A rotary sealing mechanism and semiconductor deposition equipment

Abstract

The invention discloses a rotary sealing mechanism and a semiconductor deposition device, belonging to the field of semiconductor technology. The rotary sealing mechanism is applied to semiconductor deposition devices, the rotary sealing mechanism is used to seal a vertically arranged rotary shaft, the rotary shaft is used to support and adjust the wafer by rotating itself, the rotary sealing mechanism comprises a support assembly and a seal, the rotary shaft is passed through the support assembly and the seal, the outer periphery of the rotary shaft is provided with a crimping portion spaced from the rotary shaft; the seal is clamped between the crimping portion and the support assembly, so that the seal is sealed and connected to the outer periphery of the rotary shaft, the rotary shaft can rotate around its own axis and relative to the seal, and the sealing between the rotary shaft and the rotary sealing mechanism is ensured.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a rotary sealing mechanism and semiconductor deposition equipment. Background Art

[0002] Semiconductor deposition equipment is used to perform deposition reactions on wafers, that is, to obtain a thin film on the wafer substrate by chemical or physical methods. The uniformity of the thin film on the wafer substrate is one of the most important indicators to measure the effect of the deposition reaction. In order to deposit a uniform thin film on the wafer substrate, the wafer can be horizontally rotated a certain angle multiple times and then the deposition reaction is carried out in the reaction chamber to obtain a uniform thin film.

[0003] There are many mechanisms for rotating the wafer, which generally include at least a rotating shaft for supporting and driving the wafer to rotate. The rotating shaft and the cavity need to be sealed to ensure the vacuum inside the cavity. Therefore, ensuring the sealing of the rotating shaft and the cavity is an important link, so as to prevent the wafer located on the rotating shaft and in the cavity from being disturbed by the environment, thereby affecting the wafer quality. Summary of the invention

[0004] The object of the present invention is to provide a rotary sealing mechanism and a semiconductor deposition device to ensure the sealing performance between a rotary shaft and the rotary sealing mechanism.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A rotary sealing mechanism is applied to semiconductor deposition equipment, the rotary sealing mechanism is used to seal a vertically arranged rotary shaft, the rotary shaft is used to support and adjust the wafer by rotating itself, the rotary sealing mechanism comprises a support assembly and a seal, the rotary shaft is passed through the support assembly and the seal, the outer periphery of the rotary shaft is provided with a crimping portion spaced from the rotary shaft; the seal is clamped between the crimping portion and the support assembly so that the seal is sealed and connected to the outer periphery of the rotary shaft, and the rotary shaft can rotate around its own axis and relative to the seal.

[0007] In some possible embodiments, the seal includes a sealing portion and an extension portion whose cross-sections are set at an angle, the sealing portion is sleeved on the rotating shaft and set at an angle to the rotating shaft, the extension portion is clamped between the crimping portion and the supporting assembly, and the sealing portion is located between the crimping portion and the rotating shaft.

[0008] In some possible implementations, the support assembly includes a support base, a flange is provided on the outer periphery of the rotating shaft, the crimping portion is a boss provided at the bottom of the flange, the boss divides the lower surface of the flange into two sections, wherein a section between the boss and the rotating shaft is a first surface of the flange, and a section between the boss and the outermost edge of the flange is a second surface;

[0009] The support base includes a first convex surface arranged upward from the bottom, a second convex surface arranged upward along the first convex surface, and a third convex surface arranged upward along the second convex surface; the first convex surface corresponds to the upper and lower positions of the first surface, the second convex surface corresponds to the upper and lower positions of the lower surface of the boss, and the third convex surface is completely docked and fits with the second surface; and the portion of the convex surface between the second convex surface and the third convex surface is tightly fit with the surface of the boss, so that a sealed space is formed between the first convex surface and the second convex surface at the bottom and the first surface and the lower surface of the boss at the top, and the sealing member is located in the sealed space to seal the rotating shaft.

[0010] In some possible embodiments, a lower support ring is provided in the sealing space, and the lower surface of the lower support ring corresponds to and fits with the first convex surface, the upper surface of the lower support ring is a slope, and the bottom of the slope is flush with the second convex surface, and the slope extends from the second convex surface toward the direction of the rotation axis, so that the slope and the second convex surface form a continuous connecting surface, and the connecting surface includes a planar portion and a slope portion docked with the planar portion.

