A method for magnetron sputtering coating of ITO conductive glass for charge collection

Abstract

A magnetron sputtering coating method for ITO conductive glass with charge collection. The coating method includes: arranging electric field plates with the same area above and below the conductive glass respectively, and electrically connecting the control element to the electric field plates; the control element enables the two electric field plates to enter the working state to form a coating electric field with an electric field direction from top to bottom and an electric field strength of E on the conductive glass, and determines the positions of the field source charges of the coating electric field; calculates the test electric field of each detection area according to the distance between each detection area and the field source charges; performs a regression calculation on the test electric field and the coating electric field using a deviation function to obtain the rotation offset angles X1 of the first electric field plate and the second electric field plate and the control element output voltage parameter V1 to ensure uniform charge collection on the conductive glass; after determining the electric field direction and electric field strength of the coating electric field, uniformly distribute and collect the charges on the conductive glass, and then form a uniform coating on the conductive glass through a photothermal treatment electroplating component.

Description

Technical Field:

[0001] The present invention relates to a method for magnetron sputtering coating of ITO conductive glass with charge collection. Background Art:

[0002] ITO conductive glass is fabricated by depositing a layer of indium tin oxide film on the basis of soda-lime or borosilicate substrate glass using the magnetron sputtering method. The main component of the ITO film layer is indium tin oxide. With a thickness of only a few thousand angstroms, indium oxide has a high transmittance, and tin oxide has strong conductivity. According to resistance, ITO conductive glass is divided into high-resistance glass, ordinary glass, and low-resistance glass. High-resistance glass is generally used for electrostatic protection and touch screen manufacturing; ordinary glass is generally used for TN-type liquid crystal displays and electronic anti-interference; low-resistance glass is generally used for STN liquid crystal displays and transparent circuit boards.

[0003] Generally, the ITO layer is prone to ion replacement reaction in an active positive-valent ion solution, forming other reaction substances with poor conductivity and transmittance. Therefore, during the coating process, the ITO layer needs to be detected and protected to minimize the influence of external positive-valent ions.

[0004] Most of the existing coating methods are to spin-coat photoresist on the glass, then form a conductive thin silver layer through exposure and development, and electroplate through an electroplating device to form an imprinted nickel plate, and then cure it with an ultraviolet lamp, and then form a coating on the ITO conductive glass in a form combining light and heat. The overall process is relatively complex, takes a long time, cannot quantify the process parameters, and has poor accuracy. At the same time, during the electroplating process, the direction of the electric field cannot be adjusted, resulting in uneven distribution of the obtained coating, and it is easy to cause coating damage during the coating process, affecting the performance of the ITO conductive glass. Summary of the Invention:

[0005] The embodiment of the present invention provides a method for magnetron sputtering coating of ITO conductive glass with charge collection. The method is reasonably designed. Based on the adjustment and control of the electric field plate and the control element, the electric field direction and intensity are changed to evenly distribute the coating charges on the ITO conductive glass. After light and heat treatment, a uniform coating is formed on the surface of the ITO conductive glass, avoiding damage to the coating during the coating process. At the same time, during the coating process, the amount of charge will be analyzed and detected, and the corresponding rotation offset angle and output voltage parameters will be calculated to accurately quantify and evaluate the overall process flow, simplify the overall coating process, save electroplating time, ensure the overall quality of the ITO conductive glass coating, and thus achieve rapid and accurate coating of the ITO conductive glass, solving the problems existing in the prior art.

[0006] The technical solution adopted by the present invention to solve the above technical problems is:

[0007] A magnetron sputtering coating method for charge-accumulating ITO conductive glass, the coating method comprising:

[0008] S1. Electric field plates with the same area are respectively arranged above and below the conductive glass. The electric field plates can be translated left and right, moved up and down, and rotated and offset. The electric field plates include a first electric field plate and a second electric field plate. A control element is electrically connected to the electric field plates so that the control element can adjust the electric field direction and electric field intensity of the first electric field plate and the second electric field plate;

[0009] S2. The control element enables the two electric field plates to enter the working state to form a coating electric field with an electric field direction from top to bottom and an electric field intensity of E on the conductive glass, and determines the position of the field source charge of the coating electric field;

