Adjustment system, device and method

Abstract

An independent adjustment system for a fluid handling structure of a lithographic apparatus includes: an inspection system configured to inspect the fluid handling structure and determine one or more different adjustment types to be performed on a major surface of the fluid handling structure; and a conditioning device configured to perform the determined one or more different conditioning types on the major surface of the fluid treatment structure.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to EP application 22191309.8, filed on August 19, 2022, and its entire contents are incorporated herein by reference. Technical Field

[0003] The present invention relates to an independent adjustment system for adjusting a fluid handling structure. Background Art

[0004] A lithographic apparatus is a machine for applying a desired pattern to a substrate. A lithographic apparatus can be used to manufacture integrated circuits (ICs). A lithographic apparatus can, for example, project a pattern (also often referred to as a "design layout" or "design") of a pattern forming device (e.g., a mask) onto a layer of radiation-sensitive material (resist) on a substrate (e.g., a wafer). Known lithographic apparatus include so-called steppers, in which each target portion is irradiated by exposing the entire pattern onto the target portion at once, and so-called scanners, in which each target portion is irradiated by scanning the pattern through a radiation beam in a given direction (the "scanning" direction), while simultaneously scanning the substrate in a direction parallel or anti-parallel to that direction.

[0005] As semiconductor manufacturing processes continue to advance, the size of circuit elements continues to decrease, while the number of functional elements (such as transistors) per device has been steadily increasing for decades, a trend often referred to as "Moore's Law." To keep up with Moore's Law, the semiconductor industry is chasing technologies that can create smaller and smaller features. To project a pattern onto a substrate, photolithography equipment can use electromagnetic radiation. The wavelength of this radiation determines the minimum size of the features that can be patterned on the substrate. Typical wavelengths used today are 365nm (i-line), 248nm, 193nm, and 13.5nm.

[0006] The resolution of smaller features can be further improved by providing an immersion fluid with a relatively high refractive index (e.g. water) on the substrate during exposure. The effect of the immersion fluid is to enable imaging of smaller features because the wavelength of the exposure radiation in the fluid is shorter than that in the gas. The effect of the immersion fluid can also be viewed as increasing the effective numerical aperture (NA) of the system and increasing the depth of focus.

[0007] The fluid may be confined to a localized region between the projection system and the substrate of the lithographic apparatus by the fluid handling structure.During operation of the lithographic apparatus, the flow of the immersion fluid needs to be properly controlled.

[0008] There is a general need for improvements in techniques for maintaining and repairing fluid handling structures. Summary of the invention

[0009] According to a first aspect of the present invention, an independent adjustment system for a fluid handling structure of a lithography device is provided, comprising: an inspection system configured to inspect the fluid handling structure and determine one or more different adjustment types to be performed on the main surface of the fluid handling structure; and an adjustment device configured to perform the determined one or more different adjustment types on the main surface of the fluid handling structure.

[0010] According to a second aspect of the present invention, a regulation system and a fluid handling structure are provided; wherein: the regulation system is according to the first aspect; and the fluid handling structure is received by the regulation system.

[0011] According to a third aspect of the present invention, there is provided an apparatus in a clean room, comprising: a lithographic apparatus; and an adjustment system according to the first aspect.

[0012] According to a fourth aspect of the present invention, a method for re-adjusting a fluid handling structure of a lithographic device is provided, the method comprising: removing the fluid handling structure from the lithographic device; providing the fluid handling structure with an independent adjustment system; inspecting the fluid handling structure to determine one or more different adjustment types to be performed on a main surface of the fluid handling structure; and performing the determined one or more different adjustment types on the main surface of the fluid handling structure.

[0013] Additional embodiments, features, and advantages of the present invention as well as the structure and operation of various embodiments, features, and advantages of the present invention are described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Embodiments of the present invention will now be described by way of example with reference to the accompanying drawings, in which corresponding reference characters indicate corresponding parts, and in which:

[0015] Figure 1 A schematic overview of a lithographic apparatus is shown;

[0016] Figure 2a , Figure 2b , Figure 2c and Figure 2d Two different versions of a fluid handling system are depicted in cross-section, with the left and right sides of each version showing different features that may extend around the entire circumference;

[0017] Figure 3 A regulating system according to a first embodiment is schematically depicted.

[0018] Figure 4 A regulating system according to a second embodiment is schematically depicted.

[0019] The features shown in the figures are not necessarily drawn to scale, and the sizes and / or arrangements depicted are not limiting. It should be understood that the figures include optional features that may not be required by the present invention. In addition, not all features of the device are depicted in each figure, and only some components relevant to describing a particular feature may be shown in the figure. In the figures, the same parts are represented by the same reference numerals. DETAILED DESCRIPTION

[0020] In this document, the terms "radiation" and "beam" are used to cover all types of electromagnetic radiation, including ultraviolet radiation (e.g., having a wavelength of 365 nm, 248 nm, 193 nm, 157 nm or 126 nm).

[0021] The terms "reticle", "mask" or "patterning device" may be broadly interpreted as referring to a generic patterning device that can be used to impart a patterned cross-section to an incident radiation beam, corresponding to the pattern to be created in a target portion of the substrate. The term "light valve" may also be used in this context. In addition to classical masks (transmissive or reflective, binary, phase-shifting, hybrid, etc.), other examples of such patterning devices include programmable mirror arrays and programmable LCD arrays.

[0022] Figure 1 A lithographic apparatus is schematically shown. The lithographic apparatus comprises an illumination system (also referred to as an illuminator) IL configured to condition a radiation beam B (e.g., UV radiation or DUV radiation); a mask support (e.g., a mask stage) MT configured to support a pattern forming device (e.g., a mask) MA and connected to a first positioner PM configured to precisely position the pattern forming device MA according to certain parameters; a substrate support (e.g., a substrate stage) WT configured to support a substrate (e.g., a resist-coated wafer) W and connected to a second positioner PW configured to precisely position the substrate support WT according to certain parameters; and a projection system (e.g., a refractive projection lens system) PS configured to project a pattern imparted by the pattern forming device MA to the radiation beam B onto a target portion C (e.g., comprising one or more dies) of the substrate W. A controller 500 controls the overall operation of the apparatus. The controller 500 may be a centralized control system or a system of multiple independent sub-controllers within various subsystems of the lithographic apparatus.

[0023] In operation, the illumination system IL receives a radiation beam B from a radiation source SO, for example, via a beam delivery system BD. The illumination system IL may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic and / or other types of optical components, or any combination thereof, for directing, shaping and / or controlling the radiation. The illuminator IL may be used to condition the radiation beam B so that it has a desired spatial and angular intensity distribution in its cross-section in the plane of the patterning device MA.

[0024] The term "projection system" PS as used herein should be interpreted broadly to cover various types of projection systems, including refractive, reflective, catadioptric, anamorphic, magnetic, electromagnetic and / or electrostatic optical systems, or any combination thereof, to suit the exposure radiation used and / or other factors, such as the use of immersion liquid or the use of a vacuum. Any use of the term "projection lens" as used herein may be considered a synonym for the more general term "projection system" PS.

[0025] The lithographic apparatus is of a type in which at least a portion of the substrate W may be covered by an immersion liquid having a relatively high refractive index, such as water, so as to fill an immersion space 11 between the projection system PS and the substrate W - this is also known as immersion lithography. For more information on immersion technology, see US 6,952,253, which is incorporated herein by reference.

[0026] The lithographic apparatus may be of a type having two or more substrate supports WT (also referred to as a "dual stage type"). In such a "multi-stage type" machine, the substrate supports WT may be used in parallel, and / or a subsequent exposure preparation step of a substrate W may be performed on a substrate W located on one substrate support WT while another substrate W on another substrate support WT is used to expose a pattern on another substrate W.

[0027] In addition to the substrate support WT, the lithographic apparatus may comprise a measuring table (not shown in the figure). The measuring table is arranged to hold sensors and / or cleaning means. The sensors may be arranged to measure properties of the projection system PS or properties of the radiation beam B. The measuring table may hold a plurality of sensors. The cleaning means may be arranged to clean a part of the lithographic apparatus, for example a part of the projection system PS or a part of the system for providing immersion liquid. The measuring table may be moved under the projection system PS when the substrate support WT is away from the projection system PS.

[0028] In operation, a radiation beam B is incident on a patterning device (e.g. a mask MA) which is held on a mask support MT and is patterned by a pattern (design layout) on the patterning device MA. After passing through the mask MA, the radiation beam B passes through a projection system PS which focuses the beam onto a target portion C of the substrate W. With the aid of a second positioner PW and a position measurement system IF, the substrate support WT can be precisely moved, for example, in order to position different target portions C in the path of the radiation beam B in a focused and aligned position. Similarly, a first positioner PM and possibly another position sensor (not shown) are provided. Figure 1The patterning device MA (shown explicitly in FIG. 1 ) can be used to accurately position the path of the patterning device MA relative to the radiation beam B. The patterning device MA and the substrate W can be aligned using the mask alignment marks M1, M2 and the substrate alignment marks P1, P2. Although the substrate alignment marks P1, P2 are shown occupying dedicated target portions, they can be located in the space between target portions. When the substrate alignment marks P1, P2 are located between target portions C, they are referred to as scribe line alignment marks.

[0029] To illustrate the present invention, a Cartesian coordinate system is used. A Cartesian coordinate system has three axes, namely an x-axis, a y-axis and a z-axis. Each of the three axes is orthogonal to the other two axes. A rotation around the x-axis is called an Rx rotation. A rotation around the y-axis is called an Ry rotation. A rotation around the z-axis is called an Rz rotation. The x-axis and the y-axis define a horizontal plane, while the z-axis is in a vertical direction. The Cartesian coordinate system does not limit the present invention and is only used for illustration. On the contrary, another coordinate system (e.g., a cylindrical coordinate system) can be used to illustrate the present invention. The direction of the Cartesian coordinate system can be different, for example, so that the z-axis has a component along the horizontal plane.

