Full-process simulation method and application of creep aging based on temperature non-uniformity and friction-expansion coupling

Abstract

The present invention discloses a full-process simulation method and application of creep aging based on temperature non-uniformity and friction-expansion coupling. The method includes simulating the thermal behavior in the autoclave to obtain the convective heat transfer coefficient and ambient temperature corresponding to each point of the component and the mold; mapping the convective heat transfer coefficient corresponding to each point to the component and the mold, setting the ambient temperature at each point as the process temperature and then performing thermal simulation to obtain the temperature field distribution; using the temperature field distribution as the initial condition, inputting the friction coefficient and the thermal expansion coefficient to perform creep aging simulation to obtain the creep aging forming result; using the component profile in the result as input to perform springback analysis to determine the component profile after springback. The scheme of the present invention uses simulation software to realize the creep aging simulation of the component under the condition of non-uniform temperature, and on this basis considers the coupling effect of creep, expansion and friction, and accurately describes the change of stress on the component during the creep aging process.

Description

Technical Field

[0001] The present invention relates to the technical field of creep aging simulation, and in particular to a creep aging full-process simulation method and application based on temperature non-uniformity and friction-expansion coupling. Background Art

[0002] Creep aging forming technology is widely used in the production of large thin-walled components. In the actual production process, large autoclaves are often used as the actual equipment to implement the process, and the entire creep aging process is carried out in the autoclave; this also makes the entire production process a "black box" and it is impossible to observe the entire production process in real time. Therefore, the finite element simulation method is used to simulate the entire process in advance, which can predict some problems such as buckling and fracture in advance and provide guidance for the determination of the actual production process.

[0003] Existing creep aging simulations are all based on a uniform temperature field, and do not consider the thermal expansion of components and molds. However, as the size of components continues to expand, the temperature non-uniformity of the components during the heating stage in the actual production process will become larger, and the temperature will have a drastic effect on the creep amount and aging precipitation behavior; at the same time, this temperature non-uniformity will produce large thermal stress, which will affect the stress distribution during the heating process and thus affect creep. As the size of components increases, the thermal expansion of components will also increase, and the expansion deformation of components will affect their fit with the mold surface. At the same time, the thermal expansion of components and molds is different, and there will be a relative movement trend between the two. At this time, the friction will affect the stress distribution, thereby affecting the creep results.

[0004] In the current commonly used commercial simulation finite element software, the temperature field can only be given a set temperature at the selected node through the method of predefined field. Therefore, it can only give the component a uniform temperature field or a limited gradient temperature field. The temperature field given by this method is not suitable for creep aging simulation of large structural parts. Therefore, in the existing creep aging simulation, although the friction coefficient is considered, thermal expansion is not considered, so it is impossible to simulate factors such as thermal expansion, thermal stress, and friction during the creep aging process. If the temperature field needs to be calculated, the temperature field calculation module in the existing simulation software cannot directly calculate the creep behavior of the material, and often requires the development of subroutines to calculate, which greatly increases the difficulty of creep simulation. In summary, it is difficult for existing simulation methods to accurately simulate the creep aging process of large thin-walled components. It is very important to develop an accurate, fast and simple simulation method. Summary of the invention

[0005] In order to solve the technical problem that the existing creep aging simulation method does not take factors such as thermal expansion into consideration and is difficult to accurately simulate the creep aging process of large thin-walled components, an embodiment of the present invention provides a full-process creep aging simulation method and application based on temperature non-uniformity and friction-expansion coupling.

[0006] The technical solution of the embodiment of the present invention is achieved as follows:

[0007] The embodiment of the present invention provides a full-process simulation method for creep aging based on temperature non-uniformity and friction-expansion coupling, the method comprising: using a first simulation software to simulate the thermal behavior of a large thin-walled component and a mold in an autoclave, and obtaining the convective heat transfer coefficients corresponding to each point of the large thin-walled component and the mold, as well as the ambient temperature at each point of the large thin-walled component and the mold; using an analytical field in a second simulation software to map the convective heat transfer coefficients corresponding to each point of the large thin-walled component and the mold to the large thin-walled component and the mold, and setting the ambient temperature at each point of the large thin-walled component and the mold as the process temperature to perform thermal simulation, and obtain the temperature field distribution of the large thin-walled component and the mold at different times; using the temperature field distribution as an initial condition in the second simulation software, and inputting the friction coefficient and the thermal expansion coefficient at the same time to perform creep aging simulation, and obtain a creep aging forming result; using the component profile in the creep aging forming result as an input, performing a springback analysis, and determining the component profile after springback.

