High-sensitivity electrocardio-phono-integrated sensor and installation method thereof

Abstract

The application discloses a high-sensitivity electrocardio and phonocardiogram integrated sensor and a mounting method thereof, and belongs to the technical field of biological medical sensors. The high-sensitivity electrocardio and phonocardiogram integrated sensor comprises a shell, an integrated circuit board arranged on the inner side of the shell, a top cover arranged on the shell, a auscultation diaphragm arranged between the top cover and the shell, an installation plate arranged on the inner side of the shell, a first support seat arranged on the side of the installation plate close to the auscultation diaphragm, a first mechanical layer arranged on the first support seat, and a first mass seat arranged on the other end of the first mechanical layer. The phonocardiogram sensor part of the application adopts a high-sensitivity design, the first mechanical layer is equally spaced and divided into three equal parts, and a cavity structure is formed between the first mechanical layer and a first piezoelectric sheet. The design increases the normal strain of the first piezoelectric sheet in the working process of the sensor, thereby improving the sensitivity of the phonocardiogram sensor.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of biological medical sensors, and particularly relates to a high-sensitivity electrocardio-phono-integrated sensor and a mounting method thereof. BACKGROUND

[0002] With the improvement of people's living standards, heart disease has become one of the major diseases affecting the health of Chinese residents, therefore, heart sound and electrocardio signals, as important indicators for evaluating the health status of the body, are of great significance for preventing cardiovascular diseases.

[0003] Traditional electrocardiographs and stethoscopes are used separately, and cannot accurately correlate and analyze electrocardio signals and heart sound signals at a specific time point, in fact, some heart tissue lesions cannot be directly reflected in electrocardio signals, but can be better reflected in heart sound signals, such as congenital valvular insufficiency, therefore, the detection of a single signal will lead to misjudgment of some complex heart diseases and miss the best treatment time, in addition, traditional acoustic stethoscopes have the disadvantages of poor low-frequency response, low sensitivity and being easily disturbed by environmental noise, therefore, in order to obtain more accurate heart sound signals, algorithms are usually used for filtering and noise reduction, so that heart murmur signals containing pathological information are processed as noise, affecting later processing and pathological research. SUMMARY

[0004] The application aims at the problems existing in the prior art, and provides a high-sensitivity electrocardio-phono-integrated sensor and a mounting method thereof.

[0005] In order to achieve the above-mentioned purpose, the application adopts the following technical scheme: a high-sensitivity electrocardio-phono-integrated sensor, comprising a shell, an integrated circuit board arranged on the inner side of the shell, a top cover arranged on the shell, a stethoscopic diaphragm arranged between the top cover and the shell, an installation plate arranged on the inner side of the shell, a first support seat arranged on one side of the installation plate close to the stethoscopic diaphragm, a first mechanical layer arranged on the first support seat, a first mass seat arranged on the other end of the first mechanical layer, a first piezoelectric sheet arranged between the first mass seat and the first support seat, an energy collection assembly arranged on the side of the installation plate away from the first support seat, and the energy collection assembly is electrically connected with the integrated circuit board through a lead wire.

[0006] The energy collection assembly comprises a second support seat arranged on the installation plate, a second mechanical layer arranged on the second support seat, a second mass seat arranged on the other end of the second mechanical layer, a third mechanical layer arranged on one side of the second mass seat close to the second support seat, a third mass seat arranged on the other end of the third mechanical layer, and a second piezoelectric sheet arranged on the second mass seat and connected with the second support seat and the third mass seat.

[0007] The working principle of the above scheme is that the vibration generated by the heartbeat is transmitted to the first mechanical layer, the first mass seat and the first piezoelectric sheet through the auscultation diaphragm, so that the first piezoelectric sheet is subjected to mechanical vibration, thereby polarization occurs inside the first piezoelectric sheet and an electric signal is generated, realizing force-to-electricity conversion; the vibration generated by the heartbeat is transmitted to the second mass seat and the third mass seat through the mounting plate, and then transmitted to the second piezoelectric sheet, so that polarization effect occurs inside the second piezoelectric sheet and electric energy is generated, and the electric energy is connected to the integrated circuit board through the lead wire to supply power to the integrated circuit board, and the powered integrated circuit board amplifies, filters and digitizes the electric signal.

