Electronic component packaging device and method

Abstract

The present invention relates to the technical field of electronic component packaging, and specifically to an electronic component packaging device and method, comprising a base, a glue storage box, a feeding pipe, a glue dispensing unit, a rotating unit, an electronic component, a substrate and a bubble removal component, wherein the bubble removal component comprises a stirring claw, a pressing plate and a vacuum pump, and an inclined groove is provided above the pressing plate and the stirring claw. The stirring claw stirs the glue, and the pressing plate is pressed down and moves downward together with the stirring claw to press the glue, or the lifting speed is accelerated to pat the glue to discharge internal bubbles; the vacuum pump is started to extract the air inside the glue storage box to avoid repeated formation of bubbles, thereby stirring, pressing and patting the stored glue and extracting the air from the glue storage box at the same time, effectively avoiding the formation of bubbles during glue dispensing, thereby greatly improving the glue dispensing quality and effect.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component packaging, and in particular to an electronic component packaging device and method. Background Art

[0002] Currently, in the processing of electronic components, they need to be packaged. The electronic components are placed on a substrate and packaged by dispensing resin or glue. After the sealing is completed, the electronic components are fixed on the substrate to prevent loosening and falling off. However, the traditional dispensing operation is done by manual dispensing, which is inefficient and has poor accuracy.

[0003] In the prior art, a glue dispensing machine is set up, and a slide rail or a robotic arm is used to move the glue outlet to the connection between the electronic component and the substrate to perform the glue sealing operation, thereby improving efficiency and glue dispensing accuracy.

[0004] However, in the aforementioned prior art, the glue is stored in the glue storage box of the glue dispensing machine before dispensing so that it can be withdrawn for use at any time; and there will be a part of air in the glue cylinder, and external air will also be brought in when adding glue, resulting in a continuous increase in the air in the glue cylinder; when the internal air is in contact with the glue for a long time and the glue flows when it is withdrawn, a part of the air will be integrated into the glue to form bubbles, resulting in bubbles at the connection between the electronic component and the substrate during the final dispensing, affecting the dispensing quality. Summary of the Invention

[0005] The purpose of the present invention is to provide an electronic component packaging device and method to solve the problem in the prior art that glue is stored in a glue storage box of a glue dispensing machine before dispensing so that it can be withdrawn for use at any time; there will be a part of air in the glue cylinder, and external air will also be brought in when glue is added, resulting in a continuous increase in the air in the glue cylinder; when the internal air is in contact with the glue for a long time and the glue flows when it is withdrawn, a part of the air will be integrated into the glue to form bubbles, resulting in bubbles at the connection between the electronic component and the substrate during the final dispensing, affecting the dispensing quality.

[0006] To achieve the above-mentioned object, the present invention provides an electronic component packaging device, comprising a base, a glue storage box, a feed pipe, a glue dispensing unit, a placement and rotation unit, electronic components, a substrate, and a bubble removal assembly, wherein the glue storage box is placed above the base, the feed pipe is connected to the top of the glue storage box, the glue dispensing unit is connected to one side of the glue storage box, the placement and rotation unit is provided on the base, the substrate is placed on the placement and rotation unit, and the electronic components are placed above the substrate;

[0007] The debubble assembly includes a stirring claw, a pressing plate and a vacuum pump. The pressing plate has multiple circulation holes. There are inclined grooves above the pressing plate and the stirring claw. The stirring claw is arranged inside the glue storage box. The pressing plate is arranged inside the glue storage box and is sleeved on the outside of the stirring claw. The stirring claw and the pressing plate are adapted to each other. The vacuum pump is arranged above the glue storage box.

[0008] Among them, the dispensing unit includes a telescopic hose, a glue pump, a movable pipe, a glue dispensing head and an adjustment mechanism. The glue pump is arranged on one side of the glue storage box. The two ends of the telescopic hose are respectively connected to the glue pump and one end of the movable pipe. The other end of the movable pipe is connected to the glue dispensing head. The adjustment mechanism is arranged on the glue dispensing head.

[0009] Among them, the adjustment mechanism includes a dispensing lifting component and a dispensing telescopic component. The dispensing lifting component is arranged above the base, and the dispensing telescopic component is arranged at the output end of the dispensing lifting component. The output end of the dispensing telescopic component is fixedly connected to the dispensing head.

