Modified magnesium oxysulfate inorganic glue and preparation method thereof and bamboo chip board

Abstract

The application belongs to the technical field of solid waste treatment, and discloses a modified magnesium oxysulfate inorganic glue, a preparation method thereof and a bamboo chip board. The modified magnesium oxysulfate inorganic glue is composed of the following components in parts by mass: light-burned magnesium oxide 100 parts, magnesium sulfate heptahydrate 20-60 parts, water 50-85 parts, a modifier 1.1-17 parts and a stabilizer 1.8-5.3 parts. The modifier comprises: citric acid 0.2-3 parts, silica ash 0.5-8 parts, silica sol 0.1-3 parts, lithium silicate 0.2-2 parts, sodium tripolyphosphate 0.1-1 part and nano silicon 0.5-5 parts. The stabilizer comprises: hornblende powder 1-3.5 parts, sodium silicate 0.5-3 parts and multi-walled carbon nanotubes 0.3-0.8 parts. The modified magnesium oxysulfate inorganic glue bamboo chip board does not contain harmful substances, has excellent mechanical properties, fire resistance, moisture resistance and good durability.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of solid waste treatment, and particularly relates to a modified magnesium oxysulfate inorganic glue and a preparation method thereof and a bamboo chip board. BACKGROUND

[0002] Bamboo is a green and renewable resource, which is widely used in the fields of construction, furniture, papermaking, and textile due to its short growth cycle, high strength, and good mechanical properties. However, a large amount of waste bamboo chips is generated during the processing of bamboo, which usually accounts for 5%-15% of the total weight of bamboo. If these bamboo chips cannot be effectively utilized, they will often be discarded or burned, causing resource waste and environmental pollution.

[0003] Traditional bamboo chip materials are mostly processed using organic adhesives such as "three aldehyde glue" (urea-formaldehyde resin, phenol-formaldehyde resin, and melamine-formaldehyde resin). However, such materials have poor environmental adaptability and exist problems such as formaldehyde release, environmental pollution, and fire hazards. Moreover, bamboo chips, as a natural organic fiber, have hydroxyl groups (-OH) and other hydrophilic functional groups on their surface, which makes the bonding force between bamboo chips and inorganic glue relatively weak. The structure prepared by using bamboo chips and inorganic glue has poor compressive strength and bending strength, and poor toughness. SUMMARY

[0004] To solve the above technical problems, the present application provides a modified magnesium oxysulfate inorganic glue, a preparation method thereof, and a bamboo chip board. The modified magnesium oxysulfate inorganic glue is compounded with waste bamboo chips to prepare an inorganic glue bamboo chip board with excellent mechanical properties, fire resistance, environmental protection, and water resistance.

[0005] To achieve the above purpose, the present application is realized by the following technical scheme:

[0006] In a first aspect, the present application provides a modified magnesium oxysulfate inorganic glue, which is composed of the following components in parts by mass: light-burned magnesium oxide 100 parts, magnesium sulfate heptahydrate 20-60 parts, water 50-85 parts, a modifier 1.1-17 parts, and a stabilizer 1.8-5.3 parts.

[0007] The modifier includes: citric acid 0.2-3 parts, silica fume 0.5-8 parts, silica sol 0.1-3 parts, lithium silicate 0.2-2 parts, sodium tripolyphosphate 0.1-1 parts, and nano-silicon 0.5-5 parts.

[0008] The stabilizer includes: hornblende powder 1-3.5 parts, sodium silicate 0.5-3 parts, and multi-walled carbon nanotubes 0.3-0.8 parts.

[0009] The present application mainly uses light-burned magnesium oxide and magnesium sulfate heptahydrate as base materials, and generates magnesium oxysulfate inorganic glue after chemical reaction, which has good durability and environmental protection. However, magnesium oxysulfate has the disadvantages of low strength and poor adhesion, and therefore needs to add modifiers and stabilizers to improve the adhesion between the magnesium oxysulfate and the bamboo chips and the overall mechanical properties. In addition, the addition of light-burned magnesium oxide can further improve the fire resistance of the glue.