[0008] By adopting the above technical scheme, the sensor realizes high-sensitivity collection of heart sounds and self-powered processing of heart sounds through specific structural design, including the auscultation diaphragm, the first piezoelectric sheet between the first mechanical layer and the first mass seat, and the energy collection assembly. The first mechanical layer and the first mass seat can be used for capturing heart sound signals, and the energy collection assembly can enhance the captured heart sound signals, thereby improving the overall performance of the sensor.

[0009] Further, the integrated circuit board includes a heart sound signal circuit and a heart electrical signal conditioning circuit.

[0010] By adopting the above technical scheme, the design of the heart sound signal circuit and the heart electrical signal conditioning circuit can simultaneously collect heart electrical signals and heart sound signals, and accurately time-synchronize and synchronously collect the two signals. These two signals can provide more comprehensive diagnostic information for doctors, which helps to improve the accuracy and efficiency of diagnosis.

[0011] Optionally, the shell is cylindrical, and a plurality of mounting seats are arranged on the outer side of the shell, the plurality of mounting seats are equidistantly distributed around the shell, the mounting seats and the shell are integrally formed, the upper ends of the mounting seats and the upper end of the shell are on the same horizontal plane, mounting grooves are arranged on the mounting seats, and lead wire holes are arranged between the mounting grooves and the shell.

[0012] By adopting the above technical scheme, the design of the mounting seats and the shell being integrally formed enhances the stability and durability of the overall structure. The design of the mounting seats allows the heart electrical electrode patch to be conveniently mounted thereon, thereby realizing collection of heart electrical signals. The mounting grooves arranged on the mounting seats are used to place the heart electrical electrode patch, and the lead wire holes allow the signal lines of the heart electrical electrode patch to be introduced into the shell, facilitating signal transmission. This design makes the installation and replacement of the heart electrical electrode patch simple and fast, thereby improving the convenience of use.

[0013] Optionally, the inner wall of the shell is provided with a connecting groove for fixing the top cover, the middle of the top cover is hollow, and the edge of the auscultation diaphragm is fixedly connected through the top cover and the connecting groove.

[0014] By adopting the above technical scheme, the edge of the auscultation diaphragm is fixedly connected through the top cover and the connecting groove, the stability and reliability of the auscultation diaphragm are ensured, the vibration signal can be clearly transmitted to the inside of the sensor, and the sensitivity of the sensor is improved.

[0015] Optionally, the end of the mounting plate away from the top cover is provided with a fixing plate, a fixing hole connected with the fixing plate is formed in the mounting plate, and the fixing plate is a double-layer structure, and the integrated circuit board is mounted on the bottom fixing plate.

[0016] By adopting the above technical scheme, the fixing hole is used for firmly fixing the mounting plate on the inside of the shell, so as to ensure the stability and reliability of the overall structure of the sensor, and this design helps to reduce the vibration and displacement of the sensor in the working process.

[0017] Optionally, the first piezoelectric sheet and the second piezoelectric sheet are PZT piezoelectric ceramics, the thickness of the PZT piezoelectric ceramic is 0.2mm-0.5mm, the width is 2mm-5mm, and the length is 6mm-12mm.

[0018] By adopting the above technical scheme, the PZT piezoelectric ceramic has excellent piezoelectric effect and stability, can convert mechanical vibration into electric energy, the thickness, width and length of the piezoelectric sheet are accurately controlled, so as to ensure the sensitivity and accuracy of the sensor, and this design enables the sensor to collect and power the heart sound signal.

[0019] Optionally, the auscultation diaphragm is TPU, and the thickness of the TPU is 0.02mm-0.05mm.

[0020] By adopting the above technical scheme, the TPU has excellent elasticity and wear resistance, can be tightly attached to the shell, effectively isolates external noise, and at the same time, the thickness of the TPU is also accurately controlled, so as to ensure the sensitivity and durability of the sensor, and this design enables the sensor to more accurately capture the heart sound signal and improve the accuracy of diagnosis.

