A packaging device for MOS chip processing and its use method

Abstract

The invention relates to the technical field of chip processing and packaging, and discloses a packaging device for MOS chip processing and a method of using the device, which comprises a bottom support table, a packaging table fixedly connected to the top of the bottom support table, and an electric push rod fixedly connected to the top of the bottom support table; an outer filter screen on the surface of a protective ring frame is used to reduce the contact between dust particles in the external environment and the MOS chip during the preheating process, and dust accumulation generated when filtering on the surface of the outer filter screen is cleaned; at the same time, hot air is blown toward the surface of the packaging table along the inner side of an inner connecting tube by a rotating transmission fan, so as to facilitate preheating of the MOS chip on the surface of the packaging table and improve the adhesion between the MOS chip and the packaging material; and during cooling after solidification, after the heater body is turned off, the wind temperature generated by the rotating transmission fan is relatively low, and in conjunction with the continuously rotating bottom connecting frame, the cooling efficiency of the MOS chip after packaging and solidification on the surface of the packaging table is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip processing and packaging, and in particular relates to packaging equipment for MOS chip processing and a method of using the same. Background Art

[0002] MOS chip, whose full English name is MOSFET, namely metal-oxide semiconductor field effect transistor, is a semiconductor device that uses the electric field effect of the control input loop to control the output loop current. Packaging is the last step in MOS chip manufacturing and is also a key step in converting the chip into a usable device. The main function of the packaging equipment is to provide a protective shell for the MOS chip. This shell can support the chip, prevent it from physical damage, and also play a role in cooling and electrical connection.

[0003] In the prior art, the patent document "CN118558542B" discloses "a chip packaging device"; it includes a base and a table top, the table top slides up and down on the upper side of the base, a limit mechanism is provided between the table top and the base to limit the separation of the table top and the base, and a vibration motor is fixedly connected to the lower end surface of the table top; in this scheme, the base and the chip surface are baked before the chip and the substrate are injected with glue for packaging, so as to facilitate drying of water stains on the surface of the substrate and the chip, which is beneficial to avoid encapsulating water stains in the colloid, which is beneficial to avoid retaining bubbles in the colloid, and while drying the water stains, it is also convenient to preheat the substrate and the chip, so as to facilitate improving the fluidity of the filling glue during the injection process, and thus facilitate filling the filling glue into the gap under the pin, and after drying the water stains, the dust and impurities after the drying of the water stains are cleaned by large-scale vibration and blowing, which is further beneficial to avoid encapsulating bubbles in the colloid.

[0004] The above-mentioned "a chip packaging device" still has some disadvantages. For example, during the packaging process of the existing MOS chip, the shell filled with the packaging material needs to be heated and cured to solidify the packaging material. During this process, the adhesion between the chip and the packaging material will be weakened due to the large temperature difference. If there is moisture and volatiles in the packaging material, direct curing will cause bubbles and gaps in the curing process, resulting in defects in the packaging process, affecting the final molding effect and quality of the MOS chip.

[0005] Therefore, a packaging device based on MOS chip processing is proposed here to solve the above-mentioned problems. Summary of the invention

[0006] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a packaging device for MOS chip processing, which effectively solves the problem that the adhesion between the chip and the packaging material will be weakened due to excessive temperature difference, and if there is moisture and volatiles in the packaging material, direct curing will cause bubbles and gaps in the curing process, resulting in defects in the packaging process, affecting the final molding effect and quality of the MOS chip.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a packaging device for MOS chip processing, comprising a bottom support table, the top of the bottom support table is fixedly connected to a packaging table, the top of the bottom support table is fixedly connected to an electric push rod, one side of the electric push rod is fixedly connected to a side connecting frame, one side of the side connecting frame is fixedly connected to a square protection box, the top of the square protection box is fixedly connected to a top fixing plate, the bottom of the top fixing plate is fixedly connected to the side fixing frame, one side of the side fixing frame is fixedly connected to a protection ring frame, the inner side of the protection ring frame is fixedly connected to an outer filter screen, the bottom of the top fixing plate is fixedly connected to a top fixing rod, and the top fixing rod One side of the frame is fixedly connected with a transmission motor, the output shaft of the transmission motor is fixedly connected with a bottom transmission frame, one side of the bottom transmission frame is fixedly connected with a bottom connecting frame, one side of the bottom connecting frame is fixedly connected with an inner fixing frame, one side of the inner fixing frame is fixedly connected with a servo motor, the output shaft of the servo motor is fixedly connected with an inner transmission rod, one side of the inner transmission rod is fixedly connected with a transmission fan, the inner side of the protective ring frame is fixedly connected with an inner connecting rod, one side of the inner connecting rod is fixedly connected with an inner annular slide rail, the top of the bottom connecting frame is fixedly connected with a top sliding block, the top sliding block is "T"-shaped, and the top of the top sliding block is slidably connected to the inner side of the inner annular slide rail.

[0008] Preferably: one side of the bottom connecting frame is fixedly connected to a bottom fixing plate, one side of the bottom fixing plate is fixedly connected to an inner connecting tube, one side of the inner connecting tube is fixedly connected to a side battery box, one side of the side battery box is fixedly connected to a control panel, and the control panel includes a wireless transmission module and a temperature control module.

[0009] Preferably, an inner fixing ring is fixedly connected to the inner side of the inner connecting tube, and the number of the inner fixing rings is two, the inner sides of the two inner fixing rings are movably connected to inner transmission cables, and one end of the inner transmission cable is fixedly connected to the heater body.

