A heating device and an evaporation apparatus

Abstract

The application discloses a heating device and an evaporation equipment. The heating device comprises an evaporation assembly, an isolation assembly and at least one supporting assembly. The isolation assembly is arranged circumferentially around the evaporation assembly. The first end of the supporting assembly is connected with the evaporation assembly, and the second end of the supporting assembly is connected with the isolation assembly. The evaporation assembly is used for evaporating a material to be evaporated. The isolation assembly is used for isolating a heating source for heating the evaporation assembly. The supporting assembly is used for supporting the evaporation assembly, so that there is a height difference between the opening of the evaporation assembly and the isolation assembly. In the vertical direction of the arrangement direction of the evaporation assembly and the isolation assembly, the opening of the evaporation assembly is higher than the isolation assembly. The opening of the evaporation assembly can be arranged to be higher than the isolation assembly by using the internal supporting assembly, so that the pollution of the new material by the old material remaining in the heating device during the evaporation of the material to be evaporated by the evaporation assembly is avoided, and the normal preparation efficiency of the evaporation equipment in the preparation of the internal film layer of the display device is ensured.

Description

Technical Field

[0001] This disclosure generally relates to the field of display device technology, and more specifically to a heating device and vapor deposition equipment. Background Technology

[0002] With the continuous development of display technology, organic light-emitting diode (OLED) display devices are widely used in various electronic products due to their low power consumption, portable design, and ease of achieving flexible displays.

[0003] Specifically, in the process of preparing the above-mentioned OLED display device, an evaporation machine can be used to deposit the internal film layer of the OLED display device.

[0004] However, when using the crucible inside the vapor deposition machine to evaporate the material to be deposited, the old material can easily contaminate the new material during the material replacement process, which leads to a longer film preparation time.

[0005] Therefore, the low efficiency of fabrication of internal films in existing OLED display devices has become an urgent problem to be solved. Summary of the Invention

[0006] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a heating device and a vapor deposition equipment. The heating device can use an internal support component to make the opening of the evaporation component higher than the isolation component, thereby avoiding the contamination of the new material by the old material remaining in the heating device during the evaporation of the material to be vaporized in the evaporation component, and ensuring the normal preparation efficiency of the vapor deposition equipment when preparing the internal film layer of the display device.

[0007] The heating device is as follows:

[0008] According to a first aspect of this application, a heating device is provided, the heating device including an evaporation component, an isolation component, and at least one support component; wherein, the isolation component is arranged circumferentially around the evaporation component; a first end of the support component is connected to the evaporation component, and a second end of the support component is connected to the isolation component;

[0009] The evaporation assembly is used to evaporate the material to be deposited.

[0010] The isolation component is used to isolate the heating source of the evaporation component;

[0011] The support component is used to support the evaporation component such that there is a height difference between the opening of the evaporation component and the isolation component; wherein, in the direction perpendicular to the arrangement direction of the evaporation component and the isolation component, the opening of the evaporation component is higher than the isolation component.

[0012] In addition, the heating device of this application may also have the following additional technical features:

[0013] In conjunction with the first aspect, in one possible implementation, the evaporation assembly includes a columnar cavity and an annular component sleeved at one end of the columnar cavity, wherein the inner area of ​​the annular component matches the opening area of ​​the columnar cavity.

[0014] The first end of the support component is connected to the side of the annular component near the columnar cavity.

[0015] In conjunction with the first aspect, in one possible implementation, the orthographic projection pattern of the support component partially overlaps with the orthographic projection patterns of the annular component and the isolation component, respectively.

[0016] In conjunction with the first aspect, in one possible implementation, a gap region exists between the annular component and the isolation component along the extending direction of the annular component toward the isolation component;

[0017] The partial orthographic projection pattern of the support component coincides with the orthographic projection pattern of the interval region.

[0018] In conjunction with the first aspect, in one possible implementation, the support component further includes a third end disposed between the first end and the second end, the third end extending toward the bottom of the evaporation component, wherein the third end contacts the end of the isolation component near the evaporation component.

[0019] In conjunction with the first aspect, in one possible implementation, the orthographic projection pattern of the support component partially overlaps with the orthographic projection pattern of the isolation component; wherein one end of the overlapping portion corresponds to the second end, and the other end corresponds to the third end.

[0020] In conjunction with the first aspect, in one possible implementation, the extension direction of the first end is perpendicular to the extension direction of the second end, and the length of the support component in the extension direction of the first end is 12 mm.