[0021] Optionally, the first mechanical layer is a three-equal-division structure, and the spacing between the three-equal-division structures is the same, and the first mechanical layer, the second mechanical layer and the third mechanical layer are respectively spaced apart from the mounting plate by a gap of 0.5mm-0.8mm.

[0022] By adopting the technical scheme, the first mechanical layer is a trisection structure, and the spacing between the trisection structures is the same, which increases the normal strain of the piezoelectric layer in the working process of the sensor, thereby improving the sensitivity of the sensor, and meanwhile, the first mechanical layer, the second mechanical layer and the third mechanical layer are respectively left with gaps from the mounting plate, which helps to reduce the energy loss in the mechanical vibration process and improve the transmission efficiency of the signal.

[0023] Optionally, a single cavity structure is formed between the first piezoelectric sheet and the first mechanical layer and between the third mechanical layer and the second piezoelectric sheet, respectively, and two cavity structures are formed between the second mechanical layer and the second piezoelectric sheet.

[0024] By adopting the technical scheme, the cavity structures help to increase the vibration response and sensitivity of the sensor in the working process, and meanwhile, the design of the cavity structures also makes the sensor more sensitive to the heart sound signal perpendicular to the direction of the piezoelectric layer, further suppressing the influence of noise in other directions.

[0025] Optionally, a mounting method of a high-sensitivity electrocardio-cardiophonography integrated sensor includes the following steps:

[0026] Prepare the required high-sensitivity electrocardio-cardiophonography integrated sensor and all its components;

[0027] Install the first support seat and the first mechanical layer on the mounting plate, install the first mass seat at the other end of the first mechanical layer, and ensure that a gap is left between the first mechanical layer and the mounting plate, and install the first piezoelectric sheet on the first support seat and the first mass seat by using ultraviolet curing glue;

[0028] After the first piezoelectric sheet is installed, perform a preliminary function test to ensure that the first piezoelectric sheet can correctly respond to mechanical vibration, and record the test data for subsequent calibration and verification;

[0029] Then, install the second support seat of the energy collection assembly at the other end of the mounting plate, and install the second mechanical layer, the second mass seat, the third mechanical layer and the third mass seat on the second support seat in sequence, maintain the parallelism and consistency of the gaps between the layers during the installation process, and fix the second piezoelectric sheet on the second support seat and the third mass seat by using ultraviolet curing glue, so as to form the required cavity structure between the second piezoelectric sheet and the second mechanical layer and the third mechanical layer;

[0030] After all the mechanical layers and piezoelectric sheets are installed, perform an overall function test and calibration;

[0031] Fix the assembled mounting plate on the fixing plate on the inner side of the shell by using bolts;

[0032] Take out a piece of TPU auscultation diaphragm, place the auscultation diaphragm on the top of the shell, then cover the top cover on the auscultation diaphragm, and tightly connect the auscultation diaphragm and the shell through threaded connection;

[0033] After completing the installation of all components, check whether the connection of each part is firm and reliable, and perform the collection test of electrocardio and heart sound signals.

[0034] By adopting the technical scheme, the installation method of the sensor specifically describes the whole process from preparing the required components to completing the installation of all parts, the piezoelectric sheet is fixed on the support seat and the mass seat through ultraviolet curing glue, the stability and reliability of the piezoelectric sheet are ensured, meanwhile, the auscultation diaphragm is placed on the top of the shell and is tightly connected with the shell through threaded connection, the clear transmission of heart sound signals is ensured, finally, the sensor is tested by the test equipment to collect electrocardio and heart sound signals, it is ensured that the sensor can work normally and the collected signals are clear and accurate, the installation method is not only simple and fast, but also ensures the performance and reliability of the sensor.

