A cooling system, a control method for a cooling system, and an edge server

Abstract

The present invention discloses a cooling system, a control method of the cooling system and an edge server, and relates to the technical field of servers. The cooling system includes a refrigeration module and a temperature-averaging plate module. The refrigeration module is used to be arranged outside the chassis, and the refrigeration module includes a generator and an evaporator, and the generator and the evaporator are respectively used to be arranged at a first heat-conducting contact position and a second heat-conducting contact position of the chassis; the temperature-averaging plate module is used to be arranged inside the chassis, and the temperature-averaging plate module includes a first temperature-averaging plate group and a second temperature-averaging plate group. The first temperature-averaging plate group is used to be fixed on a heating component in the chassis, and the second temperature-averaging plate group is connected to the first temperature-averaging plate group. The second temperature-averaging plate group is constructed to be in heat-conducting contact with the generator at a first heat-conducting contact position and in heat-conducting contact with the evaporator at a second heat-conducting contact position. The above-mentioned cooling system solves the problem that the current edge server cannot ensure the long-term stable operation of the equipment when working in an outdoor environment.

Description

Technical Field

[0001] The present invention relates to the technical field of servers, and in particular to a cooling system, a control method of the cooling system and an edge server. Background Art

[0002] Currently, edge servers are deployed at the edge of the network close to the data source to provide computing, storage, and network services.

[0003] Since edge servers need to be set up in harsh working environments such as outdoors and in the wild to process large amounts of data and respond to user requests in real time, factors such as high temperature, humidity, and dust pose huge challenges to the server's cooling system when the edge server works in an outdoor environment. Currently, edge servers mainly use air-cooled or liquid-cooled cooling systems. When air-cooled or liquid-cooled cooling systems are deployed outdoors, they are not only easily affected by the environment, such as outdoor dust and rainwater easily entering the chassis, but also have problems such as leakage and refilling, which cannot guarantee the long-term stable operation of the equipment. Summary of the invention

[0004] The purpose of the present invention is to provide a cooling system, a control method for the cooling system and an edge server, which solve the problem that the current edge server cannot ensure long-term stable operation of the equipment when working in an outdoor environment.

[0005] To achieve the above object, the present invention provides a cooling system, comprising:

[0006] A refrigeration module is used to be arranged outside the chassis, and the refrigeration module includes a generator and an evaporator, and the generator and the evaporator are used to be arranged at a first heat-conducting contact position and a second heat-conducting contact position of the chassis respectively;

[0007] A temperature equalizing plate module is used to be arranged inside a chassis. The temperature equalizing plate module includes a first temperature equalizing plate group and a second temperature equalizing plate group. The first temperature equalizing plate group is used to be fixed on a heat-generating component in the chassis. The second temperature equalizing plate group is connected to the first temperature equalizing plate group, so that the heat generated by the heat-generating component is transferred to the second temperature equalizing plate group via the first temperature equalizing plate group. The second temperature equalizing plate group is constructed to be in thermal contact with the generator at a first thermal contact position so that the absorbent and refrigerant in the generator are separated by heat, and to be in thermal contact with the evaporator at a second thermal contact position so that the liquid refrigerant in the evaporator is evaporated into a gaseous refrigerant by heat.

[0008] In some aspects, the temperature averaging plate module further includes a heat transfer structure, and the second temperature averaging plate group is connected to the first temperature averaging plate group through the heat transfer structure, so that the heat in the first temperature averaging plate group is transferred to the second temperature averaging plate group through the heat transfer structure.

[0009] In other aspects, the first temperature equalizing plate group includes a first temperature equalizing plate body and a second temperature equalizing plate body, the first temperature equalizing plate body is used to be fixed on the first heat-generating type component of the heat-generating component to diffuse the heat generated by the first heat-generating type component and maintain the uniformity of the surface temperature of the first heat-generating type component, and the second temperature equalizing plate body is used to be fixed on the second heat-generating type component of the heat-generating component to diffuse the heat generated by the second heat-generating type component and maintain the uniformity of the surface temperature of the second heat-generating type component, wherein the heat generated by the first heat-generating type component within a preset time is less than the heat generated by the second heat-generating type component within the preset time.

[0010] In other aspects, the second temperature averaging plate group includes a third temperature averaging plate body and a fourth temperature averaging plate body. The third temperature averaging plate body is used to be fixed on the inner surface of the chassis cover corresponding to the first thermal contact position, so that the third temperature averaging plate body is in thermal contact with the generator, and the fourth temperature averaging plate body is used to be fixed on the inner surface of the chassis cover corresponding to the second thermal contact position, so that the fourth temperature averaging plate body is in thermal contact with the evaporator.

[0011] In other aspects, the heat transfer structure includes a first heat pipe assembly and a second heat pipe assembly, the third temperature equalizing plate is connected to the first temperature equalizing plate through the first heat pipe assembly, and the fourth temperature equalizing plate is connected to the second temperature equalizing plate through the second heat pipe assembly.

[0012] In other aspects, a side of the third temperature averaging plate body close to the generator, a side of the generator close to the third temperature averaging plate body, a side of the fourth temperature averaging plate body close to the evaporator, and a side of the evaporator close to the fourth temperature averaging plate body are all provided with a thermal pad;

[0013] A heat conducting layer is provided on one side of the first temperature averaging plate body close to the first heat generating component and on one side of the second temperature averaging plate body close to the second heat generating component.

[0014] In other aspects, the cooling system further includes a locking back plate, the locking back plate is used to be arranged on the back of a board for mounting the first heat generating type component and the second heat generating type component in the chassis, and the first temperature averaging plate body and the second temperature averaging plate body are both fixed to the locking back plate by fasteners;

[0015] The third temperature averaging plate body and the fourth temperature averaging plate body are both fixed to the inner surface of the chassis cover plate through a waterproof sealing connection component.

[0016] In other aspects, the first temperature averaging plate body and the second temperature averaging plate body are further provided with heating plates, and the power of the heating plates on the first temperature averaging plate body and the heating plates on the second temperature averaging plate body are different.

[0017] In other aspects, the relationship between the surface area of ​​the first temperature averaging plate and the power of the corresponding heating plate, and the relationship between the surface area of ​​the second temperature averaging plate and the power of the corresponding heating plate are:

[0018] ;

[0019] in, is the surface area of ​​the first temperature equalizing plate or the surface area of ​​the second temperature equalizing plate, is the power of the corresponding heating plate, is the power density of the corresponding heating plate, ranging from 25-35W / cm 2 , k is the scaling factor, and its value range is 2.3-3.

[0020] In other aspects, the refrigeration module also includes:

[0021] A condenser, used to cool the gaseous refrigerant flowing out of the generator and condense it into liquid refrigerant;

[0022] A separator, disposed between the condenser and the generator, for intercepting the absorbent mixed in the refrigerant and returning the absorbent to the generator;

[0023] The expansion valve is located between the condenser and the evaporator and is used to reduce the pressure and temperature of the liquid refrigerant flowing out of the condenser;

[0024] An absorber, connected to the evaporator, for reabsorbing the gaseous refrigerant formed after evaporation in the evaporator into the absorbent to form a mixed liquid having the absorbent and the refrigerant;

[0025] The circulation pump is arranged between the absorber and the generator, and is used for making the mixed liquid containing the absorbent and the refrigerant flow back to the generator.

[0026] In other aspects, the cooling system further includes a heat dissipation module, the heat dissipation module including:

[0027] A first heat dissipation module is used to be installed on the chassis, and an air outlet of the first heat dissipation module faces the condenser to cool the gaseous refrigerant entering the condenser;

[0028] A second heat dissipation module is used to be installed on the chassis, and an air outlet of the second heat dissipation module faces the absorber to cool the gaseous refrigerant entering the absorber;

[0029] The radiator is arranged on the absorber and is used for dissipating heat from the absorber.

[0030] In other aspects, the cooling system also includes a control module, which is communicatively connected to the heating plate, circulation pump and heat dissipation module, and the control module is used to control the opening and closing of the heating plate, circulation pump and heat dissipation module according to the working performance data of the chassis.

[0031] In other aspects, the cooling system also includes a data acquisition module, which is communicatively connected to the control module, and the data acquisition module is used to detect the working performance data of the chassis.

