Hot plate air supply and exhaust device for improving thickness uniformity of coating film

Abstract

The invention discloses a hot plate air supply and exhaust device for improving the thickness uniformity of a coating film, and the device comprises a heating cavity which is used for heating a to-be-treated substrate; the exhaust module comprises an exhaust collecting box, the exhaust collecting box is arranged on one side of the heating cavity, a plurality of exhaust holes are formed in the exhaust collecting box, and the exhaust holes are communicated with the interior of the heating cavity; the air inlet module is arranged opposite to the air exhaust module and arranged on the other side of the heating cavity, the air inlet module comprises a baffle, the baffle is arranged on the side, away from the air exhaust collecting box, of the heating cavity, an air inlet gap is formed between the baffle and the heating cavity, and the baffle is arranged in the air inlet gap. The air inlet gap is communicated with the heating cavity; an exhaust space extending in the horizontal direction is formed between the air inlet gap and the exhaust hole. By means of the scheme, the non-uniformity of the thickness of a coating film in the wafer coating process can be optimized.

Description

Technical Field

[0001] The invention relates to the technical field of wafer heating treatment technology in the semiconductor industry, and in particular to a hot plate air supply and exhaust device for improving the uniformity of coating film thickness. Background Art

[0002] In the semiconductor industry or flat-panel liquid crystal display industry, the processed substrate needs to go through a complex process. In this complex and lengthy process, the various complex circuit structures designed by the chip are transferred to the substrate through the photolithography process (adhesion enhancement, glue coating, baking, cooling, exposure, etc.). In the process of realizing the transfer of this complex logic circuit, the photoresist in the photolithography process plays an important role. In the photolithography process, it is necessary to coat the surface of the wafer with photoresist, and then heat and cure the photoresist so that the photoresist on the surface of the wafer forms a uniform and stable film, thereby improving the chemical resistance and mechanical strength of the wafer. Since the photoresist is a photosensitive substance, which contains a large amount of liquids such as organic solvents and photosensitizers, the coated photoresist needs to be processed and baked during the photolithography process. In this heating and baking process, the above-mentioned organic solvents are baked and volatilized by using a heating unit. At the same time, a large amount of other granular objects will be volatilized in the photoresist during this process. The objects excluded in this process are collectively referred to as "volatiles".

[0003] Since the photolithography process involves the use of photosensitive materials to accurately transfer circuit patterns onto silicon wafers, for thicker photoresist layers (>5μm), such as polyimide (PI), non-volatile organic solvents (such as N-methylpyrrolidone, NMP) are usually used as photoresist solvents. After the spin coating process, the coating film formed on the wafer needs to be heat treated to promote the volatilization of the solvent and the curing of the photoresist. The heat treatment depends not only on the temperature setting of the hot plate, but also on the airflow inside the hot plate. Airflow plays a key role in the heat treatment process. If the air supply and exhaust system of the hot plate is not designed properly, it will cause internal airflow turbulence, which directly affects the uniformity and thickness consistency of the photoresist layer. Uneven airflow can cause uneven volatilization rates of the photoresist solvent in certain areas, resulting in non-uniform curing effects and film thickness distribution.

[0004] Therefore, it is necessary to provide a hot plate air supply and exhaust device that improves the uniformity of coating film thickness to solve the above-mentioned problems existing in the prior art. Summary of the invention

[0005] The object of the present invention is to provide a hot plate air supply and exhaust device for improving the uniformity of coating film thickness, so as to optimize the non-uniformity of coating film thickness during wafer coating process.

[0006] To achieve the above object, the technical solution of the present invention is as follows: The present invention provides a hot plate air supply and exhaust device for improving the uniformity of coating film thickness, comprising: A heating chamber, used for heating the substrate to be processed; An exhaust module, comprising an exhaust collection box, the exhaust collection box being arranged at one side of the heating cavity, the exhaust collection box being provided with a plurality of exhaust holes, the exhaust holes being communicated with the interior of the heating cavity; an air inlet module, arranged opposite to the air exhaust module and arranged on the other side of the heating cavity, the air inlet module comprising a baffle, the baffle being arranged on a side of the heating cavity away from the exhaust air collection box, an air inlet gap being formed between the baffle and the heating cavity, and the air inlet gap being in communication with the heating cavity; Wherein, an exhaust space extending in a horizontal direction is formed between the air inlet gap and the exhaust hole.