[0035] Compared with the prior art, the beneficial effects of the present application are:

[0036] 1. The heart sound sensor part of the present application adopts a high-sensitivity design, including auscultation diaphragm, mechanical layer and piezoelectric sheet components, the auscultation diaphragm adopts TPU material, has excellent elasticity and wear resistance, can be tightly attached to the shell, effectively isolates external noise, the first mechanical layer is equally divided into three equal parts, and a cavity structure is formed between the first piezoelectric sheet, this design makes the mechanical layer more likely to deform in the direction perpendicular to the piezoelectric sheet (i.e. normal direction) when subjected to sound wave pressure, thereby improving the sensitivity of the heart sound sensor;

[0037] 2. The energy collection component of the electrocardio and heart sound integrated sensor of the present application also adopts a unique asymmetric cavity structure design, a double-stable piezoelectric energy collector is composed of two consistent fixed piezoelectric cantilever beam cavity structures (two parts composed of the second mechanical layer and the second piezoelectric sheet) and a free end cantilever beam cavity structure (another part composed of the third mechanical layer and the second piezoelectric sheet) located in the middle and led by the mass block, this design can more effectively collect the multi-band signals generated by the vibration of the heart, and convert these mechanical energy into electrical energy to provide continuous power supply for the integrated circuit of the sensor, this self-power supply capability not only reduces the use cost of the sensor, but also improves its long-term stability and reliability;

[0038] 3. The integrated sensor of the present application can simultaneously collect electrocardio and heart sound signals and accurately time-synchronize the two, and this synchronous collection capability enables doctors to more intuitively analyze the correlation between electrocardio and heart sound signals and more accurately determine the health status of the heart, in addition, since electrocardio and heart sound signals respectively reflect the electrical physiological activity and mechanical activity of the heart, synchronous collection of the two signals can provide doctors with more comprehensive diagnostic information and help improve the accuracy and efficiency of diagnosis.

[0039] 4. The integrated sensor of the present application has the advantages of high sensitivity, strong reliability, low cost, portability, low noise, and multi-parameter synchronous detection of electrocardio and heart sound. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 It is a whole structure schematic diagram of the electrocardio and heart sound integrated sensor of the present application.

[0041] Figure 2 It is a structure schematic diagram of the heart sound sensor installed inside the shell of the present application.

[0042] Figure 3 It is a three-dimensional structure schematic diagram of the shell of the present application.

[0043] Figure 4 It is a whole connection structure schematic diagram of the heart sound sensor and the energy collection assembly of the present application.

[0044] Figure 5 It is a connection structure schematic diagram of the energy collection assembly and the mounting plate of the present application.

[0045] Figure 6 It is a cross-section structure schematic diagram of the heart sound sensor and the energy collection assembly of the present application.

[0046] Figure 7 It is a heart sound circuit structure schematic diagram of the present application.

[0047] Figure 8 It is an electrocardio circuit structure schematic diagram of the present application.

[0048] In the figure: 1, shell; 101, mounting seat; 102, mounting groove; 103, lead hole; 104, wire hole; 2, top cover; 3, auscultation diaphragm; 4, mounting plate; 401, fixing hole; 402, fixing plate; 5, first support seat; 6, first mechanical layer; 7, first mass seat; 8, first piezoelectric sheet; 9, energy collection assembly; 91, second support seat; 92, second mechanical layer; 93, second mass seat; 94, third mechanical layer; 95, third mass seat; 96, second piezoelectric sheet. DETAILED DESCRIPTION

[0049] The technical solutions of the present application will be described clearly and completely below in combination with the drawings in the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0050] In the description of the present application, it should be noted that the terms "intermediate", "upper", "lower", "left", "right", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0051] As shown in Figure 1 The specific scheme of the embodiment is as follows: a high-sensitivity electrocardio and phonocardiogram integrated sensor, comprising a shell 1 and an integrated circuit board arranged inside the shell 1, the shell 1 is cylindrical, a plurality of mounting seats 101 are arranged on the outer periphery of the shell 1, the mounting seat 101 and the shell 1 are integrally formed, the upper end of the mounting seat 101 and the upper end of the shell 1 are on the same horizontal plane, the mounting seat 101 is circular and flat, an installation groove 102 is formed on the mounting seat 101, the bottom of the installation groove 102 is closed and arc-shaped, the installation groove 102 is used for installing an electrocardio electrode patch, the electrocardio electrode patch is fixed on the inner side of the installation groove 102 through a buckle clamp fixator, and the buckle clamp fixator can flexibly fix the electrocardio electrode patch in the installation groove 102.

