Chip low-temperature self-heating system and method

Abstract

The invention provides a chip low-temperature self-heating system and method, and the system comprises a switching circuit which is connected in series between a power supply and a resistance heating network, the control signal end of the switching circuit is connected with the power supply control end of a temperature controller, and the temperature controller drives and controls the power supply of the resistance heating network; the resistance heating network comprises a plurality of parallel resistors, the resistors are dispersed in the chip, one parallel connection point is connected with a power supply through a switching circuit, and the other parallel connection point is grounded; the temperature controller is used for controlling the power supply of the resistance heating network through the switching circuit so as to realize temperature control; when the PCB chip is powered on and started, the switching circuit is closed, the power supply supplies power to the resistance heating network, and the resistance heating network enters a heating state; when the PCB chip is started successfully, the switching circuit is opened, and the resistance heating network is closed, compared with a traditional method for compensating and increasing the low-temperature performance of the chip from the perspective of circuit design, the method is low in cost, easy to implement and high in universality and is not affected by the low-temperature characteristic of a device.

Description

Technical Field

[0001] The present invention relates to the field of PCB chips, and more specifically, to a chip low-temperature self-heating system and method. Background Art

[0002] With the development of information technology, the application of electronic chips is becoming more and more popular. In chip design, it is generally necessary to ensure that the designed chip works normally under all process voltage and temperature angles. Among them, temperature has a very large impact on the working state of the chip. For example, the operating temperature of common industrial-grade chips is -40℃ to 85℃, the operating temperature of automotive-grade chips is -40℃ to 125℃, and the military-grade is -55℃ to 125℃. Generally speaking, high-temperature performance is relatively easy to achieve, but low-temperature performance is relatively difficult. Some chips may even have difficulty starting at low temperatures, causing the entire system to fail to work properly.

[0003] In order to solve the problem of low-temperature startup of chips, TBD is a common method.

[0004] Existing technologies basically focus on how to improve circuit performance at low temperatures through various special designs and compensation circuits so that it can work normally at low temperatures. However, these methods have several disadvantages: First, the implementation is relatively complex and requires tedious design and verification work.

[0005] Secondly, it is not very versatile. For different circuit structures, corresponding circuits need to be designed to specifically solve the low-temperature startup problem.

[0006] Third, the device model has a large deviation at low temperatures, which leads to a large deviation between the designed circuit simulation and the chip results, thus affecting the chip yield. Summary of the invention

[0007] The purpose of the present invention is to address the problem of difficulty in starting a chip at low temperature and to propose a chip low-temperature self-heating system and method; compared with the traditional method of compensating and increasing the low-temperature performance of the chip from the perspective of circuit design, the present invention has low cost, simple implementation, strong versatility and is not affected by the low-temperature characteristics of the device.

[0008] The technical solution of the present invention is: The present invention provides a chip low-temperature self-heating system, comprising: A switch circuit is connected in series between the power supply and the resistance heating network, wherein the control signal end of the switch circuit is connected to the power supply control end of the temperature controller, and the temperature controller drives and controls the power supply of the resistance heating network; The resistance heating network includes a plurality of parallel resistors, each resistor is dispersed inside the chip, one parallel connection point is connected to a power supply through a switch circuit, and another parallel connection point is grounded; and a temperature controller, which controls the power supply of the resistance heating network through a switching circuit to achieve temperature control; When the PCB chip is powered on, the switch circuit is closed, the power supply supplies power to the resistance heating network, and the resistance heating network enters the heating state; When the PCB chip is successfully started, the switch circuit is turned on and the resistance heating network is turned off.

[0009] Furthermore, in the above-mentioned S1, the switch circuit adopts a power switch to control the on-off of the line between the resistance heating network and the power supply.

[0010] Furthermore, the resistors are dispersed in the low temperature sensitive area inside the PCB chip, ie, the cold spot position.

[0011] Furthermore, it also includes a temperature detector, which is arranged inside the chip, and the output of the temperature detector is connected to the detection signal input terminal of the temperature controller; When the real-time temperature of the chip collected by the temperature detector exceeds a preset threshold, the temperature controller opens the switch circuit and closes the resistance heating network.

