A circuit detection method, system, storage medium and computer equipment for lighting display

Abstract

The present invention relates to the field of circuit detection technology, and specifically discloses a circuit detection method, system, storage medium and computer equipment for light display. The present application first obtains the welding physical characteristic information and welding on-off circuit characteristic information of the pin of the LED lamp and the circuit board, and then obtains the physical connection characteristic index of the solder joint according to the welding physical characteristic information, and then obtains the circuit connection characteristic index according to the welding on-off circuit characteristic information, and then performs weighted calculation according to the solder joint physical connection characteristic index and the circuit connection characteristic index to obtain the welding quality index, and finally, performs quality detection and judgment on the welding of the pin of the LED lamp and the circuit board according to the welding quality index, so that the welding is numerically quantified by the welding quality index, and the welding of the LED lamp and the circuit board can be judged in a standardized manner, which can avoid the subjectivity, missed detection and misjudgment problems caused by workers' judgment.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit detection, and in particular to a circuit detection method, system, storage medium and computer equipment for light display. Background Art

[0002] With the rapid development of electronic technology, LED lights have been widely used in many fields such as lighting and display. In the manufacturing process of circuit boards containing LED lights, the welding quality of LED light pins and circuit boards directly affects the performance and reliability of the entire circuit. Poor welding may cause problems such as LED lights not lighting up, flickering, abnormal brightness, etc. In severe cases, it may even cause circuit failure or safety hazards. Among them, the circuit displayed by the light is the welding on-off circuit between the above-mentioned LED light and the circuit board. The welding on-off circuit has two states: connected and disconnected.

[0003] During the process of workers soldering LED lights to circuit boards, workers usually use visual and experience to make subjective judgments. However, visual and experience judgments are highly subjective and prone to missed detections and misjudgments. Therefore, a circuit detection method for light display is needed to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a circuit detection method, system, storage medium and computer equipment for light display to solve the technical problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A circuit detection method for light display, comprising:

[0007] Obtaining welding characteristic information between the pins of the LED lamp and the circuit board, wherein the welding characteristic information includes welding physical characteristic information and welding on-off circuit characteristic information;

[0008] According to the welding physical characteristic information, the pin and circuit board fitting characteristic information, the adjacent pin welding distance information and the smoothness and flatness of the welding tin point are obtained, and the pin welding quality is obtained according to the circuit board fitting characteristic information and the adjacent pin welding distance information;

[0009] Calculating a solder joint physical connection characteristic index according to the pin soldering quality and the solder joint smoothness and flatness;

[0010] Acquire circuit resistance change information and electrical performance information of the LED lamp according to the welding on-off circuit characteristic information, and acquire first welding connection characteristic information according to the circuit resistance change information;

[0011] Acquire the brightness information of the LED lamp and the luminous color information of the LED lamp according to the electrical performance information of the LED lamp, and acquire the second welding connection characteristic information according to the brightness information of the LED lamp and the luminous color information of the LED lamp;

[0012] Performing weighted calculation according to the first welding connectivity feature information and the second welding connectivity feature information to obtain a circuit connection feature index;

[0013] Performing weighted calculation according to the physical connection characteristic index and the circuit connection characteristic index of the solder joint to obtain a soldering quality index;

[0014] The welding quality between the pins of the LED lamp and the circuit board is inspected and judged according to the welding quality index.

[0015] Preferably, the step of calculating the physical connection characteristic index of the solder joint according to the pin soldering quality and the smoothness and flatness of the solder joint comprises:

[0016] According to the pin welding quality acquisition, obtain the corresponding pin welding quality weight value;

[0017] Get welding error coefficient;

[0018] Get multiple height values ​​of the solder joint surface based on 3D surface scanning;

[0019] Obtain the preset standard solder joint smoothness and flatness;

[0020] The physical connection characteristic index of the solder joint is calculated according to the pin soldering quality, the smoothness and flatness of the solder joint, the pin soldering quality weight value and the soldering error coefficient, wherein the calculation formula is:

[0021] ;

[0022] Where s(c) represents the physical connection characteristic index of the solder joint, f(s) represents the pin soldering quality, d represents the pin soldering quality weight value, and h i It represents the i-th height value, i represents the sequence number of the height value, i=1, 2, 3...n, n represents the number of heights, R represents the smoothness and flatness of the preset standard solder joint, and θ represents the welding error coefficient.

[0023] Preferably, the step of acquiring circuit resistance change information and electrical performance information of the LED lamp according to the welding on-off circuit characteristic information comprises:

[0024] Acquire an on-off mode of the LED lamp according to the welding on-off circuit characteristic information, wherein the on-off mode of the LED lamp includes a connected mode and a disconnected mode;

[0025] When in the connection mode, obtaining a first initial resistance of the LED lamp, releasing an electronic pulse current to both ends of the LED lamp, obtaining a first electronic pulse current and a first electronic pulse voltage, and calculating a first electronic pulse resistance according to the first electronic pulse current and the first electronic pulse voltage;

[0026] using a first ratio between the first initial resistance and the first electronic pulse resistance as dynamic resistance change information;

[0027] When in the disconnection mode, obtaining a second initial resistance of the LED lamp, releasing an electronic pulse current to both ends of the LED lamp, obtaining a second electronic pulse current and a second electronic pulse voltage, and calculating a second electronic pulse resistance according to the second electronic pulse current and the second electronic pulse voltage;

[0028] A second ratio between the second initial resistance and the second electronic pulse resistance is used as static resistance change information.

