System and method for defect mitigation using data analysis

Abstract

A method for defect mitigation is disclosed. The method may include receiving defect data for one or more defects of one or more samples. The defect data may include a defect location, a defect size, a defect shape, or a relationship between the defect and a component of the one or more samples. The method may include identifying at least one defect as an unqualified defect based on the received defect data and one or more predetermined thresholds. Upon identifying the defect as an unqualified defect, the method may include generating a tool readable index configured to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing steps corresponding to the unqualified defect based on the generated tool readable index. The method may include providing the generated tool readable index to the one or more downstream manufacturing tools.

Description

Technical Field

[0001] The present invention relates generally to defect mitigation, and more particularly, to a system and method for defect mitigation using data analysis. Background Art

[0002] As the demand for electronic circuits with increasingly smaller device features continues to increase, the need for improved defect mitigation techniques for printed circuit boards (PCBs) continues to grow. Current printed circuit board defect mitigation techniques utilize defect data to adjust one or more characteristics of previous PCB manufacturing processes / tools. However, one or more downstream processes / tools may be affected by the defect and may result in the generation of additional defects. For example, during the manufacture of the PCB, contamination of the developer solution may result in the generation of additional defects because photosensitive materials may penetrate into the through holes / grooves of the circuit. Thus, it would be advantageous to provide systems and methods that remedy the shortcomings of the methods identified above. Summary of the invention

[0003] According to one or more embodiments of the present disclosure, a system is disclosed. In an embodiment, the system includes a characterization subsystem configured to perform inspection of one or more samples to generate defect data of one or more defects of the one or more samples. In an embodiment, the system further includes one or more controllers communicatively coupled to the characterization subsystem, the one or more controllers including one or more processors configured to execute a set of program instructions stored in a memory, the set of program instructions being configured to cause the one or more processors to: receive the defect data from the characterization subsystem, the defect data including one of a defect location, a defect size, a defect shape, or a relationship between the defect and a component of the one or more samples; identify at least one of the one or more defects as a non-conforming defect based on the received defect data and one or more predetermined thresholds; when the defect is identified as a non-conforming defect, generate a tool-readable index, the generated tool-readable index being configured to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing steps corresponding to the non-conforming defect based on the generated tool-readable index; and provide the generated tool-readable index to the one or more downstream manufacturing tools.

[0004] According to one or more embodiments of the present disclosure, a system is disclosed. In an embodiment, the system includes one or more controllers communicatively coupled to the characterization subsystem, the one or more controllers including one or more processors configured to execute a set of program instructions stored in a memory, the set of program instructions being configured to cause the one or more processors to: receive defect data from the characterization subsystem, the defect data including one of defect location, defect size, defect shape, or a relationship between defects and components of one or more samples; identify at least one of the one or more defects as a non-conforming defect based on the received defect data and one or more predetermined thresholds; when the defect is identified as a non-conforming defect, generate a tool-readable index, the generated tool-readable index being configured to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing steps corresponding to the non-conforming defect based on the generated tool-readable index; and provide the generated tool-readable index to the one or more downstream manufacturing tools.

[0005] According to one or more embodiments of the present disclosure, a method is disclosed. In an embodiment, the method includes receiving defect data of one or more defects of one or more samples of a characterization subsystem, the defect data including one of a defect location, a defect size, a defect shape, or a relationship between the defect and a component of the one or more samples. In an embodiment, the method includes identifying at least one of the one or more defects as a non-conforming defect based on the received defect data and one or more predetermined thresholds. In an embodiment, when the defect is identified as a non-conforming defect, the method includes generating a tool-readable index, the generated tool-readable index being configured to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing steps corresponding to the non-conforming defect based on the generated tool-readable index. In an embodiment, the method includes providing the generated tool-readable index to the one or more downstream manufacturing tools.

[0006] It should be understood that both the foregoing general description and the following detailed description are exemplary and illustrative only and do not necessarily limit the invention as claimed. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the general description, serve to explain the principles of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Many of the advantages of the present disclosure may be better appreciated by those skilled in the art by referring to the accompanying drawings.

[0008] Figure 1A A block diagram illustrating a defect mitigation system in accordance with one or more embodiments of the present disclosure.