[0011] In some possible embodiments, a seal located at the bottom is provided on the connecting surface, the lower surface of the seal at the bottom is completely corresponding to and fits with the connecting surface, and the upper surface of the seal at the bottom is a surface similar or identical to the shape of the connecting surface; an upper support ring is provided on the seal at the bottom, the lower surface of the upper support ring is completely corresponding to and fits with the planar portion of the upper surface of the seal at the bottom, and the upper surface of the upper support ring is a surface identical or similar to the connecting surface; the upper surface of the upper support ring is provided with the seal located at the top, the lower surface of the seal at the top is corresponding to and fits with the upper surface of the upper support ring, the upper surface of the seal at the top is identical or similar to the connecting surface, and the planar portion of the upper surface of the seal at the top is corresponding to and fits with the lower surface of the boss.

[0012] In some possible embodiments, one side surface of the two seals is in contact with the surface formed between the second convex surface and the raised surface, and the other side surface is in contact with the rotating shaft; the upper support ring includes a side surface facing the rotating shaft, which is in contact with the rotating shaft.

[0013] In some possible embodiments, the lower support ring has four surfaces, the lower surface is tightly fitted with the first convex surface, the upper surface is an inclined surface, which is completely fitted with the corresponding lower surface portion of the seal, one side surface is completely fitted with the surface formed between the first convex surface and the second convex surface, and the other side surface is completely fitted with the rotating axis.

[0014] In some possible embodiments, at least two seals are provided, the rotating shaft passes through at least two of the seals, the crimping portion is pressed against the extension portion of the seal at the top, and the supporting assembly supports the extension portion of the seal at the bottom, so that the extension portions of at least two seals are clamped between the crimping portion and the supporting assembly.

[0015] In some possible embodiments, two seals are provided, and the support assembly further includes an upper support ring, the upper support ring including a first support portion, a connecting portion, and a second support portion connected in sequence, the first support portion supports the sealing portion of the seal at the top, and the second support portion presses the extension portion of the seal at the bottom.

[0016] In some possible embodiments, the support assembly includes a support base, the support base is provided with a raised surface, a corresponding portion of the raised surface is fit-connected with the crimping portion, so that the rotating shaft and the support base form a sealed space, and the seal is located in the sealed space to seal the rotating shaft.

[0017] A semiconductor deposition device, comprising a target chamber and a rotating shaft, wherein the rotating shaft is used to support and adjust a wafer by rotating itself, wherein the target chamber is at least one of a reaction chamber, a transmission chamber, and a transfer chamber, and wherein the target chamber is provided with a rotating sealing mechanism as described in any one of the above items, and wherein the rotating sealing mechanism is used to seal the rotating shaft.

[0018] In some possible embodiments, the semiconductor deposition equipment includes a reaction chamber, a transmission chamber, and a transfer chamber. The reaction chamber and the transfer chamber are respectively connected to the transmission chamber, and the target chamber is a transfer chamber. A transfer member is provided in the transmission chamber. The transfer member transfers the wafer from the transmission chamber to the transfer chamber, and the rotating shaft rotates the wafer by a certain angle. The transfer member transfers the wafer to the transmission chamber and then to the reaction chamber for a first reaction. Afterwards, the transfer member moves the wafer to the transmission chamber and then to the transfer chamber. The rotating shaft rotates the wafer by a certain angle. The transfer member transfers the wafer to the transmission chamber and then to the reaction chamber for a second reaction, until the reaction is terminated after N cycles, where N is an integer greater than or equal to 1.

[0019] Beneficial effects of the present invention:

[0020] The present invention provides a rotary sealing mechanism and semiconductor deposition equipment, wherein the crimping portion is pressed tightly against the sealing member, and the crimping portion and the rotating shaft are spaced apart, so that the portion of the sealing member between the crimping portion and the rotating shaft can be deformed and tightly connected to the rotating shaft, thereby achieving sealing between the rotating shaft and the sealing member. The semiconductor deposition equipment adopts the rotary sealing mechanism, which has the following beneficial effects:

[0021] 1. When the rotating shaft is in a stationary state, a good seal is achieved on the rotating shaft;

[0022] 2. When the rotating shaft is in a rotating state, the seal can seal the rotating shaft well to ensure the sealing effect;