[0010] Preferably: a top filter cylinder is fixedly connected to one side of the inner connecting cylinder, a top transmission ring is provided on the inner side of the top filter cylinder, a top filter net is fixedly connected to the inner side of the top transmission ring, a top transmission rod is fixedly connected to the inner side of the top transmission ring, and a top transmission plate is fixedly connected to the surface of the inner transmission rod, and a top cleaning brush is fixedly connected to the bottom of the top transmission plate.

[0011] Preferably: the surface of the top transmission ring is provided with an external threaded surface, the surface of the external threaded surface is threadedly connected to the inner side of the top filter cartridge, the top of the top transmission ring is fixedly connected with a top holding rod, the number of the top holding rods is two, and the two top holding rods are symmetrically arranged along the top of the top transmission ring.

[0012] Preferably: one side of the bottom transmission frame is fixedly connected to an L fixing frame, one side of the L fixing frame is movably sleeved with a bolt, one side of the bolt is threadedly connected to one side of the bottom transmission frame, one side of the L fixing frame is fixedly connected to a side transmission plate, and one side of the side transmission plate is fixedly connected to a side cleaning brush.

[0013] Preferably: side observation windows are provided on both sides of the square protection box, and a plurality of side air inlet grooves are provided on the surface of the square protection box, and the plurality of side air inlet grooves are arranged in parallel along the surface of the square protection box.

[0014] Preferably, both sides of the inner connecting tube are fixedly connected with protection rods, and the two protection rods are arranged in parallel along the inner side of the inner connecting tube.

[0015] A method for using a packaging device for MOS chip processing comprises the following steps:

[0016] S1. By starting four electric push rods, the four electric push rods will synchronously push the side connection frame to move vertically when started. Through the fixation of the four side connection frames and the square protection box, the square protection box will be synchronously driven to move vertically when the side connection frame moves vertically. After the square protection box is lifted vertically, the packaging table on the top of the bottom support table is opened, and the top fixing plate will be synchronously driven to move synchronously during the vertical movement of the square protection box. Through the connection of the side fixing frames, the top fixing plate will be synchronously driven to move during the vertical movement of the top fixing plate. When the square protection box is lowered, the protection ring frame is synchronously driven to be lowered to the surface of the packaging table, and the outer filter on the surface of the protection ring frame is used to protect the solidified MOS chip placed on the surface of the packaging table;

[0017] S2. After the MOS chip is placed on the surface of the packaging table and the square protective box is lowered, the servo motor is started, and the inner transmission rod is driven to rotate by the servo motor. The transmission fan is driven to rotate along the inner side of the inner connecting tube by the rotating inner transmission rod. The transmission fan generates wind force to blow the external air out along one side of the inner connecting tube. In the process of the transmission fan rotating to blow the gas to the surface of the packaging table, the side storage box is started. The control panel on one side of the side storage box includes a wireless transmission module and a temperature control module. The temperature of the heater body is controlled by the temperature control module. At the same time, the connection of the inner transmission cable is used to drive the heater body to work when the side storage box is driven. After the heater body is started, it will heat up along the inner side of the inner connecting tube. After the temperature in the inner connecting tube rises to the specified temperature, the hot air is blown along the inner side of the inner connecting tube to the surface of the packaging table by the rotating transmission fan;

[0018] S3. When the transmission fan rotates and draws the external air in along the inner connection cylinder, through the connection of the top filter cylinder, the external air will first be drawn in along the top filter cylinder and sent out along the inner connection cylinder, and the top transmission ring connected to the inner side of the top filter cylinder through the top filter screen on the inner side of the top transmission ring will filter the drawn air;

[0019] S4. When the servo motor drives the inner transmission rod to rotate, the rotating inner transmission rod will synchronously drive the top transmission plate to rotate, and the rotating top transmission plate will synchronously drive multiple top cleaning brushes to rotate, by uniformly rotating the top cleaning brush along the surface of the top filter, while the inner transmission rod drives the transmission fan to rotate to generate wind force, the top cleaning brush is driven to clean the surface of the top filter, thereby cleaning the surface of the top filter;

[0020] S5. The transmission motor is stably fixed to the bottom of the top fixed plate by using two top fixing rods. The transmission motor is started to work and drive the bottom transmission frame to rotate. The rotating bottom transmission frame drives the bottom connecting frame to rotate. The bottom connecting frame drives the top sliding block to move during the rotation process, driving the top sliding block to slide along the surface of the inner annular slide rail. The top sliding block is in a "T" shape. At the same time, the inner side of the inner annular slide rail is in a ring-shaped "T". The bottom connecting frame is driven by the bottom transmission frame to rotate along the inner side of the protective ring frame to adjust the position where the transmission fan blows out hot air.