[0009] Figure 1BA simplified schematic diagram illustrating an inspection subsystem of a defect mitigation system in accordance with one or more embodiments of the present disclosure.

[0010] Figure 2 Description A flow chart depicting a method of mitigating defects within a system according to one or more embodiments of the present disclosure.

[0011] Figure 3 Description A process flow diagram depicting a method of mitigating defects within a system according to one or more embodiments of the present disclosure. DETAILED DESCRIPTION

[0012] The present disclosure has been particularly shown and described with respect to specific embodiments and specific features thereof. The embodiments described herein are considered to be illustrative and not restrictive. It should be readily apparent to one of ordinary skill in the art that various changes and modifications in form and detail may be made without departing from the spirit and scope of the present disclosure. Reference will now be made in detail to the disclosed subject matter illustrated in the accompanying drawings.

[0013] Embodiments of the present disclosure relate to a system and method for defect mitigation using data analysis. In particular, embodiments of the present disclosure relate to a system and method for preventing defect accumulation through defect detection. For example, the system may be configured to issue a tool-readable index that can be decoded by the next tool in the process, wherein the next tool in the process may be able to skip defective areas based on the issued tool-readable index.

[0014] Figure 1A A block diagram illustrating a defect mitigation system 100 in accordance with one or more embodiments of the present disclosure.

[0015] In an embodiment, the system 100 includes a characterization subsystem 102 configured for defect inspection of one or more samples. It should be noted herein that the characterization subsystem 102 may include an inspection subsystem. The characterization subsystem 102 may include any inspection subsystem 102 known in the art, including but not limited to an automated optical inspection tool (AOI tool).

[0016] Automated optical inspection systems are generally discussed in the following patents: U.S. Patent No. 8,077,307, issued on December 13, 2011; U.S. Patent No. 7,203,355, issued on April 10, 2007; and U.S. Patent No. 7,206,443, issued on April 17, 2007, each of which is incorporated herein by reference in its entirety.

[0017] The characterization subsystem 102 may provide various types of characterization data related to defects of one or more samples. For example, the characterization subsystem 102 may provide defect characterization data. For example, the characterization subsystem 102 may provide the location, size, shape, number, or type of defects of one or more samples. In addition, the characterization subsystem 102 may provide a relationship between the defects of the samples and a particular component. In this regard, as Figure 3 , a barcode 306 may be generated, wherein the barcode 306 may include a relationship between the panel 300 and the defect 300a, as discussed further herein.

[0018] In an embodiment, the system 100 includes one or more manufacturing subsystems 104 (e.g., one or more manufacturing tools 104). The manufacturing subsystem 104 may include any type of sample manufacturing subsystem 104 known in the art, including but not limited to a photolithography tool, a laser direct imaging tool, an etching tool, a drilling tool (e.g., a laser drilling tool or a mechanical drilling tool), a solder mask printing tool, a computer-aided manufacturing (CAM) design tool, or the like.

[0019] Manufacturing tools are generally discussed in the following patents: U.S. Patent No. 8,964,274, issued on February 24, 2015, and U.S. Patent No. 7,058,474, issued on June 6, 2006, both of which are incorporated herein by reference in their entirety.

[0020] In an embodiment, the system 100 includes one or more controllers 106 communicatively coupled to the characterization subsystem 102 and the one or more manufacturing subsystems 104. The controller 106 includes one or more processors 108 configured to execute program instructions maintained on a memory medium 110 (memory 110). The one or more processors 108 of the controller 106 may perform any of the various process steps described throughout this disclosure. In addition, the one or more processors 108 of the controller 106 may be configured to receive data including, but not limited to, image data associated with one or more samples 112 from the inspection subsystem 102 (or an external characterization tool).

[0021] Figure 1B is a conceptual diagram illustrating the characterization subsystem 102 according to one or more embodiments of the present disclosure.

[0022] In an embodiment, the characterization subsystem 102 includes an inspection subsystem 102 configured to perform defect inspection of one or more samples 112. For example, the inspection subsystem 102 may be configured to acquire one or more inspection images 101 of one or more portions of the one or more samples 112. The samples may include any type of samples, including but not limited to printed circuit boards (PCBs), flat panel displays (FPDs), wafers, and the like.

