Display panel and display device

Abstract

The present application discloses a display panel and a display device, wherein the display panel further comprises a substrate, a driving circuit layer, a display film layer, a packaging film layer, a packaging barrier dam, a flat layer and a touch wiring layer, wherein the driving circuit layer is arranged on the substrate; the flat layer is arranged on the packaging film layer, and the touch wiring layer is arranged on the flat layer; wherein the flat layer is provided with a via in the area where the packaging barrier dam is located, and the touch wiring layer extends toward the edge of the display panel along the via. The present application provides vias on the flat layer, and the touch wiring layer on the flat layer extends downward from the packaging barrier layer position, thereby avoiding the problem of touch wiring being broken or short-circuited due to process reasons when forming touch wiring on the cross section of the flat layer, so that the touch wiring has good performance, and the display and touch effects of the display panel are better.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] OLED (Organic Light Emitting Diode) display devices are widely used in various fields due to their light weight, wide viewing angle, fast response, low temperature resistance, high luminous efficiency, and the ability to produce curved flexible displays. As mass production technology becomes increasingly mature, OLED display panels are gradually becoming mainstream real-world panels.

[0003] Touch display panels generally include embedded touch methods and external touch methods. In embedded touch panels, the touch wiring layer needs to be set in the film layer of the display panel; when the touch wiring layer is set on the flat layer of the OLED display panel, the touch wiring layer will have problems such as disconnection or short circuit due to the large height difference of the film layer section from the flat layer to the binding area or terminal side, affecting the display of the display panel. Summary of the invention

[0004] The purpose of the present application is to provide a display panel and a display device. By setting vias on a flat layer, a touch wiring layer on the flat layer extends downward from the position of a packaging barrier layer, thereby avoiding the problem of touch wiring being broken or short-circuited due to process reasons when a touch wiring is formed on the cross-section of the flat layer, so that the touch wiring has good performance and the display and touch effects of the display panel are better.

[0005] The present application discloses a display panel, comprising a display area and a non-display area, wherein the display panel further comprises a base substrate, a driving circuit layer, a display film layer, a packaging film layer, a packaging barrier dam, a flat layer and a touch wiring layer, wherein the driving circuit layer is arranged on the base substrate; the display film layer is arranged on the driving circuit layer; the packaging film layer is arranged on the display film layer and extends from the display area to the non-display area; the packaging barrier dam is arranged between the driving circuit layer and the packaging film layer and is located in the non-display area; the flat layer is arranged on the packaging film layer, and the touch wiring layer is arranged on the flat layer; wherein the flat layer is provided with a via in the area where the packaging barrier dam is located, and the touch wiring layer extends along the via to the edge of the display panel.

[0006] Optionally, the encapsulation barrier dam includes a first barrier dam and a second barrier dam, the first barrier dam is arranged around the display area, and the second barrier dam is arranged around the first barrier dam; the second barrier dam includes a plurality of second barrier portions arranged at intervals, and the second barrier portions are insulated from each other; under the orthographic projection of the base substrate, the plurality of vias overlap with the plurality of second barrier portions respectively; the driving circuit layer is provided with a plurality of connecting lines, and the touch wiring layer is electrically connected to the connecting lines through the second blocking portions.

[0007] Optionally, the first blocking dam includes a first conductive portion and a first partition portion, the first partition portion is arranged on the first conductive portion, and the radial width of the first partition portion is greater than the radial width of the first conductive portion, and the second blocking portion includes a second conductive portion and a second partition portion, the second partition portion is arranged on the second conductive portion, and the radial width of the second partition portion is greater than the radial width of the second conductive portion; the touch wiring layer is electrically connected to the connecting line through the second conductive portion.

[0008] Optionally, the second partition portion is also formed of a conductive material, and the touch wiring layer is electrically connected to the connecting line through the second partition portion and the second conductive portion.

[0009] Optionally, the driving circuit layer also includes an insulating layer, which covers the connecting line setting; a first through hole is set on the insulating layer, and the second conductive part is connected to the connecting line through the first through hole; under the orthographic projection of the base substrate, the first through hole overlaps with the via hole.

