Wafer nondestructive attitude adjusting device

Abstract

The application discloses a wafer nondestructive attitude adjusting device, and relates to the technical field of wafer attitude adjustment.The wafer nondestructive attitude adjusting device comprises a vacuum chuck, a limiting upper skirt, a limiting lower skirt, a two-dimensional moving platform and a controller, the vacuum chuck is installed at the upper end of the limiting upper skirt, the upper surface of the vacuum chuck is provided with a plurality of adsorption holes, the vacuum chuck is used for adsorbing a wafer, the limiting upper skirt is arranged above the limiting lower skirt, a plurality of adjusting telescopic rods are arranged between the lower surface of the limiting upper skirt and the upper surface of the limiting upper skirt, the adjusting telescopic rods are used for adjusting the position of the limiting upper skirt, the limiting lower skirt is installed on the two-dimensional moving platform, the two-dimensional moving platform can drive the limiting lower skirt to move in the horizontal direction, and the adjusting telescopic rods and the two-dimensional moving platform are electrically connected with the controller.The wafer nondestructive attitude adjusting device can realize mechanical adjustment of the position of the wafer, does not need manual participation, and is accurate in wafer position adjustment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer posture adjustment, and in particular to a wafer nondestructive posture adjustment device. BACKGROUND

[0002] In the vast field of semiconductor manufacturing, wafers are the basic materials for semiconductor chip manufacturing, and their processing process requires extremely high precision and stability. During the manufacturing process, the movement, rotation, positioning and other operations of the wafer need to be accurately controlled to ensure the performance and quality of the final product. However, due to the material and shape characteristics of the wafer itself, it is prone to movement or offset during processing, thereby affecting the processing precision and consistency. The vacuum adsorption system uses adsorption force to firmly fix the wafer on the processing equipment, and by accurately controlling the size and distribution of the adsorption force, the position and posture of the wafer are accurately controlled. During processing, the wafer adsorption system can ensure the stability of the wafer and prevent it from moving or offsetting, thereby greatly improving the processing precision and consistency.

[0003] As a physical carrier for semiconductor preparation, the wafer will have a silicon dioxide film plated on its surface during processing. The wafer after plating the silicon dioxide film is called a silicon dioxide film thickness standard wafer. Accurate measurement of the thickness of the wafer after plating the silicon dioxide film is a crucial part of the semiconductor manufacturing and research and development process. Small changes in the thickness of the wafer after plating the silicon dioxide film can cause significant changes in the performance of semiconductor devices, thereby affecting the performance and quality of the entire product.

[0004] The existing wafer surface thin film uses an ellipsometer to measure its thickness. During actual measurement, the wafer after plating the silicon dioxide film is placed on the support platform of the ellipsometer, and then the thickness is measured. The height and inclination of the existing support platform cannot be adjusted, and individual support platforms can only be adjusted manually. This may cause the wafer to not be able to maintain a horizontal state, thereby seriously affecting the thickness measurement accuracy of the wafer.

[0005] Therefore, there is an urgent need in the art for a wafer nondestructive posture adjustment device to solve the above problems. SUMMARY

[0006] The purpose of the present application is to provide a wafer nondestructive posture adjustment device to solve the problems existing in the prior art, which can mechanically adjust the posture of the wafer and improve the accuracy of the wafer posture.

[0007] To achieve the above purpose, the present application provides the following solutions:

[0008] The application discloses a wafer nondestructive attitude adjusting device, which comprises a vacuum chuck, a limiting upper skirt, a limiting lower skirt, a two-dimensional moving platform and a controller, the vacuum chuck is installed at the upper end of the limiting upper skirt, the upper surface of the vacuum chuck is provided with a plurality of adsorption holes, the vacuum chuck is used for adsorbing wafers, the limiting upper skirt is arranged above the limiting lower skirt, a plurality of adjusting telescopic rods are arranged between the lower surface of the limiting upper skirt and the upper surface of the limiting upper skirt, the adjusting telescopic rods are used for adjusting the position of the limiting upper skirt, the limiting lower skirt is installed on the two-dimensional moving platform, the two-dimensional moving platform can drive the limiting lower skirt to move in the horizontal direction, and the adjusting telescopic rods and the two-dimensional moving platform are electrically connected with the controller.

