Slit type gluing device and gluing method

Abstract

The invention provides a slit type gluing device and a gluing method. The slit type gluing device comprises a gluing assembly and a pressure reduction assembly. The gluing assembly comprises a coating nozzle, a coating channel and a glue storage bin, the glue storage bin contains coating glue, the coating glue flows out of the coating nozzle through the coating channel to fill a set area, and the moving direction of the coating nozzle is a first direction; the pressure reduction assembly is arranged on one side of the gluing assembly in the first direction and used for reducing the pressure intensity of a set area, and the set area is located between the gluing assembly and the pressure reduction assembly. According to the slit type gluing device, the pressure reduction assembly is arranged in front of the gluing assembly, the pressure intensity of the to-be-glued area is reduced in the gluing process, the pressure difference is generated between the to-be-glued area and the surrounding environment, bubbles generated due to rapid filling of the offset area are reduced, and the gluing quality is improved. Therefore, the technical problem of how to coat the high-viscosity glue material on the patterned substrate, especially on the surface with large offset, with high efficiency and high quality is solved.

Description

Technical Field

[0001] The present application relates to the technical field of gluing, and in particular to a slit-type gluing device and a gluing method. Background Art

[0002] In the prior art, it is difficult to achieve high-quality coating of high-viscosity adhesives for graphic substrates, especially those with large steps and complex surfaces. When faced with such complex and changeable surface structures, traditional adhesive coating technology often cannot ensure that the adhesive can be evenly and consistently distributed on the entire surface. Due to the high variations in these surfaces, bubbles are easily formed during the flow of the adhesive, which not only destroys the uniformity and integrity of the film layer, but also reduces the quality of the film layer. The decline in the quality of the film layer will directly affect the performance of the final product, such as electrical insulation, sealing, mechanical strength, etc., and thus pose a potential threat to the overall quality and service life of the product. Summary of the invention

[0003] In order to at least overcome the above-mentioned deficiencies in the prior art, the present application provides a slit-type gluing device and a gluing method, wherein the slit-type gluing device comprises a gluing component and a decompression component;

[0004] The glue coating assembly includes a coating nozzle, a coating channel and a colloid storage bin, the colloid storage bin contains coating glue, the coating glue flows out of the coating nozzle through the coating channel to fill a set area, and the moving direction of the coating nozzle is a first direction;

[0005] The decompression component is arranged on one side of the glue coating component in the first direction, and is used to reduce the pressure of the set area, and the set area is located between the glue coating component and the decompression component.

[0006] In some possible implementations, the decompression component includes a suction nozzle, an air suction channel connected to the suction nozzle, and a motor, and the decompression component reduces the pressure of the set area under the control of the motor.

[0007] In some possible implementations, the motor can adjust the pressure in a range of -80 kPa to -20 kPa.

[0008] In some possible implementations, the distance between the coating nozzle and the suction nozzle is 5 to 100 mm;

[0009] The movement speeds of the glue coating component and the decompression component in the first direction are the same.

[0010] In some possible implementations, the gas flow direction in the air suction channel is a direction away from the suction nozzle.

[0011] In some possible implementations, the coating glue includes polyimide photoresist or photopolymer photoresist.

[0012] The present application also provides a gluing method, which is applied to any of the above-mentioned slit-type gluing devices, and the method comprises:

[0013] Providing a substrate, wherein a first surface of the substrate is provided with an area to be coated with glue;

[0014] The slit-type glue coating device is used to coat glue on the area of ​​the substrate to be coated with glue at a first speed.

[0015] In some possible implementations, the step of using the slit-type glue coating device to coat the substrate area to be coated with glue at a first speed includes:

[0016] The decompression component of the slit coating device moves along the first direction at the first speed on the first surface of the substrate, and the pressure of each point of the decompression component along the vertical coating direction is set to be the same, so as to reduce the pressure of the substrate in the area to be coated with glue;

[0017] The glue coating component of the slit-type glue coating device is used to coat the area to be coated with glue after the pressure is reduced along the first direction at the first speed.

