Jet welding device

Abstract

A jet welding device (100) according to the present invention comprises: a storage tank (110) for storing a molten solder; supply ports (125, 135) for supplying molten solder to the substrate (200); and cooling units (310, 330) for supplying a gas, the cooling units (310, 330) being provided at a position above the storage tank (110), the cooling units (310, 330) being located on the downstream side of the supply ports (125, 135) in the transport direction of the substrate (200).

Description

Technical Field

[0001] The present invention relates to a jet soldering device for supplying molten solder to a substrate. Background Art

[0002] Jet soldering devices for supplying molten solder to substrates are well known, and are provided with a cooling zone for cooling the substrate. For example, Japanese Patent Publication No. 2011-222783 discloses that a cooler 56 is provided in parallel with a preheater 52 and a jet solder tank 80, and the cooler 56 is used to cool the substrate.

[0003] The inventors have studied and found that if the substrate is not cooled to the cooling area provided with a cooler as shown in Japanese Patent Application Laid-Open No. 2011-222783, the solder may not solidify sufficiently. In particular, in the case of low-temperature melting solder, the solder may become embrittled due to insufficient solidification of the solder.

[0004] The present invention provides a jet soldering device which can more reliably prevent solder embrittlement by cooling the solder at an earlier time compared with a conventional method using only a cooling zone. Summary of the invention

[0005]

Concept 1

[0006] The jet welding device of the present invention is characterized by comprising:

[0007] A storage tank for storing molten solder;

[0008] a supply port for supplying molten solder to the substrate; and

[0009] The cooling unit is located on the downstream side of the supply port in the conveying direction of the substrate and is provided above the storage tank to supply the gas.

[0010]

Concept 2

[0011] In the jet welding device based on concept 1,

[0012] The cooling unit includes a lower cooling unit for cooling the substrate supply gas that is transported from below and an upper cooling unit for cooling the substrate supply gas that is transported from above.

[0013]

Concept 3

[0014] In the jet welding device based on Concept 2,

[0015] The lower cooling unit is located on the downstream side of the upper cooling unit in the conveyance direction of the substrate.

[0016]

Concept 4

[0017] In the jet welding device based on any one of the concepts 1 to 3,

[0018] The cooling unit supplies gas so that the gas flows toward a downstream side in a direction in which the substrate is transported.

[0019]

Concept 5

[0020] In the jet welding device based on Concept 4,

[0021] The cooling unit includes a lower cooling unit for supplying gas to the substrate conveyed from below and an upper cooling unit for supplying gas to the substrate conveyed from above.

[0022] The upper cooling unit supplies gas diagonally downward along the conveying direction of the substrate.

[0023] The lower cooling unit supplies gas obliquely upward along the conveyance direction of the substrate.

[0024]

Concept 6

[0025] In the jet welding device according to any one of the concepts 1 to 5,

[0026] The cooling portion has a first cooling portion for cooling the solder supplied to the substrate and a second cooling portion for cooling the substrate.

[0027]

Concept 7

[0028] In the jet welding device according to any one of the concepts 1 to 6,

[0029] The cooling unit may supply air at room temperature as gas.

[0030] Concept 8

[0031] In the jet welding device according to any one of the concepts 1 to 7,

[0032] The supply port includes: a first supply port provided on the first housing and used to supply molten solder; and a second supply port provided on the second housing and used to supply molten solder.

[0033] Between the first supply port and the second supply port along the substrate conveying direction, no portion where the molten solder falls downward is provided.

[0034]

Concept 9

[0035] A jet welding device according to any one of the concepts 1 to 8,

[0036] The device may further include a measuring unit configured to measure a temperature of the substrate after being cooled by the cooling unit.

[0037] Concept 10

[0038] In the jet welding device based on Concept 9,

[0039] The device may further include a display unit configured to display the temperature of the substrate measured by the measuring unit.

[0040]

Concept 11

[0041] A jet welding device based on Concept 9 or 10,

[0042] When the temperature of the substrate measured by the measuring unit is outside a predetermined temperature range, a signal for stopping the loading of the substrate is transmitted.

[0043]

Concept 12

[0044] A jet welding device according to any one of Concepts 9 to 11,

[0045] The method may further include a notification unit configured to notify that the temperature of the substrate is outside the predetermined temperature range when the temperature of the substrate measured by the measurement unit is outside the predetermined temperature range.

[0046] Effects of the Invention

[0047] According to the present invention, by cooling the solder at an earlier timing, it is possible to more reliably prevent the solder from becoming embrittled, compared with the conventional method of using only the cooling zone. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 It is a top plan view showing the welding device of this embodiment.

[0049] Figure 2 It is a top plan view of the jet welding device of this embodiment.

[0050] Figure 3 It is a schematic side cross-sectional view showing a first form of the jet welding device according to the present embodiment.

[0051] Figure 4 It is a perspective view showing an example of the lower cooling unit according to the present embodiment.

[0052] Figure 5 It is a perspective view showing an example of the upper cooling unit according to the present embodiment.

[0053] Figure 6 This is a schematic diagram showing a second embodiment of the jet welding device according to the present embodiment.

[0054] Figure 7 This is a schematic diagram showing a third embodiment of the jet welding device according to the present embodiment.

[0055] Figure 8It is a schematic side cross-sectional view showing a fourth embodiment of the jet welding device according to the present embodiment.

[0056] Fig. 9 This is a top plan view showing a state in which two slit-shaped second openings are provided in this embodiment.

[0057] Fig.10 It is a schematic side cross-sectional view showing a fifth embodiment of the jet welding device according to the present embodiment.

[0058] Fig.11 This is a schematic diagram showing a state in which no cooling zone is provided in the welding device of this embodiment.

[0059] Fig.12 This is a schematic side cross-sectional view showing a state in which the upper side main body portion of the upper side cooling portion and the lower side main body portion of the lower side cooling portion are replaceable.

[0060] Fig.13 It is a schematic side cross-sectional view showing a state in which an upper main body of an upper cooling unit is movable in the horizontal direction and in the vertical direction, and a lower main body of a lower cooling unit is movable in the horizontal direction and in the vertical direction.

[0061] Fig.14 The measuring unit and the guiding unit are shown in a three-dimensional diagram, and the measuring unit can communicate with the display unit and the notification unit.

[0062] Fig.15A This is a three-dimensional diagram showing an enlarged measurement section.