[0030] Immersion technology has been introduced into lithography systems to improve the resolution of smaller features. In an immersion lithography apparatus, a layer of immersion liquid having a relatively high refractive index is placed in an immersion space 11 between the apparatus's projection system PS (through which a patterned light beam is projected onto the substrate W) and the substrate W. The immersion liquid covers at least a portion of the substrate W below the final element of the projection system PS. Thus, at least a portion of the substrate W being exposed is immersed in the immersion liquid.

[0031] In commercial immersion lithography, the immersion liquid is water. Typically, the water is high purity distilled water, such as ultrapure water (UPW) commonly used in semiconductor manufacturing plants. In an immersion system, the UPW is typically purified, and it may undergo additional processing steps before being supplied to the immersion space 11 as an immersion liquid. In addition to water, other liquids with a high refractive index may be used as immersion liquids, for example: hydrocarbons, such as fluorocarbons; and / or aqueous solutions. In addition, it has been envisioned that other fluids than liquids may be used in immersion lithography.

[0032] In this specification, reference will be made to local immersion in the description, wherein the immersion liquid is confined in use to an immersion space 11 between the final element 100 and a surface facing the final element 100. The facing surface is a surface of the substrate W or a surface of the support table (or substrate support WT) that is coplanar with a surface of the substrate W. (Note that references to the surface of the substrate W hereinafter also refer additionally or alternatively to the surface of the substrate support WT, unless otherwise expressly stated; and vice versa). A fluid handling structure 12 present between the projection system PS and the substrate support WT serves to confine the immersion liquid in the immersion space 11. The immersion space 11 filled with immersion liquid is smaller in plane than the top surface of the substrate W, and the immersion space 11 remains substantially stationary relative to the projection system PS, while the substrate W and the substrate support WT move underneath.

[0033] Other immersion systems have been envisaged, such as unconfined immersion systems (so-called "all-wet" immersion systems) and bath-type immersion systems. In an unconfined immersion system, the immersion liquid covers more than just the surface below the final element 100. The liquid outside the immersion space 11 is in the form of a thin liquid film. The liquid may cover the entire surface of the substrate W, even the substrate W and a substrate support WT coplanar with the substrate W. In a bath-type system, the substrate W is completely immersed in a bath of immersion liquid.

[0034] The fluid handling structure 12 is a structure that supplies immersion liquid to the immersion space 11, removes immersion liquid from the immersion space 11 and thereby confines the immersion liquid in the immersion space 11. It includes features that are part of a fluid supply system. The device disclosed in PCT patent application publication number WO 99 / 49504 is an early fluid handling structure that includes pipes that supply or recover immersion liquid in the immersion space 11 and operate according to the relative movement of the stage under the projection system PS. In more recent designs, the fluid handling structure extends along at least a part of the boundary of the immersion space 11 between the final element 100 of the projection system PS and the substrate support WT or substrate W, thereby partially defining the immersion space 11.

[0035] The fluid handling structure 12 can have a variety of different functions. Each function can be derived from a corresponding feature that enables the fluid handling structure 12 to perform that function. The fluid handling structure 12 can be represented by many different terms, each of which refers to a function, such as a barrier member, a sealing member, a fluid supply system, a fluid removal system, a liquid confinement structure, etc.

[0036] As a barrier member, the fluid handling structure 12 is a barrier to the outflow of immersion liquid from the immersion space 11. As a liquid confinement structure, the structure confines the immersion liquid within the immersion space 11. As a sealing member, the sealing features of the fluid handling structure 12 form a seal to confine the immersion liquid within the immersion space 11. The sealing features may include an additional gas flow from an opening in the surface of the sealing member, such as an air knife.

[0037] In one embodiment, the fluid handling structure 12 may supply immersion fluid and thereby be a fluid supply system.

[0038] In one embodiment, the fluid handling structure 12 may at least partially confine the immersion fluid, thereby becoming a fluid confinement system.

[0039] In one embodiment, the fluid handling structure 12 may provide a barrier to the immersion fluid, thereby being a barrier member, such as a fluid confinement structure.

[0040] In one embodiment, the fluid handling structure 12 may generate or use a gas flow, for example to help control the flow and / or position of the immersion fluid.

[0041] The flow of gas may form a seal to confine the immersion fluid and thus the fluid handling structure 12 may be referred to as a sealing member; such a sealing member may be a fluid confinement structure.

[0042] In one embodiment, an immersion liquid is used as the immersion liquid. In this case, the fluid handling structure 12 may be a liquid handling system. With reference to the above description, references in this paragraph to features defined relative to a fluid may be understood to include features defined relative to a liquid.

[0043] The lithographic apparatus has a projection system PS. During exposure of the substrate W, the projection system PS projects a patterned radiation beam onto the substrate W. In order to reach the substrate W, the path of the radiation beam B from the projection system PS passes through an immersion liquid confined by a fluid handling structure 12 between the projection system PS and the substrate W. The projection system PS has a lens element, which is the final element in the beam path, which is in contact with the immersion liquid. This lens element in contact with the immersion liquid may be referred to as the "last lens element" or the "final element". The final element 100 is at least partially surrounded by the fluid handling structure 12. The fluid handling structure 12 may confine the immersion liquid below the final element 100 and above the facing surface.

[0044] Figure 2a , Figure 2b , Figure 2c and Figure 2d Different features that may exist in variations of the fluid handling system are shown. Unless otherwise noted, the design may vary. Figure 2a , Figure 2b, Figure 2c and Figure 2d The features described herein may be selected individually or in combination as shown in the figures or as desired. The figures depict different versions of the fluid handling system, with different features shown on the left and right sides, which may extend around the entire circumference. Thus, for example, the fluid handling system may have the same features extending around the entire circumference. For example, the fluid handling system may only have Figure 2a The feature on the left side of Figure 2a The feature on the right side of Figure 2b The feature on the left side of Figure 2b , or the features on the left side of 2c, or the features on the right side of 2c, or the features on the left side of 2d, or the features on the right side of 2d. Alternatively, the fluid handling system may provide any combination of the features in these figures at different positions of the circumference. The fluid handling system may include a fluid handling structure 12 as described in the following variations.

[0045] Figure 2a A fluid handling structure 12 is shown around the bottom surface of the final element 100. The final element 100 has an inverted frustoconical shape. The frustoconical shape has a planar bottom surface and a conical surface. The frustoconical shape protrudes from the plane and has a bottom plane. The bottom plane is an optically active portion of the bottom surface of the final element 100 through which the radiation beam B can pass. The final element 100 may have a coating 30. The fluid handling structure 12 surrounds at least a portion of the frustoconical shape. The fluid handling structure 12 has an inner surface facing the conical surface of the frustoconical shape. The inner surface and the conical surface may have complementary shapes. The top surface of the fluid handling structure 12 may be substantially planar. The fluid handling structure 12 may be mounted around the frustoconical shape of the final element 100. The bottom surface of the fluid handling structure 12 may be substantially planar, and in use, the bottom surface may be parallel to the facing surface of the substrate support WT and / or the substrate W. Therefore, the bottom surface of the fluid handling structure 12 may be referred to as a surface facing the surface of the substrate W. The distance between the bottom surface and the facing surface may be in the range of 30 to 500 microns, preferably in the range of 80 to 200 microns.

[0046] The fluid handling structure 12 is closer to the facing surfaces of the substrate W and the substrate support WT than the final element 100. Thus, an immersion space 11 is defined between the inner surface of the fluid handling structure 12, the plane of the frustoconical portion and the facing surface. During use, the immersion space 11 is filled with immersion liquid. The immersion liquid fills at least part of the buffer space between the complementary surfaces between the final element 100 and the fluid handling structure 12 and, in an embodiment, fills at least part of the space between the complementary inner surface and the conical surface.

[0047] Immersion liquid is supplied to the immersion space 11 through openings formed in the surface of the fluid handling structure 12. The immersion liquid may be supplied through supply openings 20 in the inner surface of the fluid handling structure 12. Alternatively or additionally, the immersion liquid is supplied from a lower supply opening 23 formed in the bottom surface of the fluid handling structure 12. The lower supply opening 23 may surround the path of the radiation beam B and may be formed by a series of openings in an array or by a single slit. Immersion liquid is supplied to fill the immersion space 11 so that the flow through the immersion space 11 below the projection system PS is laminar or at least well defined. Supplying immersion liquid from the lower supply opening 23 may also prevent air bubbles from entering the immersion space 11. Such a supply of immersion liquid may act as a liquid seal.

[0048] The immersion liquid may be recovered from a recovery opening 21 formed in the inner surface. The recovery of the immersion liquid through the recovery opening 21 may be achieved by applying a negative pressure; the recovery through the recovery opening 21 is the result of the speed at which the immersion liquid flows through the immersion space 11; or the recovery may be the result of both. When viewed in plan, the recovery opening 21 may be located on the opposite side of the supply opening 20. Additionally or alternatively, the immersion liquid may be recovered by an overflow recovery member 24 located on the top surface of the fluid handling structure 12. The functions of the supply opening 20 and the recovery opening 21 may be interchangeable (i.e. the flow direction of the liquid is opposite). This allows the flow direction to be changed according to the relative movement of the fluid handling structure 12 and the substrate W.

[0049] Additionally or alternatively, the immersion liquid may be recovered from below the fluid handling structure 12 via a recovery opening 25 formed in its bottom surface. The recovery opening 25 may be used to maintain a meniscus 33 of the immersion liquid to the fluid handling structure 12. The meniscus 33 is formed between the fluid handling structure 12 and the facing surface and serves as a boundary between the liquid space and the gaseous external environment. The recovery opening 25 may be a porous plate that may recover the immersion liquid in the form of a single-phase flow. The recovery openings in the bottom surface may be a series of fixed openings 32 through which the immersion liquid is recovered. The fixed openings 32 may recover the immersion liquid in the form of a two-phase flow.