[0021] S6. While the transmission motor is driving the bottom transmission frame to rotate, through the connection of bolts, the rotating bottom transmission frame will synchronously drive the L fixing frame to rotate, the rotating L fixing frame will synchronously drive the side transmission plate to move, the continuously rotating side transmission plate will synchronously drive the side cleaning brush to rotate, the rotating side cleaning brush moves along the surface of the outer filter, and the outer filter is cleaned synchronously during the process of adjusting the position of the bottom connecting frame after the transmission motor is started.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1) After the square protective box is lifted vertically, the packaging table on the top of the bottom support table is opened, so that the operator can place and take out the MOS chip. In the process of vertical movement of the square protective box, the top fixing plate will be driven to move synchronously. Through the connection of the side fixing frame, the protective ring frame will be driven to move synchronously in the process of vertical movement of the top fixing plate. At the same time, the side observation window opened on the surface of the square protective box allows the operator to observe the MOS chip during preheating;

[0024] 2) The transmission fan is driven by the rotating inner transmission rod to rotate along the inner side of the inner connecting tube. The transmission fan generates wind to blow the external air out along one side of the inner connecting tube. The temperature of the heater body is controlled by the temperature control module. At the same time, the connection of the inner transmission cable is used to drive the heater body to work when the side storage box is driven. After the heater body is started, it will heat up along the inner side of the inner connecting tube. After the temperature in the inner connecting tube rises to the specified temperature, the hot air is blown along the inner side of the inner connecting tube to the surface of the packaging table by the rotating transmission fan, which is convenient for preheating the MOS chip on the surface of the packaging table and improving the adhesion between the MOS chip and the packaging material. During the cooling after curing, after the heater body is turned off, the wind temperature generated by the rotating transmission fan is relatively low, and the continuous rotation of the bottom connecting frame improves the cooling efficiency of the MOS chip on the surface of the packaging table after packaging and curing.

[0025] 3) Through the connection of the top filter cylinder, the external air will first be drawn in along the top filter cylinder and sent out along the inner connection cylinder, and the top transmission ring connected to the inner side of the top filter cylinder will filter the drawn air using the top filter net inside the top transmission ring. The top filter net blocks dust, hair and other tiny impurities in the air, preventing pollutants from adhering to the MOS chip or the circuit board around its package, thereby improving the stability of the MOS chip during the packaging process, reducing the situation of circuit breaking or poor heat dissipation, and increasing the service life of the MOS chip;

[0026] 4) The rotating top transmission plate will synchronously drive multiple top cleaning brushes to rotate. By evenly rotating the top cleaning brush along the surface of the top filter, the inner transmission rod drives the transmission fan to rotate to generate wind force while driving the top cleaning brush to clean the surface of the top filter, and clean the dust and hair particles accumulated on the surface of the top filter during the filtering process, reducing the blockage of the top filter surface caused by dust and hair accumulation, improving the gas passing rate of the top filter, eliminating the need for operators to clean repeatedly, reducing the workload of operators, and at the same time, the operator holds the top holding rod and rotates the top transmission ring, and the top transmission ring is connected to the threaded connection with the top filter cartridge through the external thread surface of the top transmission ring, and the top transmission ring is rotated along the inner thread of the top filter cartridge until it is separated, thereby improving the portability of the top transmission ring and the top filter cartridge for disassembly;

[0027] 5) By starting the transmission motor and driving the bottom transmission frame to rotate, the rotating bottom transmission frame will drive the bottom connecting frame to rotate, and the bottom transmission frame drives the bottom connecting frame to rotate along the inner side of the protective ring frame, so as to facilitate the adjustment of the position where the transmission fan blows out hot air, and preheat evenly according to different positions, thereby improving the preheating effect;

[0028] 6) When the square protective box is lowered, the protective ring frame is simultaneously driven to lower to the surface of the packaging table, and the outer filter on the surface of the protective ring frame is used to protect the solidified MOS chip placed on the surface of the packaging table, thereby reducing the contact between dust particles in the external environment and the MOS chip during the preheating process. A rotating side cleaning brush is used to move along the surface of the outer filter. When the position of the bottom connecting frame is adjusted after the transmission motor is started, the outer filter is cleaned synchronously, and dust accumulation generated during filtering on the surface of the outer filter is cleaned, thereby improving the filtering effect of the outer filter, reducing the contact between dust particles and the MOS chip on the surface of the packaging table, and improving the protection of the MOS chip during the preheating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0030] Figure 1 It is a schematic diagram of the overall appearance structure of the present invention;

[0031] Figure 2 It is a schematic diagram of the structure of the side observation window of the present invention;

[0032] Figure 3 It is a schematic diagram of the structure of the outer filter screen of the present invention;

[0033] Figure 4 It is a schematic diagram of the structure of the side fixing frame of the present invention;

[0034] Figure 5 It is a schematic diagram of the top fixing rod structure of the present invention;

[0035] Figure 6 It is a schematic diagram of the structure of the servo motor of the present invention;

[0036] Figure 7 It is a schematic diagram of the structure of the inner connecting tube of the present invention;

[0037] Figure 8 It is a schematic diagram of the structure of the inner transmission cable of the present invention;

[0038] Fig. 9 It is a schematic diagram of the structure of the inner annular slide rail of the present invention;

[0039] Fig.10 It is a schematic diagram of the top fixing plate structure of the present invention;

[0040] Fig.11 It is a schematic diagram of the structure of the side cleaning brush of the present invention.

