Display module, manufacturing method thereof, and display device

Abstract

This application discloses a display module, a method for manufacturing the same, and a display device. The display module comprises a substrate, a first electrode layer, an insulating group, a light-emitting portion, and a second electrode layer. The first electrode layer is disposed on the surface of the substrate; the insulating group comprises a first wall plate and a second wall plate spaced apart, forming a positioning space between the first and second wall plates; the light-emitting portion is disposed in the positioning space; and the second electrode layer is disposed in the positioning space and located on the surface of the light-emitting portion. The technical solution of this application can improve manufacturing precision.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and specifically relates to a display module, a preparation method thereof, and a display device. Background Art

[0002] Passive matrix displays typically employ a cross-patterned arrangement of anode and cathode strips. Display module fabrication typically employs a block mask method, where a block mask is placed on the substrate surface before the desired film layer is deposited via vapor deposition. However, due to the inverted trapezoidal isolation columns, the deposition process can easily lead to winding at the bottom of the isolation columns. This results in uneven film distribution near the substrate end, which can easily lead to faults and poor film deposition accuracy. Summary of the Invention

[0003] The purpose of this application is to provide a display module that can effectively improve the deposition accuracy of film layers.

[0004] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by practice of the present application.

[0005] According to one aspect of an embodiment of the present application, the present application provides a display module, comprising:

[0006] substrate;

[0007] a first electrode layer, the first electrode layer being disposed on a surface of the substrate;

[0008] An insulation group, the insulation group comprising a first wall plate and a second wall plate spaced apart from each other, with a positioning space formed between the first wall plate and the second wall plate;

[0009] a light emitting portion, the light emitting portion being arranged in the positioning space;

[0010] The second electrode layer is disposed in the positioning space and located on the surface of the light emitting portion.

[0011] In one aspect, the display module further includes a buffer layer, which is disposed on a surface of the first electrode layer and located between two adjacent insulation groups.

[0012] In one aspect, the insulating group is made of a transparent material, and the buffer layer is made of the same material as the insulating group.

[0013] In one aspect, the buffer layer is connected to the insulation group, or the buffer layer is spaced apart from the insulation group.

[0014] In one aspect, the first electrode layer includes a plurality of first electrode strips arranged in parallel, the first electrode strips include a conductive sheet and a connecting electrode, a plurality of the conductive sheets are provided, and the plurality of the conductive sheets are arranged at intervals along the same direction, the substrate forms a sinking area between adjacent conductive sheets, the connecting electrode is arranged in the sinking area, and connects two adjacent conductive sheets.

[0015] In one aspect, the connecting electrode is at least partially curved.

[0016] In one aspect, a hollow area is formed between two adjacent insulation groups, and the display module includes a driving line, and the driving line is disposed in the hollow area.

[0017] In one aspect, the display module further includes an encapsulation layer and a sensing line, wherein the encapsulation layer is arranged on the surface of the second electrode layer, and the sensing line is arranged on the surface of the encapsulation layer, and the sensing line is orthogonal to the extension direction of the driving line, and the position where the driving line and the sensing line face each other forms a touch capacitor.

[0018] In addition, in order to solve the above problems, the present application also provides a method for preparing a display module, the method comprising:

[0019] forming a first electrode layer on a surface of the substrate;

[0020] A positioning assembly is formed on the surface of the first electrode layer, the positioning assembly comprising an insulating group and two isolation pillars, the two isolation pillars being located on opposite sides of the insulating group, the insulating group comprising a first wall plate and a second wall plate spaced apart, the upper ends of the isolation pillars extending above the insulating group, wherein the first wall plate and the second wall plate have opposing inner wall surfaces, the inner wall surface of the first wall plate being flush with the side edges of adjacent isolation pillars, and the inner wall surface of the second wall plate being flush with the side edges of adjacent isolation pillars;

[0021] forming a light emitting material layer, wherein the light emitting material layer is divided into a light emitting portion and a first removal layer under the shielding effect of the isolation column, the light emitting portion is located between the first wall plate and the second wall plate, and the first removal layer is located at the top of the isolation column;

[0022] forming a conductive layer on the light-emitting material layer, wherein the conductive layer is divided into a second electrode layer and a second removal layer under the shielding effect of the isolation pillars, wherein the second electrode layer is located between the first wall plate and the second wall plate, and the second removal layer is located on top of the first removal layer;

[0023] The isolation pillar is peeled off, and the first removal layer and the second removal layer are removed.