[0018] In some possible implementations, the second surface of the substrate is disposed on a carrier;

[0019] The substrate includes a redistribution layer, the redistribution layer includes an insulating layer, a wiring is arranged in the insulating layer, and the wiring runs through the first surface of the substrate.

[0020] In some possible implementations, the area to be coated with glue includes at least one first step surface and at least one second step surface, and the first step surface is lower than the second step surface.

[0021] Based on any one of the above aspects, the slit-type gluing device and gluing method provided by the present application, by setting a decompression component in front of the gluing component, reduces the pressure in the area to be glued during the gluing process, so that a pressure difference is formed between the area to be glued and the surrounding environment, thereby reducing bubbles generated by rapid filling of the step area, thereby solving the technical problem of how to efficiently and high-quality coat high-viscosity glue on a graphic substrate, especially on a surface with a large step. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 A schematic diagram of the slit-type glue coating device provided in an embodiment of the present application when in use;

[0024] Figure 2 A top view of the slit-type glue coating device provided in an embodiment of the present application when in use;

[0025] Figure 3 A schematic diagram of a process for the gluing method provided in an embodiment of the present application;

[0026] Figure 4 A flowchart of step S12 provided in an embodiment of the present application.

[0027] Icons: Glue coating component-100; coating nozzle-110; coating channel-120; coating glue-130; decompression component-200; suction nozzle-210; suction channel-220; substrate-300; first surface-301; second surface-302; setting area-310; area to be glued-320; insulating layer-330; routing-340; first step surface-350; second step surface-360; carrier-400; first direction-D1; air flow direction-D2; distance between coating nozzle and suction nozzle-d. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0031] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] The specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings.

[0033] The inventors have found that it is difficult to achieve efficient and high-quality coating of high-viscosity adhesives on patterned substrates, especially complex surfaces with large step differences. Traditional adhesive coating technology cannot ensure that the adhesive can be evenly and consistently distributed on the entire surface when dealing with such complex and changeable surface structures. Due to the change in surface height, bubbles are easily formed during the flow of the adhesive, which destroys the uniformity and integrity of the film layer and reduces the quality of the film layer. This decline in film quality will directly affect the performance and reliability of the final product, thereby posing a hidden danger to the overall quality and service life of the product.

[0034] The present application provides a slit-type glue coating device, including a glue coating component 100 and a decompression component 200 .

[0035] The coating assembly 100 includes a coating nozzle 110, a coating channel 120 and a colloid storage bin, wherein the colloid storage bin contains a coating glue 130, and the coating glue 130 flows out of the coating nozzle 110 through the coating channel 120 to fill the set area 310, and the moving direction of the coating nozzle 110 is a first direction D1. The design of the coating nozzle 110 ensures that the coating glue 130 can flow out evenly at a stable flow rate and fill the preset set area 310. The coating nozzle 110 can move along the first direction D1, thereby achieving continuous coating of different parts of the substrate 300.

[0036] The decompression assembly 200 is disposed on one side of the gluing assembly 100 in the first direction D1 and is used to reduce the pressure of the setting area 310 . The setting area 310 is located between the gluing assembly 100 and the decompression assembly 200 .

[0037] The main function of the decompression component 200 is to reduce the pressure in the glue coating area. By reducing the pressure in the set area 310, the formation of bubbles during the glue coating process can be effectively reduced. The decompression component 200 ensures that the coating glue 130 can be more smoothly attached to the surface of the substrate 300 during the filling process. Even on the surface of the substrate 300 with a large step difference, the pressure difference between the set area 310 formed by the decompression component 200 and the outside world can ensure the uniformity and quality of the coated glue 130 layer.

[0038] When using the slit-type glue coating device provided in this embodiment, please refer to Figure 1 and Figure 2 ,, firstly, a substrate 300 is provided, on which a region 320 to be coated with glue is provided, and the region 320 to be coated with glue includes a plurality of set regions 310. Then, a slit-type glue coating device is used to coat the region 320 to be coated with glue of the substrate 300 along a first direction D1 at a first speed. In this process, the decompression component 200 reduces the pressure of the set region 310 in the front, and the coating component fills the set region 310 with the coating glue 130 in the back. The slit-type glue coating device can be set to a first speed, and the first speed is comprehensively considered according to factors such as the viscosity of the coating glue 130, the material of the substrate 300, and the specific size of the region 320 to be coated with glue, so as to ensure the best coating effect.