[0063] Fig. 15B The measuring part is enlarged and displayed in a stereoscopic manner. Fig.15A A stereogram of the opposite side.

[0064] Fig.16 It is a schematic side cross-sectional view showing a mode in which a guide portion and a display portion are provided.

[0065] Fig.17 This is a top plan view showing a welding device provided with a measuring unit and a guide unit. DETAILED DESCRIPTION

[0066] "structure"

[0067] Figure 1The soldering device shown is, for example, a device for soldering a substrate 200 on which electronic components such as semiconductor components, resistors, and capacitors are mounted on a circuit. Typically, the electronic components and the like are positioned on the lower side of the substrate 200. The soldering device includes a main body 1 and a conveying portion 5 for conveying the substrate 200. The main body 1 includes an inlet 2 for conveying the substrate 200 in, and an outlet 3 for conveying the substrate 200 out. The substrate 200 can be conveyed at a predetermined angle, for example, at an inclination of about 3 to 6 degrees, as viewed from the side (see FIG. 2 ). Figure 3 ). In this case, it is positioned at a position where the downstream is higher than the upstream in the substrate conveying direction A. However, this is not limited to this, and for example, the substrate 200 may be conveyed horizontally. The conveying section 5 may also include a conveying drive section (not shown) that imparts a driving force, and a conveying guide rail 6 that guides the substrate 200. As the conveying guide rail 6, aluminum, iron, stainless steel, etc. may be used.

[0068] like Figure 1 As shown, the main body 1 may be provided with: a flux coater 10 for coating flux on the substrate 200; a preheater section 15 for preheating the substrate 200 coated with flux; a jet soldering device 100 for jetting out molten solder to make it contact with the substrate 200; and a cooler 20 for cooling the substrate 200 after soldering. The substrate 200 transported along the transport guide 6 of the transport section 5 will pass through the flux coater 10, the preheater section 15, the jet soldering device 100 and the cooler 20 in sequence. The place where the cooler 20 is provided is the cooling zone, but as described later, in this embodiment, since cooling sections such as the upper side cooling section 310 and the lower side cooling section 330 are provided, Fig.11 As shown, since the cooling machine 20 is not provided, the cooling zone may not be provided. The jet welding device 100 may also include a control unit 50 for giving instructions to each component and controlling it, and a memory unit 60 for storing various information. Figure 1 In FIG. 1 , the welding device is shown in a top plan view except for the control unit 50, the memory unit 60, and the operation unit 70 described later.

[0069] The flux coating machine 10 is used to coat the flux on the transported substrate 200. The flux may include a solvent and an activator, etc. The flux coating machine 10 may also be provided with a plurality of coating devices. The type of flux to be used may be distinguished according to the type of solder or the type of substrate 200.

[0070] The preheater unit 15 heats the substrate 200 so that the substrate 200 is uniformly raised to a predetermined temperature. In this way, if the substrate 200 is heated, the solder is easily attached to a predetermined portion of the substrate 200. The preheater unit 15 uses, for example, a halogen heater. The halogen heater can rapidly heat the substrate 200 to a set temperature. In addition, the gas (hot air) heated by the heater can be blown to the substrate 200 through a fan to heat the substrate 200. In addition, as the preheater unit 15, a far-infrared flat heater or the like can be used.

[0071] The cooling machine 20 has a cooling fan (not shown) to cool the substrate 200 after the welding process by the jet welding device 100. The cooling fan can be controlled by simply turning it on or off, but the wind speed can also be adjusted. In addition, as the cooling machine 20, a chiller or the like can also be used to cool the substrate 200 to a predetermined temperature.

[0072] Figure 1 The control unit 50 shown is communicatively connected to the conveying unit 5 including the conveying rail 6, the flux coating machine 10, the preheater unit 15, the jet soldering device 100, the cooling machine 20, the operating unit 70 and the memory unit 60. The communicative connection includes both wired and wireless. The operating unit 70 may have a liquid crystal display panel or a numeric keypad, and is typically a personal computer, a smart phone, a tablet, a touch panel, etc. The operator may also operate the operating unit 70 to control the conveying speed of the conveying unit 5 or the timing of conveying the substrate 200, the flux temperature of the flux coating machine 10, the amount of flux applied, the temperature of the preheater unit 15, the temperature of the molten solder S of the jet soldering device 100, or the jet flow, the jet speed, the connection or disconnection of the cooling fan of the cooling machine 20, etc. The memory unit 60 can store information inputted by the operation unit 70, instructions from the control unit 50, the operation time of the jet soldering device 100, etc. The conveying speed of the substrate 200 is about 1 to 3 cm per second.

[0073] Next, the jet welding device 100 according to the present embodiment will be described.

[0074] like Figure 3 As shown, the jet soldering device 100 may include: a storage tank 110, which stores molten solder S; a supply port, which is used to supply the molten solder S to the substrate 200; and a cooling portion, which includes a lower side cooling portion 330 and / or an upper side cooling portion 310, which are located on the downstream side of the conveying direction of the substrate 200 more than the supply port ( Figure 3), is disposed at an upper position of the storage tank 110, and supplies gas for cooling the solder supplied to and attached to the substrate 200. The supply port may include two types of first supply ports 125 and second supply ports 135. The first supply port 125 receives a driving force from a first driving unit, i.e., a first pump 141, and ejects the molten solder S from the first supply port 125, and receives a driving force from a second driving unit, i.e., a second pump 146, and ejects the molten solder S from the second supply port 135.

[0075] The molten solder S ejected from the first supply port 125 and the second supply port 135 flows from the bottom to the top. The molten solder S receiving the driving force from the first pump 141 is pressed in the pipe and flows toward the substrate 200, so that the solder adheres to a predetermined portion of the substrate 200. Similarly, the molten solder S receiving the driving force from the second pump 146 is pressed in the pipe and flows toward the substrate 200, so that the solder adheres to a predetermined portion of the substrate 200. The molten solder S is heated to a temperature of, for example, about 160°C to 260°C by a heater not shown. The molten solder supplied from the first supply port 125 and the second supply port 135 may also be recycled. In this case, it may be circulated through a filter not shown. The first pump 141 and the second pump 146 are typically each composed of one pump, but the first pump 141 and the second pump 146 may each be composed of a plurality of pumps.

