A diode packaging device and a packaging process

Abstract

The present invention relates to the technical field of diode production equipment, and discloses a diode packaging device and a packaging process, including a support table. An operation table is arranged on one side of the support table, a support plate is arranged on the top of the support table, a support frame is arranged on the support plate, a protection plate is arranged between the support frames, an operation instrument is arranged on the operation table, a transportation pipe is communicated with the operation instrument, an injection head is arranged at one end of the transportation pipe, a driving source is arranged inside the support plate, a rotating plate is arranged at the output end of the driving source, and an adjusting component is arranged on the rotating plate; an auxiliary component is arranged on the top of the support plate; the adjusting component is used for correcting and guiding the diode chip placed above it before packaging; the auxiliary component is used for eliminating bubbles during the packaging of the diode chip. Compared with the prior art, this application ensures that the packaging material is evenly distributed on the chip, guarantees the integrity of the packaging, and makes the packaging process more stable and reliable.

Description

Technical Field

[0001] The present invention relates to the technical field of diode production equipment, and particularly to a diode packaging device and a packaging process. Background Art

[0002] A diode is a common electronic component. It is a device with two electrodes that only allows current to flow in a single direction. The packaging of a diode refers to connecting the electronic pins on the silicon chip to external connectors with wires for connection to other devices. The packaging of a diode not only plays roles in aspects such as installation, fixation, sealing, protection of the chip, and enhancement of electrothermal properties, but also enables the connection between the external circuit and the internal chip through the pins of the package. Moreover, the packaged diode is also convenient for installation and transportation.

[0003] During the packaging process, generally glue is applied on the surface of the chip and then bonding is carried out. This process is generally manual or semi - manual. To bond the chip with the diode, in the traditional way, most of the implementation of this process is achieved through manual or semi - manual means. The first worker uses a dispensing machine to apply glue on the blanking sheet and then transfers the blanking sheet with glue applied to the next worker. This greatly restricts the packaging efficiency of diodes during diode packaging.

[0004] In the prior art, the Chinese patent document with publication number CN117316825A proposes a semiconductor chip packaging device and its working method, including a workbench and a conveying mechanism arranged between the workbenches. The surface of the conveying mechanism is spaced with multiple bearing grooves for bearing and storing the diodes to be packaged, and the conveying mechanism is used to convey the diodes arranged in the bearing grooves; before packaging the diode and the chip, the top of the diode is pre - treated with glue, making the packaging of the diode and the chip more stable and the bonding more stable. However, in actual use, there are still problems with the subsequent processing quality caused by inaccurate placement positions of the diode chips. At the same time, when packaging the chip, there will be gaps or bubbles between the packaging material and the chip, thus affecting the packaging quality of the diode. Therefore, the present application discloses a diode packaging device and a packaging process to meet the requirement of uniform distribution of the packaging material on the chip and ensure the integrity of the packaging. Summary of the Invention

[0005] (I) Technical Problems to be Solved

[0006] Aiming at the deficiencies of the prior art, the present invention provides a diode packaging device and a packaging process, which have the advantages of ensuring that the chip is in the correct position before packaging, effectively avoiding the problem of chip position deviation during the packaging process, improving the packaging accuracy, etc., solving the subsequent processing quality problems caused by inaccurate placement positions of diode chips, and when packaging the chips, there will be gaps or bubbles between the packaging material and the chips, thus affecting a series of problems such as the packaging quality of the diodes.

[0007] (II) Technical Solution

[0008] To achieve the above object, the present invention provides the following technical solution: A diode packaging device includes a support table, on one side of the support table, there is an operation table, on the top of the support table, there is a support plate, on the support plate, there is a support frame, between the support frames, there is a protection plate, on the operation table, there is an operation instrument, the operation instrument is communicated with a transport pipe, one end of the transport pipe is provided with an injection head, inside the support plate, there is a driving source, the output end of the driving source is provided with a rotating plate, and on the rotating plate, there is an adjusting component; on the top of the support plate, there is an auxiliary component; the adjusting component is used for rectifying and guiding the diode chip placed above it before packaging; the adjusting component includes multiple groups of mounting plates arranged on the rotating plate, inside the mounting plates, there is a lifting rod passing through, on the lifting rod, there is a synchronous plate, passing through the synchronous plate, there is a second connecting rod, on the second connecting rod, there is a deflecting plate sleeved, one end of the deflecting plate is sleeved with a first connecting rod, on the first connecting rod, there is an adjusting arm rotatably arranged, passing through the adjusting arm, there is a rotating rod, the adjusting arm and the rotating rod rotate relative to each other, and the rotating rod passes through the mounting plate; the auxiliary component is used for eliminating bubbles during the packaging of the diode chip; the auxiliary component includes multiple groups of guiding rails fixedly arranged on the support plate, the guiding rails are communicated with each other, the height of the guiding rails increases from both sides to the middle, on one side of the guiding rails, there are multiple groups of adjusting slots arranged in a wavy pattern; on the top of the lifting rod, there is a contact table, on the top of the contact table, there is a mounting seat, on the mounting seat, there is a mounting groove, the mounting groove is adapted to the contact table, and on one side of the mounting seat, there is an extension plate.