[0009] Preferably, the material of the vacuum chuck is ceramic.

[0010] Preferably, the adjusting telescopic rods are adjusting electric cylinders, three adjusting electric cylinders are arranged on the limiting upper skirt, the telescopic ends of the adjusting electric cylinders are provided with contact spheres, and the contact spheres abut against the hemispherical grooves.

[0011] Preferably, the vacuum chuck comprises a plurality of wafer clamping rings arranged in sequence from inside to outside, and a plurality of adsorption holes are uniformly distributed in the circumferential direction of each wafer clamping ring.

[0012] A level is arranged at the center of the vacuum chuck.

[0013] Preferably, the upper surface of the vacuum chuck is provided with a transfer clamping groove.

[0014] Preferably, three telescopic springs are connected between the limiting upper skirt and the limiting lower skirt.

[0015] Preferably, the limiting upper skirt and the limiting lower skirt are both in a cylindrical structure, an annular air pressure groove is arranged on the inner wall of the limiting upper skirt, a blowing pipe is fixed in the air pressure groove, a plurality of blowing holes are uniformly distributed on the blowing pipe at intervals, and one end of the blowing pipe is connected with an air pump.

[0016] Preferably, the two-dimensional moving platform comprises a moving top plate, a moving intermediate plate and a fixed bottom plate, the moving top plate and the moving intermediate plate are slidably connected, and the moving intermediate plate and the fixed bottom plate are slidably connected.

[0017] Straight line driving channels, limiting channels, measuring channels and two guide channels are arranged between the moving top plate and the moving intermediate plate and between the moving intermediate plate and the fixed bottom plate.

[0018] A linear motor is fixed in the straight line driving channel.

[0019] The light limiting channel is internally provided with a photoelectric switch;

[0020] The measuring channel is internally provided with a grating ruler;

[0021] The guiding channel is internally provided with a sliding rail.

[0022] Preferably, the lower end of the vacuum chuck is provided with a vacuum chuck base, and the vacuum chuck base is fixed to the upper end of the limiting upper skirt through a screw;

[0023] The upper surface of the vacuum chuck base is provided with three electric telescopic supports, and a laser ranging sensor is mounted on the telescopic end of the electric telescopic support.

[0024] Preferably, the electric telescopic support is in L-shaped structure, and the electric telescopic support comprises a fixed vertical rod and a transverse telescopic pipe, the transverse telescopic pipe comprises a telescopic outer pipe and a telescopic inner pipe, the telescopic inner pipe is slidably connected to the inner wall of the telescopic outer pipe, one end of the telescopic outer pipe is fixed to the upper end of the fixed vertical rod, a telescopic electric cylinder is fixed in the telescopic outer pipe, and the telescopic end of the telescopic electric cylinder is fixed to the telescopic inner pipe

[0025] The present application has the following technical effects relative to the prior art:

[0026] The present application uses three adjusting telescopic rods to adjust the lifting and pitching, and the lifting operation can be realized by adjusting the three adjusting telescopic rods, and the pitching operation can be realized by adjusting one of the adjusting telescopic rods or adjusting the adjusting telescopic rods at different heights.

[0027] Further, the present application realizes the flexible movement of the wafer through the limiting upper skirt and the limiting lower skirt, the limiting upper skirt and the limiting lower skirt are both hollow cylindrical shells, there is a 5mm gap between the two shells, and there is air pressure between the limiting upper skirt and the limiting lower skirt, so that the side walls of the upper and lower shells do not contact each other, and a flexible telescopic spring is fixed at one end to the limiting upper skirt and at the other end to the limiting lower skirt, so that the limiting upper skirt does not jump up and down excessively.