[0052] A lead hole 103 is arranged between the installation groove 102 and the shell 1, the lead hole 103 can introduce the signal line of the electrocardio electrode patch into the inside of the shell 1, and a plurality of wire holes 104 are formed in the side wall of the shell 1.

[0053] The shell 1 is provided with a top cover 2, the top cover 2 is made of aluminum material and prepared by using 3D printing technology, a stethoscopic diaphragm 3 is installed between the top cover 2 and the shell 1, a connecting groove for fixing the top cover 2 is arranged on the inner wall of the shell 1, the middle of the top cover 2 is hollow, the edge of the stethoscopic diaphragm 3 is fixedly connected with the connecting groove through the top cover 2, two grooves are arranged at the cavity opening of the shell 1, the outer groove is provided with a threaded structure for fixing and sealing the top cover 2, and the inner groove is used for placing the stethoscopic diaphragm 3, the stethoscopic diaphragm 3 is made of TPU (thermoplastic polyurethane elastomer), the TPU has excellent elasticity and wear resistance, can be closely attached to the shell 1, and effectively isolates external noise, the thickness of the TPU is 0.02mm-0.05mm, and the thickness is controlled between 0.02mm-0.05mm, which can ensure sufficient sensitivity and avoid the problem of easy damage due to too thin.

[0054] The inner side of the shell 1 is provided with a mounting plate 4, the mounting plate 4 provides a stable support platform for installing various sensor components, and the mounting plate 4 is provided with a fixed plate 402 at the end away from the top cover 2, the mounting plate 4 is provided with a fixed hole 401 connected with the fixed plate 402, and the fixed plate 402 is a two-layer symmetrical structure, the fixed plate 402 is provided for mounting an integrated circuit board, and the integrated circuit board is mounted on the bottom fixed plate 402.

[0055] In some embodiments, the integrated circuit board includes a heart sound signal circuit (as shown in Figure 7 and an electrocardio signal conditioning circuit (as shown in Figure 8 The heart sound signal circuit adopts an operational amplifier LMP7721 module, is used for charge amplifier design, the LMP7721 has 3fA ultra-low typical input bias current and 6.5 low voltage noise, is an ideal choice for amplifying high impedance signals, the average level of the input of the operational amplifier LMP7721 module is biased to by R1 and R2 voltage division, the amplification multiple of the circuit is inversely proportional to the feedback capacitor C1, the signal-to-noise ratio (SNR) and the lower cutoff frequency are also inversely proportional to C1, under the compromise of charge amplification multiple, SNR and lower cutoff frequency, C1 in the charge amplifier is set to 47pF, so that the amplification multiple of the circuit is 21.3, in addition, the charge amplifier circuit design has a 1GΩ feedback resistor R3, the circuit can generate a low cutoff frequency of 3.4Hz, so that it can meet the monitoring requirements of heart sound signals;

[0056] The ECG signal conditioning circuit adopts AD8232 module, AD8232 is an integrated signal conditioning module for ECG and other bioelectricity measurement applications, the device is designed to extract, amplify and filter weak bioelectricity signals in the presence of noise generated by motion or remote electrode placement, AD8232 adopts a double-pole high-pass filter to eliminate motion artifacts and electrode half-cell potentials, the filter is tightly coupled with the instrumentation amplifier structure, which can realize single-stage high-gain and high-pass filtering, in this embodiment, R6, R7, C1 and C3 constitute a passive low-pass filter, and R11, R12, R13, C4 and C6 constitute a passive high-pass filter, wherein R12 is used to control the quality factor Q to limit the frequency within 0.5Hz-40Hz.

[0057] The first support base 5 is installed on one side of the installation plate 4 close to the auscultation diaphragm 3, the first mechanical layer 6 is installed on the first support base 5, the first mechanical layer 6 is a three-equal-division structure, and the spacing between the three-equal-division structures is the same, the first mass seat 7 is installed at the other end of the first mechanical layer 6, and the first piezoelectric sheet 8 is arranged between the first mass seat 7 and the first support base 5.

