Substrate pre-welding lead frame plate

Abstract

The invention provides a substrate pre-welding lead frame plate. The substrate pre-welding lead frame plate comprises: a fixed frame; the connecting buckles are arranged on the two sides of the fixing frame respectively, a bottom substrate is arranged at the bottom of the fixing frame, a radar antenna is arranged on the bottom substrate, an ink plate is arranged at the bottom of the radar antenna, and a butt joint groove is formed in the top of the ink plate; the lead frame is installed at the top of the bottom substrate, a plurality of first inner pins are installed at the positions, close to the front face and the back face, of the top of the bottom substrate, and the other end of each first inner pin is fixedly connected with a first outer pin. According to the substrate pre-welding lead frame plate provided by the invention, the radar antenna area is formed at the bottom of the bottom substrate through the design, some relatively common chip and circuit production processes are adopted, but process combination is skillfully carried out; the radar chip structure with the antenna can be produced through the comprehensive processes, and the manufacturing method and the process of the radar chip structure with the antenna can be produced through the comprehensive processes.

Description

Technical Field

[0001] The invention relates to the technical field of substrate lead frames, in particular to a substrate pre-welded lead frame plate. Background Art

[0002] Radar chips are miniature sensors based on radar frequency applications that use wide-beam radar to identify movement, speed and distance. In the military, radar chips can be used to operate radars, guide ballistic missiles, and protect military hardware from nuclear and solar radiation. In civilian use, radar chips can be used in areas such as automobiles, robots and smartphones.

[0003] The radar chips currently on the market include microwave radar, centimeter-wave radar, millimeter-wave radar, etc., which detect targets by emitting waves in specific bands or frequency bands. The chip is one of the core components of the millimeter-wave radar. It integrates a variety of functional circuits, including sawtooth wave generators, synthesizers, power amplifiers PA, low-noise amplifiers LNA, filters, and analog-to-digital converters ADC. These components work together to generate and amplify millimeter-wave signals, receive reflected signals and convert them into digital signals. In order to ensure smooth signal transmission, the lead frame needs to be pre-soldered on the substrate.

[0004] During the use of the radar chip, the antenna needs to be laid outside the chip, which places high demands on application engineers and the cost of laying the antenna is high, increasing the cost and difficulty of subsequent maintenance.

[0005] Therefore, it is necessary to provide a substrate pre-welded lead frame version to solve the above technical problems. Summary of the invention

[0006] The present invention provides a substrate pre-welded lead frame plate, which solves the problem that in order to ensure smooth signal when the radar chip is used, an antenna needs to be arranged on the outer shell, which not only has high technical requirements but also high costs and increases later costs and difficulties.

[0007] In order to solve the above technical problems, the substrate pre-welded lead frame plate provided by the present invention comprises: a fixing frame;

[0008] Connecting buckles, the connecting buckles are respectively arranged on both sides of the fixing frame, the bottom of the fixing frame is provided with a bottom substrate, the bottom substrate is provided with a radar antenna, the bottom of the radar antenna is provided with an ink plate, and the top of the ink plate is provided with a docking groove;

[0009] A lead frame, wherein the lead frame is mounted on the top of a base substrate, a plurality of first inner pins are mounted on the top of the base substrate near the front and back sides, the other end of each of the first inner pins is fixedly connected to a first outer pin, a chip particle is mounted on the top of the base substrate, components are mounted on the top of the base substrate, thin wires are arranged on the top of the chip particle and components, a top substrate is mounted on the top of the fixing frame through a connecting buckle, the base substrate and the top substrate both use a single-layer double-sided copper cladding as a basic material, and an electronic circuit is arranged on the top of the base substrate;

[0010] The docking slot is the same shape as the radar antenna. The radar antenna is inserted into the docking slot and can be protected and fixed by an ink plate. The bottom substrate is installed on the bottom of the fixed frame through a connecting buckle, and the connection is sealed. The first outer pin passes through the fixed frame, and the other end of the thin wire is connected to the first inner pin. The connection between the top substrate and the fixed frame is also sealed. The bottom substrate and the top substrate can also be a synthetic fiber hard board or a ceramic substrate. According to the designed circuits, holes and radar antennas, a series of conventional PCB manufacturing processes are carried out to make a lead frame. Thin sheets of metal or alloy materials are used to obtain the corresponding graphics by stamping or cutting, and cut into corresponding sizes. The lead frame is fixed on the previously manufactured prefabricated substrate by glue or clamps to make an integrated frame. Thin wires are used for wire bonding, and the metal welding pads on the chip particles are welded and connected to the first inner pins on the lead frame by gold wires.

