Chip three-dimensional SiP packaging system based on TSV technology

Abstract

The invention relates to a chip three-dimensional SiP packaging system based on a TSV technology, which belongs to the technical field of packaging of semiconductor devices and comprises a packaging shell, a temperature control device, a refrigeration sheet and a sensor. The packaging shell is used for heat dissipation, the temperature control device is fixedly arranged outside the packaging shell, the temperature control device is used for controlling the temperature in the packaging shell and keeping the temperature in the packaging shell constant, the refrigeration sheet is arranged in the packaging shell and connected to the temperature control device through an electric wire, and the sensor is connected to the temperature control device through an electric wire. The sensor is arranged in the packaging shell; the beneficial effects of the invention are that one surface of the refrigeration sheet refrigerates the chip assembly, and the temperature of the other surface of the refrigeration sheet and the temperature in the packaging shell are dissipated to the outside of the packaging shell through the packaging shell, so that the temperature in the packaging shell is kept constant.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor device packaging, and in particular relates to a chip three-dimensional SiP packaging system based on TSV technology. Background Art

[0002] TSV technology is an advanced packaging technology that achieves vertical connections within a chip, between chips, and between a chip and a package by drilling holes in the chip and filling it with conductive materials. TSV technology significantly improves the efficiency of data transmission between chips, reduces signal delays, reduces power consumption, and increases the integration density of packages. TSV technology forms vertical electrical channels by drilling holes in silicon wafers and filling them with conductive materials. These channels can run through the entire thickness of the chip, connecting different chip layers or different circuits within the same chip to each other, thereby achieving efficient electrical interconnection.

[0003] SIP packaging is a packaging structure of semiconductor devices, which integrates chips with multiple functions, including processors and memory chips, into one package to achieve a basic and complete function. However, when SIP packaging is performed by stacking chips, the heat generated inside the SIP packaging system increases significantly due to the increase in the number of chips, but the heat dissipation volume of the package does not increase accordingly, resulting in a sharp increase in the heat density inside the SIP packaging system, making it difficult for the heat to be quickly dissipated, that is, the heat is difficult to quickly dissipate to the outside of the SIP packaging system, which can easily cause the SIP packaging system to have poor heat dissipation problems. Summary of the invention

[0004] The present invention mainly solves the technical problem of how to keep the temperature inside a chip three-dimensional SiP packaging system constant. The present invention provides a chip three-dimensional SiP packaging system based on TSV technology. One side of a cooling plate cools the chip assembly, and the temperature of the other side of the cooling plate and the temperature inside the packaging shell are dissipated to the outside of the packaging shell through the packaging shell, thereby achieving a constant temperature inside the packaging shell.

[0005] In order to achieve the above object, the present invention is implemented by the following technical solutions:

[0006] A chip three-dimensional SiP packaging system based on TSV technology, comprising:

[0007] The packaging shell is made of a heat-conducting carbon fiber material and is used for heat dissipation;

[0008] A temperature control device is fixedly arranged outside the packaging shell and is used to control the temperature inside the packaging shell so that the temperature inside the packaging shell remains constant;

[0009] A cooling plate, which is arranged inside the packaging shell and connected to the temperature control device through an electric wire;

[0010] A sensor, the sensor is connected to the temperature control device through an electric wire, and the sensor is arranged inside the packaging shell;

[0011] The temperature inside the packaging shell is transmitted to the temperature control device through the sensor, and the temperature control device controls the cooling plate to operate the cooling plate. One side of the cooling plate cools the chip assembly, and the other side of the cooling plate dissipates heat through the packaging shell.

[0012] Optionally, one side of the cooling plate is tightly fitted to the chip assembly.

[0013] Optionally, cooling fins are provided on the inner upper wall and the inner lower wall of the packaging shell, and the sensor is arranged on the inner side wall of the packaging shell.

[0014] Optionally, the interior of the temperature control device includes:

[0015] A temperature acquisition module is used to collect the temperature inside the packaging shell;

[0016] A signal processing module is used to analyze the collected temperature signal and compare the temperature inside the packaging shell with the temperature set by the temperature control device;

[0017] A temperature control module is used to adjust or control the temperature of the refrigeration plate;

[0018] An execution unit, used to control the operation of the refrigeration plate;

[0019] Lines are connected in sequence from the sensor through the temperature acquisition module, the signal processing module, the temperature control module and the execution unit to the refrigeration plate.