[0023] When the above-mentioned rotary sealing mechanism is applied to the target cavity of the semiconductor deposition equipment, the sealing inside the target cavity is ensured, so that the rotating shaft inside the target cavity can maintain good sealing during the rotational motion, keep it isolated from the external air, and keep the sealing part in a vacuum state. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic diagram of the docking state of the posture adjustment system and the transport component provided by a specific embodiment of the present invention;

[0025] Figure 2 is an exploded diagram of a posture adjustment system provided by a specific embodiment of the present invention;

[0026] Figure 3 It is a partial schematic diagram of the assembly of the rotary sealing mechanism and the rotary shaft provided by a specific embodiment of the present invention;

[0027] Figure 4 It is a schematic diagram of a state where a transfer member and a wafer provided in a specific embodiment of the present invention are located outside a posture adjustment system;

[0028] Figure 5 It is a schematic diagram of the state of the transfer member and the wafer located in the posture adjustment system provided by the specific embodiment of the present invention;

[0029] Figure 6 It is a schematic diagram of a wafer rotating state driven by a rotating mechanism provided in a specific embodiment of the present invention.

[0030] In the figure:

[0031] 200, wafer; 300, transfer parts;

[0032] 1. target cavity; 11. first shell; 111. opening; 12. second shell; 13. first fastener;

[0033] 2. Rotating mechanism; 21. Rotating shaft; 211. Flange; 212. Pressing part; 22. Bearing assembly;

[0034] 3. Rotary sealing mechanism; 31. Support assembly; 311. Support base; 312. Upper support ring; 3121. Annular gap; 3122. First support portion; 3123. Connecting portion; 3124. Second support portion; 313. Lower support ring; 32. Sealing member; 321. Sealing portion; 322. Extension portion;

[0035] 1000, sealed space; 2000, first surface; 3000, second surface; 4000, first convex surface; 5000, second convex surface; 6000, third convex surface; 7000, raised surface. DETAILED DESCRIPTION

[0036] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0037] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] like Figure 1-Figure 6As shown, this embodiment provides a rotary sealing mechanism, which is applied to semiconductor deposition equipment. The rotary sealing mechanism 3 is used to seal a vertically arranged rotary shaft 21. The rotary shaft 21 is used to support and adjust the wafer 200 by rotating itself. The rotary sealing mechanism 3 includes a supporting assembly 31 and a sealing member 32. The rotary shaft 21 is passed through the supporting assembly 31 and the sealing member 32. The outer periphery of the rotary shaft 21 is provided with a crimping portion 212 spaced apart from the rotary shaft 21; the sealing member 32 is clamped between the crimping portion 212 and the supporting assembly 31, so that the sealing member 32 is sealed and connected to the outer periphery of the rotary shaft 21, and the rotary shaft 21 can rotate around its own axis and relative to the sealing member 32.

[0040] In the above structure, the seal 32 can achieve good sealing of the rotating shaft 21 whether the rotating shaft 21 is in a stationary state or in a rotating working state; further, the crimping portion 212 is pressed against the seal 32, and the crimping portion 212 and the rotating shaft 21 are spaced apart, so that the portion of the seal 32 located between the crimping portion 212 and the rotating shaft 21 can be deformed and tightly connected to the rotating shaft 21, thereby achieving sealing between the rotating shaft 21 and the seal 32. The semiconductor deposition equipment ensures the sealing performance in the target cavity 1 by adopting the above-mentioned rotating sealing mechanism 3.

[0041] In some possible embodiments, the sealing member 32 includes a sealing portion 321 and an extension portion 322, the cross sections of which are arranged at an angle, the sealing portion 321 is sleeved on the rotating shaft 21 and arranged at an angle with the rotating shaft 21, the extension portion 322 is clamped between the crimping portion 212 and the support assembly 31, and the sealing portion 321 is located between the crimping portion 212 and the rotating shaft 21. Exemplarily, along the direction from the rotating shaft 21 to the extension portion 322, the sealing portion 321 is tilted downward / upward, and the crimping portion 212 is crimped on the extension portion 322, so that the sealing portion 321 is pressed and tightly embraced in the direction of the rotating shaft 21, thereby increasing the contact area between the sealing portion 321 and the rotating shaft 21 along the axial direction, and improving the sealing performance between the sealing portion 321 and the rotating shaft 21.

