Sealing structure for immersive cooling device

Abstract

A sealing structure for an immersion cooling apparatus for accommodating and cooling an optoelectronic processing device. The sealing structure includes a first cover portion, a second cover portion detachably connected to the first cover portion, and a sealing member. The sealing piece comprises a first sealing part arranged on the first cover part and a second sealing part arranged on the second cover part. The first cover portion, the second cover portion, and the seal collectively define a seal cover, and the seal cover sealingly covers an opening portion of a housing included in the immersion cooling apparatus. A portion of an optical fiber included in the photoelectric processing apparatus is sandwiched between and surrounded by the first sealing portion and the second sealing portion.

Description

Technical Field

[0001] The present invention relates to the field of sealing technology, and in particular to a sealing structure for an immersion cooling device, wherein the immersion cooling device is used to accommodate and cool a photoelectric processing device. Background Art

[0002] Optoelectronic integrated circuits (OEICs) use photons to replace electrons for computing and data transmission in integrated circuits, bringing great benefits to the development of industries that require high-efficiency data exchange, long-distance interconnection, 5G facilities and computing equipment. Optoelectronic integrated circuits are configured with photonic integrated circuits (PICs) and electronic integrated circuits (EICs), and can be packaged together as co-packaged optical components (CPOs). Today, CPO modules have been widely used in servers, and it is well known that servers generate a lot of heat energy during operation. In order to avoid degradation of operating performance, the circuit boards in the server are immersed in the heat dissipation liquid of the cooling container to absorb the heat energy generated by the electronic components. This heat exchange method requires a large amount of heat dissipation liquid or fluid coolant. In addition, even if the cooling container can be sealed, it is difficult to remove or replace the signal transmission line extending into the cooling container to connect to the CPO module. Unfortunately, there is no mature or effective solution to solve these problems. Summary of the invention

[0003] One of the purposes of the present application is to provide a sealing structure for an immersion cooling device to ensure that a photoelectric processing device is contained in the immersion cooling device in a sealed state and maintained at a default temperature, thereby enabling the photoelectric processing device to be in a good state.

[0004] Another object of the present application is to provide a sealing structure for an immersion cooling device, which can make it easier to replace signal transmission lines such as optical fibers while ensuring the sealing of the immersion cooling device.

[0005] In order to achieve the above-mentioned object, one aspect of the present application provides a sealing structure for an immersion cooling device, the immersion cooling device accommodates and is used to cool a photoelectric processing device, the photoelectric processing device includes a processing unit and a plurality of optical fibers connected to the processing unit, and the sealing structure includes a first cover, a second cover detachably connected to the first cover, and a seal. The seal includes a first sealing portion and a second sealing portion. The first sealing portion is arranged on the first cover and includes a first sealing surface, the second sealing portion is arranged on the second cover and includes a second sealing surface, and the first cover, the second cover and the seal jointly define a sealing cover, the sealing cover sealingly covers the opening of a box, and the box is included in the immersion cooling device. The first sealing surface and the second sealing surface are in contact with each other, and a portion of each of the optical fibers is sandwiched between the first sealing surface and the second sealing surface and surrounded by the first sealing surface and the second sealing surface.

[0006] Optionally, the first sealing portion has a first inner surface, which is arranged opposite to the first sealing surface and attached to the first cover portion, and the first sealing portion includes a first lower ring portion, which extends from the first inner surface to the first cover portion and is fastened to the first cover portion.

[0007] Optionally, the first sealing portion includes a first upper ring portion, which is disposed on the first inner surface and is located above the first lower ring portion and extends beyond the first lower ring portion.

[0008] Optionally, the second sealing portion includes a second inner surface and a second lower ring portion, the second inner surface is arranged relative to the second sealing surface and connected to the second cover portion, and the second lower ring portion extends from the second inner surface to the second cover portion and is fastened to the second cover portion.

[0009] Optionally, the second sealing member further comprises a second upper ring portion, which is disposed on the second inner surface and is located above the second lower ring portion and extends beyond the second lower ring portion.

[0010] Optionally, the first cover portion includes a first recessed portion arranged on one side of the first cover portion, and the second cover portion includes a second recessed portion arranged on one side of the second cover portion and facing the first recessed portion, wherein a portion of the first sealing portion is located in the first recessed portion, and a portion of the second sealing portion is located in the second recessed portion.

[0011] Optionally, the first cover portion includes a first protrusion, which protrudes outward from the periphery of the first cover portion, and the second cover portion includes a second protrusion, which protrudes outward from the periphery of the second cover portion, and the first protrusion and the second protrusion are located on the opening portion of the immersion cooling device.