[0050] Optionally, radially outwardly relative to the inner surface of the fluid handling structure 12 is an air knife opening 26. Gas can be supplied through the air knife opening 26 at a relatively high velocity to assist in confining the immersion liquid in the immersion space 11. The supplied gas can be humidified and it can contain a large amount of carbon dioxide. Radially outwardly of the air knife opening 26 is a gas recovery opening 28 for recovering the gas supplied through the air knife opening 26.

[0051] There may be other openings in the bottom surface of the fluid handling structure 12 (ie the surface of the fluid handling structure 12 facing the substrate W), for example to the atmosphere or a gas source or vacuum. Examples of such optional other openings 50 are shown in FIG. Figure 2a , is shown in dotted lines on the right side. As shown, other openings 50 can be supply or extraction components, which are represented by double-headed arrows. For example, if configured to supply, other openings 50 can be connected to a liquid supply or a gas supply like any supply component. Alternatively, if configured to extract, other openings 50 can be used to extract fluid and can, for example, be connected to the atmosphere or a gas source or a vacuum. For example, at least one additional opening 50 may be present between the air knife opening 26 and the gas recovery opening 28, and / or between the fixed opening 32 and the air knife opening 26. In an alternative arrangement, the fluid handling structure 12 may include a fixed opening 32, an air knife opening 26 and an optional lower supply opening 23. The supply opening 20 or the recovery opening 21 may be formed in the inner surface of the fluid handling structure 12.

[0052] Figure 2a The two different forms of the fluid handling structures 12 on the left and right sides fix the meniscus 33. Since the position of the fixed opening 32 is fixed, Figure 2a The version of the fluid handling structure 12 on the right may hold the meniscus 33 in a substantially fixed position relative to the final element 100 . Figure 2a The version of the fluid handling structure 12 on the left can fix the meniscus 33 below the recovery opening 25 so that the meniscus 33 can move along the length and / or width of the recovery opening 25. In order to direct the radiation beam B to the entire side of the substrate W under exposure, the substrate support WT supporting the substrate W moves relative to the projection system PS. In order to maximize the output of the substrate W exposed by the lithographic equipment, the substrate support WT (and the substrate W) moves as fast as possible. However, there is a critical relative speed (commonly referred to as the critical scanning speed) above which the meniscus 33 between the fluid handling structure 12 and the substrate W becomes unstable. An unstable meniscus 33 is more likely to lose immersion liquid, for example in the form of one or more droplets. In addition, an unstable meniscus 33 is more likely to cause bubbles to be entrained in the immersion liquid, especially when the confined immersion liquid passes through the edge of the substrate W.

[0053] Droplets may apply heat loads and may be a source of defects. Droplets may evaporate leaving dry stains, may move and transport contaminants (such as particles), may collide with a larger body of immersion liquid and introduce bubbles into the larger body and may evaporate, applying heat loads to the surface on which they are located. If the surface is related to the positioning of a component of the lithographic apparatus relative to the substrate W being imaged, then such heat loads may become a cause of deformation and / or a source of positioning errors. Therefore, it is undesirable to form droplets on the surface. In order to avoid the formation of such droplets, the speed of the substrate support WT is therefore limited to a critical scanning speed at which the meniscus 33 remains stable. This limits the throughput of the lithographic apparatus.

[0054] Figure 2aThe left side of the fluid handling system in FIG. 1 may include a spring 60. The spring 60 may be an adjustable passive spring configured to apply a biasing force to the fluid handling structure 12 in the direction of the substrate W. Thus, the spring 60 may be used to control the height of the fluid handling structure 12 above the substrate W. Such an adjustable passive spring is described in US 7,199,874, which is incorporated herein by reference in its entirety. Other biasing devices may also be suitable, for example, using electromagnetic force. Although the spring 60 is shown in FIG. 1 , the spring 60 may be a biasing force applied ... Figure 2a , but it is optional and does not need to be associated with Figure 2a The spring 60 is not shown in any other figure, but can also be included with respect to Figure 2a , Figure 2b , Figure 2c or Figure 2d Other variations of the described fluid handling systems are included herein.

[0055] Figure 2b To the left and right thereof are shown two different versions of the fluid handling structure 12, which allow the meniscus 33 to move relative to the final element 100. The meniscus 33 can move in the direction of the moving substrate W. This reduces the relative speed between the meniscus 33 and the moving substrate W, which can improve stability and reduce the risk of the meniscus 33 breaking. The substrate W speed at which the meniscus 33 breaks is increased, allowing the substrate W to move faster under the projection system PS. Thus, the throughput is increased.

[0056] Figure 2b As shown in Figure 2a Like features have like reference numerals.The fluid handling structure 12 has an inner surface which is complementary to the conical surface of the frustoconical shape.The bottom surface of the fluid handling structure 12 is closer to the facing surface than the bottom plane of the frustoconical shape.

[0057] Immersion liquid is supplied to the immersion space 11 through supply openings 34 formed in the inner surface of the fluid handling structure 12. The supply openings 34 are located at the bottom of the inner surface, possibly below the bottom of the frustoconical shape. The supply openings 34 are located around the inner surface, spaced around the path of the radiation beam B.

[0058] The immersion liquid is recovered from the immersion space 11 through the recovery opening 25 in the bottom surface of the fluid handling structure 12. When the facing surface moves under the fluid handling structure 12, the meniscus 33 may migrate on the surface of the recovery opening 25 in the same direction as the movement of the facing surface. The recovery opening 25 may be formed by a porous member. The immersion liquid may be recovered in a single phase. The immersion liquid may be recovered in a two-phase flow. The two-phase flow is received in a chamber 35 within the fluid handling structure 12, where it is separated into liquid and gas. The liquid and gas are recovered from the chamber 35 through separate channels 36, 38.

[0059] An inner periphery 39 of the bottom surface of the fluid handling structure 12 extends into the immersion space 11 away from the inner surface to form a plate 40. The inner periphery 39 forms a small aperture, the size of which may be matched to the shape and size of the radiation beam B. The plate 40 may be used to isolate immersion liquid on either side thereof. The supplied immersion liquid flows inwardly towards the aperture, through the inner aperture, and then flows radially outwardly beneath the plate 40 towards the surrounding recovery openings 25.

[0060] The fluid handling structure 12 can be divided into two parts, such as Figure 2b Shown on the right: inner part 12a and outer part 12b. The inner part 12a and outer part 12b are movable relative to each other, mainly in a plane parallel to the facing surfaces. The inner part 12a may have a supply opening 34 and may have an overflow recovery member 24. The outer part 12b may have a plate 40 and a recovery opening 25. The inner part 12a may have an intermediate recovery member 42 for recovering immersion liquid flowing between the inner part 12a and the outer part 12b.

[0061] therefore, Figure 2b The two different versions of the fluid handling structure allow the meniscus 33 to move in the same direction as the substrate W, thereby achieving a faster scanning speed and improving the throughput of the lithography apparatus. Figure 2b The speed of migration on the surface of the recovery opening 25 in the fluid handling structure 12 on the left may be very slow. Figure 2b The fluid handling structure 12 on the right allows the meniscus 33 to move faster by moving the outer portion 12b relative to the inner portion 12a and the final element 100. However, it may be difficult to control the intermediate recovery 42 to ensure that sufficient immersion liquid is provided between the inner portion 12a and the outer portion 12b to prevent contact between them. Embodiments may also include a liquid supply provided in the moving outer portion 12b.

[0062] Figure 2c On the left and right sides thereof are shown two different versions of the fluid handling structure 12 which may be used to secure a meniscus 33 of immersion liquid to the fluid handling structure 12 as described above with respect to Figure 2a and / or Figure 2b described. Figure 2c As shown in Figure 2a and / or Figure 2b Common features share the same reference number.

[0063] The fluid handling structure 12 has an inner surface that is complementary to the conical surface of the truncated cone. The bottom surface of the fluid handling structure 12 is closer to the facing surface than the bottom plane of the truncated cone. The immersion liquid is delivered to the immersion space 11 through an opening formed in the surface of the fluid handling structure 12. The immersion liquid can be supplied through the supply opening 34 in the inner surface of the fluid structure 12. Alternatively or additionally, the immersion liquid can be supplied through the supply opening 20 in the inner surface of the fluid structure 12. Alternatively or additionally, the immersion liquid is supplied through the lower supply opening 23. The immersion liquid can be recovered by an extraction member, for example, through a recovery opening 21 formed in the inner surface and / or an overflow recovery member 24 and / or one or more openings in the surface of the fluid handling structure 12, as described below.

[0064] Two different versions of the fluid handling structure 12 fix the meniscus 33. Since the position of the recovery opening 32a is fixed, Figure 2c The version of the fluid handling structure 12 on the right may hold the meniscus 33 in a substantially fixed position relative to the final element 100 . Figure 2c The left version of the fluid handling structure 12 can fix the meniscus 33 below the recovery opening 25 so that the meniscus 33 can move along the length and / or width of the recovery opening 25.

[0065] As mentioned above about Figure 2b As described, the inner periphery of the bottom surface of the fluid handling structure 12 may extend into the immersion space 11 away from the inner surface to form a plate 40, as shown on the left hand side. As described above, this may form a small hole and may isolate the immersion liquid on either side and / or allow the immersion liquid to flow inwardly towards the aperture, through the inner aperture, and then radially outwardly under the plate 40 to the surrounding recovery openings 25. Although this feature is not Figure 2c , but it may be used in combination with the other features shown. Preferably, as shown on the left hand side, immersion liquid is supplied to the immersion space 11 through supply openings 34 formed in the inner surface of the fluid handling structure 12. The supply openings 34 are located at the bottom of the inner surface, possibly below the bottom surface of the frustoconical shape. The supply openings 34 are located around the inner surface, spaced around the path of the radiation beam B. Alternatively or additionally, the immersion liquid may be supplied through supply openings 20 in the inner surface of the fluid structure 12. Alternatively or additionally, the immersion liquid is supplied through lower supply openings 23. Although supply openings 34 are the preferred liquid supply, any combination of supply openings 34, supply openings 20 and / or lower supply openings 23 may be provided.