[0010] Optionally, the display film layer includes a pixel definition layer, which is arranged in a non-display area. The pixel definition layer is also provided with a first pixel definition layer extension portion and a second pixel definition layer extension portion in the non-display area, the first pixel definition layer extension portion is arranged under a first blocking dam, and the second pixel definition layer extension portion is arranged under the second blocking dam.

[0011] Optionally, the driving circuit layer also includes an insulating layer, which covers the connecting line; the second blocking portion is also provided with a second blocking portion extension, and under the orthographic projection of the base substrate, the second blocking portion extension does not overlap with the second pixel definition layer extension; a second through hole is provided on the insulating layer, and the second through hole is provided under the second blocking portion extension, and the second conductive portion is connected to the connecting line through the second through hole; under the orthographic projection of the base substrate, the second through hole does not overlap with the via hole.

[0012] Optionally, the packaging film layer includes a first inorganic layer, an organic packaging layer and a second inorganic layer, the organic packaging layer is arranged between the first inorganic layer and the second inorganic layer, and the second inorganic layer is arranged on the first inorganic layer; the organic packaging layer extends from the display area to the non-display area and is blocked by the first blocking dam; the first inorganic layer and the second inorganic layer extend from the display area to the non-display area and cover the first blocking dam and the second blocking dam; the first inorganic layer and the second inorganic layer are provided with through holes corresponding to the via holes, and the touch wiring layer is connected to the second blocking part from the through holes.

[0013] Optionally, the display film layer further includes a conductive partition structure and a pixel definition layer, the pixel definition layer is arranged on the driving circuit layer, the conductive partition structure is arranged on the pixel definition layer, and the conductive partition structure is formed by the same process as the first blocking dam and the second blocking dam.

[0014] The present application discloses a display device, comprising a driving circuit and the above-mentioned display panel, wherein the driving circuit is used to drive the display panel to display.

[0015] The present application sets vias on the flat layer and utilizes the encapsulation barrier layer to have a certain height, so that the height difference of the cross section formed by the flat layer and the encapsulation barrier layer is relatively low. In the process of the touch wiring layer on the flat layer extending downward from the position of the encapsulation barrier layer, especially during the etching process, there are problems such as overexposure or weak explosion, uneven photoresist, and incomplete etching of the touch wiring layer material. The present application reduces the probability of overexposure or weak explosion by reducing the height difference of the cross section, improves the incomplete etching of the touch wiring layer material due to uneven photoresist in the touch wiring layer patterning process, makes the line width of the touch wiring in the touch wiring layer more uniform, and avoids the problem of disconnection and short circuit of the touch wiring due to process reasons when the touch wiring is formed in the cross section of the flat layer, so that the touch wiring has good performance, and the display and touch effects of the display panel are better. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0017] Figure 1 is a schematic diagram of an exemplary display panel of the present application;

[0018] Figure 2is a schematic diagram of a display panel according to a first embodiment of the present application;

[0019] Figure 3 is a schematic top view of a display panel of the present application;

[0020] Figure 4 This application Figure 3 Schematic diagram of M enlargement;

[0021] Figure 5 This application Figure 4 Schematic diagram of the cross section of the AA cutting line;

[0022] Figure 6 This application Figure 4 Schematic diagram of the cross section of the BB cutting line;

[0023] Figure 7 is a cross-sectional schematic diagram of another display panel according to the second embodiment of the present application;

[0024] Figure 8 is a schematic diagram of a display device of the present application.

[0025] Among them, 100, display panel; 101, display area; 102, non-display area; 110, substrate; 120, drive circuit layer; 121, connection line; 122, insulation layer; 123, first through hole; 124, second through hole; 130, display film layer; 131, pixel definition layer; 132, first pixel definition layer extension; 133, second pixel definition layer extension; 134, conductive partition structure; 1341, third conductive part; 1342, third partition; 140, encapsulation film layer; 141 , a first inorganic layer; 142, an organic encapsulation layer; 143, a second inorganic layer; 150, an encapsulation barrier dam; 151, a first barrier dam; 1511, a first conductive portion; 1512, a first partition portion; 152, a second barrier dam; 153, a second barrier portion; 1531, a second conductive portion; 1532, a second partition portion; 154, an extension portion of the second barrier portion; 160, a flat layer; 170, a touch wiring layer; 171, a touch wiring; 180, a via; 200, a display device; 210, a driving circuit. DETAILED DESCRIPTION

[0026] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative, but the present application can be implemented in many alternative forms and should not be construed as being limited to only the embodiments described herein.

