Display module, preparation method thereof and display device

Abstract

The display module, the preparation method thereof and the display device are provided. The preparation method of the display module comprises the following steps: obtaining a display module to be processed, wherein the display module to be processed comprises a display area and a frame area located at the periphery of the display area, and the display module to be processed further comprises a bonding area and an edge area, the bonding area is located at one side of the frame area close to the display area, and the edge area is located at one side of the frame area away from the display area. A cutting channel is formed in the area between the bonding area and the edge area. A blocking dam is formed between the cutting channel and the bonding area. In the preparation method of the display module, the blocking dam can improve the signal line short circuit problem caused by cutting, thereby improving the cutting yield.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, in particular, to a display module, a preparation method thereof and a display device. BACKGROUND

[0002] In the preparation process of the display module, because high-temperature processes are involved, the substrate in the mother board for forming the display module is usually made of high-temperature-resistant material. Therefore, in the subsequent cutting process, high energy is needed to cut the mother board, which will cause the edge of the substrate to melt and carbonize. At the same time, the broken lead wires will also produce metal debris at the cutting position, and under the influence of carbonization, there is a short circuit problem between the lead wires, which reduces the cutting yield. Therefore, how to improve the cutting yield in the process of the display module has become a problem to be solved. SUMMARY

[0003] The present disclosure provides a display module, a preparation method thereof and a display device. By arranging a blocking dam between the cutting channel and the bonding area, the risk of short circuit between the bonding terminal and the display module is reduced, thereby improving the cutting yield in the process of the display module.

[0004] The first aspect of the present disclosure provides a preparation method of a display module, the preparation method comprising: obtaining a display module to be processed, wherein the display module to be processed comprises a display area and a frame area located at the periphery of the display area, and further comprises a bonding area and an edge area, the bonding area is located at one side of the frame area close to the display area, and the edge area is located at one side of the frame area away from the display area; forming a cutting channel in the region between the bonding area and the edge area; and forming a blocking dam between the cutting channel and the bonding area.

[0005] In the above scheme, the blocking dam between the bonding area and the cutting channel can block the overflow of the film material in the subsequent process, such as the bonding process, into the cutting channel, thereby reducing the risk of signal short circuit.

[0006] In one specific embodiment of the first aspect of the present disclosure, the preparation method of the display module further comprises: forming an anisotropic conductive adhesive film layer in the bonding area of the display module to be processed; and bonding the structure to be bonded to the bonding area.

[0007] In the above scheme, during the formation of the anisotropic conductive adhesive film layer, it is difficult to overflow into the cutting channel due to the blocking of the blocking dam, thereby reducing the risk of signal short circuit caused by the communication between the bonding terminal and the conductive layer through the anisotropic conductive adhesive film layer when the cutting channel is cut to the conductive layer.

[0008] Optionally, in a direction perpendicular to the display module to be processed, the height of the anisotropic conductive adhesive film layer is less than or equal to the height of the blocking dam. In this way, the blocking dam can block the anisotropic conductive adhesive from overflowing into the cutting channel.

[0009] Optionally, in a direction perpendicular to the display module to be processed, the height of the anisotropic conductive adhesive film layer is less than the height of the blocking dam. In this way, the blocking dam can effectively block the anisotropic conductive adhesive from overflowing into the cutting channel.

[0010] Optionally, in a cross section perpendicular to the display module to be processed and perpendicular to the extension direction of the blocking dam, the cross section of the blocking dam is in the shape of a right trapezoid. In this way, the blocking dam not only effectively blocks the anisotropic conductive adhesive from overflowing into the cutting channel, but also improves its impact resistance. At the same time, the cross section of the blocking dam in the shape of a right trapezoid has a mature processing technology, which reduces the production difficulty and processing cost.

[0011] In one specific embodiment of the first aspect of the present disclosure, in the extension direction of the cutting channel, the length of the blocking dam is greater than or equal to the length of the anisotropic conductive adhesive film layer.

[0012] In the above scheme, by setting the relative length of the blocking dam and the anisotropic conductive adhesive film layer in the extension direction of the cutting channel, the cutting channel can be more effectively protected, and the anisotropic conductive adhesive is prevented from overflowing into the cutting channel.

[0013] In one specific embodiment of the first aspect of the present disclosure, after the step of forming the anisotropic conductive adhesive film layer in the bonding area of the display module to be processed, and before the step of bonding the structure to be bonded to the bonding area, the preparation method further comprises: heating the display module to be processed, so that the blocking dam changes from a solid state to a liquid state, and the liquid blocking dam flows into the cutting channel to form a filling layer.

[0014] In the above scheme, the blocking dam flowing into the cutting channel eventually forms a filling layer, which can isolate other film layers such as the anisotropic conductive adhesive film layer from directly contacting the exposed film layer of the cutting channel.

[0015] Optionally, the structure to be bonded is bonded to the bonding area by a hot pressing method, and the temperature of the hot pressing method is greater than the temperature of the heating process of the display module to be processed.

[0016] In one specific embodiment of the first aspect of the present disclosure, the material of the blocking dam comprises a hot melt insulating material.

[0017] In the above scheme, the filling layer formed by the blocking dam can well play a physical insulation role, thereby preventing the problem of signal short circuit caused by cutting the cutting channel to the conductive layer.