[0066] like Figure 2cAs shown on the left, the fluid handling system may include a fluid handling structure 12 as described above and another device 3000. The fluid handling structure 12 may have an extraction member (e.g., recovery opening 25) and a liquid supply opening (e.g., lower supply opening 23). It should be understood that the fluid handling structure 12 may include a fluid handling structure 12 and a liquid supply opening (e.g., lower supply opening 23). Figure 2a Left side, Figure 2a Right side, Figure 2b Left side, Figure 2b Right or (as described below) Figure 2c Any configuration related to the right side and used in combination with another device 3000.

[0067] The additional device 3000 may also be referred to as a droplet catcher. The additional device 3000 is used to reduce the presence of liquid on the surface of the substrate W after the fluid handling structure 12 is moved onto the surface. The additional device 3000 may include a liquid supply member 3010 and at least one extraction member 3020. The at least one extraction member 3020 may be formed in a shape that surrounds the at least one supply member 3010 in a plane. The at least one liquid supply member 3010 may be configured to provide additional liquid to a space 3110 located between at least a portion of the additional device 3000 and the surface of the substrate W. The additional device 3000 may be configured to recover at least part of the liquid by at least one extraction member 3020. The additional device 3000 may be used to combine any liquid remaining on the surface of the substrate W with the liquid in the space 3110, and then extract the liquid using the additional device 3000, thereby reducing the amount of liquid remaining on the surface of the substrate W.

[0068] exist Figure 2c , the further device 3000 is shown as a separate device from the fluid handling structure 12. The further device 3000 may be positioned adjacent to the fluid handling structure 12. Alternatively, the further device 3000 may be part of the fluid handling structure 12, i.e., integrated with the fluid handling structure 12 (e.g., Figure 2d shown, however, either arrangement may be selected).

[0069] The further device 3000 may be configured to provide a liquid to the space 3110 that is separate from the liquid provided by the fluid handling structure 12 .

[0070] Additionally or alternatively, the fluid handling structure 12 may have a Figure 2cComponents shown on the right. More specifically, the fluid handling structure 12 may include at least one liquid supply member formed on the surface of the fluid handling structure 12, two extraction members (e.g., recovery openings 32a and 32b) and two gas supply members (e.g., gas supply openings 27a and 27b). The gas supply opening 27a may be omitted, i.e., is optional. At least one liquid supply member may be the same as the lower supply opening 23 in the bottom surface of the fluid handling structure 12 or the supply opening 20 or liquid supply opening 34 formed on the inner surface of the fluid handling structure 12, as described above. Figure 2b As shown on the left, the liquid supply member, the extraction member and the gas supply member may be formed on the surface of the fluid handling structure 12. Specifically, these components may be formed on the surface of the fluid handling structure 12 facing the substrate W, that is, the bottom surface of the fluid handling structure 12.

[0071] At least one of the two extraction members may include a porous material 37. The porous material 37 may be disposed within an opening, such as the recovery opening 32a, through which the fluid handling structure 12 extracts fluid from below the fluid handling structure 12 and may recover immersion liquid in a single-phase flow. The other of the two extraction members, such as the recovery opening 32b, may function as a two-phase extractor to recover immersion fluid. The porous material 37 need not be flush with the bottom surface of the fluid handling structure 12.

[0072] Specifically, the fluid handling structure 12 may include a liquid supply member (e.g., below the supply opening 23), wherein a first extraction member (e.g., recovery opening 32a) is radially located outside the liquid supply member, and a first gas supply member (e.g., gas supply opening 27a) is radially located outside the liquid supply member. The first extraction member extends outward, while the second extraction member (e.g., recovery opening 32b) extends radially. The first gas supply member extends outward, and the second gas supply member (e.g., gas supply opening 27b) extends radially outside the second extraction member. Figure 2a Similarly, other openings may be present in the bottom surface of the fluid handling structure 12, for example to the atmosphere or a gas source or a vacuum, as previously described (with respect to the fluid handling structure 12).

[0073] For example, at least one additional opening (not shown) may be provided in the bottom surface of the fluid handling structure 12. The additional opening is optional. The additional opening may be arranged between the first extraction member (e.g., recovery opening 32a) and the first gas supply member (e.g., gas supply opening 27a), as described above. Alternatively or additionally, the additional opening may be arranged between the second extraction member (e.g., recovery opening 32b) and the second gas supply member (e.g., gas supply opening 27b), as described above. The additional opening may be the same as the additional opening 50 described above.

[0074] Optionally, the fluid handling structure 12 includes a groove 29. The groove 29 may be disposed between the recovery opening 32a and the recovery opening 32b or between the gas supply opening 27a and the recovery opening 32b. The shape of the groove 29 may uniformly surround the fluid handling structure 12 and may optionally include an inclined surface. In the case where the groove 29 is disposed between the recovery opening 32a and the recovery opening 32b, the gas supply opening 27b may be disposed on the inclined surface, such as Figure 2c As shown. In the case where a groove 29 is provided between the supply opening 27a and the recovery opening 32b, the gas supply opening 27b may be provided on a portion of an inclined surface or a bottom surface of the fluid handling structure 12 that is parallel to the surface of the substrate W. Alternatively, the shape of the groove 29 may vary around the circumference of the fluid handling structure 12. The shape of the groove 29 may vary to change the effect of the gas supplied from the gas supply member on the fluid below the fluid handling structure 12. The groove 29 may also be a negative groove, i.e., a protruding structure that reduces the interval between the fluid handling structure 12 and the substrate W.

[0075] Figure 2d Two different versions of the fluid handling structure 12 are shown in the left and right halves thereof. Figure 2d The left half of the fluid handling structure 12 has a liquid injection buffer 41a that contains a buffered amount of immersion liquid, and a liquid injection hole 41 that supplies the immersion liquid from the liquid injection buffer to the space 11. The outer side of the liquid injection hole 41 is an inner liquid recovery aperture 43 for guiding the liquid to an inner recovery buffer 43a provided with a porous member. Figure 2c A similar groove 29 is described in detail in the drawings. On the outside of the groove 29, in the lower surface of the fluid handling structure 12, there is a gas guide groove 44, in which an outer recovery hole 44a is opened. The outer recovery hole 44a guides the two-phase recovery flow to an outer recovery buffer 44b which is also provided with a porous component. The outermost is an air-sealing hole 45, which connects the air-sealing buffer volume 45a and the space below the fluid handling structure 12 to provide an air flow to accommodate the immersion liquid. In the above embodiment, the curved liquid surface 33 can be fixed on the recovery opening 32a, or it can be movable.

[0076] The fluid handling structure 12 has a liquid supply opening 20 in its inner inclined face. On the underside of the fluid handling structure 12, there are (from the inside to the outside) an extraction opening 25 with a porous member 37; a first gas knife opening 26a, a second gas knife opening 26b and a third gas knife opening 26c. Each of these openings leads to a groove on the underside of the fluid handling structure 12, which provides a buffer volume. The outermost part of the fluid handling structure 12 is stepped, thereby providing greater separation between the fluid handling structure 12 and the substrate W.

[0077] Figure 2a to Figure 2d The example of different configurations that can be used as a part of a fluid treatment system is shown.It should be understood that the examples provided above relate to specific extraction members and recovery members, but it is not necessary to use the extraction members and / or recovery members of the exact type.In some cases, different terms are used to indicate the position of the member, but the same functional characteristics can be provided.The example of the extraction member mentioned above includes recovery opening 21, overflow recovery member 24, recovery opening 25 (may include perforated plate and / or chamber 35), gas recovery opening 28, fixed opening 32, recovery opening 32a, recovery opening 32b and / or intermediate recovery member 42.The example of the supply member mentioned above includes supply opening 20, lower supply opening 23, air knife opening 26, gas supply opening 27a, gas supply opening 27b and / or supply opening 34.In general, the extraction member for extracting / recovering fluid, liquid or gas can be interchanged with at least any other example of extracting / recovering fluid, liquid or gas respectively.Similarly, the supply member for supplying fluid, liquid or gas can be interchanged with at least any other example of supplying fluid, liquid or gas respectively. The extraction member may extract / recover fluid, liquid or gas from the space by connecting to a negative pressure that draws the fluid, liquid or gas into the extraction member. The supply member may supply fluid, liquid or gas to the space by connecting to a relevant supply.

[0078] As mentioned above, immersion liquid can be extracted from the immersion space 11 (also referred to herein as liquid confinement space 11) by means of extraction means. Figure 2a , Figure 2c and Figure 2d As shown, the extraction member may be a recovery opening 21. From a plan view, the extraction member may be located on the opposite side of the supply opening 20. The extraction member may extract liquid and gas. The supply opening 20 may supply liquid. Both the extraction member and the supply opening 20 may be provided in an inner surface (i.e., a wall) facing the conical surface of the truncated cone shape of the final element 100. Therefore, water may continuously flow through the liquid confinement space 11 around the final element 100.