[0024] In addition, in order to solve the above problems, the present application also provides a display device, which includes the preparation method of the display module as described above, the first electrode layer is the anode, the second electrode layer is the cathode, and the side wall surface of the isolation column is spaced apart from the insulation group.

[0025] In this application, the provision of the insulating group allows the light exit portion to be formed between the first and second wall panels during processing. This means that the light exit portion is positioned between the first and second wall panels, and the positioning space allows for more precise positioning of the light exit portion, thereby improving the accuracy of the light exit portion placement.

[0026] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification, are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0028] Figure 1 The structural diagram of the display module in the related art of this application is schematically shown.

[0029] Figure 2 The figure schematically shows the process steps of the method for preparing the display module of the present application.

[0030] Figure 3 The figure schematically shows the process steps of setting a buffer layer in the method for preparing the display module of the present application.

[0031] Figure 4 The figure schematically shows the process steps of setting the first electrode strips in the method for preparing the display module of the present application.

[0032] Figure 5 The figure schematically shows the process steps of setting the driving lines in the method for preparing the display module of the present application.

[0033] Figure 6 The figure schematically shows the process steps of setting the touch capacitor in the method for preparing the display module of the present application.

[0034] Figure 7 The figure schematically shows the process steps of setting the isolation column in the method for preparing the display module of the present application.

[0035] Figure 8The schematic diagram shows the structure of the first electrode strips arranged on the substrate in the present application.

[0036] Figure 9 The schematic diagram shows the structure of the isolation column and the insulation group provided on the first electrode strip in the present application.

[0037] Figure 10 The schematic diagram shows the three-dimensional structure of the isolation column arranged on the first electrode strip in the present application.

[0038] Figure 11 Schematically shows the application Figure 9 Schematic diagram of the structure of the light-emitting part and the second electrode strip.

[0039] Figure 12 The structural diagram of the display module in this application is schematically shown.

[0040] Figure 13 Schematically shows the Figure 12 Schematic diagram of the three-dimensional structure.

[0041] Figure 14 Schematically shows the Figure 11 Schematic diagram of the structure of setting a buffer layer.

[0042] Figure 15 The schematic diagram shows the structure of the touch capacitor in the present application.

[0043] Figure 16 The schematic diagram of the structure of the conductive sheet and the connecting electrode in this application is shown schematically.

[0044] Figure 17 The application is schematically shown Figure 16 Schematic diagram of the structure of the insulation group set in .

[0045] Figure 18 The application is schematically shown Figure 16 Schematic diagram of the cross-section structure in.

[0046] Figure 19 The top view of the display module in the display device of the present application is schematically shown.

[0047] The following are the descriptions of the reference numerals:

[0048] 100, substrate; 200, first electrode layer; 210, first electrode strip; 300, insulation group; 400, isolation column; 500, light output portion; 501, first removal layer; 600, second electrode layer; 610, second electrode strip; 601, second removal layer; 700, buffer layer; 810, drive line; 820, sensing line; 830, encapsulation layer; 910, base; 920, isolation structure; 930, film layer; 940, deposition direction;

[0049] 211, conductive sheet; 212, connecting electrode; 301, positioning space; 310, first wall panel; 320, second wall panel. DETAILED DESCRIPTION

[0050] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art.

[0051] For further explanation of the related issues, see the related art Figure 1 As shown, an isolation structure 920 is set on the substrate 910. The isolation structure 920 is an inverted trapezoidal structure. The isolation structure 920 is wide at the top and narrow at the bottom. During the deposition of the film layer 930, diffraction will occur at the position of the isolation structure 920 close to the substrate 910. According to the deposition direction 940 as shown in the figure, the position where some materials are deposited will enter the projection range of the isolation structure 920 on the substrate 910. The deposition range and thickness are difficult to control, resulting in uneven thickness of the film layer 930, which seriously affects the manufacturing accuracy.

[0052] For this purpose, see Figure 2 、 Figures 8 to 13 As shown, the present application provides a method for preparing a display module. In this embodiment, the display module mainly refers to a structural device in a passive matrix display. A passive matrix display relies on applying voltage to pixels at the intersection of electrodes in the upper and lower substrates to complete display driving. The passive matrix display in this application can be a PMOLED (Passive matrix Organic Light-Emitting Diode) or a PMLCD (Passive matrix Liquid Crystal Display).

