Transfer impedance measuring method of high-voltage connection system and related device

Abstract

The invention provides a transfer impedance measurement method of a high-voltage connection system and a related device. The method comprises the following steps: acquiring parameter data of a measurement device and parameter data of a vector network analyzer; acquiring external circuit impedance and internal circuit impedance of the to-be-tested sample by adopting a vector network analyzer; obtaining a first resistance and a second resistance; combining a first resistor and a second resistor with the to-be-tested sample to obtain an internal and external impedance equivalent circuit of the to-be-tested sample; measuring the internal and external impedance equivalent circuit of the sample to be measured by using the vector network analyzer and the measuring device to obtain an insertion loss parameter curve; and calculating a transfer impedance curve of the sample to be measured according to the insertion loss parameter curve, parameter data of the measuring device, parameter data of the vector network analyzer, the first resistance impedance value and the second resistance impedance value. The internal and external circuit matching condition of the to-be-tested sample can be considered, the test cut-off frequency is improved, and the accuracy is high.

Description

Technical Field

[0001] The present application relates to the field of vehicle testing technology, and in particular to a transfer impedance measurement method and related device for a high-voltage connection system. Background Art

[0002] The shielding layer of the high-voltage connection system can effectively reduce the electromagnetic interference risk of automotive high-voltage components. Shielding effectiveness is the ability to evaluate the shielding layer of high-voltage components to reduce electromagnetic interference. Studying the mechanism of the shielding effectiveness of the high-voltage connection system and measuring the transfer impedance of the shielding layer of the high-voltage connection system can guide the shielding design of the high-voltage component connection system, thereby improving the electromagnetic compatibility performance of the components and the entire vehicle.

[0003] The existing transfer impedance methods are mainly line injection method and triaxial method. However, both line injection method and triaxial method only consider the impedance matching of the inner circuit composed of the core wire and the shielding layer, and do not consider the matching of the outer circuit composed of the shielding layer and the test equipment. Therefore, the cutoff frequency of the test is low and the accuracy is not high. Summary of the invention

[0004] The embodiment of the present application provides a transfer impedance measurement method and related device for a high-voltage connection system, which can take into account the matching conditions of internal and external circuits of a sample to be tested, improve the cutoff frequency of the test, and have high accuracy.

[0005] A first aspect of an embodiment of the present application provides a method for measuring transfer impedance of a high voltage connection system, the method comprising:

[0006] Acquiring parameter data of a measuring device and parameter data of a vector network analyzer;

[0007] A vector network analyzer is used to obtain the external circuit impedance and the internal circuit impedance of the sample to be tested;

[0008] Obtaining a first resistor and a second resistor, wherein the first resistor is equivalent to the impedance value of the internal circuit, and the second resistor is equivalent to the impedance value of the external circuit;

[0009] The first resistor and the second resistor are combined with the sample to be tested to obtain an equivalent circuit of internal and external impedances of the sample to be tested;

[0010] Using the vector network analyzer and the measuring device to measure the internal and external impedance equivalent circuit of the sample to be tested, and obtain an insertion loss parameter curve;

[0011] The transfer impedance curve of the sample to be tested is calculated according to the insertion loss parameter curve, the parameter data of the measuring device, the parameter data of the vector network analyzer, the first resistor impedance value and the second resistor impedance value.

[0012] Furthermore, the internal and external impedance equivalent circuit of the sample to be tested includes: a vector network analyzer, a core wire of the sample to be tested, a shielding layer of the sample to be tested, a first resistor and a second resistor. The first RF port of the vector network analyzer is connected to the input end of the core wire of the sample to be tested, the output end of the core wire of the sample to be tested is connected to the first end of the first resistor, the second end of the first resistor is connected to the input end of the shielding layer of the sample to be tested, the output end of the shielding layer of the sample to be tested is connected to the first end of the second resistor, and the second end of the second resistor is connected to the second RF port of the vector network analyzer.

[0013] Further, according to the insertion loss parameter curve, the parameter data of the measuring device, the parameter data of the vector network analyzer, the first resistor impedance value and the second resistor impedance value, the transfer impedance curve of the sample to be tested is calculated, including:

[0014] extracting a coupling length value of the measuring device from the parameter data of the measuring device;

[0015] Extracting a first radio frequency port impedance value of the vector network analyzer and a second radio frequency port impedance value of the vector network analyzer from the parameter data of the vector network analyzer;

[0016] The transfer impedance curve of the sample to be measured is calculated according to the coupling length value of the measuring device, the impedance value of the first RF port of the vector network analyzer, the impedance value of the second RF port of the vector network analyzer, the impedance value of the first resistor and the impedance value of the second resistor.

