Radiator for server memory and mounting and dismounting method thereof

Abstract

The radiator is applied to a memory bank, the radiator comprises a temperature-uniforming plate, a clamp and a radiating assembly, the temperature-uniforming plate is connected with the outer side of the memory bank, the clamp comprises a tongue piece and at least two clamping plates, the inner sides of the at least two clamping plates movably abut against the outer sides of the two sides of the temperature-uniforming plate respectively, and the inner sides of the clamping plates movably abut against the outer sides of the two sides of the temperature-uniforming plate. One side of the tongue piece is connected with the clamping plate, the tongue piece and the temperature equalizing plate are arranged at intervals, the heat dissipation assembly comprises a heat dissipation pipe and heat dissipation fins, one end of the heat dissipation pipe is connected with the heat dissipation fins, and the two sides of the end, away from the heat dissipation fins, of the heat dissipation pipe movably abut against the temperature equalizing plate and the tongue piece respectively. According to the memory radiator with the self-locking structure, self-locking of the heat pipe is achieved, meanwhile, system wind resistance can be balanced, and the radiating effect is improved.

Description

Technical Field

[0001] The invention relates to a radiator for a server memory and a method for installing and disassembling the radiator, and belongs to the field of servers. Background Art

[0002] With the update and iteration of server and memory technology, the power consumption and usage of memory are getting higher and higher, and the demand for heat dissipation solutions for high-power and high-density memory is imminent. However, at present, since the memory is generally inserted vertically side by side on the motherboard, the memory heat dissipation solution has problems such as small heat dissipation space, large air resistance between memory, heat pipe cannot be closely attached to the heat source, and radiator is difficult to fix.

[0003] With the iteration and update of servers, the number of memory modules installed is increasing. However, due to the small gap between the memory modules, it is impossible to directly design a heat sink, and the fixing of the memory heat sink is a major obstacle to memory heat dissipation. In addition, the height of the memory is mostly 31.25mm, which usually causes the fluid resistance above the memory module to be smaller than the flow resistance inside the memory module, which also becomes one of the main obstacles to memory heat dissipation. Therefore, the design of memory heat dissipation solution has become one of the key breakthroughs in improving memory performance. Summary of the invention

[0004] The present invention provides a heat sink for server memory and its installation and removal method, aiming to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a heat sink for server memory and its installation and removal method, adopting a memory heat sink with a self-locking structure, realizing a self-locking heat pipe and balancing the system wind resistance, thereby improving the heat dissipation effect.

[0005] The technical solution of the present invention relates to a heat sink for server memory, which is applied to a memory bar and includes: A temperature homogenizing plate connected to the outer side of the memory bar; A clamp, comprising a tongue and at least two clamping plates, wherein the inner sides of at least two of the clamping plates are movably abutted against the outer sides of two sides of the temperature equalizing plate respectively; one side of the tongue is connected to the clamping plate, and the tongue is spaced apart from the temperature equalizing plate; The heat dissipation component comprises a heat dissipation tube and a heat dissipation fin. One end of the heat dissipation tube is connected to the heat dissipation fin. Two sides of one end of the heat dissipation tube away from the heat dissipation fin are respectively movably abutted against the temperature averaging plate and the tongue.

[0006] Furthermore, a heat conducting sheet is included, and the heat conducting sheet is arranged between the temperature averaging plate and the memory bar.

[0007] Furthermore, the clamping plate is provided with a connecting port, the tongue piece is connected to the inner wall of the connecting port, and the tongue piece covers the connecting port.

[0008] Furthermore, the heat dissipation assembly also includes a substrate, the heat sink is arranged above the substrate, the heat dissipation pipe protrudes from below the substrate, and the substrate is provided with a buckle for connecting the clamp.

[0009] Furthermore, the heat dissipation assembly also includes a latch, the tongue piece is provided with a tongue wing, and the latch is provided with a groove for accommodating the tongue wing.

[0010] Furthermore, the latch is provided with a pin head, and the clamping plate is provided with a slot for accommodating the pin head.

[0011] Furthermore, the temperature equalizing plate is provided with a sliding buckle, and the clamping plate is provided with a crack-stopping opening for limiting the sliding buckle.

[0012] Furthermore, a side of the clamping plate away from the heat dissipation assembly is inclined inwards.