[0023] In an embodiment, the one or more samples 112 are disposed on a sample stage assembly 111 to facilitate movement of the one or more samples 112. The sample stage assembly 111 may include any stage assembly 111 known in the art.

[0024] In an embodiment, the inspection subsystem 102 includes an illumination source 114 configured to generate one or more illumination beams 116. The illumination source 114 may be configured to emit one or more illumination beams 116 of light of one or more selected wavelengths, including but not limited to vacuum ultraviolet radiation (VUV), deep ultraviolet radiation (DUV), ultraviolet (UV) radiation, visible radiation, or infrared (IR) radiation. In an embodiment, the illumination source 114 may include a spectrally tunable illumination source for generating one or more illumination beams 116 having a tunable spectrum.

[0025] In an embodiment, the illumination source 114 directs an illumination beam 116 to the one or more samples 112 via an illumination path 118. The illumination path 118 may include one or more lenses 120 or additional illumination optical components 122 suitable for modifying and / or adjusting the illumination beam 116. For example, the one or more illumination optical components 122 may include, but are not limited to, one or more polarizers, one or more filters, one or more splitters, one or more diffusers, one or more homogenizers, one or more apodizers, one or more shapers, one or more shutters (e.g., mechanical shutters, electro-optical shutters, acousto-optical shutters, or the like), one or more aperture stops, and / or one or more field stops.

[0026] In an embodiment, the inspection subsystem 102 includes an electro-optical modulator 126. The electro-optical modulator 126 can be disposed in the illumination path of the illumination beam 116 from the illumination source 114. The electro-optical modulator 126 can modulate one or more characteristics of the illumination beam 116. During operation, light is transmitted through portions of the electro-optical modulator 126, and defects can be detected by observing changes in reflected or transmitted light. Electro-optical modulators are generally discussed in U.S. Patent No. 7,817,333, issued on October 19, 2019, which is incorporated herein by reference in its entirety.

[0027] In an embodiment, the detector 128 is configured to capture radiation (e.g., sample light 113) emitted from the one or more samples 112 through the collection path 130. For example, the collection path 130 may include, but is not required to include, the electro-optical modulator 126, a collection lens (e.g., an objective lens), or one or more additional collection path lenses 132. In this regard, the detector 128 can receive radiation reflected or scattered (e.g., via specular reflection, diffuse reflection, and the like) from the one or more samples 112 or generated by the one or more samples 112 (e.g., luminescence associated with absorption of the illumination 308 or the like).

[0028] The collection path 130 may further include any number of collection optical components 134 for directing and / or modifying the illumination collected by the electro-optical modulator 126, including but not limited to one or more collection path lenses 132, one or more filters, one or more polarizers, or one or more stops. In addition, the collection path 130 may include a field stop for controlling the spatial extent of the sample imaged onto the detector 128 or an aperture stop for controlling the angular extent of the illumination from the sample used to produce the image on the detector 128. In an embodiment, the collection path 130 includes an aperture stop positioned in a plane conjugate to the back focal plane of the optical element to provide telecentric imaging of the sample. In an embodiment, the inspection subsystem 102 includes a beam splitter 124 oriented so that the electro-optical modulator 126 can simultaneously direct the illumination beam 116 to the one or more samples 112 and collect radiation emitted from the one or more samples 112.

[0029] The detector 128 may include any type of optical detector suitable for measuring the illumination received from the panel 300. For example, the detector 128 may include, but is not limited to, a charge coupled device (CCD) detector, a time delay integration (TDI) detector, a photomultiplier tube (PMT), an avalanche photodiode (APD), a complementary metal oxide semiconductor (CMOS) sensor, or the like. In an embodiment, the detector 128 may include a spectral detector suitable for identifying the wavelength of light emitted from the one or more samples 112.

[0030] Although the embodiments of the present disclosure relate to a printed circuit board inspection system, it is prudent to consider that the system 100 may be specifically implemented as a wafer inspection system or a wafer metrology system. Therefore, the above description should not be interpreted as limiting the scope of the present disclosure. Wafer inspection / metrology systems are generally discussed in the following patents: U.S. Patent No. 9,279,774, issued on March 8, 2016; U.S. Patent No. 7,957,066, issued on June 7, 2011; U.S. Patent No. 7,345,825, issued on March 18, 2008; U.S. Patent No. 5,999,310, issued on December 7, 1999; U.S. Patent No. 7,525,649, issued on April 28, 2009; U.S. Patent No. 9,228,943, issued on January 5, 2016; U.S. Patent No. 5,608,526, issued on March 4, 1997; U.S. Patent No. 6,297,880, issued on October 2, 2001, each of which is incorporated herein by reference in its entirety.

