Touch panel pressure measurement and touch vibration system and electronic equipment

Abstract

The present invention relates to a touch panel pressure measurement and touch vibration system and electronic equipment, comprising: a driving circuit, a touch panel chip, a plurality of integrated sensors connected to the driving circuit and the touch panel chip, and a capacitance scanning and finger recognition device connected to the touch panel chip; wherein the integrated sensor comprises a first electrode arranged on the touch panel, a second electrode arranged on a piezoelectric ceramic, and the piezoelectric ceramic and the touch panel are separated by multiple gaskets to form a cavity structure; the touch panel chip is used to measure the pressure applied to the touch panel according to the capacitance value between the first electrode and the second electrode, and determine whether to start the capacitance scanning and finger recognition device to perform fingerprint recognition and recognize whether the touch panel is touched according to the pressure; the driving circuit is used to drive the corresponding piezoelectric ceramic to perform touch vibration according to the integrated sensor being touched.

Description

Technical Field

[0001] The present disclosure relates to the technical field of touch panels, and in particular to a touch panel pressure measurement and touch vibration system and an electronic device. Background Art

[0002] There are two common methods for measuring pressure on pressure touch panels: First, use strain gauges or piezoresistive ink to form a Wheatstone bridge, use deformation to change the resistance of one or more resistors, and measure the small voltage change of the Wheatstone bridge to calculate the deformation of the pressure touch panel. Second, use the piezoelectric effect of piezoelectric ceramics to generate an alternating voltage during mechanical deformation, and measure the magnitude of this voltage to determine the deformation of the pressure touch panel.

[0003] Both of the above methods require dedicated complex integrated circuits to process: The first method can refer to the records of patents CN202211327912.0 and CN202211652296.6. To achieve pressure measurement, the touch panel usually has a large area, so it is generally necessary to use 4 or more pressure sensors and a multi-channel pressure measurement chip. However, the price of the multi-channel complex and expensive pressure sensor and the multi-channel pressure processing chip is high. The second method requires an expensive dedicated integrated chip to achieve. This is the reason why the price of the pressure touch panel cannot be further reduced. Summary of the invention

[0004] The purpose of the present invention is to provide a touch pad pressure measurement and touch vibration system and electronic device, aiming to solve the technical problem of high touch pad cost caused by pressure measurement through multi-channel complex and expensive pressure sensors, multi-channel pressure processing chips or through dedicated integrated chips in related scenarios.

[0005] In order to achieve the above-mentioned purpose, a first aspect of an embodiment of the present disclosure provides a touch panel pressure measurement and touch vibration system, the system comprising:

[0006] A driving circuit, a touch panel chip, a plurality of integrated sensors connected to the driving circuit and the touch panel chip, and a capacitive scanning and finger recognition device connected to the touch panel chip;

[0007] The integrated sensor includes a first electrode disposed on the touch panel and a second electrode disposed on the piezoelectric ceramic, and the piezoelectric ceramic and the touch panel are separated by multiple gaskets to form a cavity structure;

[0008] The touch panel chip is used to measure the pressure on the touch panel according to the capacitance value between the first electrode and the second electrode, and determine whether to start the capacitance scanning and finger recognition device to perform fingerprint recognition and identify whether the touch panel is touched according to the pressure;

[0009] The driving circuit is used to drive the corresponding piezoelectric ceramic to perform touch vibration according to the integrated sensor being touched.

[0010] In a possible implementation, the central electrode of the piezoelectric ceramic is configured as a HV input common terminal, and the non-central electrode of the piezoelectric ceramic is configured as an output terminal;

[0011] The integrated sensor comprises an isolation trigger module, and the output end of the isolation trigger module is connected to the output end;

[0012] The isolation trigger module is triggered during the pressure measurement process, so that the first electrode on the back of the piezoelectric ceramic is grounded; when being touched, the piezoelectric ceramic is driven to perform touch vibration according to the driving signal sent by the driving circuit.

[0013] In a possible implementation, the isolation trigger module includes an N-MOS tube, the gate of the N-MOS tube is connected to the driving circuit, the drain of the N-MOS tube is connected to the non-center electrode of the piezoelectric ceramic, and the source of the N-MOS tube is grounded;

[0014] Wherein, during the pressure measurement process, the gate of the N-MOS tube receives the high level output by the driving circuit, so that the source and drain of the N-MOS tube are turned on, so that the first electrode on the back of the piezoelectric ceramic is grounded;

[0015] When being touched, the gate of the N-MOS tube receives the alternating high-level and low-level driving signals output by the driving circuit to drive the piezoelectric ceramic to perform touch vibration.

[0016] In a possible implementation, the first electrode is a mutual capacitance electrode formed by any of the following methods: parallel intercalation, planar concentric double helix, or concentric alternating intercalation.

[0017] In a possible implementation manner, the distance between the first electrode and the second electrode is 0.05 mm to 0.5 mm.

[0018] In a possible implementation, the gasket is one of double-sided tape and double-sided adhesive silicone.

[0019] In a possible implementation, the gasket is in a shape of two arc segments, multiple arc segments, or a full arc.

[0020] In a possible implementation, the system further includes:

[0021] A control unit, the control unit is connected to the driving circuit and the touch panel chip respectively;

[0022] The control unit is used to output a first pulse width modulation signal, a second pulse width modulation signal and an input voltage v1 to the driving circuit;

[0023] The driving circuit is used to drive discharge according to the first pulse width modulation signal, the second pulse width modulation signal and the input voltage v1.