[0041] In the figure: 1, bottom support platform; 2, packaging platform; 301, square protection box; 302, side observation window; 303, side air inlet slot; 304, electric push rod; 305, side connecting frame; 306, top fixing plate; 307, side fixing frame; 308, protective ring frame; 309, outer filter; 401, top fixing rod; 402, transmission motor; 403, bottom transmission frame; 404, bottom connecting frame; 405, top sliding block; 406, inner connecting rod; 407, inner annular slide rail; 408, inner fixing frame; 409, servo motor; 4010, inner transmission rod; 4011, transmission fan; 4012, bottom fixing plate; 4013, inner connecting tube; 4014, protective rod; 501, top filter tube; 502, top transmission ring; 503, external threaded surface; 504, top filter; 505, top transmission rod; 506, top holding rod; 507, top transmission plate; 508, top cleaning brush; 601, side battery box; 602, control panel; 603, inner fixing ring; 604, inner transmission cable; 605, heater body; 701, L fixing frame; 702, bolt; 703, side transmission plate; 704, side cleaning brush. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] In this embodiment, Figure 1-Figure 11 Given, the present invention provides the following technical solutions:

[0044] A packaging device for MOS chip processing includes a bottom support platform 1, a packaging platform 2 is fixedly connected to the top of the bottom support platform 1, an electric push rod 304 is fixedly connected to one side of the electric push rod 304, a side connecting frame 305 is fixedly connected to one side of the side connecting frame 305, a square protection box 301 is fixedly connected to the top of the square protection box 301, a top fixing plate 306 is fixedly connected to the top of the top fixing plate 306, a side fixing frame 307 is fixedly connected to the bottom of the top fixing plate 306, a side fixing frame 308 is fixedly connected to one side of the side fixing frame 307, a protection ring frame 308 is fixedly connected to the inner side of the protection ring frame 308 There is an outer filter screen 309, the bottom of the top fixing plate 306 is fixedly connected to a top fixing rod 401, one side of the top fixing rod 401 is fixedly connected to a transmission motor 402, the output shaft of the transmission motor 402 is fixedly connected to a bottom transmission frame 403, one side of the bottom transmission frame 403 is fixedly connected to a bottom connecting frame 404, one side of the bottom connecting frame 404 is fixedly connected to an inner fixing frame 408, one side of the inner fixing frame 408 is fixedly connected to a servo motor 409, the output shaft of the servo motor 409 is fixedly connected to an inner transmission rod 4010, one side of the inner transmission rod 4010 is fixedly connected to a transmission fan 40 11. By fixing the four side connecting frames 305 and the square protective box 301, when the side connecting frames 305 move vertically, the square protective box 301 will be synchronously driven to move vertically. After the square protective box 301 is vertically lifted, the packaging table 2 on the top of the bottom support table 1 is opened, which is convenient for operators to place and take out the MOS chip. At the same time, the rotating transmission fan 4011 blows hot air along the inner side of the inner connecting cylinder 4013 to the surface of the packaging table 2, which is convenient for preheating the MOS chip on the surface of the packaging table 2, thereby improving the adhesion between the MOS chip and the packaging material, and During cooling after solidification, by turning off the heater body 605, the wind temperature generated by the rotating transmission fan 4011 is relatively low, and combined with the continuously rotating bottom connecting frame 404, the cooling efficiency of the MOS chip after solidification on the surface of the packaging table 2 is improved. The inner side of the protective ring frame 308 is fixedly connected to an inner connecting rod 406, one side of the inner connecting rod 406 is fixedly connected to an inner annular slide rail 407, and the top of the bottom connecting frame 404 is fixedly connected to a top sliding block 405, the top sliding block 405 is in a "T" shape, and the top of the top sliding block 405 is slidably connected to the inner side of the inner annular slide rail 407.

[0045] It should be noted that by starting the transmission motor 402 and driving the bottom transmission frame 403 to rotate, the rotating bottom transmission frame 403 will drive the bottom connecting frame 404 to rotate, and the rotation of the bottom connecting frame 404 will drive the top sliding block 405 to move, driving the top sliding block 405 to slide along the surface of the inner annular slide rail 407, and the top sliding block 405 is in a "T" shape, and the inner side of the inner annular slide rail 407 is in a ring-shaped "T", and the sliding of the inner annular slide rail 407 and the top sliding block 405 improves the stability of the bottom transmission frame 403 driving the bottom connecting frame 404 to rotate.

[0046] In an optional embodiment: one side of the bottom connecting frame 404 is fixedly connected to the bottom fixing plate 4012, one side of the bottom fixing plate 4012 is fixedly connected to the inner connecting tube 4013, one side of the inner connecting tube 4013 is fixedly connected to the side power storage box 601, one side of the side power storage box 601 is fixedly connected to the control panel 602, and the control panel 602 includes a wireless transmission module and a temperature control module.

[0047] It should be noted that the control panel 602 on the side of the side battery box 601 includes a wireless transmission module and a temperature control module. The wireless transmission module allows the operator to operate the temperature control module remotely, and use the temperature control module to control the temperature of the heater body 605. At the same time, by using the connection of the internal transmission cable 604, the heater body 605 will be driven to work when the side battery box 601 is driven. After the heater body 605 is started, it will heat up along the inner side of the internal connecting tube 4013.

[0048] In an optional embodiment: the inner side of the inner connecting tube 4013 is fixedly connected with an inner fixing ring 603, and the number of the inner fixing rings 603 is two, the inner sides of the two inner fixing rings 603 are movably connected with an inner transmission cable 604, and one end of the inner transmission cable 604 is fixedly connected with a heater body 605.