[0010] S3. Randomly select three detection areas on the conductive glass. The detection component detects the average charge amounts Q1, Q2, and Q3 in each detection area, and calculates the test electric fields E1, E2, and E3 of each detection area according to the distance between each detection area and the field source charge;

[0011] S4. A deviation function is used to perform a regression calculation on the test electric fields E1, E2, E3 and the coating electric field E to obtain the rotation offset angles X1 of the first electric field plate and the second electric field plate and the output voltage parameter V1 of the control element to ensure that charges are uniformly accumulated on the conductive glass;

[0012] S5. The control element switches the polarities of the first electric field plate and the second electric field plate, adjusts the electric field direction, and repeats the above steps S3 - S4 to obtain another set of rotation offset angles X2 of the first electric field plate and the second electric field plate and the voltage parameter V2 output by the control element. Perform a least squares operation on the two sets of rotation offset angles and voltage parameters to determine the actual coating rotation offset angle of the electric field plate and the actual output voltage parameter of the control element;

[0013] S6. After determining the electric field direction and electric field intensity of the coating electric field, uniformly distribute and accumulate charges on the conductive glass, and then form a uniform coating on the conductive glass through an electroplating component with photothermal treatment.

[0014] The detection area is an irregular figure, and the areas of each detection area are the same.

[0015] Randomly select three detection areas on the conductive glass. The detection component detects the average charge amounts Q1, Q2, and Q3 in each detection area, and calculating the test electric fields E1, E2, and E3 of each detection area according to the distance between each detection area and the field source charge includes the following steps:

[0016] S3.1. Respectively detect the distances between the center points of each detection area and the field source charge;

[0017] S3.2. Measure the specific area of each detection region, and then calculate the average charge amount of each detection region;

[0018] S3.3. Calculate the test electric field of each detection region based on the distance between the center point of the detection region and the source charge and the average charge amount.

[0019] The deviation function is as follows:

[0020] δ(x i ) = s(E, E n )|x i - π| + (1 - s(E, E n ))|x i - θ|

[0021] δ(v i ) = s(E, E n )|v i - v0| + (1 - s(E, E n ))|v i - θ|

[0022] Among them, x i is the rotational offset angle of the electric field plate, v i is the voltage parameter output by the control element, s(E, E n ) is a deviation binary function, θ is the convolution reference model, and n is the label of the test electric field.

[0023] Set the threshold range of the rotational offset angle of the electric field plate and the output voltage parameter, compare with the calculated data, and screen out the abnormal calculated data.

[0024] The steps for performing the least squares operation on two sets of rotational offset angles and voltage parameters to determine the actual rotational offset angle of the coating on the electric field plate and the actual output voltage parameter of the control element are as follows:

[0025] S5.1. Set the relevant multiplication factors according to the set threshold range;

[0026] S5.2. Combine and operate the rotational offset angles and output voltage parameters obtained from the two calculations with the multiplication factors to obtain the correlation coefficients;

[0027] S5.3. Evaluate the correlation coefficients. When the correlation coefficients are in the interval of (0.5, 0.9), it indicates that there is no large deviation in the calculated rotational offset angles and output voltage parameters, that is, the actual rotational offset angle of the coating and the actual output voltage parameter of the control element are obtained.

[0028] The rotation offset angles and output voltage parameters of the first electric field plate and the second electric field plate are the same. A voltage stabilizing chip is provided in the control element, and the voltage stabilizing chip is used to output different levels of output voltage to the electric field plates.

[0029] The rotation offset angles of the first electric field plate and the second electric field plate are in the counterclockwise direction.

[0030] With the above structure, the present invention adjusts the electric field direction and the amount of electric charge on the conductive glass by translating the first electric field plate and the second electric field plate left and right, moving them up and down, and rotating and offsetting them; electrically connecting the control element to the electric field plates so that the control element can adjust the electric field direction and electric field strength of the first electric field plate and the second electric field plate; randomly selecting three detection areas on the conductive glass, calculating the test electric field of each detection area according to the distance between each detection area and the source charge, and performing a regression calculation on the test electric field plating electric field E using a deviation function to ensure that charges are evenly collected on the conductive glass; performing a least-squares operation on two sets of rotation offset angles and voltage parameters to determine the actual rotation offset angle of the electric field plate during plating and the actual output voltage parameters of the control element, and forming a uniform coating on the conductive glass through an electroplating assembly via photothermal treatment, which has the advantages of simplicity, quickness, precision, and high efficiency. Description of the Drawings:

[0031] Figure 1 It is a schematic flow chart of the present invention.