[0010] In the modifier, citric acid can delay the coagulation speed of the inorganic glue, improve the hydration process of the magnesium oxysulfate inorganic glue, and effectively improve the mechanical properties of the glue; silica fume can improve the microstructure of the hydration product and improve the compressive strength and toughness of the glue; silica sol, as a water-soluble silicate glue, can form a dense three-dimensional network structure in the magnesium oxysulfate inorganic glue, enhancing the structural stability of the glue; lithium silicate can act as a reactive silicon source in the magnesium oxysulfate inorganic glue, enhancing the hardness and corrosion resistance of the glue; sodium tripolyphosphate can improve the flowability and stability of the glue, prevent analysis or precipitation, and enhance the overall structure of the glue, wherein the phosphate ions react with the hydroxyl groups and cellulose on the surface of the bamboo chips, promoting the physical adsorption and chemical bonding between the inorganic glue and the bamboo chips, and improving the adhesion between the two; nano-silicon particles have a high specific surface area and can have strong chemical reactions with other components (such as magnesium oxide and magnesium sulfate), improving the microstructure of the glue and forming a good interface contact with the surface of the bamboo chips, further improving the adhesion between the glue and the bamboo chips.

[0011] In the stabilizer, the layered structure of hornblende powder can improve the mechanical strength of the inorganic glue and reduce the cracks generated during hardening, which helps to improve the stability and durability of the modified inorganic glue. The introduction of hornblende powder can also improve the wettability of the glue and promote good adhesion with the bamboo chips; the aqueous solution of sodium silicate, commonly known as water glass, can effectively reduce the dispersibility of the cementitious material in water, improve the waterproof performance of the inorganic glue, and improve the long-term stability of the glue strength; the surface of the multi-walled carbon nanotube is provided with a large number of hydrophilic and hydrophobic functional groups, which can improve the compatibility of the glue with the waste bamboo chips, thereby enhancing the adhesive capacity of the glue. At the same time, the multi-walled carbon nanotube has excellent thermal stability and thermochemical properties, which can improve the fire resistance, corrosion resistance, etc. of the magnesium oxysulfate inorganic glue, and can prevent the interface between the bamboo chips and the inorganic glue from being peeled off due to environmental factors, thereby improving the durability of the inorganic glue bamboo chip board.

[0012] In some embodiments, the modified magnesium oxysulfate inorganic glue is composed of the following components by mass fraction: 100 parts of light-burned magnesium oxide, 20-40 parts of magnesium sulfate heptahydrate, 60-85 parts of water, 4-15 parts of modifier, and 3-5 parts of stabilizer.

[0013] Preferably, the modifier includes 1-3 parts of citric acid, 0.5-5 parts of silica fume, 0.3-2 parts of silica sol, 0.2-1 part of lithium silicate, 0.3-1 part of sodium tripolyphosphate, and 0.5-3 parts of nano-silicon.

[0014] Preferably, the stabilizer comprises hornblende powder 1.5-3 parts, sodium silicate 1-2 parts and multi-walled carbon nanotubes 0.3-0.5 parts.

[0015] In a second aspect, the present application provides a preparation method of the modified magnesium oxysulfate inorganic glue, comprising the following steps: dissolving magnesium sulfate heptahydrate in water to obtain a magnesium sulfate solution;

[0016] Then, the silica sol, lithium silicate, sodium silicate, citric acid, sodium tripolyphosphate, nano-silicon, hornblende powder and multi-walled carbon nanotubes are sequentially added to the magnesium sulfate aqueous solution in proportion, stirred and mixed uniformly, then the light-burned magnesium oxide and silica ash are added, mixed and continuously stirred, and after the reaction is completed, the modified magnesium oxysulfate inorganic glue is obtained.

[0017] Since the light-burned magnesium oxide reacts rapidly with the magnesium sulfate heptahydrate, if the component addition sequence is not adjusted and the retarder is not added, the inorganic glue colloid will be coagulated too quickly and cannot be applied to practical engineering. In the preparation of the present application, the light-burned magnesium oxide and the magnesium sulfate heptahydrate are mixed in steps, and before the two are mixed, the magnesium sulfate heptahydrate is ensured to be uniformly mixed with the retarder components. In addition, the silica ash as a modifier can improve the microstructure of the hydration product when the light-burned magnesium oxide and the magnesium sulfate heptahydrate chemically react, and further optimize the mechanical properties and structural stability of the colloid.

