sides of the test socket 4 will first be plugged into the plug, and then guided by the sliding of the connecting plate 38 along the vertical slot 37 to accurately fall into the detection area without position displacement. The four corners of the test socket 4 are limited during the detection process by four limit blocks 36, and the horizontal direction of the test socket 4 in and out is guided by the connecting plate 38 and the insertion strip 39.

[0035] When using the device, the chip is placed in the test seat 4, and the support plate 5 and the two test seats 4 are lifted to the position of the inlet and outlet 310 by the lifting assembly 2, and then the second motor 52 drives the screw 53 to rotate, and the moving block 54 and the screw 53 threadedly cooperate to slide along the inside of the side frame 51. Because the moving block 54 is connected to the connecting plate 55, the two groups of test seats 4 will be driven to move synchronously and switch for use. In this technical content, the test seat 4 will move toward the side of the vacant support plate 5. After the tested chip is taken out, the new chip can be placed in the placement slot 41 of the test seat 4 during the test of the chip by another group of test seats 4, so as to improve the detection efficiency. Before the test seat 4 moves into the detection area, the slide slots 43 on both sides of the test seat 4 will first be plugged with the plug, and then guided by the sliding of the connecting plate 38 along the vertical slot 37, so that it falls into the detection area accurately without position displacement, and the four corners of the test seat 4 are fixed during the detection process by four limit blocks 36. The test seat 4 is limited in position and is guided in the horizontal direction of being sent out and sent in by the connecting plate 38 and the insert strip 39, and is in contact with the top of the thermal conductive seat 34. The connecting tube 312 is connected to the negative pressure gas source 31 to generate negative pressure adsorption on the test seat 4 through the air cavity 311 and the air hole 42 to complete the chip adsorption action. At this time, the movable probe seat 64 performs power-on test on each chip in turn, and adopts TEC bipolar temperature control as the direct temperature control unit of the single-frequency VCSEL chip, and cooperates with the ceramic heating plate 35 as the environmental temperature control method, which can achieve a wide range of temperature control from 10°C below the ambient temperature to 150°C high temperature, and realizes the TEC high-precision temperature control function. The probe seat 64 is moved by the lateral moving slide 61 and the longitudinal moving slide 63 to detect the chip in each placement slot 41. Another group of test seats 4 can be used as a backup, and the undetected chips are placed in advance. After the previous group of chips are detected and sent out, the new test seat 4 is sent in for continued detection, thereby improving the overall detection efficiency.

[0036] The basic principles and main features of the present invention and the advantages of the present invention are shown and described above. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention.

[0037] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A multi-channel single-frequency VCSEL chip test base, comprising a base plate (1), characterized in that: A placement component (3) is provided at the center of the top of the base plate (1), and the placement component (3) includes a heating base (32). A TEC cooling plate (33) is fixed on the top of the heating base (32), and a heat conducting seat (34) is arranged inside the TEC cooling plate (33). The base plate (1) is provided with supporting plates (5) on both sides of the placement component (3), and the heat conducting seat (34) and one side of the supporting plate (5) are provided with a test seat (4), and a plurality of placement grooves (41) are evenly spaced on the surface of the test seat (4). A lifting component (2) is provided on the surface of the base plate (1) at the bottom of the two supporting plates (5), and the lifting component (2) includes a telescopic column (25), the bottom of the telescopic column (25) is fixed to the base plate (1), and the extended end of the telescopic column (25) is fixed to the outer side of the supporting plate (5), and a support rod (24) is provided on the base plate (1). ), and the support rod (24) is rotatably connected to the bottom of the support plate (5), a detection component (6) is arranged on the outer side of the placement component (3), the detection component (6) comprises a transverse movable slide rail (61), a longitudinal movable slide rail (63) is installed on the top of the transverse movable slide rail (61), a telescopic plate (62) is installed on the transverse movable slide rail (61), the other end of the telescopic plate (62) is connected to the longitudinal movable slide rail (63), and a probe seat (64) is installed on the surface of the longitudinal movable slide rail (63), a side frame (51) is fixed on the side of the support plate (5) close to the detection component (6), the two test seats (4) slide along the side frame (51), and a limiting block (36) is fixed on the top of the thermal conductive seat (34) corresponding to the four corners of the test seat (4), and the limiting block (36) is provided with an inlet and outlet (310) along the direction of the side frame (51).