[0013] Another aspect of the technical solution of the present invention relates to a method for installing a heat sink for a server memory, which is applied to the heat sink for a server memory in the above embodiment; the installation method comprises the following steps: S110, sticking the temperature equalizing plate to both sides of the memory bar; S120, inserting the memory module with the temperature equalizer between the two clamping plates; S130, insert the heat dissipation pipe between the tongue piece and the temperature equalizer.

[0014] Another aspect of the technical solution of the present invention is a method for disassembling a heat sink for a server memory, which is applied to the heat sink for a server memory in the above embodiment; the disassembly method comprises the following steps: S210, applying force to pull the heat dissipation component in a direction away from the fixture, so that the heat dissipation component is separated from the fixture; S220, applying force to pull the clamp in a direction away from the memory bar, so that the clamp is separated from the memory bar; S230, separate the temperature vapor chamber from the memory bar.

[0015] The beneficial effects of the present invention are as follows.

[0016] The heat sink for server memory of the present invention and the installation and disassembly method thereof are designed to solve the problem of memory heat dissipation difficulties and the problem of close fitting of heat pipes and heat sources. A memory heat sink that can both self-lock the heat pipes and balance the system wind resistance is designed for high-power consumption and high-density memory, thereby improving the heat dissipation effect.

[0017] The heat sink for server memory of the present invention has a clamp that not only has a self-locking effect that is convenient for disassembly, but also plays a connecting role. The clamp cooperates with the clamp plate and the tongue piece so that the clamp can be detachably connected to the temperature equalizing plates on both sides of the memory bar, and can be detachably connected to the heat dissipation component, so that the heat dissipation pipe is closely attached to the temperature equalizing plate. At the same time, the heat dissipation plate can be arranged on the outside of the memory bar, so that for compactly arranged memory bars, the heat sink of the embodiment of the present invention can be detachably fixed on the memory bar, and the heat sink and the memory bar can be closely attached. At the same time, the outer space of the memory bar can be fully utilized for heat dissipation, which solves the problems of less heat dissipation space of the existing memory bar and difficulty in fixing the heat sink, as well as the problem of air blockage caused by narrow spacing between multiple memory bars and the problem that the heat sink cannot be closely attached to the memory bar, and can effectively improve the heat dissipation effect of the server memory bar. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 2 is a side view of a heat sink equipped with a memory module according to an embodiment of the present invention.

[0019] Figure 2 is a side schematic diagram of a heat sink without a memory module according to an embodiment of the present invention.

[0020] Figure 3 4 is a front exploded view of a heat sink according to an embodiment of the present invention.

[0021] Figure 4 4 is a front schematic diagram of a heat sink according to an embodiment of the present invention.

[0022] Figure 5 is a schematic structural diagram of a clamp according to an embodiment of the present invention.

[0023] Figure 6 is a schematic top view of a clamp according to an embodiment of the present invention.

[0024] Figure 7 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present invention.

[0025] Figure 8 is a schematic diagram of the structure of a temperature homogenizing plate according to an embodiment of the present invention.

[0026] Description of reference numerals: 100, temperature averaging plate; 110, slider; 120, recess; 200, clamp; 210, tongue; 211, tongue wing; 212, flat plate; 213, arc portion; 220, clamp; 221, connection port; 222, clamp portion; 223, connection portion; 224, slot; 225, stopper; 230, connection plate; 231, bayonet; 300, heat dissipation assembly; 310, heat dissipation pipe; 320, heat sink; 330, base plate; 331, buckle; 340, latch; 341, pin body; 342, pin head; 344, groove; 400, thermal pad; 500, memory module. DETAILED DESCRIPTION

[0027] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the present invention, so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that the embodiments and features in the embodiments of this application can be combined with each other without conflict.

[0028] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature, or it may be indirectly fixed or connected to the other feature. In addition, the descriptions of up, down, left, right, top, bottom, etc. used in the present invention are only relative to the relative positional relationship of the components of the present invention in the drawings.

[0029] In addition, unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art. The terms used in this specification are only for describing specific embodiments, not for limiting the present invention. The term "and / or" used herein includes any combination of one or more related listed items.

[0030] It should be understood that, although the terms first, second, third, etc. may be used to describe various elements in the present disclosure, these elements should not be limited to these terms. These terms are only used to distinguish elements of the same type from each other. For example, without departing from the scope of the present disclosure, the first element may also be referred to as the second element, and similarly, the second element may also be referred to as the first element.