[0032] In other aspects, the control module is used to receive the operating performance data of the chassis collected by the data collection module, and is also used to determine whether the operating performance data of the chassis meets the first preset condition, and control the chassis to enter the first operating mode when the operating performance data of the chassis does not meet the first preset condition, and is also used to determine whether the operating performance data of the chassis meets the second preset condition after the operating performance data of the chassis meets the first preset condition, and control the chassis to enter the second operating mode when the operating performance data of the chassis does not meet the second preset condition, and control the chassis to enter the third operating mode when the operating performance data of the chassis meets the second preset condition;

[0033] Among them, in the first working mode, the heating plate starts heating, and the circulation pump and the heat dissipation module stop working. In the second working mode, the heating plate stops heating, the circulation pump starts working, and the heat dissipation module stops working. In the third working mode, both the circulation pump and the heat dissipation module start working.

[0034] In other aspects, the cooling system also includes a prompt module, which is communicatively connected to the control module and the data acquisition module, and the prompt module is used to issue an alarm when the working performance data of the chassis collected by the data acquisition module reaches an abnormal condition.

[0035] In other aspects, the cooling system also includes a data recording module, which is communicatively connected to the control module and the data acquisition module. The data recording module is used to record the operating performance data of the chassis when abnormal conditions are reached and transmit it to the control module.

[0036] In other aspects, the cooling system further includes a waterproof connector, which is used to be installed in the chassis, and the terminals of the first heat dissipation module and the terminals of the second heat dissipation module are both communicatively connected to the control module through the waterproof connector.

[0037] The present invention further provides a control method for a cooling system, which is applied to any of the above cooling systems, and the control method comprises:

[0038] Obtain chassis operating performance data;

[0039] Determining whether the work performance data meets the first preset condition;

[0040] If the working performance data does not reach the first preset condition, the heating plate is controlled to start heating, and the circulation pump and the heat dissipation module stop working;

[0041] If the work performance data meets the first preset condition, determining whether the work performance data meets the second preset condition;

[0042] If the working performance data does not reach the second preset condition, the heating plate is controlled to stop heating, the circulating pump is started to work, and the heat dissipation module stops working;

[0043] If the working performance data reaches the second preset condition, the circulation pump and the heat dissipation module are controlled to start working.

[0044] The present invention also provides an edge server, comprising any one of the above cooling systems.

[0045] In some aspects, the edge server further includes a chassis, the chassis includes a cover plate, a waterproof brim is provided on the cover plate, the waterproof brim is perpendicular to the cover plate, and a projection of the waterproof brim in a vertical direction covers a projection of the refrigeration module in a vertical direction;

[0046] A guide structure is provided at one end of the waterproof brim away from the cover plate. The guide structure is spaced apart from the refrigeration module. The guide structure is used to guide rainwater on the waterproof brim away from the cover plate.

[0047] Relative to the above background technology, the cooling system provided by the embodiment of the present invention includes a refrigeration module and a temperature averaging plate module. Among them, the refrigeration module is used to be arranged outside the chassis, and the refrigeration module includes a generator and an evaporator. The mixed liquid with absorbent and refrigerant is heated in the generator to evaporate refrigerant vapor, and the liquid refrigerant enters the evaporator and evaporates into steam, while absorbing a large amount of heat to complete the refrigeration process. The generator and the evaporator are respectively used to be arranged at the first heat-conducting contact position and the second heat-conducting contact position of the chassis; the temperature averaging plate module is used to be arranged inside the chassis, and the temperature averaging plate module includes a first temperature averaging plate group and a second temperature averaging plate group. The first temperature averaging plate group is used to be fixed on the heating component in the chassis, and the second temperature averaging plate group is connected to the first temperature averaging plate group, so that the heat generated by the heating component is transferred to the second temperature averaging plate group through the first temperature averaging plate group. The second temperature averaging plate group is constructed to be in thermal contact with the generator at the first thermal contact position so that the absorbent and refrigerant in the generator are separated by heat, and to be in thermal contact with the evaporator at the second thermal contact position so that the liquid refrigerant in the evaporator is heated and evaporated into gaseous refrigerant.

[0048] Specifically, the heat generating component in the chassis transfers the heat generated during operation to the second temperature averaging group through the first temperature averaging group installed thereon. Since the second temperature averaging group is constructed to be in thermal contact with the generator at a first thermal contact position and in thermal contact with the evaporator at a second thermal contact position, the second temperature averaging group further transfers the heat to the generator and the evaporator. After the generator absorbs the heat from the heat generating component in the chassis, the temperature in the cavity increases, causing the absorbent and the refrigerant in the cavity to be separated by heat. Moreover, after the evaporator absorbs the heat from the heat generating component in the chassis, the temperature in the cavity increases, causing the liquid refrigerant in the cavity to evaporate and absorb heat. The liquid refrigerant enters the evaporator and evaporates into steam, while absorbing a large amount of heat to complete the refrigeration process.

[0049] The above cycle process fully transfers the heat of the heat-generating components inside the chassis to the external environment through two heat absorption processes of the generator and the evaporator, achieving efficient cooling while meeting outdoor protection requirements.

[0050] The cooling system thus configured has the following beneficial effects: through the combined action of the temperature averaging module and the absorption refrigeration module, the heat inside the server chassis is efficiently dissipated, and the operating temperature of the heat generating components (including low-power heat generating devices and high-power heat generating devices) in the server chassis can be effectively controlled, thus avoiding the problem of local overheating or uneven temperature of the heat generating components, greatly improving the heat dissipation efficiency of the server chassis, and effectively reducing the performance degradation and aging of the heat generating components in the server chassis due to overheating, thereby extending the service life of the equipment. In addition, compared with traditional air cooling and liquid cooling systems, the cooling system that organically combines the temperature averaging module and the absorption refrigeration module has significant advantages in terms of heat dissipation efficiency, energy consumption, noise control and environmental adaptability, and is suitable for deployment in quiet places with high noise requirements, especially for complex outdoor environments such as edge computing, such as edge computing sites, remote monitoring sites, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0052] Figure 1 It is a front view of the overall structure of the cooling system in an embodiment of the present invention.

[0053] Figure 2 It is a side view of the overall structure of the cooling system in an embodiment of the present invention.

[0054] Figure 3 It is a schematic diagram of the assembly of a temperature homogenizing plate structure used for heat dissipation of a second type of heat generating component in a cooling system in an embodiment of the present invention.

[0055] Figure 4 Schematic diagram of a circulation loop of a cooling system in an embodiment of the present invention.

[0056] Figure 5 4 is a control block diagram of a cooling system in an embodiment of the present invention.

[0057] Figure 6 Schematic diagram of the control method of the cooling system in an embodiment of the present invention.

[0058] in:

[0059] 10-chassis, 11-first heat generating type component, 12-second heat generating type component, 13-cover plate, 131-waterproof brim, 1311-flow guiding structure, 14-board, 15-locking back plate;

[0060] 20-refrigeration module, 21-generator, 22-separator, 23-condenser, 24-expansion valve, 25-evaporator, 26-absorber, 27-circulation pump;

[0061] 30-average temperature plate module, 31-first average temperature plate body, 32-second average temperature plate body, 33-third average temperature plate body, 34-fourth average temperature plate body, 35-heat transfer structure, 351-first heat pipe assembly, 352-second heat pipe assembly, 36-thermal pad, 37-thermal conductive layer;

[0062] 40-heating plate;

[0063] 50-heat dissipation module, 51-first heat dissipation module, 52-second heat dissipation module, 53-radiator;

[0064] 60-Control module;

[0065] 70-Data acquisition module;

[0066] 80-prompt module, 81-data calculation unit, 82-voice broadcast unit;

[0067] 90-Data recording module. DETAILED DESCRIPTION

[0068] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0069] In order to enable those skilled in the art to better understand the scheme of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0070] See also Figure 1 and Figure 2 The cooling system provided in the embodiment of the present invention includes a refrigeration module 20 and a temperature homogenizing plate module 30 .

[0071] The refrigeration module 20 (also called the absorption refrigeration module 20) is used to be arranged outside the chassis 10, and is responsible for discharging the heat generated by the server from the chassis 10 by utilizing the heat absorption and evaporation cycle of the refrigerant. The refrigeration module 20 includes a generator 21 and an evaporator 25. The mixed liquid of the absorbent and the refrigerant is heated and evaporated into refrigerant vapor in the generator 21. The liquid refrigerant enters the evaporator 25 and evaporates into steam, while absorbing a large amount of heat to complete the refrigeration process. The generator 21 and the evaporator 25 are respectively used to be arranged at the first heat conduction contact position and the second heat conduction contact position of the chassis 10.