[0021] In conjunction with the first aspect, in one possible implementation, the support component is made of alumina ceramic.

[0022] In conjunction with the first aspect, in one possible implementation, the evaporation component is a crucible.

[0023] According to a second aspect of this application, a vapor deposition apparatus is provided, which includes the heating device described in the first aspect.

[0024] Compared to existing technologies where heating devices in vapor deposition equipment are prone to contaminating the material to be deposited during evaporation, the heating device and vapor deposition equipment provided in this application embodiment can utilize at least one support component to ensure that the opening of the evaporation component inside the heating device is higher than the isolation component. This avoids contamination of the new material by the old material remaining inside the heating device during the evaporation process of the material to be deposited, thus ensuring the normal preparation efficiency of the vapor deposition equipment when preparing the internal film layer of the display device. Attached Figure Description

[0025] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0026] Figure 1 This is a schematic diagram of the heating device inside the conventional vapor deposition equipment of this application;

[0027] Figure 2 This is a schematic diagram of the structure of the heating device 20 provided in an embodiment of this application;

[0028] Figure 3 This is another structural schematic diagram of the heating device 20 provided in the embodiments of this application;

[0029] Figure 4 This is another structural schematic diagram of the heating device 20 provided in the embodiments of this application;

[0030] Figure 5 A design schematic diagram of a set of support components 203 provided in an embodiment of this application;

[0031] Figure 6 This is a schematic diagram of the process for preparing the internal film layer of an OLED display device provided in an embodiment of this application;

[0032] In the above image:

[0033] 10-Heating device; 101-Evaporation assembly; 102-Isolation assembly; 103-Gap area between the opening of evaporation assembly 101 and isolation assembly 102; 20-Heating device; 201-Evaporation assembly; 202-Isolation assembly; 203-Support assembly; 2031-First end of support assembly 203; 2032-Second end of support assembly 203; 2033-Third end of support assembly 203; 301-Gap area between annular component 2012 and isolation assembly 202; 401-Overlapping area between support assembly 203 with third end 2033 and isolation assembly 202. Detailed Implementation

[0034] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0035] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present application will now be described in detail with reference to the accompanying drawings and embodiments. Furthermore, the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The terms "first" and "second," etc., in the specification and claims of the embodiments of this application are used to distinguish different objects, not to describe a specific order of objects.

[0036] With the continuous development of display technology, organic light-emitting diode (OLED) display devices are widely used in various electronic products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, and desktop computers due to their characteristics of being all-solid-state, ultra-thin, having no viewing angle limitations, fast response, being able to operate at room temperature, and being easy to realize flexible and 3D displays.

[0037] Specifically, in the process of preparing the above-mentioned OLED display device, the deposition of the internal film layer of the OLED display device can be achieved by using evaporation equipment (e.g., evaporation machine).

[0038] For example, Figure 1 This is a schematic diagram of the heating element 10 inside the conventional vapor deposition equipment of this application, as shown below. Figure 1 As shown, the heating device 10 may include an evaporation assembly 101 and an isolation assembly 102 disposed around the opening of the evaporation assembly 101; wherein, the evaporation assembly 101 may be, for example, a crucible, and the isolation assembly 102 may be, for example, a sealing ring.

[0039] In a specific implementation, the heating source inside the heating device 10 can heat the evaporation component 101 so that the evaporation component 101 evaporates the material to be deposited placed in its own cavity into a gaseous form, thereby completing the evaporation of the material to be deposited by the heating device 10.

[0040] For example, in the direction perpendicular to the arrangement direction of the evaporation assembly 101 and the isolation assembly 102 (i.e., Figure 1 As shown in the vertical direction, the opening of the evaporator assembly 101 is set lower than that of the isolation assembly 102, which results in a gap between the opening of the evaporator assembly 101 and the isolation assembly 102. Figure 1The interval region 103 is shown.

[0041] Based on this, during the process of heating the evaporation component 101 with the heating source inside the heating device 10 to evaporate the material to be deposited, since the interval region 103 is a blank area, the evaporated material is easily deposited through the interval region 103 on the side of the heating source and the isolation component 102 away from the evaporation component 101. This leads to the old material deposited inside the heating device 10 being prone to contaminating the new material during the replacement of the material to be deposited. At the same time, the interval region 103 is also prone to blockage, which affects the normal preparation efficiency of the evaporation equipment when preparing the internal film layer of the display device and prolongs the preparation time of the film layer.