[0076] Figure 2 and Figure 3 The first supply port 125 of the jet soldering device 100 shown has a plurality of first openings 126, and the first openings 126 constitute a primary jet nozzle. The plurality of first openings 126 are used to strongly supply a large amount of molten solder S to the substrate 200. The second opening 136 of the second supply port 135 is a secondary jet nozzle, which is used to supply the molten solder S to the substrate 200 with a weaker force than the first supply port 125. The jet solder supplied from the first supply port 125 is a dynamic supply that makes the molten solder S collide with the substrate 200 strongly, and is a supply for spreading the molten solder S to every corner of the substrate 200. On the other hand, the jet solder supplied from the second supply port 135 is a static supply, and is a supply for beautifully soldering to the electrode or the like of the substrate 200 by passing through the molten solder S composed of a calm fluid. In addition, the above-mentioned structure of the jet soldering device and the conditions such as the force of the jet of the molten solder are just examples, and the present case is not limited to the above-mentioned structure.

[0077] like Figure 3As shown, the first supply unit 120 includes: a first shell 121; and a first supply port 125, which is provided on the upper surface of the first shell 121 and has one or more first openings 126 for supplying molten solder S. The first opening 126 can be provided to protrude upward from the upper surface of the first shell 121. The second supply unit 130 includes: a second shell 131; and a second supply port 135, which is provided on the upper surface of the second shell 131 and has one or more second openings 136 for supplying molten solder S. The first shell 121 and the second shell 131 can be provided separately (refer to Figure 3 ), but they can also be integrated (refer to Figure 6 and Figure 7 ). When the first shell 121 and the second shell 131 are integrated, they may share a portion of the wall surface. In this embodiment, as an example, a first supply port 125 having a plurality of circular first openings 126 and a second supply port 135 having a single slit-shaped second opening 136 are used for explanation. However, the present invention is not limited to this form. For example, a plurality of slit-shaped second openings 136 may be provided. In this case, a plurality of slit-shaped second openings 136 may be provided in a parallel extending form (see Fig. 9 ).

[0078] The temperature of the molten solder S is generally the melting temperature of the solder + 30°C. In recent years, the demand for lowering the working temperature has increased based on the reduction of the damage rate of parts and the reduction of mechanical power consumption. In addition, the market prices of Sn and Ag have risen, and there are also studies on the use of solders that do not use these. Typically, the use of Sn-58Bi (a solder alloy containing Bi: 58 mass%, the rest Sn; melting point 139°C, tensile strength 76.5MPs, elongation 27%) is studied to replace SAC305 (a solder alloy containing Ag: 3 mass%, Cu: 0.5 mass%, the rest Sn; melting point 217°C, tensile strength 53.3MPs, elongation 46%). Sn-58Bi is a low-temperature eutectic solder. In addition, if Sn-58Bi is used, soldering can be performed at a temperature below 200°C. On the other hand, since Sn-58Bi is hard but also brittle, it is a difficult raw material to handle.

[0079] During the supply of the molten solder S, the molten solder S supplied from the first supply port 125 is mixed with the molten solder S supplied from the second supply port 135. The molten solder thus mixed may be configured not to be separated from the substrate 200 conveyed by the conveying unit 5 between the first supply port 125 and the second supply port 135 (see Figure 6 and Figure 7 ). By adopting such a structure, oxidation of the molten solder S can be prevented (production of oxidation debris). As a result, the amount of useless solder can be suppressed and the material cost can be reduced.

[0080] Although the substrate 200 is supported and transported by the transport rail 6, the upper surface of the mixed molten solder S can also be positioned in the entire length region along the substrate transport direction A between the first supply port 125 and the second supply port 135, and is positioned below the lower end of the transport rail 6 that transports the substrate 200 when viewed from the side. In this embodiment, "between the first supply port 125 and the second supply port 135" means between the end of the first supply port 125 on the downstream side of the substrate transport direction A and the end of the second supply port 135 on the upstream side of the substrate transport direction A (refer to Figure 2 and Figure 3 In addition, Figure 6 and Figure 7 , the components other than the first pump 141 and the second pump 146 are shown in a cross-sectional view as viewed from the side.

[0081] The width Z2 of the setting area of ​​the second supply port 135 along the substrate conveying direction A may also be smaller than the width Z1 of the setting area of ​​the first supply port 125 along the substrate conveying direction A. When this form is adopted, it is easy to make the amount of molten solder S supplied from the second supply port 135 less than the amount of molten solder S supplied from the first supply port 125. As a result, the multiple bumps (convex shapes) of the molten solder S supplied from the first supply port 125 can be prevented from being destroyed by the molten solder S supplied from the second supply port 135, and the dynamic supply of the molten solder S from the first supply port 125 and the static supply of the molten solder S from the second supply port 135 can be provided in a balanced manner. In addition, if Figure 7 As shown, if the width Z2 of the setting area of ​​the second supply port 135 along the substrate conveying direction A is large, it is necessary to adjust the amount of the molten solder S supplied so that it does not become excessive, and to adjust the amount so that the substrate 200 is in continuous contact with the molten solder S between the second supply port 135 and the first supply port 125, which makes the adjustment difficult. From this point of view, it is more advantageous to adopt a configuration in which the width Z2 of the setting area of ​​the second supply port 135 along the substrate conveying direction A is smaller than the width Z1 of the setting area of ​​the first supply port 125 along the substrate conveying direction A.

[0082] The total amount of molten solder S supplied per unit time from the first opening 126 and the total amount of molten solder S supplied per unit time from the second opening 136, which is the secondary jet nozzle, can be changed according to the type of the substrate 200. When the identification information of the substrate 200 is input from the operation unit 70, the supply amount of the corresponding molten solder S can be read from the memory unit 60 by the control unit 50, and the molten solder S can be supplied from the first opening 126 and the second opening 136 by adjusting the supply amount to the read supply amount. The operation unit 70 can be configured to read code information such as a barcode, and the supply amount of the molten solder S to the substrate 200 can be automatically adjusted by the control unit 50 by reading the code information of the substrate 200.

[0083] The molten solder S supplied from the primary jet nozzle, i.e., the first opening 126, can also be ejected to a position higher than the surface of the molten solder S supplied from the secondary jet nozzle, i.e., the second opening 136. The height of the ejected molten solder S is, for example, about 10 mm from the front end of the first opening 126. The molten solder S supplied from the second supply port 135 is in a state as if being pushed up by the molten solder S supplied from the first supply port 125. However, since the molten solder S is the same type of liquid, the molten solder S supplied from the first opening 126 and the molten solder S supplied from the second supply port 135 are in a mixed state.