[0011] Preferably, the components are welded by SMT patch welding process, and the chip particles are fixed on the metal substrate of the integrated frame by die bonding process;

[0012] The chip particles are connected to the bottom substrate via electronic circuits.

[0013] Preferably, ink characters are arranged at the bottom of the ink plate, and a connector is arranged at the bottom of the ink plate;

[0014] The chip model or text is formed on the A or B side by ink screen printing or laser engraving.

[0015] Preferably, two through holes are provided at the bottom of the base substrate, the thin wire is a gold wire, and the fixing frame is made of epoxy resin material;

[0016] The perforations are to facilitate the passage of wires and connection to the radar antenna.

[0017] Preferably, ventilation holes are provided on the front and back of the top substrate, and filter cotton is installed on the front and back of the inner wall of the top substrate;

[0018] The air holes assist in heat dissipation, and the filter cotton can filter air and water vapor.

[0019] Preferably, a plurality of second inner pins are installed on the top of the bottom substrate near the front and back sides, and the tops of the second inner pins are threadedly connected with bolts.

[0020] Preferably, one end of the second inner pin is provided with two first sockets, the first sockets are each provided with a first connecting piece inside, and a row of threaded holes is provided on the top of one of the first connecting pieces;

[0021] The first connecting piece with a threaded hole is located at the top, which is convenient for threaded connection with the threaded hole and the bolt.

[0022] Preferably, one end of the two first connecting pieces is fixedly connected with a connecting foot, and the top of the connecting foot is provided with two second sockets;

[0023] Bolts are also installed on one side of the connecting foot near the top.

[0024] Preferably, a second connecting piece is disposed inside each of the two second sockets, and a second external pin is fixedly connected to one end of the two second connecting pieces;

[0025] One of the second connecting pieces is provided with a threaded hole which is threadedly connected to the bolt on the connecting foot.

[0026] Compared with the related art, the substrate pre-welded lead frame plate provided by the present invention has the following beneficial effects:

[0027] The present invention provides a substrate pre-welded lead frame plate. In order to facilitate the substrate pre-welding lead frame and reduce the subsequent maintenance cost and difficulty, the bottom substrate is first installed on the bottom of the fixed frame through a connecting buckle, and a lead frame is installed on the bottom of the bottom substrate. Then, a plurality of first inner pins with first outer pins are installed above the bottom substrate, and components and chip particles are installed on the electronic circuit on the bottom substrate, and thin wires are arranged on the chip particles to facilitate the connection of the chip particles and components with the electronic circuit and the first inner pins. In order to increase the sealing performance, the top substrate is installed above the fixed frame through the connecting buckle, and in order to increase the signal transmission, a radar antenna is installed at the bottom of the bottom substrate, and an ink plate with a docking groove is installed at the bottom of the radar antenna, which can protect and fix the radar antenna, and the first outer pin at the other end of the first inner pin penetrates the fixed frame and is located outside, which is convenient for connection with the corresponding position. Through this design, a radar antenna area is formed at the bottom of the bottom substrate, and some common chip and circuit production processes are adopted, but the processes are cleverly combined. Through these comprehensive processes, a structure, a manufacturing method and a process of a radar chip with a built-in antenna can be produced. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1A schematic structural diagram of a first embodiment of a substrate pre-welded lead frame plate provided by the present invention;

[0029] Figure 2 A structural schematic diagram of a docking groove is provided for the present invention;

[0030] Figure 3 A structural schematic diagram of a connector is provided for the present invention;

[0031] Figure 4 The present invention provides Figure 2 An enlarged view of point A is shown;

[0032] Figure 5 A schematic diagram of the structure of the filter cotton is provided for the present invention;

[0033] Figure 6 A schematic structural diagram of a second embodiment of a substrate pre-welded lead frame plate provided by the present invention;

[0034] Figure 7 A structural schematic diagram of a first connecting piece is provided for the present invention.