[0032] Figure 2 It is a first schematic structural diagram of the present invention.

[0033] Figure 3 It is a second schematic structural diagram of the present invention.

[0034] Figure 4 It is a schematic structural diagram of the rotation and offset of the electric field plate of the present invention.

[0035] Figure 5 It is a schematic structural diagram of the conductive glass and the detection area of the present invention. Detailed Embodiments:

[0036] To clearly illustrate the technical features of this solution, the present invention will be elaborated in detail below through specific embodiments and in conjunction with its drawings.

[0037] As Figures 1-5 shown in

[0038] S1. Set electric field plates with the same area above and below the conductive glass respectively. The electric field plates can be translated left and right, moved up and down, and rotated and offset. The electric field plates include a first electric field plate and a second electric field plate. Electrically connect the control element to the electric field plates so that the control element can adjust the electric field direction and electric field intensity of the first electric field plate and the second electric field plate.

[0039] S2. The control element enables the two electric field plates to enter the working state to form a plating electric field with an electric field direction from top to bottom and an electric field intensity of E on the conductive glass, and determines the position of the field source charge of the plating electric field.

[0040] S3. Randomly select three detection areas on the conductive glass. The detection component detects the average charge amounts Q1, Q2, and Q3 in each detection area, and calculates the test electric fields E1, E2, and E3 of each detection area according to the distance between each detection area and the field source charge.

[0041] S4. Use the deviation function to perform a regression calculation on the test electric fields E1, E2, E3 and the plating electric field E to obtain the rotation offset angles X1 of the first electric field plate and the second electric field plate and the output voltage parameter V1 of the control element to ensure that the charges are evenly concentrated on the conductive glass.

[0042] S5. The control element switches the polarities of the first electric field plate and the second electric field plate, adjusts the electric field direction, and repeats the above steps S3 - S4 to obtain another set of rotation offset angles X2 of the first electric field plate and the second electric field plate and the voltage parameter V2 output by the control element. Perform a least squares operation on the two sets of rotation offset angles and voltage parameters to determine the actual plating rotation offset angle of the electric field plate and the actual output voltage parameter of the control element.

[0043] S6. After determining the electric field direction and electric field intensity of the plating electric field, evenly distribute and concentrate the charges on the conductive glass, and then form a uniform plating on the conductive glass through the electroplating component with light heat treatment.

[0044] The detection area is an irregular figure, and the area of each detection area is the same.

[0045] Randomly select three detection areas on the conductive glass. The detection component detects the average charge amounts Q1, Q2, and Q3 in each detection area, and calculates the test electric fields E1, E2, and E3 of each detection area according to the distance between each detection area and the field source charge, including the following steps:

[0046] S3.1. Detect the distance between the center point of each detection area and the field source charge respectively.

[0047] S3.2. Measure the specific area of each detection area, and then calculate the average charge amount of each detection area.

[0048] S3.3. Calculate the test electric field of each detection area based on the distance from the center point of the detection area to the field source charge and the average charge quantity.

[0049] The deviation function is as follows:

[0050] δ(x i ) = s(E, E n )|x i - π| + (1 - s(E, E n ))|x i - θ|

[0051] δ(v i ) = s(E, E n )|v i - v0| + (1 - s(E, E n ))|v i - θ|

[0052] where x i is the rotational offset angle of the electric field plate, v i is the voltage parameter output by the control element, s(E, E n ) is a deviation binary function, θ is the convolution reference model, and n is the label of the test electric field.

[0053] Set the threshold ranges of the rotational offset angle of the electric field plate and the output voltage parameter, compare with the calculated data, and screen out the abnormally calculated data.

[0054] The steps to determine the actual rotational offset angle of the coating on the electric field plate and the actual output voltage parameter of the control element by performing the least - squares operation on two sets of rotational offset angles and voltage parameters are as follows:

[0055] S5.1. Set the relevant multiplication factors according to the set threshold ranges.

[0056] S5.2. Combine and operate the rotational offset angles and output voltage parameters obtained from the two calculations with the multiplication factors to obtain the correlation coefficients.