[0018] In a third aspect, the present application provides a bamboo chip board prepared by mixing the modified magnesium oxysulfate inorganic glue with bamboo chips at a mass ratio of 6-8:2-4.

[0019] In some embodiments, the preparation method of the bamboo chip board is as follows: bamboo chips produced in the bamboo processing process, bamboo chips of bamboo that has died or is about to die are beaten;

[0020] After the bamboo chips are dried, the modified magnesium oxysulfate inorganic glue is mixed with the bamboo chips at a mass ratio of 2-4:6-8, the mixture is poured into a mold and pressed into shape, and after curing, the bamboo chip board is prepared.

[0021] Preferably, the bamboo chips are treated by screening, and the diameter of the screened bamboo chips is not more than 2 mm and the length is not more than 10 mm.

[0022] Preferably, the water content of the dried bamboo chips is less than 10%.

[0023] Preferably, the curing conditions are 20±3℃ and a relative humidity of 60%RH.

[0024] Further preferably, the curing time is 25-30 days.

[0025] The beneficial effects achieved by one or more embodiments of the present application are as follows:

[0026] The modified magnesium oxysulfate inorganic glue is prepared by compounding bamboo chip waste and modified magnesium oxysulfate inorganic glue, and the modified magnesium oxysulfate inorganic glue bamboo chip board has the characteristics of no harmful substances, excellent mechanical properties, fire resistance, moisture resistance, good durability and the like, can be applied to the fields of building, furniture, decoration materials and the like, can reduce the energy consumption of building materials in the production stage, can fix carbon and reduce the emission of carbon dioxide, and has the green and economic double significance.

[0027] The modified magnesium oxysulfate inorganic glue prepared by the method has a 28-day compressive strength of 63-95 MPa and a flexural strength of 7.5-15 MPa. BRIEF DESCRIPTION OF DRAWINGS

[0028] The accompanying drawings, which form a part of the specification, are included to provide a further understanding of the application and are incorporated herein in conjunction with the description of the application. The drawings are not to be construed as unduly limiting on the application, which is defined solely by the claims.

[0029] Figure 1 It is the flexural test device diagram (A) and the specimen damage diagram (B) of the modified magnesium oxysulfate inorganic glue in Example 1;

[0030] Figure 2 It is the compressive test device diagram (A) and the specimen damage diagram (B) of the modified magnesium oxysulfate inorganic glue in Example 1;

[0031] Figure 3 It is the compressive test device diagram in Example 2;

[0032] Figure 4 It is the compressive test device diagram in Comparative Example 1;

[0033] Figure 5 It is the flexural test device diagram (A) and the specimen damage diagram (B) in Example 2;

[0034] Figure 6 It is the flexural test device diagram (A) and the specimen damage diagram (B) in Comparative Example 1. DETAILED DESCRIPTION

[0035] It should be noted that the following detailed description is illustrative only and is intended to provide further description of the application. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0036] The application will be further described in conjunction with the examples.

[0037] In the following examples, the bamboo chips are screened through a 10-mesh sieve and are purchased from Gaoao (Shandong) Technology Co., Ltd.

[0038] Light-burned magnesium oxide, MgO content 98%~99%, 400 mesh, purchased from Wuxi Zemei New Material Science and Technology Co., Ltd.;

[0039] Magnesium sulfate heptahydrate, purity 95% or more, industrial grade, 40 mesh, purchased from Shandong Yongrui Salt Chemical Co., Ltd.;

[0040] Silica fume, powder, 325 mesh, purchased from Shijiazhuang Longcai Mineral Products Co., Ltd.;

[0041] Silica sol, liquid, content 30%, purchased from Jinan Hongxinda Biological Technology Co., Ltd.;

[0042] Lithium silicate, liquid, content 25%, purchased from Henan Youyang Chemical Products Co., Ltd.;

[0043] Sodium silicate, powder, 325 mesh, dissolved in water in advance, purchased from Luoyang Tongrun Information Technology Co., Ltd.;