[0035] Numbers in the figure: 1. fixing frame, 2. bottom substrate, 3. radar antenna, 4. ink board, 5. first outer pin, 6. top substrate, 7. connecting buckle, 8. docking groove, 9. air vent, 10. perforation, 11. connector, 12. ink characters, 13. lead frame, 14. electronic circuit, 15. fine wire, 16. filter cotton, 17. second outer pin, 18. connecting foot, 19. first socket, 20. first connecting piece, 21. second inner pin, 22. second socket, 23. threaded hole, 24. bolt, 25. second connecting piece, 26. component, 27. first inner pin, 28. chip particles. DETAILED DESCRIPTION

[0036] The present invention will be further described below in conjunction with the accompanying drawings and implementation modes.

[0037] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 ,in, Figure 1 A schematic structural diagram of a first embodiment of a substrate pre-welded lead frame plate provided by the present invention; Figure 2 A structural schematic diagram of a docking groove is provided for the present invention; Figure 3 A structural schematic diagram of a connector is provided for the present invention; Figure 4 The present invention provides Figure 2 An enlarged view of point A is shown; Figure 5 The present invention provides a schematic diagram of the structure of the filter cotton. The substrate pre-welded lead frame plate comprises: a fixing frame 1;

[0038] Connecting buckles 7, the connecting buckles 7 are respectively arranged on both sides of the fixing frame 1, the fixing frame 1 is provided with a bottom substrate 2 at the bottom, the bottom substrate 2 is provided with a radar antenna 3, the radar antenna 3 is provided with an ink plate 4 at the bottom, and the top of the ink plate 4 is provided with a docking groove 8;

[0039] A lead frame 13, wherein the lead frame 13 is mounted on the top of the bottom substrate 2, a plurality of first inner pins 27 are mounted on the top of the bottom substrate 2 near the front and back sides, the other end of each of the first inner pins 27 is fixedly connected to a first outer pin 5, a chip particle 28 is mounted on the top of the bottom substrate 2, a component 26 is mounted on the top of the bottom substrate 2, and a thin wire 15 is arranged on the top of the chip particle 28 and the component 26, a top substrate 6 is mounted on the top of the fixing frame 1 through a connecting buckle 7, the bottom substrate 2 and the top substrate 6 are both made of single-layer double-sided copper cladding as the base material, and an electronic circuit 14 is arranged on the top of the bottom substrate 2;

[0040] The docking slot 8 has the same shape as the radar antenna 3. The radar antenna 3 is inserted into the docking slot 8. The ink plate 4 can be used to increase protection and fixation. The bottom substrate 2 is installed at the bottom of the fixed frame 1 through the connecting buckle 7. The connection is sealed. The first outer pin 5 passes through the fixed frame 1. The other end of the thin wire 15 is connected to the first inner pin 27. The connection between the top substrate 6 and the fixed frame 1 is also sealed. The bottom substrate 2 and the top substrate 6 can also be synthetic fiber hard boards or ceramic substrates. According to the designed circuits, holes and radar antenna 3, a series of conventional PCB manufacturing processes are carried out to make the lead frame 13. Thin sheets of metal materials or alloy materials are used to obtain corresponding patterns by stamping or cutting. And cut into corresponding sizes, fix the lead frame 13 on the previously prepared prefabricated substrate by glue or clamps to make an integrated frame, use fine wires 15 for wire bonding, weld and connect the metal welding pads on the chip particles 28 and the first inner pins 27 on the lead frame 13 by gold wires, and perform the sealing process. Put the entire integrated frame containing the bottom substrate 2, the top substrate 6 and the lead frame 13 into the packaging mold, and inject semi-molten epoxy resin into the packaging mold through a molding machine, and take it out after the fixed frame 1 is hardened. At this time, the BOT surface of the chip is obtained. After the radar chip is formed, the radar antenna 3 is located on the top, and the first outer pin 5 is tinned by electroplating to facilitate welding when the chip is used.

[0041] The components 26 are welded by SMT patch welding process, and the chip particles 28 are fixed on the metal substrate of the integrated frame by die bonding process;

[0042] The number of components 26 is determined according to the demand, and the chip particles 28 are connected to the base substrate 2 through the electronic circuit 14 .

[0043] The bottom of the ink plate 4 is provided with ink characters 12, and the bottom of the ink plate 4 is provided with a connector 11;

[0044] The model or text of the chip is formed on the A surface or the B surface by ink silk screen printing or laser engraving. The connector 11 is used to fix the ink plate 4.

[0045] The bottom of the base substrate 2 is provided with two through holes 10, the thin wire 15 is a gold wire, and the fixing frame 1 is made of epoxy resin material;

[0046] The perforation 10 is for the convenience of the line passing through and connecting with the radar antenna 3, and the shape of the thin wire 15 can be adjusted as needed.