[0039] In some possible implementations, the decompression assembly 200 includes a suction nozzle 210, an air suction channel 220 connected to the suction nozzle 210, and a motor. The decompression assembly 200 reduces the pressure of the set area 310 under the control of the motor.

[0040] In this embodiment, the suction nozzle 210 can generate negative pressure through the suction channel 220 under the drive of the motor, thereby reducing the pressure in the set area 310. The suction channel 220 is responsible for transmitting the negative pressure generated at the suction nozzle 210 to the motor side, forming a complete negative pressure system. The motor can not only control the opening and closing of the suction nozzle 210, but also change the negative pressure intensity of the suction channel 220 by adjusting the speed, thereby realizing the regulation of the pressure in the set area 310.

[0041] By reducing the pressure in the set area 310, the slit-type glue coating device can reduce the formation of bubbles during the glue coating process, thereby ensuring the uniformity and integrity of the coating. At the same time, the decompression component 200 can make the glue coating operation smoother, reduce rework and downtime caused by bubble problems, and improve overall production efficiency.

[0042] In addition, the suction channel 220 and the suction nozzle 210 can be configured as detachable components, making daily cleaning and maintenance more convenient and reducing costs.

[0043] In some possible implementations, the motor can adjust the pressure in a range of -80 kPa to -20 kPa.

[0044] In this embodiment, by further setting the adjustable pressure range of the motor, the applicability and flexibility of the device are improved. The adjustable pressure range of the motor enables the decompression component 200 to adjust the pressure of the set area 310 according to different gluing requirements and substrate 300 characteristics. Within the range of -80kPa to -20kPa, the decompression component 200 can significantly reduce the formation of bubbles during the gluing process, especially when dealing with high-viscosity glue materials and complex surface structures of the substrate 300. The operator can choose a more suitable negative pressure within this range. In addition, the adjustable pressure range of the motor also enhances the versatility and adaptability of the slit-type gluing device. Whether it is dealing with a flat circuit board or an optical device with a complex structure, the decompression component 200 can provide a suitable pressure environment to ensure the smooth progress of the gluing operation.

[0045] For some possible implementations, please refer to Figure 1 , the distance d between the coating nozzle 110 and the suction nozzle 210 is 5 to 100 mm; the moving speeds of the glue coating component 100 and the decompression component 200 in the first direction D1 are the same.

[0046] In this embodiment, by setting the distance d between the coating nozzle 110 and the suction nozzle 210, it is helpful to form a stable glue coating environment and avoid damage to the glue layer caused by the close distance between the two, and the inability to effectively reduce the pressure of the set area 310 due to the long distance. Within this distance d range, the negative pressure generated by the suction nozzle 210 can act evenly on the coating area, effectively reducing the formation of bubbles, while ensuring that the glue flows out of the coating nozzle 110 at a uniform flow rate and fills the surface of the substrate 300. At the same time, a reasonable distance between the coating nozzle 110 and the suction nozzle 210 also helps to improve the efficiency of the glue coating operation. Within this distance d range, the glue coating component 100 can quickly respond to and adapt to different glue coating requirements to ensure the continuity and stability of the glue coating operation.

[0047] When the slit-type glue coating device provided in this embodiment is used to coat glue on the substrate 300 , the decompression assembly 200 and the glue coating assembly 100 cooperate to decompress and coat glue on the to-be-coated region 320 of the substrate 300 along the first direction D1 at a first speed.

[0048] For some possible implementations, please refer to Figure 1 The gas flow direction D2 in the air suction channel 220 is a direction away from the suction nozzle 210 .

[0049] In this embodiment, since the decompression assembly 200 is intended to form a negative pressure environment in the set area 310 , the air flow direction D2 of the gas should be away from the suction nozzle 210 .