[0017] Furthermore, the transfer impedance curve calculation formula is as follows:

[0018]

[0019] Among them, Z T is the transfer impedance curve, L C is the coupling length of the measuring device, S 21 is the insertion loss parameter curve, R 1N is the impedance value of the first RF port of the vector network analyzer, R 2N is the impedance value of the second RF port of the vector network analyzer, R 1F is the impedance value of the first resistor, R 2F is the impedance value of the second resistor.

[0020] In this example, a transfer impedance measurement method for a high-voltage connection system is proposed. First, the internal and external circuit transfer impedances of the sample to be tested are measured to obtain the internal circuit transfer impedance value and the external circuit transfer impedance value. Then, a first resistor and a second resistor equal to the internal circuit transfer impedance value and the external circuit transfer impedance value are obtained. Then, the first resistor and the second resistor are combined with the sample to be tested to obtain an equivalent sample circuit to be tested that considers the internal circuit impedance and the external circuit impedance. Then, the sample circuit to be tested is measured to obtain an insertion loss parameter curve. Finally, based on the insertion loss parameter curve, a transfer impedance curve of the sample to be tested is obtained. When measuring the impedance of the sample to be tested, the internal circuit impedance and the external circuit impedance of the sample to be tested can be considered at the same time, thereby improving the cutoff frequency of the test and improving the accuracy of the impedance measurement.

[0021] A second aspect of an embodiment of the present application provides a transfer impedance measurement device for a high-voltage connection system, which is used to implement the transfer impedance measurement method for a high-voltage connection system described in the first aspect, including:

[0022] A first acquisition unit, used to acquire parameter data of the measuring device and parameter data of the vector network analyzer;

[0023] A first processing unit is used to obtain the external circuit impedance and the internal circuit impedance of the sample to be tested by using a vector network analyzer;

[0024] A second acquisition unit, used to acquire a first resistor and a second resistor, wherein the first resistor is equivalent to the impedance value of the internal circuit, and the second resistor is equivalent to the impedance value of the external circuit;

[0025] A second processing unit is used to measure the internal and external impedance equivalent circuit of the sample to be tested by using the vector network analyzer and the measuring device to obtain an insertion loss parameter curve;

[0026] The third processing unit is used to calculate the transfer impedance curve of the sample to be tested according to the insertion loss parameter curve, the parameter data of the measuring device, the parameter data of the vector network analyzer, the first resistor impedance value and the second resistor impedance value.

[0027] Further, in the aspect of combining the first resistor and the second resistor with the sample to be tested to obtain an equivalent circuit of internal and external impedances of the sample to be tested, the equivalent circuit of internal and external impedances of the sample to be tested includes:

[0028] A vector network analyzer, a core wire of a sample to be tested, a shielding layer of the sample to be tested, a first resistor and a second resistor, wherein the first RF port of the vector network analyzer is connected to the input end of the core wire of the sample to be tested, the output end of the core wire of the sample to be tested is connected to the first end of the first resistor, the second end of the first resistor is connected to the input end of the shielding layer of the sample to be tested, the output end of the shielding layer of the sample to be tested is connected to the first end of the second resistor, and the second end of the second resistor is connected to the second RF port of the vector network analyzer.

[0029] Further, in the aspect of calculating the transfer impedance curve of the sample to be tested according to the insertion loss parameter curve, the parameter data of the measuring device, the parameter data of the vector network analyzer, the first resistor impedance value and the second resistor impedance value, the method includes:

[0030] extracting a coupling length value of the measuring device from the parameter data of the measuring device;

[0031] Extracting a first radio frequency port impedance value of the vector network analyzer and a second radio frequency port impedance value of the vector network analyzer from the parameter data of the vector network analyzer;

[0032] The transfer impedance curve of the sample to be measured is calculated according to the coupling length value of the measuring device, the impedance value of the first RF port of the vector network analyzer, the impedance value of the second RF port of the vector network analyzer, the impedance value of the first resistor and the impedance value of the second resistor.