[0047] The front and back sides of the top substrate 6 are provided with air holes 9, and the front and back sides of the inner wall of the top substrate 6 are provided with filter cotton 16;

[0048] The ventilation holes 9 are used to assist heat dissipation, and the filter cotton 16 can filter air and water vapor. If it is not necessary, the ventilation holes 9 can be sealed.

[0049] The working principle of the substrate pre-welded lead frame plate provided by the present invention is as follows:

[0050] First, the bottom substrate 2 is installed on the bottom of the fixed frame 1 through the connecting buckle 7, and a lead frame 13 is installed on the bottom of the bottom substrate 2, and then a plurality of first inner pins 27 with first outer pins 5 are installed on the top of the bottom substrate 2, and components 26 and chip particles 28 are installed on the electronic circuit 14 on the bottom substrate 2, and fine wires 15 are provided on the chip particles 28 to facilitate the connection between the chip particles 28 and components 26 and the electronic circuit 14 and the first inner pins 27. In order to increase the sealing, the top substrate 6 is installed on the top of the fixed frame 1 through the connecting buckle 7. In order to increase signal transmission, a radar antenna 3 is installed at the bottom of the bottom substrate 2, and an ink plate 4 with a docking groove 8 is installed at the bottom of the radar antenna 3, which can protect and fix the radar antenna 3, and the first outer pin 5 at the other end of the first inner pin 27 passes through the fixed frame 1 and is located outside, which is convenient for connection with the corresponding position.

[0051] Compared with the related art, the substrate pre-welded lead frame plate provided by the present invention has the following beneficial effects:

[0052] In order to facilitate the pre-welding of the lead frame on the substrate and reduce the cost and difficulty of later maintenance, the bottom substrate 2 is first installed on the bottom of the fixed frame 1 through the connecting buckle 7, and the lead frame 13 is installed on the bottom of the bottom substrate 2, and then a plurality of first inner pins 27 with first outer pins 5 are installed above the bottom substrate 2, and components 26 and chip particles 28 are installed on the electronic circuit 14 on the bottom substrate 2, and fine wires 15 are provided on the chip particles 28, which facilitates the connection between the chip particles 28 and the components 26 and the electronic circuit 14 and the first inner pins 27. In order to increase the sealing, the top substrate 6 is connected to the top of the fixed frame 1 through the connecting buckle 7. After installation, in order to increase signal transmission, a radar antenna 3 is installed at the bottom of the bottom substrate 2, and an ink plate 4 with a docking groove 8 is installed at the bottom of the radar antenna 3, which can protect and fix the radar antenna 3, and the first outer pin 5 at the other end of the first inner pin 27 penetrates the fixing frame 1 and is located outside, which is convenient for connection with the corresponding position. Through this design, a radar antenna area is formed at the bottom of the bottom substrate 2, and some more common chip and circuit production processes are adopted, but the processes are cleverly combined. Through these comprehensive processes, a structure, a manufacturing method and a process of a radar chip with a built-in antenna can be produced.

[0053] Second embodiment

[0054] Please refer to Figure 6-Figure 7 , Figure 6 A schematic structural diagram of a second embodiment of a substrate pre-welded lead frame plate provided by the present invention; Figure 7 The present invention provides a schematic diagram of the structure of the first connecting piece; based on the substrate pre-welded lead frame provided in the first embodiment of the present application, the second embodiment of the present application proposes another substrate pre-welded lead frame. The second embodiment is only a preferred method of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0055] Specifically, the difference of the substrate pre-welded lead frame version provided in the second embodiment of the present application is that a plurality of second inner pins 21 are installed at the top of the bottom substrate 2 near the front and back sides, and the tops of the second inner pins 21 are all threadedly connected with bolts 24;

[0056] The bolt 24 is threadedly inserted through the top of the second inner pin 21 .

[0057] Two first sockets 19 are formed at one end of the second inner pin 21, and first connecting pieces 20 are disposed inside the first sockets 19. A row of threaded holes 23 is formed at the top of one of the first connecting pieces 20.

[0058] The first connecting piece 20 with a threaded hole 23 is located at the top, which is convenient for threaded connection with the threaded hole 23 and the bolt 24 .

[0059] One end of the two first connecting pieces 20 is fixedly connected to a connecting pin 18, and the top of the connecting pin 18 is provided with two second sockets 22;

[0060] A bolt 24 is also installed on one side of the connecting leg 18 near the top, and the length of the connecting leg 18 is determined according to requirements.