[0031] See also Figures 1 to 8 The heat sink for server memory of the technical solution of the present invention is applied to a memory stick 500, and the heat sink for server memory includes a temperature averaging plate 100, a clamp 200 and a heat dissipation assembly 300. The temperature averaging plate 100 is connected to the outer side of the memory stick 500, the clamp 200 includes a tongue 210 and at least two clamps 220, the inner sides of the at least two clamps 220 are respectively movably abutted against the outer sides of the two sides of the temperature averaging plate 100, one side of the tongue 210 is connected to the clamp 220, the tongue 210 is spaced apart from the temperature averaging plate 100, the heat dissipation assembly 300 includes a heat pipe 310 and a heat sink 320, one end of the heat pipe 310 is connected to the heat sink 320, and the two sides of one end of the heat pipe 310 away from the heat sink 320 are respectively movably abutted against the temperature averaging plate 100 and the tongue 210.

[0032] The heat sink for server memory of the present invention has a clamp 200 which not only has a self-locking function for easy disassembly, but also plays a connecting role. The clamp 200 cooperates with the clamp 220 and the tongue 210, so that the clamp 200 can be detachably connected to the temperature averaging plates 100 on both sides of the memory bar 500, and can be detachably connected to the heat dissipation assembly 300, so that the heat dissipation pipe 310 is closely attached to the temperature averaging plates 100, and the heat dissipation plate can be arranged on the outside of the memory bar 500, so that for the compactly arranged memory bars 500, the heat sink of the embodiment of the present invention can be detachably fixed on the memory bar 500, and the heat sink and the memory bar 500 can be closely attached, and the outer space of the memory bar 500 can be fully utilized for heat dissipation, thereby solving the problems of less heat dissipation space of the existing memory bar 500 and difficulty in fixing the heat sink, as well as the problem of difficulty in heat dissipation of the memory due to poor air circulation caused by narrow spacing between multiple memory bars 500, and the problem of the heat sink being unable to be closely attached to the memory bar 500, and effectively improving the heat dissipation effect of the server memory bar 500.

[0033] For example, see Figures 1 to 4 , the lower side of the memory stick 500 of the server is inserted into the server motherboard. The heat sink of the embodiment of the present invention clamps the two sides of the memory stick 500 through the clamp 200, and dissipates heat for the memory stick 500 through the heat sink 320 arranged above the memory stick 500 and the heat pipe 310 close to the two sides of the memory stick 500. Specifically, the temperature equalizing plate 100 is first fixedly connected to the outside of the memory stick 500. It can be understood that the temperature equalizing plate 100 can be provided with multiple, multiple temperature equalizing plates 100 are arranged on the front and rear sides of the memory stick 500, and multiple clamps 220 are respectively arranged on the front and rear sides of the memory stick 500. For example, two clamps 220 are provided, the upper sides of the two clamps 220 are connected, and the lower sides of the two clamps 220 form a clamp, and the opening of the clamp faces downward, and the memory stick 500 can enter the two clamps 220 from the bottom through the clamp. The inner sides of the two clamping plates 220 are respectively in contact with the temperature averaging plates 100 on the front and rear sides of the memory bar 500, so that the clamp 200 is clamped on the memory bar 500. At this time, a socket is formed between the tongue 210 and the temperature averaging plate 100, and the opening of the socket faces upward. The lower end of the heat pipe 310 can enter between the tongue 210 and the temperature averaging plate 100 from above through the socket. The tongue 210 and the temperature averaging plate 100 are respectively in contact with the opposite sides of the heat pipe 310, so that the heat dissipation assembly 300 is fixed above the memory bar 500. It should be noted that the temperature averaging plate 100 can be fixedly connected to the side of the memory bar 500 by gluing.

[0034] In some embodiments, a heat conducting sheet 400 is disposed between the heat spreader and the memory module 500. It is understood that a plurality of heat conducting sheets 400 may be provided. Figure 1For example, two heat conducting sheets 400 are provided, and two temperature evaporating plates 100 are provided. The inner sides of the two heat conducting sheets 400 are respectively provided at the front side and the rear side of the memory bar 500, and the outer side of the heat conducting sheet 400 is connected to the inner side of the heat evaporating plate. It should be noted that the heat conducting sheet 400 can be fixedly connected to the side of the memory bar 500 by gluing, and the temperature evaporating plate 100 can be fixedly connected to the side of the heat conducting sheet 400 by gluing. Furthermore, the heat conducting sheet 400 can be made of a heat conductive material.