[0028] Further, the present application uses three laser ranging sensors to monitor the wafer, measures the distance between the wafer and the laser ranging sensor, judges whether there is a gap between the sample and the vacuum chuck, and realizes the closed-loop feedback of the attitude adjustment. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0030] Figure 1 Structure diagram of wafer non-destructive attitude adjustment device of the embodiment of the present application;

[0031] Figure 2 Structure diagram between the upper limiting skirt and the lower limiting skirt in the wafer non-destructive attitude adjustment device of the embodiment of the present application;

[0032] Figure 3 Top view of the wafer non-destructive attitude adjustment device of the embodiment of the present application;

[0033] Figure 4 Front view of the upper limiting skirt and the lower limiting skirt in the wafer non-destructive attitude adjustment device of the embodiment of the present application;

[0034] Figure 5 Front view of the silicon dioxide film thickness standard piece in the wafer non-destructive attitude adjustment device of the embodiment of the present application;

[0035] Figure 6 Light spot diagram of the silicon dioxide film thickness standard piece in the wafer non-destructive attitude adjustment device of the embodiment of the present application;

[0036] Figure 7 Front view of the silicon dioxide film thickness standard piece in the wafer non-destructive attitude adjustment device of the embodiment of the present application;

[0037] Figure 8 Light spot diagram of the silicon dioxide film thickness standard piece in the wafer non-destructive attitude adjustment device of the embodiment of the present application;

[0038] Figure 9 Position distribution diagram of the three adjusting telescopic rods in the wafer non-destructive attitude adjustment device of the embodiment of the present application;

[0039] In the figure: 1-vacuum chuck; 101-chuck base; 102-wafer clamping ring; 103-suction hole; 104-transfer clamping groove; 2-upper limiting skirt; 201-pneumatic groove; 3-lower limiting skirt; 4-two-dimensional moving platform; 401-moving top plate; 402-moving intermediate plate; 403-fixed bottom plate; 404-straight line driving channel; 405-limiting channel; 406-measuring channel; 407-guiding channel; 5-electric telescopic support; 6-telescopic spring; 7-adjusting telescopic rod; 8-autocollimator; 9-wafer. DETAILED DESCRIPTION

[0040] With reference to the accompanying drawings, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0041] The present application aims to provide a wafer non-destructive attitude adjusting device to solve the problems in the prior art, and mechanically adjust the wafer attitude to improve the accuracy of the wafer attitude.

[0042] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0043] As shown in Figures 1-9 The present application provides a wafer non-destructive attitude adjusting device, which comprises a vacuum chuck 1, a limiting upper skirt 2, a limiting lower skirt 3, a two-dimensional moving platform 4 and a controller. Specifically, the vacuum chuck 1 is installed at the upper end of the limiting upper skirt 2, the upper surface of the vacuum chuck 1 is provided with a plurality of adsorption holes 103, and the vacuum chuck 1 is used for adsorbing a wafer 9. The limiting upper skirt 2 is arranged above the limiting lower skirt 3, the limiting upper skirt 2 and the limiting lower skirt 3 are oppositely arranged, and there is an activity space between the two. A plurality of adjusting telescopic rods 7 are arranged in the activity space between the lower surface of the limiting upper skirt 2 and the upper surface of the limiting upper skirt 2, and the extension or shortening of the adjusting telescopic rods 7 can be used to adjust the position of the limiting upper skirt 2. The limiting lower skirt 3 is installed on the two-dimensional moving platform 4, and the two-dimensional moving platform 4 can drive the limiting lower skirt 3 to move in the X and Y axial directions along the horizontal direction. The adjusting telescopic rods 7 and the two-dimensional moving platform 4 are electrically connected with the controller, the adjusting telescopic rods 7 and the two-dimensional moving platform 4 are remotely controlled to operate through the controller, and the controller can adopt an existing PLC controller, a single-chip microcomputer controller or a control computer which can be remotely electrically controlled.