[0042] In some possible implementations, the support assembly 31 includes a support base 311, the support base 311 is provided with a raised surface 7000, and the corresponding portion of the raised surface 7000 is in close contact with the crimping portion 212, so that the rotating shaft 21 and the support base 311 form a sealed space 1000, and the seal 32 is located in the sealed space 1000 to seal the rotating shaft 21. Through the seal 32 and the sealed space 1000, multiple sealing effects are achieved, the sealing effect of the rotating shaft 21 and the rotating sealing mechanism 3 is improved, and the rotating sealing performance of the rotating shaft 21 when rotating is ensured.

[0043] During the rotation of the rotating shaft 21, the rotating shaft 21 rotates relative to the sealing member 32, and there is wear between the two. For this reason, at least two sealing members 32 are provided, and the rotating shaft 21 is passed through at least two sealing members 32. The crimping portion 212 is pressed against the extension portion 322 of the sealing member 32 at the top, and the supporting assembly 31 supports the extension portion 322 of the sealing member 32 at the bottom, so that the extension portions 322 of at least two sealing members 32 are clamped between the crimping portion 212 and the supporting assembly 31. By increasing the number of sealing members 32, the sealing performance is improved. In some embodiments, two sealing members 32 are provided, and the supporting assembly 31 further includes an upper supporting ring 312, and the upper supporting ring 312 includes a first supporting portion 3122, a connecting portion 3123, and a second supporting portion 3124 connected in sequence, the first supporting portion 3122 supports the sealing portion 321 of the sealing member 32 at the top, and the second supporting portion 3124 presses against the extension portion 322 of the sealing member 32 at the bottom. The upper support ring 312 is supported between the two sealing members 32 at the top and the bottom, ensuring that the extension portions 322 of the two sealing members 32 are tightly clamped between the crimping portion 212 and the support assembly 31 .

[0044] Specifically, the number of the sealing members 32 may be two, three, four or more than five, etc. Accordingly, a plurality of upper support rings 312 may be provided, and an upper support ring 312 is provided between any two adjacent upper and lower sealing members 32 .

[0045] In one embodiment, the support assembly 31 includes a support base 311, a flange 211 is provided on the outer periphery of the rotating shaft 21, and the crimping portion 212 is a boss provided at the bottom of the flange 211, and the boss divides the lower surface of the flange 211 into two sections, wherein a section between the boss and the rotating shaft 21 is a first surface 2000 of the flange 211, and a section between the boss and the outermost edge of the flange 211 is a second surface 3000. The support base 311 includes a first convex surface 4000 arranged upward from the bottom, a second convex surface 5000 arranged upward along the first convex surface 4000, and a third convex surface 6000 arranged upward along the second convex surface 5000; the first convex surface 4000 corresponds to the upper and lower positions of the first surface 2000, the second convex surface 5000 corresponds to the upper and lower positions of the lower surface of the boss, and the third convex surface 6000 is completely butted and fitted with the second surface 3000. And the portion of the raised surface 7000 between the second convex surface 5000 and the third convex surface 6000 is tightly fitted with the surface of the boss, so that a sealed space 1000 is formed between the first convex surface 4000 and the second convex surface 5000 at the bottom and the first surface 2000 and the lower surface of the boss at the top, and the seal 32 is located in the sealed space 1000 to seal the rotating shaft 21, thereby improving the sealing effect of the rotating shaft 21.

[0046] The above embodiment describes that the specific structure of the support base 311 is provided with three convex surfaces, the boss has a downward surface, and the flange is divided into two surfaces. The three convex surfaces are located at the bottom relative to the other three surfaces. Through this upper and lower arrangement, a good sealed space 1000 can be formed, thereby achieving excellent sealing. The second surface 3000 of the flange 211 is in close contact with the third convex surface 6000, thereby ensuring that the sealed space 1000 is completely isolated from the outside, and further ensuring the sealing of the inside and outside of the sealed space 1000.

[0047] A lower support ring 313 is provided in the sealed space 1000, the lower surface of the lower support ring 313 is correspondingly fitted with the first convex surface 4000, the upper surface of the lower support ring 313 is a slope, and the bottom of the slope is flush with the second convex surface 5000, and the slope extends from the second convex surface 5000 toward the direction of the rotating shaft 21, so that the slope and the second convex surface 5000 form a continuous connection surface, and the connection surface includes a plane part and a slope part connected to the plane part. A sealing member 32 is provided at the bottom on the connection surface, and the lower surface of the sealing member 32 at the bottom is completely correspondingly fitted with the connection surface.