[0009] Preferably, a limiting head is arranged at the bottom of the lifting rod, and a limiting groove is arranged inside the guiding rail, and the limiting groove is adapted to the limiting head.

[0010] Preferably, a guide rail is provided on the support plate, a moving rail is slidably arranged in the guide rail, an injection head is penetratingly arranged on the moving rail, one end of the injection head is communicated with the transport pipe, a fixing plate is fixedly arranged on the guide rail, a pushing cylinder is arranged on the fixing plate, a suction cup is arranged at the output end of the pushing cylinder, and the suction cup is in contact with the extension plate.

[0011] Preferably, a collection groove is arranged on one side of the support table, and the collection groove is arranged on one side of the fixing plate.

[0012] Preferably, it is characterized in that: a plurality of groups of deviation correction grooves are formed on the inner wall of the adjusting arm.

[0013] A diode packaging process, which is applied to the above-mentioned diode packaging equipment, includes the following steps:

[0014] S1. Select packaging materials: According to the application scenario of the diode, select suitable packaging materials to ensure that they have good insulation, heat conductivity and mechanical strength;

[0015] S2. Mold preparation: Place mounting seats of different sizes on the contact table according to requirements, and perform the next operation by rotating the rotating plate;

[0016] S3. Injection molding: Heat the packaging material to a flowing state, control the packaging material to enter the support table through the transport pipe by the operating instrument, inject the packaging material into the mounting seat through the injection head, and repeatedly lift and lower the lifting rod under the guidance of the limit head, so that the air bubbles in the mounting seat can dissipate during the vibration process and completely wrap the chip and the lead;

[0017] S4. Demolding and inspection: Adsorb the extension plate by the suction cup of the pushing cylinder to separate the mounting seat from the contact table, and check the appearance and size of the package.

[0018] (III) Beneficial effects

[0019] Compared with the prior art, the present invention provides a diode packaging equipment and a packaging process, which have the following beneficial effects:

[0020] 1. For the diode packaging equipment and packaging process, when the rotating plate drives the support plate to rotate synchronously under the drive of the drive source in the support plate, the bottom of the lifting rod moves along the guide. Through the height change of the guide, the lifting rod can drive the synchronous plate to lift and lower synchronously. When the synchronous plate changes with the height of the lifting rod, it can drive the second connecting rod to rise, thereby driving the deflection plate to rotate around the axis of the first connecting rod, and at the same time making the first connecting rod drive the adjusting arm to deflect around the axis of the rotating rod, so that the distance between the adjusting arms increases. That is, when the contact table rises, the adjusting arms can be opened, which is convenient for placing the mounting seat on the contact table and improving the efficiency of diode chip packaging.

[0021] 2. For the diode packaging device and packaging process, when the mounting base is placed on the contact table, the rotating plate continues to rotate, causing the height of the lifting rod to decrease. At this time, the adjusting arms approach each other. When the placement position of the mounting base is deviated, during the process of the adjusting arms approaching each other, the alignment groove can contact the edge of the mounting base. Because the adjusting arms approach each other synchronously, the contact degree between the alignment groove and the edge of the mounting base can be kept consistent, thereby causing the mounting base to rotate on the contact table, and then completing the alignment of the position of the mounting base. It can accurately align and guide the position before chip packaging, ensure that the chip is in the correct position before packaging, not only improve the accuracy of chip positioning, but also enhance the automation level of the device, reduce manual operation errors, and improve the packaging quality.