[0007] The beneficial effects of the fluid supply device provided by the present invention are: The present invention achieves a more balanced airflow distribution by optimizing the structural design of exhaust and air intake. The exhaust module and the air intake module are arranged relative to each other, and the exhaust space extending in the horizontal direction is formed between the air intake gap and the exhaust hole, so that the airflow in the entire heating cavity can flow evenly, avoiding the problem in the existing technology that the airflow often produces a large wind speed at the exhaust end due to improper design of the flow space, while the wind speed in the area far away from the exhaust end is small, which leads to uneven volatilization of the solvent after coating, and finally affects the consistency of the film thickness. By adopting the above technical solution, it is ensured that the airflow field in the hot plate is evenly distributed under the premise of supply and exhaust balance in the heat treatment process, so that the wafer is evenly subjected to the heat treatment process, thereby ensuring the film thickness result after coating, and avoiding the inclined morphology of the side contour of the film thickness after the coating process.

[0008] Furthermore, the air inlet gap includes a first gap and a second gap, the first gap is located between the baffle and the heating cavity, and the second gap is opened along the horizontal extension direction of the baffle.

[0009] Furthermore, a substrate inlet is provided on one side of the heating cavity close to the baffle, and a side surface of the exhaust collection box close to the substrate inlet is recessed, and the recessed direction of the exhaust collection box is away from the substrate inlet.

[0010] Furthermore, the exhaust collection box is provided with guide plates, which are symmetrically arranged on both sides of the exhaust collection box and are respectively located on both sides of the bottom surface of the heating cavity and extend in a direction close to the substrate inlet.

[0011] Furthermore, an air equalizing plate is provided in the inner cavity of the exhaust collection box, and the air equalizing plate divides the inner cavity of the exhaust collection box into a first space located close to the direction of the substrate entrance port and a second space located away from the direction of the substrate entrance port, and a plurality of air equalizing holes are evenly arranged on the air equalizing plate.

[0012] Furthermore, a docking pipe connection port is provided on the side of the exhaust collection box away from the substrate entrance port, and the docking pipe connection port is arranged in the middle position of the side of the exhaust collection box away from the substrate entrance port, and the docking pipe connection port is connected to one end of the exhaust main pipe docking pipe, and the other end of the exhaust main pipe docking pipe is connected to an external exhaust outlet.

[0013] Furthermore, the exhaust collection box includes a first exhaust plate, a second exhaust plate and a third exhaust plate connected in sequence, the exhaust holes are evenly arranged on the first exhaust plate, the second exhaust plate and the third exhaust plate, the second exhaust plate is parallel to the baffle plate, and the first baffle plate and the third baffle plate are inclined away from the heating cavity.

[0014] Furthermore, the air inlet gap is in the shape of a rectangular hole or a circular hole.

[0015] Furthermore, it also includes a lifting member, the lifting member has a driving end, the driving end is connected to the baffle, and the lifting member is used to drive the baffle to move in the height direction.

[0016] Furthermore, the first gap size is 0.1 mm-20 mm, and the second gap size is 0.1 mm-10 mm.

[0017] Furthermore, the number of the air inlet gaps is not less than two, and / or the number of the air inlet gap is one. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present invention; Figure 2 is a schematic diagram of a discharge module according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of an exhaust collection box according to an embodiment of the present invention; Figure 4 It is a schematic diagram of the baffle structure in the prior art; Figure 5 This is a schematic diagram of the baffle structure of an embodiment of the present invention; Figure 6 This is a graph of film thickness in an existing experiment; Figure 7 This is a graph of the experimental film thickness of an embodiment of the present invention.