[0048] The lower support ring 313 has four faces, the lower face is tightly fitted with the first convex surface 4000, the upper face is an inclined face that is completely fitted with the corresponding lower surface portion of the seal 32, one of the side faces is completely fitted with the face formed between the first convex surface 4000 and the second convex surface 5000, specifically, the face formed between the first convex surface 4000 and the second convex surface 5000 is an annular face extending in the vertical direction, and the other side face is fitted with the rotating shaft 21. Thus, the four faces of the lower support ring are completely sealed in the sealed space and completely fitted with different faces, thereby ensuring the sealing of the rotating shaft 21 and the sealing of the inside of the sealed space 1000, and the two sealing effects further improve the sealing performance.

[0049] In this embodiment, the first convex surface, the second convex surface, and the third convex surface are all planes at different horizontal positions, and the first spacing between the first convex surface and the second convex surface is smaller than the second spacing between the second convex surface and the second convex surface. With this arrangement, the height of the plane where the lower support ring 313 fits the vertical surface formed between the first convex surface and the second convex surface only needs to be the same as the first spacing, which is convenient for the installation of the lower support ring 313 and for sealing. On the other hand, the above-mentioned sealing space formed can facilitate the installation of the above-mentioned sealing components, etc., which is beneficial to the sealing design.

[0050] The upper surface of the bottom seal 32 is a surface similar or identical to the shape of the connecting surface; an upper support ring 312 is provided on the bottom seal 32, and the lower surface of the upper support ring 312 completely corresponds to and fits with the planar portion of the upper surface of the bottom seal 32, and the upper surface of the upper support ring 312 is a surface identical or similar to the connecting surface; the upper surface of the upper support ring 312 is provided with a seal 32 located at the top, and the lower surface of the top seal 32 corresponds to and fits with the upper surface of the upper support ring 312, the upper surface of the top seal 32 is identical or similar to the connecting surface, and the planar portion of the upper surface of the top seal 32 corresponds to and fits with the lower surface of the boss.

[0051] As described above, the upper and lower surfaces of the seal 32 are both the above-mentioned connecting surfaces, having a portion of an inclined surface and a portion of a flat surface, and the flat surface portion is supported, thereby ensuring the fixity and stability of the seal 32, and no instability will occur when the rotating shaft 21 is transported.

[0052] One side surface of the two sealing members 32 is in contact with the surface formed between the second convex surface 5000 and the convex surface 7000. Specifically, the surface formed between the convex surface 7000 and the second convex surface 5000 is an annular surface extending in the vertical direction, and the other side surface is in contact with the rotating shaft 21. This design ensures the sealing performance between the sealing member 32 and the rotating shaft 21, and ensures isolation from the outside and sealing performance regardless of the state of the rotating shaft 21.

[0053] The surface formed between the second convex surface 5000 and the raised surface 7000 is a vertical surface, and the vertical surface fits with the side surfaces of the two sealing components away from the rotating shaft.

[0054] The upper surface of the upper support ring 312 is the same as or similar to the connecting surface, and the side surface closer to the inclined portion is in contact with the rotating shaft 21, which fully guarantees its support for the seal and the stability of the seal 32, and also ensures the sufficient sealing of the seal 32.

[0055] Optionally, an annular gap 3121 is provided between the connecting portion 3123 and the supporting base 311 to reduce the contact between the connecting portion 3123 and the supporting base 311 , thereby reducing the machining accuracy of the upper supporting ring 312 and facilitating assembly.

[0056] The above rotary sealing mechanism 3 and the rotating shaft 21 form a multiple sealing effect, that is, the above sealed space 1000 is the first seal, and the two seals 32 constitute the second seal, so that the sealing effect is good. At the same time, the upper support ring 312 not only presses down and seals the bottom seal 32, but also supports and seals the top seal 32, ensuring sufficient support and sealing effects.