[0084] A downstream side adjusting portion 182 (see FIG. 18A ) which extends in the horizontal direction or descends downward toward the downstream side may be provided at the downstream side of the second supply port 135 in the substrate conveying direction A. Figure 3 The height of the downstream adjustment part 182 can also be changed appropriately. An upstream adjustment part 181 that extends in the horizontal direction or rises upward as it moves toward the downstream side can also be provided on the upstream side of the first supply port 125 in the substrate conveying direction A. The upstream adjustment part 181 and the downstream adjustment part 182 can be inclined in a straight line or in a circular arc in the longitudinal section (see Figure 6 ). The height adjustment of the upstream adjustment part 181 and the downstream adjustment part 182 can be performed manually or automatically by receiving a command from the control part 50. The command from the control part 50 can also be executed based on the identification information of the substrate 200. In this way, the advantage is that by adjusting the height of the upstream adjustment part 181 and the downstream adjustment part 182, the amount of molten solder S supplied to the substrate 200 can also be adjusted.

[0085] The height position of the conveying guide rail 6 can also be adjusted (see Figure 3 ). If this form is adopted, the advantage is that even if the height position of the conveying rail 6 is adjusted in addition to or instead of controlling the driving force of the first pump 141 and the second pump 146, it is possible to realize a structure in which the substrate 200 is continuously in contact with the molten solder S between the first supply port 125 and the second supply port 135. The height position of the conveying rail 6 can be manually adjusted or automatically adjusted by receiving an instruction from the control unit 50. The instruction from the control unit 50 can also be based on the identification information of the substrate 200.

[0086] The distance G between the first supply port 125 and the second supply port 135 along the extension direction of the conveying guide 6 (along the substrate conveying direction A) may also be smaller than the width Z1 of the setting area of ​​the first supply port 125 along the substrate conveying direction A. In the case of adopting this form, the distance between the first supply port 125 and the second supply port 135 can be shortened. Therefore, it is advantageous that the amount of molten solder S supplied from the second supply port 135 is reduced while the molten solder S is not separated from the substrate 200 conveyed by the conveying unit 5 between the first supply port 125 and the second supply port 135.

[0087] The distance G between the first supply port 125 and the second supply port 135 along the extension direction of the conveying guide 6 may be smaller than the width Z2 of the setting area of ​​the second supply port 135 along the substrate conveying direction A (the distance along the extension direction of the conveying guide 6). In this embodiment, as an example, it is assumed that the width Z2 of the setting area of ​​the second supply port 135 along the substrate conveying direction A is smaller than the width Z1 of the setting area of ​​the first supply port 125 along the substrate conveying direction A (refer to Figure 3 and Figure 6 ). Therefore, when this form is adopted, the distance between the first supply port 125 and the second supply port 135 can be quite close (refer to Figure 8 ). When this form is adopted, the distance between the first supply port 125 and the second supply port 135 can be further shortened. Therefore, the advantage is that, on the one hand, the amount of molten solder S supplied from the second supply port 135 can be further reduced, and the molten solder S between the first supply port 125 and the second supply port 135 will not be separated from the substrate 200 conveyed by the conveying unit 5.

[0088] The cooling unit may include: a lower cooling unit 330, which is located at a lower position than the conveying rail 6 of the substrate 200 and is on the upper side of the storage tank 110; and an upper cooling unit 310, which is set at a higher position than the conveying rail 6 and is above the storage tank 110. In the present case, "set above the storage tank 110" means that when a straight line is drawn from the end of the storage tank 110 in the upward direction (vertical direction) to divide the area, at least a part of it exists in the area α divided by the straight line. Therefore, the lower cooling unit 330 is set above the storage tank 110, which means that when a straight line is drawn from the storage tank 110 in the upward direction (vertical direction) to divide the area, at least a part of the lower cooling unit 330 exists in the area α. Similarly, the upper cooling unit 310 is disposed above the storage tank 110 , which means that when a straight line is drawn upward (vertically) from the storage tank 110 to divide the area, at least a portion of the upper cooling unit 310 is present in the area α.

[0089] In addition, since the lower cooling unit 330 directly cools the solder attached to the substrate 200, the cooling effect is greater. Therefore, if only one of the upper cooling unit 310 and the lower cooling unit 330 is required, the lower cooling unit 330 may be considered as the first candidate.

[0090] In addition, if it is the previous structure, the substrate 200 will be subjected to the heat from the molten solder S accumulated in the storage tank 110, but the advantage is that by setting the lower side cooling portion 330 at the upper position of the storage tank 110 as in the present embodiment, the influence of the heat from the molten solder S can be cut off on the one hand, and the solder can be cooled by the gas supplied from the lower side cooling portion 330.

[0091] By providing a lower cooling portion 330 or an upper cooling portion 310 located on the upper side of the storage tank 110, the solder can be cooled and hardened just after the molten solder S is supplied to the substrate 200 (for example, 2 to 5 seconds later). Therefore, the strength of the solder can be prevented from being reduced (solder embrittlement). In particular, in the case of a low-temperature melting solder having a low melting point such as Sn-58Bi, this effect is quite large. In addition, if it takes a long time until the solder hardens, vibration will occur during transportation in a soft state where the solder has not yet completely hardened, and it can be inferred that this vibration is one of the causes of solder embrittlement. By the way, it takes more than 10 seconds to reach the cooling zone that has existed before, but the difference of this embodiment is that the hardening of the solder can be started in a much shorter time than this time. In addition, in this embodiment, the low-temperature melting solder means a solder having a melting point below 180°C.

[0092] In addition, the cooling unit is not provided at the position where the first supply port 125 and the second supply port 135 are provided, but at a position ( Figure 3 In the embodiment shown, it is the right side position), providing a lower side cooling portion 330 and / or an upper side cooling portion 310 can prevent the molten solder S being supplied from the first supply port 125 and the second supply port 135 from cooling down.