[0018] In one specific implementation of the first aspect of the present disclosure, the display module to be processed includes a substrate, and a conductive connector and a lead wire located on a surface of the substrate. An anisotropic conductive adhesive film layer is located on a side of the conductive connector and the lead wire away from the substrate. One end of the lead wire is connected to the conductive connector, and the other end of the lead wire extends to an edge area of the display module to be processed in a direction away from the conductive connector. In the step of forming the cutting path in the area between the bonding area and the edge area, the preparation method includes: cutting the lead wire in a direction perpendicular to the extension direction of the lead wire to form the cutting path.

[0019] In the above solution, the cutting path cuts the lead wire, which can improve the problem of carbonization of the edge of the display module to be processed and metal debris after the lead wire is cut.

[0020] Optionally, the display module further includes an array film layer, which is arranged between the substrate and the conductive connector and the lead wire. In the step of cutting the lead wire to form the cutting path, the cutting depth is greater than the thickness of the lead wire and less than the sum of the thickness of the lead wire and the thickness of the array film layer.

[0021] Optionally, the array film layer includes a conductive layer, and the cutting path cuts to a surface of the conductive layer away from the substrate, or cuts into the conductive layer, or penetrates through the conductive layer.

[0022] Optionally, the conductive layer is a semiconductor conductive layer.

[0023] In one specific implementation of the first aspect of the present disclosure, the lead wire is cut by laser cutting.

[0024] In the above solution, laser cutting is easy to control, which is conducive to improving the cutting precision.

[0025] Optionally, the laser is a pulsed laser.

[0026] Optionally, the pulsed laser is a picosecond pulsed laser or a green laser or an ultraviolet laser.

[0027] The second aspect of the present disclosure provides a display module, which includes a display area and a frame area located at the periphery of the display area. The display module further includes a bonding area and an edge area. The bonding area is located at one side of the frame area close to the display area, and the edge area is located at the other side of the frame area away from the display area. A cutting path is formed in the area between the bonding area and the edge area. The display module includes a substrate, a filling layer, and an anisotropic conductive adhesive film layer. The filling layer is located on the substrate, and the filling layer fills and covers the cutting path. The anisotropic conductive adhesive film layer covers a surface of the filling layer away from the substrate, and at least part of the anisotropic conductive adhesive film layer is located in the bonding area.

[0028] In the above scheme, the filling layer prevents the anisotropic conductive adhesive film layer from entering the cutting channel and directly contacting the film layer in the cutting channel, thereby preventing the problem of signal short circuit caused by the anisotropic conductive adhesive film layer conducting the conductive layer and the bonding terminal.

[0029] In one specific embodiment of the second aspect of the present disclosure, the display module further comprises at least one conductive connecting piece, a lead wire, and a conductive layer. The conductive connecting piece is located between the substrate and the anisotropic conductive adhesive film layer. The lead wire is located between the substrate and the anisotropic conductive adhesive film layer, one end of the lead wire is connected to the conductive connecting piece, and the other end of the lead wire extends towards the cutting channel and stops at the cutting channel. The conductive layer is located between the substrate and the lead wire, wherein the cutting channel is located on the surface of the conductive layer away from the substrate and adjacent to the conductive layer or in the conductive layer or penetrates through the conductive layer.

[0030] In the above scheme, the cutting channel in the display module is formed by shift cut, which can solve the problems of edge carbonization of the display module and short circuit of the lead wire at the carbonization site. The filling layer located in the cutting channel can improve the problem of channel short circuit in the display module caused by shift cut cutting to the conductive layer after the shift cut process.

[0031] Optionally, the material of the filling layer comprises a hot melt insulating material.

[0032] Optionally, the conductive connecting piece is provided in plurality, and the plurality of conductive connecting pieces comprise a bonding electrode for bonding a circuit structure and a detection terminal for electrical performance detection.

[0033] The third aspect of the present disclosure provides a display device comprising the display module obtained by the preparation method of the first aspect or comprising the display module of the second aspect. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 A schematic diagram of a preparation method of a display module according to an embodiment of the present disclosure.

[0035] Figure 2 A flowchart of a preparation method of a display module according to an embodiment of the present disclosure.

[0036] Figure 3 A schematic diagram of a preparation method of a display module according to an embodiment of the present disclosure.

[0037] Figure 4 A flowchart of forming an anisotropic conductive adhesive film layer in a bonding area according to an embodiment of the present disclosure.

[0038] Figure 5A cross-sectional schematic view of a display module to be processed is provided for an embodiment of the present disclosure.

[0039] Figure 6 A cross-sectional schematic view of a display module to be processed is provided for an embodiment of the present disclosure.

[0040] Figure 7 A cross-sectional schematic view of a display module to be processed is provided for an embodiment of the present disclosure.

[0041] Figure 8 A planar schematic view of a display module to be processed is provided for an embodiment of the present disclosure.

[0042] Figure 9 A planar schematic view of a display module to be processed is provided for an embodiment of the present disclosure.

[0043] Figure 10 A cross-sectional schematic view of a display module to be processed is provided for another embodiment of the present disclosure.

[0044] Figure 11 A cross-sectional schematic view of a display module to be processed is provided for an embodiment of the present disclosure.

[0045] Figure 12 A cross-sectional schematic view of a display module to be processed is provided for another embodiment of the present disclosure.

[0046] Figure 13 A cross-sectional schematic view of a display module to be processed is provided for another embodiment of the present disclosure.

[0047] Figure 14 A schematic view of a preparation method of a display module is provided for an embodiment of the present disclosure.

[0048] Figure 15 A cross-sectional schematic view of a display module is provided for an embodiment of the present disclosure.