[0012] Optionally, the first cover portion includes a plurality of fastening components, which are located at opposite ends of the first cover portion, and the second cover portion includes a plurality of fixing portions, which are located at opposite ends of the second cover portion and are configured to be connected to the plurality of fastening components respectively.

[0013] Optionally, the sealing structure for the immersion cooling device further comprises a connecting device, wherein the connecting device is located at an entry opening formed in the housing, wherein the connecting device comprises a connecting base, and a plurality of optical connector adapters and a plurality of interconnectors are arranged on the connecting base.

[0014] Optionally, the connecting device further comprises a fixing plate and a circuit board. The fixing plate is connected between the connecting base and the sealing cover, and the circuit board is mounted on the fixing plate.

[0015] Optionally, the immersion cooling device includes a storage shell, which includes a rack and a plurality of terminal connectors and defines a storage space, the plurality of terminal connectors are arranged on the rack, wherein the box is placed in the storage space and can be pulled out from the storage space, and the plurality of optical connector adapters and the plurality of interconnectors are electrically connected to the plurality of terminal connectors, respectively.

[0016] Optionally, the optoelectronic processing device also includes a mainboard, a carrier board arranged on the mainboard, and a co-packaged optical module arranged on the carrier board, the co-packaged optical module includes a first shell arranged on the carrier board, a second shell assembled with the first shell, and an optoelectronic transceiver module, the optoelectronic transceiver module and the processing unit are sealed between the first shell and the second shell.

[0017] Optionally, the optoelectronic transceiver module includes a detachable optical coupling structure, the optical coupling structure includes a first connector and a second connector, and the second connector is detachably connected to the first connector.

[0018] The sealing structure of the immersion cooling device, the optoelectronic processing device also includes a plurality of functional lines, a portion of each of the plurality of functional lines extends into the co-packaged optical module, and another portion of each functional line passes through the first sealing portion or is sandwiched between the first sealing surface and the second sealing surface, and is surrounded by the first sealing surface and the second sealing surface.

[0019] Another aspect of the present application provides a sealing structure for an immersion cooling device, the immersion cooling device is used to accommodate and cool a photoelectric processing device, the sealing structure includes a first cover, a second cover detachably connected to the first cover, and a seal disposed on the first cover and the second cover. The photoelectric processing device includes a carrier, a first shell disposed on the carrier, a second shell assembled with the first shell, and an optoelectronic transceiver module sealed between the first shell and the second shell. The optoelectronic transceiver module includes a detachable optical coupling structure, and the optical coupling structure includes a first connector and a second connector. The first connector is disposed on the carrier and includes a base and a waveguide device disposed in the base. The second connector includes a plurality of optical fibers, and the second connector is detachably connected to the first connector.

[0020] Optionally, the seal comprises a first sealing portion and a second sealing portion, the first sealing portion is disposed on the first cover portion and comprises a first sealing surface, the second sealing portion is disposed on the second cover portion and comprises a second sealing surface, and the first cover portion, the second cover portion and the seal together define a sealing cover, the sealing cover sealingly covers an opening portion, the opening portion is included in the immersion cooling device. The first sealing surface and the second sealing surface are in contact with each other, and a portion of each of the optical fibers is sandwiched between the first sealing surface and the second sealing surface and surrounded by the first sealing surface and the second seal.

[0021] The sealing structure provided in the embodiment of the present application enables the optoelectronic processing device in the housing of the immersion cooling device to have good sealing performance, which prevents the fluid coolant from leaking from the housing, thereby ensuring that the co-packaged optical module is maintained at a default temperature and that the optoelectronic processing device is in a good state. In addition, the detachable combination of the first cover and the second cover, the first sealing part and the second sealing part brings the advantage of easy replacement of the optical fiber assembly, thereby solving the problem of difficulty in replacing the signal transmission line. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to describe the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings used in the description of the embodiments. The drawings in the following description only illustrate some embodiments of the present invention, and those skilled in the art can also derive other drawings based on these drawings without creative work.

[0023] Figure 1 It is a schematic combination diagram of a sealing structure for an immersion cooling device according to an embodiment of the present application.

[0024] Figure 2 yes Figure 1 Schematic exploded view of the sealing structure.

[0025] Figure 2A yes Figure 1 A schematic enlarged cross-sectional view of a portion of a sealing structure is shown.

[0026] Figure 2B is a schematic perspective view of a sealing member according to an embodiment of the present application.

[0027] Figure 3 yes Figure 1 Schematic front and side view of the sealing structure.

[0028] Figure 4 yes Figure 1 Another assembly view of the sealing structure.

[0029] Figure 5 is a schematic three-dimensional exploded view of a photoelectric processing device according to an embodiment of the present application.