[0027] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; "multiple" means two or more. In addition, the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc. indicating orientation or positional relationships are described based on the orientation or relative positional relationships shown in the accompanying drawings, and are only for the convenience of describing the simplified description of the present application, rather than indicating that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0028] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0029] Figure 1 is a schematic diagram of an exemplary display panel of the present application, Figure 2 is a schematic diagram of a display panel of the first embodiment of the present application, see Figure 1-2 As shown, the present application discloses a display panel, which includes a display area and a non-display area. The display panel also includes a base substrate 110, a driving circuit layer 120, a display film layer, a packaging film layer 140, a packaging barrier dam 150, a flat layer 160 and a touch wiring layer 170, wherein the driving circuit layer 120 is arranged on the base substrate 110; the display film layer is arranged on the driving circuit layer 120; the packaging film layer 140 is arranged on the display film layer and extends from the display area to the non-display area; the packaging barrier dam 150 is arranged between the driving circuit layer 120 and the packaging film layer 140 and is located in the non-display area; the flat layer 160 is arranged on the packaging film layer 140, and the touch wiring layer 170 is arranged on the flat layer 160; wherein the flat layer 160 is provided with a via 180 in the area where the packaging barrier dam 150 is located, and the touch wiring layer 170 extends along the via 180 to the edge of the display panel.

[0030] The present application sets a via 180 on the flat layer 160 and utilizes the certain height of the encapsulation barrier layer so that the height difference of the cross section formed by the flat layer 160 and the encapsulation barrier layer is relatively low. In the process of the touch wiring layer 170 on the flat layer 160 extending downward from the position of the encapsulation barrier layer, especially during the etching process, there are problems such as overexposure or weak explosion, uneven photoresist, and incomplete etching of the touch wiring layer 170 material. The present application reduces the probability of overexposure or weak explosion by reducing the height difference of the cross section, improves the incomplete etching of the touch wiring layer 170 material due to uneven photoresist in the patterning process of the touch wiring layer 170, makes the line width of the touch wiring 171 in the touch wiring layer 170 more uniform, and avoids the problem of disconnection and short circuit of the touch wiring 171 due to process reasons when the touch wiring 171 is formed on the cross section of the flat layer 160, so that the touch wiring 171 has good performance, and the display and touch effects of the display panel are better.

[0031] Among them, see Figure 1 As shown, the cross-sectional height difference between the upper surface of the flat layer 160 and the upper surface of the encapsulation barrier layer is less than the cross-sectional height difference between the upper surface of the flat layer 160 and the upper surface of the display panel binding side. Specifically, the substrate 110 of the display panel and the flat layer 160 include a driving circuit layer 120, a display film layer and an encapsulation film layer 140. When the flat layer 160 directly descends to the binding area at the edge of the display panel, there will be a large film layer step difference, forming the above-mentioned cross section, that is, the side of the flat layer 160. When the touch wiring layer 170 provided on the flat layer 160 extends from the flat layer 160 to the display panel binding area, the film layer interface is relatively steep, that is, the cross section of the flat layer 160 and the binding area on the substrate 110 is relatively steep, and it is easy to have disconnection and short circuit problems. Among them, when the cross section is steeper, when etching the touch wiring 171, there is uneven photoresist, which is easy to accumulate at a lower place, resulting in the photoresist being thinner closer to the upper part. Overexposure or underexposure occurs during subsequent exposure, causing the touch wiring layer 170 to be etched more toward the top and less toward the bottom, resulting in the touch wiring 171 being narrow at the top and wide at the bottom. In worse cases, the top is completely etched, which can easily lead to short circuits or open circuits.

[0032] On the one hand, the present application utilizes the height of the encapsulation barrier layer, and etches the flat layer 160 at the position of the encapsulation barrier layer to form a via 180. The cross section of the via 180 is not very steep, and the distance is short, which greatly reduces the possibility of the above-mentioned problem, thereby improving the short circuit and short circuit phenomenon of the touch wiring layer 170. On the other hand, the connection line 121 can be preset by utilizing the position of the encapsulation barrier layer. When etching the via 180, the connection line 121 is connected to the touch wiring 171 from the via 180 to achieve electrical connection of the touch wiring layer 170.