[0033] Further, in the aspect of calculating the transfer impedance curve of the sample to be measured according to the coupling length value of the measuring device, the impedance value of the first RF port of the vector network analyzer, the impedance value of the second RF port of the vector network analyzer, the impedance value of the first resistor and the impedance value of the second resistor, the transfer impedance curve calculation formula is as follows:

[0034]

[0035] Among them, Z T is the transfer impedance curve, L C is the coupling length of the measuring device, S 21 is the insertion loss parameter curve, R 1N is the impedance value of the first RF port of the vector network analyzer, R 2N is the impedance value of the second RF port of the vector network analyzer, R 1F is the impedance value of the first resistor, R 2F is the impedance value of the second resistor.

[0036] A third aspect of an embodiment of the present application provides a terminal, comprising a processor, an input device, an output device and a memory, wherein the processor, the input device, the output device and the memory are interconnected, wherein the memory is used to store a computer program, the computer program comprises program instructions, and the processor is configured to call the program instructions to execute the step instructions of the transfer impedance measurement method of the high-voltage connection system as described in the first aspect of the embodiment of the present application.

[0037] A fourth aspect of an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program for electronic data exchange, wherein the computer program enables a computer to execute the steps of the transfer impedance measurement method of a high-voltage connection system as described in the first aspect of the embodiment of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0039] Figure 1 A schematic diagram of the overall process of a method for measuring transfer impedance of a high-voltage connection system is provided for an embodiment of the present application;

[0040] Figure 2 A schematic diagram of the structure of a transfer impedance equivalent circuit in a transfer impedance measurement method for a high-voltage connection system is provided in an embodiment of the present application;

[0041] Figure 3 A top view of a transfer impedance measurement structure of a high-voltage connection system is provided for an embodiment of the present application;

[0042] Figure 4 A schematic diagram of the steps of calculating the transfer impedance curve of a sample to be tested in a method for measuring the transfer impedance of a high-voltage connection system is provided for an embodiment of the present application;

[0043] Figure 5 A schematic diagram of the structure of a terminal provided in an embodiment of the present application;

[0044] Figure 6 A schematic structural diagram of a transfer impedance measurement device for a high-voltage connection system is provided for an embodiment of the present application;

[0045] Reference numerals:

[0046] Vector network analyzer-1, first RF port-101, second RF port-102, core wire of the sample to be tested-2, first resistor-3, shielding layer of the sample to be tested-4, second resistor-5, transfer impedance measurement structure-6 for measuring high-voltage connection system, bottom plate-601, side plate-602, first board body-60201, second board body-60202, RF port connector-60203, first acquisition unit-7, first processing unit-8, second acquisition unit-9, second processing unit-10, third processing unit-11. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0048] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0049] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments.

[0050] In order to better understand the transfer impedance measurement method of a high-voltage connection system provided by an embodiment of the present application, the following first briefly introduces the scenario in which the transfer impedance measurement method of the high-voltage connection system is applied. In the traditional methods for measuring the transfer impedance of the high-voltage connection system, the line injection method and the three-coaxial method only consider the impedance matching of the inner circuit composed of the core wire and the shielding layer, and do not consider the matching of the outer circuit composed of the shielding layer and the test equipment. Therefore, the cutoff frequency of the test is low and the accuracy is not high.

[0051] In order to solve the technical problem that the traditional transfer impedance measurement method of the high-voltage connection system does not consider the matching of the shielding layer and the external circuit composed of the test equipment, so the cut-off frequency of the test is low and the accuracy is not high, a transfer impedance measurement method of the high-voltage connection system is proposed. The transfer impedance measurement method of the high-voltage connection system is applied to the transfer impedance measurement device of the high-voltage connection system. Figure 1 A schematic diagram of the overall process of a method for measuring transfer impedance of a high voltage connection system is shown in FIG. Figure 1 As shown, including:

[0052] S1. Obtain parameter data of the measuring device and parameter data of the vector network analyzer 1. Specifically, after the measuring method starts, first prepare the sample to be measured, select the spacing of the measuring device according to the size and shape of the sample to be measured, fix the sample to be measured on the measuring device, obtain the parameter data of the current measuring device and parameter data of the vector network analyzer 1, and provide a basis for subsequent data analysis.