[0019] Figure numerals: 1. Heating cavity; 11. Substrate inlet; 12. Heating unit; 2. Exhaust module; 21. Exhaust collection box; 212. Exhaust hole; 213. Butt-joint pipe connection port; 214. Exhaust main pipe butt-joint pipe; 215. Guide plate; 216. Wind uniforming plate; 217. Wind uniforming hole; 218. First space; 219. Second space; 3. Air inlet module; 31. Baffle; 32. First gap; 33. Second gap; 4. Lifting member; 5. Transfer module. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0021] The specific implementation modes of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0022] like Figure 1-Figure 5 As shown, a hot plate air supply and exhaust device for improving the uniformity of coating film thickness includes a heating chamber 1, an exhaust module 2 and an air inlet module 3.

[0023] The heating chamber 1 is hollow inside, and a heating unit 12 is arranged at the bottom of the heating chamber 1, and the heating unit 12 is used to heat the substrate to be processed inside the heating chamber 1. A substrate entrance 11 is opened on one side of the heating chamber 1, and the substrate to be processed enters the substrate entrance 11.

[0024] The heating unit 12 can be heated by a heating wire, which is suitable for rapid heating and easy to control the temperature by using the principle of heating resistance after power is turned on. In other embodiments, a heating element made of ceramic material can also be used. The heating element made of ceramic material has good thermal stability and uniformity and is suitable for long-term use.

[0025] The exhaust module 2 includes an exhaust collection box 21, which is arranged on one side of the heating chamber 1. The exhaust collection box 21 is provided with a plurality of exhaust holes 212, and the exhaust holes 212 are interconnected with the inside of the heating chamber 1. Through the reasonable position and number of the exhaust holes 212, the turbulence and eddy currents caused by the exhaust of air can be reduced. If the turbulence and eddy currents are not controlled, uneven air pressure will be generated on the surface of the substrate, thereby affecting the thickness uniformity of the coating film. By optimizing the design of the exhaust module 2, it can be ensured that the airflow is smoother when discharged, reducing the interference with the dynamics of the airflow during the coating process.

[0026] An inner cover is provided in the heating cavity 1, and the inner cover is provided on the inner side of the main body of the heating cavity 1. The bottom surface of the inner cover is sealed to the top surface of the exhaust air collection box 21, and the outer side surface of the exhaust air collection box 21 is sealed to the inner side surface of the main body of the heating cavity 1. This ensures the effective use of heat energy inside the heating cavity 1. This design not only helps maintain the temperature balance in the heating cavity, but also prevents the ineffective loss of heat energy, thereby improving the thermal efficiency of the entire system.

[0027] The air inlet module 3 is arranged opposite to the exhaust module 2 and is arranged on the other side of the heating chamber 1. The air inlet module 3 includes a baffle 31. The baffle 31 is arranged on the side of the heating chamber 1 away from the exhaust collection box 21, and is specifically arranged at a position corresponding to the substrate inlet 11. An air inlet gap is formed between the baffle 31 and the heating chamber 1, and the air inlet gap is connected to the heating chamber 1. Among them, an exhaust space extending in the horizontal direction is formed between the air inlet gap and the exhaust hole 212. The exhaust space is arranged in the horizontal direction, which can effectively guide the hot air to flow evenly over the surface of the substrate. This design allows the airflow from the air inlet end to the exhaust end to maintain a relatively consistent speed, which helps to reduce the difference in airflow speed near the exhaust end and away from the exhaust end. When the airflow is evenly distributed on the substrate, it can effectively prevent the side profile of the film thickness after the coating process from being inclined due to uneven airflow speed.

[0028] Reference Figure 4 In the prior art, the heat treatment device after coating is usually a side exhaust structure, and during the heat treatment process, the baffle 31 is closed and a certain distance gap is left above the wafer to maintain the air pressure balance. However, this method does not take into account the balance of the air flow field. During the heat treatment process, the air flow speed near the exhaust end is high, and the air flow speed away from the exhaust end is low, which will cause the side profile of the film thickness after the coating process to be inclined, seriously affecting the uniformity of the film thickness.