[0031] Figure 2 Description A flow chart depicts a method 200 for defect detection using system 100 in accordance with one or more embodiments of the present disclosure. Figure 3 The description depicts a process flow diagram of a method 200 for defect detection using the system 100 in accordance with one or more embodiments of the present invention.

[0032] In step 202, defect data of one or more defects of one or more samples 112 may be acquired. For example, the controller 106 may be configured to acquire one or more inspection images 101 of the one or more samples 112 from the inspection subsystem 102. For example, the one or more inspection images 101 may include defect data, such as, but not limited to, defect location, defect size, defect shape, relationship between the defect of the sample and a specific component, and the like.

[0033] refer to Figure 3 In an embodiment, one or more samples 112 include a panel 300, and the panel 300 includes one or more arrays 302 of samples 304. For example, the panel 300 may include one or more arrays 302 of printed circuit boards (PCBs) 304. The one or more arrays 302 of PCBs 304 may be arranged in a column / row configuration. For example, Figure 3 , one or more arrays 302 of PCBs 304 may include a first column of PCBs (e.g., column A), a second column of PCBs (e.g., column B), a third column of PCBs (e.g., column C), a fourth column of PCBs (e.g., column D), a fifth column of PCBs (e.g., column E), up to N number of columns of PCBs. Each column (e.g., columns A to E) may include five rows of PCBs (e.g., rows 1 to 5). It should be noted herein that Figure 3It is provided for illustrative purposes only and should not be construed as limiting the scope of the present disclosure.

[0034] In step 204, the one or more defects may be analyzed to determine whether the one or more defects are unqualified defects. For example, the controller 106 may be configured to identify at least one of the one or more defects as an unqualified defect (e.g., a killer defect) based on the received defect data and one or more predetermined thresholds. By way of another example, the controller 106 may be configured to identify at least one of the one or more defects as a non-unqualified defect (e.g., a qualified defect).

[0035] refer to Figure 3 In a non-limiting example, the controller 106 may be configured to analyze the sample 304a located in column D / row 3 as a fatal defect 300a, such that the defect 300a may fail the sample 304a located in column D / row 3 on the panel 300. In addition, the controller 106 may be configured to analyze the sample 304b located in column E / row 4 as a passing defect 300b, such that the defect 300b does not fail the sample 304b located in column E / row 4 on the panel 300.

[0036] In an embodiment, the one or more predetermined thresholds include one or more user-defined thresholds. For example, the one or more user-defined thresholds may include one or more user-defined limits, such as but not limited to minimum defect size, defect location, defect type, critical design area, critical design pattern, and the like.

[0037] In step 206, when at least one defect is identified as a reject defect, a tool readable index may be generated. For example, the controller 106 may be configured to generate a tool readable index including, but not limited to, a unit number, a unit location, a panel serial number, a barcode identifier (ID), or the like.

[0038] In an embodiment, the generated tool-readable index is configured to cause one or more downstream manufacturing subsystems 104 to adjust one or more downstream manufacturing steps to cut off the defective area from the one or more downstream manufacturing steps. For example, one or more downstream manufacturing subsystems 104 may be configured to avoid applying one or more manufacturing steps for the defective area. By way of another example, one or more downstream manufacturing subsystems 104 may be configured to change the design of a specified panel that includes the defective area.

[0039] Reference again Figure 3In a non-limiting example, the generated tool-readable index may be configured to cause one or more downstream manufacturing subsystems 104 to adjust one or more downstream manufacturing steps of the sample 304a containing the unqualified fatal defect 300a. In this regard, the one or more downstream manufacturing subsystems 104 may cut off the sample 304a from the downstream manufacturing step based on the generated tool-readable index, wherein the generated tool-readable index may cause the one or more downstream manufacturing subsystems 104 to adjust one or more processes based on the identified unqualified defect.