[0012] Furthermore, there are multiple temperature detectors, which are dispersed in high temperature sensitive areas, ie, hot spots, inside the PCB chip.

[0013] A chip low temperature self-heating method, using the system, comprises: When the PCB chip is powered on, the temperature controller outputs a control signal to close the switch circuit, the power supply supplies power to the resistance heating network, and the resistance heating network enters the heating state; When the PCB chip is successfully started, the temperature controller outputs a control signal to open the switch circuit and close the resistance heating network.

[0014] Furthermore, a temperature detector is used to collect the internal temperature of the chip. When the real-time temperature of the chip collected by the temperature detector exceeds a preset threshold, the temperature controller outputs a control signal to open the switch circuit and close the resistance heating network; the threshold is generally 165°.

[0015] Furthermore, the resistors in the resistance heating network are dispersed in the low temperature sensitive area inside the PCB chip, namely the cold spot position; there are multiple temperature detectors, which are dispersed in the high temperature sensitive area inside the PCB chip, namely the hot spot position.

[0016] Furthermore, the step of obtaining the resistance value of the resistance heating network includes: Obtain the mass M, specific heat, operating voltage and target temperature of the chip; Calculating the energy required to heat the chip according to the mass, specific heat and target temperature of the chip; The resistance value of the resistance heating network is obtained according to the operating voltage, the energy required for heating the chip and the preset start-up time.

[0017] Furthermore, the step of obtaining the resistance value of the resistance heating network specifically includes: Get chip area S and thickness H; According to the chip area S, thickness H and the preset silicon density ρ, the chip mass M is calculated using the following formula: M = S × H × ρ; Obtain the specific heat c and operating voltage V of silicon; Get the ambient temperature T0 and the target temperature Tt, and calculate the temperature difference ΔT, ΔT = Tt - T0; Based on the chip mass M, the specific heat of silicon c and the temperature difference ΔT, the energy E required to heat the chip is calculated using the following formula: E = c × M × ΔT; According to the operating voltage V, the energy E required for chip heating and the preset start-up time t, the resistance R of the resistance heating network is determined by the following formula: t × V² / R = E; The preset start-up time t is the time during which the resistance heating network continues to heat after the switch circuit is closed.

[0018] Beneficial effects of the present invention: The chip low temperature self-heating system and method of the present invention assists the chip to start in low temperature mode. Compared with the traditional method of compensating and increasing the low temperature performance of the chip from the perspective of circuit design, the present invention has low cost, simple implementation, strong versatility and is not affected by the low temperature characteristics of the device.

[0019] The method of the present invention converts a low-temperature environment into a normal-temperature environment by slowly heating the chip, thereby realizing normal startup of the chip.

[0020] The present invention is an adaptive system. If the chip fails to start, it will continue to heat until the temperature reaches the standard and the chip starts successfully. At the same time, the use of a temperature detector provides additional system function safety, ensuring that the heating network can be safely shut down even in the event of a fault.

[0021] The present invention solves the shortcomings of traditional solutions: first, the design is simple, and chip heating can be achieved using a polysilicon resistor heating network; second, it is highly versatile and is applicable to almost all circuit structures; third, there is no need to consider the deviation of the model when the device is at low temperature.

[0022] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and other objects, features and advantages of the present invention will become more apparent through a more detailed description of exemplary embodiments of the present invention in conjunction with the accompanying drawings, wherein like reference numerals generally represent like components throughout the exemplary embodiments of the present invention.

[0024] Figure 1 An electrical schematic diagram of the present invention is shown. DETAILED DESCRIPTION

[0025] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0026] Example 1

[0027] Figure 1 An electrical schematic diagram of the present invention is shown.

[0028] like Figure 1 As shown, the present invention provides a chip low temperature self-heating system, comprising: A switch circuit is connected in series between the power supply and the resistance heating network. The control signal end of the switch circuit is connected to the power supply control end of the temperature controller, and the temperature controller drives and controls the power supply of the resistance heating network. The switch circuit uses a power switch; The resistance heating network includes a plurality of parallel resistors, each resistor is dispersed inside the chip, one parallel connection point is connected to a power supply through a switch circuit, and another parallel connection point is grounded; and a temperature controller, which controls the power supply of the resistance heating network through a switching circuit to achieve temperature control; When the PCB chip is powered on, the switch circuit is closed, the power supply supplies power to the resistance heating network, and the resistance heating network enters the heating state; When the PCB chip is successfully started, the switch circuit is turned on and the resistance heating network is turned off.