[0053] S2. Use vector network analyzer 1 to obtain the external circuit impedance and internal circuit impedance of the sample to be tested. First, use vector network analyzer 1 to obtain the external circuit impedance value of the sample to be tested, and then use vector network analyzer 1 to obtain the internal circuit impedance value of the sample to be tested. Use vector network analyzer 1 to measure the core wire of the sample to be tested to obtain the internal circuit impedance value of the sample to be tested; use vector network analyzer 1 to measure the shielding layer of the sample to be tested to obtain the external circuit impedance value of the sample to be tested.

[0054] S3, obtain a first resistor 3 and a second resistor 5, wherein the first resistor 3 is equivalent to the internal circuit impedance value, and the second resistor 5 is equivalent to the external circuit impedance value, that is, obtain a first resistor 3 with the same impedance value as the internal circuit, and obtain a second resistor 5 with the same impedance value as the external circuit.

[0055] S4, combining the first resistor 3 and the second resistor 5 with the sample to be tested to obtain an equivalent circuit of internal and external impedances of the sample to be tested.

[0056] As a preferred solution of this embodiment, Figure 2 FIG. 1 shows a schematic diagram of the structure of the transfer impedance equivalent circuit in the transfer impedance measurement method of the high voltage connection system. Figure 2 As shown, the internal and external impedance equivalent circuit of the sample to be tested includes:

[0057] A vector network analyzer 1, a core wire 2 of a sample to be tested, a shielding layer 4 of the sample to be tested, a first resistor 3 and a second resistor 5. The first radio frequency port 101 of the vector network analyzer 1 is connected to the input end of the core wire 2 of the sample to be tested, the output end of the core wire 2 of the sample to be tested is connected to the first end of the first resistor 3, the second end of the first resistor 3 is connected to the input end of the shielding layer 4 of the sample to be tested, the output end of the shielding layer 4 of the sample to be tested is connected to the first end of the second resistor 5, and the second end of the second resistor 5 is connected to the second radio frequency port 102 of the vector network analyzer 1. Therefore, the circuit can simultaneously consider the internal circuit impedance and the external circuit impedance of the sample to be tested.

[0058] S5. Use the vector network analyzer 1 and the measuring device to measure the internal and external impedance equivalent circuit of the sample to be tested to obtain an insertion loss parameter curve (it should be noted that the loss parameter curve measured at this time is the S21 parameter curve).

[0059] S6, calculating the transfer impedance curve of the sample to be tested according to the insertion loss parameter curve, the parameter data of the measuring device, the parameter data of the vector network analyzer 1, the impedance value of the first resistor 3 and the impedance value of the second resistor 5. Specifically, it includes:

[0060] S601 , extracting a coupling length value of the measuring device from parameter data of the measuring device, wherein the device coupling length value is associated with a distance between two side plates 602 of the measuring device.

[0061] S602 : Extracting the impedance value of the first RF port 101 and the impedance value of the second port of the vector network analyzer 1 from the parameter data of the vector network analyzer 1 .

[0062] S603 , calculating a transfer impedance curve of the sample to be measured according to the coupling length value of the measuring device, the impedance value of the first RF port 101 of the vector network analyzer 1 , the impedance value of the second RF port 102 of the vector network analyzer 1 , the impedance value of the first resistor 3 , and the impedance value of the second resistor 5 .

[0063] Specifically, the transfer impedance curve calculation formula is as follows:

[0064]

[0065] Among them, Z T is the transfer impedance curve, L C is the coupling length of the measuring device, S 21 is the insertion loss parameter curve, R 1N is the impedance value of the first RF port of the vector network analyzer, R 2N is the impedance value of the second RF port of the vector network analyzer, R 1F is the impedance value of the first resistor, R2F Therefore, by using the transfer impedance curve calculation formula, the equivalent transfer impedance that takes into account both the internal circuit impedance and the external circuit impedance of the sample to be tested can be obtained, thereby increasing the cutoff frequency of the transfer impedance test and improving the accuracy of the measurement method.