[0040] In step 208 , the generated tool-readable index may be provided to one or more downstream manufacturing subsystems. For example, the controller 106 may be configured to provide the generated tool-readable index to one or more downstream manufacturing subsystems 104 .

[0041] Reference again Figure 3 , the controller 106 may be configured to provide the generated tool-readable index to a manufacturing controller communicatively coupled to one or more downstream manufacturing subsystems 104. For example, the manufacturing controller may be configured to generate one or more communication protocols configured to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing steps corresponding to the non-conforming defect based on the generated tool-readable index and the generated one or more communication protocols.

[0042] The one or more communication protocols may include, but are not limited to, one or more exposure files, one or more Transmission Control Protocol / Internet Protocol (TCP / IP), one or more table databases, one or more Secure File Transfer Protocols (SFTP), one or more Internet Message Access Protocols (IMAP), one or more Semiconductor Equipment Communication Standard / Generic Model (SECS / GEM) protocols for communication and control of manufacturing equipment, or the like.

[0043] In one non-limiting example, the controller 106 may be configured to provide a generated tool-readable index to a computer-aided machine (CAM) station positioned in front of one or more downstream manufacturing subsystems 104 (e.g., a laser direct imaging (LDI) tool). In this example, the CAM controller may be configured to generate one or more exposure files that are configured to cause the LDI tool to adjust one or more downstream manufacturing steps corresponding to the unqualified defects based on the generated tool-readable index and the generated one or more exposure files. In this regard, the CAM station may be configured to adapt the exposure file of the LDI tool. The adapted exposure file may be provided to the LDI tool to cause the LDI tool to change the LDI process according to a particular tool-readable index, thereby cutting off defective samples from the LDI process. The adapted exposure file may include fully printed samples and completely empty samples. For example, as Figure 3, panel 300 may include exposure regions 308 and empty exposure regions 310 based on tool-readable indices. In this regard, empty exposure regions 310 may correspond to the location of fatal defects 300a on failed sample 300a. Exposure regions 308 may include regions without defects and / or regions with passing defects (e.g., exposure regions 312 including passing defects 300b).

[0044] Referring again to FIG. 1 , the one or more processors 112 of the controller 106 may include any processing element known in the art. In this sense, the one or more processors 112 may include any microprocessor-type device configured to execute algorithms and / or instructions. In one embodiment, the one or more processors 112 may be composed of a desktop computer, a mainframe computer system, a workstation, an image computer, a parallel processor, or any other computer system (e.g., a networked computer) configured to execute a program (which is configured to operate the system 100), as described throughout this disclosure. It should be further recognized that the term "processor" may be broadly defined to encompass any device having one or more processing elements that execute program instructions from a non-transitory memory medium 114. Therefore, the above description should not be construed as limiting the present invention but is merely illustrative.

[0045] The memory medium 110 may include any storage medium known in the art suitable for storing program instructions executable by the associated one or more processors 108. By way of non-limiting example, the memory medium 110 may include a non-transitory memory medium. By way of additional non-limiting example, the memory medium 110 may include, but is not limited to, a read-only memory, a random access memory, a magnetic or optical storage device (e.g., a disk), a tape, a solid-state drive, and the like. It should be further noted that the memory 110 may be housed in a common controller housing with the one or more processors 108. In alternative embodiments, the memory 110 may be remotely located relative to the physical location of the one or more processors 108 and the controller 106. For example, the one or more processors 108 of the controller 106 may access a remote memory (e.g., a server) that is accessible via a network (e.g., the Internet, an intranet, and the like).

[0046] Further, it is considered that each of the embodiments of the method described above may include any (several) other steps of any (several) other methods described herein. In addition, each of the embodiments of the method described above may be performed by any system described herein.

[0047] Those skilled in the art will recognize that for the sake of conceptual clarity, the components, operations, devices, objects, and accompanying discussions described herein are used as examples, and various configuration modifications are contemplated. Therefore, as used herein, the specific examples set forth and the accompanying discussions are intended to represent their more general class. In general, the use of any specific example is intended to represent its class, and the failure to include specific components, operations, devices, and objects should not be considered limiting.

[0048] With respect to the use of substantially any plural and / or singular terms herein, those skilled in the art may translate from the plural to the singular and / or from the singular to the plural, depending on the context and / or application. For clarity, various singular / plural permutations are not explicitly set forth herein.