[0079] As previously mentioned, the fluid handling system may include a fluid handling structure 12 and / or an additional device 3000. The fluid handling system typically includes at least one substantially flat bottom surface, and in use, at least one bottom surface may be parallel to the facing surface of the substrate support WT and / or the substrate W. Therefore, the at least one bottom surface of the fluid handling system may be referred to as a substrate-facing surface 200 of the fluid handling system. The substrate-facing substrate 200 may be a surface of the fluid handling structure 12. The substrate-facing substrate 200 may be a surface of the additional device 3000. The substrate-facing substrate 200 may be any other surface of the fluid handling system that faces the substrate W. In addition, the substrate-facing surface 200 may be a combination of substrate-facing surfaces of the fluid handling system. For example, the substrate-facing surface 200 may include one or more surfaces of the fluid handling structure 12 and one or more surfaces of the additional device 3000.

[0080] like Figures 2a to 2d As shown in the configuration, the surface 200 facing the substrate may be provided with one or more openings. One or more openings may include, but are not limited to, a fluid supply member and / or a fluid extraction member. Examples of fluid extraction members include, but are not limited to, recovery openings 25, gas recovery openings 28, fixed openings 32, recovery openings 32a, recovery openings 32b, extraction members 3020, liquid recovery apertures 43, and / or external recovery holes 44a. The fluid extraction member may also be any other opening for extracting / recovering fluids, liquids, and / or gases. Examples of fluid supply members include lower supply openings 23, gas knife openings 26, gas supply openings 27a, gas supply openings 27b, liquid supply members 3010, and / or liquid injection holes 41b. The fluid supply member may also be any other opening for supplying fluids, liquids, and / or gases. One or more openings in the surface 200 facing the substrate may alternatively or additionally include other openings, such as additional openings 50 and / or gas sealing holes 45. One or more openings in the surface 200 facing the substrate may include openings for single-phase or two-phase flow of fluids.

[0081] The one or more openings in the substrate-facing surface 200 may be used to provide immersion fluid to the immersion space 11, to remove immersion fluid from the immersion space 11, and / or to retain immersion fluid in the immersion space 11. The ability of the one or more openings to achieve or accomplish one or more of these purposes may be adversely affected by manufacturing defects, blockages, contamination, and / or any other defects of the openings. For example, blockage of an immersion fluid supply component may reduce the flow rate of immersion fluid into the immersion space 11, which may result in insufficient immersion fluid in the immersion space 11. As another example, blockage of an immersion fluid extraction component may reduce the extraction capacity of the immersion fluid extraction component, which may result in overflow of immersion fluid in the immersion space 11. As another example, blockage of an air knife opening 26 may reduce the pressure in an air seal used to retain immersion fluid in the immersion space 11, which may result in immersion fluid escaping from the immersion space 11.

[0082] Therefore, any defects in one or more openings in the substrate-facing surface 200 may adversely affect the performance of the fluid handling system, and in turn may adversely affect the performance of the lithographic apparatus.

[0083] As described above, the fluid handling system may include a fluid handling structure 12, which includes an opening in a surface facing the substrate. The fluid handling structure 12 may also be referred to as an immersion hood (IH). When a defect occurs in the fluid handling structure 12, such as one or more openings in its surface facing the substrate are blocked, the fluid handling structure 12 needs to be taken out of service. As is well known, the fluid handling structure 12 is then returned to its supplier. The supplier of the fluid handling structure 12 may fully repair and requalify the fluid handling structure 12 before returning it to its place of use. This is a very inefficient and slow process, especially because the supplier may be located at the other end of the place where the fluid handling structure 12 is used. In addition, most of the fluid handling structures 12 that are taken out of service only require cleaning and / or minor repairs.

[0084] Embodiments improve upon known techniques by providing a self-contained conditioning system for reconditioning a fluid handling structure near the point of use. Embodiments of the conditioning system can perform a variety of processes to clean and / or repair a fluid handling structure.

[0085] The adjustment system according to the embodiment can be located in the same clean room where the lithographic equipment is located. The adjustment system can be an independent system that operates independently of the lithographic equipment. When it is determined that the fluid handling structure contained in the lithographic equipment needs to be readjusted, the fluid handling structure can be moved to the adjustment system, where it is readjusted. The fluid handling structure can be replaced after being readjusted in the lithographic equipment. Alternatively, different fluid handling structures stored in the adjustment system can be installed in the lithographic equipment. Therefore, the downtime of the lithographic equipment is much shorter than that of the known technology. The downtime can be minimized.

[0086] Figure 3 A regulating system 301 according to a first embodiment is schematically shown.

[0087] The regulation system 301 of the first embodiment may include a container for receiving a fluid handling structure 304. The fluid handling structure 304 may be, for example, Figure 2a-2d The adjustment system 301 may include an adjustment device 307 for adjusting the fluid handling structure 304 held by the container. The adjustment system 301 may include an inspection system that can inspect at least a portion of the fluid handling structure 304. The inspection system can determine one or more different types of adjustments to be performed on the fluid handling structure 304. The adjustment device 307 can then automatically perform a process of cleaning and / or repairing the fluid handling structure 304.

[0088] The regulating system 301 may include a fluid inlet manifold 302 for providing a fluid flow to a fluid handling structure 304 held by a container. The provided fluid may be a liquid flow, such as an ultrapure water flow. The regulating system 301 may also include a fluid outlet manifold 303 for receiving a fluid flow flowing through the fluid handling structure 304 held by a container. There may be a fluid recirculation system that provides a flow path 309 for recirculating the fluid flow through the fluid handling structure 304. Within the flow path 309, there may be a filter 308 that can capture (i.e., collect) any particles in the recirculating fluid. The particles may be analyzed by the regulating system 301 and / or different equipment may be provided to analyze the particles. Although Figure 3 Not shown, but the fluid recirculation system may also include a pump and any other devices required for its operation.

[0089] The conditioning system 301 may include a light emitter 305, which may be a laser emitter, which may illuminate the fluid handling structure 304. The laser emitter may emit scattered light. The conditioning system 301 may include a light receiver 306, which may be a laser receiver, for detecting light.

[0090] The regulation system 301 and the operation of the regulation system 301 will be described in more detail below according to an embodiment.

[0091] The fluid handling structure 304 may have a major surface, which is the surface of the fluid handling structure 304 facing the substrate W when the fluid handling structure 304 is used in a lithographic apparatus. The major surface of the fluid handling structure 304 may include openings for supplying and / or extracting fluids, and may be the part of the fluid handling structure 304 that most often requires cleaning and / or maintenance.

[0092] The conditioning device 307 may be arranged to be located below a fluid handling structure 304 received by a container of the conditioning system 301. The conditioning device 307 may comprise a major surface, which may be referred to as an active surface, facing a major surface of the fluid handling structure 304.

[0093] The inspection system may be configured to inspect the fluid handling structure 304 before the adjustment device 307 performs any adjustment process on the fluid handling structure 304. The inspection system may include a processor for controlling the inspection process and receiving, generating and transmitting data related to the inspection process. Specifically, the inspection system may generate and / or receive inspection data based on the inspection of the fluid handling structure 304. The processor may automatically determine one or more different adjustment type processes to be performed on the fluid handling structure 304 based on the inspection data. The inspection system may automatically generate and send instructions to the adjustment device 307 for performing the determined one or more adjustment processes. For example, the instructions may be for a specific type of cleaning to be performed on all major surfaces of the fluid handling structure 304, or for only a specific portion of the major surface to be repaired.

[0094] The inspection system may include one or more cameras for generating images and / or videos of all or part of at least a major surface of the fluid handling structure 304. The inspection system may analyze the images and / or videos to generate inspection data.

[0095] The inspection system may control the light emitter 305 to illuminate the main surface of the fluid handling structure 304 and / or pass light through the fluid flowing through the fluid handling structure 304. The inspection system may generate inspection data based on the light detected by the light receiver 306. For example, the inspection system may use the light detected by the light receiver 306 to inspect all or part of at least the main surface of the fluid handling structure 304. Specifically, the light emitter 305 (which may be a laser emitter) may illuminate part or all of the main surface of the fluid handling structure 304 with scattered light. The inspection system may generate inspection data based on the pattern of light detected by the light receiver 306. The inspection data may include measured dimensions of features (e.g., openings) of the fluid handling structure 304. The measured dimensions may include one or more of the diameter, shape, and size of the opening. The inspection system may compare the measured dimensions with reference data (which may include historical data) to detect any changes in the dimensions. For example, comparison with historical data can detect drift in the diameter of the opening.

[0096] The inspection system may include a particle analyzer arranged to generate inspection data based on an analysis of particles collected by the filter 308. The presence and type of any contaminant particles in the internal flow path of the fluid handling structure 304 may thereby be detected. The types of contaminant particles may include fibers, metals, and organic particles. Thus, the type or types of adjustments to be performed may depend on the type of contaminant particles detected.

[0097] The inspection system may be configured to inspect the fluid handling structure 304 while the adjustment device 307 performs an adjustment process on the fluid handling structure 304. The inspection system may generate and display an indication of the progress of the adjustment process in real time. The inspection system may determine when the adjustment of the fluid handling structure 304 is complete and when the fluid handling structure 304 is ready for use in the lithographic apparatus. The inspection system may generate and display a notification when the adjustment of the fluid handling structure 304 is complete. The determination of the completion of the adjustment of the fluid handling structure 304 may be based on a scenario predefined by a user.

[0098] Conditioning device 307 may perform a variety of different types of processes to recondition fluid handling structure 304. Each conditioning process performed by conditioning device 307 on fluid handling structure 304 may be performed locally or globally. That is, each conditioning process may be performed only on one or more portions of a major surface of fluid handling structure 304, or on the entire major surface of fluid handling structure 304.

[0099] The types of repair processes that the conditioning device 307 may perform may include one or more of: a repair process; a polishing process; a coating process; and a process of applying additives to the fluid handling structure 304 .

[0100] Conditioning device 307 may include a polishing pad for polishing scratches on the major surface of the fluid handling structure.

[0101] The adjustment device 307 may include a laser for cutting, removing, reshaping, and / or mechanically modifying components of the fluid handling structure 304. The adjustment device 307 may use a laser to change the shape of some openings. The adjustment device 307 may use a laser or other device to remove rust from the openings in the fluid handling structure 304.