[0066] In order to implement the above-mentioned transfer impedance measurement method of the high-voltage connection system, this embodiment proposes a transfer impedance measurement structure of the high-voltage connection system. Figure 3 FIG. 1 shows a top view of a transfer impedance measurement structure of a high voltage connection system. Figure 3 As shown, including:

[0067] The bottom plate 601 is made of stainless steel, and two side plates 602 are slidably arranged on the bottom plate 601. The two side plates 602 are made of copper, and the side plates 602 include a first plate body 60201 and a second plate body 60202, and the first plate body 60201 and the second plate body 60202 are vertically fixedly connected. The side plate 602 composed of the first plate body 60201 and the second plate body 60202 is in an L shape, and a radio frequency port connector 60203 is respectively arranged on the first plate body 60201 on the two side plates 602, and the sample to be tested is clamped by the radio frequency port connector 60203 by sliding the two side plates 602. In addition, the RF port of the vector network analyzer 1 is connected to the RF port connector 60203 during transfer impedance measurement, and the RF port connectors 60203 of the two side panels 602 are connected to the sample to be measured. The vector network measuring instrument is connected to the sample to be measured through the RF port connector 60203 to measure the transfer impedance of the sample to be measured.

[0068] like Figure 3 As shown, a detachable bolt is provided between the second plate body 60202 and the bottom plate 601, and a plurality of bolt holes arranged at intervals are provided in the length direction of the bottom plate 601. The bolts are threadedly matched with the bolt holes to adjust the distance between the two side plates 602. When in use, the distance between the two side plates 602 is adjusted according to the length of the sample to be measured, so as to change the coupling length value of the measuring device according to the body parameters of the sample to be measured.

[0069] By using the transfer impedance measurement structure of the high-voltage connection system in combination with the transfer impedance measurement method of the high-voltage connection system provided above, it is possible to simultaneously consider the internal circuit impedance and the external circuit impedance of the sample to be tested when measuring the impedance of the sample to be tested, thereby improving the cutoff frequency of the test and improving the accuracy of the impedance measurement.

[0070] For the above embodiments, please refer to Figure 5 , Figure 5A schematic structural diagram of a transfer impedance measurement device for a high-voltage connection system is shown, which is used to implement the above-mentioned transfer impedance measurement method for a high-voltage connection system, including:

[0071] A first acquisition unit 7, used to acquire parameter data of the measuring device and parameter data of the vector network analyzer 1;

[0072] A first processing unit 8 is used to obtain the external circuit impedance and the internal circuit impedance of the sample to be tested by using the vector network analyzer 1;

[0073] A second acquisition unit 9 is used to acquire a first resistor 3 and a second resistor 5, wherein the first resistor 3 is equivalent to the impedance value of the internal circuit, and the second resistor 5 is equivalent to the impedance value of the external circuit;

[0074] The second processing unit 10 is used to measure the internal and external impedance equivalent circuit of the sample to be tested by using the vector network analyzer 1 and the measuring device to obtain an insertion loss parameter curve;

[0075] The third processing unit 11 is used to calculate the transfer impedance curve of the sample to be tested according to the insertion loss parameter curve, the parameter data of the measuring device, the parameter data of the vector network analyzer 1, the impedance value of the first resistor 3 and the impedance value of the second resistor 5.

[0076] Preferably, in the aspect of combining the first resistor 3 and the second resistor 5 with the sample to be tested to obtain an equivalent circuit of the internal and external impedances of the sample to be tested, the equivalent circuit of the internal and external impedances of the sample to be tested includes:

[0077] A vector network analyzer 1, a core wire 2 of a sample to be tested, a shielding layer 4 of the sample to be tested, a first resistor 3 and a second resistor 5, wherein the first radio frequency port 101 of the vector network analyzer 1 is connected to the input end of the core wire 2 of the sample to be tested, the output end of the core wire 2 of the sample to be tested is connected to the first end of the first resistor 3, the second end of the first resistor is connected to the input end of the shielding layer 4 of the sample to be tested, the output end of the shielding layer 4 of the sample to be tested is connected to the first end of the second resistor 5, and the second end of the second resistor 5 is connected to the second radio frequency port 102 of the vector network analyzer 1.

[0078] Preferably, in the aspect of calculating the transfer impedance curve of the sample to be tested according to the insertion loss parameter curve, the parameter data of the measuring device, the parameter data of the vector network analyzer 1, the impedance value of the first resistor 3 and the impedance value of the second resistor 5, the method comprises:

[0079] extracting a coupling length value of the measuring device from the parameter data of the measuring device;

[0080] Extracting the impedance value of the first radio frequency port 101 of the vector network analyzer 1 and the impedance value of the second radio frequency port 102 of the vector network analyzer 1 from the parameter data of the vector network analyzer 1;

[0081] The transfer impedance curve of the sample to be measured is calculated according to the coupling length value of the measuring device, the impedance value of the first RF port 101 of the vector network analyzer 1, the impedance value of the second RF port 102 of the vector network analyzer 1, the impedance value of the first resistor 3 and the impedance value of the second resistor 5.