[0029] Preferably, the step of acquiring first welding connectivity characteristic information according to the circuit resistance change information comprises:

[0030] Obtain the forward resistance and reverse resistance between the pin of the LED lamp and the circuit board according to the static resistance change information;

[0031] Calculating a static resistivity according to a ratio of the forward resistance to the reverse resistance;

[0032] Acquire a resistance waveform diagram according to the dynamic resistance change information, wherein the acquisition method is based on oscilloscope acquisition;

[0033] Acquire multiple waveform peak points within a preset time according to the resistance waveform diagram, and extract the multiple waveform peak points based on the preset first appearance to obtain the first waveform peak point;

[0034] Acquire multiple slopes of adjacent waveform peak points according to the first waveform peak point and the remaining multiple waveform peak points, and calculate an average slope according to the multiple slopes;

[0035] Calculating a dynamic resistivity according to the average slope and a preset slope ratio;

[0036] The static resistance coefficient and the dynamic resistance coefficient are weightedly calculated to obtain a comprehensive resistance characteristic coefficient, and the comprehensive resistance characteristic coefficient is used as the first welding connection characteristic information.

[0037] Preferably, the step of acquiring the second welding connection characteristic information according to the brightness information of the LED lamp and the luminous color information of the LED lamp comprises:

[0038] Acquire multiple brightness values ​​within a preset time according to the brightness information of the LED lamp, and acquire multiple brightness fluctuation change rates between adjacent brightness values ​​according to the multiple brightness values;

[0039] Calculating an average brightness fluctuation change rate according to the plurality of brightness fluctuation change rates, and calculating a brightness fluctuation coefficient according to a ratio of the average brightness fluctuation change rate to a preset standard brightness fluctuation change rate;

[0040] Acquire spectrum information within a preset time according to the luminous color information of the LED lamp, and analyze the wavelength of the spectrum information based on a spectrometer to obtain the spectrum wavelength;

[0041] Calculate the wavelength difference coefficient according to the ratio of the spectrum wavelength to the preset spectrum wavelength;

[0042] The brightness fluctuation coefficient and the wavelength difference coefficient are weighted to calculate the light emission characteristic coefficient of the LED lamp, and the light emission characteristic coefficient of the LED lamp is used as the second welding connection characteristic information.

[0043] Preferably, the step of performing quality inspection and judgment on the welding between the pins of the LED lamp and the circuit board according to the welding quality index comprises:

[0044] Obtain standard welding quality index;

[0045] The welding quality index and the standard welding quality index are input into the quality comparison model to obtain the welding quality coefficient, wherein the function formula of the quality comparison model is:

[0046] ;

[0047] Among them, Q represents the welding quality coefficient, B(z) represents the welding quality index, and Y(S) represents the standard welding quality index;

[0048] Determining whether the welding quality coefficient reaches a preset threshold;

[0049] If the welding quality coefficient reaches a preset threshold, the welding quality between the pin of the LED lamp and the circuit board is determined to be standard welding;

[0050] If the welding quality coefficient does not reach the preset threshold, it is determined that the welding quality between the pin of the LED lamp and the circuit board is non-standard welding.

[0051] The present application also provides a circuit detection system for light display, comprising:

[0052] A first acquisition module is used to acquire welding characteristic information between the pins of the LED lamp and the circuit board, wherein the welding characteristic information includes welding physical characteristic information and welding on-off circuit characteristic information;

[0053] A second acquisition module is used to acquire the pin and circuit board fitting feature information, adjacent pin welding distance information and welding tin point smoothness according to the welding physical feature information, and acquire the pin welding quality according to the circuit board fitting feature information and adjacent pin welding distance information;

[0054] A first calculation module is used to calculate the physical connection characteristic index of the solder joint according to the pin soldering quality and the smoothness and flatness of the solder joint;

[0055] A third acquisition module is used to acquire circuit resistance change information and electrical performance information of the LED lamp according to the welding on-off circuit characteristic information, and acquire first welding connection characteristic information according to the circuit resistance change information;

[0056] A fourth acquisition module, used to acquire brightness information of the LED lamp and luminous color information of the LED lamp according to the electrical performance information of the LED lamp, and acquire second welding connection characteristic information according to the brightness information of the LED lamp and the luminous color information of the LED lamp;

[0057] a second calculation module, configured to perform weighted calculation according to the first welding connectivity feature information and the second welding connectivity feature information to obtain a circuit connection feature index;

[0058] A third calculation module is used to perform weighted calculation according to the physical connection characteristic index and the circuit connection characteristic index of the solder joint to obtain a soldering quality index;

[0059] The first judgment module is used to perform quality inspection and judgment on the welding between the pins of the LED lamp and the circuit board according to the welding quality index.

[0060] Preferably, the first calculation module comprises:

[0061] A first acquisition unit, configured to acquire a corresponding pin welding quality weight value according to the pin welding quality acquisition;

[0062] A second acquisition unit is used to acquire a welding error coefficient;

[0063] A third acquisition unit is used to acquire multiple height values ​​of the solder joint surface based on 3D surface scanning;

[0064] A fourth acquisition unit is used to acquire the smoothness and flatness of a preset standard soldering point;

[0065] The first calculation unit is used to calculate the physical connection characteristic index of the solder joint according to the pin soldering quality, the smoothness and flatness of the solder joint, the pin soldering quality weight value and the soldering error coefficient, wherein the calculation formula is:

[0066] ;

[0067] Where s(c) represents the physical connection characteristic index of the solder joint, f(s) represents the pin soldering quality, d represents the pin soldering quality weight value, and h i It represents the i-th height value, i represents the sequence number of the height value, i=1, 2, 3...n, n represents the number of heights, R represents the smoothness and flatness of the preset standard solder joint, and θ represents the welding error coefficient.

[0068] The present application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above method when executing the computer program.

[0069] The present application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the above method are implemented.