[0029] In one example, the resistors are dispersed in a low temperature sensitive area, ie, a cold spot, inside the PCB chip.

[0030] In one example, it further includes a temperature detector, which is disposed inside the chip, and the output of the temperature detector is connected to the detection signal input terminal of the temperature controller; When the real-time temperature of the chip collected by the temperature detector exceeds a preset threshold, the temperature controller opens the switch circuit and turns off the resistance heating network; There are multiple temperature detectors, which are distributed in the high temperature sensitive area, ie, the hot spot, inside the PCB chip.

[0031] In this embodiment, in order to prevent the shutdown logic from making mistakes after the chip is started, causing the chip to be heated all the time, a temperature detector module is placed inside the chip. The temperature detector module sets a high temperature warning threshold. When the chip temperature reaches the threshold, an over-temperature signal is sent to the temperature control logic. Once the temperature control logic receives the over-temperature signal, it can forcibly shut down the power supply of the resistance heating network to ensure that the chip is in a safe state.

[0032] Example 2

[0033] The present invention provides a low-temperature self-heating method for a chip, using the system, comprising: When the PCB chip is powered on, the temperature controller outputs a control signal to close the switch circuit, the power supply supplies power to the resistance heating network, and the resistance heating network enters the heating state; When the PCB chip is successfully started, the temperature controller outputs a control signal to open the switch circuit and close the resistance heating network.

[0034] In one example, a temperature detector is used to collect the internal temperature of the chip. When the real-time temperature of the chip collected by the temperature detector exceeds a preset threshold, the temperature controller outputs a control signal to open the switch circuit and close the resistance heating network. The threshold is generally 165°.

[0035] In one example, the resistors in the resistance heating network are dispersed in the low temperature sensitive area inside the PCB chip, namely the cold spot position; there are multiple temperature detectors, which are dispersed in the high temperature sensitive area inside the PCB chip, namely the hot spot position.

[0036] In the present invention, the resistance heating network converts electrical energy into thermal energy through the current flowing through it, and slowly heats the chip. In the current silicon planar integrated circuit process, resistors can be manufactured at a very low cost using polysilicon. By calculating the required amount of heat, resistors of several resistance values ​​can be set in the chip and form a network for slowly heating the chip. The selection of resistors is comprehensively considered with the low temperature environment temperature, chip heating time, system heat dissipation, system safety, etc. It cannot be too small, so that the chip heats up too quickly and reduces safety, nor can it be too large, so that the temperature is insufficient or even insufficient to compensate for the energy lost due to heat dissipation. The resistance value acquisition step of the resistance heating network includes: Obtain the mass M, specific heat, operating voltage and target temperature of the chip; Calculating the energy required to heat the chip according to the mass, specific heat and target temperature of the chip; The resistance value of the resistance heating network is obtained according to the operating voltage, the energy required for heating the chip and the preset start-up time.

[0037] In one example, the step of obtaining the resistance value of the resistance heating network specifically includes: Get chip area S and thickness H; According to the chip area S, thickness H and the preset silicon density ρ, the chip mass M is calculated using the following formula: M = S × H × ρ; Obtain the specific heat c and operating voltage V of silicon; Get the ambient temperature T0 and the target temperature Tt, and calculate the temperature difference ΔT, ΔT = Tt - T0; Based on the chip mass M, the specific heat of silicon c and the temperature difference ΔT, the energy E required to heat the chip is calculated using the following formula: E = c × M × ΔT; According to the operating voltage V, the energy E required for chip heating and the preset start-up time t, the resistance R of the resistance heating network is determined by the following formula: t × V² / R = E; The preset start-up time t is the time during which the resistance heating network continues to heat after the switch circuit is closed.

[0038] In this embodiment, the chip's operating voltage, target startup temperature and other parameters are first obtained to calculate the energy required for the chip to heat up. Then, based on the energy requirement and the operating voltage, the equivalent resistance value and heating time of the parallel resistor network are calculated, and the resistance value of each resistor is determined.