[0049] Reference Signs:

[0050] 100 - display module to be processed; AA - display area; BZ - bezel area; BB - bonding area; C - cutting path; E - edge area; 110 - barrier dam; 111 - filling layer; 120 - anisotropic conductive adhesive film layer; 130 - structure to be bonded; 140 - substrate; 150 - conductive connecting piece; 160 - lead wire; 170 - array film layer; 171 - conductive layer; 171a - semiconductive conductive layer; H1 - height of anisotropic conductive adhesive film layer; L1 - length of anisotropic conductive adhesive film layer; H2 - height of barrier dam; L2 - length of barrier dam;

[0051] 200 - encapsulation layer. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present disclosure will be described clearly and completely below in combination with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present disclosure.

[0053] In the industrial production of display modules, due to the complexity and numerous links of the production process, various factors that affect the electrical performance of the motherboard of the display module may occur. Therefore, the electrical performance of the prepared motherboard of the display module needs to be detected to ensure the product quality of the finally prepared display module. Generally, in order to detect the electrical performance of the motherboard of the display module, a detection terminal for electrical performance detection and a lead wire connected from the detection terminal are arranged in the area corresponding to each single panel (a plurality of single panels constitute the motherboard of the display module). Part of the lead wire is usually on the cutting path. Therefore, when the motherboard of the display module is cut, the lead wire on the cutting path is usually cut off. Then, after the lead wire is cut off, some problems may occur, such as the broken lead wire may generate metal debris at the cutting position, causing the lead wires near the cutting position on the single panel after cutting to be welded together, thereby causing short circuit between the lead wires; or the cutting edge of the substrate of the motherboard of the display module is affected by high energy and melts to cause carbonization, which affects the lead wire at the cutting position, causing signal line short circuit and other problems.

[0054] In order to improve this problem, Shift Cut is applied to the cutting process of the motherboard of the display module. After cutting the motherboard of the display module once, Shift Cut is performed at a certain distance inside the cutting edge. The distance of the inward shrink is determined according to the actual situation, and is generally a value obtained on the basis of avoiding the influence of carbonization and other problems on the lead wire. However, due to the continuous change of the stack and structure of the display module, this Shift Cut method also has disadvantages, for example, the Shift Cut cuts to the conductive layer, causing signal short circuit, thereby affecting the quality of the display module.

[0055] In view of this, embodiments of the present disclosure provide a display module and a method for manufacturing the same, as well as a display device. The method for manufacturing the display module includes obtaining a display module to be processed, the display module to be processed including a display area and a border area located around the display area, the display module to be processed also including a bonding area and an edge area, the bonding area being located in the border area and close to the display area, and the edge area being located in the border area and away from the display area. A dicing channel is formed in the area between the bonding area and the edge area. A barrier dam is formed between the dicing channel and the bonding area. Thus, by using the barrier dam provided between the dicing channel and the bonding area, the film layer in subsequent processes is prevented from entering the dicing channel and contacting the film layer, such as a conductive layer, cut by the dicing channel, thereby reducing the probability of signal line short circuits even if a shift cut occurs to the conductive layer of the display module to be processed.

[0056] The following description, in conjunction with the accompanying drawings, illustrates a method for fabricating a display module according to at least one embodiment of the present disclosure, and the display module itself. Furthermore, as shown in the drawings, in at least one embodiment of the present disclosure, a spatial rectangular coordinate system is established with the surface of the display module as a reference to define the positions of each film layer in the display module. In this spatial rectangular coordinate system, the X-axis and Z-axis are parallel to the surface of the display module, and the Y-axis is perpendicular to the surface of the display module.

[0057] like Figure 1 As shown, at least one embodiment of this disclosure provides a method for manufacturing a display module that includes the following steps:

[0058] Step S100: Obtain the display module 100 to be processed. The display module 100 includes a display area AA and a border area BZ located around the display area AA. The display module 100 also includes a bonding area BB and an edge area E. The bonding area BB is located in the border area BZ and is closer to the display area AA, while the edge area E is located in the border area BZ and is farther away from the display area AA. Specifically, the display module 100 to be processed is a flexible display module. The bonding area BB can be bent relative to the display area AA along the edge of the flexible display module, such as the short side, at a preset path and preset angle, bending to the non-light-emitting side of the display module, thereby facilitating the achievement of a narrow border for the display module.

[0059] Step S200: Form a cutting path C in the area between the bonding area BB and the edge area E.

[0060] For example, the display module 100 to be processed includes a display area AA and a border area BZ surrounding the display area AA. The border area BZ is located outside the display area AA and is not used to implement display functions. It is mainly used to house the electrical modules of the display module, such as driver chips, flexible circuit boards, power management modules, and signal interface modules. In order to achieve a narrow bezel effect for the display module, the film layer of the border area BZ may be thinned or removed.Figure 1 It can be seen that the frame area BZ of the display module has a film layer thickness smaller than that of the display area AA, which can be achieved by reducing the buffer layer and the planarization layer.

[0061] The display module to be processed 100 also includes a bonding area BB and an edge area E, the bonding area BB is located at the frame area BZ and close to one side of the display area AA, and the edge area E is located at the frame area BZ and away from the other side of the display area AA. In the preparation method of the display module, a cutting path C is formed by cutting, for example, Shift Cut, in the area between the bonding area BB and the edge area E. For example, in the preparation method of the display module, the mother board of the display module is cut into a plurality of independent single panels by using a first laser, at this time, the independent single panel will have problems such as short circuit of the lead 160 at the cutting position based on the above-mentioned carbonization problem of the cutting edge, therefore, the independent single panel will be subjected to a second cutting, i.e. Shift Cut, so as to obtain the display module to be processed 100 with the cutting path C.