[0093] The upper cooling part 310 and / or the lower cooling part 330 may have a slit-shaped opening for supplying gas, or may have a plurality of openings with small diameters. The wind speed of the gas supplied from the upper cooling part 310 and / or the lower cooling part 330 may be set to be about several meters to tens of meters per second. The upper cooling part 310 and the lower cooling part 330 may also supply air at room temperature as gas. By providing both the lower cooling part 330 and the upper cooling part 310, the substrate 200 can be quickly cooled from the top and bottom, and the strength reduction of the solder (solder embrittlement) can be more reliably prevented. In addition, the advantage is that when air at room temperature is supplied as gas, air at a temperature considerably lower than the melting temperature of the solder can be supplied to the substrate 200. In addition, the advantage is that by supplying air instead of nitrogen, etc., it is not necessary to adopt a closed structure required when supplying nitrogen, etc., and the device structure can be simplified and manufactured at low cost. In addition, if it is set as a closed structure, heat will easily accumulate, so from this point of view, it is more advantageous to set it as an open device structure. In addition, when nitrogen is supplied, there is a tendency for the molten solder to rebound more, but by using air, such rebound can be prevented. In addition, when nitrogen is used, the energy used to operate the device can be reduced, and the device can be set to be carbon neutral. The air supplied from the upper side cooling part 310 and / or the lower side cooling part 330 can be cooled by a cooling mechanism such as a cooler, or the external air can be directly supplied without providing a cooling mechanism. When a cooling mechanism is not provided, the energy used by the device can be reduced.

[0094] The upper cooling unit 310 may include: an upper main body 311 extending perpendicularly to the substrate conveying direction; and an upper supply port 315 disposed on the side of the upper main body 311 for ejecting and supplying a gas such as air (see Figure 5 The upper supply port 315 may be as follows Figure 5 The linear slit shown in FIG. 1 may also be provided with a plurality of small openings or protruding nozzles (see Figure 6 and Figure 7 ). The upper side main body portion 311 may be as Fig. 9 As shown, it extends across a pair of conveying guide rails 6, or it can be Figure 2 As shown, the upper cooling portion 310 extends between a pair of conveying rails 6. By providing such an upper cooling portion 310, the entire substrate 200 can be quickly cooled. In particular, if the upper supply port 315 is a linear slit, the substrate 200 can be cooled more uniformly from the upper side. If a nozzle is used as the upper supply port 315, the supply direction of the gas can be specified, and the solder can be prevented from being cooled while it is attached to the substrate 200, and the generation of solder burrs can be more reliably prevented.

[0095] The lower cooling unit 330 may include: a lower body 331; and lower supply ports 335a, 335b, which are arranged upward from the lower side of the conveying rail 6 of the substrate 200 to eject and supply gas such as air (refer to Figure 2 , Figure 4 and Fig. 9 ). The lower side supply ports 335a, 335b may be linear slits, or may be provided with a plurality of small openings or protruding nozzles. By providing such a lower side cooling portion 330, the substrate 200 may be directly cooled from the side to which the molten solder is attached, and a higher cooling efficiency may be achieved. When a nozzle is used as the lower side supply port 335a, 335b, the supply direction of the gas may also be specified, so that the solder may be prevented from being cooled while it is attached to the substrate 200, and the generation of solder burrs may be more reliably prevented.

[0096] Figure 2 and Fig. 9 In the form shown, a slit-shaped first lower side supply port 335a and a second lower side supply port 335b composed of a plurality of nozzles are provided. The first lower side supply port 335a has the effect of cooling the solder surface, and mainly has the function of cooling and hardening the solder. In this case, the first lower side supply port 335a functions as a first cooling unit for cooling the solder. On the other hand, the second lower side supply port 335b composed of a plurality of nozzles mainly has the function of cooling the substrate 200, and exerts the effect previously performed by the cooling zone. In this case, the second lower side supply port 335b functions as a second cooling unit for cooling the substrate 200. By adopting this form, the advantage is that the solder can be hardened early through the first lower side supply port 335a, while the substrate can be cooled through the second lower side supply port 335b.

[0097] A return portion 333 may be provided at the first lower supply port 335a (see Figure 4 ), the return portion 333 faces the downstream side in the substrate conveying direction A, and causes the gas supplied from the first lower side supply port 335a to flow to the downstream side in the substrate conveying direction A. By adopting this form, it is possible to more reliably prevent the gas such as air supplied from the first lower side supply port 335a from being supplied when the solder is being attached to the substrate 200. Figure 2 and Fig. 9 In the embodiment shown, although the return portion 333 is not shown, Figure 2 and Fig. 9 When the return portion 333 is provided, the return portion 333 is provided so as to cover the entire upper portion of the first lower supply port 335a.

[0098] The upper supply port 315 may include a slit-shaped first upper supply port 315a and a second upper supply port 315b composed of a plurality of nozzles (see Figure 6 ). The first upper side supply port 315a can have the effect of cooling the solder surface, and mainly has the function of cooling and hardening the solder. In this case, the first upper side supply port 315a functions as a first cooling unit for cooling the solder. On the other hand, the second upper side supply port 315b composed of a plurality of nozzles mainly has the function of cooling the substrate 200, and can play the effect previously performed by the cooling zone. In this case, the second upper side supply port 315b functions as a second cooling unit for cooling the substrate 200. A return portion (not shown) can also be provided at the first upper side supply port 315a, which is oriented toward the downstream side of the substrate conveying direction A, so that the gas supplied from the first upper side supply port 315a flows toward the downstream side of the substrate conveying direction A.

[0099] In addition, from the perspective of cooling and hardening the solder, only the first lower supply port 335a or the first upper supply port 315a may be provided, and the second lower supply port 335b or the second upper supply port 315b may not be provided (see Figure 7 ).

[0100] The upper supply port 315 and the lower supply port 335 may be positioned in their entirety in the region α above the storage tank 110. In addition, when the second upper supply port 315b or the second lower supply port 335b is provided, the first upper supply port 315a and the first lower supply port 335a may be positioned in their entirety in the region α above the storage tank 110, and at least a portion of the second upper supply port 315b or the second lower supply port 335b may be positioned in the region α above the storage tank 110.