[0033] In one embodiment, the via 180 can be set as a large through-slot or a plurality of independent through-holes. When the via 180 is a large through-slot, the plurality of touch wirings 171 in the touch wiring layer 170 are connected to the corresponding connection wires 121 after passing through the through-slots. When the via 180 is a plurality of independent through-holes, each touch wiring 171 is connected to a connection wire 121 through a through-hole. Relatively speaking, the independent through-hole method allows each touch wiring 171 to be set separately, with better insulation, but the process is more difficult.

[0034] Specifically, the driving circuit layer 120 includes a stacked arrangement of multiple conductive layers and multiple insulating layers. Thin film transistors and driving circuits are formed in the driving circuit layer 120, and a pixel driving circuit for driving the light-emitting unit to display is formed by the thin film transistors and the driving circuits.

[0035] Figure 3 is a schematic top view of the display panel of the present application, Figure 4 This application Figure 3 Schematic diagram of M magnification, Figure 5 This application Figure 4 Schematic diagram of the cross section of the AA cutting line, Figure 6 This application Figure 4 BB cutting line cross-sectional diagram, see Figure 3-6 As shown, for a general display panel 100, the film layer position of the touch wiring layer 170 can also be set below the flat layer 160, that is, the wiring is set from above the encapsulation layer to below the flat layer 160, so as to avoid the problem of short circuit and disconnection of the touch wiring layer 170 caused by the cross section of the flat layer 160. However, for using a partition structure in the non-display area 102 to isolate the organic light-emitting unit in the light-emitting unit, or setting a partition structure in the non-display area 102 to increase the water vapor intrusion path, or setting a partition structure in the non-display area 102, after the partition structure is set in the non-display area 102, when the touch wiring layer 170 is formed on the partition structure, the touch wiring 171 will be disconnected due to the partition structure.

[0036] By setting the flat layer 160, the present application can flatten the partition structure through the flat layer 160, so that the touch wiring layer 170 is set on the flat layer 160, avoiding the disconnection problem of the touch wiring 171 where the partition structure is located. Of course, this embodiment is not limited to the touch wiring layer 170. When it is necessary to form a metal wiring above the partition structure and the flat layer 160 is needed to flatten the metal wiring, the metal wiring also falls within the protection scope of this implementation.

[0037] In this embodiment, the planar layer 160 can be used to fill the partition part protruding from the conductive part between the conductive part and the partition part in the partition structure, so that it no longer has a partitioning function, so that the touch wiring 171 above the planar layer 160 can pass smoothly. When the cross-section problem of the planar layer 160 in the previous embodiment exists, the solution in the first embodiment can also be adopted, which will not be repeated here.

[0038] In another embodiment, a plurality of flat layers 160 may be designed. After the bottom flat layer 160 completes the flattening partition structure, a touch line layer 170 is formed and then another flat layer 160 is formed to reduce the film height of the flat layer 160 near the binding area so that the touch line 171 can extend directly to the binding area.

[0039] In this embodiment, a partition structure is specifically used as the encapsulation barrier dam 150 for specific description.

[0040] The present application discloses a display panel, wherein the display panel 100 includes a display area 101 and a non-display area 102, and the display panel also includes a base substrate 110, a driving circuit layer 120, a display film layer 130, a packaging film layer 140, a packaging barrier dam 150, a flat layer 160 and a touch wiring layer 170, wherein the driving circuit layer 120 is arranged on the base substrate 110; the display film layer 130 is arranged on the driving circuit layer 120; the packaging film layer 140 is arranged on the display film layer 130, and the touch wiring layer 170 is composed of the above-mentioned The display area 101 extends toward the non-display area 102; the encapsulation barrier dam 150 is disposed between the driving circuit layer 120 and the encapsulation film layer 140, and is located in the non-display area; the flat layer 160 is disposed on the encapsulation film layer 140, and the touch wiring layer 170 is disposed on the flat layer 160; wherein the flat layer 160 is provided with a via 180 in the area where the encapsulation barrier dam 150 is located, and the touch wiring layer 170 extends toward the edge of the display panel along the via 180.