[0057] S5.3. Evaluate the correlation coefficients. When the correlation coefficients are in the interval (0.5, 0.9), it indicates that there is no large deviation in the calculated rotational offset angles and output voltage parameters, that is, the actual rotational offset angle of the coating and the actual output voltage parameter of the control element are obtained.

[0058] The rotational offset angles and output voltage parameters of the first electric field plate and the second electric field plate are the same. A voltage - stabilizing chip is provided in the control element, and the voltage - stabilizing chip is used to output different levels of output voltage to the electric field plate.

[0059] The rotational offset angles of the first electric field plate and the second electric field plate are in the counter - clockwise direction.

[0060] The working principle of a magnetron sputtering coating method for charge collection ITO conductive glass in an embodiment of the present invention is as follows: Based on the adjustment and control of the electric field plate and the control element, the electric field direction and intensity are changed to evenly distribute the coating charges on the ITO conductive glass. After light heat treatment, a uniform coating is formed on the surface of the ITO conductive glass, avoiding damage to the coating during the coating process. At the same time, the amount of charge is analyzed and detected during the coating process, and the corresponding rotation offset angle and output voltage parameters are calculated to accurately quantify and evaluate the overall process flow, simplify the overall coating process, save electroplating time, ensure the overall quality of the ITO conductive glass coating, and thus achieve rapid and accurate coating of the ITO conductive glass.

[0061] In the overall solution, it mainly includes the following steps: Electric field plates with the same area are respectively arranged above and below the conductive glass, and the electric field plates can be translated left and right, moved up and down, and rotated and offset; The electric field plates include a first electric field plate and a second electric field plate, and the control element is electrically connected to the electric field plates so that the control element can adjust the electric field direction and intensity of the first electric field plate and the second electric field plate; The control element enables the two electric field plates to enter the working state to form a coating electric field with an electric field direction from top to bottom and an electric field intensity of E on the conductive glass, and determines the position of the field source charge of the coating electric field; Randomly select three detection areas on the conductive glass, and the detection component detects the average charge amounts Q1, Q2, and Q3 in each detection area, and calculates the test electric fields E1, E2, and E3 in each detection area according to the distance between each detection area and the field source charge; The deviation function is used to perform a regression calculation on the test electric fields E1, E2, E3 and the coating electric field E to obtain the rotation offset angles X1 of the first electric field plate and the second electric field plate and the output voltage parameter V1 of the control element to ensure the uniform collection of charges on the conductive glass; The control element switches the polarities of the first electric field plate and the second electric field plate, adjusts the electric field direction, and repeats the above steps S3 - S4 to obtain another set of rotation offset angles X2 of the first electric field plate and the second electric field plate and the voltage parameter V2 output by the control element, and performs a least squares operation on the two sets of rotation offset angles and voltage parameters to determine the actual coating rotation offset angle of the electric field plate and the actual output voltage parameter of the control element; After determining the electric field direction and intensity of the coating electric field, the charges are evenly distributed and collected on the conductive glass, and then a uniform coating is formed on the conductive glass by the electroplating component of light heat treatment.

[0062] The control element of this application is an integrated controller, which is built-in with a voltage regulator chip and can output different levels of output voltage to adjust the electric field strength of the plating electric field, so as to change the uniform distribution of charges on the conductive glass. At the same time, the control element can also transmit control instructions to the corresponding automated mechanical structure to realize the rotational offset of the first electric field plate and the second electric field plate to change the electric field direction, thereby affecting the charge collection and uniform distribution on the conductive glass.

[0063] Furthermore, the core innovation of this application lies in two data interaction conversions through regression calculation and least squares operation. Through the comparison of the electric field strength, the rotational offset angles of the first electric field plate and the second electric field plate and the actual output voltage parameters of the control element are obtained to achieve the uniform distribution and collection of charges on the conductive glass, providing a data basis for the production of the plating.

[0064] Preferably, due to the particularity of charges, in this application, multiple irregular figures with the same area are selected as test controls, and the test electric fields of each detection area are calculated respectively.

[0065] Specifically, three detection areas are randomly selected on the conductive glass, and the detection component detects the average charge amounts Q1, Q2, and Q3 in each detection area. Calculating the test electric fields E1, E2, and E3 of each detection area based on the distance between each detection area and the source charge includes the following steps: detecting the distance between the center point of each detection area and the source charge respectively; measuring the specific area of each detection area, and then calculating the average charge amount of each detection area; calculating the test electric field of each detection area based on the distance between the center point of the detection area and the source charge and the average charge amount, providing a data basis for subsequent calculations.