[0008] In one embodiment, the thermal behavior of the large thin-walled component and the mold in the autoclave is simulated using the first simulation software to obtain the convective heat transfer coefficients corresponding to the large thin-walled component and each point of the mold, including: obtaining the temperature curve in the creep aging process curve; simulating the thermal flow field after hot air is introduced into the autoclave using the first simulation software according to the temperature curve to obtain the convective heat transfer coefficients corresponding to the large thin-walled component and each point of the mold in the autoclave.

[0009] In one embodiment, the heat flow field after hot air is introduced into the autoclave is simulated using the first simulation software according to the temperature curve to obtain the convective heat transfer coefficients corresponding to the large thin-walled component and each point of the mold in the autoclave, including: determining the hot air input end and the hot air output end of the autoclave in the first simulation software; setting a hot air input of a preset speed at the hot air input end and a pressure of 0 MPa at the hot air output end; simulating the temperature in the autoclave according to the temperature curve to obtain the convective heat transfer coefficients corresponding to the large thin-walled component and each point of the mold in the autoclave.

[0010] In one embodiment, in the second simulation software, the convective heat transfer coefficients corresponding to each point of the large thin-walled component and the mold are mapped to the large thin-walled component and the mold using an analytical field, and the ambient temperature at each point of the large thin-walled component and the mold is set as the process temperature before thermal simulation is performed. The method also includes: meshing the large thin-walled component and the mold, dividing the large thin-walled component and the mold into multiple finite element meshes; establishing a mechanical finite element model based on the geometric model after meshing, setting mechanical material parameters and load boundaries for the mechanical finite element model, and performing mechanical analysis to determine the deformed component and mold; the mechanical material parameters include elastic modulus, Poisson's ratio, and yield strength; the load boundary is the pressure curve in the creep aging process curve; the deformed component and mold are input into the second simulation software; and the input geometric model is used as the initial model for thermal simulation.

[0011] In one embodiment, the convective heat transfer coefficients corresponding to each point of the large thin-walled component and the mold are mapped to the large thin-walled component and the mold using an analytical field in a second simulation software, and the ambient temperature at each point of the large thin-walled component and the mold is set as the process temperature before performing a thermal simulation to obtain the temperature field distribution of the large thin-walled component and the mold at different times, including: setting the thermal material parameters of the initial model in the second simulation software; the thermal material parameters include specific heat capacity, thermal expansion coefficient, thermal conductivity and density; using an analytical field to map the convective heat transfer coefficients corresponding to each point of the large thin-walled component and the mold to the large thin-walled component and the mold, and the ambient temperature at each point of the large thin-walled component and the mold is set as the process temperature before performing a thermal simulation to obtain the temperature field distribution of the large thin-walled component and the mold at different times.

[0012] In one embodiment, the temperature field distribution is used as an initial condition in a second simulation software, and a creep aging simulation is performed after the friction coefficient and the thermal expansion coefficient are inputted at the same time to obtain a creep aging forming result, including: in the second simulation software, the undeformed component and the mold are used as the initial model, the temperature field distribution is used as the thermal boundary condition, the pressure curve in the creep aging process curve is used as the load boundary condition, the elastic modulus, Poisson's ratio, yield strength, thermal expansion coefficient and friction coefficient are set, and the creep subroutine in the second simulation software is called to perform creep aging simulation to obtain a creep aging forming result.

[0013] In one embodiment, the component profile in the creep aging forming result is used as input to perform a springback analysis to determine the component profile after springback, including: establishing a springback model, importing the component profile in the creep aging forming result as an initial model, and after deleting thermal boundary conditions and load boundary conditions, performing a springback analysis to determine the component profile after springback.