[0072] The temperature equalizing plate module 30 is used to be arranged inside the chassis 10. The temperature equalizing plate module 30 includes a first temperature equalizing plate group and a second temperature equalizing plate group. The first temperature equalizing plate group is used to be fixed on the heat-generating component in the chassis 10. The second temperature equalizing plate group is arranged on the inner surface of the cover plate 13 of the chassis 10. The second temperature equalizing plate group is connected to the first temperature equalizing plate group, so that the heat generated by the heat-generating component is transferred to the second temperature equalizing plate group through the first temperature equalizing plate group. The second temperature equalizing plate group is constructed to be in thermal contact with the generator 21 at a first thermal contact position so that the absorbent and refrigerant in the generator 21 are separated by heat, and to be in thermal contact with the evaporator 25 at a second thermal contact position so that the liquid refrigerant in the evaporator 25 is evaporated into a gaseous refrigerant by heat.

[0073] It can be seen that the temperature plate module 30 is mainly used to quickly diffuse the high heat generated by the internal heating components of the server, while maintaining the uniformity of the surface temperature of each heating component. It diffuses the heat generated at the heat source to the entire surface of the temperature plate through internal micro-steam circulation and phase change heat transfer, thereby avoiding the heat from being concentrated at a certain point. The refrigeration module 20 is responsible for using the heat absorption evaporation cycle of the refrigerant to discharge the heat generated by the internal heating components of the server to the outside of the chassis 10, and an absorption refrigeration cycle occurs in the absorption refrigeration module 20 outside the chassis 10 to maintain the temperature stability of the heating components in the server at all times.

[0074] Compared with traditional air cooling and liquid cooling solutions, the absorption refrigeration module 20 has lower energy consumption and lower maintenance costs, and meets the environmental protection requirements of green data centers and edge computing equipment.

[0075] In this way, the heat-generating component in the chassis 10 transfers the heat generated during operation to the second temperature equalizing plate group through the first temperature equalizing plate group installed thereon. Since the second temperature equalizing plate group is constructed to be in thermal contact with the generator 21 at the first thermal contact position and in thermal contact with the evaporator 25 at the second thermal contact position, the second temperature equalizing plate group further transfers the heat to the generator 21 and the evaporator 25. After the generator 21 absorbs the heat from the heat-generating component in the chassis 10, the temperature in the cavity increases, causing the absorbent and the refrigerant in the cavity to separate due to heat. Moreover, after the evaporator 25 absorbs the heat from the heat-generating component in the chassis 10, the temperature in the cavity increases, causing the liquid refrigerant in the cavity to evaporate and absorb heat. The liquid refrigerant enters the evaporator 25 and evaporates into steam, while absorbing a large amount of heat to complete the refrigeration process.

[0076] The above cycle process fully transfers the heat of the heating components inside the chassis 10 to the external environment through two heat absorption processes of the generator 21 and the evaporator 25, thereby achieving efficient cooling while meeting outdoor protection.

[0077] The cooling system thus configured has the following beneficial effects: through the combined action of the temperature equalizing plate module 30 and the absorption refrigeration module 20, efficient heat dissipation inside the server chassis 10 is achieved, and the operating temperature of the heating components (including low-power heating devices and high-power heating devices) in the server chassis 10 can be effectively controlled, thereby avoiding the problem of local overheating or uneven temperature of the heating components, greatly improving the heat dissipation efficiency of the server chassis 10, effectively reducing the performance degradation and aging of the heating components in the server chassis 10 due to overheating, and extending the service life of the equipment.

[0078] In addition, compared with traditional air cooling and liquid cooling systems, the cooling system that organically combines the temperature vapor chamber module 30 and the absorption refrigeration module 20 has significant advantages in heat dissipation efficiency, energy consumption, noise control and environmental adaptability. It is suitable for deployment in quiet places with high noise requirements, especially for complex outdoor environments such as edge computing, such as edge computing sites, remote monitoring sites, etc. These scenarios usually require equipment to have a high degree of protection and stability. The system can cope with these challenges well through its closed protection design and absorption refrigeration technology.

[0079] It should be noted that the above-mentioned chassis 10 is a closed chassis, which is mainly used to effectively isolate environmental factors such as dust, moisture, temperature changes, etc. to ensure that internal components (such as motherboard, hard disk, memory, etc.) are not affected by the environment. At the same time, the cover 13 of the chassis 10 can also serve as a support and fixing structure for the second temperature equalizing plate group of the above-mentioned refrigeration module 20 and the temperature equalizing plate module 30. The design of the entire chassis 10 can fully ensure the correct installation and compatibility of server components, and provide the necessary space for wiring and connecting other equipment.

[0080] Among them, the refrigeration module 20 is arranged on the outer surface of the cover plate 13 of the chassis 10, and the second temperature equalizing plate group of the temperature equalizing plate module 30 is arranged on the inner surface of the cover plate 13 of the chassis 10, wherein the first thermal conductive contact position and the second thermal conductive contact position are respectively arranged at two opposite corners of the cover plate 13 of the chassis 10.

[0081] The refrigeration module 20 is the core component of this system, which is responsible for discharging the heat generated by the server from the chassis 10 by utilizing the heat absorption and evaporation cycle of the refrigerant. Among them, the generator 21 is in thermal contact with the second temperature equalizing plate group to absorb heat from low-power devices such as management devices and switching devices, and promote the thermal separation of the absorbent and the refrigerant in the cavity; the evaporator 25 is in thermal contact with the second temperature equalizing plate group to absorb heat from high-power devices such as computing devices and processing devices, thereby reducing the temperature of the devices.

[0082] In addition to the generator 21 and the evaporator 25, the refrigeration module 20 also includes a condenser 23, a separator 22, an expansion valve 24, an absorber 26, a circulation pump 27, etc. Each component of the refrigeration module 20 is fixed to the outer surface of the cover plate 13 of the chassis 10 by a waterproof sealing bolt structure.

[0083] Please also read Figure 4 The condenser 23 is used to cool the high-temperature and high-pressure refrigerant vapor flowing out of the generator 21 through the condensing module and condense it into liquid refrigerant, so that it can easily enter the expansion valve 24. The expansion valve 24 is arranged between the condenser 23 and the evaporator 25. The function of the expansion valve 24 is to reduce the pressure and temperature of the high-pressure liquid refrigerant coming out of the condenser 23, so that it becomes a low-temperature and low-pressure liquid refrigerant and is suitable for evaporating and absorbing heat in the evaporator 25. The evaporator 25 is the actual refrigeration component in the absorption refrigeration module 20. In the evaporator 25, the low-temperature and low-pressure refrigerant liquid absorbs the heat in the second temperature equalizing plate group through the evaporation process and becomes a high-temperature and high-pressure gas. Thereby, cooling of the heat generating components in the chassis 10 is achieved. The absorber 26 is connected to the evaporator 25. The function of the absorber 26 is to reabsorb the refrigerant vapor evaporated in the evaporator 25 into the absorbent to form an absorbent-refrigerant mixed liquid, which is then transported to the generator 21 by the circulating pump 27 for the next cycle. The circulating pump 27 is arranged between the absorber 26 and the generator 21. The circulating pump 27 is used to make the mixed liquid with the absorbent and the refrigerant flow back to the generator 21. The separator 22 is arranged between the condenser 23 and the generator 21. The separator 22 is used to intercept the absorbent mixed in the refrigerant and make the absorbent flow back to the generator 21.

[0084] In addition, the refrigeration module 20 also includes supporting pipelines, the main function of the supporting pipelines is to connect the various components of the refrigeration module 20 so that the refrigerant and the absorbent circulate between the various components, while maintaining the airtightness of the system to prevent gas or liquid leakage.

[0085] When the refrigeration module 20 is running, the solution in the absorber 26 is driven by the circulating pump 27 to enter the generator 21, and is heated in the generator 21 to evaporate refrigerant vapor. The refrigerant vapor enters the condenser 23 and is condensed into liquid refrigerant. The liquid refrigerant enters the evaporator 25 and evaporates into vapor, while absorbing a large amount of heat, completing the refrigeration process. The refrigerant vapor enters the absorber 26 and is absorbed by the solution from the generator 21, completing the working cycle.