[0042] Therefore, the low efficiency of fabrication of internal films in existing OLED display devices has become an urgent problem to be solved.

[0043] Based on this, the present application provides a heating device and a vapor deposition equipment. The heating device can use an internal support component to make the opening of the evaporation component higher than the isolation component, thereby avoiding the contamination of the new material by the old material remaining in the heating device during the evaporation of the material to be vaporized in the evaporation component, and ensuring the normal preparation efficiency of the vapor deposition equipment when preparing the internal film layer of the display device.

[0044] Figure 2 This is a schematic diagram of a structure of the heating device 20 provided in an embodiment of this application, as shown below. Figure 2 As shown, the heating device 20 may include an evaporation component 201, an isolation component 202, and at least one support component 203; wherein, the isolation component 202 is arranged circumferentially around the evaporation component 201; the first end 2031 of the support component 203 is connected to the evaporation component 201, and the second end 2032 of the support component 203 is connected to the isolation component 202.

[0045] Specifically, the support component 203 can be used to support the evaporation component 201 so that there is a height difference between the opening of the evaporation component 201 and the isolation component 202; wherein, in the direction perpendicular to the arrangement direction of the evaporation component 201 and the isolation component 202, the opening of the evaporation component 201 is higher than that of the isolation component 202.

[0046] In one possible implementation, the evaporation assembly 201 can be used to evaporate the material to be deposited. The material to be deposited can be, for example, a metal, alloy, or compound.

[0047] For example, the material used to prepare the evaporation component 201 can be determined based on the melting point and chemical activity of the material to be evaporated. For instance, the evaporation component 201 can be a crucible, and its material can include graphite, tungsten, molybdenum, etc.

[0048] It should be noted that before using the evaporation component 201 to evaporate the material to be deposited, the evaporation component 201 needs to be cleaned to avoid contamination of the material to be deposited.

[0049] In one possible implementation, the evaporation assembly 201 can be heated by a heating source inside the heating device 20 to achieve the evaporation operation of the evaporation assembly 201 on the material to be deposited.

[0050] For example, the evaporation component 201 can be heated by different heating methods.

[0051] Specifically, when the material used to manufacture the evaporation component 201 contains a resistive material (such as high-melting-point metals like tungsten or molybdenum), the evaporation component 201 can be heated by contacting the evaporation component 201 with a resistive heating element (such as a resistance wire or a resistance sheet).

[0052] Optionally, a high-energy electron beam can be emitted from an electron gun and focused onto the evaporation component 201 to heat the evaporation component 201 by means of electron beam heating.

[0053] Alternatively, an alternating magnetic field can be generated using an induction coil to generate eddy currents within the evaporation assembly 201, thereby achieving non-contact heating of the evaporation assembly 201 through induction heating.

[0054] Optionally, a halogen bulb can be placed near the evaporation assembly 201 to heat the evaporation assembly 201 through radiation heating. It should be noted that this application does not limit the heating method of the evaporation assembly 201.

[0055] In one possible implementation, the isolation component 202 can be used to isolate the heating source of the heating evaporation component 201.

[0056] For example, the isolation component 202 may be disposed around the opening of the evaporation component 201. For example, the isolation component 202 may be a sealing ring.

[0057] Specifically, when the isolation component 202 is a sealing ring, the isolation component 202 can have characteristics such as high temperature resistance, low gas evolution rate, good compatibility with the material of the evaporation component 201 and the material to be vaporized, and easy processing and installation.

[0058] In one possible implementation, at least one support component 203 may be provided between the circumferential opening of the evaporation component 201 and the isolation component 202. The first end 2031 of the support component 203 is connected to the evaporation component 201, and the second end 2032 of the support component 203 is connected to the isolation component 202.

[0059] For example, the support component 203 can be connected to the evaporation component 201 through its first end 2031, so that the opening of the evaporation component 201 is set higher than that of the isolation component 202.

[0060] Based on this, refer to Figure 2 The direction perpendicular to the arrangement direction of the evaporation assembly 201 and the isolation assembly 202 (i.e., Figure 2 (As shown in the vertical direction), the opening of the evaporation component 201 is higher than that of the isolation component 202.