[0024] In a possible implementation, the driving circuit includes a boost circuit, a discharge circuit and a feedback circuit respectively connected to the control unit, the boost circuit is connected to the integrated sensor,

[0025] The boost circuit is used to modulate the input voltage v1 input by the control unit to the boost circuit into a target input voltage of a specific waveform based on the first pulse width modulation signal input by the control unit, and output the target input voltage to the feedback circuit;

[0026] The feedback circuit is used to lead the target input voltage back to the control unit as feedback of the input voltage v1, and output the target input voltage to the discharge circuit;

[0027] The discharge circuit is used for performing driving discharge according to the target input voltage based on the second pulse width modulation signal input by the control unit.

[0028] In a possible implementation, the boost circuit is a flyback switch circuit, and the flyback switch circuit includes: a transformer L10, a diode D11 and a MOS tube Q10;

[0029] The first end of the low voltage input side of the transformer L10 is connected to the reference voltage VIN_A, the second end of the low voltage input side of the transformer L10 is connected to the drain of the MOS tube Q10, the first end of the high voltage output side of the transformer L10 is connected to the anode of the diode D11, and the second end of the high voltage output side of the transformer L10 is grounded;

[0030] The cathode of the diode D11 is respectively configured as the output end of the driving circuit, connected to the second electrode of the integrated sensor, and configured as the output end of the flyback switch circuit, connected to the input end of the feedback circuit.

[0031] In a possible implementation, the flyback switch circuit further includes a capacitor C12, a resistor R11, a capacitor C13, a capacitor C14, a capacitor C15, a diode D10, a capacitor C10 and a resistor R10;

[0032] The first end of the capacitor C12 is connected to the first end of the resistor R11, and is connected to the reference voltage VIN_A after the connection. The second end of the capacitor C12 is grounded. The first end and the second end of the capacitor C13 are respectively connected to the first end and the second end of the resistor R11. The first end of the low voltage input side of the transformer L10 is connected to the first end of the capacitor C13. The second end of the low voltage input side of the transformer L10 is connected to the anode of the diode D10. The cathode of the diode D10 is connected to the second end of the capacitor C13. The anode of the diode D10 is connected to the drain of the MOS tube Q10. The source of the MOS tube Q10 is grounded. The gate of the MOS tube Q10 is configured to be connected to the control unit to receive the first pulse width modulation signal input by the control unit.

[0033] After the first end of the capacitor C14 is connected to the cathode of the diode D11, it is constructed as the output end of the drive circuit and connected to the second electrode of the integrated sensor. After the first end of the capacitor C15 is connected to the first end of the capacitor C14, it is constructed as the output end of the flyback switch circuit and connected to the input end of the feedback circuit. The second end of the capacitor C15 and the second end of the capacitor C14 are grounded respectively.

[0034] In a possible implementation, the boost circuit is a combination circuit of a boost switch and a protection circuit and a Boost boost circuit, the boost switch and the protection circuit include a capacitor C11, a processing chip U10, a capacitor C16, a capacitor C9 and a resistor R19, and the Boost boost circuit includes: an inductor L4, a diode D3 and a MOS tube Q6;

[0035] Wherein, the capacitor C11 is connected to the voltage signal input terminal of the processing chip U10, and is connected to the reference voltage VIN after the connection, the first end of the capacitor C16 is configured to be connected to the DC enable signal DCDC_EN, the second end of the capacitor C16 is connected to the first end of the resistor R19, and is connected to the enable signal input terminal of the processing chip U10 after the connection, the first end of the capacitor C9 is connected to the signal output terminal of the processing chip U10, and is connected to the reference voltage VIN_A after the connection and is configured to be connected to the signal input terminal in the Boost boost circuit as the output terminal, and the second end of the resistor R19 and the second end of the capacitor C9 are grounded respectively;

[0036] The first end of the inductor L4 is connected to the reference voltage VIN_A and is constructed as the signal input end of the Boost circuit. The second end of the inductor L4 is connected to the anode of the diode D3 and is connected to the drain of the MOS tube Q6 after the connection. The cathode of the diode D3 is constructed as the output end of the drive circuit, connected to the second electrode of the integrated sensor, and connected to the input end of the feedback circuit.

[0037] In a possible implementation, the Boost circuit further includes: a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C8 and a resistor R18;

[0038] Among them, the first end of the capacitor C5 is connected to the first end of the inductor L4, and is connected to the reference voltage VIN_A and is constructed as the signal input end of the Boost boost circuit after the connection. The cathode of the diode D3 is connected to the first end of the capacitor C6, and is constructed as the output end of the drive circuit after the connection, and is connected to the second electrode of the integrated sensor. The first end of the capacitor C7 is connected to the first end of the capacitor C6, and is connected to the input end of the feedback circuit after the connection. The first end of the capacitor C8 is connected to the control unit to receive the first pulse width modulation signal input by the control unit. The second end of the capacitor C8 is connected to the first end of the resistor R18, and is connected to the gate of the MOS tube Q6 after the connection. The second end of the capacitor C5, the second end of the resistor R18, the source of the MOS tube Q6, the second end of the capacitor C6, and the second end of the capacitor C7 are grounded respectively.