[0030] Figure 5A is a schematic assembly diagram of an optoelectronic transceiver module of an optoelectronic processing device according to an embodiment of the present application.

[0031] Figure 5B yes Figure 5A Schematic exploded diagram of .

[0032] Figure 6 It is a schematic partial cross-sectional view of a box of an immersion cooling device according to an embodiment of the present application.

[0033] Figure 7 It is a schematic stereoscopic diagram of a sealing structure that can be inserted into a box according to an embodiment of the present application.

[0034] Figure 8 yes Figure 7 A partial cross-sectional view of the box.

[0035] Fig. 9 is an enlarged cross-sectional view of a sealing structure according to an embodiment of the present application being inserted into an immersion cooling device.

[0036] Fig.10 It is a schematic stereoscopic diagram of a box body with a sealing structure placed in a storage housing according to an embodiment of the present application.

[0037] Fig.11 yes Fig.10 A schematic three-dimensional diagram of a box being pulled out from a storage housing. DETAILED DESCRIPTION

[0038] The following embodiments will illustrate specific practicable embodiments of the present application with reference to the accompanying drawings. Directional terms described in the present application, such as up, down, front, back, left, right, inside, outside, side, etc., are only referenced to the directions of the accompanying drawings, so the directional terms used are intended to be used to describe and understand the present application, but the present application is not limited thereto.

[0039] It should be understood that although the terms first, second, etc. may be used herein to describe various components, these components should not be limited by these terms. Unless otherwise specified, these terms are only used to distinguish one component from another component. Thus, for example, the first component, first part, or first portion discussed below may be referred to as a second component, second part, or second portion without departing from the teachings of the present application.

[0040] The present invention provides a sealing structure for an immersion cooling device. The immersion cooling device is configured to accommodate and cool a photoelectric processing device, which can be operated in the immersion cooling device with a fluid coolant, and the sealing structure of the present application ensures that the photoelectric processing device is accommodated in the immersion cooling device in a sealed state and maintained at a default temperature, thereby keeping the photoelectric processing device in a good state during use.

[0041] refer to Figures 1 to 4 , Figure 1 is a schematic assembly diagram of a sealing structure 1 for an immersion cooling device 5 according to an embodiment of the present application (see the following description) Figure 6 ), Figure 2 yes Figure 1 A schematic exploded view of the sealing structure 1, Figure 2A yes Figure 1 A schematic enlarged cross-sectional view of a portion of the sealing structure 1 is shown, Figure 2B is a schematic three-dimensional diagram of the seal 13, Figure 3 yes Figure 1 Schematic front and side view of Figure 4 yes Figure 1 Another assembly view of the sealing structure 1. Figure 1 and Figure 2 As shown, the present application provides an immersion cooling device 5 (see the following description) Figure 6 ), the optoelectronic processing device 3 is located in the immersion cooling device 5. In some embodiments, the optoelectronic processing device 3 includes a co-packaged co-packaged optical module 30, which is connected to a plurality of signal transmission lines including a plurality of optical fibers 331 and a plurality of functional lines 37 for signal transmission with an external device.

[0042] Reference Figure 1 and Figure 2The sealing structure 1 includes a first cover 11, a second cover 12 and a sealing member 13, wherein the second cover 12 is detachably connected to the first cover 11. In some embodiments, the sizes and shapes of the first cover 11 and the second cover 12 are symmetrical, so that they can be combined with the sealing member 13 into a whole to form a sealing cover 10. The sealing cover 10 is configured to sealably cover the opening 510 of the immersion cooling device 5 (see the following description). Figure 6 In some embodiments, the seal 13 may be made of a material including, for example, rubber, silicon, fluororubber (also known as Viton, FPM or FKM), silicone or a silicone compound, but the present application is not limited thereto. Figure 2 and Figure 2A As shown, the seal 13 includes a first seal portion 131 and a second seal portion 132, each of which is provided as a separate component. The first seal portion 131 is provided on the first cover portion 11 and includes a first sealing surface 131a facing the second cover portion 12. The second seal portion 132 is provided on the second cover portion 12 and includes a second sealing surface 132a facing the first sealing surface 131a. Figure 1 and Figure 2A As shown, after assembling the first cover portion 11 and the second cover portion 12, the first sealing surface 131a and the second sealing surface 132a contact each other, so that a portion of each optical fiber 331 is sandwiched between the first sealing surface 131a and the second sealing surface 132a and surrounded by the first sealing surface 131a and the second sealing surface 132a.