[0061] In this embodiment, by designing a support component 203 between the evaporation component 201 and the isolation component 202, the evaporation component 201 can be positioned higher than the isolation component 202, thereby avoiding the situation where... Figure 1 Because the existing isolation component 202 is set higher than the evaporation component 201, the old material deposited on the isolation component 202 when the new material is vapor-deposited on the evaporation component 201 causes contamination of the new material.

[0062] For example, the material used to fabricate the support component 203 may be alumina ceramic (i.e., Al2O3 ceramic).

[0063] For example, a set of support components 203 may be provided between the circumferential direction of the evaporation component 201 and the isolation component 202, wherein the set of support components 203 may be two support components 203 evenly disposed between the circumferential direction of the evaporation component 201 and the isolation component 202.

[0064] Compared to the existing technology where heating devices in vapor deposition equipment are prone to contaminating the material to be vaporized during evaporation, the heating device 20 provided in this application embodiment can utilize at least one support component 203 to ensure that the opening of the evaporation component 201 inside the heating device 20 is higher than the isolation component 202. This avoids contamination of the new material by the old material remaining inside the heating device 20 during the evaporation process of the evaporation component 201 inside the heating device 20, thus ensuring the normal preparation efficiency of the vapor deposition equipment when preparing the internal film layer of the display device.

[0065] In another embodiment of this application, a specific structural distribution of the evaporation assembly 201 is also provided. For example, Figure 3 This is another structural schematic diagram of the heating device 20 provided in the embodiments of this application, as shown below. Figure 3 As shown, the evaporation assembly 201 may include a cylindrical cavity 2011 and an annular component 2012 sleeved on one end of the cylindrical cavity 2011, wherein the inner ring area of ​​the annular component 2012 matches the opening area of ​​the cylindrical cavity 2011.

[0066] Specifically, the first end 2031 of the support component 203 is connected to the side of the annular component 2012 near the columnar cavity 2011.

[0067] In this embodiment of the application, when the evaporation component 201 includes an annular component 2012, the support component 203 can be connected to the annular component 2012 through the first end 2031, so that the connection between itself and the evaporation component 201 is more stable, thereby ensuring the supporting role of the support component 203 in the evaporation component 201.

[0068] In one possible implementation, the evaporation assembly 201 may include a columnar cavity 2011 and an annular component 2012 sleeved on one end of the columnar cavity 2011.

[0069] For example, the inner ring area of ​​the annular component 2012 can be matched with the opening area of ​​one end of the cylindrical cavity 2011; wherein the cylindrical cavity 2011 can be used to place the material to be vaporized.

[0070] For example, the inner radius of the annular component 2012 can be the same as the radius of the opening at one end of the cylindrical cavity 2011 (i.e., the circumference of the inner circle of the annular component 2012 is the same as the circumference of the opening at one end of the cylindrical cavity 2011).

[0071] For example, one end opening of the cylindrical cavity 2011 can be welded to the inner ring of the annular component 2012.

[0072] In one possible implementation, the first end 2031 of the support component 203 can be connected to the side of the annular component 2012 near the columnar cavity 2011.

[0073] For example, when the support component 203 is configured as a straight line, the support component 203 can, based on the connection between its first end 2031 and the side of the annular component 2012 near the columnar cavity 2011, make the annular component 2012 higher than the isolation component 202 by its own thickness, so that the opening of the columnar cavity 2011 connected to the annular component 2012 is higher than the isolation component 202.

[0074] For example, refer to Figure 3 When the support component 203 is set in a right-angle shape (i.e., the first end 2031 and the second end 2032 of the support component 203 are perpendicular to each other) and its first end 2031 is connected to the side of the annular component 2012 near the columnar cavity 2011, the support component 203 can make the annular component 2012 higher than the isolation component 202 by its own length in the direction of the first end 2031, so that the opening of the columnar cavity 2011 connected to the annular component 2012 is higher than the isolation component 202.

[0075] In another embodiment of this application, a specific arrangement of the components inside the heating device 20 is also provided.

[0076] In one possible implementation, the outer ring area of ​​the annular component 2012 of the evaporation assembly 201 can be matched with the area of ​​the opening region enclosed by the isolation component 202 surrounding the evaporation assembly 201.

[0077] For example, when the orthographic projection pattern of the heating device 20 is specifically the outer ring of the annular component 2012 seamlessly connected to the isolation component 202, the area of ​​the outer ring of the annular component 2012 can match the area of ​​the opening region enclosed by the isolation component 202; wherein, the orthographic projection direction can be, for example, the direction from the opening end of the evaporation component 201 to the bottom end of the evaporation component 201.