[0039] According to a second aspect of the embodiments of the present disclosure, an electronic device is provided, including: a touch panel and the touch panel pressure measurement and touch vibration system described in any one of the first aspects.

[0040] The present invention provides a touch panel pressure measurement and touch vibration system and electronic equipment. Compared with the prior art, the present invention has the following beneficial effects:

[0041] The touch panel pressure measurement and touch vibration system includes: a driving circuit, a touch panel chip, a plurality of integrated sensors connected to the driving circuit and the touch panel chip, and a capacitive scanning and finger recognition device connected to the touch panel chip; wherein the integrated sensor includes a first electrode arranged on the touch panel, a second electrode arranged on the piezoelectric ceramic, and the piezoelectric ceramic and the touch panel are separated by multiple gaskets to form a cavity structure; the touch panel chip is used to measure the pressure on the touch panel according to the capacitance value between the first electrode and the second electrode, and determine whether to start the capacitive scanning and finger recognition device to perform fingerprint recognition and identify whether the touch panel is touched according to the pressure; the driving circuit is used to drive the corresponding piezoelectric ceramic to perform touch vibration according to the integrated sensor being touched. The capacitance measurement capability of the touch chip is fully utilized, and the capacitance electrode is formed by the copper surface of the touch panel, and the capacitance pressure sensor is formed after being grounded with the metal sheet on the back of the piezoelectric ceramic. No additional components are required, and the cost is extremely low. The back of the piezoelectric ceramic is reused as the ground electrode of the pressure sensor or the vibration driving circuit, and the structure is simple and the volume is light and thin.

[0042] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0044] Figure 1 It is a block diagram of a touch panel pressure measurement and touch vibration system according to an embodiment of the specification.

[0045] Figure 2 It is a schematic diagram of an integrated sensor shown according to an embodiment of the specification.

[0046] Figure 3 It is a schematic diagram of another integrated sensor shown in an embodiment of the specification.

[0047] Figure 4 1 is an example diagram of the shape of a mutual capacitance electrode according to an embodiment of the specification.

[0048] Figure 5 is an example diagram of another shape of a mutual capacitance electrode shown in an embodiment of the specification.

[0049] Figure 6 is an example diagram of another shape of a mutual capacitance electrode shown in an embodiment of the specification.

[0050] Figure 7 This is an example diagram of the shape of a self-capacitance electrode shown in an embodiment of the specification.

[0051] Figure 8 This is an example diagram of a gasket shape shown according to an embodiment of the specification.

[0052] Fig. 9 This is an example diagram of another gasket shape shown in an embodiment of the specification.

[0053] Fig.10 It is a block diagram of another touch panel pressure measurement and touch vibration system according to an embodiment of the specification.

[0054] Fig.11 It is a circuit diagram of a driving circuit according to an embodiment of the specification.

[0055] Fig.12 It is a circuit diagram of a flyback switching circuit shown in an embodiment of the specification.

[0056] Fig.13 It is a block diagram of another touch panel pressure measurement and touch vibration system according to an embodiment of the specification.

[0057] Fig.14 It is a circuit diagram of a driving circuit according to an embodiment of the specification.

[0058] Fig.15 It is a circuit diagram of a Boost circuit according to an embodiment of the specification. DETAILED DESCRIPTION

[0059] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0060] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0061] In order to achieve the above-mentioned object, the present disclosure provides a touch panel pressure measurement and touch vibration system, see Figure 1 As shown, the system comprises:

[0062] A driving circuit 13 , a touch panel chip 12 , a plurality of integrated sensors 14 connected to the driving circuit 13 and the touch panel chip 12 , and a capacitive scanning and finger recognition device 15 connected to the touch panel chip 12 .

[0063] The integrated sensor 14 includes a first electrode disposed on the touch panel and a second electrode disposed on the piezoelectric ceramic. The piezoelectric ceramic and the touch panel are separated by multiple gaskets to form a cavity structure.

[0064] The touch panel chip 12 is used to measure the pressure on the touch panel according to the capacitance value between the first electrode and the second electrode, and determine whether to start the capacitance scanning and finger recognition device 15 to perform fingerprint recognition and identify whether the touch panel is touched according to the pressure.

[0065] The driving circuit 13 is used to drive the corresponding piezoelectric ceramic to perform touch vibration according to the integrated sensor 14 being touched.

[0066] In the disclosed embodiment, when measuring pressure, the metal sheet on the back of the piezoelectric ceramic is connected to the ground. When there is pressure, the distance between the grounded metal sheet and the ground plane becomes smaller, so that the capacitance value of the mutual capacitance or self-capacitance changes. Taking the simplest self-capacitance as an example, the self-capacitance electrode and the grounded metal sheet on the back of the piezoelectric ceramic form a flat plate capacitor with a variable pole distance. When the influence of the fringe electric field is not considered, its capacitance C is: C=εS / d, where ε is the dielectric constant of the medium between the plates, S is the plate area, and d is the distance between the plates. It can be obtained that the capacitance of the self-capacitance electrode is inversely proportional to the distance between the plates.

[0067] When the distance d between the plates changes, it can be approximately considered that the change in d is linearly related to the change in capacitance C. When the gasket and the metal sheet are within the elastic range, the distance d can be considered to be proportional to the pressure under a small force deformation. Therefore, it can be approximately obtained that: g = a* dC + b.