[0043] Reference Figures 1 to 3 The first cover portion 11 is long and has a stepped edge profile to improve the bonding strength between the first sealing portion 131 and the first cover portion 11 and also enhance the sealing performance at the opening 510 (see the following description). Figure 6 In some embodiments, the first cover portion 11 includes a first recessed portion 111 and a first convex portion 112. Figure 2 and Figure 2A As shown, the first recessed portion 111 is provided on the long side of the first cover portion 11 and is recessed into the first cover portion 11. The first convex portion 112 is provided on the top of the first cover portion 11 and protrudes outward from the periphery of the first cover portion 11. Similarly, the second cover portion 12 includes a second recessed portion 121 and a second convex portion 122. In detail, the second recessed portion 121 is provided on the long side of the second cover portion 12 and is recessed into the second cover portion 12. The second convex portion 122 is provided on the top of the second cover portion 12 and protrudes outward from the periphery of the second cover portion 12.

[0044] like Figure 2 , Figure 2A and Figure 3As shown, the first concave portion 111 and the first convex portion 112 together form a stepped edge profile in the depth direction D1 from the outermost top surface of the first cover portion 11 to the outermost bottom surface of the first cover portion 11, and the second concave portion 121 and the second convex portion 122 together form a stepped edge profile in the depth direction D1. In some embodiments, as Figure 2A As shown, the first cover portion 11 further includes a first lower groove 11a and a first upper groove 11b. Specifically, the first lower groove 11a is formed on the outer surface of the first cover portion 11 and extends along the entire outer edge of the first cover portion 11. The first upper groove 11b is formed on the bottom surface of the first convex portion 112 and extends along the entire outer edge of the first convex portion 112. Preferably, the orthographic projection of the first upper groove 11b on the horizontal plane does not overlap with the orthographic projection of the first lower groove 11a on the horizontal plane.

[0045] Similarly, if Figure 2A As shown, the second cover portion 12 further includes a second lower groove 12a and a second upper groove 12b. Specifically, the second lower groove 12a is formed on the outer surface of the second cover portion 12 and extends along the entire outer edge of the second cover portion 12. The second upper groove 12b is formed on the bottom surface of the second convex portion 122 and extends along the entire outer edge of the second convex portion 122. Preferably, the orthographic projection of the second upper groove 12b on the horizontal plane does not overlap with the orthographic projection of the second lower groove 12a on the horizontal plane.

[0046] Reference Figures 2 to 4 The first sealing portion 131 includes a first inner surface 131b, which is opposite to the first sealing surface 131a and attached to the first cover portion 11. Figure 2A and 2B As shown, the top of the first sealing portion 131 is bent toward the first recessed portion 111 to form a first bent portion 131c, and the first bent portion 131c is positioned in the first recessed portion 111 so that the first bent portion 131c completely fills the first recessed portion 111. Figure 2A and 2B As shown, the first sealing portion 131 further includes a first lower ring portion 1311 and a first upper ring portion 1312. Specifically, the first lower ring portion 1311 extends from the first inner surface 131b toward the first cover portion 11 as a whole, and is fastened to the first cover portion 11 by being closely attached to the first lower groove 11a. The first upper ring portion 1312 extends from the first inner surface 131b as a whole, exceeds the first lower ring portion 1311, and is located above the first lower ring portion 1311.

[0047] like Figure 2 , 2AAs shown in FIGS. 2B and 2B, similar to the first sealing portion 131, the second sealing portion 132 includes a second inner surface 132b, and the second inner surface 132b is opposite to the second sealing surface 132a and attached to the second cover portion 12. In detail, the top of the second sealing portion 132 is bent toward the second recessed portion 121 to form a second curved portion 132c, and the second curved portion 132c is positioned in the second recessed portion 121 so that the second curved portion 132c completely fills the second recessed portion 121. In this embodiment, the second sealing portion 132 also includes a second lower ring portion 1321 and a second upper ring portion 1322. In detail, the second lower ring portion 1321 extends from the second inner surface 132b toward the second cover portion 12 as a whole, and is fastened to the second cover portion 12 by being closely attached to the second lower groove 12a. The second upper ring portion 1322 extends from the second inner surface 132b as a whole beyond the second lower ring portion 1321 and is located above the second lower ring portion 1321.

[0048] As described above, the provision of the first recess 111 and the second recess 121 increases the contact area with the sealing member 13 , thereby further enhancing the bonding strength between the first sealing portion 131 and the first cover portion 11 and between the second sealing portion 132 and the second cover portion 12 .