[0070] The beneficial effects of the present application are as follows: the present application first obtains the welding physical characteristic information and welding on-off circuit characteristic information of the pin of the LED lamp and the circuit board, and then obtains the pin and circuit board fitting characteristic information, adjacent pin welding spacing information and welding tin point smoothness and flatness according to the welding physical characteristic information, and obtains the pin welding quality according to the circuit board fitting characteristic information and the adjacent pin welding spacing information, and then calculates the solder point physical connection characteristic index according to the pin welding quality and the solder point smoothness and flatness, and then obtains the circuit resistance change information and the LED lamp electrical performance information according to the welding on-off circuit characteristic information, and obtains the circuit connection characteristic index according to the circuit resistance change information and the LED lamp electrical performance information, and then performs weighted calculation according to the solder point physical connection characteristic index and the circuit connection characteristic index to obtain the welding quality index, and finally, performs quality inspection and judgment on the welding of the pin of the LED lamp and the circuit board according to the welding quality index, so that the welding is numerically quantified by the welding quality index, and the welding of the LED light and the circuit board can be judged in a standardized manner, which can avoid the subjectivity, missed detection and misjudgment problems caused by workers' judgment. BRIEF DESCRIPTION OF THE DRAWINGS

[0071] Figure 1 A schematic diagram of a method flow chart of an embodiment of the present application.

[0072] Figure 2 A schematic diagram of the system structure of an embodiment of the present application.

[0073] Figure 3 A schematic diagram of the internal structure of a computer device according to an embodiment of the present application.

[0074] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0075] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0076] like Figure 1-3 As shown, the present application provides a circuit detection method for light display, comprising:

[0077] S1. Obtaining welding characteristic information between the pins of the LED lamp and the circuit board, wherein the welding characteristic information includes welding physical characteristic information and welding on-off circuit characteristic information;

[0078] S2, obtaining pin and circuit board fitting feature information, adjacent pin welding distance information and welding spot smoothness and flatness according to the welding physical feature information, and obtaining pin welding quality according to the circuit board fitting feature information and adjacent pin welding distance information;

[0079] S3, calculating the physical connection characteristic index of the solder joint according to the soldering quality of the pin and the smoothness and flatness of the solder joint;

[0080] S4, obtaining circuit resistance change information and electrical performance information of the LED lamp according to the welding on-off circuit characteristic information, and obtaining first welding connection characteristic information according to the circuit resistance change information;

[0081] S5. Acquire brightness information of the LED lamp and luminous color information of the LED lamp according to the electrical performance information of the LED lamp, and acquire second welding connection characteristic information according to the brightness information of the LED lamp and the luminous color information of the LED lamp;

[0082] S6. Performing weighted calculation according to the first welding connectivity feature information and the second welding connectivity feature information to obtain a circuit connection feature index;

[0083] S7, performing weighted calculation according to the physical connection characteristic index and the circuit connection characteristic index of the solder joint to obtain a soldering quality index;

[0084] S8. Perform quality inspection and judgment on the welding between the pins of the LED lamp and the circuit board according to the welding quality index.

[0085] As described in the above steps S1-S8, in the process of workers welding the LED lights to the circuit board, the workers usually use visual and experience to make subjective judgments. However, visual and experience judgments are highly subjective and prone to missed detection and misjudgment. Therefore, the present invention first obtains the welding characteristic information of the pins of the LED lamp and the circuit board, wherein the welding characteristic information includes welding physical characteristic information and welding on-off circuit characteristic information, so that the mechanical stability of the welding and the reliability of the electrical connection can be judged, and at the same time, it can provide a basis for the judgment of the welding quality. Since the quality of the soldering process of connecting the pins of the LED lamp to the circuit board determines the quality of the LED lamp, the welding process of the LED lamp and the circuit board is very important. The soldering quality of the pins and the circuit board can be determined based on the physical characteristic information of soldering. Therefore, the pin-to-circuit fitting characteristic information, the adjacent pin soldering spacing information and the smoothness and flatness of the soldering tin spot can be obtained according to the physical characteristic information of soldering. In this way, it can be judged whether the standard soldering standard is reached through the pin-to-circuit fitting characteristic information. At the same time, the adjacent pin soldering spacing information can be used to judge whether the LED lamp pins are short-circuited due to soldering during the soldering process, and the smoothness and flatness of the soldering tin spot can be used to judge whether there are quality factors such as voids and cracks in the soldering. Therefore, the pin soldering quality can be obtained according to the circuit board fitting characteristic information and the adjacent pin soldering spacing information. In this way, the physical characteristic information of soldering can be used to determine whether the pins of the LED lamps are short-circuited due to soldering during the soldering process. The physical connection status of welding can be comprehensively evaluated, and a key basis is provided for the subsequent calculation of the physical connection characteristic index of the solder joint, so as to more accurately judge the welding quality. Then, the physical connection characteristic index of the solder joint is calculated according to the pin welding quality and the smoothness and flatness of the solder joint. The physical connection characteristic index of the solder joint can quantify the quality of the welding appearance, and provide a basis for the welding quality of the pin of the LED lamp and the circuit board. Since the path between the pin of the LED lamp and the circuit board determines whether the LED lamp can be used normally, the circuit resistance change information and the electrical performance information of the LED lamp can be obtained according to the welding on-off circuit characteristic information. The circuit resistance change information can determine whether the LED lamp has changed in resistance due to welding during use, for example, resistance change caused by poor contact caused by leaky soldering, and obtain the first welding connectivity feature information based on the circuit resistance change information. The first welding connectivity feature information obtained in this way can comprehensively evaluate the electrical connection characteristics of the welding point during the circuit on-off process. Among them, circuit on-off is two electrical connection modes, the disconnection mode and the connection mode, which provide an important basis for welding quality judgment from the perspective of circuit electrical performance, and complement each other with the physical connection feature index of the solder joint, and can more comprehensively and accurately judge the welding quality. Since the brightness of the LED lamp is stable during normal operation, poor welding quality may lead to unstable current transmission, which in turn causes brightness fluctuations. The brightness fluctuations can then be used to infer fluctuations caused by welding factors such as cold soldering. On this basis, the brightness information and the luminous color information of the LED lamp are obtained based on the electrical performance information of the LED lamp. In this way, the electrical performance of the LED lamp can be used to determine whether there is a problem with the welding.And according to the brightness information of the LED lamp and the luminous color information of the LED lamp, the second welding connectivity characteristic information is obtained, so that the welding status is multi-dimensionally evaluated through the second welding connectivity characteristic information, and a comprehensive welding quality evaluation system is jointly constructed with the first welding connectivity characteristic information and the physical connection characteristic index of the solder joint to improve the accuracy of the judgment. Finally, a weighted calculation is performed according to the first welding connectivity characteristic information and the second welding connectivity characteristic information to obtain a circuit connection characteristic index. In this way, the circuit connection characteristic index can quantify the overall quality of the circuit connection from a macro perspective, and integrates the electrical characteristics of the circuit and the performance of the LED lamp, and provides an intermediate key indicator for further weighted calculation with the physical connection characteristic index of the solder joint, which is helpful for comprehensively and systematically evaluating the welding quality. Then, a weighted calculation is performed according to the physical connection characteristic index of the solder joint and the circuit connection characteristic index to obtain a welding quality index. In this way, the weighted calculation combines the physical connection characteristic index of the solder joint (focusing on the physical connection status of the solder joint) and the circuit connection characteristic index (focusing on the overall electrical connection of the circuit and the LED The welding quality index is combined with the welding quality index of the LED lamp and the circuit board to comprehensively weigh all aspects of welding quality, so that the welding quality index can more accurately reflect the comprehensive level of welding quality and avoid the one-sidedness of single factor evaluation. Its value can intuitively and quantitatively indicate the level of welding quality, providing a unified and clear standard for judging welding quality, facilitating quality control and product screening in the production process, and ensuring the consistency and reliability of product quality. Finally, the welding quality of the LED lamp pin and the circuit board is inspected and judged according to the welding quality index. Such standardized judgment of the welding of LED lamps and circuit boards can avoid the subjective, missed and misjudgment problems caused by workers' judgment.