[0062] Step S300: forming a blocking dam 110 between the cutting path C and the bonding area BB.

[0063] For example, the blocking dam 110 is formed in the area between the cutting path C and the bonding area BB on the display module to be processed 100, and the blocking dam 110 can block the film layer in the bonding area BB from flowing into the cutting path C during the manufacturing process in the direction from the display area AA to the cutting path C, so that the problem of signal short circuit caused by the film layer entering the cutting path C in the subsequent process, for example, the bonding process, is also improved when the cutting path C is cut to the conductive layer of the display module to be processed 100. In addition, the blocking dam 110 can be formed by any one of a photolithography process, a printing process or a deposition process, which will not be described here.

[0064] It should be noted that the embodiments of the present disclosure do not limit the specific structure of the display module to be processed 100, which can be a mother board of the display module after the first cutting in the preparation process of the display module as described above and then obtained by Shift Cut, or obtained by other ways. The present disclosure also does not specifically limit the cutting path C on the display module to be processed 100, for example, the cutting path C can be arranged to have a straight edge, i.e. the edge of the cutting path has no obvious sawtooth or curved shape, or the cutting path C can be arranged to have a uniform width distribution in the extension direction of the cutting path. In addition, the blocking dam 110 in the display module to be processed 100 of the present disclosure is not limited to the blocking dam 110 formed between the bonding area BB and the cutting path C in the above examples, but can also include other types of blocking dams 110, such as the blocking dam 110 surrounding the periphery of the display area AA of the display module to be processed 100. The above can be designed according to actual needs, which will not be described here.

[0065] In the method for manufacturing the display module provided in the embodiments of the present disclosure, the method further comprises forming an anisotropic conductive film layer 120 in the bonding area BB of the display module to be processed, which is referred to as an ACF layer. The structure to be bonded 130 is bonded to the bonding area BB.

[0066] As shown in Figure 2 and Figure 3 , a method for manufacturing a display module is provided, which comprises the following steps:

[0067] Step S100: obtaining a display module to be processed 100, which comprises a bonding area BB and an edge area E. The description of the display module to be processed 100 can refer to the above embodiments, which will not be repeated here.

[0068] Step S200: forming a cutting path C in the area between the bonding area BB and the edge area E. The description of this step can refer to the above embodiments, which will not be repeated here.

[0069] Step S300: forming a blocking dam 110 between the cutting path C and the bonding area BB. The description of forming the blocking dam 110 can refer to the above embodiments, which will not be repeated here.

[0070] Step S400: forming an anisotropic conductive film layer 120, i.e. an ACF layer, in the bonding area BB of the display module to be processed 100.

[0071] As shown in Figure 3 and Figure 4 , in the step of forming an anisotropic conductive film layer 120 in the bonding area BB of the display module to be processed 100, the following steps can be included:

[0072] Step S401: cleaning the bonding area BB. For example, the bonding area BB of the display module to be processed 100 is cleaned with corresponding cleaning agents and cleaning tools, and then cleaned with deionized water and dried, so that the surface of the bonding area BB is clean, free of dust, oil stains and other impurities, thereby improving the bonding strength.

[0073] Step S402: coating anisotropic conductive adhesive in the bonding area BB. Specifically, any one of silk screen printing, dispensing, and spraying can be adopted to complete the coating, which will not be described herein. In this step, the blocking dam 110 arranged between the bonding area BB and the cutting path C can prevent the anisotropic conductive adhesive, i.e., ACF, from flowing into the cutting path C, thereby reducing the risk that the anisotropic conductive adhesive overflows into the cutting path C after the chip is bonded, the conductive layer 171 cut by the cutting path C is in communication with the to-be-bonded structure 130, and the problem of signal short circuit is improved.

[0074] Step S403: curing the anisotropic conductive adhesive to form an anisotropic conductive adhesive film layer 120. Specifically, the anisotropic conductive adhesive can be cured by heat curing or light curing to form the anisotropic conductive adhesive film layer 120, which will not be described herein.

[0075] Step S500: bonding the to-be-bonded structure 130 to the bonding area BB.

[0076] For example, the step of bonding the to-be-bonded structure 130 to the bonding area BB can include the following steps:

[0077] First, the to-be-bonded structure 130, such as an IC (Integrated Circuit) or an FPC (Flexible Printed Circuit), is accurately placed on the anisotropic conductive adhesive film layer 120 in the bonding area BB, ensuring that the pins of the IC or FPC, i.e., IC Pin or FPC Pin, are aligned with the panel pins in the bonding area BB, i.e., Panel Pin. Then, a pre-pressing operation is performed to preliminarily contact and bond the IC or FPC with the anisotropic conductive adhesive film layer 120 and to discharge the air and excess adhesive between the chip or flexible circuit board and the anisotropic conductive adhesive film layer 120. After the pre-pressing operation, formal bonding is performed. Specifically, according to a predetermined bonding method, such as thermal compression bonding or ultrasonic bonding, appropriate pressure, temperature, and time are applied to soften the conductive particles in the anisotropic conductive adhesive film layer 120 at high temperature and form a conductive path, while firmly bonding the chip and the bonding area BB together. In addition, the parameters such as pressure, time, and temperature in the pre-pressing operation and formal bonding can be adjusted according to the characteristics of the anisotropic conductive adhesive and the characteristics of the to-be-bonded structure 130, which will not be described herein.

[0078] In the preparation method of the display module provided in at least one embodiment of the present disclosure, the height of the anisotropic conductive adhesive film layer 120 is less than or equal to the height of the blocking dam 110 in a direction perpendicular to the to-be-processed display module 100.