[0066] Preferably, a deviation function is used to perform a regression calculation on the test electric field and the plating electric field to obtain the rotational offset angles X1 of the first electric field plate and the second electric field plate and the output voltage parameter V1 of the control element to ensure the uniform collection of charges on the conductive glass.

[0067] The deviation function is:

[0068] δ(x i )=s(E,E n )|x i -π|+(1-s(E,E n ))|x i -θ|

[0069] δ(v i )=s(E,E n )|v i -v0|+(1-s(E,E n ))|v i -θ|

[0070] Among them, x i is the rotational offset angle of the electric field plate, v i is the voltage parameter output by the control element, s(E, E n ) is a deviation binary function, θ is the convolution reference model, and n is the label of the test electric field.

[0071] Based on the deviation correlation between the test electric field and the plating electric field, and the regression correlation between the rotational offset angle and the output voltage parameter, a data basis is provided for the rotational offset and electric field strength setting of the electric field plate to ensure that charges are uniformly and orderly collected on the conductive glass.

[0072] To prevent large deviations during actual operation, after a large number of simulation tests and calculations, the threshold ranges of the rotational offset angle and output voltage parameter of the electric field plate are set, compared with the calculated data, and then the abnormal calculated data is screened out.

[0073] Furthermore, the least squares operation is performed on two sets of rotational offset angles and voltage parameters to determine the actual plating rotational offset angle of the electric field plate and the actual output voltage parameter of the control element, including the following steps: according to the set threshold range, set the relevant multiplication factors; combine and operate the rotational offset angles and output voltage parameters obtained from the two calculations with the multiplication factors to obtain the correlation coefficients; evaluate the correlation coefficients. When the correlation coefficient is in the interval of (0.5, 0.9), it indicates that there is no large deviation in the calculated rotational offset angle and output voltage parameter, that is, the actual plating rotational offset angle and the actual output voltage parameter of the control element are obtained.

[0074] Regarding the setting of the evaluation interval, only under ideal conditions can the correlation coefficient reach 1. Therefore, in this application, considering the time change and the error in charge collection, when the correlation coefficient reaches (0.5, 0.9), it can be determined that the calculated rotational offset angle and output voltage parameter are consistent with the actual data.

[0075] For the electroplating operation of the final electroplating assembly, mature technical means in the existing technology can be adopted. According to the electric field direction and electric field strength of the calculated plating electric field, a uniform plating is formed on the conductive glass by means of charge collection.

[0076] It should be particularly noted that in this application, according to the characteristics of the conductive glass, the rotational offset angles of the first electric field plate and the second electric field plate are preferably set in the counterclockwise direction.

[0077] In summary, a method for magnetron sputtering coating of ITO conductive glass with charge collection in the embodiments of the present invention is based on the adjustment and control effects of an electric field plate and a control element. By changing the electric field direction and intensity, the coating charges are evenly distributed on the ITO conductive glass. After photo-thermal treatment, a uniform coating is formed on the surface of the ITO conductive glass, avoiding damage to the coating during the coating process. At the same time, the amount of charge is analyzed and detected during the coating process, and the corresponding rotation offset angle and output voltage parameters are calculated to accurately quantify and evaluate the overall process flow, simplify the overall coating process, save electroplating time, ensure the overall quality of the ITO conductive glass coating, and thus achieve rapid and accurate coating of the ITO conductive glass.

[0078] The above specific embodiments cannot be used as a limitation to the protection scope of the present invention. For those skilled in the art of this technology, any alternative improvement or transformation made to the embodiments of the present invention falls within the protection scope of the present invention.

[0079] Where the present invention is not elaborated, they are all well-known technologies to those skilled in the art of this technology.

