Efficient batch BGA device ball mounting device and method

Abstract

The invention discloses an efficient batched BGA device ball mounting device and method. The device comprises an air pipe, a base and a suction nozzle head. The bottom of the air pipe is connected with the upper surface of the base; the base is connected with the suction nozzle head through a screw, and the base is in threaded connection with the suction nozzle head. All solder balls can be taken and placed at a time, so that the purpose of batch ball mounting is achieved, the process is simple, operation is easy, efficiency is high, and batch operation is facilitated.

Description

Technical Field

[0001] The present invention belongs to the technical field of integrated circuits, and in particular relates to an efficient batch BGA device ball planting device and method. Background Art

[0002] BGA (ball grid array) packaging technology is an advanced high-performance packaging technology developed after the 1990s.

[0003] BGA is a packaging technology used for multi-pin devices and circuits. Its external leads are solder balls or bumps, which are arranged in an array on the bottom plane of the package substrate. Large-scale integrated circuit (LSI) chips are assembled on the substrate. It is a surface mount package type for LSI chips. It requires no maintenance and avoids the process problems that occur in packages with leads on all four sides. It features large pitch (typical pitch is 1.27mm), good lead hardness, and high self-alignment properties.

[0004] These characteristics are based on the use of special pins—solder balls. The process of connecting the solder balls to the substrate is called ball placement. As a key process technology in BGA packaging, it directly affects device performance and reliability. Conventional ball placement operations involve many steps and have low mass production efficiency. Summary of the Invention

[0005] In order to solve the above problems, the present invention proposes an efficient batch BGA device ball planting device, including an air pipe, a base, and a suction nozzle head; the bottom of the air pipe is connected to the upper surface of the base; the base and the suction nozzle head are connected by screws, and the base and the suction nozzle head are screwed together.

[0006] Furthermore, the base is provided with a plurality of recessed grooves, and the nozzle head is provided with a plurality of threaded holes corresponding to the recessed grooves. The screws pass through the recessed grooves and are inserted into the corresponding threaded holes to achieve screw connection between the base and the nozzle head.

[0007] Furthermore, the nozzle head is provided with several first cavities penetrating the upper and lower surfaces of the nozzle head, the first cavity is composed of a ball groove and an air channel, the cross-section of the ball groove on the lower surface of the nozzle head is circular, and the diameter of the cross-section of the ball groove on the lower surface of the nozzle head is larger than the diameter of the tin ball.

[0008] Furthermore, the ball groove is cylindrical or hemispherical.

[0009] Furthermore, the cross section where the air channel meets the ball groove is circular, and the diameter of the cross section where the air channel meets the ball groove is smaller than the diameter of the solder ball.

[0010] Furthermore, the gap between the base and the nozzle head is a sealing groove, and the sealing groove seals the gap between the base and the nozzle head except the first cavity.

[0011] An efficient batch BGA device ball planting method is also provided. The method is implemented based on the above-mentioned ball planting device and includes the following steps:

[0012] (1) Prepare the devices to be implanted;

[0013] (2) Apply solder to the device to be balled;

[0014] (3) Use ball planting device to absorb solder balls;

[0015] (4) Check whether the ball is missing. If so, repeat step (3) until the ball is no longer missing.

[0016] (5) Gently press the ball-planting device filled with solder balls onto the device with pre-solder so that the solder balls correspond to the pads;

[0017] (6) Release the vacuum switch of the ball planting device to allow the solder ball to fall onto the pad;

[0018] (7) After the ball planting device is removed, all solder balls fall neatly on the pads;

[0019] (8) Reflow soldering to complete the ball planting work.

[0020] Furthermore, the vacuum switch of the ball planting device is released while blowing air in the reverse direction.

[0021] Compared with the prior art, the present invention has the following advantages:

[0022] (1) A new reliable, fast, efficient and low-cost BGA device ball planting method has been realized.

[0023] (2) Suitable for various shapes of ball-mounted devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of the vacuum nozzle according to an embodiment of the present invention.

[0025] Figure 2 This is a partial structural diagram of a suction nozzle according to an embodiment of the present invention.

[0026] Figure 3 This is one of the overall structural diagrams of the suction nozzle according to an embodiment of the present invention.

[0027] Figure 4 This is the second overall structural diagram of the suction nozzle according to an embodiment of the present invention.

[0028] Figure 5 This is a schematic diagram of using a suction nozzle to suck a ball according to an embodiment of the present invention.

[0029] Figure 6 Schematic diagram of a suction nozzle full of balls according to an embodiment of the present invention.

[0030] Figure 7 FIG. 4 is a flow chart of a ball implantation method according to an embodiment of the present invention.

[0031] The following are marked in the figure:

[0032] Air pipe 1, base 2, sink 21, nozzle head 3, threaded hole 31, ball groove 32, air channel 33, sealing groove 4, solder ball 5. DETAILED DESCRIPTION

[0033] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0035] It will be understood that the terms "first," "second," etc. used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element.

[0036] Spatially relative terms such as "under," "beneath," "beneath," "under," "above," "above," etc., may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the drawings is turned over, the element or feature described as "under" or "beneath" or "beneath" the other elements will be oriented as "above" the other elements or features. Thus, the exemplary terms "under" and "under" can include both upper and lower orientations. In addition, the device can also include alternative orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0037] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intervening element. In addition, the "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc., if there is transmission of electrical signals or data between the connected objects.

[0038] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include," "comprising," "having," and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Furthermore, the term "and / or" as used in this specification includes any and all combinations of the relevant listed items.