[0101] The lower cooling unit 330 may be located on the downstream side of the conveying direction of the substrate 200 relative to the upper cooling unit 310. If the lower cooling unit 330 is too close to the second supply port 135, the molten solder S supplied from the first supply port 125 and the second supply port 135 may be blocked, so the lower cooling unit 330 cannot be arranged sufficiently close to the second supply port 135. On the other hand, the upper cooling unit 310 is less likely to cover the molten solder S supplied from the first supply port 125 and the second supply port 135, so it can be arranged close to the second supply port 135 when viewed in the conveying direction of the substrate 200. Therefore, by setting the lower cooling unit 330 to be located on the downstream side of the conveying direction of the substrate 200 relative to the upper cooling unit 310, the gas can be supplied from the upper cooling unit 310 just after the solder is attached to the substrate 200, and the gas can be supplied from the lower cooling unit 330 from a position where the molten solder S is not blocked. In addition, the lower cooling unit 330 is located at the downstream side of the conveying direction of the substrate 200 relative to the upper cooling unit 310, which means that the upstream end of the upper cooling unit 310 (with Figure 3 The left end is located at the upstream end of the lower cooling portion 330 (with Figure 3 The left end) is further upstream (with Figure 3 on the left side).

[0102] The cooling unit may also supply gas in such a manner that the gas flows in the direction in which the substrate 200 is conveyed. As an example, the upper supply port 315 of the upper cooling unit 310 may also be provided in such a manner that the gas is ejected from the oblique upper side of the substrate 200 to the downstream side in the conveying direction of the substrate 200. By adopting this form, it is possible to prevent the temperature of the molten solder from decreasing when the molten solder is adhering to the substrate 200. If the temperature of the molten solder decreases rapidly when the molten solder is adhering to the substrate 200, the molten solder will solidify before curling due to surface tension, thereby causing the formation of solder burrs. In this regard, in this form, the formation of such solder burrs can be prevented. In particular, in this embodiment, a cooling unit is provided on the storage tank 110, and the molten solder is cooled at a position extremely close to the area in which the molten solder is adhering to the substrate 200. Therefore, it is necessary to avoid a temperature drop in the area where the molten solder adheres to the substrate 200, and thus, as in the present embodiment, it is more advantageous to set the configuration in which the gas is ejected from the oblique upper side of the substrate 200 to the downstream side in the conveying direction of the substrate 200. In addition, as described above, when the upper cooling section 310 is located more upstream in the conveying direction of the substrate 200 than the lower cooling section 330, in order to prevent the gas such as air supplied from the upper cooling section 310 from being ejected to the molten solder when the molten solder is adhering to the substrate 200, it is more advantageous to set the upper supply port 315 in a manner in which the gas is ejected from the oblique upper side of the substrate 200 to the downstream side in the conveying direction of the substrate 200.

[0103] Based on the same reason, the lower side supply ports 335a and 335b of the lower side cooling section 330 may be arranged in a manner to eject gas from the obliquely downward side of the substrate 200 to the downstream side in the conveying direction of the substrate 200. However, if the lower side cooling section 330 is located on the downstream side of the conveying direction of the substrate 200 more closely than the upper side cooling section 310, and if the lower side cooling section 330 and the area where the molten solder adheres to the substrate 200 are more separated than the upper side cooling section 310, this form may not be adopted. That is, the upper side supply port 315 of the upper side cooling section 310 may be arranged in a manner to eject gas from the obliquely upward side of the substrate 200 to the downstream side in the conveying direction of the substrate 200, but the lower side supply ports 335a and 335b of the lower side cooling section 330 may be arranged in a manner to eject gas in a vertical direction toward the substrate 200 (refer to Fig.10 ).

[0104] In this way, in order to eject the gas toward the downstream side in the conveying direction of the substrate 200 , the above-mentioned return portion 333 may be used (the return portion that may be provided in the upper cooling portion 310 is not shown).

[0105] It is also possible to adopt a form in which no opening or gap is provided between the first supply port 125 and the second supply port 135 along the substrate conveying direction A on the upper surface of the first shell 121 and the second shell 131 for the molten solder S to fall downward. In the case where an opening or gap is provided for the molten solder S to fall downward, the surface area of ​​the molten solder S in contact with oxygen becomes larger, thereby generating oxides. On the other hand, if a form is adopted in which no opening or gap is provided between the first supply port 125 and the second supply port 135 along the substrate conveying direction A for the molten solder S to fall, as in this form, since no molten solder S falls between the first supply port 125 and the second supply port 135 along the substrate conveying direction A, the generation of oxides of the molten solder S can be prevented. In addition, when no opening or gap is provided for the molten solder S to fall downward, the area for supplying the molten solder S to the substrate 200 can be shortened. As a result, the advantage is that the timing for solder cooling by the upper side cooling part 310 and the lower side cooling part 330 on the storage tank 110 can be started earlier.

[0106] Next, mainly use Fig.11 , an example of a method for processing the substrate 200 is described.

[0107] When the operator places the substrate 200 on the transport rail 6, the transport unit 5 transports the substrate 200 and carries the substrate 200 from the carrying port 2 into the main body 1. When the substrate 200 reaches the flux coater 10, the flux coater 10 coats flux on a predetermined portion of the substrate 200.

[0108] The conveyor unit 5 conveys the substrate 200 coated with flux by the flux coater 10 to the preheater unit 15. The preheater unit 15 heats the substrate 200 to a predetermined temperature.

[0109] Next, the conveying unit 5 conveys the substrate 200 heated to a predetermined temperature by the preheater unit 15 to the jet soldering device 100. The jet soldering device 100 solders a predetermined portion of the substrate 200, and the following configuration is adopted: during the supply of the molten solder S by the jet soldering device 100, the molten solder S supplied from the first supply port 125 and the molten solder S supplied from the second supply port 135 are mixed, and the molten solder S is supplied to a position above the conveying guide S. In addition, as an example, the molten solder S is between the first supply port 125 and the second supply port 135 and is not separated from the substrate 200 conveyed by the conveying unit 5. In addition, in a state where there is no substrate 200, the molten solder S supplied from the first supply port 125 pushes up the molten solder S supplied from the second supply port 135, and a plurality of convex shapes corresponding to the first opening 126 are formed by the molten solder S.

[0110] In this way, immediately after the molten solder S is supplied to the substrate 200 (for example, 3 to 5 seconds later), a gas such as air is supplied to the substrate 200 from each of the upper cooling unit 310 and the lower cooling unit 330 to harden the solder. In this way, since the molten solder S is hardened immediately after it is supplied to the substrate 200, solder embrittlement can be prevented.