[0022] 3. For the diode packaging device and packaging process, by rotating the rotating plate, the limit head at the bottom of the lifting rod can move within the guide. Through the mutual connection between the guides and the height of the guides increasing from both sides to the middle, when the rotating plate rotates, the lifting rod can maintain a complete rotation cycle. At the same time, when the limit head contacts the adjustment groove, due to the adjustment groove being arranged in a wave shape, the lifting rod can quickly reciprocate up and down, thereby realizing the vibration effect on the mounting base, ensuring that the bubbles existing during packaging are eliminated, and then ensuring the packaging effect of the diode, reducing the packaging quality problems caused by bubbles.

[0023] 4. For the diode packaging device and packaging process, the packaging material is transported to the injection head through the transport pipe and injected into the diode chip to be packaged by it. The auxiliary component eliminates the bubbles. At the same time, when the packaged diode moves to one side of the fixed plate, the suction cup at the output end of the pushing cylinder can adsorb the extension plate, realize the picking of the mounting base, and can realize the mounting base falling into the collection tank, thereby completing the picking of the packaged diode, and then completing an entire packaging process, effectively improving the automated operation during the packaging process and improving the packaging efficiency.

[0024] 5. The diode packaging device and packaging process select appropriate packaging materials according to the application scenario, and through the mounting seats of different sizes on the contact table and the preparation work of high-precision molds, the packaging materials are transported to the injection head through the operating instrument and the transport pipe and injected into the mounting seats. During the injection molding process, the lifting rod repeatedly rises and falls under the guidance of the limiting head, so that the bubbles in the mounting seats of the packaging materials dissipate through vibration, ensuring that the materials evenly cover the chip and the leads. Finally, the mounting seats and the contact table are separated by the suction cup of the pushing cylinder, and the packaged diodes are taken out, and their appearance and size are inspected to ensure the packaging quality; through the repeated movement of the lifting rod, the bubbles in the packaging materials are effectively eliminated, ensuring the integrity and uniformity of the packaging. At the same time, the design of the pushing cylinder and the suction cup simplifies the demolding process, reduces the complexity of manual operation, and improves the automation level. Through strict inspection steps, it is ensured that the package has no bubbles, cracks or dimensional deviations, improving the stability and quality of the product. The overall process is efficient and reliable, and can meet the diode packaging requirements of different scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic perspective view of the first perspective of the present invention;

[0026] Figure 2 is a schematic perspective view of the second perspective of the present invention;

[0027] Figure 3 is a schematic perspective view of the support frame of the present invention;

[0028] Figure 4 is a schematic perspective view of the support plate and the support frame of the present invention;

[0029] Figure 5 is a schematic perspective view of the support plate of the present invention;

[0030] Figure 6 is a schematic perspective view of the adjusting arm of the present invention;

[0031] Figure 7 is a schematic perspective view of the mounting plate of the present invention;

[0032] Figure 8 is a schematic perspective view of the guide rail of the present invention;

[0033] Figure 9 is a schematic perspective view of the adjusting groove of the present invention;

[0034] Figure 10 is a schematic perspective view of the mounting seat of the present invention;

[0035] In the figure: 1, support platform; 2, operating platform; 3, support plate; 4, support frame; 5, operating instrument; 6, transport pipe; 7, protection plate; 8, guide rail; 9, moving rail; 10, injection head; 11, rotating plate; 12, mounting plate; 13, lifting rod; 14, synchronous plate; 15, deflection plate; 16, first connecting rod; 17, second connecting rod; 18, adjusting arm; 19, rotating rod; 20, deviation correction groove; 21, contact platform; 22, guide; 23, adjusting groove; 24, limiting head; 25, mounting seat; 26, mounting groove; 27, extension plate; 28, fixing plate; 29, pushing cylinder; 30, collection groove. Detailed implementation manner

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0037] As introduced in the background art, there are deficiencies in the prior art. To solve the above technical problems, the present application proposes a diode packaging device and a packaging process.