[0058] The energy collection assembly 9 is arranged on the side of the installation plate 4 away from the first support base 5, the energy collection assembly 9 is electrically connected to the integrated circuit board through a lead wire, the energy collection assembly 9 comprises a second support base 91 installed on the installation plate 4, a second mechanical layer 92 is installed on the second support base 91, a second mass seat 93 is installed at the other end of the second mechanical layer 92, a third mechanical layer 94 is installed on one side of the second mass seat 93 close to the second support base 91, the first mechanical layer 6, the second mechanical layer 92 and the third mechanical layer 94 are respectively spaced apart from the installation plate 4, and the spacing is 0.5mm-0.8mm, the design of the spacing helps to reduce energy loss in the mechanical vibration process and improve the transmission efficiency of the signal, the third mass seat 95 is arranged at the other end of the third mechanical layer 94, and the second piezoelectric sheet 96 connected with the second support base 91 and the third mass seat 95 is arranged on the second mass seat 93.

[0059] The first piezoelectric sheet 8 and the second piezoelectric sheet 96 are PZT (lead zirconate titanate) piezoelectric ceramics, which are prepared into piezoelectric sheets by cutting and thinning process. The top and bottom of the piezoelectric sheet are sputtered with a layer of gold respectively by using magnetron sputtering technology, which serves as the upper and lower electrodes for the output of heart sound signals. The thickness of the PZT piezoelectric ceramic is 0.2-0.5 mm, the width is 2-5 mm, and the length is 6-12 mm. The thickness of the first mechanical layer 6, the second mechanical layer 9 and the third mechanical layer 94 is 0.4-0.8 mm, the width is 4-7 mm, and the length is 4-16 mm. The width of the piezoelectric sheet is smaller than the width of the mechanical layer, and the two are in an asymmetric state. The first piezoelectric sheet 8 and the first mechanical layer 6 are in an asymmetric state, and the second piezoelectric sheet 96 and the second mechanical layer 9 and the third mechanical layer 94 are also in an asymmetric state.

[0060] The first piezoelectric sheet 8 and the first mechanical layer 6 form a single cavity structure, and the third mechanical layer 94 and the second piezoelectric sheet 96 form a single cavity structure. The second mechanical layer 92 and the second piezoelectric sheet 96 form two cavity structures. The design of the cavity structure also makes the sensor more sensitive to the heart sound signal perpendicular to the piezoelectric layer direction, further suppresses the influence of noise in other directions, and increases the vibration mass of the mechanical layer by setting the first mass seat 7, the second mass seat 93 and the third mass seat 95, thereby improving the response sensitivity of the sensor to the heart sound signal. The shell 1, the first support seat 5, the first mechanical layer 6, the mounting plate 4, the first mass seat 7, the second support seat 91, the second mechanical layer 92, the second mass seat 93, the third mechanical layer 94 and the third mass seat 95 are all made of aluminum metal material. The good electrical conductivity and thermal conductivity of the aluminum metal material help to improve the signal transmission efficiency and heat dissipation performance of the sensor. The size of the first support seat 5 is 12 mm x 6 mm x 5 mm (length x width x height), the size of the first mass seat 7 is 12 mm x 18 mm x 4 mm (length x width x height), the size of the second support seat 91 is 12 mm x 6 mm x 4.5 mm (length x width x height), the size of the second mass seat 93 is 12 mm x 4 mm x 3.5 mm (length x width x height), and the size of the third mass seat 95 is 5 mm x 3 mm x 3.5 mm (length x width x height).

[0061] The energy collection component 9 forms a highly integrated energy conversion system through processing and assembly. The second support seat 91 serves as a fixed foundation to support the entire energy collection structure. The second mechanical layer 92 and the third mechanical layer 94 serve as a bridge for transmitting vibration.