[0082] Preferably, in the aspect of calculating the transfer impedance curve of the sample to be measured according to the coupling length value of the measuring device, the impedance value of the first RF port of the vector network analyzer, the impedance value of the second RF port of the vector network analyzer, the impedance value of the first resistor and the impedance value of the second resistor, the transfer impedance curve calculation formula is as follows:

[0083]

[0084] Among them, Z T is the transfer impedance curve, L C is the coupling length of the measuring device, S 21 is the insertion loss parameter curve, R 1N is the impedance value of the first RF port of the vector network analyzer, R 2N is the impedance value of the second RF port of the vector network analyzer, R 1F is the impedance value of the first resistor, R 2F is the impedance value of the second resistor.

[0085] In this embodiment, the internal and external circuit transfer impedances of the sample to be tested are first measured to obtain the internal circuit transfer impedance value and the external circuit transfer impedance value, and then the first resistor 3 and the second resistor 5 equal to the internal circuit transfer impedance value and the external circuit transfer impedance value are obtained, and then the first resistor 3 and the second resistor 5 are combined with the sample to be tested, which is equivalent to the sample circuit to be tested that considers the internal circuit impedance and the external circuit impedance, and then the sample circuit to be tested is measured to obtain an insertion loss parameter curve, and finally based on the insertion loss parameter curve, the transfer impedance curve of the sample to be tested is obtained, so that when measuring the impedance of the sample to be tested, the internal circuit impedance and the external circuit impedance of the sample to be tested can be considered at the same time, thereby improving the cutoff frequency of the test and improving the accuracy of the impedance measurement.

[0086] For the above embodiments, please refer to Figure 4 , Figure 4A schematic diagram of the structure of a terminal provided in an embodiment of the present application, as shown in the figure, includes a processor, an input device, an output device and a memory, the processor, the input device, the output device and the memory are interconnected, wherein the memory is used to store a computer program, the computer program includes program instructions, the processor is configured to call the program instructions, and the program includes instructions for executing the following steps;

[0087] Acquiring parameter data of the measuring device and parameter data of the vector network analyzer 1;

[0088] Using a vector network analyzer 1 to obtain the external circuit impedance and the internal circuit impedance of the sample to be tested;

[0089] Obtain a first resistor 3 and a second resistor 5, wherein the first resistor 3 is equivalent to the impedance value of the internal circuit, and the second resistor 5 is equivalent to the impedance value of the external circuit;

[0090] The first resistor 3 and the second resistor 5 are combined with the sample to be tested to obtain an equivalent circuit of internal and external impedances of the sample to be tested;

[0091] The vector network analyzer 1 and the measuring device are used to measure the internal and external impedance equivalent circuits of the sample to be tested to obtain an insertion loss parameter curve;

[0092] The transfer impedance curve of the sample to be tested is calculated according to the insertion loss parameter curve, the parameter data of the measuring device, the parameter data of the vector network analyzer 1 , the impedance value of the first resistor 3 and the impedance value of the second resistor 5 .

[0093] In this example, the internal and external circuit transfer impedances of the sample to be tested are first measured to obtain the internal circuit transfer impedance value and the external circuit transfer impedance value, and then the first resistor 3 and the second resistor 5 equal to the internal circuit transfer impedance value and the external circuit transfer impedance value are obtained, and then the first resistor 3 and the second resistor 5 are combined with the sample to be tested, which is equivalent to the sample circuit to be tested that considers the internal circuit impedance and the external circuit impedance, and then the sample circuit to be tested is measured to obtain an insertion loss parameter curve, and finally based on the insertion loss parameter curve, the transfer impedance curve of the sample to be tested is obtained, which can simultaneously consider the internal circuit impedance and the external circuit impedance of the sample to be tested when measuring the impedance of the sample to be tested, thereby improving the cutoff frequency of the test and improving the accuracy of the impedance measurement.