[0038] In a typical implementation manner of the present application, as Figures 1-10 shown, a diode packaging device includes a support platform 1. An operating platform 2 is arranged on one side of the support platform 1. A support plate 3 is arranged on the top of the support platform 1. A support frame 4 is arranged on the support plate 3. A protection plate 7 is arranged between the support frames 4. An operating instrument 5 is arranged on the operating platform 2. A transport pipe 6 is connected and communicated on the operating instrument 5. An injection head 10 is arranged at one end of the transport pipe 6. A driving source is arranged in the support plate 3. The output end of the driving source is provided with a rotating plate 11. An adjusting component is arranged on the rotating plate 11; an auxiliary component is arranged on the top of the support plate 3; the adjusting component is used for correcting and guiding the diode chip placed above it before packaging; the auxiliary component is used for eliminating bubbles during the packaging of the diode chip;

[0039] The operating instrument 5 transports the packaging material to the injection head 10 through the connected transport pipe 6. The injection head 10 precisely packages the diode chip. The driving source in the support plate 3 drives the rotating plate 11 to rotate through the output end. The adjusting component adjusts the position according to the specific position of the chip to ensure that the chip is in the correct position before packaging, effectively avoiding the problem of chip position deviation during the packaging process, improving the packaging accuracy. The auxiliary component eliminates bubbles during the packaging process to ensure that the packaging material is evenly distributed on the chip, ensuring the integrity of the packaging, making the packaging process more stable and reliable, reducing packaging defects, reducing manual operation errors, and overall improving the production efficiency and packaging quality of the device.

[0040] As a preferred implementation mode in this embodiment, referring to the attached Figures 1-7 , the adjusting assembly includes multiple groups of mounting plates 12 arranged on the rotating plate 11. A lifting rod 13 is penetrated through the mounting plate 12. A synchronous plate 14 is arranged on the lifting rod 13. A second connecting rod 17 is penetrated through the synchronous plate 14. A deflecting plate 15 is sleeved on the second connecting rod 17. One end of the deflecting plate 15 is sleeved with a first connecting rod 16. An adjusting arm 18 is rotatably arranged on the first connecting rod 16. A rotating rod 19 is penetrated through the adjusting arm 18. The adjusting arm 18 and the rotating rod 19 rotate relative to each other. The rotating rod 19 is penetrated through the mounting plate 12; Multiple groups of deviation-correcting grooves 20 are formed on the inner wall of the adjusting arm 18;

[0041] When the rotating plate 11 rotates synchronously with the support plate 3 driven by the driving source in the support plate 3, the bottom of the lifting rod 13 moves along the guide 22. Through the height change of the guide 22, the lifting rod 13 can drive the synchronous plate 14 to lift synchronously. When the synchronous plate 14 changes in height following the lifting rod 13, it can drive the second connecting rod 17 to rise, thereby driving the deflecting plate 15 to rotate around the axis of the first connecting rod 16 while making the first connecting rod 16 drive the adjusting arm 18 to deflect around the axis of the rotating rod 19, and further increasing the distance between the adjusting arms 18. That is, when the contact table 21 rises, the adjusting arms 18 can be opened, which is convenient for placing the mounting seat 25 on the contact table 21 and improving the efficiency of diode chip packaging;

[0042] At the same time, after the mounting seat 25 is placed on the contact table 21, the rotating plate 11 continues to rotate, causing the height of the lifting rod 13 to decrease. At this time, the adjusting arms 18 approach each other. When the placement position of the mounting seat 25 is deviated, during the process of the adjusting arms 18 approaching each other, the deviation-correcting groove 20 can be made to contact the edge of the mounting seat 25. Because the adjusting arms 18 approach each other synchronously during the approaching process, the contact degree between the deviation-correcting groove 20 and the edge of the mounting seat 25 can be kept consistent, thereby causing the mounting seat 25 to rotate on the contact table 21, and then completing the deviation correction of the position of the mounting seat 25. It can accurately correct and guide the position before chip packaging, ensure that the chip is in the correct position before packaging, not only improve the accuracy of chip positioning, but also improve the automation level of the equipment, reduce manual operation errors, and improve the packaging quality.

[0043] As a preferred implementation mode in this embodiment, referring to the attached Figure 4 、 Figure 5 、 Figure 8 and Figure 9, The auxiliary component includes multiple groups of guide rails 22 fixedly arranged on the support plate 3. The guide rails 22 are interconnected with each other. The height of the guide rails 22 increases from both sides to the middle. Multiple groups of adjustment slots 23 are formed on one side of the guide rails 22, and the adjustment slots 23 are arranged in a wavy pattern; a contact platform 21 is arranged at the top of the lifting rod 13, a mounting seat 25 is arranged at the top of the contact platform 21, a mounting slot 26 is formed in the mounting seat 25, the mounting slot 26 is adapted to the contact platform 21, and an extension plate 27 is arranged on one side of the mounting seat 25; a limiting head 24 is arranged at the bottom of the lifting rod 13, and a limiting slot is formed in the guide rail 22, and the limiting slot is adapted to the limiting head 24;