[0035] In some embodiments, the clamping plate 220 is provided with a connection port 221, and the tongue piece 210 is connected to the inner wall of the connection port 221. Figure 5 and Figure 6 The clamp 200 includes a tongue 210, a connecting plate 230 and two clamps 220. The upper sides of the two clamps 220 are respectively connected to the front and rear sides of the connecting plate 230, so that the clamp 200 forms a U-shaped structure. The lower sides of the two clamps 220 form a clamping opening. The connecting opening 221 is arranged on the upper side of the clamp 220, and the lower inner wall of the connecting opening 221 is connected to the lower side of the tongue 210. Specifically, the tongue 210 is provided with a flat portion 212 and an arc portion 212, the lower side of the arc portion 212 is connected to the lower inner wall of the connecting port 221, the lower side of the flat portion 212 is connected to the upper side of the arc portion 212, and the upper side of the arc portion 212 extends in a direction away from the clamping plate 220, so that the flat portion 212 and the clamping plate 220 are not on the same plane, the flat portion 212 protrudes from the outer side of the clamping plate 220, and the tongue 210 covers the outer side of the connecting port 221, so that when the memory bar 500 provided with the temperature equalizing plate 100 enters between the two clamping plates 220, the two clamping plates 220 are in contact with both sides of the temperature equalizing plate 100, and there is a gap between the flat portion 212 and the temperature equalizing plate 100.

[0036] It is understandable that the tongue piece 210 and the connection port 221 are both provided in plurality, the number of the tongue piece 210 and the number of the connection port 221 match, and the outer side of each connection port 221 is covered with a tongue piece 210. Further, the connection plate 230 is provided in plurality, see Figure 5 and Figure 6 The clamping plate 220 is provided with a clamping portion 222 and a plurality of connecting portions 223. The clamping portion 222 is used to abut against the temperature homogenizing plate 100. The lower sides of the plurality of connecting portions 223 are connected to the upper sides of the clamping portions 222. The connecting portions 223 are perpendicular to the clamping portions 222. Two adjacent connecting portions 223 and the clamping portions 222 form a connecting hole. The upper sides of the connecting portions 223 are connected to the connecting plate 230, so that a plurality of notches are formed on the upper side of the clamp 200, thereby forming an upwardly opening socket between the tongue 210 and the temperature homogenizing plate 100. When the heat pipe 310 enters from the socket and is clamped between the tongue 210 and the temperature homogenizing plate 100, the heat pipe 310 is tightly fitted to the temperature homogenizing plate 100, which is beneficial to improving the heat dissipation effect of the memory stick 500.

[0037] In some embodiments, the side of the clamping plate 220 away from the heat dissipation assembly 300 is tilted inward. Specifically, the heat dissipation assembly 300 is disposed on the upper side of the clamping plate 220, and the lower side of the clamping plate 220 is tilted and extended inward, so that the clamping plate 220 and the connecting plate 230 form an acute angle, that is, the lower side of the clamping plate 220 is tilted inward at a certain angle, for example, the lower side of the clamping plate 220 is tilted inward by 1 degree, so that the clamping plate 220 can clamp the memory bar 500. It should be noted that the clamping plate 220 can be made of a rigid material, and through the rigid stress of the clamping plate 220, the clamp 200 can clamp the memory bar 500 and the temperature plate 100.