[0061] The two second sockets 22 are each provided with a second connecting piece 25 , and one end of the two second connecting pieces 25 is fixedly connected to a second external pin 17 ;

[0062] A threaded hole 23 is formed on one of the second connecting pieces 25 and is threadedly connected to a bolt 24 on the connecting leg 18 , so that the two second connecting pieces 25 can be fixed inside the second socket 22 .

[0063] Compared with the related art, the substrate pre-welded lead frame plate provided by the present invention has the following beneficial effects:

[0064] In order to facilitate the second outer pin 17 to be able to adjust different lengths and be suitable for chip circuit boards of different sizes, two first sockets 19 are provided at one end of the second inner pin 21, and first connecting pieces 20 are provided inside the first sockets 19. In order to increase the stability of the two first connecting pieces 20, a threaded hole 23 is provided on one of the first connecting pieces 20, and the first connecting piece 20 is fixed inside the first socket 19 by a bolt 24. The stability of the connecting foot 18 can be increased by the two first connecting pieces 20, and one end of the two first connecting pieces 20 is fixedly connected with the connecting foot 18, and the first connecting piece 20 is fixedly connected to the connecting foot 18. There are two second sockets 22 at the top of 18. Then, you only need to insert the second connecting piece 25 with the second external pin 17 into the second socket 22 and fix it with the bolt 24. In actual use, the position of the connecting pin 18 can be adjusted by adjusting the length of the first connecting piece 20 pulled out from the first socket 19. At the same time, the hooking of the second external pin 17 can be adjusted by adjusting the length of the second connecting piece 25 pulled out from the second socket 22. Through this design, the length of the second external pin 17 can be adjusted as needed, so that it can be suitable for chip circuit boards of different sizes, thereby increasing applicability.

[0065] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. The substrate is pre-welded with a lead frame, characterized in that: include: Fixed frame; Connecting buckles, the connecting buckles are respectively arranged on both sides of the fixing frame, the bottom of the fixing frame is provided with a bottom substrate, the bottom substrate is provided with a radar antenna, the bottom of the radar antenna is provided with an ink plate, and the top of the ink plate is provided with a docking groove; A lead frame is installed on the top of a base substrate, a plurality of first inner pins are installed on the top of the base substrate near the front and back sides, the other end of each of the first inner pins is fixedly connected to a first outer pin, chip particles are installed on the top of the base substrate, components are installed on the top of the base substrate, thin wires are arranged on the top of the chip particles and components, a top substrate is installed on the top of the fixing frame through a connecting buckle, the base substrate and the top substrate both use single-layer double-sided copper cladding as the basic material, and an electronic circuit is arranged on the top of the base substrate.

2. The substrate pre-welded lead frame version according to claim 1, characterized in that: The components are welded by SMT patch welding process, and the chip particles are fixed on the metal substrate of the integrated frame by crystal bonding process.

3. The substrate pre-welded lead frame version according to claim 1, characterized in that: Ink characters are arranged at the bottom of the ink plate, and a connector is arranged at the bottom of the ink plate.

4. The substrate pre-welded lead frame version according to claim 1, characterized in that: The bottom of the base substrate is provided with two through holes, the thin wire is a gold wire, and the fixing frame is made of epoxy resin material.

5. The substrate pre-welded lead frame version according to claim 1, characterized in that: The front and back sides of the top substrate are both provided with ventilation holes, and the front and back sides of the inner wall of the top substrate are both provided with filter cotton.

6. The substrate pre-welded lead frame version according to claim 1, characterized in that: A plurality of second inner pins are installed at the top of the bottom substrate near the front and back sides, and the tops of the second inner pins are threadedly connected with bolts.

7. The substrate pre-welded lead frame version according to claim 6, characterized in that: One end of the second inner pin is provided with two first sockets, and the first sockets are each provided with a first connecting piece inside, wherein a row of threaded holes is provided on the top of one of the first connecting pieces.

8. The substrate pre-welded lead frame version according to claim 7, characterized in that: One end of the two first connecting pieces is fixedly connected with a connecting pin, and the top of the connecting pin is provided with two second sockets.

9. The substrate pre-welded lead frame version according to claim 8, characterized in that: A second connecting piece is disposed inside each of the two second sockets, and one end of the two second connecting pieces is fixedly connected to a second external pin.

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