[0068] In practical applications, an object close to the trigger force can be used to calibrate the entire panel to obtain coefficients a and b at various positions. This can minimize the nonlinear relationship from pressure to capacitance and the error caused by different initial distances of capacitance.

[0069] In order to quickly calibrate in batches, a sphere is used to calibrate the entire panel by rolling it with a robotic arm. For example, two triggering force levels are required: 90 grams and 200 grams.

[0070] The first time, the panel is calibrated with a 90-gram force sphere to obtain the calibration coefficients a1

[128] at 128 positions. The second time, the panel is calibrated with a 200-gram force sphere to obtain the calibration coefficients a2

[128] and b2

[128] at 128 positions. When the pressure is less than or equal to 90 grams, the pressure is calculated using the formula g=a1[i]*dC, where i is the grid position of the corresponding touch panel. When the pressure is greater than 90 grams, the pressure is calculated using the formula g=a2[i]*Dc + b. This ensures that the pressure error is minimal at 90 grams and 200 grams.

[0071] The above-mentioned touch panel pressure measurement and touch vibration system includes: a driving circuit, a touch panel chip, a plurality of integrated sensors connected to the driving circuit and the touch panel chip, and a capacitive scanning and finger recognition device connected to the touch panel chip. Among them, the integrated sensor includes a first electrode arranged on the touch panel, a second electrode arranged on the piezoelectric ceramic, and the piezoelectric ceramic and the touch panel are separated by multiple gaskets to form a cavity structure. The touch panel chip is used to measure the pressure on the touch panel according to the capacitance value between the first electrode and the second electrode, and determine whether to start the capacitive scanning and finger recognition device to perform fingerprint recognition and identify whether the touch panel is touched according to the pressure. The driving circuit is used to drive the corresponding piezoelectric ceramic to perform touch vibration according to the integrated sensor being touched. The capacitance measurement capability of the touch chip is fully utilized, and the capacitance electrode is formed by the copper surface of the touch panel, and the capacitive pressure sensor is formed after being grounded with the metal sheet on the back of the piezoelectric ceramic. No additional components are required, and the cost is extremely low. The back of the piezoelectric ceramic is reused as the ground electrode of the pressure sensor or the vibration driving circuit, and the structure is simple and the volume is light and thin.

[0072] In a possible implementation manner, the central electrode of the piezoelectric ceramic is configured as an HV input common terminal, and the non-central electrodes of the piezoelectric ceramic are configured as output terminals.

[0073] The integrated sensor comprises an isolation trigger module, and an output end of the isolation trigger module is connected to the output end.

[0074] The isolation trigger module is triggered during the pressure measurement process, so that the first electrode on the back of the piezoelectric ceramic is grounded. In the case of touch control, the piezoelectric ceramic is driven to perform touch vibration according to the driving signal sent by the driving circuit.

[0075] In one possible implementation, the isolation trigger module includes an N-MOS tube, a gate of the N-MOS tube is connected to the drive circuit, a drain of the N-MOS tube is connected to a non-center electrode of the piezoelectric ceramic, and a source of the N-MOS tube is grounded.

[0076] Wherein, during the pressure measurement process, the gate of the N-MOS tube receives the high level output by the driving circuit, so that the source and drain of the N-MOS tube are turned on, so that the first electrode on the back of the piezoelectric ceramic is grounded.

[0077] When being touched, the gate of the N-MOS tube receives the alternating high-level and low-level driving signals output by the driving circuit to drive the piezoelectric ceramic to perform touch vibration.

[0078] In the disclosed embodiment, the central electrode of all piezoelectric ceramics on the touch panel has been used as the modulated HV input common terminal. In order to dynamically trigger different piezoelectric ceramics to vibrate according to the finger position, the metal sheet on the back of the piezoelectric ceramic needs to be dynamically grounded or not. Therefore, an N-MOS tube is added: during the pressure measurement process, the G pole of the N-MOS tube inputs a high level to turn on D / S, so that the metal sheet on the back of the piezoelectric ceramic is grounded. During vibration, depending on whether the piezoelectric ceramic that needs to vibrate needs to vibrate, the corresponding N-MOS tube G pole is at a high level or a low level.

[0079] See also Figure 2 In the illustrated mutual capacitance integrated sensor 14, PR_TX1 and PR_RX1 in the pressure measurement / vibration feedback integrated sensor 14 are a group of pressure capacitance sensors connected to the capacitive button channel of the touch chip. Each group of pressure capacitance sensors (CAP) can be independently connected to each capacitive button channel of the touch chip.

[0080] You can share TX, connect all PR_TX1 and PR_TX2 to PR_TXN together, and connect RX to the touch chip. You can also share RX, connect all PR_RX1 and PR_RX2 to PR_RXN together, and connect TX to the touch chip. You can also connect all TX and RX in parallel and share a group of capacitive button channels: PR_TX1 and PR_TX2 to PR_TXN are all connected together, and PR_RX1 and PR_RX2 to PR_RXN are all connected together. This way, you don't take up too many channels.

[0081] Typically, in order to achieve the lowest cost advantage, the N-MOS tube Q2N can be removed and the electrode A of the piezoelectric ceramic can be directly grounded. In this way, all the piezoelectric ceramics will vibrate together, and when measuring pressure, there is no need to control PZT_CNTL1 to PZT_CNTLN.