[0094] The above mainly introduces the scheme of the embodiment of the present application from the perspective of the execution process on the method side. It is understandable that in order to realize the above functions, the terminal includes a hardware structure and / or software module corresponding to the execution of each function. Those skilled in the art should easily realize that, in combination with the units and algorithm steps of each example described in the embodiments provided herein, the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is executed in the form of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0095] The embodiment of the present application can divide the terminal into functional units according to the above method example. For example, each functional unit can be divided according to each function, or two or more functions can be integrated into one processing unit. The above integrated unit can be implemented in the form of hardware or in the form of software functional units. It should be noted that the division of units in the embodiment of the present application is schematic and is only a logical function division. There may be other division methods in actual implementation.

[0096] An embodiment of the present application also provides a computer storage medium, wherein the computer storage medium stores a computer program for electronic data exchange, and the computer program enables a computer to execute part or all of the steps of any one of the transfer impedance measurement methods for a high-voltage connection system as recorded in the above method embodiments.

[0097] An embodiment of the present application also provides a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program, and the computer program enables a computer to execute part or all of the steps of any one of the transfer impedance measurement methods for a high-voltage connection system as recorded in the above method embodiments.

[0098] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

[0099] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0100] In the several embodiments provided in the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of the units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of the device or unit can be electrical or other forms.

[0101] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0102] In addition, the functional units in the various embodiments of the application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated units may be implemented in the form of hardware or in the form of software program modules.

[0103] If the integrated unit is implemented in the form of a software program module and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a memory, including a number of instructions to enable a computer device (which can be a personal computer, server or network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned memory includes: U disk, read-only memory (ROM), random access memory (RAM), mobile hard disk, disk or optical disk and other media that can store program codes.

[0104] A person of ordinary skill in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable memory, which can include: a flash drive, a read-only memory, a random access memory, a magnetic disk or an optical disk, etc.

[0105] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for measuring transfer impedance of a high voltage connection system, characterized in that: include: Acquiring parameter data of a measuring device and parameter data of a vector network analyzer; A vector network analyzer is used to obtain the external circuit impedance and internal circuit impedance of the sample to be tested; Obtaining a first resistor and a second resistor, wherein the first resistor is equivalent to the impedance value of the internal circuit, and the second resistor is equivalent to the impedance value of the external circuit; The first resistor and the second resistor are combined with the sample to be tested to obtain an equivalent circuit of internal and external impedances of the sample to be tested; Using the vector network analyzer and the measuring device to measure the internal and external impedance equivalent circuit of the sample to be tested, and obtain an insertion loss parameter curve; The transfer impedance curve of the sample to be tested is calculated according to the insertion loss parameter curve, the parameter data of the measuring device, the parameter data of the vector network analyzer, the first resistor impedance value and the second resistor impedance value.

2. The transfer impedance measurement method of the high voltage connection system according to claim 1, characterized in that: The internal and external impedance equivalent circuit of the sample to be tested includes: a vector network analyzer, a core wire of the sample to be tested, a shielding layer of the sample to be tested, a first resistor and a second resistor. The first radio frequency port of the vector network analyzer is connected to the input end of the core wire of the sample to be tested, the output end of the core wire of the sample to be tested is connected to the first end of the first resistor, the second end of the first resistor is connected to the input end of the shielding layer of the sample to be tested, the output end of the shielding layer of the sample to be tested is connected to the first end of the second resistor, and the second end of the second resistor is connected to the second radio frequency port of the vector network analyzer.

3. The transfer impedance measurement method of the high voltage connection system according to claim 2, characterized in that: Calculating a transfer impedance curve of the sample to be tested according to the insertion loss parameter curve, parameter data of the measuring device, parameter data of the vector network analyzer, the first resistor impedance value and the second resistor impedance value, including: extracting a coupling length value of the measuring device from the parameter data of the measuring device; Extracting a first radio frequency port impedance value of the vector network analyzer and a second radio frequency port impedance value of the vector network analyzer from the parameter data of the vector network analyzer; The transfer impedance curve of the sample to be measured is calculated according to the coupling length value of the measuring device, the impedance value of the first RF port of the vector network analyzer, the impedance value of the second RF port of the vector network analyzer, the impedance value of the first resistor and the impedance value of the second resistor.