[0057] A semiconductor deposition device includes a target chamber 1 and a rotating shaft 21, the rotating shaft 21 is used to support and rotate a wafer 200, the target chamber 1 is at least one of a reaction chamber, a transmission chamber, and a transfer chamber, and the target chamber 1 is provided with a rotating sealing mechanism 3 as described above, and the rotating sealing mechanism 3 is used to seal the rotating shaft 21. The wafer 200 is located in the above-mentioned target chamber 1, and the sealing effect in the target chamber 1 can be ensured by sealing the rotating sealing mechanism 3 and the rotating shaft 21, so as to prevent the wafer 200 located on the rotating shaft 21 and in the target chamber 1 from being disturbed by the environment, thereby affecting the quality of the wafer 200. The target chamber 1 and the rotating sealing mechanism 3 are sealed and connected, which further ensures the sealing of the target chamber 1.

[0058] The wafer 200 is rotated to a preset angle by the rotating shaft 21. Specifically, the rotating shaft 21 makes the wafer 200 rotate N times, and the wafer 200 rotated N times correspondingly rotates to N preset angles, so that the wafer 200 is located in the target chamber 1 at N preset angles. The wafer 200 performs deposition reactions in sequence at N different preset angles, and in the case of uneven distribution of the reaction gas, the film on the surface of the wafer 200 is ensured to be uniform, and the quality of the deposition of the wafer 200 is ensured.

[0059] The rotating mechanism 2 is generally applicable to any one, two or three of the reaction chamber, the transmission chamber and the transfer chamber, as long as the wafer 200 is rotated N times to complete the reaction at N different preset angles.

[0060] In one embodiment, the target chamber 1 is a reaction chamber, and the wafer 200 undergoes a deposition reaction in the target chamber 1 at N different preset angles, so that the reaction gas in the target chamber 1 is unevenly distributed, while ensuring that the film on the surface of the wafer 200 is uniform.

[0061] In one embodiment, a semiconductor deposition device includes a reaction chamber, a transmission chamber, and a transfer chamber. The reaction chamber and the transfer chamber are respectively connected to the transmission chamber, and the target chamber 1 is a transfer chamber. A transfer member 300 is provided in the transmission chamber. The transfer member 300 transfers a wafer 200 from the transmission chamber to the transfer chamber. The rotating shaft 21 rotates the wafer 200 by a certain angle. The transfer member 300 transfers the wafer 200 to the transmission chamber and then to the reaction chamber for a first reaction. Afterwards, the transfer member 300 moves the wafer 200 to the transmission chamber and then moves the wafer 200 to the transfer chamber. The rotating shaft 21 rotates the wafer 200 by a certain angle. The transfer member 300 transfers the wafer 200 to the transmission chamber and then to the reaction chamber for a second reaction, until the reaction is terminated after N cycles, where N is an integer greater than or equal to 1.

[0062] The wafer 200 is adjusted to a preset angle in the transfer chamber, and the transfer chamber transfers the wafer 200 adjusted to the preset angle to the reaction chamber, so that the wafer 200 reacts in the reaction chamber as preset. After N transfers in the transfer chamber, N angle adjustments in the transfer chamber, and N reactions in the reaction chamber, the deposition reaction of the wafer 200 is realized.

[0063] Optionally, a supporting component 22 is provided on the rotating shaft 21, and the two form a rotating mechanism 2. The wafer 200 is provided on the supporting component 22. The rotating shaft 21 rotates to drive the supporting component 22 and the wafer 200 thereon to rotate. The supporting component 22 may specifically include three connecting rods, on which ejector pins are provided. The ejector pins on the three connecting rods form a supporting surface for supporting the wafer 200.

[0064] like Figure 4 and Figure 5 As shown, when placing the wafer 200, the transport member 300 moves along the X1 direction to the top of the carrier assembly 22; then the transport member 300 moves along the Y1 direction, that is, downward, and after placing the wafer 200 on the carrier assembly 22, the transport member 300 is pulled out from the wafer 200 and the end of the rotating shaft 21 along the X2 direction. When taking away the wafer 200, the transport member 300 moves along the X1 direction and is inserted from the wafer 200 and the end of the rotating shaft 21, and the transport member 300 moves upward to make the wafer 200 fall on the transport member 300, and then the transport member 300 moves along the X2 direction to carry the wafer 200 away from the carrier assembly 22.

[0065] like Figure 6 As shown, the rotating mechanism 2 can rotate in two directions, M1 and M2. It can rotate in one direction of M1 and M2 for N times, or it can rotate in two directions, for example, the first rotation is in M1 and the second rotation is in M2, and so on. It can be set according to needs.