[0082] This design has lower costs, but the disadvantage is that when there is only one finger, the entire touch panel vibrates together, which causes the vibration force to be dispersed, and the vibration noise is also louder.

[0083] See also Figure 3 In the self-capacitive integrated sensor 14 shown, PR_SELF_CAP in the pressure measurement / vibration feedback integrated sensor 14 is a group of pressure capacitance sensors connected to the capacitance button channel of the touch chip. Each group of pressure capacitance sensors can be independently connected to each capacitance button channel of the touch chip. Figure 3 In the figure, A represents the connection point between PZT_C and the piezoelectric ceramic, for example, the connection point between PZT1_C and PZT_S1. B represents the connection point between HV and the piezoelectric ceramic, for example, the connection point between HV and PZT_S1. PZT_CNTL1 is connected to the gate of transistor QS1. Similarly, PZT_CNTLN is connected to the gate of transistor QSN, while PZT1_C is connected to the drain of transistor QS1, the source of transistor QS1 is grounded, and PZTN_C is connected to the drain of transistor QSN, the source of transistor QSN is grounded.

[0084] In the disclosed embodiment, by inputting a high level at the G pole of the N-MOS tubes Q21 to Q2N, the D and S poles of Q21 are turned on and grounded, and the metal sheet electrode A on the back of the piezoelectric ceramic is grounded. The touch chip scans the capacitance value of the panel and the capacitance value of the pressure sensor. When a finger is present, the baseline value of the capacitance value of the pressure sensor will stop updating, thereby obtaining the capacitance value corresponding to the pressure of the finger pressing down. When the capacitance value on the pressure sensor reaches the threshold, the touch chip recognizes that there is a key output. According to the position of the finger, the table is looked up to obtain the piezoelectric ceramic that should vibrate. The specific piezoelectric ceramic is selected by inputting an electrical level at the G pole of the N-MOS tubes Q21 to Q2N. The waveform of HV is modulated by two optional boost circuits to make the piezoelectric ceramic vibrate. After the vibration is completed, a specific delay time is made to allow the voltage on the piezoelectric ceramic to be completely discharged, and then the piezoelectric measurement is returned.

[0085] In a possible implementation, the first electrode is a mutual capacitance electrode formed by any of the following methods: parallel intercalation (see Figure 4 shown), a planar concentric double helix (see Figure 5 As shown), concentric alternating interlocking. Wherein, the concentric alternating interlocking can be, for example Figure 6 The "M" shape shown is inserted into each other.

[0086] See also Figure 7 As shown, the first electrode can constitute a self-capacitive electrode.

[0087] In a possible implementation manner, the distance between the first electrode and the second electrode is 0.05 mm to 0.5 mm.

[0088] In a possible implementation, the gasket is one of double-sided tape and double-sided adhesive silicone.

[0089] In the disclosed embodiment, the gasket may be double-sided tape, double-sided adhesive silicone, or other insulators to isolate the metal sheet on the back of the piezoelectric ceramic from the electrodes of the self / mutual capacitor by a distance of 0.05 mm to 0.5 mm.

[0090] In a possible implementation, the gasket is in a shape of two arc segments, multiple arc segments, or a full arc.

[0091] In the embodiment of the present disclosure, the shape of the gasket can be in various shapes, such as Figure 8 The two arcs shown, the multiple arcs, wherein, Figure 8 The dashed line in the middle represents the shape of the piezoelectric ceramic, see Fig. 9 The full arc shown in the figure, etc. In the full arc shape, in order to consider the effect of compressed air in a closed space, it is generally not made fully sealed, and holes for exhaust will be left.

[0092] In one possible implementation, see Fig.10 As shown, the system also includes:

[0093] The host 10 is connected to the control unit 11 through I2C1 communication, and the control unit 11 is connected to the driving circuit 13 and the touch panel chip 12 respectively;

[0094] The control unit is used to output a first pulse width modulation signal, a second pulse width modulation signal and an input voltage v1 to the driving circuit;

[0095] The driving circuit is used to drive discharge according to the first pulse width modulation signal, the second pulse width modulation signal and the input voltage v1.

[0096] Among them, the pulse width modulation signal (PWM Signal) can be equivalently simulated by changing the duty cycle of the pulse signal to simulate different analog signal levels. Drive discharge can refer to the discharge operation of the drive circuit, and drive discharge usually involves the on-off control of the electronic switch to control the size of the discharge current and the discharge time.

[0097] First, the driving circuit may detect the duty cycle, frequency and other parameters of the first and second pulse width modulation signals, and may convert the input voltage v1 into a voltage level suitable for driving discharge. Based on the detected pulse width modulation signal and input voltage, the electronic switch (such as MOSFET, IGBT, etc.) in the circuit may be controlled to turn on or off. The on-off state of the switch determines whether the current path of the discharge circuit is open and the magnitude of the discharge current. When the switch is controlled to the on state, the capacitor or inductor element begins to discharge. The current magnitude and duration of the discharge are jointly determined by the duty cycle and frequency of the pulse width modulation signal, as well as the value of the input voltage v1. During the discharge process, the circuit may monitor the state of discharge through a feedback mechanism, and adjust the pulse width modulation signal or input voltage as needed to achieve precise control of the discharge process.