[0053] The method for preparing a display module includes:

[0054] Step S10, forming a first electrode layer 200 on the surface of the substrate 100; Figure 8As shown, the substrate 100 can be a glass plate or a plastic plate. The substrate 100 primarily serves as a support and protection layer. A first electrode layer 200 can be deposited on the upper surface of the substrate 100 and then etched to form first electrode strips 210. Alternatively, the first electrode strips 210 can be formed directly by deposition using a mask. The plurality of first electrode strips 210 are spaced apart and parallel to each other.

[0055] In step S20, a positioning assembly is formed on the surface of the first electrode layer 200. The positioning assembly includes an insulating group 300 and two isolation columns 400. The two isolation columns 400 are respectively located on opposite sides of the insulating group 300. The insulating group 300 includes a first wall panel 310 and a second wall panel 320 that are spaced apart. The upper ends of the isolation columns 400 extend above the insulating group 300. The first wall panel 310 and the second wall panel 320 have oppositely disposed inner wall surfaces. The inner wall surface of the first wall panel 310 is flush with the side edge of the adjacent isolation column 400, and the inner wall surface of the second wall panel 320 is flush with the side edge of the adjacent isolation column 400.

[0056] Specifically, combined Figure 9 and Figure 10 As shown, it is understood that the insulating group 300 can also be in the shape of an elongated strip, with the extension direction of the insulating group 300 forming a certain angle with the extension direction of the first electrode strips 210. For example, the extension direction of the first electrode strips 210 is orthogonal to the extension direction of the insulating group 300. The insulating group 300 is disposed above the first conductive layer, that is, above the first electrode strips 210. The arrangement of the first wall plate 310 and the second wall plate 320 forms a narrow space between the first wall plate 310 and the second wall plate 320. This narrow space between the first wall plate 310 and the second wall plate 320 can be fully utilized to position the light output portion 500. In other words, the first wall plate 310 and the second wall plate 320 have a certain function of defining the position of the light output portion 500. That is, the light output portion 500 is formed between the first wall plate 310 and the second wall plate 320, thereby improving the placement accuracy of the light output portion 500.

[0057] The insulating group 300 can be formed by film deposition. Deposition marks are first made on the first electrode strips 210, and then a film is deposited using a mask to form the insulating group 300. More specifically, a high-precision machine can be used to install a mask mold according to the pre-made deposition marks, thereby reducing the possibility of poor precision during film deposition.

[0058] The upper ends of the isolation columns 400 are higher than the height of the insulation groups 300. The isolation columns 400 can block the space between adjacent insulation groups 300, preventing film deposition outside the area between the first and second wall panels 310, 320. The first and second wall panels 310, 320 are located within the orthographic projection of the isolation columns 400 onto the substrate 100. Furthermore, because the inner wall surface of the first wall panel 310 is flush with the side edges of the adjacent isolation columns 400, and the inner wall surface of the second wall panel 320 is flush with the side edges of the adjacent isolation columns 400, the film deposited between the first and second wall panels 310, 320 is not blocked by the isolation columns 400, allowing the film to be accurately deposited between the first and second wall panels 310, 320, thereby improving film deposition accuracy.

[0059] Step S30: forming a light emitting material layer. Under the shielding effect of the isolation column 400, the light emitting material layer is divided into a light emitting portion 500 and a first removal layer 501. The light emitting portion 500 is located between the first wall plate 310 and the second wall plate 320. The first removal layer 501 is located at the top of the isolation column 400. Figure 11 and Figure 12 As shown, the light emitting portion 500 is used to emit light. For example, the light emitting portion 500 includes an organic light emitting portion, a hole transport layer, a hole injection layer, an electron transport layer and an electron injection layer. The hole transport layer and the hole injection layer are arranged in sequence below the organic light emitting portion, and the electron transport layer and the electron injection layer are arranged in sequence above the organic light emitting portion.