[0049] Reference Figure 1 and Figure 2 , a plurality of fastening components 113 are located at opposite ends of the first cover portion 11 facing the second cover portion 12, and a plurality of fixing portions 123 are located at opposite ends of the second cover portion 12 corresponding to the fastening components 113. In some embodiments, as Figure 2 As shown, each of the fastening components 113 is pin-shaped and spaced apart from each other in the depth direction D1. Each of the fixing portions 123 is hollow cylindrical, so that the fastening components 113 can be respectively inserted into the fixing portions 123 and closely attached to the fixing portions 123. In some embodiments, the fastening components 113 and the fixing portions 123 can also be firmly fixed by, for example, structural coupling, screw fastening, etc. With the help of the combination of the first cover portion 11 and the second cover portion 12, the first sealing portion 131 and the second sealing portion 132 can be tightly attached to each other, so that a portion of each optical fiber 331 is sandwiched between the first sealing surface 131a and the second sealing surface 132a and surrounded by the first sealing surface 131a and the second sealing surface 132a (see Figure 2A The detachable combination of the first cover portion 11 and the second cover portion 12 and the first sealing portion 131 and the second sealing portion 132 can also facilitate replacement of the optical fiber assembly 33 in the event of damage or failure (see Figures 5 to 5B )’s advantages.

[0050] like Figure 4As shown, in this embodiment, a portion of each functional line 37 extends into the co-packaged optical module 30, while another portion passes through the first sealing portion 131. In detail, a plurality of through holes 1310 are pre-formed in the first sealing portion 131 so that the functional line 37 can be inserted. Optionally, according to actual needs, the functional line 37 can pass through the second sealing portion 132 or the first sealing portion 131 and the second sealing portion 132. In some other embodiments, part of the functional line 37 can also be sandwiched between the first sealing surface 131a and the second sealing surface 132a and surrounded by the first sealing surface 131a and the second sealing surface 132a. In some embodiments, as Figure 5 As shown, the functional line 37 includes two power lines 371 and two pressure regulating tubes 372. The power line 371 is used to supply power to the components disposed on the carrier 35. The pressure regulating tube 372 is used to maintain the atmospheric pressure inside the co-packaged optical module 30 in response to the temperature fluctuation in the co-packaged optical module 30 to ensure the normal operation of the co-packaged optical module 30.

[0051] Reference Figure 1 and Figure 3 to Figure 4 , the sealing structure 1 also includes a connecting device 20 for keeping the optical fiber 331 and the functional line 37 outside the sealing cover 10. In some embodiments, the connecting device 20 includes a connecting base 21, a plurality of optical connector adapters 22, a plurality of interconnectors 23, a fixing plate 24 and a circuit board 25. In detail, the optical connector adapter 22 and the interconnector 23 are arranged on the connecting base 21 for connecting with an external connector or adapter. The fixing plate 24 is connected between the connecting base 21 and the sealing cover 10 to keep the connecting base 21 above the sealing cover 10. The circuit board 25 is mounted on the fixing plate 24 for configuring the data processing components. In some embodiments, the optical connector adapter 22 and the interconnector 23 are connected to the optical fiber 331 and the functional line 37, and are used to transmit signals or power to the co-packaged optical module 30, but the present application does not specifically limit the types of the optical connector adapter 22 and the interconnector 23.

[0052] It should be noted that, in some embodiments, the connection device 20 may be designed to not use the connection base 21 and the fixing plate 24, but to place the optical connector adapter 22, the interconnector 23 and the circuit board 25 on an external device.

[0053] Please combine Figure 1 refer to Figure 5 , Figure 5A and Figure 5B , Figure 5 is a schematic exploded perspective view of a photoelectric processing device 3 according to an embodiment of the present application, Figure 5A is a schematic assembly diagram of the optoelectronic transceiver module 31 of the optoelectronic processing device 3, Figure 5B yes Figure 5AThe optoelectronic processing device 3 further includes a carrier board 35 and a main board 36. The carrier board 35 is a printed circuit board disposed on the main board 36, and the main board 36 is fixed to the first cover portion 11 of the sealing cover 10. In some embodiments, the co-packaged optical module 30 is disposed on the carrier board 35, and includes a first housing 301 disposed on the carrier board 35, a second housing 302 detachably assembled with the first housing 301, a plurality of optoelectronic transceiver modules 31, and a processing unit 34.

[0054] like Figure 5 As shown, the optoelectronic transceiver module 31 is electrically connected to the processing unit 34 sealed between the first housing 301 and the second housing 302. Specifically, each optoelectronic transceiver module 31 includes an optoelectronic transceiver connector 32 and an optical fiber assembly 33 connected to the optoelectronic transceiver connector 32. In some embodiments, the processing unit 34 may include one or more electronic integrated circuits (electronic integrated circuits, EICs), such as a microprocessor, an application specific integrated circuit (ASIC) or a memory, and one or more photonic integrated circuits (photonic integrated circuits, PICs).