[0044] In practical use, the wafer 9 non-destructive attitude adjustment device needs to be installed as a whole on the ellipsometer. Wafer 9 is placed on the vacuum chuck 1. Generally, the surface of wafer 9 is located at the intersection of the incident and exit directions of the polarization arm and the analyzer arm. Then, the adjusting telescopic rod 7 is moved downwards to adjust the surface of wafer 9 downwards. The movement stops when the surface of wafer 9 is 5mm below the horizontal level of the intersection point. The attitude of wafer 9 can then be adjusted. The horizontal distance of wafer 9 is adjusted using the two-dimensional moving platform 4, ensuring that the center of wafer 9 is collinear with the intersection of the incident and exit directions of the polarization arm and the analyzer arm in the vertical direction. If wafer 9 is found to be tilted, the telescopic rods 7 can be extended or retracted according to the tilt to keep wafer 9 horizontal. After the attitude of wafer 9 is adjusted, wafer 9 is driven upwards to the intersection of the incident and exit directions of the polarization arm and the analyzer arm, and the ellipsometer measures the thickness.

[0045] In this embodiment, the vacuum suction cup 1 is made of ceramic. Ceramic material has excellent electrostatic diffusion properties, which can effectively eliminate static electricity.

[0046] In this embodiment, the adjusting telescopic rod 7 is an adjusting electric cylinder. There are three adjusting electric cylinders arranged in a triangle, each located at one of the three vertices of an equilateral triangle, as shown in the diagram. Figure 9 As shown, the distance between each adjusting cylinder and the center is 100mm to ensure uniform movement. The adjusting cylinders are existing micro servo cylinders used for lifting and lowering, with a stroke of 10mm and a push-pull force of 70N. When all three adjusting cylinders move simultaneously, they can achieve a 10mm vertical lift / lower movement on the upper skirt 2. When one adjusting cylinder is moved while the other two remain stationary, a pitch adjustment of ±2° can be achieved.

[0047] Opposite to the adjusting electric cylinder, the upper skirt 2 of the limiting position is provided with three hemispherical grooves. The positions of the three hemispherical grooves correspond one-to-one with the positions of the three adjusting electric cylinders. The telescopic end of the adjusting electric cylinder is provided with a contact ball, which can enter into the hemispherical groove and abut against the hemispherical groove.

[0048] In the actual process of adjusting the tilt angle of wafer 9, such as Figures 5-8 As shown, this embodiment adjusts the horizontal state of the wafer 9 surface by using a high-precision autocollimator 8 in conjunction with the wafer 9 surface. When light emitted by the autocollimator 8 passes through the wafer 9 surface, it is received by the autocollimator 8. For example... Figure 6 When the received light spot is located at the center of the display interface of the autocollimator 8, it can be determined that the surface of the wafer 9 is in a horizontal state (e.g., Figure 5 (As shown). In particular, as Figure 8 As shown, when the light spot is located on the right side of the autocollimator 8 display interface, adjustment is required.Figure 9 Raising the two telescopic levers 7 on the right or lowering the one telescopic lever 7 on the left will adjust the light spot on the display interface back to the center position. After adjusting the level, raise the surface of wafer 9 to the height of the intersection of the ellipsometry's starting arm and the analyzing arm.

[0049] In this embodiment, as Figures 1-3 As shown, the vacuum chuck 1 includes multiple wafer retaining rings 102 arranged sequentially from the inside out, specifically three rings, all of which are circular. A sliding support column is slidably connected to the center of the central wafer retaining ring 102. A lifting cylinder is connected to the lower end of the sliding support column, which is electrically connected to a controller. The lifting cylinder can move the sliding support column up and down. The diameter of the central sliding support column and the three outer wafer retaining rings 102 gradually increases from the inside out, and the height generally increases accordingly (the sliding support column can be raised if needed). The outermost wafer retaining ring 102 also has a vertical outer edge to hold the wafer 9 in place. The diameters of the central sliding support column and the three outer wafer retaining rings 102 are 100mm, 150mm, 200mm, and 300mm respectively, from the inside out. Wafers 9 of different sizes are placed on wafer retaining rings 102 or sliding support columns of different sizes.