[0060] In step S40, a conductive layer is formed on the light-emitting material layer. Under the shielding effect of the spacer 400, the conductive layer is divided into a second electrode layer 600 and a second removable layer 601. The second electrode layer 600 is located between the first and second wall panels 310 and 320, and the second removable layer 601 is located on top of the first removable layer 501. As can be seen, the limiting effect of the first and second wall panels 310 and 320, as well as the placement of the spacer 400, allows the second electrode layer 600 to be accurately formed between the first and second wall panels 310 and 320. The strip-shaped arrangement of the first and second wall panels 310 and 320 forms the second electrode layer 600, or in other words, the second electrode layer 600 includes second electrode strips 610. The hole injection layer may contact the first electrode strips 210, and the electron injection layer may contact the second electrode strips 610.

[0061] The first electrode strips 210 can be anodes, providing positive electricity. The second electrode strips 610 can be cathodes, providing negative electricity. Since the insulation group 300 intersects the first electrode strips 210, it can be understood that the second electrode strips 610 also intersect the first electrode strips 210. Of course, the first electrode strips 210 can also be cathodes and the second electrode strips 610 can be anodes. In this case, the electron transport layer and the electron injection layer are arranged between the light output portion 500 and the first electrode strips 210; and the hole transport layer and the hole injection layer are arranged between the organic light output portion and the second electrode strips 610.

[0062] The second electrode strips 610 can be disposed by depositing the second electrode layer 600 toward the isolation pillars 400 and the insulation group 300. Due to the isolation pillars 400, the second electrode strips 610 can be formed between the first wall plate 310 and the second wall plate 320 during the deposition of the second electrode layer 600. Furthermore, due to the positioning and limiting effect of the first wall plate 310 and the second wall plate 320, the second electrode strips 610 can be formed directly at precise locations through film deposition without etching, thereby reducing the corrosion effects of the etching process on the light output portion 500.

[0063] Of course, the light emitting portion 500 may also be a liquid crystal layer, and by controlling the voltage on the first electrode strips 210 and the second electrode strips 610 , the deflection of liquid crystal molecules in the liquid crystal layer is controlled, thereby achieving light transmission or light shielding.

[0064] It should be noted that the first electrode layer 200 and the second electrode layer 600 are generally made of a transparent conductive material, and the transparent conductive material may be ITO (Indium Tin Oxide).

[0065] Step S50: peeling off the isolation column 400 and removing the first removal layer 501 and the second removal layer 601. Figure 13 As shown, the spacer 400 is removed from the first electrode layer 200, and the first and second removal layers 501 and 601 located on top of the spacer 400 are simultaneously removed. This can reduce the overall height of the display module, facilitating a slimmer design. The spacer 400 can be removed by bonding, removing it from the substrate 100.

[0066] In this embodiment, the provision of the insulating group 300 allows the light exit portion 500 to be formed between the first wall panel 310 and the second wall panel 320 during processing. In other words, the formation position of the light exit portion 500 is limited to the positioning space 301 between the first wall panel 310 and the second wall panel 320, making the formation position of the light exit portion 500 more precise.

[0067] In addition, the isolation column 400 is set between adjacent insulation groups 300. The isolation column 400 can mask the position between the insulation groups 300, reduce the situation where the light output part 500 is formed between the insulation groups 300, and further improve the setting accuracy of the light output part 500.

[0068] In the related art, a structure similar to the spacer 400 is retained on the substrate 100, which blocks the light output angle of the light output portion 500, causing the light output portion 500 to only emit light directly upward. By removing the spacer 400, the light output angle blockage of the light output portion 500 is reduced, thereby increasing the viewing angle range.

[0069] At the same time, the insulation group 300 can provide a certain degree of protection for the light output portion 500, isolating the light output portion 500 from the spacer 400. This prevents damage to the light output portion 500 due to displacement errors when removing the spacer 400, and reduces the impact of the peeling operation on the light output portion 500. Furthermore, the spacer 400 remaining on the substrate 100 may fall off or fall over. Peeling off the spacer 400 can also simultaneously reduce this problem.

[0070] It should be further explained that generally, the overlapping position of the first electrode strip 210 and the second electrode strip 610 is a pixel position point. By setting the insulating group 300, the setting accuracy of the second electrode strip 610 can be improved, thereby improving the positioning accuracy of the pixel position point.