[0041] Specifically, the encapsulation barrier dam 150 includes a first barrier dam 151 and a second barrier dam 152 . The first barrier dam 151 is disposed around the display area 101 , and the second barrier dam 152 is disposed around the first barrier dam 151 .

[0042] Among them, the packaging film layer 140 includes a first inorganic layer 141, an organic packaging layer 142 and a second inorganic layer 143, the organic packaging layer 142 is arranged between the first inorganic layer 141 and the second inorganic layer 143, and the second inorganic layer 143 is arranged on the first inorganic layer 141; the organic packaging layer 142 extends from the display area 101 to the non-display area 102 and is blocked by the first blocking dam 151; the first inorganic layer 141 and the second inorganic layer 143 extend from the display area 101 to the non-display area 102 and cover the first blocking dam 151 and the second blocking dam 152.

[0043] The main function of the encapsulation barrier dam 150 in this embodiment is to prevent the organic encapsulation layer 142 from diffusing and overflowing outward. When the organic encapsulation layer 142 is manufactured by inkjet printing, it takes a certain amount of time to level and then solidify. During the leveling process, the encapsulation barrier dam 150 is required to block and prevent diffusion to the edge of the display panel 100.

[0044] When the display panel 100 uses the maskless evaporation technology to form the light-emitting film layer, the encapsulation barrier dam 150 in this embodiment uses the partition structure in the maskless evaporation technology to achieve leveling barrier for the organic encapsulation layer 142 , that is, it is formed synchronously with the partition structure of the display area 101 .

[0045] The display film layer 130 includes a pixel definition layer 131, a conductive partition structure 134 and a plurality of light-emitting units. The display area can be divided into an opening area and a non-opening area. The light-emitting units are arranged in the opening area. Two adjacent light-emitting units are separated by the pixel definition layer 131 and the conductive partition structure 134. The pixel definition layer 131 is arranged on the driving circuit layer 120, and the conductive partition structure 134 is arranged on the pixel definition layer 131; the conductive partition structure 134 is formed by the same process as the first blocking dam 151 and the second blocking dam 152.

[0046] The first blocking dam 151 includes a first conductive portion 1511 and a first partition portion 1512, wherein the first partition portion 1512 is disposed on the first conductive portion 1511, and a radial width of the first partition portion 1512 is greater than a radial width of the first conductive portion 1511; the second blocking portion 153 includes a second conductive portion 1531 and a second partition portion 1532, wherein the second partition portion 1532 is disposed on the second conductive portion 1531, and a radial width of the second partition portion 1532 is greater than a radial width of the second conductive portion 1531;

[0047] The conductive partition structure 134 includes a third conductive portion 1341 and a third partition portion 1342 . The third partition portion 1342 is disposed on the third conductive portion 1341 , and a radial width of the third partition portion 1342 is greater than a radial width of the third conductive portion 1341 .

[0048] The first conductive portion 1511 , the second conductive portion 1531 and the third conductive portion 1341 are formed by the same process, and the first partition portion 1512 , the second partition portion 1532 and the third partition portion 1342 are formed by the same process. Specifically, after the pixel definition layer 131 is formed on the driving circuit layer 120, the conductive part material and the partition part material are deposited in sequence on the entire surface, and a patterning process is performed after the deposition is completed, retaining the partition part of the non-opening area in the display area 101 and the partition part of the non-display area 102 located in the encapsulation barrier dam 150 area to form a first partition part 1512, a second partition part 1532 and a third partition part 1342; using the first partition part 1512, the second partition part 1532 and the third partition part 1342 as a protective layer, a wet etching process is performed on the conductive part material, so that the widths of the first partition part 1512, the second partition part 1532 and the third partition part 1342 are respectively larger than the widths of the first conductive part 1511, the second conductive part 1531 and the third conductive part 1341.

[0049] It can be understood that the width of the third partition portion 1342 mentioned in the display area 101 refers to the width of the third partition portion 1342 between two adjacent light-emitting units. The width of the first partition portion 1512 mentioned in the non-display area 102 refers to the width in the direction from the display area 101 to the non-display area 102 and perpendicular to the edge of the display panel 100. In other words, the first partition portion 1512 is arranged around the display area 101, and the surrounding extension direction is the length direction, and the direction perpendicular to the length direction is the width direction, and the direction of film stacking is the thickness direction.