[0039] By integrating a heating circuit inside the chip, rapid preheating of the chip is achieved, the startup time of the chip in a low-temperature environment is shortened, and the working reliability of the chip in a low-temperature environment is improved, which has important practical value.

[0040] The embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.

Claims

1. A chip low temperature self-heating system, characterized in that: include: A switch circuit is connected in series between the power supply and the resistance heating network, wherein the control signal end of the switch circuit is connected to the power supply control end of the temperature controller, and the temperature controller drives and controls the power supply of the resistance heating network; The resistance heating network includes a plurality of parallel resistors, each resistor is dispersed inside the chip, one parallel connection point is connected to a power supply through a switch circuit, and another parallel connection point is grounded; and a temperature controller, which controls the power supply of the resistance heating network through a switching circuit to achieve temperature control; When the PCB chip is powered on, the switch circuit is closed, the power supply supplies power to the resistance heating network, and the resistance heating network enters the heating state; When the PCB chip is successfully started, the switch circuit is turned on and the resistance heating network is turned off.

2. The chip low temperature self-heating system according to claim 1, characterized in that: The switch circuit adopts a power switch to control the on-off of the line between the resistance heating network and the power supply.

3. The chip low temperature self-heating system according to claim 1, characterized in that: The resistors are dispersed in the low temperature sensitive area inside the PCB chip, namely the cold spot.

4. The chip low temperature self-heating system according to claim 1, characterized in that: It also includes a temperature detector, which is arranged inside the chip, and the output of the temperature detector is connected to the detection signal input end of the temperature controller; When the real-time temperature of the chip collected by the temperature detector exceeds a preset threshold, the temperature controller opens the switch circuit and closes the resistance heating network.

5. The chip low temperature self-heating system according to claim 4, characterized in that: There are multiple temperature detectors, which are distributed in the high temperature sensitive area, ie, the hot spot, inside the PCB chip.

6. A chip low temperature self-heating method, using the system according to any one of claims 1 to 5, characterized in that: include: When the PCB chip is powered on, the temperature controller outputs a control signal to close the switch circuit, the power supply supplies power to the resistance heating network, and the resistance heating network enters the heating state; When the PCB chip is successfully started, the temperature controller outputs a control signal to open the switch circuit and close the resistance heating network.

7. The chip low temperature self-heating method according to claim 6, characterized in that: A temperature detector is used to collect the internal temperature of the chip. When the real-time temperature of the chip collected by the temperature detector exceeds a preset threshold, the temperature controller outputs a control signal to open the switch circuit and close the resistance heating network.

8. The chip low temperature self-heating method according to claim 6, characterized in that: The resistors in the resistance heating network are dispersed in the low temperature sensitive area inside the PCB chip, namely the cold spot position; there are multiple temperature detectors, which are dispersed in the high temperature sensitive area inside the PCB chip, namely the hot spot position.

9. The chip low temperature self-heating method according to claim 6, characterized in that: The resistance value acquisition step of the resistance heating network includes: Obtain the mass M, specific heat, operating voltage and target temperature of the chip; Calculating the energy required to heat the chip according to the mass, specific heat and target temperature of the chip; The resistance value of the resistance heating network is obtained according to the operating voltage, the energy required for heating the chip and the preset start-up time.

10. The chip low temperature self-heating method according to claim 6, characterized in that: The resistance value acquisition step of the resistance heating network specifically includes: Get chip area S and thickness H; According to the chip area S, thickness H and the preset silicon density ρ, the chip mass M is calculated using the following formula: M = S × H × ρ; Obtain the specific heat c and operating voltage V of silicon; Get the ambient temperature T0 and the target temperature Tt, and calculate the temperature difference ΔT, ΔT = Tt - T0; Based on the chip mass M, the specific heat of silicon c and the temperature difference ΔT, the energy E required to heat the chip is calculated using the following formula: E = c × M × ΔT; According to the operating voltage V, the energy E required for chip heating and the preset start-up time t, the resistance R of the resistance heating network is determined by the following formula: t × V² / R = E; The preset start-up time t is the time during which the resistance heating network continues to heat after the switch circuit is closed.

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