[0014] The embodiment of the present invention also provides an application of the above-mentioned creep aging full-process simulation method based on temperature non-uniformity and friction-expansion coupling in the fields of aerospace, national defense and automobile.

[0015] This embodiment has the following beneficial effects:

[0016] This embodiment establishes a full-process simulation of the creep aging process by considering the mold, the surface and the size of the component, and couples the non-uniform temperature field, thermal expansion, thermal stress and friction stress into the simulation, and obtains the change of the internal stress of the component during the heating process, thereby improving the accuracy of the creep aging simulation and providing a basis for mold design and process optimization. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic flow chart of a full-process simulation method of creep aging based on temperature non-uniformity and friction-expansion coupling according to an embodiment of the present invention;

[0018] Figure 2 A schematic diagram of a creep aging process curve according to an embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the geometric model structure of the autoclave according to an embodiment of the present invention;

[0020] Figure 4 A schematic diagram of mesh division of a model according to an embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of mechanical analysis results of an embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of thermal simulation analysis results of an embodiment of the present invention;

[0023] Figure 7 This is a schematic diagram of the creep aging forming results of a component according to an embodiment of the present invention;

[0024] Figure 8 This is a schematic diagram of the springback result of a component in an embodiment of the present invention;

[0025] Fig. 9 Schematic diagram of stress changes of components in an embodiment of the present invention; wherein, Fig. 9 (a) is a schematic diagram of node locations; Fig. 9(b) is a schematic diagram of the node stress change curve;

[0026] Fig.10 1 is a diagram showing the internal structure of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0027] The present invention will be described in further detail below with reference to the accompanying drawings and embodiments.

[0028] The embodiment of the present invention provides a full-process simulation method for creep aging based on temperature non-uniformity and friction-expansion coupling, such as Figure 1 As shown, the method includes:

[0029] Step 101: using a first simulation software to simulate the thermal behavior of the large thin-walled component and the mold in the autoclave, and obtaining the convection heat transfer coefficients corresponding to each point of the large thin-walled component and the mold, and the ambient temperature at each point of the large thin-walled component and the mold;

[0030] Step 102: using analytical fields in a second simulation software to map the convection heat transfer coefficients corresponding to each point of the large thin-walled component and the mold to the large thin-walled component and the mold, and setting the ambient temperature at each point of the large thin-walled component and the mold as the process temperature to perform thermal simulation, and obtain the temperature field distribution of the large thin-walled component and the mold at different times;

[0031] Step 103: in a second simulation software, the temperature field distribution is used as an initial condition, and a friction coefficient and a thermal expansion coefficient are inputted to perform creep aging simulation, so as to obtain a creep aging forming result;

[0032] Step 104: using the component profile in the creep aging forming result as input, performing a springback analysis to determine the component profile after springback.

[0033] This embodiment proposes a full-process simulation method for creep aging process that takes temperature non-uniformity into consideration and couples friction-expansion. The entire simulation process can be completed using basic modules of commercial simulation software such as Fluent and Abaqus.

[0034] Because the creep aging forming of large components is carried out in an autoclave, the air temperature in the autoclave is raised by hot air, and the components and molds obtain heat through convection heat exchange with the air and generate a certain temperature. The air temperature in the autoclave is not equal everywhere, so the convection heat transfer coefficient and ambient temperature at different positions on the components and molds are inconsistent. In order to accurately calculate the temperature, it is first necessary to obtain the convection heat transfer coefficient and ambient temperature at different positions on the components and molds. Fluent is more reliable in computational thermal fluid dynamics. Therefore, considering the autoclave, Fluent is used to perform thermal flow field analysis on the hot air, molds and structural parts in the autoclave to obtain the convection heat transfer coefficient and ambient temperature on the loaded mold and components.

[0035] Specifically, in one embodiment, the thermal behavior of the large thin-walled component and the mold in the autoclave is simulated using the first simulation software to obtain the convective heat transfer coefficients corresponding to the large thin-walled component and each point of the mold, including: obtaining the temperature curve in the creep aging process curve; simulating the thermal flow field after hot air is introduced into the autoclave using the first simulation software according to the temperature curve, to obtain the convective heat transfer coefficients corresponding to the large thin-walled component and each point of the mold in the autoclave.