[0050] In this embodiment, the partition part is a key structure used in the maskless evaporation technology. The width of the upper part (third partition part 1342) of the conductive partition structure 134 is greater than the width of the lower part (third conductive part 1341), so that no mask plate is required during the evaporation process, so that a plurality of patterned light-emitting units are formed in the light-emitting film layer process. In particular, when forming the organic light-emitting layer in the light-emitting unit, the conductive partition structure 134 is used to separate the organic light-emitting layers of the light-emitting units at different positions to form a plurality of independently packaged light-emitting units. The conductive partition structure 134 is also called a hanging structure or an eaves structure. For the cathode layer in the light-emitting unit, it can be connected through the third conductive part 1341 in the conductive partition structure 134, so as to form the cathode layer wiring on the front side and reduce the resistance drop of the cathode.

[0051] Since the first barrier dam 151 and the second barrier dam 152 are respectively designed with a partition structure, when the touch line 171 is formed above the package barrier dam 150, the touch line 171 may be disconnected due to the partition function of the first barrier dam 151 and the second barrier dam 152. In this embodiment, a flat layer 160 is further provided on the package barrier dam 150, so that the touch line 171 is designed to be routed along the flat layer 160.

[0052] Furthermore, the second blocking dam 152 includes a plurality of second blocking portions 153 that are spaced apart, and the second blocking portions 153 are insulated from each other; under the orthographic projection of the base substrate 110, the plurality of vias 180 overlap with the plurality of second blocking portions 153 respectively; the driving circuit layer 120 is provided with a plurality of connecting wires 121, and the touch wiring layer 170 is electrically connected to the connecting wires 121 through the second blocking portions 153.

[0053] In this embodiment, the first blocking dam 151 is mainly used to block the organic encapsulation layer 142, and the second blocking dam 152 is mainly used to connect the touch wiring layer 170. Since each touch wiring 171 needs to be connected separately, the second blocking dam 152 needs to be set as a plurality of second blocking portions 153, and each second blocking portion 153 is used to connect a touch wiring 171 with the connecting line 121. It is worth mentioning that the number of the second blocking portions 153 is consistent with the number of the touch wiring 171. In the area where the touch wiring layer 170 is not provided, the second blocking dam 152 is still a continuous surrounding structure, and a plurality of second blocking portions 153 arranged at intervals are only provided in the area where the touch wiring layer 170 is located.

[0054] In one embodiment, the touch wiring layer 170 is electrically connected to the connection line 121 through the second conductive part 1531. That is, when forming the via 180, the second partition part 1532, the first inorganic layer 141, and the second inorganic layer 143 above the second conductive part 1531 are opened, so that the touch wiring 171 in the touch wiring layer 170 is directly connected to the second conductive part 1531, and connected to the connection line 121 provided on the driving circuit layer 120 through the second conductive part 1531, and the connection line 121 provided on the driving circuit layer 120 transmits the electrical signal to the external driving chip.

[0055] In another embodiment, the second partition portion 1532 is also formed of a conductive material, and the touch wiring layer 170 is electrically connected to the connection line 121 through the second partition portion 1532 and the second conductive portion 1531. In this embodiment, the second partition portion 1532 does not need to be punched, and can be directly connected to the connection line 121 below the second conductive portion 1531 through the second partition portion 1532 and the second conductive portion 1531.

[0056] In this embodiment, it is no longer necessary to punch holes in the second partition portion 1532, and the electrical connection can be directly performed by using the second partition portion 1532. However, it is worth noting that the material of the second conductive portion 1531 is different from the conductive material used by the second partition portion 1532. For example, the material of the second partition portion 1532 is Ti material, and the material of the second conductive portion 1531 is aluminum or molybdenum material. When the second conductive portion 1531 is etched, the second partition portion 1532 will not be affected.

[0057] Specifically, the first inorganic layer 141 and the second inorganic layer 143 are provided with through holes corresponding to the via holes 180 , and the touch wiring layer 170 is connected to the second blocking portion 153 through the through holes.

[0058] During this process, the via 180 and the through hole in this embodiment are respectively completed by etching processes. When the second partition portion 1532 is formed by conductive material, there is no need to further etch the second partition portion 1532. Holes can be directly dug in the first inorganic layer 141 and the second inorganic layer 143 above the second partition portion 1532.