[0044] Citric acid, powder, dissolved in water in advance, purchased from National Pharmaceutical Group Chemical Reagent Co., Ltd.;

[0045] Sodium tripolyphosphate, powder, dissolved in water in advance, purchased from National Pharmaceutical Group Chemical Reagent Co., Ltd.;

[0046] Nano-silicon, powder, dissolved in water in advance, Hubei Hui Fu Nanometer Material Co., Ltd.;

[0047] Amphibole powder, powder, 300 mesh, dissolved in water in advance, purchased from Lingshou County Fengfeng Mineral Products Processing Factory;

[0048] Multi-walled carbon nanotubes, purity 85.5% or more, powder, 20,000 mesh, dissolved in water in advance, purchased from Jiaxing Bonan New Material Co., Ltd.

[0049] Example 1

[0050] A modified magnesium oxysulfate inorganic glue, by mass parts, consists of: light-burned magnesium oxide 100 parts, magnesium sulfate heptahydrate 30 parts, water 80 parts, silica fume 0.8 parts, silica sol 0.5 parts, lithium silicate 1.0 parts, sodium silicate 1.5 parts, citric acid 1.5 parts, sodium tripolyphosphate 0.5 parts, nano-silicon 1.0 parts, amphibole powder 2.0 parts, multi-walled carbon nanotubes 0.3 parts.

[0051] Preparation method:

[0052] According to the above material dosage ratio, each component is weighed, magnesium sulfate heptahydrate is dissolved in water and stirred, the water temperature is controlled at 20℃, and a magnesium sulfate aqueous solution is obtained;

[0053] Subsequently, the silica sol, lithium silicate, sodium silicate, citric acid, sodium tripolyphosphate, nano-silicon 1.0 parts, hornblende powder and multi-walled carbon nanotubes are sequentially added into the magnesium sulfate aqueous solution, and continue to be stirred to ensure that each component is uniformly stirred.

[0054] Finally, light-burned magnesium oxide and silica ash are added and mixed and stirred until all components are fully reacted and uniformly distributed, to obtain the modified magnesium oxysulfate inorganic glue.

[0055] Product performance: test the compressive strength and flexural strength of the inorganic glue

[0056] The modified magnesium oxysulfate inorganic glue after stirring is poured into a 40 mm x 40 mm x 160 mm mold to make 6 test pieces, which are vibrated and compacted, and placed in a constant temperature (20±3℃) and constant humidity (relative humidity 60% RH) environment for 28 days. The compressive strength and flexural strength of the modified magnesium oxysulfate inorganic glue itself are tested.

[0057] Figure 1 The comparison before and after the flexural test of the modified magnesium oxysulfate inorganic glue of Example 1 is shown in Figure 1 A and Figure 1 B. After testing, the 28-day flexural strength of the 6 test pieces varied in the range of 7.5~15 MPa, and were 7.53 MPa, 11.29 MPa, 13.84 MPa, 14.32 MPa, 14.73 MPa, and 15.28 MPa, respectively, with an average of 13.0 MPa.

[0058] Figure 2 The comparison before and after the compressive test of the modified magnesium oxysulfate inorganic glue of Example 1 is shown in Figure 2 A and Figure 2 B. In the compressive test, the test pieces (12) after the flexural test were used for testing. After testing, the 28-day compressive strength of the 12 test pieces varied in the range of 63~95 MPa, and were 63.42 MPa, 66.44 MPa, 69.32 MPa, 73.46 MPa, 78.67 MPa, 80.97 MPa, 82.93 MPa, 85.36 MPa, 86.43 MPa, 87.95 MPa, 90.89 MPa, and 95.06 MPa, respectively, with an average of 79.24 MPa.

[0059] Example 2

[0060] A modified magnesium oxysulfate inorganic glue bamboo chip board, by mass fraction, consists of: bamboo chip content 30 parts, light burned magnesium oxide 100 parts, magnesium sulfate heptahydrate 30 parts, water 80 parts, silica powder 0.8 parts, silica sol 0.5 parts, lithium silicate 1.0 parts, nano silicon 1.0 parts, sodium silicate 1.5 parts, citric acid 1.5 parts, sodium tripolyphosphate 0.5 parts, hornblende powder 2.0 parts and multi-walled carbon nanotubes 0.3 parts.