[0010] Among them, the placement and rotation unit includes a rotating component and a turntable. The rotating component is arranged below the base. The output end of the rotating component passes through the base and is fixedly connected to the turntable. The turntable is rotatably connected to the base, and the substrate is placed above the turntable.

[0011] Among them, the bubble removal assembly also includes a control panel, an air detector and a telescopic rod. The control panel is arranged on one side of the base, the air detector is arranged on the inner top wall of the glue storage box, and the two ends of the telescopic rod are respectively fixedly connected to the movable pipe and one side of the glue storage box.

[0012] In which, the bubble removal component also includes an adjustment unit, which includes a stirring drive component, a stirring lifting component and two pressing lifting components. The stirring drive component is arranged on the inner top wall of the glue storage box, and the stirring lifting component is fixedly connected to the output end of the stirring drive component. The output end of the stirring lifting component is fixedly connected to the stirring claw. The two pressing lifting components are sequentially arranged above the glue storage box, and the output ends of the two pressing lifting components both pass through the glue storage box and are fixedly connected to the pressing plate.

[0013] Wherein, the bubble removal assembly further includes a scraper unit, and the scraper unit is arranged on the base;

[0014] The scraper unit includes a scraper transverse moving component, a scraper lifting component, a scraper telescopic component, a scraper rotation mechanism, a camera and an infrared sensor. The scraper transverse moving component is arranged above the base, the scraper lifting component is arranged at the output end of the scraper transverse moving component, the scraper telescopic component is arranged at the output end of the scraper lifting component, the scraper rotation mechanism is arranged at the output end of the scraper telescopic component, and the camera and the infrared sensor are both arranged on the scraper rotation mechanism.

[0015] Among them, the scraper rotation mechanism includes a fixed groove, a scraper rotating component and a scraper plate, the fixed groove is fixedly connected to the output end of the scraper telescopic component, the scraper rotating component is arranged on one side of the fixed groove, the scraper plate is rotatably connected to the fixed groove and is located inside the fixed groove, the output end of the scraper rotating component is fixedly connected to the scraper plate, and the camera and the infrared sensor are symmetrically arranged on both sides of the scraper plate.

[0016] Wherein, the debubble assembly further comprises two clamping units, and the two clamping units are symmetrically arranged on the base;

[0017] The clamping unit includes a clamping component, a support plate, a pressure sensor and a rubber protective layer. The clamping component is arranged above the base and located on one side of the turntable. The output end of the clamping component is fixedly connected to the support plate. The pressure sensor is arranged on one side of the support plate, and the rubber protective layer is arranged on one side of the pressure sensor.

[0018] The present invention also provides an electronic component packaging method, which uses the above-mentioned electronic component packaging device and includes the following steps:

[0019] Add glue to the feed tube and place the electronic component on the substrate;

[0020] The stirring claw stirs the glue, and the pressing plate presses down and moves down together with the stirring claw to press the glue, or accelerates the lifting speed to beat the glue to expel internal bubbles;

[0021] After the pressing plate is pressed down, the glue flows out from the flow hole and then returns to the bottom of the glue storage box through the chute, and the process repeats.

[0022] The vacuum pump is started to extract the air inside the glue storage box to avoid repeated formation of bubbles;

[0023] Starting the dispensing unit to dispense glue on the connection between the electronic component and the substrate;

[0024] The placement and rotation unit drives the electronic component and the substrate to rotate and adjust the angle until the dispensing operation is completed;

[0025] The electronic components and the substrate are taken out for subsequent curing and testing, and finally the packaging is completed.

[0026] The present invention provides an electronic component packaging device and method, wherein glue is added to the feed pipe and the electronic component is placed on the substrate; the stirring claw stirs the glue, the pressing plate is pressed down, and the stirring claw moves downward together to press the glue, or the lifting and lowering speed is increased to pat the glue to expel internal bubbles; after the pressing plate is pressed down, the glue flows out from the circulation hole, and then returns to the bottom of the glue storage box through the inclined groove, and repeats this process; the vacuum pump is started to extract the air inside the glue storage box to avoid repeated formation of bubbles; the glue dispensing unit is started to perform glue dispensing on the connection between the electronic component and the substrate; the placement rotation unit drives the electronic component and the substrate to rotate and adjust the angle until the glue dispensing operation is completed; through the above-mentioned structural setting, the stored glue is stirred, pressed and patted, and the air in the glue storage box is extracted at the same time, which effectively avoids the formation of bubbles during glue dispensing, thereby greatly improving the glue dispensing quality and effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art.