[0049] The subject matter described herein sometimes illustrates different components contained in or connected to other components. It should be understood that such depicted architectures are exemplary only, and in fact many other architectures that realize the same functionality can be implemented. In a conceptual sense, any arrangement of components for realizing the same functionality is effectively "associated" so as to realize the desired functionality. Therefore, any two components combined to realize a specific functionality in this article can be regarded as "associated" with each other so as to realize the desired functionality, without considering the architecture or intermediate components. Similarly, any two components so associated can also be regarded as "connected" or "coupled" to realize the desired functionality, and any two components that can be so associated can also be regarded as "coupleable" to each other to realize the desired functionality. Specific examples that can be coupled include but are not limited to physically matched and / or physically interactive components and / or wirelessly interactive and / or wirelessly interactive components and / or logically interactive and / or logically interactive components.

[0050] In addition, it should be understood that the present invention is defined by the appended claims. Those skilled in the art will understand that, in general, the terms used herein and particularly in the appended claims (e.g., the body of the appended claims) are generally intended to be "open" terms (e.g., the term "including" should be understood as "including but not limited to", the term "having" should be understood as "having at least", the term "includes" should be understood as "including but not limited to", and the like). Those skilled in the art will further understand that if a specific number of introduced claim recitations is intended, such intention will be expressly stated in the claim, and in the absence of such a statement, such intention does not exist. For example, as an aid to understanding, the following appended claims may contain the use of the introductory phrases "at least one" and "one or more" to introduce claim recitations. However, the use of such phrases should not be construed as implying that the introduction of a claim recitation by the indefinite article "a / an" limits any particular claim containing the introduced claim recitation to inventions containing only one such recitation, even if the same claim contains the introductory phrases "one or more" or "at least one" and an indefinite article such as "a / an" (e.g., "a / an" should generally be understood to mean "at least one" or "one or more"); the above applies equally to the use of definite articles used to introduce claim recitations. In addition, even if a specific number of introduced claim recitations is explicitly recited, those skilled in the art will recognize that such recitation should generally be understood to mean at least the recited number (e.g., the basic recitation of "two recitations" (without other modifiers) generally means at least two recitations or two or more recitations). Furthermore, in examples where conventional expressions similar to “at least one of A, B, and C, and the like” are used, such construction is generally contemplated in the sense that a person skilled in the art would understand the conventional expressions (e.g., “a system having at least one of A, B, and C” would include, but is not limited to, systems having only A, only B, only C, both A and B, both A and C, both B and C, and / or both A, B, and C, and the like). In examples where conventional expressions similar to “at least one of A, B, or C, and the like” are used, such construction is generally contemplated in the sense that a person skilled in the art would understand the conventional expressions (e.g., “a system having at least one of A, B, or C” would include, but is not limited to, systems having only A, only B, only C, both A and B, both A and C, both B and C, and / or both A, B, and C, and the like). Those skilled in the art will further understand that virtually any transitional conjunction and / or phrase presenting two or more alternatives, whether in the description, claims or drawings, should be understood to contemplate the following possibilities: including one, either or both of the items.For example, the phrase "A or B" will be understood to include the possibilities of "A" or "B" or "A and B."

[0051] It is believed that the present disclosure and its many attendant advantages will be understood from the foregoing description, and it will be appreciated that various changes may be made to the form, construction, and arrangement of components without departing from the disclosed subject matter or sacrificing all of its material advantages. The forms described are illustrative only, and the appended claims are intended to cover and encompass such changes. Furthermore, it should be understood that the invention is defined by the appended claims.

Claims

1. A system, comprising: a characterization subsystem configured to perform inspection of one or more samples to generate defect data for one or more defects of the one or more samples; and one or more controllers communicatively coupled to the characterization subsystem, the one or more controllers comprising one or more processors configured to execute a set of program instructions stored in a memory, the set of program instructions configured to cause the one or more processors to: receiving the defect data from the characterization subsystem, the defect data comprising one of a defect location, a defect size, a defect shape, or a relationship between the defect and a component of the one or more samples; identifying at least one of the one or more defects as a failing defect based on the received defect data and one or more predetermined thresholds; upon identifying the defect as a failing defect, generating a tool-readable index, the generated tool-readable index being configured to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing steps corresponding to the failing defect based on the generated tool-readable index; and The generated tool-readable index is provided to the one or more downstream manufacturing tools. 2 . The system of claim 1 , wherein the tool-readable index comprises an identifier configured to be decoded by the one or more downstream manufacturing tools.