[0029] In some embodiments of the present invention, the air inlet gap includes a first gap 32 and a second gap 33, the first gap 32 is located between the baffle 31 and the heating chamber 1, and the second gap 33 is opened along the horizontal extension direction of the baffle 31. In some embodiments of the present invention, the shape of the air inlet gap can be a rectangular hole or a circular hole, etc., and the shape is not specifically limited here. The setting of the first gap 32 and the second gap 33 allows the airflow to be evenly distributed during the heat treatment process, thereby reducing the difference in wind speed between the exhaust end and the exhaust end. This balance of airflow can effectively prevent the tilted morphology of the film thickness after the coating process and improve the uniformity of the film thickness. In some embodiments of the present invention, the size of the first gap 32 is 0.1mm-20mm, and the size of the second gap 33 is 0.1mm-10mm.

[0030] In other embodiments of the present invention, the number of the air inlet gaps is not limited and may be single or multiple.

[0031] By the relative arrangement of the exhaust module 2 and the air inlet module 3 and the provision of an air inlet gap, the airflow forms a more balanced flow inside the hot plate compared to the prior art.

[0032] In other embodiments of the present invention, a lifting member 4 is also included, and the lifting member 4 has a driving end, and the driving end is connected to the baffle 31, and the lifting member 4 is used to drive the baffle 31 to move in the height direction. In this embodiment, the lifting member 4 adopts an electric lift. The lift is composed of a motor, a transmission system and a lifting platform. The motor drives the lifting platform to move in the vertical direction through gear transmission. One end of the lifting platform is connected to the baffle 31, and the baffle 31 can be smoothly lifted and lowered under the drive of the motor. The control system of the electric lift can achieve precise control of the lifting height by setting a height sensor and a limit switch. In other embodiments of the present invention, the lifting member can also adopt a pneumatic cylinder. The pneumatic cylinder pushes the piston through the pressure provided by the air source, thereby driving the baffle 31 connected thereto to move up and down. In this embodiment, there is almost no structural design that blocks the airflow in the heating chamber 1 between the lifting member 4 and the exhaust collection box 21, so the airflow supplemented from the substrate inlet 11 into the heating chamber 1 is a stable flow state without turbulent process, so the volatiles can smoothly enter the exhaust collection box 21 along the airflow. In addition, the lifting member 4 can cooperate with the baking process to realize logical judgment lifting action under the control of an external controller. When required by some processes, after all volatiles are discharged, the lifting baffle 31 is set to be lifted at the end of heating to form a closed state in the heating cavity 1 to prevent external airflow from affecting the internal state of the heating cavity 1.

[0033] In some embodiments of the present invention, the side of the exhaust collection box 21 near the substrate inlet 11 is recessed in a direction away from the substrate inlet 11 and surrounds the outside of the heating unit 12 in the heating chamber 1. In this embodiment, the side of the exhaust collection box 21 near the substrate inlet 11 is recessed in a trapezoidal notch to achieve an embracing design, which is as close to the heating unit 12 as possible, so that the exhaust collection box 21 is at a higher temperature, reducing the possibility of volatiles condensing on the surface of the exhaust collection box 21 and blocking the exhaust holes 212, and the effect of extending the cleanliness of the exhaust collection box 21 is achieved through structural design. The exhaust collection box 21 is provided with a guide plate 215, and two guide plates 215 are provided. The two guide plates 215 are respectively located on both sides of the heating unit 12 and extend in a direction close to the substrate inlet 11. The provision of the guide plate 215 can play a role in better guiding the airflow and improve the exhaust efficiency.

[0034] Specifically, in some embodiments of the present invention, a uniform wind plate 216 is provided in the inner cavity of the exhaust collection box 21, and the uniform wind plate 216 divides the inner cavity of the exhaust collection box 21 into a first space 218 located in the direction close to the substrate entrance port 11 and a second space 219 located in the direction away from the substrate entrance port 11, and a plurality of uniform wind holes 217 are evenly opened on the uniform wind plate 216. The length direction of the uniform wind plate 216 is perpendicular to the direction in which the substrate enters and exits the heating chamber 1. By providing a uniform wind baffle 31 with uniform wind holes 217 in the exhaust collection box 21, the airflow in the exhaust collection box 21 passes from the first space 218 to the second space 219, and the slight negative pressure generated at the uniform wind plate 216 can be uniformized, further ensuring that the entire surface of the substrate can be covered by the airflow.