2. A multi-channel single-frequency VCSEL chip test base according to claim 1, characterized in that: The lifting assembly (2) further comprises a movable groove (21), the movable groove (21) is provided at a position of the base plate (1) corresponding to the support rod (24), and a bidirectional screw rod (22) is rotatably mounted inside the movable groove (21) via a bearing, a first motor (23) is fixed to the outside of the base plate (1), and an output end of the first motor (23) is meshingly connected to the bidirectional screw rod (22), a slider is rotatably mounted at the bottom of the support rod (24) via a rotating shaft, and the slider at the bottom of the support rod (24) is threadedly sleeved on the bidirectional screw rod (22).

3. A multi-channel single-frequency VCSEL chip test base according to claim 1, characterized in that: The placement component (3) further comprises a negative pressure gas source (31), the bottom of the negative pressure gas source (31) is mounted on the bottom plate (1), and the top of the negative pressure gas source (31) is fixed to the heating base (32), a connecting pipe (312) is fixed to the gas outlet end of the negative pressure gas source (31), and the connecting pipe (312) penetrates into the interior of the heat conducting seat (34), and an air cavity (311) is provided on the top of the heat conducting seat (34) corresponding to the position where the connecting pipe (312) penetrates.

4. A multi-channel single-frequency VCSEL chip test base according to claim 3, characterized in that: Ceramic heating plates (35) are installed around the heating base (32), and temperature sensors are installed inside the heating base (32) and the test base (4).

5. The multi-channel single-frequency VCSEL chip test base according to claim 1, characterized in that: Two connecting plates (38) are arranged on the top of the heat conducting seat (34) parallel to the side frame (51), and the connecting plates (38) are located on both sides of the test seat (4). The position of the limiting block (36) corresponding to the connecting plate (38) is provided with a vertical groove (37), and the two ends of the connecting plate (38) slide along the vertical groove (37).

6. A multi-channel single-frequency VCSEL chip test base according to claim 5, characterized in that: An inserting strip (39) is fixed on the inner surface of the connecting plate (38), and sliding grooves (43) are provided on both sides of the test seat (4), and the inserting strip (39) slides along the sliding grooves (43).

7. The multi-channel single-frequency VCSEL chip test base according to claim 1, characterized in that: An air hole (42) is provided at the bottom of the placement groove (41), and the air hole (42) is communicated with the air cavity (311).

8. The multi-channel single-frequency VCSEL chip test base according to claim 7, characterized in that: The test seat (4) is fixed with connecting columns (56) at the middle positions on both sides parallel to the side frame (51), and a connecting plate (55) is fixed on the outside of the connecting column (56), and the connecting plate (55) is on the outside of the limit block (36).

9. The multi-channel single-frequency VCSEL chip test base according to claim 8, characterized in that: A screw rod (53) is rotatably mounted inside the side frame (51) via a bearing, and a moving block (54) is threadedly sleeved on the surface of the screw rod (53). A second motor (52) is fixed to one end of the side frame (51), an output end of the second motor (52) is fixedly connected to the screw rod (53), and the moving block (54) is fixedly connected to the connecting plate (55).

10. The multi-channel single-frequency VCSEL chip test base according to claim 1, characterized in that: The probe seat (64) comprises two probe contacts, one probe contact of the probe seat (64) contacts the positive electrode of the front surface of the single-frequency VCSEL chip, and the other probe contact of the probe seat (64) directly contacts the surface of the chip seat.

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