[0044] By rotating the rotating plate 11, the limiting head 24 at the bottom of the lifting rod 13 can be moved within the guide 22. Due to the interconnection of the guides 22 with each other and the height of the guides 22 increasing from both sides to the middle, when the rotating plate 11 rotates, the lifting rod 13 can maintain a complete rotation cycle. At the same time, when the limiting head 24 contacts the adjustment slot 23, due to the wavy arrangement of the adjustment slot 23, the lifting rod 13 can be quickly reciprocated up and down, thereby achieving the effect of vibrating the mounting seat 25, ensuring that the bubbles existing during encapsulation are eliminated, thus ensuring the encapsulation effect of the diode and reducing the encapsulation quality problems caused by bubbles.

[0045] As a preferred implementation manner in this embodiment, refer to the attached Figures 1-4 , a guide rail 8 is arranged on the support plate 3. A moving rail 9 is slidably arranged within the guide rail 8. An injection head 10 is arranged through the moving rail 9. One end of the injection head 10 is communicated with the transport pipe 6. A fixing plate 28 is fixedly arranged on the guide rail 8. A pushing cylinder 29 is arranged on the fixing plate 28. A suction cup is arranged at the output end of the pushing cylinder 29, and the suction cup contacts the extension plate 27; a collecting groove 30 is arranged on one side of the support table 1, and the collecting groove 30 is arranged on one side of the fixing plate 28;

[0046] The encapsulation material is transported to the injection head 10 through the transport pipe 6 and injected into the diode chip to be encapsulated by it. The auxiliary component eliminates the bubbles. At the same time, when the encapsulated diode moves to one side of the fixing plate 28, the suction cup at the output end of the pushing cylinder 29 can adsorb the extension plate 27, realizing the taking of the mounting seat 25, and can realize the mounting seat 25 falling into the collecting groove 30, thereby completing the taking of the encapsulated diode, and then completing an entire encapsulation process, effectively improving the automated operation during the encapsulation process and improving the encapsulation efficiency.

[0047] A diode encapsulation process is applied to the above-mentioned diode encapsulation device and includes the following steps:

[0048] S1. Select encapsulation material: According to the application scenario of the diode, select a suitable encapsulation material to ensure it has good insulation, thermal conductivity, and mechanical strength;

[0049] S2. Mold preparation: Place mounting seats 25 of different sizes on the contact table 21 according to requirements, and perform the next operation by rotating the rotating plate 11. Select a high-precision mold to ensure dimensional consistency and a smooth surface, so that the material can be evenly filled into the mold without generating bubbles or voids;

[0050] S3. Injection molding: Heat the encapsulation material to a flowing state, control the encapsulation material to enter the support table 1 through the transport pipe 6 by the operating instrument 5, inject the encapsulation material into the mounting seat 25 through the injection head 10, and repeatedly lift and lower the lifting rod 13 under the guidance of the limit head 24, which can cause the bubbles in the mounting seat 25 to dissipate during vibration, completely wrap the chip and leads, and ensure uniform material distribution;

[0051] S4. Demolding and inspection: Separate the mounting seat 25 from the contact table 21 by sucking and extending the extension plate 27 with the suction cup of the pushing cylinder 29, and check the appearance and dimensions of the encapsulation to ensure there are no bubbles, cracks, or dimensional deviations.

[0052] Select a suitable encapsulation material according to the application scenario, and through the preparation work of different-sized mounting seats 25 on the contact table 21 and a high-precision mold, the encapsulation material is transported to the injection head 10 through the operating instrument 5 and the transport pipe 6 and injected into the mounting seat 25. During the injection molding process, the lifting rod 13 repeatedly lifts and lowers under the guidance of the limit head 24, causing the bubbles of the encapsulation material in the mounting seat 25 to dissipate through vibration, ensuring that the material evenly covers the chip and leads. Finally, separate the mounting seat 25 and the contact table 21 with the suction cup of the pushing cylinder 29, take out the encapsulated diode, and check its appearance and dimensions to ensure the encapsulation quality; through the repeated movement of the lifting rod 13, the bubbles in the encapsulation material are effectively eliminated, ensuring the integrity and uniformity of the encapsulation. At the same time, the design of the pushing cylinder 29 and the suction cup simplifies the demolding process, reduces the complexity of manual operation, and improves the automation level. Through strict inspection steps, it is ensured that the encapsulated body has no bubbles, cracks, or dimensional deviations, improving the stability and quality of the product. The overall process is efficient and reliable, and can meet the diode encapsulation requirements of different scenarios.