[0061] Preparation method:

[0062] According to the above material dosage ratio, each component is weighed, magnesium sulfate heptahydrate is dissolved in water for stirring, the water temperature is controlled at 20 DEG C, and a magnesium sulfate aqueous solution is obtained.

[0063] Then silica sol, lithium silicate, sodium silicate, citric acid, nano silicon, hornblende powder and multi-walled carbon nanotubes are sequentially added to the magnesium sulfate aqueous solution, and stirring is continued to ensure that each component is uniformly stirred.

[0064] Finally, light burned magnesium oxide and silica ash are added for mixing and stirring until all components are fully reacted and uniformly distributed, obtaining a modified magnesium oxysulfate inorganic glue.

[0065] The treated waste bamboo chips are added to the modified magnesium oxysulfate inorganic glue, stirred uniformly, and poured into a 40 mm x 40 mm x 160 mm mold for compression molding. The molded bamboo chip board is cured in a constant temperature (20±3 DEG C) and constant humidity (relative humidity 60% RH) environment for 28 days. The prepared modified magnesium oxysulfate inorganic glue bamboo chip board is non-combustible grade A1, and the formaldehyde emission is 0.

[0066] Comparative example 1

[0067] The magnesium oxysulfate inorganic glue (authorized number CN 111423820B) bamboo chip board, by mass fraction, consists of: bamboo chip content 30 parts, light burned magnesium oxide 100 parts, magnesium sulfate heptahydrate 30 parts, water 60 parts, silica powder 0.8 parts, silica sol 0.5 parts, lithium silicate 1.0 parts, sodium silicate 1.5 parts and citric acid 1.5 parts.

[0068] The preparation method is the same as example 2, except that the components of the magnesium oxysulfate inorganic glue in example 2 are changed.

[0069] Comparative example 2

[0070] The difference from example 2 is that the nano silicon is replaced by silica ash, and the others are the same as example 2.

[0071] Comparative example 3

[0072] The difference from example 2 is that the nano silicon is replaced by silica sol, and the others are the same as example 2.

[0073] Comparative example 4

[0074] The difference from Example 2 is that sodium tripolyphosphate is replaced by nano-silicon, and the others are the same as Example 2.

[0075] Comparative Example 5

[0076] The difference from Example 2 is that sodium tripolyphosphate is replaced by citric acid, and the others are the same as Example 2.

[0077] Comparative Example 6

[0078] The difference from Example 2 is that hornblende powder is replaced by multi-walled carbon nanotubes, and the others are the same as Example 2.

[0079] Comparative Example 7

[0080] The difference from Example 2 is that multi-walled carbon nanotubes are replaced by sodium silicate, and the others are the same as Example 2.

[0081] The compressive strength and flexural strength tests of the inorganic glue bamboo chip board test pieces of Example 2 and comparative examples in total 8 groups are carried out according to GB / T 17671-2021 “Cement mortar strength test method (ISO method)”.

[0082] Figure 3 The compressive strength test device diagram in Example 2 is, Figure 5 The flexural test device diagram (A) and test piece damage diagram (B) in Example 2, the compressive strength of the bamboo chip board in Example 2 is 34-55 MPa, which is 34.32 MPa, 35.0 MPa, 35.53 MPa, 37.27 MPa, 38.10 MPa, 40.64 MPa, 42.76 MPa, 45.92 MPa, 48.81 MPa, 50.61 MPa, 52.38 MPa, 54.97 MPa, and the average is 43.03 MPa;

[0083] The flexural strength is 12-18 MPa, which is 12.24 MPa, 12.76 MPa, 16.0 MPa, 16.53 MPa, 17.95 MPa, 18.32 MPa, and the average is 15.64 MPa;

[0084] Figure 4 The compressive strength test device diagram in Comparative Example 1 is, Figure 6Figure (A) and the specimen failure figure (B) of the bending test device in Comparative Example 1. The compressive strength of Comparative Example 1 was 12-30 MPa, and was 12.43 MPa, 12.52 MPa, 13.96 MPa, 15.82 MPa, 17.71 MPa, 18.76 MPa, 20.45 MPa, 22.77 MPa, 24.51 MPa, 27.45 MPa, 28.82 MPa, and 30.42 MPa, respectively, and the average was 20.47 MPa;

[0085] The bending strength was 4-10 MPa, and was 4.21 MPa, 6.75 MPa, 7.82 MPa, 8.56 MPa, 9.98 MPa, and 10.34 MPa, respectively, and the average was 7.94 MPa.