[0086] In particular, in order to prevent the refrigerant from carrying part of the absorbent into the condenser 23 when evaporating, a separator 22 is designed to be introduced between the generator 21 and the condenser 23 of the absorption refrigeration module 20. Its function is to intercept the absorbent mixed in the refrigerant and return it to the generator 21 through its internal multi-stage separation process, so as to prevent them from entering the condenser 23 together with the refrigerant.

[0087] Considering the types of heat generating components inside the chassis 10 , the heat generating components mainly include a first heat generating type component 11 and a second heat generating type component 12 , wherein the heat generated by the first heat generating type component 11 within a preset time is less than the heat generated by the second heat generating type component 12 within the preset time.

[0088] In some embodiments, the first heat-generating type component 11 may be a low-power heat-generating device, such as a management device or a switching device in a server, and the second heat-generating type component 12 may be a high-power heat-generating device, such as a computing device or a processing device in a server.

[0089] To this end, the first temperature equalizing plate group includes a first temperature equalizing plate body 31 and a second temperature equalizing plate body 32. The first temperature equalizing plate body 31 is used to be fixed on the first heat-generating type component 11 of the heat-generating component to diffuse the heat generated by the first heat-generating type component 11 and maintain the uniformity of the surface temperature of the first heat-generating type component 11. The second temperature equalizing plate body 32 is used to be fixed on the second heat-generating type component 12 of the heat-generating component to diffuse the heat generated by the second heat-generating type component 12 and maintain the uniformity of the surface temperature of the second heat-generating type component 12.

[0090] That is to say, the first temperature equalizing plate body 31 and the second temperature equalizing plate body 32 are respectively used to quickly diffuse the high heat generated by the first heat-generating type component 11 and the second heat-generating type component 12 of the internal heat-generating components of the server, while maintaining the uniformity of the surface temperature of each heat-generating type component. Through internal tiny steam circulation and phase change heat transfer, the heat generated at the heat source is diffused to the entire surface of the temperature equalizing plate, thereby avoiding the heat from being concentrated at a certain point.

[0091] It should be noted that the first temperature averaging plate 31 and the second temperature averaging plate 32 are both regular plate structures, and the volumes of the first temperature averaging plate 31 and the second temperature averaging plate 32 are specifically designed according to the power consumption or heat generation of the corresponding type of heat-generating devices. For example, for computing devices and processing devices that generate more heat per unit time, the volume of the second temperature averaging plate 32 is designed to be larger, and for management devices and switching devices that generate less heat per unit time, the volume of the first temperature averaging plate 31 is designed to be smaller.

[0092] More specifically, there is a strong correlation between the size of the temperature balancing plate and the power consumption of the corresponding device, and the temperature performance of the heat-generating device during operation is mainly determined by the heat dissipation efficiency. In this embodiment, the relationship between the surface area of ​​the temperature balancing plate and the power consumption of the corresponding device is a power function relationship. Considering that the design of the temperature balancing plate in actual engineering often adopts a nonlinear relationship, the following empirical formula can be used:

[0093]

[0094] in: is the surface area of ​​the temperature-equalizing plate (in m²), is the power consumption of the corresponding device (in W), K is an empirical constant, which usually needs to be determined through experiments or specific applications, and n is an empirical index, which is usually between 0.7 and 1.

[0095] To make the formula more concrete, the values ​​of K and n can be estimated based on empirical data from some common devices.

[0096] 1. For ordinary computing devices (power consumption is about 50W), it is assumed that the area of ​​the required temperature equalization board is about 0.05 m².

[0097] 2. For ordinary processing devices (power consumption is about 200W), it is assumed that the area of ​​the required temperature equalization plate is about 0.15m².

[0098] Based on these data, the values ​​of K and n can be estimated:

[0099] Examples of computing devices:

[0100] (1)

[0101] (2)

[0102] Substituting the data into the solution, we get:

[0103] (3)

[0104] Processing device examples:

[0105] (4)

[0106] (5)

[0107] Substituting the data into the solution, we get:

[0108] (6)

[0109] From the above equations (3) and (6), we can get:

[0110] (7)

[0111] (8)

[0112] Therefore, the empirical formula is:

[0113] (9)

[0114] According to the above empirical formula, the size parameters of the corresponding temperature equalization board can be designed according to the power consumption of different devices to meet the heat dissipation requirements.

[0115] Please also read Figure 3 In order to facilitate the fixing of the first temperature averaging plate 31 and the second temperature averaging plate 32, the cooling system further includes a locking back plate 15. Specifically, a board 14 for mounting the first heat-generating type component 11 and the second heat-generating type component 12 is provided in the chassis 10, and the locking back plate 15 is used to be arranged on the back of the board 14, and the first temperature averaging plate 31 and the second temperature averaging plate 32 are both fixed to the locking back plate 15 by fasteners.

[0116] Of course, according to actual needs, the fastener can be a spring screw, and the first temperature equalizing plate 31 and the second temperature equalizing plate 32 can be collectively referred to as a primary-side temperature equalizing plate. The primary-side temperature equalizing plate is locked to the locking backplane 15 by spring screws, so that the first temperature equalizing plate 31 is attached to the management device or switching device of the server board 14, and the second temperature equalizing plate 32 is attached to the computing device or processing device of the server board 14.

[0117] In addition, the temperature equalizing plate and the heat generating device of the server board 14 have a one-to-one correspondence. That is, the number of management devices and switching devices in the server determines the number of first temperature equalizing plates 31, and the number of computing devices and processing devices in the server determines the number of second temperature equalizing plates 32.

[0118] In addition, a heat conducting layer 37 is disposed on a side of the first temperature equalizing plate 31 close to the first heat generating type component 11 , and a side of the second temperature equalizing plate 32 close to the second heat generating type component 12 .

[0119] In some embodiments, silicone grease with a high thermal conductivity can be coated on the packaging surface of the first heat-generating type component 11 to form a thermal conductive layer 37 to reduce the heat transfer resistance from the first heat-generating type component 11 to the first temperature-averaging plate 31. Similarly, thermal conductive silicone grease with a high thermal conductivity can be coated on the packaging surface of the second heat-generating type component 12 to form a thermal conductive layer 37 to reduce the heat transfer resistance from the second heat-generating type component 12 to the second temperature-averaging plate 32.

[0120] In order to facilitate the heat transfer of the first and second temperature averaging plates 31 and 32 to the generator 21 and the evaporator 25, respectively, the second temperature averaging plate group includes a third temperature averaging plate 33 and a fourth temperature averaging plate 34, which can be collectively referred to as secondary side temperature averaging plates. The third temperature averaging plate 33 is used to be fixed on the inner surface of the cover plate 13 of the chassis 10 corresponding to the first heat conduction contact position, so that the third temperature averaging plate 33 is in heat conduction contact with the generator 21, and the fourth temperature averaging plate 34 is used to be fixed on the inner surface of the cover plate 13 of the chassis 10 corresponding to the second heat conduction contact position, so that the fourth temperature averaging plate 34 is in heat conduction contact with the evaporator 25.

[0121] The third temperature averaging plate 33 and the fourth temperature averaging plate 34 are both fixed to the inner surface of the cover plate 13 of the chassis 10 through a waterproof sealing connection assembly. The waterproof sealing connection assembly can be a waterproof sealing bolt assembly.

[0122] Furthermore, to facilitate heat conduction between the third temperature equalizing plate 33 and the generator 21, and between the fourth temperature equalizing plate 34 and the evaporator 25, a thermal pad 36 is provided on one side of the third temperature equalizing plate 33 close to the cover 13 of the chassis 10 or the generator 21, one side of the generator 21 close to the cover 13 of the chassis 10 or the third temperature equalizing plate 33, one side of the fourth temperature equalizing plate 34 close to the cover 13 of the chassis 10 or the evaporator 25, and one side of the evaporator 25 close to the cover 13 of the chassis 10 or the fourth temperature equalizing plate 34.

[0123] Of course, the thermal pad 36 can also be made of thermally conductive silicone grease with high thermal conductivity.