[0078] Based on this, the orthographic projection pattern of the support component 203 can overlap with the orthographic projection patterns of the annular component 2012 and the isolation component 202, respectively.

[0079] Specifically, the support component 203 has a partial orthographic projection pattern at the first end 2031 that coincides with the orthographic projection pattern of the annular component 2012, and a partial orthographic projection pattern at the second end 2032 that coincides with the orthographic projection pattern of the isolation component 202.

[0080] In one possible implementation, along the extending direction from the annular component 2012 of the evaporation assembly 201 to the isolation assembly 202, there may be a space between the annular component 2012 and the isolation assembly 202 as follows: Figure 3 The interval region 301 is shown. When the direction from the opening end of the evaporation component 201 to the bottom end of the evaporation component 201 is vertical, the extension direction of the annular component 2012 of the evaporation component 201 towards the isolation component 202 can be horizontal.

[0081] For example, when the orthographic projection pattern of the heating device 20 specifically shows an annular blank area between the outer ring of the annular component 2012 and the isolation component 202, a space such as... can exist between the annular component 2012 and the isolation component 202. Figure 3 The interval region 301 shown; wherein, the orthographic projection direction may be, for example, the direction from the opening end of the evaporation component 201 to the bottom end of the evaporation component 201.

[0082] Based on this, a portion of the orthographic projection pattern of the support component 203 can coincide with the orthographic projection pattern of the interval region 301.

[0083] Specifically, the support component 203 has a partial orthographic projection pattern at the first end 2031 that coincides with the orthographic projection pattern of the annular component 2012, and a partial orthographic projection pattern at the second end 2032 that coincides with the orthographic projection pattern of the isolation component 202. The orthographic projection pattern of the area between the first end 2031 and the second end 2032 of the support component 203 can coincide with the orthographic projection pattern of the interval area 301.

[0084] In this embodiment, based on the gap region 301 between the annular component 2012 and the isolation component 202, the contact area between the support component 203 and the evaporation component 201 can be a hollow area. This hollow area can reduce heat dissipation inside the heating device 20 when the evaporation component 201 evaporates the material to be deposited, thus ensuring the evaporation efficiency of the evaporation component 201. At the same time, the hollow area avoids the material from blocking the gap region 301 when evaporating the material to be deposited.

[0085] In another embodiment of this application, other design forms of the support component 203 are also provided.

[0086] For example, Figure 4 This is another structural schematic diagram of the heating device 20 provided in the embodiments of this application, as shown below. Figure 4 As shown, the support component 203 may also include a third end 2033 disposed between the first end 2031 and the second end 2032, wherein the third end 2033 extends toward the bottom of the evaporation component 201.

[0087] Specifically, the third end 2033 is in contact with the end of the isolation component 202 that is close to the evaporation component 201.

[0088] In this embodiment, based on the design of the third end 2033 inside the support component 203 that is in contact with the end of the isolation component 202 that is close to the evaporation component 201, the setting position of the support component 203 can be quickly determined by the relative position of the third end 2033 and the end of the isolation component 202, thereby ensuring the accuracy of the setting position of the support component 203 inside the heating device 20.

[0089] In one possible implementation, the third end 2033 of the support component 203 can be located between the first end 2031 and the second end 2032.

[0090] For example, when the support component 203 is configured as a straight line, the third end 2033 can be located between the first end 2031 and the second end 2032 at a position that can contact the end of the isolation component 202 near the evaporation component 201, wherein the third end 2033 extends toward the bottom of the evaporation component 201 (i.e., the bottom of the columnar cavity 2011).

[0091] For example, when the first end 2031 and the second end 2032 of the support component 203 are at right angles (i.e., the first end 2031 and the second end 2032 of the support component 203 are perpendicular to each other) and the first end 2031 is connected to the side of the annular component 2012 near the columnar cavity 2011, the third end 2033 can be set as follows: Figure 4 The first end 2031 and the second end 2032 are located at a position where they can contact the end of the isolation component 202 that is close to the evaporation component 201; wherein, the third end 2033 is arranged parallel to the first end 2031 and perpendicular to the second end 2032.

[0092] In one possible implementation, the orthographic projection pattern of the support component 203 can partially overlap with the orthographic projection pattern of the isolation component 202, wherein one end of the overlapping part can correspond to the second end 2032 and the other end can correspond to the third end 2033.