4. The transfer impedance measurement method of the high voltage connection system according to claim 3, characterized in that: The transfer impedance curve calculation formula is as follows: Among them, Z T is the transfer impedance curve, L C is the coupling length of the measuring device, S 21 is the insertion loss parameter curve, R 1N is the impedance value of the first RF port of the vector network analyzer, R 2N is the impedance value of the second RF port of the vector network analyzer, R 1F is the impedance value of the first resistor, R 2F is the impedance value of the second resistor.

5. A transfer impedance measuring device for a high voltage connection system, characterized in that: A method for measuring transfer impedance of a high voltage connection system according to any one of claims 1 to 4, comprising: A first acquisition unit, used to acquire parameter data of the measuring device and parameter data of the vector network analyzer; A first processing unit is used to obtain the external circuit impedance and the internal circuit impedance of the sample to be tested by using a vector network analyzer; A second acquisition unit, used to acquire a first resistor and a second resistor, wherein the first resistor is equivalent to the impedance value of the internal circuit, and the second resistor is equivalent to the impedance value of the external circuit; A second processing unit is used to measure the internal and external impedance equivalent circuit of the sample to be tested by using the vector network analyzer and the measuring device to obtain an insertion loss parameter curve; The third processing unit is used to calculate the transfer impedance curve of the sample to be tested according to the insertion loss parameter curve, the parameter data of the measuring device, the parameter data of the vector network analyzer, the first resistor impedance value and the second resistor impedance value.

6. The transfer impedance measuring device of the high voltage connection system according to claim 5, characterized in that: In the aspect of using the first resistor and the second resistor in combination with the sample to be tested to obtain an equivalent circuit of internal and external impedances of the sample to be tested, the equivalent circuit of internal and external impedances of the sample to be tested includes: A vector network analyzer, a core wire of a sample to be tested, a shielding layer of the sample to be tested, a first resistor and a second resistor, wherein the first RF port of the vector network analyzer is connected to the input end of the core wire of the sample to be tested, the output end of the core wire of the sample to be tested is connected to the first end of the first resistor, the second end of the first resistor is connected to the input end of the shielding layer of the sample to be tested, the output end of the shielding layer of the sample to be tested is connected to the first end of the second resistor, and the second end of the second resistor is connected to the second RF port of the vector network analyzer.

7. The transfer impedance measuring device of the high voltage connection system according to claim 5, characterized in that: In the aspect of calculating the transfer impedance curve of the sample to be tested according to the insertion loss parameter curve, the parameter data of the measuring device, the parameter data of the vector network analyzer, the first resistor impedance value and the second resistor impedance value, the method comprises: extracting a coupling length value of the measuring device from the parameter data of the measuring device; Extracting a first radio frequency port impedance value of the vector network analyzer and a second radio frequency port impedance value of the vector network analyzer from the parameter data of the vector network analyzer; The transfer impedance curve of the sample to be measured is calculated according to the coupling length value of the measuring device, the impedance value of the first RF port of the vector network analyzer, the impedance value of the second RF port of the vector network analyzer, the impedance value of the first resistor and the impedance value of the second resistor.

8. The transfer impedance measuring device of the high voltage connection system according to claim 7, characterized in that: In the aspect of calculating the transfer impedance curve of the sample to be measured according to the coupling length value of the measuring device, the impedance value of the first RF port of the vector network analyzer, the impedance value of the second RF port of the vector network analyzer, the impedance value of the first resistor and the impedance value of the second resistor, the transfer impedance curve calculation formula is as follows: Among them, Z T is the transfer impedance curve, L C is the coupling length of the measuring device, S 21 is the insertion loss parameter curve, R 1N is the impedance value of the first RF port of the vector network analyzer, R 2N is the impedance value of the second RF port of the vector network analyzer, R 1F is the impedance value of the first resistor, R 2F is the impedance value of the second resistor.

9. A terminal, characterized in that: The invention comprises a processor, an input device, an output device and a memory, wherein the processor, the input device, the output device and the memory are interconnected, wherein the memory is used to store a computer program, the computer program comprises program instructions, and the processor is configured to call the program instructions to execute the transfer impedance measurement method of the high-voltage connection system according to any one of claims 1 to 4.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program includes program instructions, and when the program instructions are executed by a processor, the processor executes the transfer impedance measurement method for a high-voltage connection system according to any one of claims 1 to 4.

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