[0124] For example, a thermally conductive adhesive pad with a certain thermal conductivity is pasted between the third temperature averaging plate 33 and the inner surface of the cover 13 of the chassis 10, and between the fourth temperature averaging plate 34 and the inner surface of the cover 13 of the chassis 10. In this way, the third temperature averaging plate 33 and the third temperature averaging plate 33 can transfer part of the heat to the cover 13 of the chassis 10 to exchange heat with the outside world. At the same time, the thermally conductive adhesive pad can also play a role of waterproof sealing after being tightened by the waterproof sealing bolt assembly to ensure that the interior of the chassis 10 is isolated from the external environment.

[0125] In some embodiments, the temperature evaporating plate module 30 further includes a heat transfer structure 35 , and the second temperature evaporating plate group is connected to the first temperature evaporating plate group via the heat transfer structure 35 , so that the heat in the first temperature evaporating plate group is transferred to the second temperature evaporating plate group via the heat transfer structure 35 .

[0126] In this embodiment, the heat transfer structure 35 includes a first heat pipe assembly 351 and a second heat pipe assembly 352. The third temperature equalizing plate 33 is connected to the first temperature equalizing plate 31 through the first heat pipe assembly 351. The fourth temperature equalizing plate 34 is connected to the second temperature equalizing plate 32 through the second heat pipe assembly 352.

[0127] In this way, the heat generated by the first heat-generating type component 11 when it is working can be conducted to the third temperature-averaging plate 33 via the first temperature-averaging plate 31 and the first heat pipe assembly 351. The heat generated by the second heat-generating type component 12 when it is working can be conducted to the fourth temperature-averaging plate 34 via the second temperature-averaging plate 32 and the second heat pipe assembly 352. The third temperature-averaging plate 33 and the fourth temperature-averaging plate 34 transfer the heat to the generator 21 and the evaporator 25 respectively, so that the absorbent and the refrigerant in the generator 21 are separated by heat, and the liquid refrigerant in the evaporator 25 is evaporated into a gaseous refrigerant by heat.

[0128] It can be understood that the first heat pipe assembly 351 and the second heat pipe assembly 352 mainly transfer the heat of the primary-side temperature equalizing plate to the secondary-side temperature equalizing plate by liquid phase change (evaporation and condensation). In the present invention, the heat pipe assembly is fixed to the primary-side temperature equalizing plate and the secondary-side temperature equalizing plate by welding, and is flattened and bent. Specifically, low-power devices such as management devices and exchange devices transfer heat to the first temperature equalizing plate body 31 thereon, and the first temperature equalizing plate body 31 further transfers heat to the third temperature equalizing plate body 33 by surface welding of the first heat pipe assembly 351, and high-power devices such as management devices and exchange devices transfer heat to the second temperature equalizing plate body 32 thereon, and the second temperature equalizing plate body 32 further transfers heat to the fourth temperature equalizing plate body 34 by surface welding of the second heat pipe assembly 352.

[0129] In some embodiments, a heating plate 40 of varying power is designed and pasted above each primary-side temperature equalizing plate. This design is mainly used to protect the normal startup of management devices, switching devices, computing devices, and processing devices inside the chassis 10 in an outdoor low-temperature environment. Its operation is controlled by a control module 60 inside the chassis 10. When the temperature sensor on the internal board 14 of the server continuously obtains a low-temperature signal, the control module 60 will control the heating plate 40 to start heating.

[0130] In this embodiment, a heating plate 40 is further disposed on the first temperature averaging plate 31 and the second temperature averaging plate 32 , and the power of the heating plate 40 on the first temperature averaging plate 31 and the power of the heating plate 40 on the second temperature averaging plate 32 are different.

[0131] Specifically, the relationship between the surface area of ​​the first temperature averaging plate 31 and the power of the corresponding heating plate 40, and the relationship between the surface area of ​​the second temperature averaging plate 32 and the power of the corresponding heating plate 40 are both:

[0132] ;

[0133] in, is the surface area of ​​the first temperature averaging plate 31 or the surface area of ​​the second temperature averaging plate 32, is the power of the corresponding heating plate 40, is the power density of the corresponding heating plate 40, and the value range is 25-35W / cm 2 , k is the scaling factor, and its value range is 2.3-3.

[0134] It should be noted that since the heating sheet 40 is evenly pasted on the corresponding temperature equalizing plate, the length and width of the heating sheet 40 are consistent with the length and width of the temperature equalizing plate. Preferably, the heating sheet 40 selected in the present invention is a PI film heating sheet with adhesive on one side. The power of the heating sheet 40 selected for different temperature equalizing plate sizes is selected and designed according to the following formula:

[0135] (10)

[0136] (11)

[0137] in, is the surface area of ​​the first temperature equalizing plate 31 or the surface area of ​​the second temperature equalizing plate 32 (in m²), is the power of the corresponding heating plate 40 (in W), is the power density of the corresponding heating plate 40. The value range of the commonly used PI film heating plate 40 is 25-35W / cm 2 The power density of the heating plate 40 selected in the present invention is 30W / cm 2 , is the area of ​​the corresponding heating plate 40 (in cm 2 ), k is a proportional factor, and its value range is 2.3-3. The present invention takes the proportional factor as 2.5 for calculation.

[0138] From the above, according to equations (10) and (11), we can get:

[0139] (12)

[0140] In some embodiments, the cooling system further includes a heat dissipation module 50 , and the heat dissipation module 50 includes a first heat dissipation module 51 , a second heat dissipation module 52 and a radiator 53 .

[0141] Among them, the first heat dissipation module 51 is used to be installed on the chassis 10, and the air outlet of the first heat dissipation module 51 is toward the condenser 23, so as to cool the gaseous refrigerant entering the condenser 23; the second heat dissipation module 52 is used to be installed on the chassis 10, and the air outlet of the second heat dissipation module 52 is toward the absorber 26, so as to cool the gaseous refrigerant entering the absorber 26; the radiator 53 is arranged on the absorber 26, and the radiator 53 is used to dissipate heat from the absorber 26.

[0142] Of course, according to actual needs, the first heat dissipation module 51 and the second heat dissipation module 52 are both fan modules.

[0143] The first heat dissipation module 51 and the second heat dissipation module 52 are used to cool the high-temperature refrigerant vapor entering the condenser 23 and the absorber 26 respectively. The first heat dissipation module 51 and the second heat dissipation module 52 are both installed on the outer surface of the cover plate 13 of the chassis 10 through a waterproof sealing bolt assembly, and the air outlet positions are respectively opposite to the heat exchange devices of the condenser 23 and the absorber 26.

[0144] In this way, high-temperature refrigerant vapor enters the absorber 26 under the action of the pressure difference, and is absorbed by the cooled absorbent liquid in the absorber 26 to form an absorbent-refrigerant mixed liquid. At the same time, the absorber 26 is cooled by the external radiator 53 and the fan module to improve the absorption capacity of its internal absorbent for refrigerant vapor.

[0145] In order to realize intelligent control of the fan module, the cooling system also includes a waterproof connector, which is used to be installed in the chassis 10. The terminals of the first heat dissipation module 51 and the terminals of the second heat dissipation module 52 are both communicated with the control module 60 inside the chassis 10 through the waterproof connector to realize real-time regulation.

[0146] Please also read Figure 5 The cooling system also includes a control module 60, which is communicatively connected to the heating plate 40, the circulation pump 27 and the heat dissipation module 50. The control module 60 is used to control the opening and closing of the heating plate 40, the circulation pump 27 and the heat dissipation module 50 according to the working performance data of the chassis 10.

[0147] In this embodiment, the control module 60 is used to monitor the temperature of the internal environment of the chassis 10 in real time, and automatically adjust the working conditions of the heating plate 40, the circulation pump 27 and the heat dissipation module 50 through data analysis and intelligent decision-making to ensure the stable operation of the server under various loads and environmental conditions, and when an abnormal working condition is detected, an alarm is triggered and a log is recorded to ensure equipment safety.

[0148] In some embodiments, the cooling system also includes a data acquisition module 70, which is communicatively connected to the control module 60. The data acquisition module 70 is used to detect the working performance data of the chassis 10. Of course, the working performance data is mainly the ambient temperature data inside the chassis 10.