[0053] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A diode packaging device, comprising a support table (1), an operating table (2) is arranged on one side of the support table (1), a support plate (3) is arranged on the top of the support table (1), a support frame (4) is arranged on the support plate (3), a protection plate (7) is arranged between the support frames (4), and it is characterized in that: An operating instrument (5) is provided on the operating table (2). A transport pipe (6) is communicatively provided on the operating instrument (5). One end of the transport pipe (6) is provided with an injection head (10). A driving source is provided inside the support plate (3). The output end of the driving source is provided with a rotating plate (11). An adjusting assembly is provided on the rotating plate (11). An auxiliary assembly is provided on the top of the support plate (3). The adjusting assembly is used for correcting and guiding the diode chip placed above it before encapsulation. The adjusting assembly includes a plurality of groups of mounting plates (12) provided on the rotating plate (11). A lifting rod (13) is penetrated through the mounting plate (12). A synchronous plate (14) is provided on the lifting rod (13). A second connecting rod (17) is penetrated through the synchronous plate (14). A deflecting plate (15) is sleeved on the second connecting rod (17). One end of the deflecting plate (15) is sleeved with a first connecting rod (16). An adjusting arm (18) is rotatably provided on the first connecting rod (16). A rotating rod (19) is penetrated through the adjusting arm (18). The adjusting arm (18) and the rotating rod (19) rotate relative to each other. The rotating rod (19) is penetrated through the mounting plate (12). The auxiliary assembly is used for eliminating bubbles during the encapsulation of the diode chip. The auxiliary assembly includes a plurality of groups of guiding rails (22) fixedly provided on the support plate (3). The guiding rails (22) are communicatively connected to each other. The height of the guiding rails (22) increases from both sides to the middle. A plurality of groups of adjusting grooves (23) are provided on one side of the guiding rail (22). The adjusting grooves (23) are arranged in a wavy pattern. A contact table (21) is provided on the top of the lifting rod (13). A mounting seat (25) is provided on the top of the contact table (21). A mounting groove (26) is provided in the mounting seat (25). The mounting groove (26) is adapted to the contact table (21). An extension plate (27) is provided on one side of the mounting seat (25).

2. The diode packaging device according to claim 1, characterized in that: A limiting head (24) is provided at the bottom of the lifting rod (13). A limiting groove is provided in the guiding rail (22). The limiting groove is adapted to the limiting head (24).

3. A diode packaging device according to claim 2, wherein: A guiding rail (8) is provided on the support plate (3). A moving rail (9) is slidably provided in the guiding rail (8). An injection head (10) is penetrated through the moving rail (9). One end of the injection head (10) is communicatively connected to the transport pipe (6). A fixing plate (28) is fixedly provided on the guiding rail (8). A pushing cylinder (29) is provided on the fixing plate (28). The output end of the pushing cylinder (29) is provided with a suction cup. The suction cup is in contact with the extension plate (27).

4. A diode packaging device according to claim 3, characterized in that: A collection groove (30) is provided on one side of the support table (1). The collection groove (30) is provided on one side of the fixing plate (28).

5. A diode packaging device according to claim 4, characterized in that: A plurality of groups of deviation correction grooves (20) are provided on the inner wall of the adjusting arm (18).

6. A diode packaging process, applied in a diode packaging device as described in any one of the above claims 1-5, characterized in that, Including the following steps: S1. Select encapsulation material: According to the application scenario of the diode, select a suitable encapsulation material to ensure good insulation, thermal conductivity and mechanical strength; S2. Mold preparation: Place mounting seats (25) of different sizes on the contact table (21) according to requirements, and perform the next operation by rotating the rotating plate (11); S3. Injection molding: Heat the encapsulation material to a flowing state, control the encapsulation material to enter the support table (1) through the transport pipe (6) by the operating instrument (5), inject the encapsulation material into the mounting seat (25) through the injection head (10), and repeatedly lift and lower the lifting rod (13) under the guidance of the limit head (24), so that the bubbles in the mounting seat (25) can dissipate during vibration and completely wrap the chip and leads; S4. Demolding and inspection: Adsorb the extension plate (27) by the suction cup of the pushing cylinder (29) to separate the mounting seat (25) from the contact table (21), and check the appearance and size of the encapsulation.

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