[0049] It should be noted that the temperature of the heater body 605 is controlled by the temperature control module, and at the same time, the connection of the internal transmission cable 604 is utilized so that the heater body 605 can be driven to work when the side battery box 601 is driven. After the heater body 605 is started, it will heat up along the inner side of the inner connecting tube 4013. After the temperature inside the inner connecting tube 4013 rises to the specified temperature, the rotating transmission fan 4011 will blow the hot air along the inner side of the inner connecting tube 4013 toward the surface of the packaging table 2, so as to preheat the MOS chip on the surface of the packaging table 2.

[0050] In an optional embodiment: a top filter cylinder 501 is fixedly connected to one side of the inner connecting cylinder 4013, a top transmission ring 502 is arranged on the inner side of the top filter cylinder 501, a top filter net 504 is fixedly connected to the inner side of the top transmission ring 502, a top transmission rod 505 is fixedly connected to the inner side of the top transmission ring 502, and a top transmission plate 507 is fixedly connected to the surface of the inner transmission rod 4010, and a top cleaning brush 508 is fixedly connected to the bottom of the top transmission plate 507.

[0051] It should be noted that the top filter 504 on the inner side of the top transmission ring 502 is used to filter the drawn-in air. The top filter 504 blocks dust, hair and other tiny impurities in the air, prevents pollutants from adhering to the MOS chip or the circuit board around its package, and improves the stability of the MOS chip during the packaging process. At the same time, the rotating top transmission plate 507 will synchronously drive multiple top cleaning brushes 508 to rotate. By evenly rotating the top cleaning brushes 508 along the surface of the top filter 504, the inner transmission rod 4010 drives the transmission fan 4011 to rotate to generate wind force, while driving the top cleaning brush 508 to clean the surface of the top filter 504, and clean the dust and hair particles accumulated on the surface of the top filter 504 during the filtering process, thereby reducing the blockage of the surface of the top filter 504 caused by dust and hair accumulation.

[0052] In an optional embodiment: the surface of the top transmission ring 502 is provided with an external threaded surface 503, the surface of the external threaded surface 503 is threadedly connected to the inner side of the top filter cartridge 501, and the top of the top transmission ring 502 is fixedly connected with a top holding rod 506. There are two top holding rods 506, and the two top holding rods 506 are symmetrically arranged along the top of the top transmission ring 502.

[0053] It should be noted that the operator holds the top holding rod 506 and then rotates the top transmission ring 502. Through the threaded connection between the outer threaded surface 503 on the surface of the top transmission ring 502 and the top filter cartridge 501, the top transmission ring 502 is rotated along the inner thread of the top filter cartridge 501 until they are separated, thereby improving the portability of disassembly of the top transmission ring 502 and the top filter cartridge 501.

[0054] In an optional embodiment: one side of the bottom transmission frame 403 is fixedly connected to an L fixing frame 701, one side of the L fixing frame 701 is movably sleeved with a bolt 702, one side of the bolt 702 is threadedly connected to one side of the bottom transmission frame 403, one side of the L fixing frame 701 is fixedly connected to a side transmission plate 703, and one side of the side transmission plate 703 is fixedly connected to a side cleaning brush 704.

[0055] It should be noted that the L fixing frame 701 is stably connected to the bottom transmission frame 403 by bolts 702, and the continuously rotating side transmission plate 703 will synchronously drive the side cleaning brush 704 to rotate. The rotating side cleaning brush 704 moves along the surface of the outer filter 309, and the outer filter 309 is cleaned synchronously during the process of adjusting the position of the bottom connecting frame 404 after the transmission motor 402 is started. The dust accumulation generated during the filtering on the surface of the outer filter 309 is cleaned, thereby improving the filtering effect of the outer filter 309, reducing the contact between dust particles and the MOS chip on the surface of the packaging table 2, and improving the protection of the MOS chip during the preheating process.

[0056] In an optional embodiment: side observation windows 302 are provided on both sides of the square protective box 301, and a plurality of side air inlet grooves 303 are provided on the surface of the square protective box 301, and the plurality of side air inlet grooves 303 are arranged in parallel along the surface of the square protective box 301.

[0057] It should be noted that the side observation window 302 opened on the surface of the square protective box 301 allows the operator to observe the MOS chip preheating process. At the same time, by opening a plurality of side air inlet grooves 303, when the transmission fan 4011 rotates to generate airflow, the side air inlet grooves 303 are used to maintain the circulation performance of the internal and external airflows, thereby improving the stability of the airflow during the preheating of the MOS chip. The side air inlet grooves 303 are opened at the bottom of the side observation window 302. When the airflow enters the square protective box 301 along the side air inlet grooves 303, it will come into contact with the external filter 309.

[0058] In an optional embodiment: both sides of the inner connecting tube 4013 are fixedly connected with protection rods 4014 , and the two protection rods 4014 are arranged in parallel along the inner side of the inner connecting tube 4013 .