[0071] See Figure 3 As shown, in one embodiment of the present application, the step of forming a positioning component on the surface of the first electrode layer 200 includes:

[0072] In step S210 , a buffer layer 700 is formed on the surface of the first electrode layer 200 ; the buffer layer 700 can provide buffer protection for the first electrode layer 200 .

[0073] In step S220, spacer columns 400 are disposed on the surface of the buffer layer 700. The spacer columns 400 can be disposed on the buffer layer 700 to isolate the spacer columns 400 from the first electrode strips 210, preventing the spacer columns 400 from damaging the first electrode strips 210 during the stripping process. The buffer layer 700 also prevents other signals from interfering with the first electrode layer 200, providing a certain degree of insulation.

[0074] At the same time, the buffer layer 700 can also reduce the crosstalk signals between adjacent first electrode strips 210 through the isolation column 400 .

[0075] In one embodiment of the present application, the insulating group 300 is a transparent material, and the buffer layer 700 is made of the same material as the insulating group 300. By setting the insulating group 300 to a transparent material, the light from the light-emitting portion 500 can be directly transmitted through the insulating group 300. This ensures that the light-emitting portion 500 can emit light over a wider viewing angle range, thereby improving the viewing angle range of the display module. The main material of the insulating group 300 can be aluminum oxide films (Aluminum Oxide Films), such as those prepared by magnetron sputtering. Aluminum oxide films not only have high mechanical strength and stability, but also provide excellent insulation and corrosion resistance, as well as good optical transparency. The refractive index of aluminum oxide films is generally between 1.6 and 1.8.

[0076] By using the same material for the buffer layer 700 as for the insulation assembly 300, the number of materials used can be reduced, eliminating the need for material replacement during the manufacturing process. This allows the buffer layer 700 to be installed while the insulation assembly 300 is being manufactured, improving processing efficiency. Furthermore, the buffer layer 700 and the insulation assembly 300 can be made of different materials, allowing for the buffer layer 700 to be constructed with materials having improved insulation properties or cushioning and protection properties as needed.

[0077] The thickness of the insulation group 300 is generally controlled within the range of 0.15-0.2 μm to reduce the impact of the insulation group 300 on subsequent packaging operations.

[0078] In one embodiment of the present application, the substrate 100 can also be set as a flexible substrate 100. For example, the display module can be used on a foldable screen. The material of the flexible substrate 100 is generally a polymer material such as polyimide plastic, polyetheretherketone or transparent conductive polyester.

[0079] In order to adapt to the configuration of the flexible substrate 100, the connection between the buffer layer 700 and the insulation group 300 includes at least two situations:

[0080] In the first connection scenario, the buffer layer 700 is connected to the insulation group 300; that is, the buffer layer 700 connects two adjacent insulation groups 300 together to form a single unit. This covers the top of the connection electrode 212, reducing exposure of the connection electrode 212. The top surface of the connection electrode 212 is also sealed and covered.

[0081] The second connection situation is that a gap is set between the buffer layer 700 and the insulating group 300. By setting a gap between the buffer layer 700 and the insulating group 300, the mutual extrusion between the buffer layer 700 and the insulating group 300 can be reduced when the substrate 100 is folded, and the extrusion force that damages the buffer layer 700 or the insulating group 300 can be reduced. Even when the substrate 100 is bent, the mutual pressure between the buffer layer 700 and the insulating group 300 can be avoided. If the insulating group 300 is made of a material with a large Young's modulus, the insulating group 300 can be disconnected from the buffer layer 700 on the bottom surface, avoiding the generation of a large force between the buffer layer 700 on the bottom surface and the insulating group 300 on the side during the stretching process, reducing damage to the light-emitting portion 500, and extending the life of the display module.

[0082] See Figure 4 As shown, in one embodiment of the present application, the first electrode layer 200 includes a plurality of parallel first electrode strips 210 , which are formed by etching the first electrode layer 200 or depositing the first electrode strips 210 using a mask.

[0083] The step of forming the first electrode layer 200 on the surface of the substrate 100 includes:

[0084] In step S110, conductive sheets 211 are sequentially formed on the surface of the substrate 100 in a spaced-apart arrangement along the same direction. It should be noted that the positions of the conductive sheets 211 can be understood as the intersections of the second electrode strips 610 and the first electrode strips 210. Each conductive sheet 211 can be understood as a pixel location where light can be emitted, and adjacent conductive sheets 211 are spaced apart.