[0050] In some possible implementations, the coating glue 130 includes polyimide photoresist or photopolymer photoresist.

[0051] In this embodiment, the coating glue 130 uses polyimide photoresist or photopolymer photoresist. Polyimide photoresist has high viscosity, high thermal stability and good chemical resistance, and is suitable for application scenarios that need to withstand high temperature or chemical corrosion. It can form a uniform coating during the coating process and maintain stable performance during the photolithography process, thereby ensuring high-precision pattern transfer. Photopolymer photoresist has the characteristics of high resolution, good adhesion and easy processing. It can react chemically quickly under light to form the desired pattern, and has good adhesion with the substrate 300, which helps to reduce the problem of falling off or peeling in subsequent processes.

[0052] The present application also provides a method for coating glue, which is applied to any of the aforementioned slit-type coating devices, please refer to Figure 3 , the method comprises the following steps.

[0053] Step S11 , providing a substrate 300 , wherein a first surface 301 of the substrate 300 is provided with an area 320 to be coated with glue.

[0054] Step S12: Use the slit-type glue coating device to coat glue on the area 320 of the substrate 300 to be coated with glue at a first speed.

[0055] In this step, the slit-type glue coating device is configured to coat the coating glue 130 on the to-be-coated area 320 of the substrate 300 at a first speed. The first speed can be adjusted according to the properties of the glue, the material of the substrate 300, and the desired coating effect. For example, for high-viscosity glue, the coating speed may need to be reduced to ensure that the glue can be evenly coated; while for application scenarios that require rapid glue coating, the coating speed can be increased. At the same time, by using the aforementioned slit-type glue coating device, the formation of bubbles in the coating glue 130 during the coating process can be effectively reduced.

[0056] For some possible implementations, please refer to Figure 4 , step S12 includes the following steps.

[0057] In step S121, the decompression component 200 of the slit-type glue coating device moves at the first speed along the first direction D1 on the first surface 301 of the substrate 300, and sets the pressure of each point of the decompression component 200 along the vertical coating direction to be the same to reduce the pressure of the area 320 of the substrate 300 to be glued.

[0058] In this step, the decompression component 200 of the slit-type glue coating device moves at a first speed on the first surface 301 of the substrate 300 and ensures that the pressure at each point in the vertical coating direction is consistent, thereby effectively reducing the pressure of the set area 310 on the area to be glued 320. This decompression treatment helps to make the surface of the substrate 300 reach a relatively stable low-pressure environment before glue coating, and forms a pressure difference with the surrounding environment, which provides favorable conditions for the subsequent glue coating process.

[0059] Step S122 : Use the glue coating assembly 100 of the slit glue coating device to coat the glue on the depressurized area 320 along the first direction D1 at the first speed.

[0060] In this step, the glue coating component 100 of the slit glue coating device applies glue to the depressurized area 320 to be glued, that is, the aforementioned set area 310, along the first direction D1 at the same speed as the decompression component 200. Since the pressure in the area has been reduced by the decompression component 200, the glue can be more evenly distributed on the surface of the substrate 300 during glue coating, avoiding the problem of uneven glue coating caused by uneven pressure, thereby improving the uniformity and consistency of glue coating.

[0061] At the same time, step S121 and step S122 can be performed continuously with a consistent speed, which can improve the production efficiency of the entire gluing process.

[0062] In some possible embodiments, the second surface 302 of the substrate 300 is disposed on a carrier 400 ; the substrate 300 includes a redistribution layer, the redistribution layer includes an insulating layer 330 , a trace 340 is disposed in the insulating layer 330 , and the trace 340 runs through the first surface 301 of the substrate 300 .

[0063] In this embodiment, the main function of the carrier plate 400 is to provide support and stability to ensure that the substrate 300 can remain flat during the process of gluing, etc. The area 320 to be glued on the substrate 300 is arranged on the first surface 301 .