[0028] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0029] Figure 2 It is a top view of the entire present invention.

[0030] Figure 3 The present invention Figure 2 AA line section view.

[0031] Figure 4 The present invention Figure 1 A magnified view of the local structure at point B.

[0032] Figure 5 The present invention Figure 3 A magnified view of the local structure at point C.

[0033] Figure 6 The present invention Figure 3 A magnified view of the local structure at point D.

[0034] Figure 7 It is a schematic diagram of the internal structure of the glue storage box of the present invention.

[0035] Figure 8 It is a flow chart of the steps of the electronic component packaging method of the present invention.

[0036] 1-base, 2-glue storage box, 3-feed pipe, 4-electronic components, 5-substrate, 6-stirring claw, 7-pressing plate, 8-vacuum pump, 9-circulation hole, 10-chute, 11-telescopic hose, 12-glue pump, 13-moving pipeline, 14-dispensing head, 15-dispensing lifting component, 16-dispensing telescopic component, 17-rotating component, 18-turntable, 19-control panel, 20-air detector, 21-telescopic rod, 22-stirring drive component, 23-stirring lifting component, 24-pressing lifting component, 25-squeegee traverse component, 26-squeegee lifting component, 27-squeegee telescopic component, 28-camera, 29-infrared sensor, 30-fixed slot, 31-squeegee rotating component, 32-squeegee plate, 33-clamping component, 34-support plate, 35-pressure sensor, 36-rubber protective layer. DETAILED DESCRIPTION

[0037] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0038] See also Figures 1 to 7 The present invention provides an electronic component packaging device, including a base 1, a glue storage box 2, a feed pipe 3, a glue dispensing unit, a placement and rotation unit, an electronic component 4, a substrate 5 and a bubble removal component, the bubble removal component includes a stirring claw 6, a pressing plate 7 and a vacuum pump 8, the pressing plate 7 has a plurality of flow holes 9, and the pressing plate 7 and the stirring claw 6 are both provided with an inclined groove 10, the glue dispensing unit includes a telescopic hose 11, a glue pump 12, a moving pipe 13, a glue dispensing head 14 and an adjustment mechanism, the adjustment mechanism includes a glue dispensing lifting component 15 and a glue dispensing telescopic component 16, the placement and rotation unit includes a rotating component 17 and a turntable 18, and the bubble removal component also includes a control panel 19. An air detector 20 and a telescopic rod 21. The bubble removal component also includes an adjustment unit, which includes a stirring drive component 22, a stirring lifting component 23 and two pressing lifting components 24. The bubble removal component also includes a scraper unit, which includes a scraper transverse moving component 25, a scraper lifting component 26, a scraper telescopic component 27, a scraper rotating mechanism, a camera 28 and an infrared sensor 29. The scraper rotating mechanism includes a fixing groove 30, a scraper rotating component 31 and a scraper plate 32. The bubble removal component also includes two clamping units, which include a clamping component 33, a support plate 34, a pressure sensor 35 and a rubber protective layer 36.

[0039] In which, the glue storage box 2 is placed above the base 1, the feed pipe 3 is connected to the top of the glue storage box 2, the dispensing unit is connected to one side of the glue storage box 2, the placement and rotation unit is arranged on the base 1, the substrate 5 is placed on the placement and rotation unit, the electronic component 4 is placed above the substrate 5, the pressing plate 7 has a plurality of flow holes 9, and the pressing plate 7 and the stirring claw 6 are both provided with an inclined groove 10, the stirring claw 6 is arranged inside the glue storage box 2, the pressing plate 7 is arranged inside the glue storage box 2, and is sleeved on the outside of the stirring claw 6, the stirring claw 6 and the pressing plate 7 are adapted to each other, and the vacuum pump 8 is arranged above the glue storage box 2. The pressing plate 7 is provided with a through hole in the middle, which is adapted to the stirring claw 6; a valve is installed on the feeding tube 3, and glue is added to the feeding tube 3 to place the electronic component 4 on the substrate 5; the stirring claw 6 stirs the glue, and the pressing plate 7 is pressed down, and moves down together with the stirring claw 6 to press the glue, or speeds up the lifting and lowering speed to beat the glue to expel internal bubbles; after the pressing plate 7 is pressed down, the glue flows out from the circulation hole 9, and then passes through the inclined groove 10 and returns to the bottom of the glue storage box 2, and repeats this process; the vacuum pump 8 is started to extract the air inside the glue storage box 2 to avoid repeated formation of bubbles; the glue dispensing unit is started to dispense glue to the connection between the electronic component 4 and the substrate 5; the placement rotation unit drives the electronic component 4 and the substrate 5 to rotate and adjust the angle until the glue dispensing operation is completed; the electronic component 4 and the substrate 5 are taken out for subsequent curing and testing, and finally the packaging is completed.