[0079] For example, as shown in FIG. 1, the height of the anisotropic conductive adhesive film layer 120 is less than the height of the blocking dam 110 in the direction perpendicular to the to-be-processed display module 100. Figure 5As shown, in the preparation method of the display module, the blocking dam 110 is formed between the bonding area BB and the cutting path C of the display module 100 to be processed, and the height H1 of the blocking dam is the height of the blocking dam 110 in the direction perpendicular to the display module 100 to be processed. In the step after forming the blocking dam 110, the anisotropic conductive adhesive film layer 120 is formed on the bonding area BB of the display module 100 to be processed, and the coating thickness of the anisotropic conductive adhesive film layer 120, i.e. the height H2 of the anisotropic conductive adhesive film layer, is controlled according to the height H1 of the blocking dam, so that the height H2 of the anisotropic conductive adhesive film layer is less than the height H1 of the blocking dam. In this way, the blocking dam 110 can effectively prevent the coated anisotropic conductive adhesive from overflowing into the cutting path C on the other side of the blocking dam 110.

[0080] As shown, in the preparation method of the display module, the height H2 of the anisotropic conductive adhesive film layer is equal to the height H1 of the blocking dam. Other descriptions can be referred to the above embodiments, which will not be repeated here. Figure 6

[0081] In the preparation method of the display module provided in at least one embodiment of the present disclosure, in the cross section perpendicular to the display module 100 to be processed and perpendicular to the extension direction of the blocking dam 110, the cross section of the blocking dam 110 is a right trapezoid.

[0082] As shown, in the preparation method of the display module, the height H2 of the anisotropic conductive adhesive film layer is equal to the height H1 of the blocking dam. Other descriptions can be referred to the above embodiments, which will not be repeated here. Figure 7 As shown, the blocking dam 110 formed between the bonding area BB and the cutting path C of the display module 100 to be processed has a right trapezoidal cross section in the direction perpendicular to the thickness direction of the display module 100 to be processed. In this way, the right trapezoidal cross section makes the contact area between the wider bottom of the blocking dam 110 and the display module 100 to be processed larger, which can provide more stable support and better sealing, which helps to prevent the bonding material such as anisotropic conductive adhesive from leaking from the bonding area BB into the cutting path C. At the same time, when subjected to external impact, the wider bottom of the blocking dam 110 can withstand greater pressure, while the gradually narrowing top can reduce stress concentration and reduce the risk of damage to the blocking dam 110 due to impact. In addition, the manufacturing and assembly process of the blocking dam 110 with a right trapezoidal cross section is relatively mature, thereby improving the production efficiency.

[0083] In the preparation method of the display module provided in the embodiments of the present disclosure, as shown, Figure 8 ​As shown, with reference to the plan view of the display module 100 to be processed, in the extension direction of the cutting path C, the length L2 of the blocking dam is greater than or equal to the length L1 of the anisotropic conductive adhesive film layer. That is, in the process of forming the blocking dam 110 in step S200, the length of the blocking dam 110 in the Z direction can be controlled with reference to the length of the bonding area BB of the display module in the Z direction, so that the length L2 of the blocking dam is greater than or equal to the length L1 of the anisotropic conductive adhesive film layer.

[0084] In the method for manufacturing the display module provided in the embodiments of the present disclosure, the display module 100 to be processed includes a substrate 140 and a conductive connecting member 150 and a lead 160 on the surface of the substrate 140, one end of the lead 160 is connected to the conductive connecting member 150, and the other end of the lead 160 extends to the edge area E of the display module 100 to be processed. In the method for manufacturing the display module, a cutting path C is formed between the bonding area BB and the edge area E of the display module 100 to be processed, and the lead 160 is cut off in a direction perpendicular to the extension direction of the lead 160.

[0085] As shown in the method for manufacturing the display module, the display module 100 to be processed includes a substrate 140 and a plurality of conductive connecting members 150 and a plurality of leads 160 on the substrate 140. Figure 9 and Figure 10 As shown in the method for manufacturing the display module, the display module 100 to be processed includes a substrate 140 and a plurality of conductive connecting members 150 and a plurality of leads 160 on the substrate 140.

[0086] The substrate 140 can be a flexible substrate 140, such as a PI (Polyimide, polyimide film) and / or a PET (Polyethylene Terephthalate, polyethylene terephthalate) film. After being cut from the mother board of the display module, the flexible substrate 140 is more prone to carbonization and melting, which can easily cause short circuiting of the leads 160 adjacent to the cutting position after melting.

[0087] The conductive connecting member 150 can be at least one of a detection terminal and a bonding terminal, one end of which can be connected to a to-be-tested circuit in a driving circuit layer and a pixel driving circuit of the display module 100 to be processed, respectively, and the other end of which is connected to the lead 160, and the other end of the lead 160 extends to the edge area E of the display module 100 to be processed. Specifically, in the step of forming the cutting path C between the bonding area BB and the edge area E, the method cuts the lead 160 in a direction perpendicular to the extension direction of the lead 160 to form the cutting path C, and at this time, the cutting path C is formed on the display module 100 to be processed, that is, the other end of the lead 160 extends to the cutting path C.

[0088] Based on the structure of the display module 100 to be processed, the present disclosure further limits the step of forming the cutting path C in the preparation method of the display module.