[0111] Thereafter, when the conveyor unit 5 discharges the substrate 200 from the discharge port 3, the soldering process on the substrate 200 is completed. In addition, in the form of a cooling zone, the substrate 200 is cooled by the gas supplied from each of the upper cooling unit 310 and the lower cooling unit 330, and then cooled by the cooling machine 20, and then discharged from the discharge port 3 (refer to Figure 1 ).

[0112] As a variation example, Fig.10As shown, a pump 140 may be provided to adjust the amount of molten solder S flowing into the first passage 161 connected to the first supply port 125 and the amount of molten solder S flowing into the second passage 162 connected to the second supply port 135. The amount of molten solder S flowing into the first passage 161 may be adjusted by the first adjustment valve 166, and the amount of molten solder S flowing into the second passage 162 may be adjusted by the second adjustment valve 167. The amount of molten solder S flowing into the first passage 161 and the amount of molten solder S flowing into the second passage 162 may also be adjusted according to the relative ratio of the opening of the first adjustment valve 166 and the opening of the second adjustment valve 167. If this form is adopted, only one pump 140 may be used to adjust the amount of molten solder S supplied from the first supply port 125 and the amount of molten solder S supplied from the second supply port 135. The openings of the first adjustment valve 166 and the second adjustment valve 167 may be adjusted based on the operation portion 70 (refer to Figure 1 and Fig.11 ) or the identification information of the substrate 200 read by the operation unit 70, and automatically adjusts by receiving the command issued by the control unit 50 based on the information read from the memory unit 60.

[0113] However, it is somewhat difficult to adjust the amount of molten solder S using only one pump 140. In a general jet soldering device 100 that must process multiple types of substrates 200 in one day, it is more advantageous to use more than two pumps as described above to adjust the amount of molten solder S supplied from the first supply port 125 and the second supply port 135.

[0114] In addition, as another embodiment, it is also possible to use only one pump 140 and appropriately adjust the sizes of the inlet ports of the first passage 161 and the second passage 162. In this case, by manually or automatically adjusting the sizes of the inlet ports of the first passage 161 and the second passage 162, the amount of the molten solder S supplied from the first supply port 125 and the amount of the molten solder S supplied from the second supply port 135 can be adjusted.

[0115] In this variation, a plurality of pumps 140 may be provided. In this case, the amount of the molten solder S supplied from the first supply port 125 and the amount of the molten solder S supplied from the second supply port 135 may be adjusted by adjusting the openings of the first adjustment valve 166 and the second adjustment valve 167, or the sizes of the inlet ports of the first passage 161 and the second passage 162.

[0116] Either or both of the upper cooling unit 310 and the lower cooling unit 330 may be replaced, and their sizes etc. may be changed by replacement (see Fig.12). By adopting this form, the position of the upper supply port 315 or the lower supply port 335a, 335b can be changed as needed. In addition, either or both of the upper cooling unit 310 and the lower cooling unit 330 can also be moved in the horizontal direction (refer to Fig.13 ). In addition, the wind direction of the upper side cooling section 310 and the lower side cooling section 330 can also be changed. For example, the upper side cooling section 310 can be rotated in the horizontal direction along an axis extending in a direction perpendicular to the substrate conveying direction A, and the wind direction from the upper side cooling section 310 can be changed. In addition, the direction of the protruding nozzle of the lower side cooling section 330 can be changed, and the wind direction from the lower side cooling section 330 can be changed. By adopting this form, the position of the upper side supply port 315 or the lower side supply port 335a, 335b can be appropriately changed. In addition, for the lower side cooling section 330, it can also be made to be freely retractable in the horizontal direction (a form of movable form), and the horizontal position of the lower side supply port 335a, 335b can be adjusted. In addition, either or both of the upper side cooling section 310 and the lower side cooling section 330 can also be made movable in both the upper and lower directions. In this case, "along the horizontal direction" can be any direction that includes a horizontal component, and also includes a form of movement in a direction inclined relative to the horizontal direction. Similarly, "along the up-down direction" can be any direction that includes an up-down component, and also includes a form of movement in a direction inclined relative to the up-down direction.

[0117] A measuring unit 400 (see FIG. 4 ) for measuring the temperature of the substrate 200 after being cooled by the upper cooling unit 310 and the lower cooling unit 330 may be provided. Figures 14 to 17 ). In this way, by measuring the temperature of the substrate 200 being transported by the measuring unit 400, it is possible to confirm and manage whether the solder hardening or the immediate cooling after soldering for achieving solder hardening is properly completed. If the cooler 20 is provided, the measuring unit 400 can be provided at a position before the substrate 200 is cooled by the cooler 20. As an example, the measuring unit 400 can be provided just behind the downstream side of the substrate transport direction A of the lower cooling unit 330 (refer to Fig.16 and Fig.17 Here, "directly behind the downstream side in the substrate conveying direction A" means an area within 30 cm from the downstream end of the upper cooling unit 310 and the lower cooling unit 330 located on the downstream side in the substrate conveying direction A. The measuring unit 400 may be, for example, a thermometer sensor.

[0118] A display unit 410 (see FIG. 4 ) for displaying the temperature of the substrate 200 measured by the measuring unit 400 may be provided. Fig.14 and Fig.16The display unit 410 may be, for example, a thermometer display. By providing such a display unit 410 , an operator can easily check the temperature of the substrate 200 .

[0119] As an example, the temperature of the soldering surface side (lower side) of the substrate 200 after cooling is measured by the measuring unit 400 disposed on the downstream side of the upper cooling unit 310 and the lower cooling unit 330 in the substrate conveying direction A. And the temperature measurement result is sent to the thermometer amplifier 405 (see Fig.14 ). Furthermore, the temperature measurement result is sent to the display unit 410 through the thermometer amplifier 405, and the temperature measurement result is displayed on the display unit 410. However, it is not limited to this form, and the measurement result of the measuring unit 400 can also be directly sent to the display unit 410, and the measurement result can be displayed on the display unit 410. In addition, the function of the thermometer amplifier 405 is typically to convert the measurement signal of the measuring unit 400 into a signal that can be understood by the display unit 410. Therefore, if a signal that can be understood by the display unit 410 can be sent from the measuring unit 400 to the display unit 410, it is not necessary to specially set up the thermometer amplifier 405.