[0085] In step S120, the substrate 100 between adjacent conductive sheets 211 is etched to form a sunken area. This etching process forms a sunken area sunken from the surface of the substrate 100. The connection area may be etched first, followed by the deposition of the conductive sheets 211, or the conductive sheets 211 may be deposited first, followed by the etching of the substrate 100.

[0086] In step S130, connecting electrodes 212 are provided in the sunken areas. Connecting electrodes 212 sequentially connect the conductive sheets 211 to form first electrode strips 210. Due to the sunken areas, connecting electrodes 212 experience minimal tensile deformation when bent within the sunken areas. This ensures that connecting electrodes 212 function as a connection, effectively connecting two adjacent conductive sheets 211 together and ensuring signal transmission between the conductive sheets 211. This improves the bendability of the display module.

[0087] See Figure 17 and Figure 18As shown, in one embodiment of the present application, the connecting electrode 212 is at least partially bent and extended. When the screen is folded, the bending of the connecting electrode 212 allows the connecting electrode 212 to have good toughness when stretched, or it can be understood that the connecting electrode 212 has a longer stretched length and can still maintain connection with the conductive sheet 211. For example, the connecting electrode 212 is configured as a curved shape. For another example, if the connecting electrode 212 is S-shaped, the connecting electrode 212 can achieve a large deformation during the folding process of the substrate 100.

[0088] See Figure 19 As shown, in one embodiment of the present application, the insulation group 300 covers the sidewall surface of the light output portion 500, and the buffer layer 700 is disposed above the connection electrode 212. The insulation group 300 can cover the entire sidewall surface of the light output portion 500, thereby reducing the ingress of external moisture into the light output portion 500 and reducing the impact on the light output portion 500. It can be understood that the insulation group 300 plays a role in encapsulating and protecting the light output portion 500.

[0089] See Figure 5 and Figure 15 As shown, in one embodiment of the present application, multiple insulation groups 300 are provided, with a hollow region formed between adjacent insulation groups 300. A filling layer can be formed in the hollow structure, and the Young's modulus of the filling layer is smaller than that of the insulation groups 300 on the side. The insulation groups 300 on the side have a larger Young's modulus and are less prone to deformation, thus more effectively protecting the light output portion 500. The filling layer, on the other hand, has a smaller Young's modulus and is more susceptible to deformation. Since it is located in the hollow region, it can be easily stretched.

[0090] After the step of stripping the spacer 400, the following steps are included:

[0091] In step S60, a driving line 810 is provided in the hollow region between two adjacent insulation groups 300. A display module typically includes various signal driving lines 810, which transmit various control signals. By providing the driving lines 810 in the hollow region, the space in the hollow region can be fully utilized, reducing the space occupied by the driving lines 810 in other locations.

[0092] See Figure 6 and Figure 16 As shown, in one embodiment of the present application, after the step of providing the driving line 810 in the hollow area between two adjacent insulation groups 300, the following steps are included:

[0093] In step S70 , a packaging layer 830 is provided on the surface of the second electrode layer 600 ; the packaging layer 830 is used to protect the second electrode layer 600 and reduce erosion by water vapor.

[0094] In step S80, sensing lines 820 are arranged on the surface of the encapsulation layer 830. The sensing lines 820 extend perpendicularly to the driving lines 810, and touch capacitors are formed at the positions where the driving lines 810 and the sensing lines 820 face each other. As can be seen, this embodiment can fully utilize the structural design of the display module and add a touch solution to the display module, allowing the display module to receive touch commands while performing image display.

[0095] When a grounded conductive object approaches or touches the touchscreen surface, the capacitance on the touchscreen changes. Capacitive touchscreens use these capacitance changes to sense information such as the contact location of the conductive object. The human body can be considered a conductor with high resistance. When a finger touches the screen, the capacitance changes. The control circuit detects this capacitance change and determines the touch location.

[0096] Due to the overlap of the drive lines 810 and the sensing lines 820, some of the drive lines 810 and the sensing lines 820 are positioned directly opposite each other. When power is applied, touch capacitors are formed at the locations where the drive lines 810 and the sensing lines 820 face each other. Because there are multiple drive lines 810 and sensing lines 820, adjacent drive lines 810 and adjacent sensing lines 820 are equally spaced, forming multiple touch capacitors. These multiple touch capacitors are arranged in a matrix pattern, evenly distributed across the entire surface of the display module. When a finger approaches or touches the display module, the size of the touch capacitor changes.