[0036] Here, according to the temperature curve, the first simulation software is used to simulate the thermal flow field after hot air is introduced into the autoclave, and the convective heat transfer coefficients corresponding to the large thin-walled component in the autoclave and each point of the mold are obtained, including: determining the hot air input end and the hot air output end of the autoclave in the first simulation software; setting a hot air input with a preset speed at the hot air input end, and setting a pressure of 0 MPa at the hot air output end; simulating the temperature in the tank with the temperature curve, and obtaining the convective heat transfer coefficients corresponding to the large thin-walled component in the autoclave and each point of the mold.

[0037] When using Fluent to perform thermal flow field analysis, the temperature field distribution of components and molds can be obtained. However, during the creep aging process, the thermal expansion of the materials of the components and molds is large, and the changes in the shape of the materials and the appearance of thermal stress will affect the distribution of the temperature field on the materials. Therefore, in order to obtain accurate temperature field results, it is necessary to calculate the temperature field while considering thermal expansion. And because the actual creep aging process is to load at room temperature first, and then enter the autoclave for further heating and loading. In this process, the components are heated after deformation. Therefore, this embodiment first establishes a mechanical finite element model to obtain the deformation of the components in the first half of the process, and then obtains the temperature field distribution on this basis.

[0038] Specifically, in one embodiment, this embodiment first meshes the large thin-walled component and the mold, and divides the large thin-walled component and the mold into multiple finite element meshes; a mechanical finite element model is established based on the geometric model after meshing, and mechanical material parameters and load boundaries are set for the mechanical finite element model to perform mechanical analysis to determine the deformed component and mold; the mechanical material parameters include elastic modulus, Poisson's ratio, and yield strength; the load boundary is the pressure curve in the creep aging process curve; the deformed component and mold are input into the second simulation software; and the input geometric model is used as the initial model for thermal simulation.

[0039] Then, the thermal material parameters of the initial model are set in the second simulation software; the thermal material parameters include specific heat capacity, thermal expansion coefficient, thermal conductivity and density; the convective heat transfer coefficients corresponding to each point of the large thin-walled component and the mold are mapped to the large thin-walled component and the mold using an analytical field, and the ambient temperature at each point of the large thin-walled component and the mold is set as the process temperature before performing a thermal simulation to obtain the temperature field distribution of the large thin-walled component and the mold at different times.

[0040] This embodiment uses Fluent to obtain the convective heat transfer coefficient and ambient temperature of different nodes, and maps them to the analytical field in abaqus. The thermal expansion is considered by setting the thermal expansion coefficient in the material coefficient, and the thermal expansion amount, thermal stress and its accurate temperature distribution at different times on the component and mold during the temperature history of creep aging are obtained.

[0041] The mold material is often Invar steel, and the thermal expansion deformation of the mold is almost negligible. Therefore, the unexpanded mold and the temperature field results of the entire process are input into the creep aging simulation as initial conditions, so that the accurate temperature field in the creep-aging process can be mapped into the creep aging simulation. At the same time, the thermal expansion coefficient is added to the material parameters to couple the thermal expansion into the creep aging simulation, and the friction coefficient relationship with temperature change is set on the contact surface to couple the friction into the creep aging simulation. In this way, the friction-expansion coupled creep aging simulation of the non-uniform temperature field can be realized.

[0042] Specifically, in one embodiment, the temperature field distribution is used as an initial condition in the second simulation software, and a creep aging simulation is performed after the friction coefficient and the thermal expansion coefficient are inputted at the same time to obtain a creep aging forming result, including: in the second simulation software, the undeformed component and the mold are used as the initial model, the temperature field distribution is used as the thermal boundary condition, the pressure curve in the creep aging process curve is used as the load boundary condition, the elastic modulus, Poisson's ratio, yield strength, thermal expansion coefficient and friction coefficient are set, and the creep subroutine in the second simulation software is called to perform creep aging simulation to obtain a creep aging forming result.