[0020] Optionally, the signal processing module includes: a temperature signal analysis unit and a temperature comparison unit;

[0021] A temperature signal analysis unit, used for analyzing whether the collected temperature signal is a continuous temperature signal or a discrete temperature signal;

[0022] A temperature comparison unit, used to compare the temperature inside the packaging shell with the temperature set by the temperature control device;

[0023] Two ends of the temperature signal analysis unit are respectively connected to the temperature acquisition module and the temperature control module; two ends of the temperature comparison unit are respectively connected to the temperature acquisition module and the temperature control module.

[0024] Optionally, the temperature signal analysis unit uses a signal continuity-discrete judgment method to analyze the collected temperature signal. The signal continuity-discrete judgment method is the following formula (1):

[0025] (1);

[0026] in, is a continuous signal, To set is a continuous signal, is a discrete signal, To set is a discrete signal;

[0027] To analyze whether the signal is continuous or discrete;

[0028] To analyze whether the signal is continuous or discrete; For the analysis results.

[0029] Optionally, the temperature comparison unit uses a temperature trend method to compare the temperature inside the packaging shell with the temperature set by the temperature control device. The temperature trend method is the following formula (2):

[0030] (2);

[0031] in, The temperature set by the temperature control device, To adjust the temperature set by the temperature control device and then fix the temperature set by the temperature control device;

[0032] The temperature is lower than the temperature set by the temperature control device. , To determine The temperature value, For temperature Towards the temperature set by the temperature control device ;

[0033] The temperature is higher than the temperature set by the temperature control device. , To determine The temperature value, For temperature Towards the temperature set by the temperature control device ;

[0034] To compare whether there is temperature or temperature Towards the temperature set by the temperature control device ; For comparison results.

[0035] Optionally, the temperature control module decides whether to adjust or control the temperature of the refrigeration plate based on the analysis of the temperature comparison unit; if the temperature inside the packaging shell is the same as the temperature set by the temperature control device, the temperature of the refrigeration plate is not adjusted; if the temperature inside the packaging shell is different from the temperature set by the temperature control device, the temperature of the refrigeration plate is adjusted.

[0036] Optionally, the execution unit determines the operation of the refrigeration plate according to the operation of the temperature control module; if the temperature control module does not adjust the temperature of the refrigeration plate, the execution unit does not operate; if the temperature control module adjusts the temperature of the refrigeration plate, the execution unit operates.

[0037] Beneficial effects of the present invention:

[0038] 1. The present invention transmits the temperature inside the packaging shell to the temperature control device through a sensor, and the temperature control device controls the refrigeration plate to operate the refrigeration plate, and one side of the refrigeration plate cools the chip assembly, and the other side of the refrigeration plate dissipates heat through the packaging shell. The temperature inside the packaging shell is detected by a sensor, and according to the temperature detected by the sensor, the temperature control device is driven to operate the refrigeration plate, and one side of the refrigeration plate cools the chip assembly, and the temperature of the other side of the refrigeration plate and the temperature inside the packaging shell are dissipated to the outside of the packaging shell through the packaging shell. In this way, one side of the refrigeration plate cools the chip assembly, and the temperature of the other side of the refrigeration plate and the temperature inside the packaging shell are dissipated to the outside of the packaging shell through the packaging shell, so that the temperature inside the packaging shell is kept constant.

[0039] 2. In the present invention, after the temperature acquisition module acquires the temperature inside the packaging shell, the signal processing module analyzes the acquired temperature signal, and the signal processing module compares the temperature inside the packaging shell with the temperature set by the temperature control device, the temperature control module then adjusts or controls the temperature of the refrigeration plate, and the execution unit controls the operation of the refrigeration plate. One side of the refrigeration plate cools the chip assembly, and the temperature of the other side of the refrigeration plate and the temperature inside the packaging shell are dissipated to the outside of the packaging shell through the packaging shell, thereby achieving a constant temperature inside the packaging shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0041] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0042] Figure 2It is a schematic diagram of the cross-sectional structure of the present invention;

[0043] Figure 3 It is a schematic diagram of the internal circuit structure of the temperature control device of the present invention;

[0044] Figure 4 It is a schematic diagram of the chip component structure of the present invention.