[0086] In one embodiment, the step S3 of calculating the solder joint physical connection characteristic index according to the pin soldering quality and the solder joint smoothness and flatness includes:

[0087] S301, acquiring a corresponding pin welding quality weight value according to the pin welding quality acquisition;

[0088] S302, obtaining welding error coefficient;

[0089] S303, obtaining multiple height values ​​of the solder joint surface based on 3D surface scanning;

[0090] S304, obtaining the preset standard soldering point smoothness and flatness;

[0091] S305, calculating the solder joint physical connection characteristic index according to the pin soldering quality, solder joint smoothness, pin soldering quality weight value and soldering error coefficient, wherein the calculation formula is:

[0092] ;

[0093] Where s(c) represents the physical connection characteristic index of the solder joint, f(s) represents the pin soldering quality, d represents the pin soldering quality weight value, and h i It represents the i-th height value, i represents the sequence number of the height value, i=1, 2, 3...n, n represents the number of heights, R represents the smoothness and flatness of the preset standard solder joint, and θ represents the welding error coefficient.

[0094] As described in the above steps S301-S305, the present invention first obtains the corresponding pin welding quality weight value according to the pin welding quality. Since there are certain errors in the welding environment temperature, humidity and the technical level of the operator, it is necessary to introduce a welding error coefficient to ensure that the subsequent solder joint physical connection characteristic index calculation is more accurate. Finally, the solder joint physical connection characteristic index is calculated according to the pin welding quality, the smoothness and flatness of the welding tin point, the pin welding quality weight value and the welding error coefficient. The solder joint physical connection characteristic index obtained in this way comprehensively considers the two key physical characteristics of the pin welding quality and the smoothness and flatness of the welding tin point, as well as the weight value and the error coefficient, and can comprehensively and objectively quantify the physical connection state of the solder joint. For example, a solder joint may have good pin welding, but the surface of the tin point is not smooth and flat. Through weight distribution and comprehensive calculation, the actual situation of the solder joint in terms of the overall physical connection can be accurately reflected, avoiding misjudgment of the welding quality by focusing on a single factor. At the same time, the calculated solder joint physical connection characteristic index provides a unified quantitative indicator for welding quality evaluation, which is convenient for comparison and analysis between different solder joints or different products.

[0095] In one embodiment, the step S4 of acquiring the circuit resistance change information and the electrical performance information of the LED lamp according to the welding on-off circuit characteristic information includes:

[0096] S401, acquiring an on-off mode of an LED lamp according to the welding on-off circuit characteristic information, wherein the on-off mode of the LED lamp includes a connected mode and a disconnected mode;

[0097] S402, when in the connection mode, obtaining a first initial resistance of the LED lamp, and releasing an electronic pulse current to both ends of the LED lamp to obtain a first electronic pulse current and a first electronic pulse voltage, and calculating a first electronic pulse resistance according to the first electronic pulse current and the first electronic pulse voltage;

[0098] S403, using a first ratio between the first initial resistance and the first electronic pulse resistance as dynamic resistance change information;

[0099] S404, when in the disconnection mode, obtaining a second initial resistance of the LED lamp, and releasing an electronic pulse current to both ends of the LED lamp to obtain a second electronic pulse current and a second electronic pulse voltage, and calculating a second electronic pulse resistance according to the second electronic pulse current and the second electronic pulse voltage;

[0100] S405 , using a second ratio between the second initial resistance and the second electronic pulse resistance as static resistance change information.

[0101] As described in the above steps S401-S405, the present invention first obtains the on-off mode of the LED lamp according to the welding on-off circuit characteristic information, wherein the on-off mode of the LED lamp includes a connected mode and a disconnected mode, so that the characteristics of the welding point can be analyzed from different electric fusion connection states, which is helpful to comprehensively judge the electrical connection quality of the welding point under various working conditions. When in the connected mode, the first initial resistance of the LED lamp is obtained, and the electronic pulse current is released to both ends of the LED lamp to obtain the first electronic pulse current and the first electronic pulse voltage, and the first electronic pulse resistance is calculated according to the first electronic pulse current and the first electronic pulse voltage, and the first proportion coefficient between the first initial resistance and the first electronic pulse resistance is used as the dynamic resistance change information, so that the dynamic resistance change information can reflect the resistance response of the welding point during the normal working current change process. Under normal welding conditions, the resistance change should be within a reasonable range. If the dynamic resistance change is abnormal, such as excessive fluctuation or not in line with the expected change trend, it may indicate that the welding point has problems such as cold welding and unstable contact, thereby affecting the stability of the circuit and the normal operation of the LED lamp. This provides a basis for evaluating the electrical connection reliability of the welding point under the dynamic working state, helps to discover potential welding defects in advance, and ensures the long-term stable operation of the circuit.