[0149] In some embodiments, the control module 60 is used to receive the working performance data of the chassis 10 collected by the data collection module 70, and is also used to determine whether the working performance data of the chassis 10 meets the first preset condition, and control the chassis 10 to enter the first working mode when the working performance data of the chassis 10 does not meet the first preset condition, and is also used to determine whether the working performance data of the chassis 10 meets the second preset condition after the working performance data of the chassis 10 meets the first preset condition, and control the chassis 10 to enter the second working mode when the working performance data of the chassis 10 does not meet the second preset condition, and control the chassis 10 to enter the third working mode when the working performance data of the chassis 10 meets the second preset condition;

[0150] Among them, in the first working mode, the heating plate 40 starts heating, the circulation pump 27 and the heat dissipation module 50 stop working; in the second working mode, the heating plate 40 stops heating, the circulation pump 27 starts working, and the heat dissipation module 50 stops working; in the third working mode, the circulation pump 27 and the heat dissipation module 50 are both started working.

[0151] In some embodiments, the cooling system also includes a prompt module 80, which is communicatively connected to the control module 60 and the data acquisition module 70. The prompt module 80 is used to issue an alarm when the working performance data of the chassis 10 collected by the data acquisition module 70 reaches an abnormal condition.

[0152] Of course, the so-called working performance data of the chassis 10 reaching an abnormal condition means that the working performance data of the chassis 10 is within a preset abnormal data range.

[0153] Furthermore, the prompt module 80 includes a data calculation unit 81, which is used to calculate the working time of the circulation pump 27 and the heat dissipation module 50 according to the difference between the current working performance data of the chassis 10 and the lower limit value of the preset abnormal data range.

[0154] It should be noted that the working performance data of the chassis 10 is mainly the ambient temperature data inside the chassis 10. Therefore, the ambient temperature data inside the chassis 10 needs to be collected by the control module 60 first. For example, multiple temperature detection devices can be set. The multiple temperature detection devices are used to monitor the temperature of the heating device in the chassis 10 in real time and transmit the signal to the control module 60. After receiving the temperature signal, the control module 60 performs logical judgment and transmits data to the data calculation unit 81 of the prompt module 80. After receiving the ambient temperature data inside the chassis 10 transmitted by the control module 60, the data calculation unit 81 compares the current working performance data with the lower limit value of the preset abnormal data range according to the pre-stored preset abnormal data range, and calculates the difference. This difference will be directly related to the calculation of the working time of the circulation pump 27 and the heat dissipation module 50. Among them, the lower limit value of the preset abnormal data range is the key to judging whether the working performance data is abnormal. This range can be set according to historical data and experience, or it can be determined by statistical methods. Afterwards, the working time of the circulation pump 27 and the heat dissipation module 50 is calculated according to the difference between the working performance data of the current chassis 10 and the lower limit of the preset abnormal data range. The relationship between the difference between the working performance data of the current chassis 10 and the lower limit of the preset abnormal data range and the working time of the circulation pump 27 and the heat dissipation module 50 can be determined by using a time recursive optimization guidance model, which can predict the most reasonable working time of the circulation pump 27 and the heat dissipation module 50 for making the current working performance data lower than the lower limit of the preset abnormal data range on the current day based on the data of the previous day.

[0155] Of course, according to actual needs, the data calculation unit 81 can dynamically adjust the preset abnormal data range according to real-time data to adapt to factors such as environmental changes and equipment aging.

[0156] In addition to abnormality detection, the data calculation unit 81 can also be used for prediction and optimization. For example, by analyzing historical data, future working performance can be predicted, thereby optimizing the operation strategy of the circulation pump 27 and the heat dissipation module 50 in combination with the control module 60.

[0157] The use of the above-mentioned data calculation unit 81 can not only improve the accuracy of detecting abnormal temperature of the internal environment of the chassis 10, but also optimize equipment operation, reduce maintenance costs, and improve the reliability and efficiency of server system operation.

[0158] In addition, the prompt module 80 also includes a voice broadcast unit 82 , which is communicatively connected to the data calculation unit 81 , and is used to broadcast the working time of the circulation pump 27 and the heat dissipation module 50 .

[0159] In some embodiments, the cooling system also includes a data recording module 90, which is communicatively connected to the control module 60 and the data acquisition module 70. The data recording module 90 is used to record the working performance data of the chassis 10 when it is in a preset abnormal data range and transmit it to the control module 60.

[0160] In this embodiment, the data acquisition module 70 includes a plurality of temperature sensors arranged inside the chassis 10, wherein the temperature sensors are mainly used to monitor the temperature of the heating components in the chassis 10 in real time and transmit the signals to the control module 60. After receiving the temperature signals, the control module 60 performs logical judgment and sends adjustment instructions to the internal heating plate 40, the external heat dissipation module 50 and the circulation pump 27, thereby realizing intelligent control of the entire cooling system.

[0161] In this embodiment, the control module 60 can be set on the board 14 of the server, and the temperature sensors are distributed in various key positions of the heating device, the board 14 and the chassis 10. Through the coordinated work of the control module 60, the cooling module 20, the temperature plate module 30, the heating plate 40, the heat dissipation module 50 and the temperature sensor, an efficient cooling effect is provided for the outdoor edge server, thereby ensuring the stable and efficient operation of the edge server while meeting the IP65 protection level requirements.

[0162] The working process of the above refrigeration system is described in detail below:

[0163] Specifically, after the server is powered on, the control module 60 starts working first. At this time, the server is not turned on. The control module 60 obtains the internal ambient temperature of the chassis 10 for judgment. If the internal ambient temperature of the chassis 10 is lower than the first temperature value (preferably -5°C), the control module 60 will control the heating plate 40 attached to each primary side temperature equalizing plate to start heating, and control the expansion valve 24 and the circulation pump 27 in the pipeline to close. At the same time, the ambient temperature in the chassis 10 is judged at all times. If it is monitored that the ambient temperature in the chassis 10 is continuously higher than the first temperature value for 2 minutes or the heating time is greater than 20 minutes, the heating plate 40 stops working and judges whether the ambient temperature in the chassis 10 is higher than the second temperature value (preferably 30°C). If it is monitored that the ambient temperature in the chassis 10 is lower than the second temperature value At this time, the control module 60 will trigger the server to start up and enter the operating system (only triggered once), and obtain the temperature parameters of all temperature sensors, and perform PWM regulation on the circulation pump 27 in real time according to the temperature parameters. Since the ambient temperature in the chassis 10 is low at this time, the control module 60 will control the fan module to stop to achieve the purpose of energy saving. The cooling of the condenser 23 and the absorber 26 depends entirely on natural convection; if the ambient temperature in the chassis 10 is monitored to be higher than the second temperature value, it means that the external ambient temperature is high. At this time, the control module 60 will trigger the server to start up and enter the operating system (only triggered once), and control the circulation pump 27 and the fan module to start working at the same time, obtain the temperature parameters of all temperature sensors, and perform PWM regulation on the circulation pump 27 and the fan module in real time according to the temperature parameters.

[0164] At the same time, after the server is turned on and enters the operating system, an absorption refrigeration cycle occurs in the absorption refrigeration module 20 outside the chassis 10 to maintain the temperature of the internal heating components of the server stable at all times. Specifically, low-power devices such as management devices and exchange devices transfer heat to the third temperature averaging plate 33 through the first temperature averaging plate 31 and the first heat pipe assembly 351 installed thereon, and the third temperature averaging plate 33 further transfers heat to the generator 21 through the thermal pad 36. After absorbing the heat from the low-power devices, the temperature in the cavity of the generator 21 increases, causing the absorbent and the refrigerant in the cavity to be separated by heat; the high-temperature refrigerant vapor escapes from the generator 21 and enters the separator 22, and the separator 22 cools and separates a small amount of absorbent mixed in the refrigerant vapor and refluxes into the generator 21; the pure refrigerant vapor enters the condenser 23 for cooling driven by the pressure difference, and the high-temperature and high-pressure refrigerant vapor is converted into a low-temperature and high-pressure liquid refrigerant in the condenser 23. The high-pressure liquid refrigerant enters the expansion valve 24 driven by the pressure difference to reduce pressure and expand into a low-temperature and low-pressure liquid refrigerant, and then enters the evaporator 25 for evaporation and heat absorption. In addition, high-power consumption devices such as computing devices and processing devices transfer heat to the fourth temperature averaging plate 34 through the second temperature averaging plate 32 and the second heat pipe assembly 352 installed thereon. The fourth temperature averaging plate 34 further transfers heat to the evaporator 25 through the thermal pad 36. After absorbing the heat from the high-power consumption devices, the temperature in the cavity of the evaporator 25 increases, causing the low-temperature and low-pressure refrigerant liquid in the cavity to evaporate into high-temperature and low-pressure refrigerant vapor. The high-temperature refrigerant vapor enters the absorber 26 under the action of the pressure difference, and is absorbed by the cooled absorbent liquid in the absorber 26 to form an absorbent-refrigerant mixed liquid. At the same time, the absorber 26 is cooled by the radiator 53 and the fan module outside the cavity to improve the absorption capacity of the internal absorbent for the refrigerant vapor. Then, the absorbent-refrigerant mixed liquid returns to the generator 21 under the action of the circulating pump 27 for the next evaporative cooling cycle.