[0120] The measuring unit 400 may be mounted on a guide unit 440 (see FIG. 1 ) formed by a slide rail extending in a direction perpendicular to the substrate conveying direction A, that is, in a horizontal direction. Fig.14 and Fig.15A In this case, the measuring unit 400 can move along the guide unit 440. In addition, the angle and vertical height of the measuring unit 400 relative to the guide unit 440 can also be adjusted (see Fig. 15B ). In addition, the position of the guide portion 440 formed by the slide rail or the like in the vertical direction may be changed. In addition, the position of the guide portion 440 along the substrate conveying direction A may be changed.

[0121] Fig.14 , Fig.15A and Fig. 15B This is just an example. Fig.14 In the illustrated form, a pair of first up-and-down adjustment screws 460 are shown, but by loosening the first up-and-down adjustment screws 460, the guide portion 440 can move in the up-and-down direction along the longitudinal guide hole 470a provided in the up-and-down extension portion 470, and by tightening the first up-and-down adjustment screws 460, the up-and-down position of the guide portion 440 relative to the up-and-down extension portion 470 is fixed. Fig.15A In the illustrated form, a knurled knob 441 is shown. By loosening the knurled knob 441, a measuring part fixing member 443 on which the measuring part 400 is mounted can be moved along the guide part 440. By tightening the knurled knob 441, the horizontal position of the measuring part fixing member 443 relative to the guide part 440 is fixed. Fig. 15BIn the form shown, a second adjusting screw 442 for up and down adjustment is shown. By loosening the second adjusting screw 442 for up and down adjustment, the measuring part fixing member 443 can be moved in the up and down direction (movable relative to the guide part 440) guided by the longitudinal guide hole 443a provided in the measuring part fixing member 443. By tightening the second adjusting screw 442 for up and down adjustment, the horizontal position of the measuring part fixing member 443 relative to the guide part 440 is fixed.

[0122] In addition, if the temperature of the substrate measured by the measuring unit 400 is outside the predetermined temperature range, the control unit 50 may send a control signal or the like for stopping the loading of the substrate 200 to an external device 500 (see FIG. 1 ) located upstream of the jet soldering device 100, such as a component loading device. Fig.17 ). If this form is adopted, when there is a high possibility that the solder hardening is not properly completed or the immediate cooling after soldering for achieving the solder hardening is high, the substrate 200 can be forcibly stopped from being carried in from the external device 500 located on the upstream side of the jet soldering device 100. The specified temperature range can be input from the operation unit 70, and can also be read from the information stored in the memory unit 60.

[0123] A notification unit 430 such as an alarm may be provided to notify that the temperature of the substrate 200 is outside the predetermined temperature range when the temperature of the substrate measured by the measuring unit 400 is outside the predetermined temperature range (see Fig.14 ). If this form is adopted, when there is a high possibility that the solder hardening is not completed properly or the immediate cooling after the soldering for achieving the solder hardening is not completed, this situation can be notified to the operator, etc. The information transmission to the notification unit 430 can be performed directly from the measurement unit 400, or can be performed through the thermometer amplifier 405, etc. In addition, the display unit 410 can also function as a notification unit. In this case, when the temperature of the substrate 200 is outside the specified temperature range, the display unit 410 can display a warning.

[0124] The disclosure of all embodiments including the above-mentioned variations and drawings is only an example for explaining the invention described in the scope of the patent application, and the invention described in the scope of the patent application is not limited by the disclosure of the above-mentioned embodiments or drawings. In addition, the description of the technical solution at the beginning of the application is only an example, and the description of the technical solution can also be appropriately changed based on the description of the specification, drawings, etc.

[0125] Explanation of symbols

[0126] 6 transport track

[0127] 100 jet welding device

[0128] 110 storage slots

[0129] 121 First Shell

[0130] 125 First supply port

[0131] 131 Second Shell

[0132] 135 Second supply port

[0133] 200 substrates

[0134] 310 upper side cooling unit

[0135] 330 Lower side cooling unit

[0136] S molten solder.

Claims

1. A jet welding device, characterized in that: include: A storage tank for storing molten solder; a supply port for supplying molten solder to the substrate; as well as The cooling unit is located on the downstream side of the supply port in the conveying direction of the substrate and is provided above the storage tank to supply the gas.

2. The jet welding device according to claim 1, characterized in that: The cooling unit includes a lower cooling unit for cooling the substrate supply gas that is transported from below and an upper cooling unit for cooling the substrate supply gas that is transported from above.

3. The jet welding device according to claim 2, characterized in that: The lower cooling unit is located on the downstream side of the upper cooling unit in the conveyance direction of the substrate.

4. The jet welding device according to claim 1 or 2, characterized in that: The cooling unit supplies gas so that the gas flows toward a downstream side in a direction in which the substrate is transported.

5. The jet welding device according to claim 4, characterized in that: The cooling unit includes a lower cooling unit for supplying gas to the substrate conveyed from below and an upper cooling unit for supplying gas to the substrate conveyed from above. The upper cooling unit supplies gas diagonally downward along the conveying direction of the substrate, and the lower cooling unit supplies gas diagonally upward along the conveying direction of the substrate.

6. The jet welding device according to claim 1 or 2, characterized in that: The cooling portion has a first cooling portion for cooling the solder supplied to the substrate and a second cooling portion for cooling the substrate.

7. The jet welding device according to claim 1 or 2, characterized in that: The cooling unit supplies air at room temperature in the form of gas.

8. The jet welding device according to claim 1 or 2, characterized in that: The supply port includes: a first supply port provided on the first housing and used to supply molten solder; and a second supply port provided on the second housing and used to supply molten solder. Between the first supply port and the second supply port along the substrate conveying direction, no portion where the molten solder falls downward is provided.

9. The jet welding device according to claim 1 or 2, characterized in that: include: The measuring unit measures the temperature of the substrate after being cooled by the cooling unit.

10. The jet welding device according to claim 9, characterized in that: include: The display unit displays the temperature of the substrate measured by the measuring unit.

11. The jet welding device according to claim 9, characterized in that: When the temperature of the substrate measured by the measuring unit is outside a predetermined temperature range, a signal for stopping the loading of the substrate is transmitted.

12. The jet welding device according to claim 9, characterized in that: include: The notification unit notifies that the temperature of the substrate is outside the predetermined temperature range when the temperature of the substrate measured by the measuring unit is outside the predetermined temperature range.

Images