3. The system of claim 2, wherein the identifier comprises a barcode.

4. The system of claim 1, wherein the one or more downstream manufacturing tools include at least one of: Photolithography tools, laser direct imaging tools, etching tools, drilling tools, solder mask printing tools, or computer aided manufacturing design tools.

5. The system of claim 4, wherein said providing said generated tool-readable index to said one or more downstream manufacturing tools comprises: The generated tool-readable index is provided to a manufacturing controller communicatively coupled to the one or more downstream manufacturing tools, the manufacturing controller being configured to generate one or more communication protocols, the one or more communication protocols being configured to cause the one or more downstream manufacturing tools to adjust the one or more downstream manufacturing steps corresponding to the nonconforming defect based on the generated tool-readable index and the generated one or more communication protocols.

6. The system of claim 5, wherein the one or more communication protocols include one or more exposure files, wherein the generated one or more exposure files include fully exposed areas and empty exposure areas.

7. The system of claim 1, wherein the one or more predetermined thresholds include one or more user-defined thresholds.

8. The system of claim 7, wherein the one or more user-defined thresholds include at least one of: Minimum defect size, defect location, defect type, critical design area or critical design pattern.

9. The system of claim 1, wherein the one or more samples comprise one or more printed circuit boards.

10. The system of claim 9, wherein the one or more printed circuit boards are arranged in one or more arrays on a panel.

11. The system of claim 1, wherein the characterization subsystem comprises a verification subsystem.

12. The system of claim 11, wherein the inspection subsystem comprises an automated optical inspection subsystem.

13. A system, comprising: One or more controllers including one or more processors configured to execute a set of program instructions stored in a memory, the set of program instructions configured to cause the one or more processors to: receiving defect data from a characterization subsystem, the defect data including one of a defect location, a defect size, a defect shape, or a relationship between a defect and a component for one or more samples; identifying at least one of the one or more defects as a failing defect based on the received defect data and one or more predetermined thresholds; upon identifying the defect as a failing defect, generating a tool-readable index configured to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing steps corresponding to the failing defect based on the generated index; and The generated tool-readable index is provided to the one or more downstream manufacturing tools.

14. The system of claim 13, wherein the tool-readable index comprises an identifier configured to be decoded by the one or more downstream manufacturing tools.

15. The system of claim 13, wherein the downstream manufacturing tool comprises at least one of: Photolithography tools, laser direct imaging tools, etching tools, drilling tools, solder mask printing tools, or computer aided manufacturing design tools.

16. The system of claim 15, wherein said providing said generated tool-readable index to said one or more downstream manufacturing tools comprises: The generated tool-readable index is provided to a manufacturing controller communicatively coupled to the one or more downstream manufacturing tools, the manufacturing controller being configured to generate one or more communication protocols, the one or more communication protocols being configured to cause the one or more downstream manufacturing tools to adjust the one or more downstream manufacturing steps corresponding to the nonconforming defect based on the generated tool-readable index and the generated one or more communication protocols.

17. The system of claim 13, wherein the one or more predetermined thresholds include one or more user-defined thresholds.

18. The system of claim 17, wherein the one or more user-defined thresholds include at least one of: Minimum defect size, defect location, defect type, critical design area or critical design pattern.

19. The system of claim 13, wherein the one or more samples comprise one or more printed circuit boards arranged in one or more arrays on a panel.

20. A method comprising: receiving defect data for one or more defects from one or more samples of a characterizing subsystem, the defect data comprising one of a defect location, a defect size, a defect shape, or a relationship between the defect and a component of the one or more samples; identifying at least one of the one or more defects as a failing defect based on the received defect data and one or more predetermined thresholds; upon identifying the defect as a failing defect, generating a tool-readable index, the generated tool-readable index being configured to cause one or more downstream manufacturing tools to adjust one or more downstream manufacturing steps corresponding to the failing defect based on the generated tool-readable index; and The generated tool-readable index is provided to the one or more downstream manufacturing tools.

Images