[0086] The compressive strength of Comparative Example 2 was 38-60 MPa, and was 38.25 MPa, 39.39 MPa, 39.62 MPa, 40.05 MPa, 43.72 MPa, 45.21 MPa, 46.06 MPa, 48.51 MPa, 50.81 MPa, 55.44 MPa, 58.76 MPa, and 60.16 MPa, respectively, and the average was 47.17 MPa;

[0087] The bending strength was 7-13 MPa, and was 7.12 MPa, 7.35 MPa, 8.97 MPa, 10.24 MPa, 12.75 MPa, and 13.38 MPa, respectively, and the average was 9.97 MPa.

[0088] The compressive strength of Comparative Example 3 was 21-45 MPa, and was 21.44 MPa, 23.17 MPa, 26.58 MPa, 28.95 MPa, 33.62 MPa, 37.11 MPa, 39.52 MPa, 40.61 MPa, 42.88 MPa, 44.21 MPa, 44.74 MPa, and 45.39 MPa, respectively, and the average was 35.69 MPa;

[0089] The bending strength was 7.8-15 MPa, and was 7.88 MPa, 8.96 MPa, 10.54 MPa, 11.02 MPa, 13.43 MPa, and 15.72 MPa, respectively, and the average was 11.26 MPa.

[0090] The compressive strength of Comparative Example 4 was 20-50 MPa, and was 20.52 MPa, 22.14 MPa, 26.96 MPa, 29.27 MPa, 35.94 MPa, 39.93 MPa, 41.81 MPa, 43.85 MPa, 44.01 MPa, 46.96 MPa, 48.75 MPa, 50.17 MPa, respectively, and the average was 37.53 MPa;

[0091] The flexural strength was 7-16 MPa, and was 7.20 MPa, 9.87 MPa, 11.06 MPa, 13.35 MPa, 14.98 MPa, 16.56 MPa, respectively, and the average was 12.17 MPa.

[0092] The compressive strength of Comparative Example 5 was 37-56 MPa, and was 37.58 MPa, 39.18 MPa, 40.99 MPa, 41.23 MPa, 42.08 MPa, 43.65 MPa, 45.3 MPa, 48.72 MPa, 52.06 MPa, 53.39 MPa, 55.47 MPa, 56.26 MPa, respectively, and the average was 46.33 MPa;

[0093] The flexural strength was 7-15 MPa, and was 7.53 MPa, 8.45 MPa, 11.76 MPa, 13.26 MPa, 14.94 MPa, 15.22 MPa, respectively, and the average was 11.86 MPa.

[0094] The compressive strength of Comparative Example 6 was 24-43 MPa, and was 24.23 MPa, 26.64 MPa, 28.98 MPa, 29.74 MPa, 32.62 MPa, 36.86 MPa, 38.05 MPa, 39.73 MPa, 41.21 MPa, 41.97 MPa, 42.31 MPa, 43.08 MPa, respectively, and the average was 35.45 MPa;

[0095] The flexural strength was 7-16 MPa, and was 7.26 MPa, 8.55 MPa, 10.94 MPa, 13.68 MPa, 15.13 MPa, 16.07 MPa, respectively, and the average was 11.94 MPa.

[0096] The compressive strength of Comparative Example 7 was 26-56 MPa, which was 26.46 MPa, 28.62 MPa, 29.31 MPa, 32.44 MPa, 35.73 MPa, 40.25 MPa, 41.25 MPa, 43.89 MPa, 46.93 MPa, 49.04 MPa, 51.22 MPa, 52.67 MPa, respectively, and the average was 39.82 MPa;

[0097] The flexural strength was 6-17 MPa, which was 6.13 MPa, 8.34 MPa, 10.69 MPa, 12.75 MPa, 15.42 MPa, 17.05 MPa, respectively, and the average was 11.73 MPa.