[0038] In some embodiments, the heat dissipation assembly 300 further includes a base plate 330, the heat sink 320 is disposed above the base plate 330, the heat dissipation pipe 310 protrudes from below the base plate 330, and the base plate 330 is provided with a buckle for connecting the clamp 200. Figure 7 The base plate 330 is in the shape of a long strip. When the heat dissipation assembly 300 is inserted into the fixture 200, the base plate 330 is arranged above the connecting plate 230. The two connecting plates 230 on the left and right sides of the clamp 220 are both provided with a bayonet 331, which is arranged on the outside of the connecting plate 230. There are two buckles, which are arranged on the left and right sides of the base plate 330 respectively. When the buckle can be snapped into the bayonet 331, the base plate 330 can be fastened on the connecting plate 230, so that the heat dissipation assembly 300 can be fixed on the fixture 200. Further, a plurality of heat sinks 320 are provided, and the heat sink 320 is a U-shaped structure. A plurality of heat sinks 320 are vertically stacked side by side above the base plate 330. The heat pipe 310 is vertically arranged and the upper side of the heat pipe 310 passes through the plurality of heat sinks 320. It should be noted that a plurality of heat dissipation tubes 310 may be provided. Furthermore, the number of heat dissipation tubes 310 matches the number of tongues 210 . One heat dissipation tube 310 abuts against one tongue 210 . It is understandable that one tongue 210 may also abut against a plurality of heat dissipation tubes 310 .

[0039] In some embodiments, the heat dissipation assembly 300 further includes a latch 340, the tongue 210 is provided with a tongue wing 211, and the latch 340 is provided with a groove 344 for accommodating the tongue wing 211. When the heat dissipation assembly 300 is inserted into the fixture 200, the tongue wing 211 enters the groove 344, and the tongue wing 211 abuts against the inner wall of the groove 344, so that the tongue 210 can further clamp the heat dissipation pipe 310. Figure 4 , Figure 5 and Figure 7, the lower side of the tongue piece 210 is connected to the inner wall of the connection port 221, the tongue wing 211 is arranged on the left side and / or right side of the tongue piece 210, and the tongue wing 211 extends toward the inner side of the tongue piece 210, that is, the tongue wing 211 is recessed toward the inner side of the tongue piece 210. Specifically, the latch 340 is provided with a pin body 341 and a pin head 342, the upper side of the pin body 341 is connected to the base plate 330, and the lower side of the pin body 341 is connected to the pin head 342. It can be understood that the pin body 341 is thicker than the pin head 342, and the groove 344 is arranged on the pin body 341. The latches 340 on both sides of the memory stick 500 are symmetrically arranged. When the tongue wing 211 enters the groove 344, the opening of the groove 344 faces the tongue wing 211, and the outer side of the tongue wing 211 abuts against the inner wall of the groove 344. It should be noted that the lower side of the clamping plate 220 extends inward, and the inner wall of the groove 344 abutting against the tongue wing 211 is inclined inward from top to bottom, which can further improve the clamping of the heat dissipation component 300.

[0040] In some embodiments, the latch 340 is provided with a pin head 342, and the clamping plate 220 is provided with a slot 224 for accommodating the pin head 342. When the heat dissipation assembly 300 is inserted into the clamp 200, the latch 340 enters the slot 224. Figure 4 , Figure 5 and Figure 7 The slot 224 is arranged on the inner wall of the connection port 221, and the slot 224 is arranged on the left and / or right side of the tongue 210, the opening of the slot 224 faces upward, and the thickness of the slot 224 matches the pin head 342. When the pin head 342 is inserted into the slot 224, the inner side of the slot 224 abuts against the outer side of the pin head 342, and the tongue wing 211 abuts against the inner wall of the groove 344, so that the tongue 210 can further clamp the heat dissipation pipe 310. It should be noted that the lower side of the clamping plate 220 is tilted inward, and the inner wall of the slot 224 abutting against the pin head 342 is tilted inward from top to bottom, which can further improve the clamping of the heat dissipation component 300.

[0041] In some embodiments, the temperature homogenizing plate 100 is provided with a slider 110, and the clamping plate 220 is provided with a stopper 225 for limiting the slider 110. Figures 3 to 5 , Figure 8The crack stop opening 225 is arranged on the inner wall of the connection opening 221 and the opening faces upward. The crack stop opening 225 is arranged on the left and / or right side of the tongue piece 210. The slider 110 is arranged on the outer side of the temperature-averaging plate 100, that is, the slider 110 protrudes from the outer side of the temperature-averaging plate 100. When the memory bar 500 and the temperature-averaging plate 100 are inserted into the two clamping plates 220, the slider 110 pushes the clamping plates 220 outward. When the temperature-averaging plate 100 continues to enter, when the slider 110 reaches the crack stop opening 225, the clamping plates 220 on both sides move inward and contact the temperature-averaging plate 100 to make a sound, which serves to prompt and confirm that the memory bar 500 has been inserted in place. Furthermore, the slider 110 is a triangular-shaped structure, and the upward inclined surface of the slider 110 extends outward from top to bottom, so that the slider 110 is easier to be inserted into the clamping plate 220.