[0059] It should be noted that by fixing the protective rod 4014, the airflow generated by the transmission fan 4011 is dispersed, and the hot airflow generated during the operation of the transmission fan 4011 will not directly impact the MOS chip, thereby improving the stability of the packaging working environment, reducing the thermal stress of the MOS chip during the preheating process, and improving the packaging quality and yield rate. Example

[0060] This embodiment 2 provides a method for using a packaging device for MOS chip processing, which is used to further illustrate the working process or principle of the packaging device for MOS chip processing provided in the above embodiment 1, and the details are as follows:

[0061] A method for using a packaging device for MOS chip processing comprises the following steps:

[0062] S1. First, start the four electric push rods 304. When started, the four electric push rods 304 will synchronously push the side connecting frame 305 to move vertically. The four side connecting frames 305 are fixed to the square protective box 301. When the side connecting frame 305 moves vertically, it will synchronously drive the square protective box 301 to move vertically. After the square protective box 301 is vertically lifted, the packaging table 2 on the top of the bottom support table 1 is opened, so that the operator can place and take out the MOS chip. In addition, during the vertical movement of the square protective box 301, the top fixing plate 306 will be synchronously driven to move synchronously. The connection of the side fixing frame 307 will synchronously drive the protection ring frame 308 to move during the vertical movement of the top fixing plate 306, and synchronously drive the protection ring frame 308 to be lowered to the surface of the packaging table 2 when the square protection box 301 is lowered, and the outer filter 309 on the surface of the protection ring frame 308 is used to protect the MOS chip placed on the surface of the packaging table 2 to reduce the contact between dust particles in the external environment and the MOS chip during the preheating process. At the same time, the side observation window 302 opened on the surface of the square protection box 301 allows the operator to observe the MOS chip during the preheating process;

[0063] S2. After the MOS chip is placed on the surface of the packaging table 2 and the square protective box 301 is lowered, the servo motor 409 is started, and the inner transmission rod 4010 is driven to rotate by the servo motor 409. The rotating inner transmission rod 4010 drives the transmission fan 4011 to rotate along the inner side of the inner connecting tube 4013. The transmission fan 4011 will generate wind force to blow the external air out along one side of the inner connecting tube 4013, and the transmission fan 4011 will be protected by the protective rod 4014 on the side of the inner connecting tube 4013 when rotating, thereby improving the stability of the transmission fan 4011 when rotating. In the process of the transmission fan 4011 rotating to blow the gas to the surface of the packaging table 2, the side storage box 601 is started to work. The control panel 602 on one side of the side storage box 601 includes a wireless transmission module and a temperature control module. The wireless transmission module allows the operator to The temperature control module is operated remotely, and the temperature of the heater body 605 is controlled by the temperature control module. At the same time, the connection of the internal transmission cable 604 is used to drive the heater body 605 to work when the side storage box 601 is driven. After the heater body 605 is started, it will heat up along the inner side of the inner connecting tube 4013. After the temperature in the inner connecting tube 4013 rises to the specified temperature, the hot air is blown along the inner side of the inner connecting tube 4013 to the surface of the packaging table 2 through the rotating transmission fan 4011, so as to preheat the MOS chip on the surface of the packaging table 2 and improve the adhesion between the MOS chip and the packaging material. When cooling after solidification, after the heater body 605 is turned off, the wind temperature generated by the rotating transmission fan 4011 is relatively low, and the continuous rotation of the bottom connecting frame 404 improves the cooling efficiency of the MOS chip on the surface of the packaging table 2 after solidification.

[0064] S3, when the transmission fan 4011 rotates and draws external air in along the inner connection tube 4013, through the connection of the top filter tube 501, the external air will first be drawn in along the top filter tube 501 and sent out along the inner connection tube 4013, and the top transmission ring 502 connected to the inner side of the top filter tube 501 by the thread, uses the top filter net 504 inside the top transmission ring 502 to filter the drawn air, and the top filter net 504 blocks dust, hair and other tiny impurities in the air, preventing pollutants from adhering to the MOS chip or the circuit board around its package, thereby improving the stability of the MOS chip during the packaging process, reducing the situation of circuit breaking or poor heat dissipation, and increasing the service life of the MOS chip;

[0065] S4. At the same time, when the servo motor 409 drives the inner transmission rod 4010 to rotate, the rotating inner transmission rod 4010 will synchronously drive the top transmission plate 507 to rotate, and the rotating top transmission plate 507 will synchronously drive multiple top cleaning brushes 508 to rotate, and the top cleaning brushes 508 will rotate evenly along the surface of the top filter 504. While the inner transmission rod 4010 drives the transmission fan 4011 to rotate to generate wind force, it drives the top cleaning brushes 508 to clean the surface of the top filter 504, and the dust accumulated on the surface of the top filter 504 during the filtering process is removed. The top filter 504 is cleaned by dust and hair particles, and the clogging of the surface of the top filter 504 caused by dust and hair accumulation is reduced, and the gas passing rate of the top filter 504 is improved. The operator does not need to clean it repeatedly, which reduces the workload of the operator. At the same time, the operator holds the top holding rod 506 and rotates the top transmission ring 502. The outer thread surface 503 on the surface of the top transmission ring 502 is connected with the thread of the top filter cartridge 501, and the top transmission ring 502 is rotated along the inner thread of the top filter cartridge 501 until it is separated, which improves the portability of the top transmission ring 502 and the top filter cartridge 501 for disassembly;

[0066] S5. At the same time, the two top fixing rods 401 are used to fix the transmission motor 402 stably on the bottom of the top fixing plate 306. By starting the transmission motor 402 to work and drive the bottom transmission frame 403 to rotate, the rotating bottom transmission frame 403 will drive the bottom connecting frame 404 to rotate, and the bottom connecting frame 404 will drive the top sliding block 405 to move during the rotation, driving the top sliding block 405 to slide along the surface of the inner annular slide rail 407, and the top sliding block 405 is in a "T" shape, and the inner side of the inner annular slide rail 407 is in a ring-shaped "T" shape. Through the sliding of the inner annular slide rail 407 and the top sliding block 405, the stability of the bottom transmission frame 403 driving the bottom connecting frame 404 to rotate is improved, and the bottom connecting frame 404 is driven by the bottom transmission frame 403 to rotate along the inner side of the protective ring frame 308, so as to facilitate the adjustment of the position where the transmission fan 4011 blows out hot air, and uniform preheating is performed according to different positions, thereby improving the preheating effect;