[0050] Each wafer retainer ring 102 has multiple adsorption holes 103 evenly distributed along its circumference; the specific number can be adjusted according to actual needs.

[0051] Each wafer retaining ring 102 and sliding support column has a negative pressure chamber inside, which corresponds to its shape and size. The innermost sliding support column is a cylindrical chamber, and the negative pressure chambers of the three outer wafer retaining rings 102 are all annular chambers. Each negative pressure chamber is connected to a negative pressure main pipe through a negative pressure branch pipe. The end of the negative pressure main pipe away from the negative pressure branch pipe is connected to a negative pressure pump, and each negative pressure branch pipe is equipped with an electric control valve. The negative pressure pump and the electric control valve are electrically connected to the controller, which controls the opening and closing of each electric control valve.

[0052] In practical use, if wafer 9 is placed on the sliding support pillar, it is only necessary to open the electrically controlled valve on the negative pressure branch pipe connecting to the smallest negative pressure chamber and the negative pressure pump. If wafer 9 is placed at the 300mm, 200mm, or 150mm wafer retainer 102, the electrically controlled valve on the corresponding negative pressure branch pipe can be opened. Of course, to enhance the adsorption capacity, the electrically controlled valve on the negative pressure branch pipe of the negative pressure chamber of the sliding support pillar can also be opened. In order to ensure support for the center of wafer 9, the sliding support pillar can be moved upward by the lifting electric cylinder, and the center of wafer 9 can be supported by the sliding support pillar.

[0053] Furthermore, a level is installed at the center of the vacuum chuck 1 (i.e., the upper end of the sliding support column). The level makes a preliminary judgment on the horizontal state of the wafer 9 surface. When the droplet inside the level is in the center position, it can be preliminarily determined that the wafer 9 is in a horizontal state. The horizontal state needs to be further accurately judged using the autocollimator 8. Moreover, a mounting groove is specially added at the center of the vacuum chuck 1 for mounting the level. The depth of the mounting groove of the vacuum chuck 1 is greater than the height of the level to avoid affecting the orientation of the wafer 9 when the level is placed.

[0054] In this embodiment, the upper surface of the vacuum chuck 1 is provided with a transfer slot 104, the depth of which is 5mm. The purpose of setting the transfer slot 104 is to facilitate the transfer of the wafer 9 on the vacuum chuck 1 by the robotic arm, which can be an existing Bernoulli mechanical finger.

[0055] In this embodiment, three telescopic springs 6 connect the upper skirt 2 and the lower skirt 3. Specifically, the lower surface of the upper skirt 2 and the upper surface of the lower skirt 3 are each provided with three corresponding spring grooves for installing the springs. The three telescopic springs 6 are also located at the three vertices of an equilateral triangle, with the distance from the telescopic spring 6 to the center of the triangle being 100mm. The three telescopic springs 6 are staggered with the three adjusting telescopic rods 7 to ensure the vertical positioning of the upper skirt 2 and the lower skirt 3.

[0056] In this embodiment, both the upper skirt 2 and the lower skirt 3 are cylindrical structures, and a sealing cover is provided at the center of the upper end of the upper skirt 2 and the lower end of the lower skirt 3, so that the upper skirt 2 and the lower skirt 3 are both cover-shaped and arranged opposite to each other. The inner diameter of the upper skirt 2 is larger than the outer diameter of the lower skirt 3, so that the lower skirt 3 can be inserted into the interior of the upper skirt 2.

[0057] An annular air pressure groove 201 is provided on the inner wall of the upper skirt 2, and the air pressure groove 201 is located at half the height of the upper skirt 2. An air blowing pipe is fixed inside the air pressure groove 201, and multiple air blowing holes are evenly distributed on the air blowing pipe. Specifically, there are 12 air blowing holes, one at every 30°. One end of the air blowing pipe is connected to an air pump, and the air pump blows air through the air blowing pipe to the outer wall of the lower skirt 3, so that there is a sufficiently uniform air pressure between the upper skirt 2 and the lower skirt 3, ensuring that the upper skirt 2 and the lower skirt 3 are in a stable state and their relative horizontal position is not easily affected by external factors.