[0042] See also Figure 3 and Figure 4 , further, two temperature evaporating plates 100 are arranged on both sides of the memory bar 500, and the memory bar 500 protrudes from the upper side of the temperature evaporating plates 100. When the heat dissipation component 300 is inserted into the fixture 200, the temperature evaporating plates 100 are in contact with the substrate 330, and the memory bar 500 is spaced apart from the substrate 330, which is conducive to preventing the memory bar 500 from being damaged during the installation process. Further, the memory bar 500 protrudes from the left side and / or right side of the temperature evaporating plates 100. Further, a recess 120 matching the connecting plate 230 is arranged on the upper side of the temperature evaporating plates 100. When the heat dissipation component 300 is inserted into the fixture 200, the connecting plate 230 enters the recess 120.

[0043] See also Figures 1 to 8 The installation method of the heat sink for server memory of the technical solution of the present invention is applied to the heat sink for server memory of the embodiment of the present invention, and the installation method of the heat sink for server memory includes at least the following steps: S110, sticking the temperature homogenizing plate 100 to both sides of the memory bar 500; S120, inserting the memory bar 500 with the temperature equalizing plate 100 between the two clamping plates 220; S130 , insert the heat dissipation pipe 310 between the tongue piece 210 and the temperature homogenizing plate 100 .

[0044] Specifically, the heat conducting sheet 400 is first pasted on the front and rear sides of the memory stick 500, and then the temperature vapor chamber 100 is pasted on the outer sides of the two heat conducting sheets 400. Then, the memory stick 500 with the heat conducting sheet 400 and the temperature vapor chamber 100 is inserted into the lower clamping opening of the clamp 200, and force is applied to move the memory stick 500 toward the inner side of the clamp 200 until the slider 110 reaches the crack stop opening 225 and makes a sound, then the force is stopped, and at this time, the clamp 200 clamps the memory stick 500. Finally, align the heat dissipation tube 310 with the clamp formed by the tongue piece 210 and the temperature homogenizing plate 100, align the groove 344 of the latch 340 with the tongue wing 211, and align the pin head 342 with the slot 224, and then apply force to make the heat dissipation tube 310 enter the clamp, the tongue wing 211 enter the groove 344, and the pin head 342 enter the slot 224, and continue to apply force to move the heat dissipation component 300 toward the fixture 200 until the buckle reaches the buckle 331 and makes a sound, then stop applying force, at this time, the heat dissipation component 300 is fixed on the fixture 200, and the installation of the radiator is completed, for example, see Figure 1 The heat sink is disposed on the upper side of the memory stick 500 .

[0045] See also Figures 1 to 8 The disassembly method of the heat sink for server memory of the technical solution of the present invention is applied to the heat sink for server memory of the embodiment of the present invention, and the disassembly method of the heat sink for server memory includes at least the following steps: S210, applying force to pull the heat dissipation component 300 in a direction away from the fixture 200, so that the heat dissipation component 300 is separated from the fixture 200; S220, applying force to pull the clamp 200 in a direction away from the memory bar 500, so that the clamp 200 is separated from the memory bar 500; S230 , separate the temperature vapor chamber 100 from the memory bar 500 .

[0046] Specifically, see Figure 1 , the heat dissipation assembly 300 is arranged on the upper side of the clamp 200, and the memory stick 500 protrudes from the lower side of the clamp 200. First, the buckles on both sides of the heat dissipation assembly 300 are opened outwards to make the buckles leave the bayonet 331, and then the heat dissipation assembly 300 is pulled upwards to make the pin head 342 disengage from the slot 224, the tongue wing 211 disengage from the groove 344, and the heat pipe 310 disengage from the clamp, so that the heat dissipation assembly 300 is separated from the clamp 200. Then, when the memory stick 500 is inserted into the server, the clamp 200 is forced upward, or when the memory stick 500 is separated from the server, the clamp 200 is forced upward and the memory stick 500 is forced downward at the same time, so that the slider 110 is separated from the crack stop 225, and then the memory stick 500 is separated from the clamp 200. Finally, the temperature plate 100 and the heat conducting sheet 400 are removed from the memory stick 500, thereby completing the disassembly of the heat sink.