[0043] Correspondingly, in one embodiment, the component profile in the creep aging forming result is used as input to perform a springback analysis to determine the component profile after springback, including: establishing a springback model, importing the component profile in the creep aging forming result as an initial model, and after deleting thermal boundary conditions and load boundary conditions, performing a springback analysis to determine the component profile after springback.

[0044] In this embodiment, the creep amount is simulated and calculated by applying the load required by the process using the developed creep subroutine to obtain the profile, creep amount, stress distribution state and other parameters of the component after creep aging. The profile after creep aging simulation is used as input and a springback analysis is performed. Finally, the profile of the component after the creep aging process is obtained.

[0045] This embodiment establishes a full-process simulation of the creep aging process by considering the mold, the surface and the size of the component, and couples the non-uniform temperature field, thermal expansion, thermal stress and friction stress into the simulation, and obtains the change of the internal stress of the component during the heating process, thereby improving the accuracy of the creep aging simulation and providing a basis for mold design and process optimization.

[0046] The present solution will be described in detail below in conjunction with a specific embodiment.

[0047] This embodiment is described by taking the creep simulation of a 4m structural member as an example.

[0048] See also Figure 2 , first determine the creep aging process curve, such as Figure 2 shown.

[0049] Taking this process as the simulation process of creep aging, we first use fluent to simulate the situation of molds and components being heated by hot air in the autoclave, such as Figure 3 As shown. Establish a boundary condition similar to that of an autoclave, place the mold and components in it; set the input end (Inlet) and output end (Outlet), set the hot air input of 10m / s at the input end, and set the pressure of 0MPa at the output end; the temperature inside the tank is based on the temperature curve in the process curve. Use Fluent simulation to calculate the convection heat transfer coefficient and ambient temperature of each node on the component and mold.

[0050] Import the mold and structural parts into the finite element model and assemble them; select the appropriate finite element meshing method to convert the geometric shape of the part to be analyzed into a finite element mesh, such as Figure 4 shown.

[0051] Because the structural parts in this example are thin and large in length and width, shell elements are used for unit division.

[0052] The actual creep aging process is to first load at room temperature, and then enter the autoclave for further heating and loading. Therefore, a mechanical finite element model is first established. The material parameters include elastic modulus, Poisson's ratio, and yield strength. The setting of the load boundary conditions is the same as the process diagram. Mechanical analysis is performed. The results are as follows: Figure 5 shown.

[0053] Because the temperature of the component is increased after deformation, the deformed component and mold calculated by the previous mechanical model are extracted and imported into the thermal analysis model as the initial model. The material parameters such as specific heat capacity, thermal expansion coefficient, thermal conductivity, density, etc. are set. The convection heat transfer coefficient and ambient temperature are calculated by Fluent and imported as analytical field conditions to be applied to the thermal boundary conditions. Thermal simulation analysis is then performed to obtain the precise temperature distribution of the structural parts and molds in the tank. Figure 6 shown.

[0054] The temperature field calculated in the above process includes the temperature of each node on the mold and structure during the entire creep aging time history. Therefore, a creep aging finite element model is established, and the mold and structural parts in the initial state are imported as the model; the temperature field calculated previously is used as a predefined field input into the model as a thermal boundary condition; the pressure value in the creep aging process curve is used as the load boundary condition; the elastic modulus, Poisson's ratio, yield strength, thermal expansion coefficient, friction coefficient and other material parameters are set; and the creep calculation is performed by calling the creep subroutine. Finally, a creep aging model that takes into account temperature non-uniformity and expansion-friction coupling is obtained. The results after the component creep are as follows Figure 7 shown.

[0055] The springback model is established, and the components obtained in the last step of the creep aging model calculation are imported as the initial model. All its boundary conditions are deleted and the springback calculation is performed. Finally, the structural shape after the process is obtained, such as Figure 8 shown.

[0056] By extracting the stress changes of several nodes on the component, such as Fig. 9 As shown in the figure, it can be found that under the coupling of creep, expansion and friction, the stress on the node will first decrease and then continue to increase as the temperature increases. This is consistent with the results detected by the experiment, but inconsistent with the previous stress situation that only considered uniform temperature creep.