[0055] Continued reference Figure 5 , 5A In some embodiments, the optoelectronic transceiver module 31 includes a detachable optical coupling structure, which includes a first connector (e.g., an optoelectronic transceiver connector 32) and a second connector (e.g., an optical fiber assembly 33). The second connector is detachably connected to the first connector, so that the optical fiber assembly 33 can be easily replaced. Figure 5A and 5B As shown, the optoelectronic transceiver connector 32 includes a base 320 and a waveguide device 321. The base 320 includes a lower surface 320B, an upper surface 320T, and a front end 320F connected between the lower surface 320B and the upper surface 320T. In some embodiments, a cutout portion 322 is formed in the base 320 and is recessed from the front end 320F, and the waveguide device 321 is disposed in the cutout portion 322. In detail, the cutout portion 322 is configured to pass through the lower surface 320B, the upper surface 320T, and the front end 320F of the base 320 portion.

[0056] In some embodiments, Figure 5BAs shown, a plurality of positioning components 323 are symmetrically arranged on the front end 320F of the base 320 with respect to the middle of the base 320, and are spaced apart from each other on opposite sides of the cutout portion 322 and the waveguide device 321. A retaining wall 324 is formed on the base 320, and is bent and extended downward from the lower surface 320B, so that the base 320 has an inverted L-shaped cross-sectional profile. In this embodiment, there are two positioning components 323, which are pin-shaped and extend outward from the front end 320F on the retaining wall 324, respectively. In some embodiments, the base 320 is made of a material having high temperature resistance, such as ceramic or metal, such as zirconium dioxide (ZrO2). Alternatively, the base 320 can be made of a non-metallic material, such as an organic binder (such as a resin), a polymer or a plastic.

[0057] Preferably, the waveguide device 321 is made of a material including, for example, silicon dioxide. Alternatively, the waveguide device 321 can be made of a material including silicon on insulator (SOI), lithium niobate (LiNbO3) or a polymer. In some embodiments, the waveguide device 321 can be formed using materials such as fused quartz, quartz, glass, borosilicate glass, etc. It should be noted that the waveguide device 321 includes a planar lightwave circuit (PLC). In some embodiments, the planar lightwave circuit can be configured in various ways, including but not limited to a straight line circuit, a separator circuit, an array waveguide grating wavelength multiplexer, and a cross-connection type circuit. In one embodiment of the present application, different types of waveguide circuits or devices can be used for the planar lightwave circuit.

[0058] Still refer to Figures 5 to 5B In some embodiments, the optical fiber assembly 33 includes an optical fiber 331 and a docking connector 332, wherein the docking connector 332 is configured to be detachably connected to the optoelectronic transceiver connector 32. The optical fiber 331 has a plurality of optical fiber ends 333 (such as Figure 5A In this embodiment, the docking connector 332 is used as an optical multi-channel connector and includes a connection surface 334 configured to face the front end 320F of the base 320, and the docking connector 332 includes a plurality of recesses (not shown) configured to correspond to the pin-shaped positioning components 323 (such as Figure 5B As shown in Figure 5A As shown, the optical fiber assembly 33 is inserted into the optical transceiver connector 32. Figure 5B As shown, the fiber optic assembly 33 can be removed from the base 320 of the optical / electrical transceiver connector 32 .

[0059] In this configuration, if Figure 5AAs shown, the fiber end 333 of the optical fiber 331 is positioned to directly face the cutout portion 322 at the front end 320F of the base 320, so that a signal can be transmitted between the optical fiber 331 and the waveguide device 321 in a surface coupling manner. It should be noted that in the present application, the signal transmission between the optical fiber 331 and the waveguide device 321 is not limited to the surface coupling type as described above, but may be various forms of optical coupling.

[0060] Reference Figures 6 to 9 , Figure 6 is a schematic partial cross-sectional view of a box 51 of an immersion cooling device 5 according to an embodiment of the present application, Figure 7 A schematic three-dimensional diagram showing that the sealing structure 1 can be inserted into the box 51, Figure 8 Indicated Figure 7 A partial cross-sectional view of the housing 51, and Fig. 9 is an enlarged cross-sectional view showing the sealing structure 1 inserted into the immersion cooling device 5. Figure 6 and 7 As shown, the immersion cooling device 5 includes a box 51, which is configured to have a plurality of cooling chambers 511. Each cooling chamber 511 is filled with a fluid coolant 50 (e.g., cold water or dielectric coolant) for cooling the co-packaged optical module 30. In this embodiment, each cooling chamber 511 of the box 51 is molded to have an opening 510, and the size and shape of the opening 510 are designed to fit tightly around the sealing cover 10 (see FIG. Fig. 9 In addition, a plurality of access openings 512 are formed on the top of the box body 51, and these access openings 512 are located above and communicated with the corresponding opening portion 510. The size of each access opening 512 is set to be able to support the corresponding connection base 21 of the connection device 20.