[0067] S6. While the transmission motor 402 is driving the bottom transmission frame 403 to rotate, through the connection of the bolts 702, the rotating bottom transmission frame 403 will synchronously drive the L fixing frame 701 to rotate, and the rotating L fixing frame 701 will synchronously drive the side transmission plate 703 to move, and the continuously rotating side transmission plate 703 will synchronously drive the side cleaning brush 704 to rotate, and the rotating side cleaning brush 704 will move along the surface of the outer filter 309. After the transmission motor 402 is started, the outer filter 309 is cleaned synchronously in the process of adjusting the position of the bottom connecting frame 404, and the dust accumulation generated when filtering on the surface of the outer filter 309 is cleaned, thereby improving the filtering effect of the outer filter 309, reducing the contact between dust particles and the MOS chip on the surface of the packaging table 2, and improving the protection of the MOS chip during the preheating process;

[0068] It should be noted that the transmission motor 402, servo motor 409, side battery box 601, control panel 602, internal transmission cable 604 and heater body 605 in the present invention are all prior arts, and corresponding models can be selected according to actual needs. The internal structure and operating principle of the above parts are also common knowledge of technicians in this field, and no further elaboration will be made on this.

[0069] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A packaging device for MOS chip processing, comprising a bottom support table (1), characterized in that: The top of the bottom support platform (1) is fixedly connected to the packaging platform (2); the top of the bottom support platform (1) is fixedly connected to an electric push rod (304); one side of the electric push rod (304) is fixedly connected to a side connecting frame (305); one side of the side connecting frame (305) is fixedly connected to a square protection box (301); the top of the square protection box (301) is fixedly connected to a top fixing plate (306); the bottom of the top fixing plate (306) is fixedly connected to a side fixing frame (307); one side of the side fixing frame (307) is fixedly connected to a protection ring frame (308); the inner side of the protection ring frame (308) is fixedly connected to an outer filter screen (309); the bottom of the top fixing plate (306) is fixedly connected to a top fixing rod (401); one side of the top fixing rod (401) is fixedly connected to a transmission motor (402); the output shaft of the transmission motor (402) is fixedly connected to the top fixing plate (306); A bottom transmission frame (403) is connected, one side of the bottom transmission frame (403) is fixedly connected to a bottom connecting frame (404), one side of the bottom connecting frame (404) is fixedly connected to an inner fixing frame (408), one side of the inner fixing frame (408) is fixedly connected to a servo motor (409), an output shaft of the servo motor (409) is fixedly connected to an inner transmission rod (4010), one side of the inner transmission rod (4010) is fixedly connected to a transmission fan (4011), the inner side of the protective ring frame (308) is fixedly connected to an inner connecting rod (406), one side of the inner connecting rod (406) is fixedly connected to an inner annular slide rail (407), the top of the bottom connecting frame (404) is fixedly connected to a top sliding block (405), the top sliding block (405) is in a "T" shape, and the top of the top sliding block (405) is slidably connected to the inner side of the inner annular slide rail (407).

2. The packaging equipment for MOS chip processing according to claim 1, characterized in that: One side of the bottom connection frame (404) is fixedly connected to a bottom fixing plate (4012), one side of the bottom fixing plate (4012) is fixedly connected to an inner connecting tube (4013), one side of the inner connecting tube (4013) is fixedly connected to a side power storage box (601), one side of the side power storage box (601) is fixedly connected to a control panel (602), and the control panel (602) comprises a wireless transmission module and a temperature control module.

3. The packaging equipment for MOS chip processing according to claim 2 is characterized in that: The inner side of the inner connecting tube (4013) is fixedly connected to an inner fixing ring (603), and the number of the inner fixing rings (603) is two. The inner sides of the two inner fixing rings (603) are both movably connected to an inner transmission cable (604), and one end of the inner transmission cable (604) is fixedly connected to a heater body (605).

4. The packaging equipment for MOS chip processing according to claim 3 is characterized in that: A top filter cylinder (501) is fixedly connected to one side of the inner connecting cylinder (4013), a top transmission ring (502) is provided on the inner side of the top filter cylinder (501), a top filter net (504) is fixedly connected to the inner side of the top transmission ring (502), a top transmission rod (505) is fixedly connected to the inner side of the top transmission ring (502), a top transmission plate (507) is fixedly connected to the surface of the inner transmission rod (4010), and a top cleaning brush (508) is fixedly connected to the bottom of the top transmission plate (507).

5. The packaging equipment for MOS chip processing according to claim 4 is characterized in that: The surface of the top transmission ring (502) is provided with an external threaded surface (503), and the surface of the external threaded surface (503) is threadedly connected to the inner side of the top filter cartridge (501). The top of the top transmission ring (502) is fixedly connected with a top holding rod (506), and the number of the top holding rods (506) is two, and the two top holding rods (506) are symmetrically arranged along the top of the top transmission ring (502).