[0058] In this embodiment, as Figure 1As shown, the two-dimensional moving platform 4 comprises a moving top plate 401, a moving middle plate 402 and a fixed bottom plate 403 arranged from top to bottom, wherein the moving top plate 401 is slidingly connected with the moving middle plate 402, the moving middle plate 402 is slidingly connected with the fixed bottom plate 403, and the sliding direction of the moving top plate 401 relative to the moving middle plate 402 is perpendicular to the sliding direction of the moving middle plate 402 relative to the fixed bottom plate 403, and the fixed bottom plate 403 is used for mounting on the ellipsometer.

[0059] Further, the moving top plate 401 and the moving middle plate 402 and the moving middle plate 402 and the fixed bottom plate 403 are provided with a straight line driving channel 404, a limiting channel 405, a measuring channel 406 and two guide channels 407, and the straight line driving channel 404, the limiting channel 405, the measuring channel 406 and the two guide channels 407 between the moving top plate 401 and the moving middle plate 402 or between the moving middle plate 402 and the fixed bottom plate 403 are perpendicular to each other, and the straight line driving channel 404 between the moving top plate 401 and the moving middle plate 402 and the straight line driving channel 404 between the moving middle plate 402 and the fixed bottom plate 403 are arranged perpendicular to each other. Since the straight line driving channel 404, the limiting channel 405, the measuring channel 406 and the two guide channels 407 between the moving top plate 401 and the moving middle plate 402 and between the moving middle plate 402 and the fixed bottom plate 403 are the same structure, only the straight line driving channel 404, the limiting channel 405, the measuring channel 406 and the two guide channels 407 between the moving middle plate 402 and the fixed bottom plate 403 will be described in detail below:

[0060] First of all, it needs to be pointed out that whether it is the straight line driving channel 404, the limiting channel 405, the measuring channel 406 or the two guide channels 407, it is a complete rectangular channel formed by the butt joint of the lower end of the half rectangular channel of the moving middle plate 402 and the upper end of the half rectangular channel of the fixed bottom plate 403.

[0061] Among them, the straight line driving channel 404 is located at the center position, the straight line motor is fixed in the straight line driving channel 404, the straight line motor is a mature technology, the main body of the straight line motor is fixed on the lower half rectangular channel of the straight line driving channel 404, and the sliding block on the straight line motor is fixed on the upper half rectangular channel of the straight line driving channel 404. The straight line motor is remotely controlled by the controller, when the straight line motor operates, the sliding block moves along the straight line, thereby driving the moving middle plate 402 above to move along the straight line.

[0062] The limiting channel 405 is located on one side of the straight line driving channel 404, and a photoelectric switch (also known as a photoelectric limiting switch or a photoelectric sensor) is arranged in the limiting channel 405. Preferably, an existing opposite-reflecting photoelectric switch is used. The photoelectric switch can be fixed on any one of the upper or lower half-rectangular channels in the limiting channel 405, and a shielding plate is arranged on the other half-rectangular channel. The photoelectric switch is electrically connected with the controller. With the operation of the linear motor, the moving intermediate plate 402 moves along the straight line until the shielding plate moves to the middle of the photoelectric switch and blocks the opposite-reflecting light. At this time, the photoelectric switch transmits a detection signal to the controller, and the controller controls the linear motor to stop running.