[0066] In one embodiment, the target cavity 1 is used as a transmission cavity, and the wafer 200 is transferred between the reaction cavity and the adjustment cavity through the transmission cavity, so that the wafer 200 is adjusted by the transmission cavity and then removed from the transmission cavity in a preset posture, and is placed in the reaction cavity in a preset posture for reaction. The wafer 200 is centered and positioned in the transmission cavity to ensure positioning accuracy, thereby improving the transfer accuracy of the wafer 200, and is transferred to the reaction cavity at a preset angle for reaction by adjusting the angle.

[0067] Optionally, the target chamber 1 includes a first shell 11 and a second shell 12 connected to each other, the driving mechanism is disposed in the second shell 12, the rotating shaft 21 passes through and is rotatably connected to the first shell 11, and the bearing assembly 22 is disposed in the first shell 11. The first shell 11 is provided with an opening 111, so that the target chamber 1 can be entered and exited through the opening 111 to take and place the wafer 200.

[0068] Optionally, the first shell 11 and the second shell 12 are connected by a first fastener 13 such as a screw to facilitate assembly and disassembly.

[0069] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A rotary sealing mechanism, applied to semiconductor deposition equipment, characterized in that: The rotary sealing mechanism is used to seal a vertically arranged rotary shaft (21), the rotary shaft (21) being used to support and adjust a wafer (200) by rotating itself, the rotary sealing mechanism comprising a supporting assembly (31) and a sealing member (32), the rotary shaft (21) being passed through the supporting assembly (31) and the sealing member (32), the outer periphery of the rotary shaft (21) being provided with a crimping portion (212) spaced from the rotary shaft (21); the sealing member (32) being clamped between the crimping portion (212) and the supporting assembly (31) so that the sealing member (32) The seal is connected to the outer periphery of the rotating shaft (21), and the rotating shaft (21) can rotate around its own axis and relative to the sealing member (32); the sealing member (32) comprises a sealing portion (321) and an extending portion (322) whose cross sections are arranged at an angle, the sealing portion (321) is sleeved on the rotating shaft (21) and is arranged at an angle to the rotating shaft (21), the extending portion (322) is clamped between the crimping portion (212) and the supporting assembly (31), and the sealing portion (321) is located between the crimping portion (212) and the rotating shaft (21).

2. The rotary sealing mechanism according to claim 1, characterized in that: The support assembly (31) comprises a support base (311), a flange (211) is provided on the outer periphery of the rotating shaft (21), the crimping portion (212) is a boss provided at the bottom of the flange (211), the boss divides the lower surface of the flange (211) into two sections, wherein a section between the boss and the rotating shaft (21) is a first surface (2000) of the flange (211), and a section between the boss and the outermost edge of the flange (211) is a second surface (3000); The support base (311) comprises a first convex surface (4000) arranged upward from the bottom, a second convex surface (5000) arranged upward along the first convex surface (4000), and a third convex surface (6000) arranged upward along the second convex surface (5000); the first convex surface (4000) corresponds to the first surface (2000) in upper and lower positions, the second convex surface (5000) corresponds to the lower surface of the boss in upper and lower positions, and the third convex surface (6000) corresponds to the second surface ( 3000) are completely butted against each other; and a portion of the raised surface (7000) between the second convex surface (5000) and the third convex surface (6000) is tightly fitted with the surface of the boss, so that a sealed space (1000) is formed between the first convex surface (4000) and the second convex surface (5000) at the bottom and the first surface (2000) and the lower surface of the boss, and the sealing member (32) is located in the sealed space (1000) to seal the rotating shaft (21).

3. The rotary sealing mechanism according to claim 2, characterized in that: A lower support ring (313) is arranged in the sealed space (1000), the lower surface of the lower support ring (313) is correspondingly fitted with the first convex surface (4000), the upper surface of the lower support ring (313) is a slope, and the bottom of the slope is flush with the second convex surface (5000), and the slope extends from the second convex surface (5000) toward the rotation axis (21), so that the slope and the second convex surface (5000) form a continuous connection surface, and the connection surface includes a plane part and a slope part connected to the plane part.