[0102] When in the disconnection mode, the second initial resistance of the LED lamp is obtained, and the electronic pulse current is released at both ends of the LED lamp to obtain the second electronic pulse current and the second electronic pulse voltage, and the second electronic pulse resistance is calculated according to the second electronic pulse current and the second electronic pulse voltage. The second proportion coefficient between the second initial resistance and the second electronic pulse resistance is used as the static resistance change information. Such static resistance change information reflects the resistance of the welding point in a stable disconnection state, can be used to evaluate the basic conduction performance and stability of the welding point, provide a basis for subsequent targeted analysis and improvement, and help improve welding quality and product reliability.

[0103] In one embodiment, the step S4 of acquiring the first welding connection characteristic information according to the circuit resistance change information includes:

[0104] S406, obtaining the forward resistance and reverse resistance between the pin of the LED lamp and the circuit board according to the static resistance change information;

[0105] S407, calculating a static resistance coefficient according to the ratio of the forward resistance to the reverse resistance;

[0106] S408, obtaining a resistance waveform diagram according to the dynamic resistance change information, wherein the obtaining method is based on an oscilloscope;

[0107] S409, acquiring a plurality of waveform peak points within a preset time according to the resistance waveform diagram, and extracting the plurality of waveform peak points based on a preset first appearance to obtain a first waveform peak point;

[0108] S4010, acquiring multiple slopes of adjacent waveform peak points according to the first waveform peak point and the remaining multiple waveform peak points, and calculating an average slope according to the multiple slopes;

[0109] S4011, calculating a dynamic resistivity according to the average slope and a preset slope ratio;

[0110] S4012. Perform weighted calculation on the static resistance coefficient and the dynamic resistance coefficient to obtain a comprehensive resistance characteristic coefficient, and use the comprehensive resistance characteristic coefficient as the first welding connectivity characteristic information.

[0111] As described in the above steps S406-S4012, since the on-off of the LED lamp and the circuit board is also one of the requirements for welding quality, and the circuit resistance change information can be decomposed into static and dynamic parts, it is helpful to more comprehensively understand the resistance characteristics of the welding point under different working conditions. The static resistance change information reflects the resistance of the welding point in a stable state, which can be used to evaluate the basic conduction performance and stability of the welding point; the dynamic resistance change information reveals the resistance response of the welding point during the current change process. At the same time, different types of welding defects may show different characteristics in static and dynamic resistance changes. For example, a cold solder joint may cause an increase in static resistance, and in a dynamic situation, due to unstable contact, the resistance fluctuation will be more obvious; a short circuit may cause an abnormal decrease in static resistance, and the dynamic resistance change will also deviate from the normal range. By obtaining the static and dynamic resistance change information respectively, various welding problems can be more accurately identified and distinguished, providing a basis for subsequent targeted analysis and improvement. In this way, the resistance characteristics can be fully understood. Since forward resistance and reverse resistance are the main indicators of LED The forward resistance and reverse resistance between the pin of the LED lamp and the circuit board can be obtained according to the static resistance change information. Under normal circumstances, the LED lamp should have a small forward resistance when forward biased to ensure that the current can pass smoothly to make it emit light; and when reverse biased, the reverse resistance should be large enough to prevent the reverse current from being too large to damage the device or affect the normal operation of the circuit. By measuring these two resistance values, the soldering point can be directly evaluated for the LED. The influence of the unidirectional conductive performance of the lamp can be used to determine whether welding has caused changes in device characteristics. Conversely, abnormal forward or reverse resistance values ​​can indicate specific types of welding defects. If the forward resistance is too large, it may indicate that there is poor contact between the pin and the pad, such as oxide layer, dirt or loose welding, which hinders the normal conduction of current; if the reverse resistance is too small, it may indicate the existence of reverse leakage or short circuit, which may be caused by tin slag short circuit, insulation damage between pins and other reasons during welding. In this way, the quality of the LED lamp can be comprehensively judged by the change of resistance, and then the static resistance coefficient is calculated according to the ratio of the forward resistance and the reverse resistance. In this way, the welding quality can be quantified by the static resistance coefficient. For example, if the static resistance coefficient is within the preset reasonable range, it means that the welding process is relatively stable and the product quality has high reliability.On the contrary, if the static resistance coefficient is greatly different, it indicates that there may be fluctuations in the welding process or poor welding of individual products. Then, a resistance waveform diagram is obtained according to the dynamic resistance change information, wherein the acquisition method is based on an oscilloscope, and then a plurality of waveform peaks within a preset time are obtained according to the resistance waveform diagram, and the plurality of waveform peaks are extracted based on the preset first appearance to obtain the first waveform peak. The first waveform peak is used as a reference mark for subsequent analysis of the initial state of the waveform change. Then, a plurality of slopes of adjacent waveform peaks are obtained according to the first waveform peak and the remaining plurality of waveform peaks, and the stability of the waveform can be judged by the plurality of slopes of adjacent waveform peaks. Since the normal resistance waveform is regular and stable, if abnormal fluctuations occur at high frequencies, it indicates that there is a problem with the electrical performance of the welding. Then, an average slope is calculated according to the plurality of slopes. Finally, the dynamic resistance coefficient is calculated according to the ratio of the average slope to the preset slope. The dynamic resistance coefficient can quantify the degree of deviation of the welding point from the ideal state or standard requirements in terms of dynamic resistance change by comparing the average slope with the preset slope. The preset slope can be calculated according to the circuit design and LED The normal working characteristics of the lamp are determined. The closer the dynamic resistance coefficient is to 1, the more the dynamic resistance change of the welding point is in line with expectations, and the better the welding quality is. On the contrary, if the dynamic resistance coefficient deviates greatly from 1, it indicates that there is an abnormality in the dynamic working process of the welding point. Then, the static resistance coefficient and the dynamic resistance coefficient are weighted to obtain a comprehensive resistance characteristic coefficient, and the comprehensive resistance characteristic coefficient is used as the first welding connectivity characteristic information. The comprehensive resistance characteristic coefficient combines the static resistance coefficient and the dynamic resistance coefficient through weighted calculation, and comprehensively considers the resistance characteristics of the welding point in both static and dynamic working states. It can more accurately and comprehensively reflect the comprehensive impact of the welding point on circuit connectivity and electrical performance, avoids the one-sidedness that may be caused by relying solely on a single resistance characteristic to judge the welding quality, and provides a quantitative indicator for accurately evaluating the welding quality. ;