[0061] In some embodiments, Figure 6 and Figure 7 As shown, the immersion cooling device 5 further includes a circulating cooling component 52, which is disposed on one side of the box body 51 to improve cooling performance.

[0062] Still refer to Figures 7 to 9 In use, the main board 36 together with the co-packaged optical module 30 are inserted into the cooling chamber 511, so that the co-packaged optical module 30 is immersed in the fluid coolant 50, the first convex portion 112 and the second convex portion 122 of the sealing cover 10 located on the opening 510 are in contact with the opening 510, and the connection base 21 is supported on the inlet opening 512 of the box body 51. Specifically, after the sealing cover 10 is installed in place, the first lower ring portion 1311 and the second lower ring portion 1321 are in close contact with the periphery of the opening 510, and the first upper ring portion 1312 and the second upper ring portion 1322 are in close contact with the top surface around the opening 510, so that the cooling chamber 511 is in an excellent sealing state.

[0063] Reference Fig.10 and Fig.11 , Fig.10 A schematic three-dimensional diagram showing a box 51 having a sealing structure 1 according to an embodiment of the present application being placed in a storage housing 53 is shown. Fig.11 The diagram shows the device being pulled out from the storage housing 53. Fig.10 A schematic three-dimensional diagram of the box body 51. Fig.10 As shown, the immersion cooling device 5 includes a storage case 53, which includes a plurality of storage space units 531, a bracket 532, a cover 533 for closing the storage space 531, and a plurality of terminal connectors 534 disposed on the bracket 532. In some embodiments, the case 51 is placed in the storage space 531 and can be withdrawn from the storage space 531, and the optical connector adapter 22 and the interconnector 23 are respectively electrically connected to the terminal connector 534. The optoelectronic processing device 3 immersed in the case 51 can be electrically and optically connected to an external device through the terminal connector 534 to achieve transmission of electrical and optical signals.

[0064] According to the above disclosure, the sealing structure provided in the embodiment of the present application enables the optoelectronic processing device in the housing of the immersion cooling device to have good sealing, which prevents the fluid coolant from leaking from the housing, thereby ensuring that the co-packaged optical module is kept at a default temperature and enables the optoelectronic processing device to be in a good state. In addition, the detachable combination of the first cover and the second cover and the first sealing part and the second sealing part brings the advantage of easy replacement of the optical fiber assembly, thereby solving the problem of difficulty in replacing the signal transmission line.

[0065] The above embodiments are used to illustrate the technical ideas of the present disclosure, but not to limit the technical ideas of the present disclosure. Therefore, the scope of rights of the present disclosure is not limited to the embodiments. The protection scope of the present disclosure shall be interpreted by the claims, and shall be interpreted as all technical ideas that are the same or equivalent to the above protection scope are included in the scope of rights of the present disclosure.

Claims

1. A sealing structure for an immersion cooling device, wherein the immersion cooling device accommodates and is used to cool a photoelectric processing device, wherein the photoelectric processing device comprises a processing unit and a plurality of optical fibers connected to the processing unit, wherein: The sealing structure comprises: A first cover portion: a second cover portion detachably connected to the first cover portion; and a sealing member, comprising a first sealing portion and a second sealing portion, wherein the first sealing portion is disposed on the first cover portion and comprises a first sealing surface, the second sealing portion is disposed on the second cover portion and comprises a second sealing surface, and the first cover portion, the second cover portion and the sealing member together define a sealing cover, the sealing cover sealingly covers an opening of a box, the box being included in the immersion cooling device; The first sealing surface and the second sealing surface are in contact with each other, and a portion of each of the optical fibers is sandwiched between the first sealing surface and the second sealing surface and surrounded by the first sealing surface and the second sealing surface.

2. The sealing structure for immersion cooling equipment according to claim 1, characterized in that: The first sealing portion includes a first inner surface and a first lower ring portion, the first inner surface is arranged opposite to the first sealing surface and attached to the first cover portion, and the first lower ring portion extends from the first inner surface to the first cover portion and is fastened to the first cover portion.

3. The sealing structure for immersion cooling equipment according to claim 2, characterized in that: The first sealing portion further includes a first upper ring portion, which is disposed on the first inner surface and is located above the first lower ring portion and extends beyond the first lower ring portion.

4. The sealing structure for immersion cooling equipment according to claim 1, characterized in that: The second sealing portion has a second inner surface and a second lower ring portion, the second inner surface is arranged relative to the second sealing surface and connected to the second cover portion, and the second lower ring portion extends from the second inner surface to the second cover portion and is fastened to the second cover portion.