[0089] For example, as shown in FIG. 1A, the display module to be processed 100 includes a substrate 140, a conductive connecting piece 150, a lead 160, and an array film layer 170. The substrate 140 is provided with a plurality of display units 110. The conductive connecting piece 150 is arranged on the substrate 140 and is connected to the display units 110. The lead 160 is arranged on the substrate 140 and is connected to the conductive connecting piece 150. The array film layer 170 is arranged between the substrate 140 and the conductive connecting piece 150 and the lead 160. Figure 11 、 Figure 12 and Figure 13 In the preparation method of the display module provided by at least one embodiment of the present disclosure, the display module further includes an array film layer 170, the array film layer 170 is arranged between the substrate 140 and the conductive connecting piece 150 and the lead 160, and in the step of cutting off the lead 160 to form the cutting path C, the cutting depth is greater than the thickness of the lead 160 and less than the sum of the thickness of the lead 160 and the thickness of the array film layer 170, that is, the step of cutting off the lead 160 does not cut off the substrate 140 of the display module to be processed 100.

[0090] In addition to the above structure, in the preparation method of the display module provided by at least one embodiment of the present disclosure, the array film layer 170 of the display module to be processed 100 further includes a conductive layer 171, and the conductive layer 171 is located between the substrate 140 and the lead 160. There are various design schemes for the relationship between the cutting path C and the conductive layer 171. For example, as shown in FIG. 1B, the cutting path C cuts to the surface of the conductive layer 171 away from the substrate 140, that is, exposes the surface of the conductive layer 171 away from the substrate 140, which has the risk of contacting the ACF layer. For example, as shown in FIG. 1C, the cutting path C cuts into the conductive layer 171, that is, exposes the side surface of the conductive layer 171. For example, as shown in FIG. 1D, the cutting path C penetrates the conductive layer 171, that is, exposes the side surface of the conductive layer 171. In this way, various design schemes for the relationship between the cutting path C and the conductive layer 171 reduce the difficulty of the cutting path forming process and save production costs. Figure 11 Figure 12 Figure 13

[0091] In the preparation method of the display module provided by at least one embodiment of the present disclosure, the conductive layer 171 is a semiconductor conductive layer 171a.

[0092] ​​​For example, the semiconductor conductive layer 171a is an a-Si (amorphous silicon) layer, which is located on the substrate 140 and mainly functions to regulate electrical properties. For example, the a-Si conductive layer has certain conductivity and uniformity, and can uniformly distribute the current input from the power supply or the driving circuit to each pixel point. For the current input from the local power supply or the driving chip, the a-Si conductive layer can also function as a diffusion layer. In addition, the a-Si conductive layer also plays an important role in accurately controlling the pixel voltage and stabilizing the pixel voltage. Since the a-Si conductive layer is fully conductive, in the case where the anisotropic conductive adhesive overflows and enters the cutting channel C, the ACF layer will be connected to the bonding terminal and the a-Si conductive layer after the bonding process, and signal short circuit will occur. The blocking dam 110 in the present disclosure reduces the risk of anisotropic conductive adhesive overflowing into the cutting channel C, thereby reducing the risk of the above-mentioned signal short circuit problem.

[0093] It should be noted that the structure of the display module 100 to be processed is not limited to the structure in the above example. For example, the display module 100 to be processed can also include a light emitting device layer located on the substrate 140 and a packaging layer 200 facing away from the substrate 140. For details, please refer to Figure 15 . These can be designed according to actual needs, and will not be repeated here.

[0094] In the preparation method of the display module provided in the embodiments of the present disclosure, after the anisotropic conductive adhesive film layer 120 is formed in the bonding area BB, before the structure to be bonded 130 is bonded to the bonding area BB, the display module to be processed 100 is further subjected to a heating treatment, so that the blocking dam 110 changes from a solid state to a liquid state, and the liquid blocking dam 110 flows into the cutting channel C to fill the cutting channel C. In at least one embodiment, the material of the blocking dam 110 includes a hot melt insulating material.

[0095] For example, as Figure 14 shown, a preparation method of a display module is provided, which includes the following steps:

[0096] Step S100: obtaining a display module to be processed 100, which includes a bonding area BB and an edge area E.

[0097] Step S200: forming a cutting channel C in the area between the bonding area BB and the edge area E. For details, please refer to the above embodiments, which will not be repeated here.

[0098] Step S300: forming a blocking dam 110 between the cutting channel C and the bonding area BB.

[0099] Step S400: forming an anisotropic conductive adhesive film layer 120 in the bonding area BB of the display module to be processed 100.

[0100] Step S410: heat treatment is performed on the display module 100 to be processed, so that the barrier dam 110 is converted from a solid state to a liquid state, and the liquid barrier dam 110 flows into the cutting path C to fill the cutting path C. For example, the material of the barrier dam 110 is a hot melt insulation material.

[0101] In the process from step S400 to step S410, after the anisotropic conductive adhesive film layer 120 is formed in the bonding area BB of the display module 100 to be processed, the display module 100 to be processed is heated, and the heating temperature is such that the barrier dam 110 formed of the hot melt insulation material is converted from a solid state to a liquid state, and the liquid barrier dam 110 fills the cutting path C. In this way, the barrier dam 110 in the solid state can prevent the ACF from overflowing into the cutting path C during the preparation process of the ACF layer, and when the barrier dam 110 is heated to a liquid state, it fills the cutting path C, and after cooling, a filling layer 111 is formed in the cutting path C, which plays a role of physical insulation protection. In this way, it can be avoided that the film layer overflows into the cutting path C in the subsequent preparation process, thereby improving the quality of the display module. Further, in the heating treatment of the display module 100 to be processed, the heating temperature is such that the anisotropic conductive adhesive film layer 120 is converted into a flowable state to cover the side of the filling layer 111 away from the substrate 140 after the barrier dam 110 forms the filling layer 111, and the heating temperature of this step is controlled to control the flowability of the anisotropic conductive adhesive film layer 120, thereby reducing the risk of overflow.