[0062] When the heart beats, the sound waves generated are captured by the auscultation diaphragm 3; the sound waves produce vibrations on the auscultation diaphragm 3, which are transmitted to the first mass seat 7 and the first piezoelectric sheet 8 through the first mechanical layer 6; when the first piezoelectric sheet 8 is subjected to mechanical vibration, polarization occurs inside the piezoelectric sheet to generate an electric signal, thereby realizing force-to-electricity conversion, and then the signal is amplified by the operational amplifier LMP7721 module on the integrated circuit board to realize the pickup of weak heart sound signals;

[0063] At the same time, the vibration is transmitted to the second mechanical layer 92 and the third mechanical layer 94 through the mounting plate 4, and the second mechanical layer 92 and the third mechanical layer 94 also produce vibrations, which are further transmitted to the second piezoelectric sheet 96, also causing polarization inside the piezoelectric sheet to generate electric energy, and the electric energy is connected to the integrated circuit board through the lead wire to power the operational amplifier LMP7721 module and the AD8232 module on the integrated circuit board; after being powered on, the operational amplifier LMP7721 module and the AD8232 module amplify, filter and digitize the electric signal on the passive sensor, and the electric signal after amplification, filtering and digitization has a high signal-to-noise ratio and clarity, and can more accurately reflect the detailed characteristics of the heart beat.

[0064] A mounting method of a high-sensitivity electrocardio and phonocardiogram integrated sensor, comprising the following steps:

[0065] Prepare the required high-sensitivity electrocardio and phonocardiogram integrated sensor and all its components;

[0066] Install the first support seat 5 and the first mechanical layer 6 on the mounting plate 4, and install the first mass seat 7 at the other end of the first mechanical layer 6, and ensure that there is a gap between the first mechanical layer 6 and the mounting plate 4, and install the first piezoelectric sheet 8 on the first support seat 5 and the first mass seat 7 by ultraviolet curing glue;

[0067] After the first piezoelectric sheet 8 is installed, a preliminary function test is performed to ensure that the first piezoelectric sheet 8 can correctly respond to mechanical vibration, and the test data is recorded;

[0068] Then, install the second support seat 91 of the energy collection assembly 9 on the other end of the mounting plate 4, and install the second mechanical layer 92, the second mass seat 93, the third mechanical layer 94 and the third mass seat 95 on the second support seat 91 in sequence, and maintain the parallelism and consistency of the gap between the layers during installation, and use ultraviolet curing glue to fix the second piezoelectric sheet 96 on the second support seat 91 and the third mass seat 95, to ensure that the required cavity structure is formed between the second piezoelectric sheet 96 and the second mechanical layer 92 and the third mechanical layer 94;

[0069] After all the mechanical layers and piezoelectric sheets are installed, overall function test and calibration are performed;

[0070] The assembled mounting plate 4 is bolted to the fixing plate 402 on the inside of the shell 1;

[0071] A piece of TPU auscultation film 3 is taken out, the auscultation film 3 is placed on the top of the shell 1, then the top cover 2 is covered on the auscultation film 3, and the auscultation film 3 is tightly connected with the shell 1 by screw connection;

[0072] After the installation of all components is completed, it is checked whether the connection of each part is firm and reliable, and the collection test of electrocardio and heart sound signals is carried out.

[0073] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-sensitivity integrated electrocardiogram and heart sound sensor, characterized in that, The device includes a housing and an integrated circuit board disposed inside the housing. The housing has a top cover, and a stethoscope diaphragm is installed between the top cover and the housing. An installation plate is provided inside the housing. A first support is installed on the side of the installation plate near the stethoscope diaphragm. A first mechanical layer is installed on the first support. A first mass seat is installed at the other end of the first mechanical layer. A first piezoelectric element is provided between the first mass seat and the first support. An energy harvesting component is provided on the side of the installation plate away from the first support. The energy harvesting component is electrically connected to the integrated circuit board via a lead wire. The energy harvesting component includes a second support mounted on the mounting plate. A second mechanical layer is mounted on the second support. A second mass seat is mounted on the other end of the second mechanical layer. A third mechanical layer is mounted on the side of the second mass seat near the second support. A third mass seat is located on the other end of the third mechanical layer. A second piezoelectric element is mounted on the second mass seat and connected to the second support and the third mass seat respectively. A single cavity structure is formed between the first piezoelectric element and the first mechanical layer, and between the third mechanical layer and the second piezoelectric element. Two cavity structures are formed between the second mechanical layer and the second piezoelectric element. Gaps exist between the first, second, and third mechanical layers and the mounting plate. The first and second piezoelectric elements are PZT piezoelectric ceramics. The first piezoelectric element and the first mechanical layer are in an asymmetrical state, and the second piezoelectric element and the second and third mechanical layers are also in an asymmetrical state.