[0093] For example, refer to Figure 4 Along the positive projection direction of the heating device 40 (i.e., the direction from the annular component 2012 to the columnar cavity 2011 of the evaporation component 201), the support component 203 with the third end 2033 forms an overlapping area 401 with the isolation component 202.

[0094] Specifically, since the third end 2033 of the support component 203 is in contact with the end of the isolation component 202 that is close to the evaporation component 201, one end of the overlapping area 401 corresponds to the third end 2033, and the other end corresponds to the first end 2031.

[0095] It should be noted that regardless of whether the outer ring area of ​​the annular component 2012 matches the area of ​​the opening region enclosed by the isolation component 202, or whether there is a relationship between the annular component 2012 and the isolation component 202, the following applies: Figure 3 The interval region 301 shown, the overlapping area 401 of the support component 203 and the isolation component 202 in the orthographic projection direction, one end of each corresponds to the third end 2033 of the support component 203, and the other end of each corresponds to the first end 2031 of the support component 203.

[0096] In one possible implementation, when the extension direction of the first end 2031 of the support component 203 is perpendicular to the extension direction of the second end 2032 of the support component 203, the length of the support component 203 in the extension direction of the first end 2031 is 12mm.

[0097] For example, Figure 5 This is a design schematic diagram of a set of support components 203 provided in an embodiment of this application. Specifically, Figure 5The set of support components 203 shown can be two support components 203 evenly arranged between the evaporation component 201 and the isolation component 202 as described in the previous embodiment.

[0098] For example, refer to Figure 5 Each support component 203 may include a first end 2031 and a second end 2032 arranged vertically, and a third end 2033 disposed between the first end 2031 and the second end 2032; wherein the third end 2033 is arranged parallel to the first end 2031 and perpendicular to the second end 2032.

[0099] Specifically, the support component 203 extends in the direction of the first end 2031 (i.e., Figure 5 The length in the vertical direction shown can be 12mm, and in the vertical direction of the extension direction of the first end 2031 (i.e., Figure 5 The length of the support component 203 in the horizontal direction (as shown) can be 12 mm; the length of the support component 203 in the vertical direction of the extension direction of the second end 2031 (i.e., Figure 5 The length of the support component 203 in the vertical direction shown can be 12mm; the length of the support component 203 in the direction of extension of the third end 2033 (i.e., Figure 5 The length in the vertical direction shown can be 12mm, and the length in the vertical direction of the extension direction of the third end 2033 (i.e., Figure 5 The length in the horizontal direction (as shown) can be 12mm.

[0100] It should be noted that the length of the support component 203 in the direction of extension of the first end 2031 and the length of the support component 203 in the direction of extension of the third end 2033 both end at the contact position with the extension of the second end 2032.

[0101] Secondly, in a set of support components 203, the shortest distance between the two first ends 2031 is 30.5 mm (with an error of 0.4 mm), and the longest distance between the two first ends 2031 is 32.9 mm; in a set of support components 203, the shortest distance between the two third ends 2033 is 34.8 mm, and the longest distance between the two third ends 2033 is 37.2 mm (with an error of 0.4 mm); in a set of support components 203, the longest distance between the two second ends 2032 is 45 mm.

[0102] It should be noted that the shortest and longest distances between the different ends of the aforementioned set of support components 203 can be designed based on the outer radius of the annular component 2012 of the evaporation component 201 and / or the size of the opening area formed by the isolation component 202. This application does not impose specific limitations on this.

[0103] In another embodiment of this application, a vapor deposition apparatus 30 is also described, which may include the heating device 20 in the foregoing embodiments.

[0104] For example, the vapor deposition equipment 30 may be 200mm in size. A 200mm vapor deposition machine.

[0105] For example, the internal film layer of an OLED display device can be prepared using evaporation equipment 30. Specifically, Figure 6 This is a schematic diagram of the process for preparing the internal film layer of an OLED display device according to an embodiment of this application, such as... Figure 6 As shown, the preparation process may specifically include the following steps:

[0106] Step 601: Establish a vacuum environment within the vapor deposition equipment 30.

[0107] For example, the vacuum level inside the vapor deposition equipment 30 can be set to 10. - ³Pa~10 -6 Pa, to establish the internal vacuum environment of the vapor deposition equipment 30.