[0097] This embodiment is beneficial for improving space utilization, thereby reducing panel thickness, and can also add a capacitive touch solution based on the hollow areas between the insulation groups 300, thereby improving the multifunctionality and intelligence of the product.

[0098] See Figure 7 As shown, in one embodiment of the present application, the step of forming a positioning component on the surface of the first electrode layer 200 also has two cases, including:

[0099] In step S21, spacer columns 400 are pre-formed and positioned opposite to the substrate 100. The insulating group 300 is formed within the orthographic projection of the spacer columns 400 onto the substrate 100. The spacer columns 400 are positioned first, followed by the insulating group 300. For example, a mask plate is pre-fabricated, the spacer columns 400 are positioned on the mask plate, and the mask plate and substrate 100 are positioned opposite to each other and fastened together, placing the spacer columns 400 between the insulating group 300.

[0100] The mask plate is bonded to the substrate 100, thus preventing deformation due to gravity. Compared to existing technologies, the present invention reduces the distance between the mask plate and the substrate 100, thereby improving pattern accuracy. Furthermore, after the mask plate is removed, the light extraction efficiency of the product is improved, while also reducing the risk of separation of the spacer pillars 400. The mask mold can be made of high-strength and high-temperature-resistant materials, such as metal alloys such as iron alloys and nickel alloys. This improves product yield and reliability.

[0101] In step S22, an insulating group 300 is formed on the first electrode layer 200, and pre-formed isolation columns 400 are placed opposite to the first electrode layer 200. That is, the insulating group 300 is formed first, and then the isolation columns 400 are arranged. The isolation columns 400 can be arranged by using a mold.

[0102] In one embodiment of the present application, the cross-section of the isolation column 400 gradually increases from the bottom to the top, and a gap is provided between the sidewall surface of the isolation column 400 and the adjacent insulation group 300. The isolation column 400 can have an inverted trapezoidal structure, with the isolation column 400 being narrow at the bottom and wide at the top. In this way, the lower end of the isolation column 400 can be positioned between two adjacent insulation groups 300, and the upper end of the isolation column 400 can block the space between the two adjacent insulation groups 300.

[0103] By setting a gap between the isolation column 400 and the insulation group 300, the isolation column 400 can be separated from the insulation group 300 by a certain distance, so that when the isolation column 400 is peeled off, the isolation column 400 can be prevented from touching or scratching the insulation group 300.

[0104] Example 2

[0105] See again Figure 12 As shown, the present application also provides a display module, which is manufactured using the above-mentioned method for preparing the display module. Through the above-mentioned preparation method, the isolation column 400 is peeled off. The display module includes: a substrate 100, a first electrode layer 200, an insulating group 300, a light-emitting portion 500 and a second electrode layer 600, wherein the first electrode layer 200 is arranged on the surface of the substrate 100; the insulating group 300 includes a first wall plate 310 and a second wall plate 320 arranged at intervals, and a positioning space 301 is formed between the first wall plate 310 and the second wall plate 320; the light-emitting portion 500 is arranged in the positioning space 301; the second electrode layer 600 is arranged in the positioning space 301 and is located on the surface of the light-emitting portion 500.

[0106] In this embodiment, the provision of the insulating group 300 allows the light exit portion 500 to be formed between the first wall panel 310 and the second wall panel 320 during the processing of the light exit portion. In other words, the formation position of the light exit portion 500 is limited between the first wall panel 310 and the second wall panel 320. The positioning space 301 allows the formation position of the light exit portion 500 to be more precise, thereby improving the placement accuracy of the light exit portion 500.

[0107] Example 3

[0108] The present application also provides a display device, comprising the display module described above, wherein the first electrode layer 200 serves as an anode, the second electrode layer 600 serves as a cathode, and the sidewall surface of the isolation column 400 is spaced apart from the insulation group 300. Positive electricity is supplied to the first electrode strips 210, and negative electricity is supplied to the second electrode strips 610, forming a potential difference between the first electrode strips 210 and the second electrode strips 610, thereby enabling the light emitting portion 500 between the first electrode strips 210 and the second electrode strips 610 to emit light, thereby achieving image display.