[0098] It is understandable that the embodiment of the present disclosure may also include a host connected to the control unit via I2C. The control unit 11 may be a single chip microcomputer.

[0099] In one possible implementation, see Fig.11 As shown, the driving circuit includes a boost circuit, a discharge circuit 1303 and a feedback circuit 1304 respectively connected to the control unit, and the boost circuit is connected to the integrated sensor.

[0100] The boost circuit is used to modulate the input voltage v1 input by the control unit to the boost circuit into a target input voltage of a specific waveform based on the first pulse width modulation signal input by the control unit, and output the target input voltage to the feedback circuit.

[0101] The discharge circuit 1303 includes a resistor R15, a resistor R14 and a transistor Q11, and the connection relationship thereof is shown in FIG. Fig.11 The feedback circuit 1304 includes a resistor R12 and a resistor R13, and the connection relationship thereof is shown in FIG. Fig.11 shown.

[0102] In the disclosed embodiment, in order to achieve a good vibration effect of the piezoelectric ceramic, the input voltage V1 needs to be modulated to output a specific waveform HV. Typically, this waveform can be modulated by a flyback boost circuit or a BOOST boost voltage.

[0103] The feedback circuit is used to lead the target input voltage back to the control unit as feedback of the input voltage v1, and output the target input voltage to the discharge circuit.

[0104] The discharge circuit is used for performing driving discharge according to the target input voltage based on the second pulse width modulation signal input by the control unit.

[0105] In the disclosed embodiment, (1) the capacitance measurement capability of the touch chip is fully utilized, and the capacitance electrode is formed by the copper surface of the PCB, which is grounded to the metal sheet on the back of the piezoelectric ceramic to form a capacitive pressure sensor. No additional components are required, and the cost is extremely low.

[0106] (2) Use multiple N-MOS tubes to time-share as the ground electrode of the pressure sensor or the vibration driving circuit, which has a simple structure and a light and thin volume.

[0107] (3) Use boost circuit or flyback boost circuit to modulate specific piezoelectric ceramic circuit to make the circuit simple and low cost.

[0108] In one possible implementation, see Fig.11 As shown, the boost circuit is a flyback switch circuit, and the flyback switch circuit includes: a transformer L10, a diode D11 and a MOS tube Q10;

[0109] The first end of the low voltage input side of the transformer L10 is connected to the reference voltage VIN_A, the second end of the low voltage input side of the transformer L10 is connected to the drain of the MOS tube Q10, the first end of the high voltage output side of the transformer L10 is connected to the anode of the diode D11, and the second end of the high voltage output side of the transformer L10 is grounded;

[0110] The cathode of the diode D11 is respectively configured as the output end of the driving circuit, connected to the second electrode of the integrated sensor, and configured as the output end of the flyback switch circuit, connected to the input end of the feedback circuit.

[0111] In one possible implementation, see Fig.12 As shown, the flyback switch circuit further includes a capacitor C12, a resistor R11, a capacitor C13, a capacitor C14, a capacitor C15, a diode D10, a capacitor C10 and a resistor R10;

[0112] The first end of the capacitor C12 is connected to the first end of the resistor R11, and is connected to the reference voltage VIN_A after the connection. The second end of the capacitor C12 is grounded. The first end and the second end of the capacitor C13 are respectively connected to the first end and the second end of the resistor R11. The first end of the low voltage input side of the transformer L10 is connected to the first end of the capacitor C13. The second end of the low voltage input side of the transformer L10 is connected to the anode of the diode D10. The cathode of the diode D10 is connected to the second end of the capacitor C13. The anode of the diode D10 is connected to the drain of the MOS tube Q10. The source of the MOS tube Q10 is grounded. The gate of the MOS tube Q10 is configured to be connected to the control unit to receive the first pulse width modulation signal input by the control unit.

[0113] After the first end of the capacitor C14 is connected to the cathode of the diode D11, it is constructed as the output end of the drive circuit and connected to the second electrode of the integrated sensor. After the first end of the capacitor C15 is connected to the first end of the capacitor C14, it is constructed as the output end of the flyback switch circuit and connected to the input end of the feedback circuit. The second end of the capacitor C15 and the second end of the capacitor C14 are grounded respectively.

[0114] In one possible implementation, see Fig.13 and Fig.14 As shown, the host 10 is connected to the control unit 11 via I2C1 communication, the boost circuit is a combination circuit of a boost switch and protection circuit 1301 and a Boost boost circuit 1302, the boost switch and protection circuit include capacitor C11, processing chip U10, capacitor C16, capacitor C9 and resistor R19, and the Boost boost circuit includes: inductor L4, diode D3 and MOS tube Q6.

[0115] Among them, the capacitor C11 is connected to the voltage signal input terminal of the processing chip U10, and is connected to the reference voltage VIN after the connection. The first end of the capacitor C16 is constructed to be connected to the DC enable signal DCDC_EN. The second end of the capacitor C16 is connected to the first end of the resistor R19, and is connected to the enable signal input terminal of the processing chip U10 after the connection. The first end of the capacitor C9 is connected to the signal output terminal of the processing chip U10, and is connected to the reference voltage VIN_A after the connection and is constructed as an output terminal connected to the signal input terminal in the Boost boost circuit. The second end of the resistor R19 and the second end of the capacitor C9 are grounded respectively.