[0059] Specifically, the driving circuit layer 120 also includes an insulating layer 122, and the insulating layer 122 covers the connecting line 121; a first through hole 123 is provided on the insulating layer 122, and the second conductive part 1531 passes through the first through hole 123 and is connected to the connecting line 121; under the orthographic projection of the base substrate 110, the first through hole 123 overlaps with the via 180.

[0060] In this embodiment, the first through hole 123 is directly disposed below the second conductive portion 1531 of the second blocking portion 153, so that when the second conductive portion 1531 is formed, it is directly electrically connected to the connecting wire 121 disposed thereunder. The advantage of this embodiment is that when only one insulating layer 122 is disposed between the connecting wire 121 and the second blocking portion 153, the process of forming the first through hole 123 on the insulating layer 122 is relatively convenient, and direct connection is possible.

[0061] However, when other film layers are disposed under the second blocking portion 153 , it is necessary to arrange the via hole 180 and the through hole on the insulating layer 122 in a non-overlapping manner.

[0062] Figure 7 is a cross-sectional schematic diagram of another display panel of the second embodiment of the present application, see Figure 7As shown, the display film layer 130 includes a pixel definition layer 131, and the pixel definition layer 131 is arranged in the display area 101. The pixel definition layer 131 is also provided with a first pixel definition layer extension portion 132 and a second pixel definition layer extension portion 133 in the non-display area 102. The first pixel definition layer extension portion 132 is arranged under the first blocking dam 151, and the second pixel definition layer extension portion 133 is arranged under the second blocking dam 152.

[0063] In this embodiment, the pixel definition layer 131, the first pixel definition layer extension 132 and the second pixel definition layer extension 133 are formed in the same process, and the extension material of the pixel definition layer 131 is arranged in the encapsulation barrier dam 150 area to raise the first barrier dam 151 and the second barrier dam 152. It can be understood that in the process of raising the first barrier dam 151 and the second barrier dam 152, the planarization film layer in the driving circuit layer 120 can also be used to increase the height of the first barrier dam 151 and the second barrier dam 152, thereby forming a better blocking effect. Among them, the material used for the planarization film layer and the above-mentioned planarization layer 160 can be the same or different. The planarization film layer in the driving circuit layer 120 can be formed by organic material or inorganic material, but the planarization layer 160 is generally coated with an organic layer to achieve film planarization.

[0064] Among them, the driving circuit layer 120 also includes an insulating layer 122, and the insulating layer 122 covers the connecting line 121; the second blocking portion 153 is also provided with a second blocking portion extension 154, and under the orthographic projection of the base substrate 110, the second blocking portion extension 154 does not overlap with the second pixel definition layer extension 133; a second through hole 124 is provided on the insulating layer 122, and the second through hole 124 is arranged under the second blocking portion extension 154, and the second conductive portion 1531 passes through the second through hole 124 to be connected to the connecting line 121, and under the orthographic projection of the base substrate, the second through hole 124 does not overlap with the via 180.

[0065] In the design of this embodiment, the second blocking portion extension 154 is arranged on the side of the second pixel definition layer extension 133 by setting an extension portion. The second blocking portion extension 154 does not need to be arranged on the second pixel definition layer extension 133. By forming a second through hole 124 between the second blocking portion extension 154 and the connecting line 121, the second conductive portion 1531 also extends to the second through hole 124 and is connected to the connecting line 121, thereby realizing the transmission of electrical signals of the touch wiring layer 170.

[0066] In one embodiment, the height of the first barrier dam 151 is higher than the height of the second barrier dam 152. The main purpose of the higher height of the first barrier dam 151 is to increase the leveling capability of the organic encapsulation layer 142 and prevent the organic encapsulation layer 142 from overflowing. The height of the second barrier dam 152 does not need to be limited. Of course, the higher the height of the second barrier dam 152, the smaller the cross-sectional height difference between the corresponding flat layer 160 and the second barrier dam 152, and the better the process accuracy of the touch wiring 171.

[0067] Figure 8 is a schematic diagram of the display device of the present application, see Figure 8 As shown, the present application discloses a display device 200, including a driving circuit 210 and the above-mentioned display panel 100, wherein the driving circuit 210 is used to drive the display panel 100 to display.