[0109] For example, the display module also includes a drive line 810 and a sensing line 820, and the display device also includes a detection circuit and a drive circuit, the drive circuit is connected to the drive line 810, and the detection circuit is connected to the sensing line 820. A touch capacitor is formed at the intersection of the drive line 810 and the sensing line 820. When a finger approaches the touch capacitor, the capacitance of the touch capacitor will change. The detection circuit can detect the capacitance change and thus determine the position of the finger touch. A capacitor array is formed on the entire screen. When a finger touches the touch screen surface, the capacitance value of the touched position will change. Based on the changes in this two-dimensional capacitor array, the two-dimensional touch coordinates can be calculated.

[0110] For other specific implementations and beneficial effects of the display device, please refer to the above-mentioned display module solution, which will not be repeated here.

[0111] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of this application and include common knowledge or customary techniques in the art that are not disclosed herein.

[0112] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A display module, characterized in that: The display module includes: substrate; a first electrode layer, the first electrode layer being disposed on a surface of the substrate; An insulation group, the insulation group comprising a first wall plate and a second wall plate spaced apart from each other, with a positioning space formed between the first wall plate and the second wall plate; a light emitting portion, the light emitting portion being arranged in the positioning space; a second electrode layer, the second electrode layer being disposed in the positioning space and located on a surface of the light emitting portion; Among them, the first electrode layer includes multiple first electrode strips arranged in parallel, the first electrode strips include conductive sheets and connecting electrodes, there are multiple conductive sheets, and the multiple conductive sheets are arranged at intervals along the same direction. The substrate forms a sinking area between adjacent conductive sheets, and the connecting electrode is arranged in the sinking area and connects two adjacent conductive sheets.

2. The display module according to claim 1, wherein: The display module further includes a buffer layer, which is disposed on the surface of the first electrode layer and located between two adjacent insulation groups.

3. The display module according to claim 2, wherein: The insulating group is made of a transparent material, and the buffer layer is made of the same material as the insulating group.

4. The display module according to claim 2, wherein: The buffer layer is connected to the insulation group, or the buffer layer is spaced apart from the insulation group.

5. The display module according to claim 1, wherein: The connecting electrode is at least partially bent and extended.

6. The display module according to claim 1, wherein: A hollow area is formed between two adjacent insulation groups. The display module includes a driving line, and the driving line is arranged in the hollow area.

7. The display module according to claim 6, wherein: The display module further includes an encapsulation layer and a sensing line. The encapsulation layer is arranged on the surface of the second electrode layer. The sensing line is arranged on the surface of the encapsulation layer. The sensing line is orthogonal to the extension direction of the driving line. The position where the driving line and the sensing line face each other forms a touch capacitor.

8. A method for preparing a display module, characterized in that: The method for preparing the display module includes: forming a first electrode layer on a surface of the substrate; A positioning assembly is formed on the surface of the first electrode layer, the positioning assembly comprising an insulating group and two isolation pillars, the two isolation pillars being located on opposite sides of the insulating group, the insulating group comprising a first wall plate and a second wall plate spaced apart, the upper ends of the isolation pillars extending above the insulating group, wherein the first wall plate and the second wall plate have opposing inner wall surfaces, the inner wall surface of the first wall plate being flush with the side edges of adjacent isolation pillars, and the inner wall surface of the second wall plate being flush with the side edges of adjacent isolation pillars; forming a light emitting material layer, wherein the light emitting material layer is divided into a light emitting portion and a first removal layer under the shielding effect of the isolation column, the light emitting portion is located between the first wall plate and the second wall plate, and the first removal layer is located at the top of the isolation column; forming a conductive layer on the light-emitting material layer, wherein the conductive layer is divided into a second electrode layer and a second removal layer under the shielding effect of the isolation pillars, wherein the second electrode layer is located between the first wall plate and the second wall plate, and the second removal layer is located on top of the first removal layer; The isolation pillar is peeled off, and the first removal layer and the second removal layer are removed.

9. A display device, characterized in that: The display device includes the display module according to any one of claims 1 to 7, the first electrode layer is an anode, the second electrode layer is a cathode, and when the display module is prepared using the preparation method according to claim 8: the side wall surface of the isolation column is spaced apart from the insulation group.

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