[0116] The first end of the inductor L4 is connected to the reference voltage VIN_A and is constructed as the signal input end of the Boost circuit. The second end of the inductor L4 is connected to the anode of the diode D3 and is connected to the drain of the MOS tube Q6 after the connection. The cathode of the diode D3 is constructed as the output end of the drive circuit, connected to the second electrode of the integrated sensor, and connected to the input end of the feedback circuit.

[0117] In one embodiment, see Fig.15 As shown, the Boost circuit further includes: capacitor C5, capacitor C6, capacitor C7, capacitor C8 and resistor R18;

[0118] The first end of the capacitor C5 is connected to the first end of the inductor L4, and is connected to the reference voltage VIN_A and is constructed as the signal input end of the Boost circuit after the connection. The second end of the inductor L4 is connected to the anode of the diode D3, and is connected to the drain of the MOS tube Q6 after the connection. The cathode of the diode D3 is connected to the first end of the capacitor C6, and is constructed as the output end of the drive circuit after the connection, and is connected to the second electrode of the integrated sensor. The first end of the capacitor C7 is connected to the first end of the capacitor C6, and is connected to the input end of the feedback circuit after the connection. The first end of the capacitor C8 is connected to the control unit to receive the first pulse width modulation signal input by the control unit. The second end of the capacitor C8 is connected to the first end of the resistor R18, and is connected to the gate of the MOS tube Q6 after the connection. The second end of the capacitor C5, the second end of the resistor R18, the source of the MOS tube Q6, the second end of the capacitor C6, and the second end of the capacitor C7 are grounded respectively.

[0119] An embodiment of the present disclosure provides an electronic device, including: a touch panel and a touch panel pressure measurement and touch vibration system according to any one of the aforementioned embodiments.

[0120] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments; within the technical concept of the present disclosure, various changes, modifications, substitutions and variations may be made to these embodiments, and these changes, modifications, substitutions and variations all fall within the protection scope of the present disclosure.

[0121] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any appropriate manner without contradiction, which should also be regarded as the content disclosed by this disclosure. In order to avoid unnecessary repetition, this disclosure will not further explain various possible combinations. The technical scope of this application is not limited to the content in the specification.

Claims

1. A touch panel pressure measurement and touch vibration system, characterized in that: The system comprises: A driving circuit, a touch panel chip, a plurality of integrated sensors connected to the driving circuit and the touch panel chip, and a capacitive scanning and finger recognition device connected to the touch panel chip; The integrated sensor includes a first electrode constructed by the copper surface of the touch panel and a second electrode constructed by a metal sheet on the back of the piezoelectric ceramic, and the piezoelectric ceramic and the touch panel are separated by multiple gaskets to form a cavity structure; The touch panel chip is used to measure the pressure on the touch panel according to the capacitance value between the first electrode and the second electrode, and determine whether to start the capacitance scanning and finger recognition device to perform fingerprint recognition and identify whether the touch panel is touched according to the pressure; The driving circuit is used to drive the corresponding piezoelectric ceramic to perform touch vibration according to the integrated sensor being touched; Wherein, the central electrode of the piezoelectric ceramic is configured as a HV input common terminal, and the non-central electrode of the piezoelectric ceramic is configured as an output terminal; The integrated sensor comprises an isolation trigger module, the output end of which is connected to the output end formed by the non-central electrode of the piezoelectric ceramic; The isolation trigger module is triggered during the pressure measurement process, so that the metal sheet on the back of the piezoelectric ceramic is grounded; when being touched, the piezoelectric ceramic is driven to perform touch vibration according to the driving signal sent by the driving circuit.

2. The system according to claim 1, characterized in that The isolation trigger module comprises an N-MOS tube, the gate of the N-MOS tube is connected to the driving circuit, the drain of the N-MOS tube is connected to the non-center electrode of the piezoelectric ceramic, and the source of the N-MOS tube is grounded; Wherein, during the pressure measurement process, the gate of the N-MOS tube receives the high level output by the driving circuit, so that the source and drain of the N-MOS tube are turned on, so that the metal sheet on the back of the piezoelectric ceramic is grounded; When being touched, the gate of the N-MOS tube receives the alternating high-level and low-level driving signals output by the driving circuit to drive the piezoelectric ceramic to perform touch vibration.

3. The system according to claim 1, characterized in that The first electrodes are mutual capacitance electrodes formed by any of the following methods: parallel intercalation, planar concentric double helix, and concentric alternating intercalation.

4. The system according to claim 1, characterized in that The distance between the first electrode and the second electrode is 0.05 mm to 0.5 mm.

5. The system according to claim 1, characterized in that The gasket is one of double-sided adhesive tape and double-sided adhesive silicone.

6. The system according to claim 5, characterized in that The gasket is in the shape of a multi-segment arc or a full arc with at least two segments of arc.

7. The system according to any one of claims 1 to 6, characterized in that: The system further comprises: A control unit, the control unit is connected to the driving circuit and the touch panel chip respectively; The control unit is used to output a first pulse width modulation signal, a second pulse width modulation signal and an input voltage v1 to the driving circuit; The driving circuit is used to drive discharge according to the first pulse width modulation signal, the second pulse width modulation signal and the input voltage v1.