[0057] This embodiment provides a method for full-process creep aging coupling, which uses existing commercial simulation software to realize the creep aging simulation of components under the condition of uneven temperature. On this basis, the coupling effect of creep, expansion and friction is considered, and the change of stress on the component during the creep aging process is accurately described.

[0058] The embodiment of the present invention also provides an application of the above-mentioned creep aging full-process simulation method based on temperature non-uniformity and friction-expansion coupling in the fields of aerospace, national defense and automobile.

[0059] In order to implement the method of the embodiment of the present invention, the embodiment of the present invention also provides a computer program product, which includes computer instructions, and the computer instructions are stored in a computer-readable storage medium. The processor of the computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device performs the steps of the above method.

[0060] Based on the hardware implementation of the above program modules, and in order to implement the method of the embodiment of the present invention, the embodiment of the present invention further provides an electronic device (computer device). Specifically, in one embodiment, the computer device may be a terminal, and its internal structure diagram may be as follows: Fig.10 As shown. The computer device includes a processor A01, a network interface A02, a display screen A04, an input device A05 and a memory (not shown in the figure) connected through a system bus. Among them, the processor A01 of the computer device is used to provide computing and control capabilities. The memory of the computer device includes an internal memory A03 and a non-volatile storage medium A06. The non-volatile storage medium A06 stores an operating system B01 and a computer program B02. The internal memory A03 provides an environment for the operation of the operating system B01 and the computer program B02 in the non-volatile storage medium A06. The network interface A02 of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor A01, the method of any one of the above embodiments is implemented. The display screen A04 of the computer device can be a liquid crystal display screen or an electronic ink display screen, and the input device A05 of the computer device can be a touch layer covered on the display screen, or a key, trackball or touchpad set on the computer device housing, or an external keyboard, touchpad or mouse, etc.

[0061] Those skilled in the art will understand that Fig.10 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0062] The device provided by the embodiment of the present invention includes a processor, a memory, and a program stored in the memory and executable on the processor. When the processor executes the program, the method of any one of the above embodiments is implemented.

[0063] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0064] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0065] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0066] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0067] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0068] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0069] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0070] It can be understood that the memory of the embodiment of the present invention can be a volatile memory or a non-volatile memory, and can also include both volatile and non-volatile memories. Among them, the non-volatile memory can be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), a magnetic random access memory (FRAM), a flash memory, a magnetic surface memory, an optical disc, or a compact disc read-only memory (CD-ROM); the magnetic surface memory can be a disk memory or a tape memory. The volatile memory can be a random access memory (RAM), which is used as an external cache. By way of example and not limitation, many forms of RAM are available, such as static random access memory (SRAM), synchronous static random access memory (SSRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDRSDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM, SyncLink Dynamic Random Access Memory), and direct RAMbus random access memory (DRRAM, Direct Rambus Random Access Memory).The memories described in the embodiments of the present invention are intended to include, but are not limited to, these and any other suitable types of memories.

[0071] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0072] The above are only embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included within the scope of the claims of the present application.

Claims

1. A full-process simulation method for creep aging based on temperature non-uniformity and friction-expansion coupling, characterized in that: The method comprises: Using the first simulation software to simulate the thermal behavior of the large thin-walled component and the mold in the autoclave, and obtain the convection heat transfer coefficients corresponding to each point of the large thin-walled component and the mold, and the ambient temperature at each point of the large thin-walled component and the mold; In the second simulation software, the convective heat transfer coefficients corresponding to each point of the large thin-walled component and the mold are mapped to the large thin-walled component and the mold by using an analytical field, and the ambient temperature at each point of the large thin-walled component and the mold is set as the process temperature to perform a thermal simulation to obtain the temperature field distribution of the large thin-walled component and the mold at different times; In the second simulation software, the temperature field distribution is used as an initial condition, and the friction coefficient and the thermal expansion coefficient are inputted at the same time to perform creep aging simulation to obtain a creep aging forming result; Taking the component profile in the creep aging forming result as input, performing a springback analysis to determine the component profile after springback; Wherein, before performing thermal simulation by using analytical fields to map the convection heat transfer coefficients corresponding to each point of the large thin-walled component and the mold to the large thin-walled component and the mold, and setting the ambient temperature at each point of the large thin-walled component and the mold as the process temperature, the method further comprises: Meshing the large thin-walled component and the mold, dividing the large thin-walled component and the mold into a plurality of finite element meshes; A mechanical finite element model is established based on the geometric model after meshing, and mechanical analysis is performed on the mechanical finite element model after mechanical material parameters and load boundaries are set to determine the deformed components and molds; the mechanical material parameters include elastic modulus, Poisson's ratio, and yield strength; the load boundary is the pressure curve in the creep aging process curve; The deformed component and the mold are input into the second simulation software; the input geometric model is used as the initial model of the thermal simulation.