[0068] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0069] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. A display panel, comprising a display area and a non-display area, characterized in that: The display panel further includes: substrate substrate; A driving circuit layer is arranged on the base substrate; A display film layer, disposed on the driving circuit layer; A packaging film layer, disposed on the display film layer and extending from the display area to the non-display area; A packaging barrier dam is disposed between the driving circuit layer and the packaging film layer and is located in the non-display area; a flat layer, disposed on the packaging film layer, and A touch wiring layer, arranged on the flat layer; The planar layer is provided with a via hole in the area where the encapsulation barrier dam is located, and the touch wiring layer extends along the via hole toward the edge of the display panel.

2. The display panel according to claim 1, characterized in that: The encapsulation barrier dam comprises a first barrier dam and a second barrier dam, wherein the first barrier dam is disposed around the display area, and the second barrier dam is disposed around the first barrier dam; The second blocking dam includes a plurality of second blocking portions arranged at intervals, and the second blocking portions are insulated from each other; Under the orthographic projection of the base substrate, the plurality of via holes overlap with the plurality of second blocking portions respectively; The driving circuit layer is provided with a plurality of connecting wires, and the touch wiring layer is electrically connected to the connecting wires through the second blocking portion.

3. The display panel according to claim 2, characterized in that: The first barrier dam includes a first conductive portion and a first partition portion, the first partition portion is disposed on the first conductive portion, and a radial width of the first partition portion is greater than a radial width of the first conductive portion. The second blocking portion includes a second conductive portion and a second partition portion, the second partition portion is disposed on the second conductive portion, and a radial width of the second partition portion is greater than a radial width of the second conductive portion; The touch wiring layer is electrically connected to the connecting wire through the second conductive portion.

4. The display panel according to claim 3, characterized in that: The second partition portion is also formed of a conductive material, and the touch wiring layer is electrically connected to the connecting line through the second partition portion and the second conductive portion.

5. The display panel according to claim 3, characterized in that: The driving circuit layer further comprises an insulating layer, and the insulating layer covers the connection line arrangement; The insulating layer is provided with a first through hole, and the second conductive part passes through the first through hole and is connected to the connecting line; Under the orthographic projection of the base substrate, the first through hole overlaps with the via hole.

6. The display panel according to claim 3, characterized in that: The display film layer includes a pixel definition layer, which is arranged in a non-display area. The pixel definition layer is also provided with a first pixel definition layer extension portion and a second pixel definition layer extension portion in the non-display area. The first pixel definition layer extension portion is arranged under a first blocking dam, and the second pixel definition layer extension portion is arranged under the second blocking dam.

7. The display panel according to claim 6, characterized in that: The driving circuit layer further comprises an insulating layer, and the insulating layer covers the connection line arrangement; The second blocking portion is further provided with a second blocking portion extension portion, and under the orthographic projection of the base substrate, the second blocking portion extension portion does not overlap with the second pixel definition layer extension portion; The insulating layer is provided with a second through hole, the second through hole is provided under the second blocking portion extension, and the second conductive portion is connected to the connecting line through the second through hole; Under the orthographic projection of the base substrate, the second through hole does not overlap with the via hole.

8. The display panel according to claim 2, characterized in that: The encapsulation film layer comprises a first inorganic layer, an organic encapsulation layer and a second inorganic layer, the organic encapsulation layer is arranged between the first inorganic layer and the second inorganic layer, and the second inorganic layer is arranged on the first inorganic layer; The organic encapsulation layer extends from the display area to the non-display area and is blocked by the first blocking dam; The first inorganic layer and the second inorganic layer extend from the display area to the non-display area and cover the first barrier dam and the second barrier dam; The first inorganic layer and the second inorganic layer are provided with through holes corresponding to the via holes, and the touch wiring layer is connected to the second blocking portion through the through holes.

9. The display panel according to claim 3, characterized in that: The display film layer also includes a conductive partition structure and a pixel definition layer. The pixel definition layer is arranged on the driving circuit layer. The conductive partition structure is arranged on the pixel definition layer. The conductive partition structure is formed by the same process as the first blocking dam and the second blocking dam.

10. A display device, characterized in that: It comprises a driving circuit and the display panel according to any one of claims 1 to 9, wherein the driving circuit is used to drive the display panel to display.

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