[0102] The conditioning device 307 may perform ion deposition to fill cracks in the major surface of the fluid handling structure 304. The conditioning device 307 may apply an additive to the major surface of the fluid handling structure 304. The additive may be a plastic or metallic material.

[0103] The fluid handling structure 304 may be modular. The repair process performed by the conditioning device 307 may include replacing one or more modules of the fluid handling structure 304.

[0104] The adjustment system 301 may include a mechanical device ( Figure 3 304), the mechanical device is arranged to impact the fluid handling structure 304. This can generate shock waves in the fluid handling structure 304, thereby moving any parts stuck together in the fluid handling structure 304. This can help the inspection and adjustment process.

[0105] Although Figure 3 309. Although not shown, the fluid recirculation system may include a fluid temperature control system. The fluid temperature control system may monitor the temperature of the fluid recirculated by the fluid recirculation system and, if necessary, heat or cool the fluid to maintain or change it to a desired temperature. The fluid temperature control system may be disposed in flow path 309.

[0106] Although Figure 3 Although not shown, the fluid recirculation system may include a fluid flow control system. The fluid flow control system may control the flow rate of the fluid in the fluid recirculation system. The fluid flow control system may quickly stop and start the fluid flow, thereby generating pressure waves in the fluid. The pressure waves may move the stuck parts of the fluid handling structure 304 apart, thereby facilitating the inspection and / or adjustment process of the fluid handling structure 304. The fluid flow control system may be disposed in the flow path 309.

[0107] The adjustment system 301 may also include a temperature control system for controlling the temperature of the fluid handling structure 304. The temperature of the fluid handling structure 304 may be changed to and maintained at an appropriate temperature for each inspection and adjustment process.

[0108] The conditioning system 301 may also include one or more storage sections ( Figure 3 ), for storing a plurality of fluid handling structures 304. There may be a first storage portion for storing a plurality of fluid handling structures 304 that require readjustment by the adjustment device 307. There may be a second storage portion for storing a plurality of fluid handling structures 304 that have been readjusted by the adjustment device 307. The adjustment system 301 may automatically select a fluid handling structure 304 in the first storage portion for readjustment, readjust the selected fluid handling structure 304, and then store the readjusted fluid handling structure 304 in the second storage portion. The adjustment system 301 may determine the order in which the fluid handling structures 304 are readjusted, and then readjust the fluid handling structures 304 in sequence. Advantageously, the second storage portion provides storage for one or more fluid handling structures 304 that are readily available. When a fluid handling structure 304 of a lithographic device needs to be repaired, the fluid handling structure 304 may be quickly removed from the lithographic device and replaced with another fluid handling structure 304 that is ready for use.

[0109] As mentioned above, the adjustment system 301 may be located in the same clean room as the lithography apparatus. The adjustment system 301 is an independent system that operates independently of the lithography apparatus.

[0110] The adjustment system 301 may include a transmission system ( Figure 3 The transfer system 301 is used to automatically transfer the fluid handling structure 304 that needs to be re-adjusted from the lithographic apparatus to the adjustment system 301. The transfer system can also automatically transfer the fluid handling structure 304 that has been re-adjusted and is ready for use from the adjustment system 301 to the lithographic apparatus. Alternatively, the fluid handling structure 304 can be manually transferred between the lithographic apparatus and the adjustment system 301.

[0111] The fluid recirculation system of the conditioning system 301 may be set up and operated completely independently of the fluid flow system of the lithographic apparatus.

[0112] To provide and control the inspection system and the adjustment device 307 , the adjustment system 301 may include a computer, a server, a mainframe, a terminal, a personal computer, any type of mobile computing device, etc., or a combination thereof.

[0113] A non-transitory computer readable medium may be provided for storing instructions for a processor of a controller of the inspection system and adjustment device 307. Common forms of non-transitory media include, for example, a floppy disk, a flexible disk, a hard disk, a solid state drive (SSD), a magnetic tape or any other magnetic data storage medium, a compact disk read only memory (CD-ROM), any other optical data storage medium, any physical medium with a pattern of holes, a random access memory (RAM), a programmable read only memory (PROM) and an erasable programmable read only memory (EPROM), a FLASH-EPROM or any other flash memory, a non-volatile random access memory (NVRAM), a cache, a register, any other memory chip or cartridge memory, and networked versions thereof.

[0114] Rust is a corrosion layer that may form on the inner and outer surfaces of fluid handling structures 12 that come into contact with water. Rust increases the risk of particles being generated in the immersion fluid and also degrades the appearance of the fluid handling structure 12. When fluid handling structures 12 become rusted, they are currently scrapped.

[0115] According to a second embodiment, a conditioning system for cleaning a fluid handling structure is provided. Cleaning is the process of removing the effects of rusting so that the rusted fluid handling structure 12 is substantially restored to a state where rusting had not occurred. Rusting of the fluid handling structure is cleaned by flowing an acid over the rusted surface. The cleaned fluid handling structure can then be reused in a lithographic apparatus.

[0116] Figure 4A regulation system 401 according to a second embodiment is schematically shown. The regulation system 401 of the second embodiment may include a fluid supply system 402 and a rust removal system 403. The fluid supply system 402 generates different fluid flows, which are supplied to the rust removal system 403. The rust removal system 403 receives a fluid treatment structure 418 having a rusted surface, and is arranged to use the fluid received from the fluid supply system 402 to remove the rust on the rusted surface of the fluid treatment structure 418. The fluid treatment structure 418 may be, for example, Figure 2a-2d The fluid handling structure 12 described in.

[0117] The fluid supply system 402 includes an acid supply 406, a dilution liquid supply 407, an ultrapure water (UPW) supply 404, an ultra-clean dry air (XCDA) supply 405, an acid supply pump 412, a heater 411, a dilution liquid supply regulator 413, a pH meter 414, a UPW supply valve 408, an XCDA supply valve 409, an acid supply valve 410, and a fluid supply 415. Figure 4 Not shown, there may also be a control system for automatically controlling the operation of at least the dilution liquid supply regulator 413, the UPW supply valve 408, the XCDA supply valve 409 and the acid supply valve 410.

[0118] Fluid supply 415 is the fluid output of fluid supply system 402. Fluid supply system 402 is controllable so that the fluid output through fluid supply 415 is acid, UPW, XCDA, or no fluid output through fluid supply 415.

[0119] In order to provide acid in fluid supply source 415, acid is output from acid supply source 406. pH meter 414 can measure the pH of acid. If it is necessary to change the pH of acid, dilution liquid supply regulator 413 can be automatically controlled so that acid is mixed with dilution liquid (e.g., water) from dilution liquid supply source 407 in an appropriate ratio. Acid supply pump 412 can pressurize acid, and heater 411 can heat acid to an appropriate temperature for deacidification. Acid supply valve 410 can be automatically controlled so that acid flows into fluid supply source 415 at an appropriate rate. UPW supply valve 408 and XCDA supply valve 409 can be closed so that only acid is supplied to fluid supply source 415.

[0120] To provide UPW in fluid supply 415, UPW supply valve 408 may be controlled to allow UPW to flow at an appropriate rate from UPW supply 404 to fluid supply 415. Acid supply valve 410 and XCDA supply valve 409 may be closed to supply UPW to fluid supply 415 only.

[0121] To provide XCDA in fluid supply source 415, XCDA supply valve 409 is controlled to allow XCDA to flow from XCDA supply source 405 to fluid supply source 415 at an appropriate rate. Acid supply valve 410 and UPW supply valve 408 may be closed to supply XCDA to fluid supply source 415 only.

[0122] When the UPW supply valve 408 , the XCDA supply valve 409 , and the acid supply valve 410 are all closed, no fluid is supplied to the fluid supply source 415 .

[0123] The descaling system 403 includes a descaling station 419, a liquid bath 420, a stirring fan 417, one or more O-rings 416, a cover 424, a suction line 421, a drain pump 422, and a drain pipe 423. The descaling system 403 is arranged to receive a descaled fluid handling structure, i.e., a fluid handling structure 418 having a descaled surface. The descaling system 403 is arranged to receive fluid from a fluid supply member 415 of the fluid supply system 402. Although Figure 4 Not shown, but there may also be a control system for automatically controlling the operation of the rust removal system 403. The same control system may automatically control the operation of the fluid supply system 402 and the rust removal system 403.

[0124] The derusting fluid handling structure 418 can be positioned on one or more O-rings 416 on the upper surface of the derusting station 419. The liquid bath 420 is an area to which acid and other fluids can be supplied, and is at least partially defined by some outer surfaces of the fluid handling structure 418, the upper surface of the derusting station 419, and one or more O-rings 416. Acid and other fluids can flow into the channel between the lower surface of the fluid handling structure 418 and the upper surface of the derusting station 419. The end of the channel can be defined by one or more O-rings 416. The cover 424 can be positioned above the main opening passing through the fluid handling structure 418 so that the area to which acid and other fluids can flow is closed. The cover 424 can prevent acid from flowing to certain surfaces of the fluid handling structure 418 that should be avoided from being affected by acid. Certain surfaces of the fluid handling structure 418 may contain glue and / or other materials that can be damaged if contacted with acid. The cover 424 can prevent acid from reaching these surfaces of the fluid handling structure 418 and thus damaging these surfaces. The stirring fan 417 may be arranged to generate turbulence when there is liquid in the liquid bath 420. Figure 4419 can be mounted on a dynamic platform. The dynamic platform can rotate bidirectionally on all three orthogonal axes (e.g., x-axis, y-axis, and z-axis). The rotation may be only a partial rotation around each axis, rather than a complete rotation. The dynamic platform can be used to shake the fluid handling structure 418 to increase the turbulence in the fluid flow. The turbulence in the fluid flow can increase the degree of all rusted surfaces of the fluid reaching the fluid handling structure 418, the separation of particles by the fluid, and the mixing of the fluid. Turbulence can also prevent the released particles from being re-deposited in the fluid handling structure 418. Acid and other fluids can flow out of the liquid bath 420 through the suction line 421. The fluid can be drawn into the suction line 421 by the drain pump 422. The fluid in the suction line 421 can flow to the drain pipe 423.