[0108] It should be noted that the internal environment of the vapor deposition equipment 30 is set as a vacuum environment because the vapor deposition process of the material needs to be carried out in a high vacuum environment. Specifically, a high vacuum environment can reduce collisions between gas molecules and evaporating atoms / molecules, thus avoiding collisions between evaporating atoms and gas molecules before reaching the substrate, which could lead to a decrease in film quality. At the same time, a high vacuum environment can prevent the film from being oxidized or contaminated.

[0109] Step 602: Heat the evaporation component 201 in the vapor deposition equipment 30 to achieve evaporation of the material to be vaporized using the evaporation component 201.

[0110] For example, when the material used to manufacture the evaporation component 201 contains a resistive material (such as high-melting-point metals like tungsten or molybdenum), the evaporation component 201 can be heated by contacting the evaporation component 201 with a resistive heating element (such as a resistance wire or a resistance sheet).

[0111] Optionally, a high-energy electron beam can be emitted from an electron gun and focused onto the evaporation component 201 to heat the evaporation component 201 by means of electron beam heating.

[0112] Alternatively, an alternating magnetic field can be generated using an induction coil to generate eddy currents within the evaporation assembly 201, thereby achieving non-contact heating of the evaporation assembly 201 through induction heating.

[0113] Optionally, a halogen bulb can be placed near the evaporation assembly 201 to heat the evaporation assembly 201 through radiation heating. It should be noted that this application does not limit the heating method of the evaporation assembly 201.

[0114] Step 603: The evaporation atoms or molecules of the material to be deposited form the film layer inside the OLED display device.

[0115] For example, atoms or molecules formed by evaporating the material to be deposited can move in all directions in a straight line in a vacuum environment. After the atoms or molecules move to the substrate surface, they form the film layer inside the OLED display device through a series of processes such as adsorption, migration, nucleation and growth.

[0116] Specifically, evaporated atoms can aggregate at low-energy sites on the substrate surface to form atomic clusters, thereby achieving the above-mentioned nucleation process; subsequently, a continuous film layer can be formed based on the aggregation and connection of multiple atomic clusters.

[0117] Step 604: Cool the film layer formed in step 603.

[0118] It should be noted that after the film is formed, its temperature needs to be gradually cooled to room temperature to avoid stress or cracking of the film.

[0119] The vapor deposition equipment 30 provided in this application embodiment can utilize at least one support component 203 disposed in its internal heating device 20 to make the opening of the evaporation component 201 inside the heating device 20 higher than the isolation component 202, thereby avoiding the contamination of the new material by the old material remaining in the heating device 20 during the evaporation of the material to be vaporized by the evaporation component 201 inside the heating device 20, and ensuring the normal preparation efficiency of the vapor deposition equipment 30 when preparing the internal film layer of the display device.

[0120] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of disclosure in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the foregoing disclosed concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A heating device, characterized in that, The heating device includes an evaporation component, an isolation component, and at least one support component; wherein, the isolation component is arranged circumferentially around the evaporation component; the support component is in the form of a right angle, with a first end connected to the evaporation component and a second end connected to the isolation component; The evaporation assembly is used to evaporate the material to be deposited. The isolation component is used to isolate the heating source of the evaporation component; The support component is used to support the evaporation component such that there is a height difference between the opening of the evaporation component and the isolation component; wherein, in the direction perpendicular to the arrangement direction of the evaporation component and the isolation component, the opening of the evaporation component is higher than the isolation component; The evaporation assembly includes a columnar cavity and an annular component sleeved at one end of the columnar cavity, wherein the inner ring area of ​​the annular component matches the opening area of ​​the columnar cavity. The first end of the support assembly is connected to the side of the annular component near the columnar cavity; The support component further includes a third end disposed between the first end and the second end, the third end extending toward the bottom of the evaporation component, wherein the third end contacts the end of the isolation component near the evaporation component, and the third end is arranged parallel to the first end and perpendicular to the second end; Along the extending direction of the annular component toward the isolation assembly, there is a gap between the annular component and the isolation assembly; a portion of the orthographic projection pattern of the support assembly coincides with the orthographic projection pattern of the gap; wherein, the support assembly is made of alumina ceramic.

2. The heating device according to claim 1, wherein the length of the support assembly in the extending direction of the first end is 12 mm.

3. The heating device according to any one of claims 1-2, characterized in that, The evaporation component is a crucible.

4. A vapor deposition apparatus, characterized in that, Includes the heating device as described in any one of claims 1-3.

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