6. The packaging equipment for MOS chip processing according to claim 5, characterized in that: One side of the bottom transmission frame (403) is fixedly connected to an L fixing frame (701), one side of the L fixing frame (701) is movably sleeved with a bolt (702), one side of the bolt (702) is threadedly connected to one side of the bottom transmission frame (403), one side of the L fixing frame (701) is fixedly connected to a side transmission plate (703), and one side of the side transmission plate (703) is fixedly connected to a side cleaning brush (704).

7. The packaging equipment for MOS chip processing according to claim 6 is characterized in that: Side observation windows (302) are provided on both sides of the square protection box (301), and a plurality of side air inlet grooves (303) are provided on the surface of the square protection box (301). The plurality of side air inlet grooves (303) are arranged in parallel along the surface of the square protection box (301).

8. The packaging equipment for MOS chip processing according to claim 7, characterized in that: Both sides of the inner connecting tube (4013) are fixedly connected with protection rods (4014), and the two protection rods (4014) are arranged in parallel along the inner side of the inner connecting tube (4013).

9. A method for using a packaging device for MOS chip processing, applied to a packaging device for MOS chip processing as claimed in claim 8, characterized in that: The steps include: S1. By starting the four electric push rods (304), the four electric push rods (304) will synchronously push the side connection frame (305) to move vertically. By fixing the four side connection frames (305) and the square protection box (301), when the side connection frame (305) moves vertically, the square protection box (301) will be synchronously driven to move vertically. After the square protection box (301) is vertically lifted, the packaging table (2) on the top of the bottom support table (1) is opened, and the square protection box (301) is placed on the bottom support table (1). 1) During the vertical movement, the top fixing plate (306) is synchronously driven to move synchronously. Through the connection of the side fixing frame (307), during the vertical movement of the top fixing plate (306), the protection ring frame (308) is synchronously driven to move. When the square protection box (301) is lowered, the protection ring frame (308) is synchronously driven to be lowered to the surface of the packaging platform (2). The outer filter (309) on the surface of the protection ring frame (308) is used to protect the solidified MOS chip placed on the surface of the packaging platform (2); S2. After placing the MOS chip on the surface of the packaging table (2) and lowering the square protection box (301), start the servo motor (409), and drive the inner transmission rod (4010) to rotate through the servo motor (409). The rotating inner transmission rod (4010) drives the transmission fan (4011) to rotate along the inner side of the inner connection tube (4013). The transmission fan (4011) generates wind force to blow the external air along one side of the inner connection tube (4013). In the process of the transmission fan (4011) rotating to blow the gas toward the surface of the packaging table (2), the side storage box (601) is started to work. The control panel (602) on one side of the side power storage box (601) includes a wireless transmission module and a temperature control module. The temperature control module is used to control the temperature of the heater body (605). At the same time, the connection of the internal transmission cable (604) is used to drive the heater body (605) to work when the side power storage box (601) is driven. After the heater body (605) is started, it will heat up along the inner side of the inner connecting tube (4013). After the temperature in the inner connecting tube (4013) rises to a specified temperature, the hot air is blown along the inner side of the inner connecting tube (4013) toward the surface of the packaging table (2) through the rotating transmission fan (4011); S3, when the transmission fan (4011) rotates and draws external air in along the inner connecting cylinder (4013), the external air is first drawn in along the top filter cylinder (501) and sent out along the inner connecting cylinder (4013) through the connection of the top filter cylinder (501), and the drawn air is filtered by the top filter screen (504) on the inner side of the top transmission ring (502) which is threadedly connected to the inner side of the top filter cylinder (501); S4. When the servo motor (409) drives the inner transmission rod (4010) to rotate, the rotating inner transmission rod (4010) will synchronously drive the top transmission plate (507) to rotate, and the rotating top transmission plate (507) will synchronously drive the plurality of top cleaning brushes (508) to rotate, and the top cleaning brushes (508) will be uniformly rotated along the surface of the top filter (504). When the inner transmission rod (4010) drives the transmission fan (4011) to rotate to generate wind force, the top cleaning brushes (508) will be driven to clean the surface of the top filter (504), thereby cleaning the surface of the top filter (504); S5. The transmission motor (402) is stably fixed to the bottom of the top fixing plate (306) by using the two top fixing rods (401). The transmission motor (402) is started to work and drive the bottom transmission frame (403) to rotate. The rotating bottom transmission frame (403) drives the bottom connecting frame (404) to rotate. During the rotation of the bottom connecting frame (404), the top sliding block (405) is driven to move, driving the top sliding block (405) to slide along the surface of the inner annular slide rail (407). The top sliding block (405) is in a "T" shape. At the same time, the inner side of the inner annular slide rail (407) is in a ring-shaped "T". The bottom connecting frame (404) is driven to rotate along the inner side of the protective ring frame (308) by the bottom transmission frame (403), so as to adjust the position of the transmission fan (4011) to blow out hot air. S6. While the transmission motor (402) is driving the bottom transmission frame (403) to rotate, the rotating bottom transmission frame (403) will synchronously drive the L fixing frame (701) to rotate through the connection of the bolts (702). The rotating L fixing frame (701) will synchronously drive the side transmission plate (703) to move. The continuously rotating side transmission plate (703) will synchronously drive the side cleaning brush (704) to rotate. The rotating side cleaning brush (704) moves along the surface of the outer filter (309). After the transmission motor (402) is started, the outer filter (309) is cleaned synchronously during the process of adjusting the position of the bottom connection frame (404).

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