[0112] In one embodiment, the step S5 of acquiring the second welding connection characteristic information according to the brightness information of the LED lamp and the luminous color information of the LED lamp comprises:

[0113] S501, acquiring a plurality of brightness values ​​within a preset time according to the brightness information of the LED lamp, and acquiring a plurality of brightness fluctuation change rates between adjacent brightness values ​​according to the plurality of brightness values;

[0114] S502, calculating an average brightness fluctuation change rate according to the plurality of brightness fluctuation change rates, and calculating a brightness fluctuation coefficient according to a ratio of the average brightness fluctuation change rate to a preset standard brightness fluctuation change rate;

[0115] S503, acquiring spectrum information within a preset time according to the luminous color information of the LED lamp, and analyzing the wavelength of the spectrum information based on a spectrometer to obtain a spectrum wavelength;

[0116] S504, calculating a wavelength difference coefficient according to a ratio of the spectrum wavelength to a preset spectrum wavelength;

[0117] S505. Weight the brightness fluctuation coefficient and the wavelength difference coefficient to calculate the light emitting characteristic coefficient of the LED lamp, and use the light emitting characteristic coefficient of the LED lamp as the second welding connectivity characteristic information.

[0118] As described in the above steps S501-S505, since the luminous characteristics of the LED lamp can also reflect the quality of welding, the present invention first obtains multiple brightness values ​​within a preset time according to the brightness information of the LED lamp, and obtains multiple brightness fluctuation change rates between adjacent brightness values ​​according to the multiple brightness values, and then calculates the average brightness fluctuation change rate according to the multiple brightness fluctuation change rates, and calculates the brightness fluctuation coefficient according to the ratio of the average brightness fluctuation change rate and the preset standard brightness fluctuation change rate. In this way, the brightness fluctuation coefficient can intuitively display the deviation of the brightness fluctuation degree of the current LED lamp from the standard requirement, and provides a unified indicator for quantitatively evaluating the brightness stability. Then, according to the luminous color information of the LED lamp, the spectrum information within the preset time is obtained, and the wavelength of the spectrum information is analyzed based on the spectrometer to obtain the spectrum wavelength. Since the welding quality problem may change the electrical environment inside the LED lamp, thereby affecting its luminous wavelength and color, for example, overcurrent or overheating during the welding process may cause the physical structure or material properties inside the LED chip to change, thereby causing the luminous wavelength to shift and the color to deviate. By monitoring the spectrum wavelength, these color change problems caused by welding can be discovered in time, which is useful for evaluating the impact of welding quality on the LED. The influence of the optical performance of the light is provided with key data, and then the wavelength difference coefficient is calculated according to the ratio of the spectral wavelength to the preset spectral wavelength. Finally, the brightness fluctuation coefficient and the wavelength difference coefficient are weighted to calculate the luminous characteristic coefficient of the LED lamp, and the luminous characteristic coefficient of the LED lamp is used as the second welding connectivity characteristic information. The second welding connectivity characteristic information can provide a multi-dimensional quantitative indicator for evaluating the welding quality of the LED lamp pin and the circuit board.

[0119] In one embodiment, the step S8 of performing quality inspection and judgment on the welding between the pin of the LED lamp and the circuit board according to the welding quality index includes:

[0120] S801, obtain standard welding quality index;

[0121] S802, inputting the welding quality index and the standard welding quality index into a quality comparison model to obtain a welding quality coefficient, wherein the function formula of the quality comparison model is:

[0122] ;

[0123] Among them, Q represents the welding quality coefficient, B(z) represents the welding quality index, and Y(S) represents the standard welding quality index;

[0124] S803, determining whether the welding quality coefficient reaches a preset threshold;

[0125] If the welding quality coefficient reaches a preset threshold, the welding quality between the pin of the LED lamp and the circuit board is determined to be standard welding;

[0126] If the welding quality coefficient does not reach the preset threshold, it is determined that the welding quality between the pin of the LED lamp and the circuit board is non-standard welding.

[0127] As described in the above steps S801-S803, the present invention obtains a standard welding quality index, and then inputs the welding quality index and the standard welding quality index into a quality comparison model to obtain a welding quality coefficient, and then determines whether the welding quality coefficient reaches 1. If the welding quality coefficient reaches 1, it is determined that the welding quality between the pin of the LED lamp and the circuit board is standard welding. If the welding quality coefficient does not reach 1, it is determined that the welding quality between the pin of the LED lamp and the circuit board is non-standard welding. In this way, the welding is numerically quantified through the welding quality coefficient, and the welding of the LED lamp and the circuit board can be judged in a standardized manner, which can avoid the subjectivity, missed detection and misjudgment problems caused by workers' judgment.