[0098] Table 1 Comparison of compressive strength and flexural strength of Example 2 and Comparative Examples

[0099]

[0100] It can be found through experiments that the density and pore structure of the material are changed after the incorporation of bamboo chips, resulting in that the compressive strength of the bamboo chip board is significantly lower than that of the glue block. However, as a natural fiber, bamboo chips significantly improve the toughness and flexural strength of the material. The experimental results of Example 2 and Comparative Example 1 show that the compressive strength and flexural strength of the modified magnesium sulfide inorganic glue bamboo chip board are significantly improved.

[0101] If the components of the modified magnesium sulfide inorganic glue are replaced, such as Comparative Example 2 and Comparative Example 3, nano-silicon is replaced, and through the experimental results of Comparative Example 2, Comparative Example 3 and Example 2, it can be found that the addition of nano-silicon plays an important role in the modified magnesium sulfide inorganic glue bamboo chip board. It not only improves the strength of the inorganic glue, but also improves the bonding performance between the glue and the bamboo chips, significantly improving the compressive strength and flexural strength of the bamboo chip board. This shows that nano-silicon as an effective modifier has an advantage that other components (such as silica fume and silica sol) cannot replace in enhancing the bonding between the glue and the bamboo chips.

[0102] Similarly, in Comparative Examples 4-7, sodium tripolyphosphate, hornblende powder and multi-walled carbon nanotubes were replaced, respectively, and compared with the experimental results of the example, it was found that the three components of sodium tripolyphosphate, hornblende powder and multi-walled carbon nanotubes played an important role in improving the strength of the glue and the bonding performance between the glue and the bamboo chips in the modified magnesium sulfide inorganic glue bamboo chip board.

[0103] The above merely provides the preferred embodiments of the present application, and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the principles and technical scope of the present application shall fall into the scope of the present application.

Claims

1. A bamboo chip board, characterized by: The modified magnesium oxysulfate inorganic glue is prepared by mixing modified magnesium oxysulfate inorganic glue and bamboo chips, wherein the bamboo chips are 30 parts. The modified magnesium oxysulfate inorganic glue is prepared by mixing modified magnesium oxysulfate inorganic glue and bamboo chips, wherein the bamboo chips are 30 parts.

2. A bamboo chip board according to claim 1, characterized by: The modified magnesium oxysulfate inorganic glue is prepared by mixing modified magnesium oxysulfate inorganic glue and bamboo chips, wherein the bamboo chips are 30 parts. The preparation method of the modified magnesium oxysulfate inorganic glue comprises the following steps: dissolving magnesium sulfate heptahydrate in water to obtain a magnesium sulfate solution; 3. The bamboo chip board according to claim 1, wherein: Then, the silica sol, lithium silicate, sodium silicate, citric acid, sodium tripolyphosphate, nano silicon, hornblende powder and multi-walled carbon nanotubes are added into the magnesium sulfate aqueous solution in proportion, stirred and mixed uniformly, and then the light-burned magnesium oxide and silica ash are added and mixed, so that the modified magnesium oxysulfate inorganic glue is obtained after the reaction is completed. The preparation method of the bamboo chip board comprises the following steps: beating the bamboo chips generated in the bamboo processing process and the bamboo that has died or is about to die into bamboo chips; 4. The bamboo chip board according to claim 1, wherein: After the bamboo chips are dried, the modified magnesium oxysulfate inorganic glue is mixed with the bamboo chips, the mixture is poured into a mold and is pressed and formed, and the bamboo chip board is prepared after curing.

5. The bamboo chip board according to claim 1, wherein: The bamboo chips are treated by screening, and the diameter of the screened bamboo chips is not more than 2 mm and the length is not more than 10 mm.

6. The bamboo chip board according to claim 3, characterized in that: The water content of the dried bamboo chips is less than 10%. The curing conditions are 20±3℃ and the relative humidity is 60%RH, and the curing time is 25-30 days. The curing conditions are 20±3℃ and the relative humidity is 60%RH, and the curing time is 25-30 days.

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