[0064] In some possible implementations, the area to be glued 320 includes at least one first step surface 350 and at least one second step surface 360 ​​, and the first step surface 350 is lower than the second step surface 360 ​​.

[0065] In this embodiment, due to the presence of step surfaces in the area 320 to be coated with glue, the aforementioned slit-type glue coating device is required. By using the decompression component 200 and the glue coating component 100 in combination, the coating glue 130 can form a uniform coating between different step surfaces.

[0066] In summary, the present application provides a slit-type gluing device and a gluing method, wherein the slit-type gluing device comprises a gluing component 100 and a decompression component 200; the gluing component 100 comprises a coating nozzle 110, a coating channel 120 and a colloid storage bin, wherein the colloid storage bin contains a coating glue 130, and the coating glue 130 flows out of the coating nozzle 110 through the coating channel 120 to fill a set area 310, and the moving direction of the coating nozzle 110 is a first direction D1; the decompression component 200 is arranged on one side of the gluing component 100 in the first direction D1, and is used to reduce the pressure of the set area 310, and the set area 310 is located between the gluing component 100 and the decompression component 200. The slit-type glue coating device provided in the present application reduces the pressure of the area to be glued 320 during the glue coating process by setting a decompression component 200 in front of the glue coating component 100, so that a pressure difference is generated between the area to be glued 320 and the surrounding environment, thereby reducing bubbles generated by quickly filling the step area, thereby solving the technical problem of how to efficiently and high-quality coat high-viscosity glue on a graphic substrate, especially on a surface with a large step.

[0067] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0068] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A slit type glue coating device, characterized in that: It includes a gluing component and a pressure relief component; The glue coating assembly includes a coating nozzle, a coating channel and a colloid storage bin, the colloid storage bin contains coating glue, the coating glue flows out of the coating nozzle through the coating channel to fill a set area, and the moving direction of the coating nozzle is a first direction; The decompression component is arranged on one side of the glue coating component in the first direction, and is used to reduce the pressure of the set area, and the set area is located between the glue coating component and the decompression component.

2. The slit-type glue coating device according to claim 1, characterized in that: The decompression component includes a suction nozzle, an air suction channel connected to the suction nozzle, and a motor. The decompression component reduces the pressure of the set area under the control of the motor.

3. The slit-type glue coating device according to claim 2, characterized in that: The adjustable pressure range of the motor is -80kPa to -20kPa.

4. The slit-type glue coating device according to claim 2, characterized in that: The distance between the coating nozzle and the suction nozzle is 5 to 100 mm; The movement speeds of the glue coating component and the decompression component in the first direction are the same.

5. The slit-type glue coating device according to claim 2, characterized in that: The gas flow direction in the air suction channel is a direction away from the suction nozzle.

6. The slit-type glue coating device according to claim 1, characterized in that: The coating glue comprises polyimide photoresist or photopolymer photoresist.

7. A method for coating glue, characterized in that: The method applied to the slit-type glue coating device according to any one of claims 1 to 6 comprises: Providing a substrate, wherein a first surface of the substrate is provided with an area to be coated with glue; The slit-type glue coating device is used to coat glue on the area of ​​the substrate to be coated with glue at a first speed.

8. The gluing method according to claim 7, characterized in that: The step of using the slit-type glue coating device to coat the substrate area to be coated with glue at a first speed comprises: The decompression component of the slit-type glue coating device moves along the first direction at the first speed on the first surface of the substrate, and the pressure of each point of the decompression component along the vertical coating direction is set to be the same, so as to reduce the pressure of the substrate in the area to be glued; The glue coating component of the slit-type glue coating device is used to coat the area to be coated with glue after the pressure is reduced along the first direction at the first speed.

9. The gluing method according to claim 7, characterized in that: The second surface of the substrate is disposed on a carrier plate; The substrate includes a redistribution layer, the redistribution layer includes an insulating layer, a wiring is arranged in the insulating layer, and the wiring runs through the first surface of the substrate.

10. The gluing method according to claim 7, characterized in that: The area to be coated with glue includes at least one first step surface and at least one second step surface, and the first step surface is lower than the second step surface.

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