[0045] Icon: 1-Packaging shell, 2-Temperature control device, 3-Wire, 4-Refrigeration sheet, 5-Chip assembly, 6-Sensor. DETAILED DESCRIPTION

[0046] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0047] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0048] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0049] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be welding, bolt connection, or riveting; it can be fixed connection, detachable connection, or integral connection; it can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0050] Embodiment 1;

[0051] like Figure 1 , Figure 2 and Figure 4As shown, this embodiment provides a chip three-dimensional SiP packaging system based on TSV technology, including: a packaging shell 1, a temperature control device 2, a cooling plate 4 and a sensor 6; the packaging shell 1 is a heat-conductive carbon fiber material, the packaging shell 1 is used for heat dissipation, the temperature control device 2 is fixedly arranged on the outside of the packaging shell 1, the temperature control device 2 is used to control the temperature inside the packaging shell 1, so that the temperature inside the packaging shell 1 remains constant, the cooling plate 4 is arranged inside the packaging shell 1, the cooling plate 4 is connected to the temperature control device 2 through the wire 3, the sensor 6 is connected to the temperature control device 2 through the wire 3, and the sensor 6 is arranged inside the packaging shell 1;

[0052] The temperature inside the packaging shell 1 is transmitted to the temperature control device 2 through the sensor 6, and the temperature control device 2 controls the cooling plate 4 to operate. One side of the cooling plate 4 cools the chip assembly 5, and the other side of the cooling plate 4 dissipates heat through the packaging shell 1.

[0053] One side of the cooling sheet 4 is in close contact with the chip assembly 5 . The cooling sheet 4 is provided on the inner upper wall and the inner lower wall of the packaging shell 1 . The sensor 6 is provided on the inner side wall of the packaging shell 1 .

[0054] In this embodiment, the sensor 6 detects the temperature inside the package shell 1. According to the temperature detected by the sensor 6, the temperature control device 2 is driven to operate the refrigeration plate 4. One side of the refrigeration plate 4 (i.e., the side where the refrigeration plate 4 and the chip assembly 5 are tightly attached) cools the chip assembly 5, and the temperature of the other side of the refrigeration plate 4 (i.e., the side where the refrigeration plate 4 and the package shell 1 are tightly attached) and the temperature inside the package shell 1 are dissipated to the outside of the package shell 1 through the package shell 1. In this way, one side of the refrigeration plate 4 cools the chip assembly 5, and the temperature of the other side of the refrigeration plate 4 and the temperature inside the package shell 1 are dissipated to the outside of the package shell 1 through the package shell 1, so that the temperature inside the package shell 1 is kept constant.

[0055] Since the chip assembly 5 is a combination of individual chips, the temperatures of the individual chips in the chip assembly 5 are mutually conductive, so the temperature of each location of the entire chip assembly 5 is the same.

[0056] Embodiment 2;

[0057] Based on Example 1, Figure 3 As shown, the interior of the temperature control device 2 includes:

[0058] A temperature acquisition module, used to acquire the temperature inside the packaging shell 1;

[0059] A signal processing module, used to analyze the collected temperature signal (i.e., the signal obtained by collecting the temperature inside the packaging shell 1), and compare the temperature inside the packaging shell 1 with the temperature set by the temperature control device 2;

[0060] A temperature control module, used to adjust or control the temperature of the refrigeration plate 4;

[0061] An execution unit, used to control the operation of the refrigeration plate 4;

[0062] Lines are connected in sequence from the sensor 6 through the temperature acquisition module, the signal processing module, the temperature control module and the execution unit to the refrigeration plate 4.

[0063] Specifically, Figure 3 As shown, the signal processing module includes: a temperature signal analysis unit and a temperature comparison unit;

[0064] A temperature signal analysis unit, used for analyzing whether the collected temperature signal is a continuous temperature signal or a discrete temperature signal;

[0065] A temperature comparison unit is used to compare the temperature inside the packaging shell 1 (i.e., the temperature inside the packaging shell 1 detected by the sensor 6) with the temperature set by the temperature control device 2 (the temperature comparison unit sets the temperature set by the temperature control device 2, i.e., the temperature set by the temperature control device 2 is the normal working temperature of the chip component 5 inside the packaging shell 1);

[0066] Two ends of the temperature signal analysis unit are respectively connected to the temperature acquisition module and the temperature control module; two ends of the temperature comparison unit are respectively connected to the temperature acquisition module and the temperature control module.