[0039] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0040] This embodiment provides an efficient batch BGA device ball planting device, such as Figure 1-Figure 4 As shown, it includes: an air pipe 1, a base 2, a nozzle head 3 and a vacuum switch; the vacuum switch is used to control the inflow and outflow of air from the air pipe 1 to the nozzle head 3; the bottom of the air pipe 1 is connected to the upper surface of the base 2; the base 1 and the nozzle head 3 are connected by screws, and a plurality of grooves 21 are provided on the base 2, and a plurality of threaded holes 31 corresponding to the grooves 21 are provided on the nozzle head 3. The screws pass through the grooves 21 and are inserted into the corresponding threaded holes 31 to realize the screw connection between the base 2 and the nozzle head 3.

[0041] The nozzle tip 3 is provided with several first cavities extending through its upper and lower surfaces. These first cavities consist of a ball groove 32 and an air passage 33. The cross-section of the ball groove 32 on the lower surface of the nozzle tip 3 is circular, with a diameter slightly larger than the diameter of the solder ball 5. In actual use, the ball groove 32 is cylindrical or hemispherical. The cross-section where the air passage 33 meets the ball groove is circular, with a diameter smaller than the diameter of the solder ball 5. The gap between the base 2 and the nozzle tip 3 is a sealing groove 4, which seals the gap between the base 2 and the nozzle tip 3 except for the first cavity.

[0042] This embodiment also provides a method for implementing BGA device ball planting using the ball planting device, such as Figure 7 As shown, the following steps are included:

[0043] (1) Make a special vacuum nozzle head 3 that matches the device to be implanted. See the sample Figure 1 , local structure see Figure 2 、 Figure 3 、 Figure 4 (The finished product after assembly is Figure 1 ), Figure 3 The nozzle head 3 can be customized according to the specific device; prepare the device to be implanted;

[0044] (2) Apply solder to the device to be balled;

[0045] (3) Use the ball planting device to absorb the solder ball 5 (in order to improve the success rate of solder ball absorption, the container holding the solder ball can be assisted by vibration), such as Figure 5 As shown;

[0046] (4) After the suction, manual or visual inspection can be performed to check whether the ball is missing. If missing, repeat step (3);

[0047] (5) Place the nozzle filled with solder balls (such as Figure 6 As shown in the figure, lightly press the solder ball onto the pre-soldered component and visually identify the solder ball and the solder pad.

[0048] (6) Release the vacuum switch of the ball planting device (add reverse air blowing if necessary) to allow the solder ball 5 to fall onto the pad;

[0049] (7) After the nozzle is removed, all solder balls 5 fall neatly on the pads;

[0050] (8) Reflow soldering to complete the ball planting work.

[0051] Note: To further improve ball planting efficiency, the components can be printed in a patchwork format, and the nozzles can also be printed in a patchwork format to plant multiple balls at a time.

[0052] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An efficient batch BGA device ball implantation device, characterized in that: The invention comprises an air pipe (1), a base (2) and a suction nozzle (3); the bottom of the air pipe (1) is connected to the upper surface of the base (2); the base (1) and the suction nozzle (3) are connected by screws, and the base (2) and the suction nozzle (3) are screwed.

2. The efficient batch BGA device ball implantation device according to claim 1, characterized in that: The base (2) is provided with a plurality of recessed grooves (21), the nozzle head (3) is provided with a plurality of threaded holes (31) corresponding to the recessed grooves (21), and screws are inserted through the recessed grooves (21) into the corresponding threaded holes (31) to achieve screw connection between the base (2) and the nozzle head (3).

3. The efficient batch BGA device ball implantation device according to claim 1, characterized in that: The nozzle head (3) is provided with a plurality of first cavities penetrating the upper and lower surfaces of the nozzle head (3), wherein the first cavities are composed of ball grooves (32) and air passages (33), the cross section of the ball grooves (32) on the lower surface of the nozzle head (3) is circular, and the diameter of the cross section of the ball grooves (32) on the lower surface of the nozzle head (3) is greater than the diameter of the solder ball (5).

4. The efficient batch BGA device ball implantation device according to claim 3, characterized in that: The ball groove (32) is cylindrical or hemispherical.

5. The efficient batch BGA device ball implantation device according to claim 3, characterized in that: The cross section where the air channel (33) and the ball groove (32) meet is circular, and the diameter of the cross section where the air channel (33) and the ball groove (32) meet is smaller than the diameter of the solder ball (5).

6. The efficient batch BGA device ball implantation device according to claim 1, characterized in that: The gap between the base (2) and the nozzle head (3) is a sealing groove (4), and the sealing groove (4) seals the gap between the base (2) and the nozzle head (3) except the first cavity.

7. An efficient batch BGA device ball planting method, characterized in that: The method is implemented based on the ball implantation device according to any one of claims 1 to 6, and comprises the following steps: (1) Prepare the devices to be implanted; (2) Apply solder to the device to be bumped; (3) Using a ball implantation device to absorb the solder ball (5); (4) Check whether the ball is missing. If so, repeat step (3) until the ball is no longer missing; (5) Gently press the ball implanting device filled with solder balls (5) onto the device pre-filled with solder so that the solder balls correspond to the solder pads; (6) Release the vacuum switch of the ball implantation device to allow the solder ball (5) to fall onto the solder pad; (7) After the ball placement device is removed, all solder balls (5) fall neatly on the pads; (8) Reflow soldering to complete the ball planting work.

8. The efficient batch BGA device ball planting method according to claim 7, characterized in that: Release the vacuum switch of the ball implanter and blow air in the reverse direction at the same time.

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