5. The sealing structure for immersion cooling equipment according to claim 4, characterized in that: The second seal also includes a second upper ring portion disposed on the second inner surface and located above the second lower ring portion and extending beyond the second lower ring portion.

6. The sealing structure for immersion cooling equipment according to claim 1, characterized in that: The first cover portion includes a first recessed portion arranged on one side of the first cover portion, and the second cover portion includes a second recessed portion arranged on one side of the second cover portion and facing the first recessed portion, wherein a portion of the first sealing portion is located in the first recessed portion, and a portion of the second sealing portion is located in the second recessed portion.

7. The sealing structure for immersion cooling equipment according to claim 1, characterized in that: The first cover portion includes a first convex portion, which protrudes outward from the periphery of the first cover portion; the second cover portion includes a second convex portion, which protrudes outward from the periphery of the second cover portion, and the first convex portion and the second convex portion are located on the opening portion of the immersion cooling device.

8. The sealing structure for immersion cooling equipment according to claim 1, characterized in that: The first cover portion includes a plurality of fastening components located at opposite ends of the first cover portion, and the second cover portion includes a plurality of fixing portions located at opposite ends of the second cover portion and configured to be connected to the plurality of fastening components, respectively.

9. The sealing structure for immersion cooling equipment according to claim 1, characterized in that: The sealing structure further comprises a connecting device, wherein the connecting device is located at an access opening formed in the box body, wherein the connecting device comprises a connecting base, and a plurality of optical connector adapters and a plurality of interconnectors are arranged on the connecting base.

10. The sealing structure for immersion cooling equipment according to claim 9, characterized in that: The connecting device also includes: a fixing plate connected between the connecting base and the sealing cover; and A circuit board is mounted on the fixing plate.

11. The sealing structure for immersion cooling equipment according to claim 10, characterized in that: The immersion cooling device includes a storage shell, which includes a rack and a plurality of terminal connectors and defines a storage space, wherein the plurality of terminal connectors are arranged on the rack, wherein the box is placed in the storage space and can be withdrawn from the storage space, and the plurality of optical connector adapters and the plurality of interconnectors are electrically connected to the plurality of terminal connectors, respectively.

12. The sealing structure of the immersion cooling device according to claim 1, characterized in that: The optoelectronic processing device also includes a mainboard, a carrier board arranged on the mainboard, and a co-packaged optical module arranged on the carrier board. The co-packaged optical module includes a first shell arranged on the carrier board, a second shell assembled with the first shell, and an optoelectronic transceiver module. The optoelectronic transceiver module and the processing unit are sealed between the first shell and the second shell.

13. The sealing structure for immersion cooling equipment according to claim 12, characterized in that: The optoelectronic transceiver module includes a detachable optical coupling structure, and the optical coupling structure includes a first connector and a second connector, and the second connector is detachably connected to the first connector.

14. The sealing structure of the immersion cooling device according to claim 12, characterized in that: The optoelectronic processing device also includes a plurality of functional lines, a portion of each of the plurality of functional lines extends into the co-packaged optical module, and another portion of each functional line passes through the first sealing portion or is sandwiched between the first sealing surface and the second sealing surface, and is surrounded by the first sealing surface and the second sealing surface.

15. A sealing structure for an immersion cooling device, the immersion cooling device being used to accommodate and cool a photoelectric processing device, characterized in that: The sealing structure comprises: First cover a second cover portion detachably connected to the first cover portion; and A sealing member is disposed on the first cover portion and the second cover portion, wherein the optoelectronic processing device includes a carrier, a first shell disposed on the carrier, a second shell assembled with the first shell, and an optoelectronic transceiver module sealed between the first shell and the second shell, wherein the optoelectronic transceiver module includes a detachable optical coupling structure, and the optical coupling structure includes: A first connector is disposed on the carrier board and comprises: base; and a waveguide disposed in the base; and The second connector includes a plurality of optical fibers and is detachably connected to the first connector.

16. The sealing structure for immersion cooling equipment according to claim 15, characterized in that: The seal comprises a first sealing portion and a second sealing portion, the first sealing portion is disposed on the first cover portion and comprises a first sealing surface, the second sealing portion is disposed on the second cover portion and comprises a second sealing surface, and the first cover portion, the second cover portion and the seal together define a sealing cover, the sealing cover sealingly covers an opening portion, the opening portion being included in the immersion cooling device; The first sealing surface and the second sealing surface are in contact with each other, and a portion of each of the optical fibers is sandwiched between the first sealing surface and the second sealing surface and surrounded by the first sealing surface and the second sealing surface.

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