[0067] In this embodiment, after the temperature acquisition module acquires the temperature inside the packaging shell 1, the signal processing module analyzes the acquired temperature signal, and the signal processing module compares the temperature inside the packaging shell 1 with the temperature set by the temperature control device 2, the temperature control module then adjusts or controls the temperature of the refrigeration plate 4, and the execution unit controls the operation of the refrigeration plate 4.

[0068] The general safe operating temperature range of the refrigeration plate 4 is usually between -20°C and 55°C. The present invention sets the general safe operating temperature range of the refrigeration plate 4 between -5°C and 5°C. The temperature control module adjusts or controls the temperature of the refrigeration plate 4 in the following manner: one side of the refrigeration plate 4 is -1°C, and the other side of the refrigeration plate 4 is 1°C; one side of the refrigeration plate 4 is -2°C, and the other side of the refrigeration plate 4 is 2°C; and so on.

[0069] Embodiment 3;

[0070] Based on Example 2, the temperature signal analysis unit uses a signal continuity-discrete judgment method to analyze the collected temperature signal. The specific signal continuity-discrete judgment method is the following formula (1):

[0071] (1);

[0072] in, is a continuous signal, To set is a continuous signal, is a discrete signal, To set is a discrete signal;

[0073] To analyze whether the signal is continuous or discrete;

[0074] To analyze whether the signal is continuous or discrete; For the analysis results.

[0075] Formula (1) is to put the collected temperature signal on In the above example, the collected temperature signal and the continuous signal For comparison, at the same time, the collected temperature signal is placed on In the above example, the collected temperature signal and discrete signal For comparison, through The operation can be used to analyze whether the collected temperature signal is a continuous signal or a discrete signal.

[0076] In addition, the temperature comparison unit uses a temperature trend method to compare the temperature inside the packaging shell 1 with the temperature set by the temperature control device 2. The temperature trend method is the following formula (2):

[0077] (2);

[0078] in, is the temperature set by the temperature control device 2, The temperature set by the temperature control device 2 is adjusted and then fixed (i.e., the temperature set by the temperature control device 2 is first adjusted and then the temperature set by the temperature control device 2 is determined);

[0079] is lower than the temperature set by the temperature control device 2 , To determine The temperature value, For temperature Towards the temperature set by temperature control device 2 ;

[0080] is higher than the temperature set by the temperature control device 2 , To determine The temperature value, For temperature Towards the temperature set by temperature control device 2 ;

[0081] To compare whether there is temperature or temperature Towards the temperature set by temperature control device 2 ; For comparison results.

[0082] Formula (2) is that as long as there is a certain temperature value And temperature Tends to the temperature set by temperature control device 2 , or as long as there is a certain temperature value And temperature Tends to the temperature set by temperature control device 2 , or a certain temperature value And temperature Tends to the temperature set by temperature control device 2 , has a certain temperature value And temperature Tends to the temperature set by temperature control device 2 , then the temperature inside the package shell 1 is different from the temperature set by the temperature control device 2; if there is no determined temperature value Trending to temperature control device 2 and no determined temperature value Tends to the temperature set by temperature control device 2 , then the temperature inside the packaging shell 1 is the same as the temperature set by the temperature control device 2.

[0083] Embodiment 4;

[0084] Based on Example 2-Example 3, the temperature control module decides whether to adjust or control the temperature of the cooling plate 4 according to the analysis of the temperature comparison unit; if the temperature inside the packaging shell 1 is the same as the temperature set by the temperature control device 2, the temperature control module does not adjust the temperature of the cooling plate 4; if the temperature inside the packaging shell 1 is different from the temperature set by the temperature control device 2, the temperature control module adjusts the temperature of the cooling plate 4.

[0085] The execution unit determines the operation of the cooling plate 4 according to the operation of the temperature control module; if the temperature control module does not adjust the temperature of the cooling plate 4, the execution unit does not operate; if the temperature control module adjusts the temperature of the cooling plate 4, the execution unit operates.