8. The system according to claim 7, characterized in that The driving circuit includes a boost circuit, a discharge circuit and a feedback circuit respectively connected to the control unit, and the boost circuit is connected to the integrated sensor. The boost circuit is used to modulate the input voltage v1 input by the control unit to the boost circuit into a target input voltage of a specific waveform based on the first pulse width modulation signal input by the control unit, and output the target input voltage to the feedback circuit; The feedback circuit is used to lead the target input voltage back to the control unit as feedback of the input voltage v1, and output the target input voltage to the discharge circuit; The discharge circuit is used for performing driving discharge according to the target input voltage based on the second pulse width modulation signal input by the control unit.

9. The system according to claim 8, characterized in that The boost circuit is a flyback switch circuit, and the flyback switch circuit includes: a transformer L10, a diode D11 and a MOS tube Q10; The first end of the low voltage input side of the transformer L10 is connected to the reference voltage VIN_A, the second end of the low voltage input side of the transformer L10 is connected to the drain of the MOS tube Q10, the first end of the high voltage output side of the transformer L10 is connected to the anode of the diode D11, and the second end of the high voltage output side of the transformer L10 is grounded; The cathode of the diode D11 is respectively configured as the output end of the driving circuit, connected to the second electrode of the integrated sensor, and configured as the output end of the flyback switch circuit, connected to the input end of the feedback circuit.

10. The system according to claim 9, characterized in that The flyback switch circuit further includes a capacitor C12, a resistor R11, a capacitor C13, a capacitor C14, a capacitor C15, a diode D10, a capacitor C10 and a resistor R10; The first end of the capacitor C12 is connected to the first end of the resistor R11, and is connected to the reference voltage VIN_A after the connection. The second end of the capacitor C12 is grounded. The first end and the second end of the capacitor C13 are respectively connected to the first end and the second end of the resistor R11. The first end of the low voltage input side of the transformer L10 is connected to the first end of the capacitor C13. The second end of the low voltage input side of the transformer L10 is connected to the anode of the diode D10. The cathode of the diode D10 is connected to the second end of the capacitor C13. The anode of the diode D10 is connected to the drain of the MOS tube Q10. The source of the MOS tube Q10 is grounded. The gate of the MOS tube Q10 is configured to be connected to the control unit to receive the first pulse width modulation signal input by the control unit. After the first end of the capacitor C14 is connected to the cathode of the diode D11, it is constructed as the output end of the drive circuit and connected to the second electrode of the integrated sensor. After the first end of the capacitor C15 is connected to the first end of the capacitor C14, it is constructed as the output end of the flyback switch circuit and connected to the input end of the feedback circuit. The second end of the capacitor C15 and the second end of the capacitor C14 are grounded respectively.

11. The system according to claim 8, characterized in that The boost circuit is a combination circuit of a boost switch and a protection circuit and a Boost boost circuit. The boost switch and the protection circuit include a capacitor C11, a processing chip U10, a capacitor C16, a capacitor C9 and a resistor R19. The Boost boost circuit includes: an inductor L4, a diode D3 and a MOS tube Q6. Wherein, the capacitor C11 is connected to the voltage signal input terminal of the processing chip U10, and is connected to the reference voltage VIN_A after the connection, the first end of the capacitor C16 is configured to be connected to the DC enable signal DCDC_EN, the second end of the capacitor C16 is connected to the first end of the resistor R19, and is connected to the enable signal input terminal of the processing chip U10 after the connection, the first end of the capacitor C9 is connected to the signal output terminal of the processing chip U10, and is connected to the reference voltage VIN_A after the connection and is configured to be connected to the signal input terminal in the Boost boost circuit as the output terminal, and the second end of the resistor R19 and the second end of the capacitor C9 are grounded respectively; The first end of the inductor L4 is connected to the reference voltage VIN_A and is constructed as the signal input end of the Boost circuit. The second end of the inductor L4 is connected to the anode of the diode D3 and is connected to the drain of the MOS tube Q6 after the connection. The cathode of the diode D3 is constructed as the output end of the drive circuit, connected to the second electrode of the integrated sensor, and connected to the input end of the feedback circuit.

12. The system according to claim 11, characterized in that The Boost circuit also includes: capacitor C5, capacitor C6, capacitor C7, capacitor C8 and resistor R18; Among them, the first end of the capacitor C5 is connected to the first end of the inductor L4, and is connected to the reference voltage VIN_A and is constructed as the signal input end of the Boost boost circuit after the connection. The cathode of the diode D3 is connected to the first end of the capacitor C6, and is constructed as the output end of the drive circuit after the connection, and is connected to the second electrode of the integrated sensor. The first end of the capacitor C7 is connected to the first end of the capacitor C6, and is connected to the input end of the feedback circuit after the connection. The first end of the capacitor C8 is connected to the control unit to receive the first pulse width modulation signal input by the control unit. The second end of the capacitor C8 is connected to the first end of the resistor R18, and is connected to the gate of the MOS tube Q6 after the connection. The second end of the capacitor C5, the second end of the resistor R18, the source of the MOS tube Q6, the second end of the capacitor C6, and the second end of the capacitor C7 are grounded respectively.

13. An electronic device, characterized in that: include: A touch panel and a touch panel pressure measurement and touch vibration system as claimed in any one of claims 1 to 12.

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