[0128] The present application also provides a circuit detection system for light display, comprising:

[0129] The first acquisition module 1 is used to acquire the welding characteristic information between the pins of the LED lamp and the circuit board, wherein the welding characteristic information includes welding physical characteristic information and welding on-off circuit characteristic information;

[0130] The second acquisition module 2 is used to obtain the pin and circuit board fitting feature information, the adjacent pin welding distance information and the smoothness and flatness of the welding tin point according to the welding physical feature information, and obtain the pin welding quality according to the circuit board fitting feature information and the adjacent pin welding distance information;

[0131] A first calculation module 3, used to calculate the physical connection characteristic index of the solder joint according to the pin soldering quality and the smoothness and flatness of the solder joint;

[0132] A third acquisition module 4 is used to acquire circuit resistance change information and electrical performance information of the LED lamp according to the welding on-off circuit characteristic information, and acquire first welding connection characteristic information according to the circuit resistance change information;

[0133] A fourth acquisition module 5, used to acquire the brightness information of the LED lamp and the luminous color information of the LED lamp according to the electrical performance information of the LED lamp, and acquire the second welding connection characteristic information according to the brightness information of the LED lamp and the luminous color information of the LED lamp;

[0134] A second calculation module 6, configured to perform weighted calculation according to the first welding connectivity feature information and the second welding connectivity feature information to obtain a circuit connection feature index;

[0135] A third calculation module 7, used for performing weighted calculation according to the physical connection characteristic index and the circuit connection characteristic index of the solder joint to obtain a soldering quality index;

[0136] The first judgment module 8 is used to perform quality inspection and judgment on the welding between the pins of the LED lamp and the circuit board according to the welding quality index.

[0137] In one embodiment, the first computing module includes:

[0138] A first acquisition unit, configured to acquire a corresponding pin welding quality weight value according to the pin welding quality acquisition;

[0139] A second acquisition unit is used to acquire a welding error coefficient;

[0140] A third acquisition unit is used to acquire multiple height values ​​of the solder joint surface based on 3D surface scanning;

[0141] A fourth acquisition unit is used to acquire the smoothness and flatness of a preset standard soldering point;

[0142] The first calculation unit is used to calculate the physical connection characteristic index of the solder joint according to the pin soldering quality, the smoothness and flatness of the solder joint, the pin soldering quality weight value and the soldering error coefficient, wherein the calculation formula is:

[0143] ;

[0144] Where s(c) represents the physical connection characteristic index of the solder joint, f(s) represents the pin soldering quality, d represents the pin soldering quality weight value, and h i It represents the i-th height value, i represents the sequence number of the height value, i=1, 2, 3...n, n represents the number of heights, R represents the smoothness and flatness of the preset standard solder joint, and θ represents the welding error coefficient.

[0145] The present invention also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the circuit detection method for light display described in any of the above embodiments is implemented.

[0146] The present invention also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the circuit detection method for light display described in any of the above embodiments when executing the computer program.

[0147] Those of ordinary skill in the art can understand that the implementation of all or part of the process in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the process of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media provided in this application and used in the embodiments may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0148] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0149] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A circuit detection method for light display, characterized in that: include: Obtaining welding characteristic information between the pins of the LED lamp and the circuit board, wherein the welding characteristic information includes welding physical characteristic information and welding on-off circuit characteristic information; According to the welding physical characteristic information, the pin and circuit board fitting characteristic information, the adjacent pin welding distance information and the smoothness and flatness of the welding tin point are obtained, and the pin welding quality is obtained according to the circuit board fitting characteristic information and the adjacent pin welding distance information; Calculating a solder joint physical connection characteristic index according to the pin soldering quality and the solder joint smoothness and flatness; Acquire circuit resistance change information and electrical performance information of the LED lamp according to the welding on-off circuit characteristic information, and acquire first welding connection characteristic information according to the circuit resistance change information; Acquire the brightness information of the LED lamp and the luminous color information of the LED lamp according to the electrical performance information of the LED lamp, and acquire the second welding connection characteristic information according to the brightness information of the LED lamp and the luminous color information of the LED lamp; Performing weighted calculation according to the first welding connectivity feature information and the second welding connectivity feature information to obtain a circuit connection feature index; Performing weighted calculation according to the physical connection characteristic index and the circuit connection characteristic index of the solder joint to obtain a soldering quality index; The welding quality between the pins of the LED lamp and the circuit board is inspected and judged according to the welding quality index.

2. The circuit detection method for light display according to claim 1, characterized in that: The step of calculating the solder joint physical connection characteristic index according to the pin soldering quality and the solder joint smoothness and flatness comprises: Obtaining a corresponding pin welding quality weight value according to the pin welding quality; Get welding error coefficient; Get multiple height values ​​of the solder joint surface based on 3D surface scanning; Obtain the preset standard soldering point smoothness and flatness; The physical connection characteristic index of the solder joint is calculated according to the pin soldering quality, the smoothness and flatness of the solder joint, the pin soldering quality weight value and the soldering error coefficient, wherein the calculation formula is: ； Where s(c) represents the physical connection characteristic index of the solder joint, f(s) represents the pin soldering quality, d represents the pin soldering quality weight value, and h i It represents the i-th height value, i represents the sequence number of the height value, i=1, 2, 3...n, n represents the number of heights, R represents the smoothness and flatness of the preset standard solder joint, and θ represents the welding error coefficient.

3. The circuit detection method for light display according to claim 1, characterized in that: The step of acquiring circuit resistance change information and electrical performance information of the LED lamp according to the welding on-off circuit characteristic information comprises: Acquire an on-off mode of the LED lamp according to the welding on-off circuit characteristic information, wherein the on-off mode of the LED lamp includes a connected mode and a disconnected mode; When in the connection mode, obtaining a first initial resistance of the LED lamp, releasing an electronic pulse current to both ends of the LED lamp, obtaining a first electronic pulse current and a first electronic pulse voltage, and calculating a first electronic pulse resistance according to the first electronic pulse current and the first electronic pulse voltage; using a first ratio between the first initial resistance and the first electronic pulse resistance as dynamic resistance change information; When in the disconnection mode, obtaining a second initial resistance of the LED lamp, releasing an electronic pulse current to both ends of the LED lamp, obtaining a second electronic pulse current and a second electronic pulse voltage, and calculating a second electronic pulse resistance according to the second electronic pulse current and the second electronic pulse voltage; A second ratio between the second initial resistance and the second electronic pulse resistance is used as static resistance change information.