2. The high-sensitivity integrated ECG and heart sound sensor according to claim 1, characterized in that: The integrated circuit board includes a heart sound signal circuit and an electrocardiogram signal conditioning circuit.

3. The high-sensitivity integrated ECG and heart sound sensor according to claim 1, characterized in that: The housing is cylindrical, and a plurality of mounting seats are provided on the outer side of the housing. The mounting seats are equidistantly distributed on the outer periphery of the housing. The mounting seats are integrally formed with the housing. The upper end of the mounting seat and the upper end of the housing are respectively on the same horizontal plane. The mounting seat is provided with a mounting groove, and a lead wire hole is provided between the mounting groove and the housing.

4. The high-sensitivity integrated ECG and heart sound sensor according to claim 1, characterized in that: The inner wall of the housing is provided with a connecting groove for fixing the top cover. The top cover is hollow in the middle, and the edge of the stethoscope diaphragm is fixedly connected through the top cover and the connecting groove.

5. A high-sensitivity integrated electrocardiogram and heart sound sensor according to claim 1, characterized in that: The mounting plate has a fixing plate at one end away from the top cover. The mounting plate has fixing holes for connecting with the fixing plate. The fixing plate has a double-layer structure, and the integrated circuit board is mounted on the bottom fixing plate.

6. The high-sensitivity integrated electrocardiogram and heart sound sensor according to claim 1, characterized in that: The first piezoelectric element and the second piezoelectric element are both PZT (lead zirconate titanate) piezoelectric ceramics. The thickness of the PZT piezoelectric ceramic is 0.2mm-0.5mm, the width is 2mm-5mm, and the length is 6mm-12mm.

7. A high-sensitivity integrated electrocardiogram and heart sound sensor according to claim 1, characterized in that: The stethoscope diaphragm is made of TPU (thermoplastic polyurethane elastomer), and the thickness of the TPU is 0.02mm-0.05mm.

8. A high-sensitivity integrated electrocardiogram and heart sound sensor according to claim 1, characterized in that: The first mechanical layer is divided into three equal parts with equal spacing between them. There are gaps between the first mechanical layer, the second mechanical layer and the third mechanical layer and the mounting plate, with the gaps being 0.5mm-0.8mm.

9. The installation method of the high-sensitivity integrated ECG and heart sound sensor as described in any one of claims 1-8, characterized in that, Includes the following steps: Prepare the necessary high-sensitivity integrated ECG and phonocardiogram sensor and all its components; A first support base and a first mechanical layer are installed on the mounting plate, and a first mass base is installed at the other end of the first mechanical layer, ensuring that there is a gap between the first mechanical layer and the mounting plate. The first piezoelectric sheet is then installed on the first support base and the first mass base using UV-cured adhesive. After the first piezoelectric element is installed, a preliminary functional test is conducted to ensure that the first piezoelectric element can respond correctly to mechanical vibration, and the test data is recorded. Next, the second support of the energy harvesting component is installed on the other end of the mounting plate. The second mechanical layer, the second mass seat, the third mechanical layer, and the third mass seat are then installed on the second support in sequence. During the installation process, the parallelism and gap between each layer are kept consistent. The second piezoelectric sheet is fixed on the second support and the third mass seat using UV-curing adhesive to ensure that the required cavity structure is formed between the second piezoelectric sheet and the second and third mechanical layers. After all mechanical layers and piezoelectric elements are installed, overall functional testing and calibration are performed. The assembled mounting plate is fixed to the fixing plate inside the housing with bolts; Take out a TPU stethoscope diaphragm, place the stethoscope diaphragm on top of the housing, then cover the stethoscope diaphragm with the top cover and connect the stethoscope diaphragm to the housing tightly with a threaded connection. After all components are installed, ECG and heart sound signal acquisition tests are performed.

Images