[0125] The second embodiment of the conditioning system 401 can automate the process of cleaning the fluid handling structure 418. The conditioning system 401 can operate as follows.

[0126] The rust removal system 403 may be provided with a pipe removal fluid handling structure 418. The fluid supply system 402 may produce acid to supply the rust removal system 403. The acid from the acid supply member 406 may be mixed with a dilution liquid (e.g., water) from a dilution liquid supply member 407 to provide a suitable pH value. The acid supply pump 412 may pressurize the acid to a suitable pressure. The heater 411 may heat the acid to a temperature suitable for pipe removal. The acid may then be supplied to the rust removal system 403 via the fluid supply member 415.

[0127] Rust removal system 403 can receive acid from fluid supply member 415. The received acid can be supplied to partial surfaces, preferably all surfaces, of fluid handling structure 418 where rust may occur. These surfaces are in contact with water. Specifically, acid can be supplied to pipes, where rust may occur, of fluid handling structure 418. This includes all fluid supply pipes and fluid extraction pipes. Acid can flow through pipes and enter liquid bath 420. Acid can flow to partial outer surfaces, preferably all outer surfaces, such as damper surfaces, i.e., the lower side or bottom surface of fluid handling structure 418, of fluid handling structure 418 where rust may occur. Acid can be supplied so that acid reaches substantially all surfaces to which it may flow. Agitating fan 417 and / or dynamic platform can be operated to generate turbulence in the acid flow. Acid can flow continuously into rust removal system 403, flowing into drain pipe 423 through fluid handling structure 418. Alternatively, the flow flowing into drain pipe 423 can be temporarily stopped so that the acid flowing into fluid handling structure 418 is temporarily retained in fluid handling structure 418. The time that the acid is allowed to contact each surface can be about 120 seconds or less, and preferably less than 60 seconds. After allowing the acid to maintain contact with the surface that it may reach for the required length of time, all the acid can flow to the drain pipe 423.

[0128] When acid is supplied to the descaling system 403, the inlet and outlet of the pipe of the fluid handling structure 418 (which is designed not to support liquid flow when in use, such as a pipe that only supports gas flow when in use) can be sealed so that no acid flows in. Since there is no liquid flow, it is expected that no descaling will occur in such a pipe.

[0129] The fluid supply system 402 can then generate a UPW stream that is supplied to the descaling system 403 via a fluid supply 415. The UPW can rinse any residual acid from all surfaces contacted by the acid. The agitation fan 417 and / or the dynamic platform can be operated to generate turbulence in the UPW stream. The UPW can flow to a drain 423.

[0130] Fluid supply system 402 can then generate a flow of XCDA that is supplied to descaling system 403 via fluid supply 415. XCDA can dry any remaining water from all surfaces contacted by the water. Agitation fan 417 and / or a dynamic platform can be operated to create turbulence in the XCDA flow. XCDA can flow to drain 423.

[0131] The fluid handling structure 418 may then be removed from the descaling system 403 and reused in the lithographic apparatus.

[0132] Advantageously, the conditioning system 401 of the second embodiment can automate the process of cleaning the dirty fluid handling structure 418 .

[0133] In one embodiment of the second embodiment, the pH value of the acid can be changed throughout the acid supply process. Specifically, an acid with a low pH value can be used at the beginning of the acid supply process to quickly remove the rust surface. The pH value of the acid can then be increased so that the rust surface removal rate slows down to increase the control of rust surface removal. The pH value of the acid can be controlled by changing the mixing ratio of the acid from the acid supplier 406 and the diluent from the diluent supplier 407.

[0134] In another embodiment of the second embodiment, there may be multiple acid supplies 406, and each acid supply 406 may include a different acid. The control system may then select an acid for a particular purpose. For example, a first acid may be used to remove some resist, and then a second acid may be used to remove rust.

[0135] In another implementation of the second embodiment, the pH of the acid may be set based on a determination or measurement by a system (not shown) separate from the conditioning system 401. This allows an operator of the conditioning system 401 to manually set the pH value.

[0136] In another embodiment of the second embodiment, a detector or sensor (not shown) can measure the rusting and / or contamination level on the surface of the fluid handling structure 418. The derusting process can be controlled based on the measured rusting and / or contamination. The detector can be, for example, an optical detector, such as a camera.

[0137] In another embodiment of the second embodiment, a pH sensor or meter (not shown) can measure the pH value of the acid in the fluid supply 415 and the acid in the suction line 421. The acid supply process can be controlled based on the measurement results of the pH sensor or meter. Specifically, the rust removal process can be continued until the pH value of the acid in the suction line 421 is substantially the same as the pH value of the acid in the fluid supply 415.

[0138] In another embodiment of the second embodiment, the acid liquid flowing through the rust removal system 403 can be filtered and supplied back to the fluid supply system 402, similar to the fluid recycling system described in the first embodiment. Then, the acid liquid can be re-supplied to the rust removal system 403.

[0139] Any two or more implementations of the second embodiment described above may be used in combination with each other.

[0140] The regulating system 401 of the second embodiment may be an independent regulating system separated from the regulating system 301 of the first embodiment, or may be integrated with the regulating system 301 of the first embodiment.

[0141] Embodiments include numerous modifications and variations of the above-described techniques.

[0142] Although the second embodiment has been described as a conditioning system 401 for descaling a fluid handling structure 418, the second embodiment more generally includes a conditioning system 401 for descaling a fluid handling system 418. The conditioning system 401 may also be used to descal other types of descaling structures and systems.

[0143] Embodiments may be used to repair various known types of fluid handling structures in fluid handling systems, such as Figures 2a to 2d The structures shown in . Embodiments are not limited to repairing features of a fluid handling system or a particular arrangement of its substrate-facing surfaces. Embodiments can be used to repair all or part of any fluid handling system.

[0144] Although specific reference may have been made above to using embodiments of the present invention in the context of repairing a fluid handling system, embodiments of the present invention are not limited thereto. Embodiments include repairing any other component of a lithographic apparatus. Embodiments may also be used to repair apparatus other than apparatus included in a lithographic apparatus, such as a mask inspection apparatus, a component of a metrology apparatus, or a component of any apparatus that measures or processes an object such as a wafer (or other substrate) or a mask (or other pattern forming apparatus). These apparatuses may generally be referred to as lithographic tools. Such lithographic tools may use ambient (non-vacuum) conditions.

[0145] Although specific reference is made herein to the use of immersion lithography apparatus, it should be understood that embodiments of the present invention are not limited to this type of lithography apparatus. For example, embodiments include repairing devices contained in extreme ultraviolet (EUV) lithography apparatus.

[0146] Although the application of lithography equipment in IC manufacturing may be specifically mentioned herein, it should be understood that the lithography equipment described herein may have other applications. Possible other applications include manufacturing integrated optical systems, guidance and detection patterns of magnetic domain memories, flat panel displays, liquid crystal displays (LCDs), thin film magnetic heads, etc.

[0147] Where the context permits, embodiments of the present invention may be implemented in hardware, firmware, software, or any combination thereof. Embodiments of the present invention may also be implemented by instructions stored on a machine-readable medium, which may be read and executed by one or more processors. A machine-readable medium may include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computing device). For example, a machine-readable medium may include a read-only memory (ROM); a random access memory (RAM); a magnetic storage medium; an optical storage medium; a flash memory device; an electrical, optical, acoustic, or other form of propagation signal (e.g., a carrier wave, an infrared signal, a digital signal, etc.), etc. In addition, firmware, software, routines, instructions may be described herein as performing certain actions. However, it should be understood that such descriptions are merely for convenience, and that such actions are actually generated by a computing device, processor, controller, or other device that executes the firmware, software, routines, instructions, etc., and in doing so may cause an actuator or other device to interact with the physical world.

[0148] Although embodiments of the invention may be specifically mentioned herein in the context of lithographic apparatus, embodiments of the invention may be used in other apparatus. Embodiments of the invention may form part of a mask inspection apparatus, a metrology apparatus, or any apparatus that measures or processes an object such as a wafer (or other substrate) or a mask (or other pattern forming device). These apparatus may generally be referred to as lithographic tools. Such lithographic tools may use ambient (non-vacuum) conditions.

[0149] Although the foregoing may have made specific reference to embodiments of the invention being used in the context of optical lithography, it will be appreciated that the invention is not limited to optical lithography where the context permits.

[0150] The examples include the following numbered clauses:

[0151] 1. An independent regulation system for a fluid handling structure of a lithographic apparatus, comprising:

[0152] an inspection system configured to inspect the fluid handling structure and determine one or more different types of conditioning to be performed on a major surface of the fluid handling structure; and

[0153] A conditioning device is configured to perform the determined one or more different conditioning types on the major surface of the fluid handling structure.

[0154] 2. The adjustment system of clause 1, wherein the review system is configured to review the adjustment process and generate an indication of the progress of the adjustment process in real time.

[0155] 3. An adjustment system according to clause 1 or 2, wherein the inspection system is configured to determine when the adjustment of the fluid handling structure is complete and ready for use based on user predefined scenarios.

[0156] 4. An adjustment system according to any preceding clause, wherein the inspection system is configured to generate a notification when the adjustment of the fluid handling structure is completed.

[0157] 5. A conditioning system according to any preceding clause, wherein the major surface of the fluid handling structure is a substrate-facing surface when the fluid handling structure is used in a lithographic apparatus.