4. The circuit detection method for light display according to claim 3, characterized in that: The step of acquiring first welding connection characteristic information according to the circuit resistance change information comprises: Obtain the forward resistance and reverse resistance between the pin of the LED lamp and the circuit board according to the static resistance change information; Calculating a static resistivity according to a ratio of the forward resistance to the reverse resistance; Acquire a resistance waveform diagram according to the dynamic resistance change information, wherein the acquisition method is based on oscilloscope acquisition; Acquire multiple waveform peak points within a preset time according to the resistance waveform diagram, and extract the multiple waveform peak points based on the preset first appearance to obtain the first waveform peak point; Acquire multiple slopes of adjacent waveform peak points according to the first waveform peak point and the remaining multiple waveform peak points, and calculate an average slope according to the multiple slopes; Calculating a dynamic resistivity according to the average slope and a preset slope ratio; The static resistance coefficient and the dynamic resistance coefficient are weightedly calculated to obtain a comprehensive resistance characteristic coefficient, and the comprehensive resistance characteristic coefficient is used as the first welding connection characteristic information.

5. The circuit detection method for light display according to claim 1, characterized in that: The step of acquiring the second welding connection characteristic information according to the brightness information of the LED lamp and the luminous color information of the LED lamp comprises: Acquire multiple brightness values ​​within a preset time according to the brightness information of the LED lamp, and acquire multiple brightness fluctuation change rates between adjacent brightness values ​​according to the multiple brightness values; Calculating an average brightness fluctuation change rate according to the plurality of brightness fluctuation change rates, and calculating a brightness fluctuation coefficient according to a ratio of the average brightness fluctuation change rate to a preset standard brightness fluctuation change rate; Acquire spectrum information within a preset time according to the luminous color information of the LED lamp, and analyze the wavelength of the spectrum information based on a spectrometer to obtain the spectrum wavelength; Calculate the wavelength difference coefficient according to the ratio of the spectrum wavelength to the preset spectrum wavelength; The brightness fluctuation coefficient and the wavelength difference coefficient are weighted to calculate the light emission characteristic coefficient of the LED lamp, and the light emission characteristic coefficient of the LED lamp is used as the second welding connection characteristic information.

6. The circuit detection method for light display according to claim 1, characterized in that: The step of performing quality inspection and judgment on the welding between the pin of the LED lamp and the circuit board according to the welding quality index comprises: Obtain standard welding quality index; The welding quality index and the standard welding quality index are input into the quality comparison model to obtain the welding quality coefficient, wherein the function formula of the quality comparison model is: ； Among them, Q represents the welding quality coefficient, B(z) represents the welding quality index, and Y(S) represents the standard welding quality index; Determining whether the welding quality coefficient reaches a preset threshold; If the welding quality coefficient reaches a preset threshold, the welding quality between the pin of the LED lamp and the circuit board is determined to be standard welding; If the welding quality coefficient does not reach the preset threshold, it is determined that the welding quality between the pin of the LED lamp and the circuit board is non-standard welding.

7. A circuit detection system for light display, characterized in that: include: A first acquisition module is used to acquire welding characteristic information between the pins of the LED lamp and the circuit board, wherein the welding characteristic information includes welding physical characteristic information and welding on-off circuit characteristic information; A second acquisition module is used to acquire the pin and circuit board fitting feature information, adjacent pin welding distance information and welding tin point smoothness according to the welding physical feature information, and acquire the pin welding quality according to the circuit board fitting feature information and adjacent pin welding distance information; A first calculation module is used to calculate the physical connection characteristic index of the solder joint according to the pin soldering quality and the smoothness and flatness of the solder joint; A third acquisition module is used to acquire circuit resistance change information and electrical performance information of the LED lamp according to the welding on-off circuit characteristic information, and acquire first welding connection characteristic information according to the circuit resistance change information; A fourth acquisition module, used to acquire brightness information of the LED lamp and luminous color information of the LED lamp according to the electrical performance information of the LED lamp, and acquire second welding connection characteristic information according to the brightness information of the LED lamp and the luminous color information of the LED lamp; a second calculation module, configured to perform weighted calculation according to the first welding connectivity feature information and the second welding connectivity feature information to obtain a circuit connection feature index; A third calculation module is used to perform weighted calculation according to the physical connection characteristic index and the circuit connection characteristic index of the solder joint to obtain a soldering quality index; The first judgment module is used to perform quality inspection and judgment on the welding between the pins of the LED lamp and the circuit board according to the welding quality index.

8. The circuit detection system for light display according to claim 7, characterized in that: The first computing module comprises: A first acquisition unit, used to acquire a corresponding pin welding quality weight value according to the pin welding quality; A second acquisition unit is used to acquire a welding error coefficient; A third acquisition unit is used to acquire multiple height values ​​of the solder joint surface based on 3D surface scanning; A fourth acquisition unit is used to acquire the smoothness and flatness of a preset standard soldering point; The first calculation unit is used to calculate the physical connection characteristic index of the solder joint according to the pin soldering quality, the smoothness and flatness of the solder joint, the pin soldering quality weight value and the soldering error coefficient, wherein the calculation formula is: ； Where s(c) represents the physical connection characteristic index of the solder joint, f(s) represents the pin soldering quality, d represents the pin soldering quality weight value, and h i It represents the i-th height value, i represents the sequence number of the height value, i=1, 2, 3...n, n represents the number of heights, R represents the smoothness and flatness of the preset standard solder joint, and θ represents the welding error coefficient.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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