4. The rotary sealing mechanism according to claim 3, characterized in that: The connecting surface is provided with a sealing member (32) located at the bottom, the lower surface of the sealing member (32) at the bottom is completely corresponding to and fitted with the connecting surface, and the upper surface of the sealing member (32) at the bottom is a surface similar to or identical to the shape of the connecting surface; the sealing member (32) at the bottom is provided with an upper support ring (312), the lower surface of the upper support ring (312) is completely corresponding to and fitted with a planar portion of an upper surface of the sealing member (32) at the bottom, and the upper surface of the upper support ring (312) is a surface identical to or similar to the connecting surface; the upper surface of the upper support ring (312) is provided with the sealing member (32) located at the top, the lower surface of the sealing member (32) at the top is corresponding to and fitted with an upper surface of the upper support ring (312), the upper surface of the sealing member (32) at the top is identical to or similar to the connecting surface, and the planar portion of the upper surface of the sealing member (32) at the top is correspondingly fitted with a lower surface of the boss.

5. The rotary sealing mechanism according to claim 4, characterized in that: One side of the two sealing members (32) away from the rotating shaft is in contact with the surface formed between the second convex surface (5000) and the raised surface (7000), and the other side is in contact with the rotating shaft (21); the upper support ring (312) includes a side facing the rotating shaft (21), and the side is in contact with the rotating shaft (21).

6. The rotary sealing mechanism according to claim 3, characterized in that: The lower support ring (313) has four surfaces, the lower surface is tightly fitted with the first convex surface (4000), the upper surface is an inclined surface, which is completely fitted with the corresponding lower surface portion of the seal (32), one side surface is completely fitted with the surface formed between the first convex surface (4000) and the second convex surface (5000), and the other side surface is completely fitted with the rotating shaft (21).

7. The rotary sealing mechanism according to claim 1, characterized in that: At least two seals (32) are provided, the rotating shaft (21) passes through at least two seals (32), the crimping portion (212) is pressed against the extension portion (322) of the seal (32) at the top, and the supporting assembly (31) supports the extension portion (322) of the seal (32) at the bottom, so that the extension portions (322) of at least two seals (32) are clamped between the crimping portion (212) and the supporting assembly (31).

8. The rotary sealing mechanism according to claim 7, characterized in that: The sealing member (32) is provided with two, and the supporting assembly (31) further comprises an upper supporting ring (312), wherein the upper supporting ring (312) comprises a first supporting portion (3122), a connecting portion (3123) and a second supporting portion (3124) which are connected in sequence, wherein the first supporting portion (3122) supports the sealing portion (321) of the sealing member (32) at the top, and the second supporting portion (3124) presses the extending portion (322) of the sealing member (32) at the bottom.

9. The rotary sealing mechanism according to claim 1, characterized in that: The support assembly (31) comprises a support base (311), the support base (311) being provided with a raised surface (7000), a corresponding portion of the raised surface (7000) being fitted and connected with the crimping portion (212), so that the rotating shaft (21) and the support base (311) form a sealed space (1000), and the sealing member (32) is located in the sealed space (1000) to seal the rotating shaft (21).

10. A semiconductor deposition device, characterized in that: The semiconductor deposition equipment comprises a target chamber (1) and a rotating shaft (21), wherein the rotating shaft (21) is used to support and adjust the wafer (200) by rotating itself, and the target chamber (1) is at least one of a reaction chamber, a transmission chamber, and a transfer chamber, and the target chamber (1) is provided with a rotating sealing mechanism according to any one of claims 1 to 9, and the rotating sealing mechanism is used to seal the rotating shaft (21).

11. The semiconductor deposition device according to claim 10, characterized in that: The semiconductor deposition equipment comprises a reaction chamber, a transmission chamber, and a transfer chamber, wherein the reaction chamber and the transfer chamber are respectively connected to the transmission chamber, and the target chamber (1) is a transfer chamber, wherein a transfer member (300) is arranged in the transmission chamber, wherein the transfer member (300) transfers the wafer (200) from the transmission chamber to the transfer chamber, wherein the rotating shaft (21) causes the wafer (200) to rotate by a certain angle, and the transfer member (300) transfers the wafer (200) to the transmission chamber. The wafer (200) is transferred to the transfer chamber and then to the reaction chamber for a first reaction; thereafter, the transfer unit (300) moves the wafer (200) to the transfer chamber and then moves the wafer (200) to the transfer chamber, the rotating shaft (21) rotates the wafer (200) by a certain angle, and the transfer unit (300) transfers the wafer (200) to the transfer chamber and then to the reaction chamber for a second reaction, until the reaction is terminated after N cycles, where N is an integer greater than or equal to 1.

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