[0035] In some other embodiments of the present invention, a transfer module 5 is also included, and the transfer module 5 is located outside the heating chamber 1. The transfer module 5 is used to transfer the substrate from the outside through the substrate entrance 11 to the inside of the heating chamber 1 to be heated by the heating unit 12. Specifically, the transfer module 5 is designed as a closed channel to ensure that the impact of the external environment on the substrate is minimized during the substrate transfer process. A constant temperature pipeline is arranged inside the transfer module 5, and the constant temperature pipeline performs subsequent cooling treatment on the heated substrate through a circulating medium. Specifically, the fluid in the constant temperature pipeline can be maintained within a set temperature range, so that the substrate is cooled in advance after entering the heating chamber 1 for heating and before the next step is carried out, thereby reducing the cooling time of the substrate and improving the subsequent processing efficiency. The structure of the transfer module 5 adopts a streamlined design to reduce airflow resistance and ensure smooth passage of the substrate. At the same time, sealing devices are provided at the entrance and exit of the transfer module 5 to prevent heat loss and the entry of external contaminants.

[0036] In other embodiments of the present invention, a butt joint connection port 213 is provided on the side of the exhaust collection box 21 away from the substrate inlet 11. The butt joint connection port 213 is arranged in the middle of the side of the exhaust collection box 21 away from the substrate inlet 11. The butt joint connection port 213 is connected to one end of an exhaust main pipe butt joint 214, and the other end of the exhaust main pipe butt joint 214 is connected to an external exhaust outlet. The external exhaust main pipe is connected to an external exhaust system, so that a space is formed in the connected exhaust main pipe butt joint 214, the exhaust collection box 21 and the heating cavity 1 to facilitate uniform airflow, thereby exhausting air. The settings of the external exhaust main pipe and the external exhaust system are both prior art. During exhaust, the gas inside the heating chamber 1 enters the exhaust collection box 21 from the exhaust holes 212 of the exhaust collection box 21, then enters the exhaust main pipe docking pipe 214 from the docking pipe connection port 213 of the exhaust collection box 21, and finally enters the external exhaust main pipe through the exhaust main pipe docking pipe 214. By setting the exhaust collection box 21 with exhaust holes 212 on the side and the heating chamber 1 with the substrate inlet 11 on the side, the airflow in the heating chamber 1 can flow basically in the horizontal direction during exhaust, and the entire surface of the substrate can be covered by the airflow. The volatiles are taken away by the airflow flowing in the horizontal direction, and it is not easy for the volatiles to fall back to the substrate surface, thereby improving the baking process effect. In this embodiment, the docking pipe connection port 213 is set in the middle position on the side of the exhaust collection box 21 away from the substrate inlet port 11, so that the pressure at the docking pipe connection port 213 is relatively uniform, and it is not easy for gas to accumulate and form vortices.

[0037] In this embodiment, the axial center lines of the exhaust holes 212 are parallel to the direction in which the substrate enters, thereby making the airflow move more stably in the horizontal direction.

[0038] Further, the exhaust collection box 21 includes a first exhaust plate, a second exhaust plate and a third exhaust plate connected in sequence, and the exhaust holes 212 are evenly arranged on the first exhaust plate, the second exhaust plate and the third exhaust plate, the second exhaust plate is parallel to the baffle plate 31, and the first baffle plate 31 and the third baffle plate 31 are tilted in the direction away from the heating chamber 1. The first gap 32 is tilted to align with the first exhaust plate and the third exhaust plate. Since the airflow near the inner wall of the edge of the heating chamber 1 will have a viscosity effect. The airflow has a lower speed near the inner wall. This is because the boundary layer effect causes the speed of the airflow to decrease at the contact surface, and as the distance from the inner wall increases, the speed gradually increases, forming a speed gradient. The tilted design of the first exhaust plate and the third exhaust plate allows the gas to enter the exhaust collection box 21 more smoothly during the flow process. The inclined surface allows the first baffle plate 31 and the third baffle plate 31 to form a shorter gas stroke with the baffle plate 31, thereby making the airflow faster when passing through the discharge space. Offsetting the viscosity of the gas helps guide the airflow, reduces dead zones and eddy currents, and causes the gas to flow along a more linear path, thereby improving the uniformity of the flow. The second air exhaust plate is parallel to the baffle 31, forming a stable airflow channel so that the gas will not be subject to additional interference when passing through the second air exhaust plate, thereby reducing fluctuations caused by flow changes.