[0063] The measuring channel 406 is located on the side of the straight line driving channel 404 away from the limiting channel 405, and a grating ruler is arranged in the measuring channel 406. The scale grating and the grating reading head in the grating ruler are respectively fixed in the upper and lower half-rectangular channels of the measuring channel 406. The moving distance of the moving intermediate plate 402 is measured by the grating ruler, and the data is transmitted to the controller, so as to realize the accurate control of the linear motor. Further, two grating rulers are used for positioning in the embodiment, which are respectively responsible for the movement positions of the X-axis and the Y-axis. The total distance from the origin can be obtained by calculating the square root of the sum of the squares of the X-axis and the Y-axis. The angle value from the far point can be obtained by calculating the arctangent of the ratio of the X-axis to the Y-axis, that is, y / x=arctan(angle). The position of the wafer 9 can be more accurately determined by the physical quantities of distance and angle.

[0064] The two guide channels 407 are respectively arranged on the outermost sides of the two sides. A slide rail is arranged in the guide channel 407. Specifically, the slide rail is arranged in the lower half-rectangular channel of the guide channel 407, and the upper half-rectangular channel can be provided with a sliding block or a sliding groove matched with the slide rail, so as to realize the guiding effect of the moving intermediate plate 402.

[0065] The straight line driving channel 404, the limiting channel 405, the measuring channel 406 and the two guide channels 407 in the moving top plate 401 and the moving intermediate plate 402 are the same as the above structure, and will not be described here.

[0066] In actual application, the embodiment can realize comprehensive detection of a wafer 9 with a maximum diameter of 300 mm. A two-dimensional moving platform 4 with a movement range of 300 mm x 300 mm is used, and the step is 0.2 μm. The detection can be performed every 0.2 μm in the XY-axis direction.

[0067] In the embodiment, the lower end of the vacuum chuck 1 is provided with a chuck base 101, the chuck base 101 is a disc structure, a plurality of threaded holes are uniformly distributed on the edge circumference of the chuck base 101, the upper surface of the limiting upper skirt 2 is provided with a plurality of connecting holes, and the chuck base 101 is fixed on the upper end of the limiting upper skirt 2 through screws.

[0068] The upper surface of the chuck base 101 is provided with three electric telescopic supports 5, the central angles of two adjacent electric telescopic supports 5 are 120°, a laser ranging sensor is installed on the telescopic end of the electric telescopic support 5, the laser ranging sensor is electrically connected with the controller, and the laser ranging sensor is used for measuring the distance between the wafer 9 and the laser ranging sensor.

[0069] In the embodiment, the electric telescopic support 5 is an L-shaped structure, the electric telescopic support 5 includes a fixed vertical rod and a horizontal telescopic pipe, the fixed vertical rod is vertically arranged, and the horizontal telescopic pipe is horizontally arranged. The horizontal telescopic pipe includes a telescopic outer pipe and a telescopic inner pipe, the telescopic inner pipe is slidably connected to the inner wall of the telescopic outer pipe, one end of the telescopic outer pipe is fixed to the upper end of the fixed vertical rod, a telescopic electric cylinder is fixed in the telescopic outer pipe, the telescopic end of the telescopic electric cylinder is fixed to the telescopic inner pipe, and the telescopic electric cylinder is electrically connected with the controller. When the controller controls the telescopic electric cylinder to be telescoped, the telescopic inner pipe can be controlled to be telescoped, and the laser ranging sensor is fixed on the end of the telescopic inner pipe, so as to adjust the position of the laser ranging sensor, thereby measuring the distance of each position of the wafer 9, and ensuring that there is no gap between the wafer 9 and the vacuum chuck 1.

[0070] The principle and implementation mode of the present application are described by using specific examples in the present application, and the above embodiment is only used to help understand the method and core idea of the present application; meanwhile, for the general technical personnel in the field, according to the idea of the present application, the specific implementation mode and application range will be changed. In conclusion, the content of the specification should not be understood as the limitation of the present application.