[0086] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A chip three-dimensional SiP packaging system based on TSV technology, characterized in that: include: A packaging shell (1), wherein the packaging shell (1) is made of a heat-conductive carbon fiber material, and the packaging shell (1) is used for heat dissipation; A temperature control device (2), the temperature control device (2) being fixedly arranged outside the packaging shell (1), and the temperature control device (2) being used to control the temperature inside the packaging shell (1) so that the temperature inside the packaging shell (1) is kept constant; A refrigeration plate (4), the refrigeration plate (4) being arranged inside the packaging shell (1), and the refrigeration plate (4) being connected to the temperature control device (2) via an electric wire (3); A sensor (6), the sensor (6) being connected to the temperature control device (2) via the electric wire (3), and the sensor (6) being arranged inside the packaging shell (1); The temperature inside the packaging shell (1) is transmitted to the temperature control device (2) via a sensor (6), and the temperature control device (2) controls the cooling plate (4) to operate the cooling plate (4). One side of the cooling plate (4) cools the chip assembly (5), and the other side of the cooling plate (4) dissipates heat through the packaging shell (1).

2. The chip three-dimensional SiP packaging system based on TSV technology according to claim 1, characterized in that: One side of the cooling plate (4) is in close contact with the chip assembly (5).

3. The chip three-dimensional SiP packaging system based on TSV technology according to claim 2, characterized in that: The cooling fins (4) are provided on the inner upper wall and the inner lower wall of the packaging shell (1), and the sensor (6) is arranged on the inner side wall of the packaging shell (1).

4. The chip three-dimensional SiP packaging system based on TSV technology according to claim 1, characterized in that: The interior of the temperature control device (2) comprises: A temperature acquisition module, used for acquiring the temperature inside the packaging shell (1); A signal processing module, used to analyze the collected temperature signal and compare the temperature inside the packaging shell (1) with the temperature set by the temperature control device (2); A temperature control module, used for adjusting or controlling the temperature of the refrigeration plate (4); An execution unit, used for controlling the operation of the refrigeration plate (4); Line connections are sequentially made from the sensor (6) through the temperature acquisition module, the signal processing module, the temperature control module and the execution unit to the refrigeration plate (4).

5. The chip three-dimensional SiP packaging system based on TSV technology according to claim 4, characterized in that: The signal processing module includes: a temperature signal analysis unit and a temperature comparison unit; The temperature signal analysis unit is used to analyze whether the collected temperature signal is a continuous temperature signal or a discrete temperature signal; The temperature comparison unit is used to compare the temperature inside the packaging shell (1) with the temperature set by the temperature control device (2); Two ends of the temperature signal analysis unit are connected to the temperature acquisition module and the temperature control module respectively; two ends of the temperature comparison unit are connected to the temperature acquisition module and the temperature control module respectively.

6. The chip three-dimensional SiP packaging system based on TSV technology according to claim 5, characterized in that: The temperature signal analysis unit adopts a signal continuous-discrete judgment method to analyze the collected temperature signal. The signal continuous-discrete judgment method is the following formula (1): (1)； in, is a continuous signal, To set is a continuous signal, is a discrete signal, To set is a discrete signal; Operations to analyze whether a signal is continuous or discrete; To analyze whether the signal is continuous or discrete; For the analysis results.

7. The chip three-dimensional SiP packaging system based on TSV technology according to claim 5, characterized in that: The temperature comparison unit uses a temperature trend method to compare the temperature inside the packaging shell (1) with the temperature set by the temperature control device (2), and the temperature trend method is the following formula (2): (2)； in, is the temperature set by the temperature control device (2), The temperature set by the temperature control device (2) is adjusted and then fixed; The temperature is lower than the temperature set by the temperature control device (2). , To determine The temperature value, For temperature Towards the temperature set by the temperature control device (2) ; is higher than the temperature set by the temperature control device (2) , To determine The temperature value, For temperature Towards the temperature set by the temperature control device (2) ; To compare whether there is temperature or temperature Towards the temperature set by the temperature control device (2) ; For comparison results.

8. The chip three-dimensional SiP packaging system based on TSV technology according to claim 4, characterized in that: The temperature control module determines whether to adjust or control the temperature of the refrigeration plate (4) based on the analysis of the temperature comparison unit; if the temperature inside the packaging shell (1) is the same as the temperature set by the temperature control device (2), the temperature of the refrigeration plate (4) is not adjusted; if the temperature inside the packaging shell (1) is different from the temperature set by the temperature control device (2), the temperature of the refrigeration plate (4) is adjusted.

9. The chip three-dimensional SiP packaging system based on TSV technology according to claim 4, characterized in that: The execution unit determines the operation of the refrigeration plate (4) according to the operation status of the temperature control module; if the temperature control module does not adjust the temperature of the refrigeration plate (4), the execution unit does not operate; if the temperature control module adjusts the temperature of the refrigeration plate (4), the execution unit operates.

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