[0039] According to the embodiment of the present invention, a comparative experiment is conducted with the prior art: Existing example: See Figure 6 , use 12-inch wafers as experimental substrates to ensure that their surfaces are clean and uncontaminated. Then place the wafer in a pre-baking device for heat treatment to remove moisture from the wafer surface. The temperature of the process is set to 180°C and the processing time is 5 minutes to ensure that the moisture is fully removed. After the treatment is completed, the wafer is transferred to the cold plate for rapid cooling to room temperature. Then, the cooled wafer enters the coating unit and is evenly coated with polyimide (PI) photoresist to ensure that the photoresist is evenly coated on the wafer surface. The wafer that has completed the coating process is transferred to the existing example for pre-baking. The hot plate temperature is set to 150°C and the baking time is 60 seconds to promote the curing of the photoresist. After the pre-baking is completed, the wafer is transferred to the cold plate for cooling to ensure that the wafer temperature drops to room temperature. Finally, a film thickness measuring instrument is used to measure the thickness of the photoresist film on the wafer, and the film thickness value of each measuring point is recorded to evaluate the uniformity of the film thickness. The measurement points are evenly distributed, covering the entire wafer surface, and the results are as follows. Figure 6 .

[0040] Invention example: See Figure 7, use a 12-inch wafer as the experimental substrate to ensure that its surface is clean and uncontaminated. Then place the wafer in a pre-baking device for heat treatment to remove water vapor from the wafer surface. The temperature of this process is set to 180°C and the processing time is 5 minutes to ensure that the water vapor is fully removed. After the treatment is completed, the wafer is transferred to a cold plate for rapid cooling to room temperature. Then, the cooled wafer enters the coating unit and is evenly coated with polyimide (PI) photoresist to ensure that the photoresist is evenly coated on the wafer surface. The wafer that has completed the coating process is transferred to the heating chamber in an embodiment of the present invention for pre-baking treatment. The hot plate temperature is set to 150°C and the baking time is 60 seconds to promote the curing of the photoresist. After the pre-baking is completed, the wafer is transferred to a cold plate for cooling to ensure that the wafer temperature drops to room temperature. Finally, a film thickness measuring instrument is used to measure the thickness of the photoresist film on the wafer, and the film thickness value of each measuring point is recorded to evaluate the uniformity of the film thickness. The measuring points are evenly distributed, covering the entire wafer surface, and the results are as follows. Figure 7 .

[0041] Conclusion: By comparing the results, it can be found that the present invention can effectively improve the imbalance of the existing hot plate airflow field, and avoid the problem that the airflow speed near the exhaust end is high and the airflow speed far away from the exhaust end is low during the heat treatment process, resulting in the film thickness being inclined after the coating process.

[0042] Beneficial effects of the present invention: The present invention achieves a more balanced airflow distribution by optimizing the structural design of exhaust and air intake. The exhaust module 2 and the air intake module 3 are arranged relative to each other, and the exhaust space extending in the horizontal direction is formed between the air intake gap and the exhaust hole 212, so that the airflow in the entire heating chamber 1 can flow evenly, avoiding the problem in the prior art that the airflow often produces a higher wind speed at the exhaust end due to improper design, while the wind speed in the area far away from the exhaust end is lower, resulting in uneven volatilization of the solvent after coating, which ultimately affects the consistency of the film thickness. By adopting the above technical solution, it is ensured that the airflow field in the hot plate is evenly distributed under the premise of balanced supply and exhaust in the heat treatment process, so that the wafer is evenly subjected to the heat treatment process, thereby ensuring the film thickness result after coating, and avoiding the inclined morphology of the side contour of the film thickness after the coating process.