[0158] 6. An adjustment system according to any preceding clause, wherein the adjustment device comprises a major surface; and

[0159] The conditioning device is configured such that, when the fluid handling structure is received by the conditioning system, a major surface of the conditioning device faces the major surface of the fluid handling structure.

[0160] 7. A conditioning system according to clause 6, wherein the conditioning device is configured such that when the fluid handling structure is received by the conditioning system, the major surface of the conditioning device is located below the major surface of the fluid handling structure.

[0161] 8. A conditioning system according to any preceding clause, wherein the type of conditioning the conditioning device is configured to perform on the fluid handling structure comprises one or more of:

[0162] Repair and restoration process;

[0163] Polishing process;

[0164] Coating process;

[0165] a process for applying an additive to the fluid handling structure;

[0166] a process for replacing modular components of the fluid handling structure; and

[0167] A process for descaling at least a portion of the fluid handling structure.

[0168] 9. A conditioning system according to any of the preceding clauses, further comprising a fluid recirculation system;

[0169] wherein the fluid recirculation system is configured to recirculate a flow of fluid through the fluid handling structure when the fluid handling structure is received by the regulation system; and

[0170] The inspection system is configured to perform an analysis of the recirculating fluid and determine one or more types of adjustments to be performed based on the analysis.

[0171] 10. The regulating system according to clause 9, wherein the fluid recirculation system comprises a filter arranged in a fluid flow path thereof for collecting contaminants in the fluid; and

[0172] The inspection system is configured to analyze the contaminants collected by the filter such that the one or more types of adjustments determined to be performed depend on a type of the contaminants.

[0173] 11. The regulation system according to clause 9 or 10, further comprising a fluid temperature control system configured to control the temperature of the fluid recirculated by the fluid recirculation system.

[0174] 12. The regulating system according to clauses 9 to 11, further comprising a fluid flow control system configured to control the flow of the fluid in the fluid recirculation system so as to generate pressure waves in the fluid.

[0175] 13. A regulation system according to any preceding clause, further comprising a temperature control system for controlling the temperature of the fluid handling structure.

[0176] 14. A regulation system according to any preceding clause, further comprising a mechanical device arranged to generate shock waves in the fluid handling structure.

[0177] 15. A regulating system according to any of the preceding clauses, wherein the inspection system further comprises:

[0178] a light emitter configured to illuminate the major surface of the fluid handling structure and / or a fluid flowing through the fluid handling structure; and

[0179] a light receiver configured to detect light from the illumination;

[0180] The inspection system is configured to determine one or more types of adjustments to be performed based on the received light.

[0181] 16. An adjustment system according to any of the preceding clauses, wherein the emitted light is configured to emit scattered light.

[0182] 17. A regulation system according to any of the preceding clauses, wherein the inspection system is configured to measure dimensions of features of the fluid handling structure and to compare the measured dimensions with reference data.

[0183] 18. The adjustment system of clause 17, wherein the feature comprises an opening, and the dimension measured comprises one of more than one of: a diameter, a shape, and a size of the opening.

[0184] 19. A regulating system according to any of the preceding clauses, further comprising a storage portion for storing a plurality of fluid handling structures.

[0185] 20. The regulation system according to any of the preceding clauses, wherein the regulation system is configured to automatically regulate a plurality of fluid handling structures in sequence.

[0186] 21. A regulating system according to any one of the preceding claims, wherein the regulating system comprises:

[0187] a fluid supply system; and

[0188] Rust removal system;

[0189] The descaling system is configured to receive acid from the fluid supply system and utilize the received acid to descaling at least a portion of the fluid handling structure.

[0190] 22. A regulating system and a fluid handling structure; wherein:

[0191] The regulating system is a regulating system according to any of the preceding clauses; and

[0192] The fluid handling structure is received by the regulation system.

[0193] 23. A device in a clean room, comprising:

[0194] Lithographic equipment; and

[0195] A regulation system according to any of clauses 1 to 21.

[0196] 24. The apparatus of clause 23, further comprising a transport system for automatically transporting a fluid handling structure from the lithographic apparatus to the conditioning system.

[0197] 25. The device according to clause 24, further comprising a fluid handling structure;

[0198] Wherein the fluid handling structure is received by the regulation system.

[0199] 26. A method of repairing a fluid handling structure of a lithographic apparatus, the method comprising:

[0200] removing the fluid from the lithographic apparatus and the processing structure;

[0201] providing the fluid handling structure to an independent regulation system;

[0202] inspecting the fluid handling structure to determine one or more different types of conditioning to be performed on a major surface of the fluid handling structure; and

[0203] The determined one or more different conditioning types are performed on the major surface of the fluid handling structure.

[0204] 27. The method according to clause 26, wherein the regulating system is according to any one of clauses 1 to 21.

[0205] 28. A method according to clause 26 or 27, wherein the conditioning system and the lithographic apparatus are located in the same clean room.

[0206] Although specific embodiments of the present invention have been described above, it will be appreciated that the present invention may be implemented in a manner other than that described. The above description is intended to be illustrative, not restrictive. Therefore, it will be appreciated by those skilled in the art that modifications may be made to the present invention as described without departing from the scope of the claims set forth below.

Claims

1. An independent regulation system for a fluid handling structure of a lithographic apparatus, comprising: an inspection system configured to inspect the fluid handling structure and determine one or more different types of conditioning to be performed on a major surface of the fluid handling structure; as well as A conditioning device is configured to perform the determined one or more different conditioning types on the major surface of the fluid handling structure.

2. An adjustment system according to claim 1, wherein the inspection system is configured to inspect the adjustment process and generate an indication of the progress of the adjustment process in real time, and / or wherein the inspection system is configured to determine when the adjustment of the fluid handling structure is completed and ready for use based on a user predefined scenario, and / or wherein the inspection system is configured to generate a notification when the adjustment of the fluid handling structure is completed, and / or wherein the inspection system is configured to measure the dimensions of features of the fluid handling structure and compare the measured dimensions with reference data, and / or wherein when the fluid handling structure is used in a lithography device, the main surface of the fluid handling structure is the surface facing the substrate.

3. The adjustment system of claim 2, wherein the feature comprises an opening, and the dimension measured comprises one or more of: a diameter, a shape, and a size of the opening.

4. An adjustment system according to claim 1, 2 or 3, wherein the adjustment device comprises a major surface; and The conditioning device is configured such that, when the fluid handling structure is received by the conditioning system, a major surface of the conditioning device faces the major surface of the fluid handling structure, and / or Wherein the adjustment system is configured to automatically and sequentially adjust a plurality of the fluid handling structures.

5. A regulation system according to claim 4, wherein the regulation device is configured so that when the fluid handling structure is received by the regulation system, the major surface of the regulation device is located below the major surface of the fluid handling structure.

6. A conditioning system according to any one of the preceding claims, wherein the type of conditioning the conditioning device is configured to perform on the fluid handling structure comprises one or more of: Restoration process; Polishing process; Coating process; a process for applying an additive to the fluid handling structure; a process for replacing modular components of the fluid handling structure; as well as A process for descaling at least a portion of the fluid handling structure.

7. A conditioning system according to any one of the preceding claims, further comprising a fluid recirculation system; in, the fluid recirculation system being configured to recirculate a flow of fluid through the fluid handling structure when the fluid handling structure is received by the regulation system; and The inspection system is configured to perform an analysis of the recirculating fluid and determine one or more types of adjustments to be performed based on the analysis.

8. The regulating system of claim 7, wherein the fluid recirculation system comprises a filter arranged in a fluid flow path thereof for collecting contaminants in the fluid; and The inspection system is configured to analyze the contaminants collected by the filter so that the one or more types of adjustments determined to be performed depend on the type of the contaminants, and / or also includes a fluid temperature control system, which is configured to control the temperature of the fluid recirculated by the fluid recycling system, and / or also includes a fluid flow control system, which is configured to control the flow of the fluid in the fluid recycling system so that pressure waves are generated in the fluid, and / or also includes a temperature control system for controlling the temperature of the fluid processing structure, and / or also includes a temperature control system for controlling the temperature of the fluid processing structure, and / or also includes a temperature control system for controlling the temperature of the fluid processing structure, and / or also includes a temperature control system for controlling the temperature of the fluid processing structure, and / or also includes a storage part for storing multiple fluid processing structures.

9. The adjustment system according to any one of the preceding claims, wherein the inspection system further comprises: a light emitter configured to illuminate the major surface of the fluid handling structure and / or a fluid flowing through the fluid handling structure; as well as a light receiver configured to detect light from the illumination; The inspection system is configured to determine one or more types of adjustments to be performed based on the received light.

10. The adjustment system of claim 9, wherein the emitted light is configured to emit scattered light.

11. A regulating system according to any one of the preceding claims, wherein the regulating system comprises: Fluid supply system; as well as Rust removal system; The descaling system is configured to receive acid from the fluid supply system and utilize the received acid to descaling at least a portion of the fluid handling structure.

12. A regulating system and a fluid handling structure; wherein: The regulating system is a regulating system according to any one of the preceding claims; and The fluid handling structure is received by the regulation system.

13. A device in a clean room, comprising: Lithography equipment; as well as A regulating system according to any one of claims 1 to 11.

14. The apparatus of claim 13, further comprising a transport system for automatically transferring a fluid handling structure from the lithographic apparatus to the conditioning system, and / or further comprising the fluid handling structure; Wherein the fluid handling structure is received by the regulation system.

15. A method for repairing a fluid handling structure of a lithographic apparatus, the method comprising: removing the fluid handling structure from the lithographic apparatus; providing the fluid handling structure to an independent regulation system; inspecting the fluid handling structure to determine one or more different types of conditioning to be performed on a major surface of the fluid handling structure; as well as The determined one or more different conditioning types are performed on the major surface of the fluid handling structure.

Images