Claims

1. A wafer non-destructive attitude adjustment device, characterized in that: The device includes a vacuum suction cup, an upper limiting skirt, a lower limiting skirt, a two-dimensional moving platform, and a controller. The vacuum suction cup is mounted on the upper end of the upper limiting skirt, and its upper surface has multiple suction holes for adsorbing wafers. The upper limiting skirt is positioned above the lower limiting skirt, and several adjusting telescopic rods are provided between the lower surface of the upper limiting skirt and the upper surface of the lower limiting skirt for adjusting the position of the upper limiting skirt. The lower limiting skirt is mounted on the two-dimensional moving platform, which can move the lower limiting skirt horizontally. Both the adjusting telescopic rods and the two-dimensional moving platform are electrically connected to the controller. The vacuum suction cup includes multiple wafer retaining rings arranged sequentially from the inside to the outside. A sliding support column is slidably connected to the center of the innermost wafer retaining ring. A lifting electric cylinder is provided at the lower end of the sliding support column. Multiple adsorption holes are evenly distributed in the circumferential direction of the sliding support column and each wafer retaining ring. The height of each wafer retaining ring gradually increases from the inside to the outside. A vertical outer edge is provided on the outer side of the outermost wafer retaining ring. Wafers of different sizes are placed on wafer retaining rings or sliding support columns of different sizes. The upper skirt of the limiting position is provided with a hemispherical groove, and the telescopic end of the adjusting telescopic rod is provided with a contact ball. The contact ball can enter into the hemispherical groove and abut against it. Both the upper skirt and the lower skirt are cylindrical structures. The inner diameter of the upper skirt is larger than the outer diameter of the lower skirt, so that the lower skirt can be inserted into the upper skirt. The inner wall of the upper skirt is provided with an annular air pressure groove. An air blowing pipe is fixed in the air pressure groove. Multiple air blowing holes are evenly distributed on the air blowing pipe. One end of the air blowing pipe is connected to an air pump. The adjusting telescopic rod is an adjusting electric cylinder, and there are three adjusting electric cylinders. The upper skirt of the limiting position is provided with three hemispherical grooves. The telescopic end of the adjusting electric cylinder is provided with a contact ball, and the contact ball abuts against the hemispherical groove. Three telescopic springs are connected between the upper skirt of the limiting position and the lower skirt of the limiting position. The three telescopic springs are respectively distributed alternately with the three adjusting telescopic rods. The lower end of the vacuum suction cup is provided with a suction cup base, which is fixed to the upper end of the limiting upper skirt by screws; the upper surface of the suction cup base is provided with three electric telescopic brackets, and a laser rangefinder sensor is installed on the telescopic end of the electric telescopic bracket.

2. The wafer non-destructive attitude adjustment device according to claim 1, characterized in that: The vacuum suction cup is made of ceramic.

3. The wafer non-destructive attitude adjustment device according to claim 1, characterized in that: A level is located at the center of the vacuum suction cup.

4. The wafer non-destructive attitude adjustment device according to claim 1, characterized in that: The upper surface of the vacuum suction cup is provided with a transfer slot.

5. The wafer non-destructive attitude adjustment device according to claim 1, characterized in that: The two-dimensional mobile platform includes a movable top plate, a movable middle plate, and a fixed bottom plate. The movable top plate and the movable middle plate are slidably connected, and the movable middle plate and the fixed bottom plate are slidably connected. A linear drive channel, a limiting channel, a measuring channel, and two guide channels are provided between the movable top plate and the movable middle plate, as well as between the movable middle plate and the fixed bottom plate. A linear motor is fixed inside the linear drive channel; A photoelectric switch is installed in the limiting channel; The measuring channel is equipped with a grating ruler; The guide channel is equipped with a slide rail.

6. The wafer non-destructive attitude adjustment device according to claim 1, characterized in that: The electric telescopic support has an L-shaped structure. The electric telescopic support includes a fixed vertical rod and a horizontal telescopic tube. The horizontal telescopic tube includes a telescopic outer tube and a telescopic inner tube. The telescopic inner tube is slidably connected to the inner wall of the telescopic outer tube. One end of the telescopic outer tube is fixed to the upper end of the fixed vertical rod. A telescopic electric cylinder is fixed inside the telescopic outer tube. The telescopic end of the telescopic electric cylinder is fixed to the telescopic inner tube.

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