[0165] The above cycle process fully transfers the heat of the internal heating components of the server to the external environment through two heat absorption processes of the generator 21 and the evaporator 25, thereby achieving efficient cooling while meeting outdoor protection.

[0166] In addition, in order to prevent the internal ambient temperature fluctuation of the chassis 10 from causing the reciprocating switching between the three working modes, the control module 60 also sets the following judgment logic:

[0167] After the system is powered on, if the system enters the second working mode after triggering the heating plate 40 to work, no matter how the temperature in the chassis 10 changes, the heating plate 40 will not be triggered to work again; if the system is already in the second working mode, it is necessary to monitor the external ambient temperature to be higher than the second temperature value and the time is continuous for 2 minutes before switching to the third working mode; if the system is already in the third working mode, it is necessary to monitor the external ambient temperature to be lower than the second temperature value and the time is continuous for 5 minutes before switching to the second working mode.

[0168] Please also read Figure 6 A control method for a cooling system provided by the present invention is applied to the cooling system described in the above specific embodiment, and the control method includes:

[0169] S1: Obtaining the working performance data of the chassis 10;

[0170] S2: Determine whether the work performance data meets the first preset condition;

[0171] S3: If the working performance data does not reach the first preset condition, the heating plate 40 is controlled to start heating, and the circulation pump 27 and the heat dissipation module 50 stop working;

[0172] S4: If the work performance data meets the first preset condition, determine whether the work performance data meets the second preset condition;

[0173] S5: If the working performance data does not reach the second preset condition, the heating plate 40 is controlled to stop heating, the circulating pump 27 is started to work, and the heat dissipation module 50 stops working;

[0174] S6: If the working performance data reaches the second preset condition, the circulation pump 27 and the heat dissipation module 50 are controlled to start working.

[0175] In S1 , the so-called working performance data of the chassis 10 mainly refers to the ambient temperature inside the chassis 10 .

[0176] In S2, whether the working performance data meets the first preset condition refers to whether the internal ambient temperature value of the chassis 10 is greater than or equal to a first temperature value (preferably -5°C).

[0177] In S3, if the internal ambient temperature of the chassis 10 is lower than the first temperature value, the control module 60 will control the heating plate 40 attached to each primary side temperature equalizing plate to start heating, and control the expansion valve 24 and the circulation pump 27 in the pipeline to close.

[0178] In S4, whether the working performance data meets the second preset condition refers to whether the ambient temperature in the chassis 10 is equal to or greater than a second temperature value (preferably 30° C.).

[0179] In S5, if it is monitored that the ambient temperature inside the chassis 10 is lower than the second temperature value, the control module 60 will control the heating plate 40 to stop heating and trigger the server to start up and enter the operating system, and obtain the temperature parameters of all temperature sensors, and perform PWM regulation on the circulation pump 27 in real time according to the temperature parameters. Since the ambient temperature inside the chassis 10 is relatively low at this time, the control module 60 will control the fan module to stop rotating to achieve the purpose of energy saving, and the cooling of the condenser 23 and the absorber 26 relies entirely on natural convection.

[0180] In S6, if the ambient temperature inside the chassis 10 is monitored to be higher than the second temperature value, it means that the external ambient temperature is too high. At this time, the control module 60 will trigger the server to start up and enter the operating system, and control the circulation pump 27 and the fan module to start working at the same time, obtain the temperature parameters of all temperature sensors, and perform PWM control on the circulation pump 27 and the fan module in real time according to the temperature parameters.

[0181] An edge server provided by the present invention includes the cooling system described in the above specific embodiment.

[0182] In some embodiments, the edge server further includes a chassis 10, which is a sealed chassis. The chassis 10 is mainly used to effectively isolate environmental factors such as dust, moisture, temperature changes, etc. to ensure that the internal components of the chassis 10 are not affected by the environment. The chassis 10 includes a cover plate 13, and a waterproof brim 131 is provided on the top of the cover plate 13. The waterproof brim 131 is perpendicular to the cover plate 13, and the projection of the waterproof brim 131 in the vertical direction covers the projection of the refrigeration module 20 in the vertical direction.

[0183] In this way, the waterproof brim 131 on the top of the cover plate 13 can play a waterproof role, especially play a role in keeping out rain. Considering that the application environment of the edge server is mostly outdoors, the waterproof brim 131 is used to keep rainwater away from the surface of the cover plate 13, thereby providing good protection for the refrigeration module 20 arranged on the surface of the cover plate 13.

[0184] Moreover, in order to further enhance the protective effect, a guide structure 1311 is provided at one end of the waterproof brim 131 away from the cover plate 13. The guide structure 1311 may be a guide slope provided at the bottom of one end of the waterproof brim 131 away from the cover plate 13. The guide structure 1311 is used to guide rainwater on the waterproof brim 131 away from the cover plate 13. At the same time, the guide structure 1311 is spaced apart from the refrigeration module 20 in the horizontal direction, so as to ensure that the guided rainwater will not drip onto the cover plate 13, thereby not affecting the operation of the cooling system.

[0185] In summary, the beneficial effects brought about by adopting the above cooling system and the edge server having the cooling system mainly include:

[0186] Efficient heat dissipation in a fully enclosed environment: Due to the harsh conditions of the outdoor environment, the protection level requirements are high and fans cannot be used for heat dissipation. The present invention uses an absorption refrigeration module 20 to ensure efficient heat dissipation in a fully enclosed server chassis 10, avoiding the influence of external factors such as dust and water vapor on the inside of the server.

[0187] The operating temperature of the components inside the chassis 10 is stable: through the combined action of the temperature averaging plate, the heat pipe and the absorption cooling module 20, the operating temperature of the low-power heating components and the high-power heating components in the server can be effectively controlled, avoiding the problem of local overheating or uneven temperature.

[0188] Low energy consumption and environmentally friendly design: Compared with traditional air cooling and liquid cooling solutions, the absorption cooling module 20 has lower energy consumption and low maintenance costs, which meets the environmental protection requirements of green data centers and edge computing equipment. In addition, the system produces very little noise during use, which is suitable for deployment in quiet places with high noise requirements.

[0189] High reliability and extended service life: The system greatly improves the heat dissipation efficiency of the server by optimizing heat conduction and absorption refrigeration technology, effectively reduces the performance degradation and aging of the heating components inside the chassis 10 caused by overheating, and extends the service life of the equipment.

[0190] Applicable to a variety of complex environments: This technical solution is particularly suitable for use in complex outdoor environments, such as edge computing sites, remote monitoring sites, etc. These scenarios usually require equipment to have a high degree of protection and stability, and this system can cope with these challenges well through closed protection design and absorption refrigeration technology.

[0191] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0192] The cooling system, the control method of the cooling system and the edge server provided by the present invention are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the scheme of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A cooling system, characterized in that: include: A refrigeration module, which is used to be arranged outside the chassis, and the refrigeration module includes a generator and an evaporator, and the generator and the evaporator are respectively used to be arranged at a first heat-conducting contact position and a second heat-conducting contact position of the chassis; A temperature equalizing plate module is used to be arranged inside a chassis, and the temperature equalizing plate module includes a first temperature equalizing plate group and a second temperature equalizing plate group. The first temperature equalizing plate group is used to be fixed on a heat-generating component in the chassis, and the second temperature equalizing plate group is connected to the first temperature equalizing plate group, so that the heat generated by the heat-generating component is transferred to the second temperature equalizing plate group via the first temperature equalizing plate group. The second temperature equalizing plate group is constructed to be in thermal contact with the generator at a first thermal contact position so that the absorbent and refrigerant in the generator are separated by heat, and to be in thermal contact with the evaporator at the second thermal contact position so that the liquid refrigerant in the evaporator is evaporated into a gaseous refrigerant by heat.