[0102] Step S500: bonding the structure to be bonded 130 to the bonding area BB.

[0103] The specific operations of steps S100, S200, S300, S400 and S500 in the above examples can refer to the above embodiments, and will not be repeated here.

[0104] In the display module preparation method provided in at least one embodiment of the present disclosure, in step S500, the hot pressing method is used to bond the structure to be bonded 130 to the bonding area BB, and the temperature of the hot pressing method is greater than the temperature of the heating treatment of the display module 100 to be processed. In this way, the bonding process is completed while the quality of the filling layer 111 formed in the above steps is not affected.

[0105] In the display module preparation method provided in the embodiments of the present disclosure, in the step of cutting off the lead 160 to form the cutting path C, laser cutting is used. Specifically, the laser parameters can be set such that the energy of the laser in the step of cutting off the lead 160 is sufficient to cut off the lead 160, but insufficient to cut off the film layer below the lead 160, such as the substrate 140 or the conductive layer 171, thereby improving the problem of signal short circuit.

[0106] In the method for manufacturing the display module provided in at least one of the embodiments of the present disclosure, the laser is a pulsed laser. The pulsed laser is discontinuous, and the energy of the pulsed laser is easier to control than that of a continuous laser, thereby improving the cutting precision.

[0107] In the method for manufacturing the display module provided in at least one of the embodiments of the present disclosure, the pulsed laser is a picosecond pulsed laser.

[0108] For example, the picosecond pulsed laser can include a picosecond green laser or a picosecond ultraviolet laser, which is easier to control and more conducive to improving the cutting precision. In addition, the pulse width of the picosecond laser enables the laser to perform cutting on the display module 100 to be processed in a "cold" manner, without generating heat melting, thereby reducing the risk of carbonization or short circuit caused by the melting of the lead 160.

[0109] The embodiments of the present disclosure also provide a display module, as shown in Figure 15 The display module includes a display area AA and a bezel area BZ located at the periphery of the display area AA. The display module further includes a bonding area BB and an edge area E. The bonding area BB is located at one side of the bezel area BZ and close to the display area AA. The edge area E is located at the other side of the bezel area BZ and away from the display area AA. A cutting path C is formed in the area between the bonding area BB and the edge area E. The display module includes a substrate 140, a filling layer 111, and an anisotropic conductive film layer 120, i.e., an ACF layer. The filling layer 111 is located on the substrate 140, and the filling layer 111 fills and covers the cutting path C. The anisotropic conductive film layer 120 covers the surface of the filling layer 111 away from the substrate 140, and at least part of the anisotropic conductive film layer 120 is located in the bonding area BB. A bonding structure is bonded to the surface of the anisotropic conductive film layer 120 away from the substrate 140, and an encapsulation layer 200 is arranged on the surface of the bonding structure away from the substrate 140.

[0110] In the display module provided in the embodiments of the present disclosure, as shown in Figure 15 The display module further includes at least one conductive connecting piece 150, a lead 160, and a conductive layer 171. The conductive connecting piece 150 is located between the substrate 140 and the anisotropic conductive film layer 120. The lead 160 is located between the substrate 140 and the anisotropic conductive film layer 120. One end of the lead 160 is connected to the conductive connecting piece 150, and the other end of the lead 160 extends to the cutting path C and stops at the cutting path C. The conductive layer 171 is located between the substrate 140 and the lead 160. The cutting path C is located on the surface of the conductive layer 171 away from the substrate 140 and adjacent to the conductive layer 171, or in the conductive layer 171, or penetrates through the conductive layer 171. For details, please refer to Figure 11 、 Figure 12 and Figure 13 and the description of the above embodiments, which are not repeated here.

[0111] In the display module provided in at least one embodiment of the present disclosure, the material of the filling layer 111 includes a hot-melt insulating material.

[0112] In the display module provided in at least one embodiment of the present disclosure, the conductive connecting piece 150 includes a plurality of conductive connecting pieces 150, and the plurality of conductive connecting pieces 150 include a bonding electrode for bonding a circuit structure and a detection terminal for electrical performance detection. The conductive connecting piece 150 can be described with reference to the above embodiments, and will not be described here.

[0113] It should be noted that the structure of the display module of the present disclosure is not limited to the above examples. For example, the packaging layer 200 of the display module can be provided with other functional film layers, such as a touch functional layer, away from the surface of the substrate 140. The material of the filling layer 111 is not limited to a hot-melt insulating material, but can also be other composite materials or mixed materials including a hot-melt insulating material. In addition, the present disclosure does not specifically introduce the specific film layers of the display module, such as the driving functional layer, the light-emitting functional layer, etc. These can be designed according to the needs of the display module, and will not be described here.

[0114] Embodiments of the present disclosure also provide a display device including the display module obtained by the preparation method of the display module in the above embodiments or including the display module in the above embodiments. The preparation method of the display module and the structure of the display module can be described with reference to the above embodiments, and will not be described here.

[0115] In embodiments of the present disclosure, the display device can be an organic light-emitting diode display device, a liquid crystal display device, an electronic paper display device, etc.

[0116] For example, the display device in embodiments of the present disclosure can be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, etc.

[0117] It should be noted that the embodiments of the present disclosure do not describe all the structures of the display device described above. In order to realize the necessary functions of the display device, those skilled in the art can set other structures according to specific application scenarios.