Claims

1. A method for magnetron sputtering coating of ITO conductive glass for charge collection, characterized in that, The coating method includes: S1. Electric field plates with the same area are respectively arranged above and below the conductive glass. The electric field plates can be translated left and right, moved up and down, and rotated and offset. The electric field plates include a first electric field plate and a second electric field plate. An electrical connection is made between the control element and the electric field plates so that the control element can adjust the electric field direction and electric field intensity of the first electric field plate and the second electric field plate. S2. The control element makes the two electric field plates enter the working state to form a coating electric field with an electric field direction from top to bottom and an electric field intensity of E on the conductive glass, and determines the position of the field source charge of the coating electric field. S3. Randomly select three detection areas on the conductive glass. The detection component detects the average charge amounts Q1, Q2, and Q3 in each detection area, and calculates the test electric fields E1, E2, and E3 of each detection area according to the distance between each detection area and the field source charge. S4. A deviation function is used to perform a regression calculation on the test electric fields E1, E2, E3 and the coating electric field E to obtain the rotation offset angles X1 of the first electric field plate and the second electric field plate and the output voltage parameter V1 of the control element to ensure that charges are uniformly collected on the conductive glass. S5. The control element switches the polarities of the first electric field plate and the second electric field plate, adjusts the electric field direction, and repeats the above steps S3 - S4 to obtain another set of rotation offset angles X2 of the first electric field plate and the second electric field plate and the voltage parameter V2 output by the control element. Perform a least squares operation on the two sets of rotation offset angles and voltage parameters to determine the actual coating rotation offset angle of the electric field plate and the actual output voltage parameter of the control element. S6. After determining the electric field direction and electric field intensity of the coating electric field, uniformly distribute and collect charges on the conductive glass, and then form a uniform coating on the conductive glass through the electroplating component with photothermal treatment.

2. A magnetron sputtering coating method for charge-collecting ITO conductive glass according to claim 1, characterized in that: The detection area is an irregular figure, and the areas of each detection area are the same.

3. A magnetron sputtering coating method for ITO conductive glass with charge collection according to claim 1, characterized in that, Randomly select three detection areas on the conductive glass. The detection component detects the average charge amounts Q1, Q2, and Q3 in each detection area, and calculates the test electric fields E1, E2, and E3 of each detection area according to the distance between each detection area and the field source charge, including the following steps: S3.

1. Respectively detect the distance between the center point of each detection area and the field source charge. S3.

2. Measure the specific area of each detection area, and then calculate the average charge amount of each detection area. S3.

3. Calculate the test electric field of each detection area through the distance between the center point of the detection area and the field source charge and the average charge amount.

4. A magnetron sputtering coating method for ITO conductive glass with charge collection according to claim 1, characterized in that, The deviation function is: δ(x i ) = s(E, E n )|x i - π| + (1 - s(E, E n ))|x i - θ| δ(v i ) = s(E, E n ) |v i - v0| + (1 - s(E, E n )) |v i - θ| where x i is the rotational offset angle of the electric field plate, v i is the voltage parameter output by the control element, s(E, E n ) is a deviation binary function, θ is the convolution reference model, and n is the label of the test electric field.

5. A magnetron sputtering coating method for ITO conductive glass with charge collection according to claim 4, characterized in that: Set the threshold range of the rotation offset angle and output voltage parameter of the electric field plate, compare it with the calculated data, and screen out the abnormal calculated data.

6. A magnetron sputtering coating method for charge-collecting ITO conductive glass according to claim 5, characterized in that, Performing a least squares operation on the two sets of rotation offset angles and voltage parameters to determine the actual coating rotation offset angle of the electric field plate and the actual output voltage parameter of the control element includes the following steps: S5.

1. According to the set threshold range, set the relevant multiplication factor. S5.

2. Combine and operate the rotation offset angles and output voltage parameters obtained from the two calculations with the multiplication factor to obtain the correlation coefficient. S5.3, evaluate the correlation coefficient. When the correlation coefficient is in the interval of (0.5, 0.9), it indicates that there is no large deviation between the calculated rotation offset angle and the output voltage parameter, that is, the actual rotation offset angle of the coating and the actual output voltage parameter of the control element are obtained.

7. A magnetron sputtering coating method for charge-collecting ITO conductive glass according to claim 1, characterized in that: The rotation offset angles and output voltage parameters of the first electric field plate and the second electric field plate are the same. A voltage stabilizing chip is provided in the control element, and the voltage stabilizing chip is used to output different levels of output voltage to the electric field plate.

8. A magnetron sputtering coating method for ITO conductive glass with charge collection according to claim 1, characterized in that: The rotation offset angles of the first electric field plate and the second electric field plate are in the counterclockwise direction.

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