2. The cooling system according to claim 1, characterized in that The temperature averaging plate module further includes a heat transfer structure, and the second temperature averaging plate group is connected to the first temperature averaging plate group via the heat transfer structure, so that the heat in the first temperature averaging plate group is transferred to the second temperature averaging plate group via the heat transfer structure.

3. The cooling system according to claim 2, characterized in that The first temperature equalizing plate group includes a first temperature equalizing plate body and a second temperature equalizing plate body, the first temperature equalizing plate body is used to be fixed on the first heat-generating type component of the heat-generating component to diffuse the heat generated by the first heat-generating type component and maintain the uniformity of the surface temperature of the first heat-generating type component, the second temperature equalizing plate body is used to be fixed on the second heat-generating type component of the heat-generating component to diffuse the heat generated by the second heat-generating type component and maintain the uniformity of the surface temperature of the second heat-generating type component, wherein the heat generated by the first heat-generating type component within a preset time is less than the heat generated by the second heat-generating type component within the preset time.

4. The cooling system according to claim 3, characterized in that The second temperature averaging plate group includes a third temperature averaging plate body and a fourth temperature averaging plate body. The third temperature averaging plate body is used to be fixed on the inner surface of the chassis cover corresponding to the first thermal contact position, so that the third temperature averaging plate body is in thermal contact with the generator, and the fourth temperature averaging plate body is used to be fixed on the inner surface of the chassis cover corresponding to the second thermal contact position, so that the fourth temperature averaging plate body is in thermal contact with the evaporator.

5. The cooling system according to claim 4, characterized in that The heat transfer structure includes a first heat pipe assembly and a second heat pipe assembly. The third temperature averaging plate is connected to the first temperature averaging plate through the first heat pipe assembly. The fourth temperature averaging plate is connected to the second temperature averaging plate through the second heat pipe assembly.

6. The cooling system according to claim 4, characterized in that A side of the third temperature averaging plate body close to the generator, a side of the generator close to the third temperature averaging plate body, a side of the fourth temperature averaging plate body close to the evaporator, and a side of the evaporator close to the fourth temperature averaging plate body are all provided with a thermal pad; A side of the first temperature equalizing plate body close to the first heat-generating type component and a side of the second temperature equalizing plate body close to the second heat-generating type component are both provided with a heat-conducting layer.

7. The cooling system according to claim 4, characterized in that The cooling system further comprises a locking back plate, which is used to be arranged on the back of a board in the chassis for mounting the first heat generating type component and the second heat generating type component, and the first temperature averaging plate body and the second temperature averaging plate body are both fixed to the locking back plate by fasteners; The third temperature averaging plate body and the fourth temperature averaging plate body are both fixed to the inner surface of the chassis cover plate through a waterproof sealing connection component.

8. The cooling system according to claim 3, characterized in that The first temperature averaging plate and the second temperature averaging plate are further provided with heating plates, and the heating plates on the first temperature averaging plate and the heating plates on the second temperature averaging plate have different powers.

9. The cooling system according to claim 8, characterized in that The relationship between the surface area of ​​the first temperature averaging plate and the corresponding power of the heating plate, and the relationship between the surface area of ​​the second temperature averaging plate and the corresponding power of the heating plate are both: ； in, is the surface area of ​​the first temperature equalizing plate or the surface area of ​​the second temperature equalizing plate, is the power of the corresponding heating plate, is the power density of the corresponding heating plate, ranging from 25-35 W / cm 2 , k is the scaling factor, and its value range is 2.3-3.

10. The cooling system according to claim 8, characterized in that The refrigeration module also includes: A condenser, used to cool the gaseous refrigerant flowing out of the generator and condense it into liquid refrigerant; a separator, disposed between the condenser and the generator, for intercepting the absorbent mixed in the refrigerant and allowing the absorbent to flow back to the generator; An expansion valve is provided between the condenser and the evaporator, and is used to reduce the pressure and temperature of the liquid refrigerant flowing out of the condenser; an absorber connected to the evaporator and used to reabsorb the gaseous refrigerant formed after evaporation in the evaporator into the absorbent to form a mixed liquid having the absorbent and the refrigerant; A circulation pump is arranged between the absorber and the generator, and is used to make the mixed liquid containing the absorbent and the refrigerant flow back to the generator.

11. The cooling system according to claim 10, characterized in that The cooling system further comprises a heat dissipation module, wherein the heat dissipation module comprises: A first heat dissipation module, which is used to be installed on the chassis, wherein an air outlet of the first heat dissipation module faces the condenser to cool down the gaseous refrigerant entering the condenser; A second heat dissipation module is used to be installed on the chassis, and an air outlet of the second heat dissipation module faces the absorber to cool the gaseous refrigerant entering the absorber; The radiator is arranged on the absorber and is used for dissipating heat from the absorber.

12. The cooling system according to claim 11, characterized in that The cooling system also includes a control module, which is communicatively connected with the heating plate, the circulation pump and the heat dissipation module, and is used to control the opening and closing of the heating plate, the circulation pump and the heat dissipation module according to the working performance data of the chassis.

13. The cooling system according to claim 12, characterized in that The cooling system also includes a data acquisition module, which is communicatively connected to the control module and is used to detect working performance data of the chassis.

14. The cooling system according to claim 13, characterized in that The control module is used to receive the operating performance data of the chassis collected by the data collection module, and is also used to determine whether the operating performance data of the chassis meets a first preset condition, and control the chassis to enter a first operating mode when the operating performance data of the chassis does not meet the first preset condition, and is also used to determine whether the operating performance data of the chassis meets a second preset condition after the operating performance data of the chassis meets the first preset condition, and control the chassis to enter a second operating mode when the operating performance data of the chassis does not meet the second preset condition, and control the chassis to enter a third operating mode when the operating performance data of the chassis meets the second preset condition; Among them, in the first working mode, the heating plate starts heating, and the circulation pump and the heat dissipation module stop working; in the second working mode, the heating plate stops heating, the circulation pump starts working, and the heat dissipation module stops working; in the third working mode, the circulation pump and the heat dissipation module are both started working.

15. The cooling system according to claim 14, characterized in that The cooling system also includes a prompt module, which is communicatively connected to the control module and the data acquisition module, and is used to issue an alarm prompt when the working performance data of the chassis collected by the data acquisition module reaches an abnormal condition.

16. The cooling system according to claim 14, characterized in that The cooling system also includes a data recording module, which is communicatively connected to the control module and the data acquisition module. The data recording module is used to record the working performance data of the chassis when abnormal conditions are reached and transmit it to the control module.

17. The cooling system according to claim 12, characterized in that The cooling system further comprises a waterproof connector, which is used to be installed in a chassis, and the terminals of the first heat dissipation module and the terminals of the second heat dissipation module are both communicatively connected with the control module through the waterproof connector.

18. A method for controlling a cooling system, applied to the cooling system according to any one of claims 1 to 17, characterized in that: The control method comprises: Obtain chassis operating performance data; Determining whether the work performance data meets a first preset condition; If the working performance data does not meet the first preset condition, the heating plate is controlled to start heating, and the circulation pump and the heat dissipation module stop working; If the work performance data meets the first preset condition, determining whether the work performance data meets the second preset condition; If the working performance data does not meet the second preset condition, the heating plate is controlled to stop heating, the circulating pump is started to work, and the heat dissipation module stops working; If the working performance data reaches a second preset condition, the circulation pump and the heat dissipation module are controlled to start working.

19. An edge server, characterized in that: Comprising a cooling system as described in any one of claims 1-17.

20. The edge server of claim 19, wherein: The edge server further includes a chassis, the chassis includes a cover plate, the cover plate is provided with a waterproof brim, the waterproof brim is perpendicular to the cover plate, and the projection of the waterproof brim in the vertical direction covers the projection of the refrigeration module in the vertical direction; A guide structure is provided at one end of the waterproof brim away from the cover plate. The guide structure is spaced apart from the refrigeration module and is used to guide rainwater on the waterproof brim away from the cover plate.

Images