[0118] The above only describes the preferred embodiments of the present disclosure and does not limit the present disclosure. Any modification, equivalent replacement, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A method for manufacturing a display module, characterized by, The method comprises: obtaining a display module to be processed, wherein the display module to be processed comprises a display area and a frame area located at the periphery of the display area, the display module to be processed further comprises a bonding area and an edge area, the bonding area is located at one side of the frame area close to the display area, and the edge area is located at one side of the frame area away from the display area; forming a cutting path in the region between the bonding area and the edge area; forming a barrier dam between the cutting path and the bonding area; forming an anisotropic conductive adhesive film layer in the bonding area of the display module to be processed; heat-treating the display module to be processed, so that the barrier dam changes from a solid state to a liquid state, and the liquid barrier dam flows into the cutting path to fill the cutting path and form a filling layer; bonding a structure to be bonded to the bonding area.

2. The method of claim 1, wherein the display module is prepared by the steps of: In a direction perpendicular to the display module to be processed, the height of the anisotropic conductive adhesive film layer is less than or equal to the height of the barrier dam. ​ 3. The method for preparing a display module according to claim 1, characterized in that, In a direction perpendicular to the display module to be processed, the height of the anisotropic conductive adhesive film layer is less than the height of the barrier dam.

4. The method for preparing a display module according to claim 1, characterized in that, In a cross section perpendicular to the display module to be processed and perpendicular to the extension direction of the barrier dam, the cross section of the barrier dam is in the shape of a right trapezoid.

5. The method for manufacturing a display module according to claim 1, characterized in that, In the extension direction of the cutting path, the length of the barrier dam is greater than or equal to the length of the anisotropic conductive adhesive film layer.

6. The method for preparing a display module according to claim 1, characterized in that, The structure to be bonded is bonded to the bonding area by using a hot-pressing method, and the temperature of the hot-pressing method is greater than the temperature of heat-treating the display module to be processed.

7. The method for preparing a display module according to claim 6, characterized in that, The material of the barrier dam comprises a hot-melt insulating material.

8. The method of claim 1-7, wherein, The display module to be processed comprises a substrate, a conductive connector and a lead wire located on the surface of the substrate, the anisotropic conductive adhesive film layer is located on the side of the conductive connector and the lead wire away from the substrate, one end of the lead wire is connected to the conductive connector, and the other end of the lead wire extends to the edge area of the display module to be processed in a direction away from the conductive connector, wherein in the step of forming a cutting path in the region between the bonding area and the edge area, the preparation method comprises: cutting the lead wire in a direction perpendicular to the extension direction of the lead wire to form the cutting path.

9. The method for preparing a display module according to claim 8, characterized in that, The display module further comprises an array film layer arranged between the substrate and the conductive connector and the lead wire, and in the step of cutting the lead wire to form the cutting path, the cutting depth is greater than the thickness of the lead wire and less than the sum of the thickness of the lead wire and the thickness of the array film layer.

10. The method of claim 9, wherein the display module is prepared by the steps of: The array film layer comprises a conductive layer, the cutting path cuts to the surface of the conductive layer away from the substrate, or cuts into the conductive layer, or penetrates through the conductive layer. ​ 11. The method for manufacturing a display module according to claim 10, characterized in that, The conductive layer is a semiconductor conductive layer.

12. The method for preparing a display module according to claim 8, characterized in that, The lead wire is cut by using laser cutting.

13. The method for preparing a display module according to claim 12, characterized in that, The laser is a pulsed laser.

14. The method of claim 13, wherein the display module is prepared by the steps of: The pulsed laser is a picosecond pulsed laser. ​ 15. A display module, characterized by The display module comprises a display area and a frame area located at the periphery of the display area, and further comprises a bonding area and an edge area, the bonding area is located at the frame area and close to one side of the display area, the edge area is located at the frame area and away from the other side of the display area, a cutting path is formed between the bonding area and the edge area, and the display module comprises: a substrate; a filling layer located on the substrate, wherein the filling layer fills and covers the cutting path; and an anisotropic conductive adhesive film layer covering a side surface of the filling layer away from the substrate, and at least part of the anisotropic conductive adhesive film layer is located in the bonding area; wherein, before the anisotropic conductive adhesive film layer is arranged, a blocking dam is arranged between the cutting path and the bonding area, and after the anisotropic conductive adhesive film layer is arranged, a heating treatment is performed to make the blocking dam flow into the cutting path to form the filling layer, so that the anisotropic conductive adhesive film layer covers the surface of the filling layer away from the substrate.

16. The display module of claim 15, wherein, Further comprising: at least one conductive connecting piece located between the substrate and the anisotropic conductive adhesive film layer; a lead wire located between the substrate and the anisotropic conductive adhesive film layer, one end of the lead wire is connected with the conductive connecting piece, and the other end of the lead wire extends to the cutting path and stops at the cutting path; and a conductive layer located between the substrate and the lead wire, wherein the cutting path is located on a surface of the conductive layer away from the substrate and adjacent to the conductive layer, or in the conductive layer, or penetrates through the conductive layer. The filling layer comprises a hot melt insulating material.

17. The display module of claim 16, wherein, The conductive connecting piece is provided in plurality, and the plurality of conductive connecting pieces comprise a bonding electrode for bonding a circuit structure and a detection terminal for electrical performance detection.

18. The display module of claim 16, wherein, The display module obtained by the preparation method of any one of claims 1 to 14 or the display module of any one of claims 15 to 18.

19. A display device comprising: ​

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