[0043] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0044] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] Unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include the first feature being in direct contact with the second feature, or may include the first feature being in contact with the second feature through another feature between them instead of being in direct contact. Moreover, a first feature being "above", "above" and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0046] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A hot plate air supply and exhaust device for improving the uniformity of coating film thickness, characterized in that: include: A heating chamber, used for heating the substrate to be processed; An exhaust module, comprising an exhaust collection box, the exhaust collection box being arranged at one side of the heating cavity, the exhaust collection box being provided with a plurality of exhaust holes, the exhaust holes being communicated with the interior of the heating cavity; an air inlet module, arranged opposite to the air exhaust module and arranged on the other side of the heating cavity, the air inlet module comprising a baffle, the baffle being arranged on a side of the heating cavity away from the exhaust air collection box, an air inlet gap being formed between the baffle and the heating cavity, and the air inlet gap being in communication with the heating cavity; Wherein, an exhaust space extending in a horizontal direction is formed between the air inlet gap and the exhaust hole.

2. A hot plate air supply and exhaust device for improving the uniformity of coating film thickness according to claim 1, characterized in that: The air inlet gap includes a first gap and a second gap, the first gap is located between the baffle and the heating cavity, and the second gap is opened along the horizontal extension direction of the baffle.

3. A hot plate air supply and exhaust device for improving the uniformity of coating film thickness according to claim 1, characterized in that: A substrate inlet is provided on one side of the heating cavity close to the baffle, and a side recess is provided on the exhaust collection box close to the substrate inlet, and the recess direction of the exhaust collection box is away from the substrate inlet.

4. A hot plate air supply and exhaust device for improving the uniformity of coating film thickness according to claim 3, characterized in that: The exhaust collection box is provided with guide plates, which are symmetrically arranged on both sides of the exhaust collection box and are respectively located on both sides of the bottom surface of the heating cavity and extend in a direction close to the substrate inlet.

5. A hot plate air supply and exhaust device for improving the uniformity of coating film thickness according to claim 4, characterized in that: An air equalizing plate is provided in the inner cavity of the exhaust collection box, and the air equalizing plate divides the inner cavity of the exhaust collection box into a first space located close to the substrate inlet and a second space located away from the substrate inlet, and a plurality of air equalizing holes are evenly arranged on the air equalizing plate.

6. A hot plate air supply and exhaust device for improving the uniformity of coating film thickness according to claim 1, characterized in that: A docking pipe connection port is provided on the side of the exhaust collection box away from the substrate entrance port, and the docking pipe connection port is arranged in the middle position of the side of the exhaust collection box away from the substrate entrance port. The docking pipe connection port is connected to one end of the exhaust main pipe docking pipe, and the other end of the exhaust main pipe docking pipe is connected to the external exhaust outlet.

7. A hot plate air supply and exhaust device for improving the uniformity of coating film thickness according to claim 3, characterized in that: The exhaust collection box includes a first exhaust plate, a second exhaust plate and a third exhaust plate connected in sequence, the exhaust holes are evenly arranged on the first exhaust plate, the second exhaust plate and the third exhaust plate, the second exhaust plate is parallel to the baffle plate, and the first baffle plate and the third baffle plate are inclined away from the heating cavity.

8. A hot plate air supply and exhaust device for improving the uniformity of coating film thickness according to claim 1, characterized in that: The air inlet gap is in the shape of a rectangular hole or a circular hole.

9. A hot plate air supply and exhaust device for improving the uniformity of coating film thickness according to claim 1, characterized in that: It also includes a lifting member, which has a driving end connected to the baffle, and the lifting member is used to drive the baffle to move along the height direction.

10. A hot plate air supply and exhaust device for improving the uniformity of coating film thickness according to claim 2, characterized in that: The first gap size is 0.1mm-20mm, and the second gap size is 0.1mm-10mm.

11. A hot plate air supply and exhaust device for improving the uniformity of coating film thickness according to claim 1, characterized in that: The number of the air inlet gaps is not less than two, and / or the number of the air inlet gap is one.

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