[0047] The heat sink for server memory of the present invention can be installed by first inserting the memory stick 500 into the clamp 200 and then directly inserting the heat dissipation component 300 into the clamp 200. When disassembling, it only needs to pull out the heat dissipation component 300 and the clamp 200 in turn. Under the action of the tongue 210, the pin 340 and the bayonet 331, it is easy to install and disassemble, and at the same time, the heat dissipation pipe 310 can be tightly attached to the temperature equalizing plate 100.

[0048] The above is only a preferred embodiment of the present invention. The present invention is not limited to the above implementation. As long as the technical effect of the present invention is achieved by the same means, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the scope of protection of the present disclosure. All should belong to the protection scope of the present invention. Within the protection scope of the present invention, its technical scheme and / or implementation method can have various modifications and changes.

Claims

1. A heat sink for server memory, applied to a memory bar (500), characterized in that: include: A temperature homogenizing plate (100) connected to the outer side of the memory bar (500); The clamp (200) comprises a tongue (210) and at least two clamping plates (220), wherein the inner sides of the at least two clamping plates (220) are respectively movably abutted against the outer sides of two sides of the temperature equalizing plate (100); one side of the tongue (210) is connected to the clamping plate (220), and the tongue (210) and the temperature equalizing plate (100) are spaced apart; The heat dissipation assembly (300) comprises a heat dissipation pipe (310) and a heat dissipation fin (320), wherein one end of the heat dissipation pipe (310) is connected to the heat dissipation fin (320); and two sides of one end of the heat dissipation pipe (310) away from the heat dissipation fin (320) are movably abutted against the temperature homogenizing plate (100) and the tongue piece (210), respectively.

2. The heat sink for server memory according to claim 1, characterized in that: It also includes a heat conducting sheet (400), wherein the heat conducting sheet (400) is arranged between the temperature averaging plate (100) and the memory bar (500).

3. The heat sink for server memory according to claim 1, characterized in that: The clamping plate (220) is provided with a connecting port (221), the tongue piece (210) is connected to the inner wall of the connecting port (221), and the tongue piece (210) covers the connecting port (221).

4. The heat sink for server memory according to claim 1, characterized in that: The heat dissipation assembly (300) further comprises a base plate (330), the heat sink (320) is arranged above the base plate (330), the heat dissipation pipe (310) protrudes from below the base plate (330), and the base plate (330) is provided with a buckle for connecting to the clamp (200).

5. The heat sink for server memory according to claim 1, characterized in that: The heat dissipation assembly (300) further comprises a latch (340), the tongue piece (210) is provided with a tongue wing (211), and the latch (340) is provided with a groove (344) for accommodating the tongue wing (211).

6. The heat sink for server memory according to claim 5, characterized in that: The latch pin (340) is provided with a pin head (342), and the clamping plate (220) is provided with a slot (224) for accommodating the pin head (342).

7. The heat sink for server memory according to claim 1, characterized in that: The temperature equalizing plate (100) is provided with a sliding buckle (110), and the clamping plate (220) is provided with a crack-stopping opening (225) for limiting the sliding buckle (110).

8. The heat sink for server memory according to claim 1, characterized in that: The side of the clamping plate (220) away from the heat dissipation assembly (300) is inclined inwards.

9. A method for installing a heat sink for a server memory, applied to the heat sink for a server memory according to any one of claims 1 to 8; the installation method comprises the following steps: S110, sticking the temperature equalizing plate (100) to two sides of the memory bar (500); S120, inserting the memory bar (500) with the temperature equalizing plate (100) between the two clamping plates (220); S130: insert the heat dissipation pipe (310) between the tongue piece (210) and the temperature equalizing plate (100).

10. A method for disassembling a heat sink for a server memory, applied to the heat sink for a server memory according to any one of claims 1 to 8; the disassembly method comprises the following steps: S210, applying force to pull the heat dissipation component (300) in a direction away from the clamp (200), so that the heat dissipation component (300) is separated from the clamp (200); S220, applying force to pull the clamp (200) in a direction away from the memory bar (500), so that the clamp (200) is separated from the memory bar (500); S230, separating the temperature vapor chamber (100) from the memory bar (500).

Images