2. The full-process simulation method for creep aging based on temperature non-uniformity and friction-expansion coupling according to claim 1 is characterized in that: The thermal behavior of the large thin-walled component and the mold in the autoclave is simulated by using the first simulation software to obtain the convection heat transfer coefficients corresponding to each point of the large thin-walled component and the mold, including: Obtain the temperature curve in the creep aging process curve; The thermal flow field after hot air is introduced into the autoclave is simulated using the first simulation software according to the temperature curve to obtain the convection heat transfer coefficients corresponding to the large thin-walled component in the autoclave and each point of the mold.

3. The full-process simulation method for creep aging based on temperature non-uniformity and friction-expansion coupling according to claim 2 is characterized in that: According to the temperature curve, the heat flow field after hot air is introduced into the autoclave is simulated using the first simulation software to obtain the convection heat transfer coefficients corresponding to the large thin-walled component in the autoclave and each point of the mold, including: Determine the hot air input end and the hot air output end of the autoclave in the first simulation software; A hot air input at a preset speed is set at the hot air input end, and a pressure of 0 MPa is set at the hot air output end; the temperature inside the tank is simulated using the temperature curve to obtain the convection heat transfer coefficients corresponding to the large thin-walled component in the autoclave and each point of the mold.

4. The full-process simulation method for creep aging based on temperature non-uniformity and friction-expansion coupling according to claim 1 is characterized in that: In the second simulation software, the convective heat transfer coefficients corresponding to each point of the large thin-walled component and the mold are mapped to the large thin-walled component and the mold by using an analytical field, and the ambient temperature at each point of the large thin-walled component and the mold is set as the process temperature to perform a thermal simulation, and the temperature field distribution of the large thin-walled component and the mold at different times is obtained, including: Setting thermal material parameters of the initial model in the second simulation software; the thermal material parameters include specific heat capacity, thermal expansion coefficient, thermal conductivity and density; The convective heat transfer coefficients corresponding to each point of the large thin-walled component and the mold are mapped to the large thin-walled component and the mold using an analytical field, and the ambient temperature at each point of the large thin-walled component and the mold is set as the process temperature before performing a thermal simulation to obtain the temperature field distribution of the large thin-walled component and the mold at different times.

5. The full-process simulation method for creep aging based on temperature non-uniformity and friction-expansion coupling according to claim 4 is characterized in that: In the second simulation software, the temperature field distribution is used as the initial condition, and the friction coefficient and the thermal expansion coefficient are inputted at the same time to perform creep aging simulation to obtain creep aging forming results, including: In the second simulation software, the undeformed component and mold are used as the initial model, the temperature field distribution is used as the thermal boundary condition, the pressure curve in the creep aging process curve is used as the load boundary condition, the elastic modulus, Poisson's ratio, yield strength, thermal expansion coefficient and friction coefficient are set, and the creep subroutine in the second simulation software is called to perform creep aging simulation to obtain the creep aging forming result.

6. The full-process simulation method for creep aging based on temperature non-uniformity and friction-expansion coupling according to claim 5 is characterized in that: The component profile in the creep aging forming result is used as input to perform a springback analysis to determine the component profile after springback, including: A springback model is established, the component profile in the creep aging forming result is imported as an initial model, and after deleting the thermal boundary conditions and the load boundary conditions, a springback analysis is performed to determine the component profile after springback.

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