[0040] Secondly, the glue pump 12 is provided on one side of the glue storage box 2, and the two ends of the telescopic hose 11 are respectively connected to the glue pump 12 and one end of the mobile pipe 13, and the other end of the mobile pipe 13 is connected to the glue dispensing head 14. The adjustment mechanism is provided on the glue dispensing head 14. The adjustment mechanism drives the mobile pipe 13 to move so that the glue dispensing head 14 approaches the connection between the electronic component 4 and the substrate 5. At the same time, the telescopic hose 11 is adjusted to extend and contract, and then the glue pump 12 is started to extract glue from the glue storage box 2 for dispensing.

[0041] At the same time, the dispensing lifting component 15 is arranged above the base 1, and the dispensing telescopic component 16 is arranged at the output end of the dispensing lifting component 15. The output end of the dispensing telescopic component 16 is fixedly connected to the dispensing head 14. The dispensing lifting component 15 is an electric slide rail, and the dispensing telescopic component 16 is a cylinder. When the dispensing lifting component 15 is activated, the dispensing telescopic component 16 is driven up and down to adjust the dispensing height. At the same time, when the dispensing telescopic component 16 is activated, the dispensing head 14 is extended to adjust the front and rear dispensing distance.

[0042] In addition, the rotating component 17 is disposed below the base 1. The output end of the rotating component 17 passes through the base 1 and is fixedly connected to the turntable 18. The turntable 18 is rotatably connected to the base 1, and the substrate 5 is placed above the turntable 18. The rotating component 17 is a self-locking motor; when the rotating component 17 is started, it drives the turntable 18 to rotate, thereby adjusting the dispensing position.

[0043] Then, the control panel 19 is set on one side of the base 1, the air detector 20 is set on the inner top wall of the glue storage box 2, and the two ends of the telescopic rod 21 are fixedly connected to the mobile pipe 13 and one side of the glue storage box 2 respectively. The control panel 19 is electrically connected to various devices, and the staff can perform glue dispensing operations by operating the control panel 19. The air detector 20 detects the air content inside the glue storage box 2. When the air content is detected to be over 1%, the vacuum pump 8 is started; or when the glue is stirred and pressed, the vacuum pump 8 is continuously started, thereby timely expelling the air in the glue to prevent the formation of bubbles again. In addition, when the mobile pipe 13 moves, the telescopic rod 21 is extended and retracted to maintain the stability of the mobile pipe 13.

[0044] Furthermore, the adjustment unit includes a stirring drive component 22, a stirring lifting component 23, and two pressing lifting components 24. The stirring drive component 22 is disposed on the inner top wall of the glue storage box 2. The stirring lifting component 23 is fixedly connected to the output end of the stirring drive component 22. The output end of the stirring lifting component 23 is fixedly connected to the stirring claw 6. The two pressing lifting components 24 are sequentially disposed above the glue storage box 2. The output ends of the two pressing lifting components 24 both pass through the glue storage box 2 and are fixedly connected to the pressing plate 7. The stirring drive component 22 is a motor, the stirring lifting component 23 is a cylinder, and the pressing lifting component 24 is a cylinder. The stirring drive component 22 drives the stirring claw 6 to rotate, stirring the glue and helping to expel bubbles. The pressing lifting component 24 is activated, driving the pressing plate 7 to move downward.

[0045] Furthermore, the scraper unit is arranged on the base 1; the scraper lateral movement component 25 is arranged above the base 1, the scraper lifting component 26 is arranged at the output end of the scraper lateral movement component 25, the scraper telescopic component 27 is arranged at the output end of the scraper lifting component 26, the scraper rotation mechanism is arranged at the output end of the scraper telescopic component 27, and the camera 28 and the infrared sensor 29 are both arranged on the scraper rotation mechanism. The scraper lateral movement component 25 is an electric slide rail, the scraper lifting component 26 is an electric slide rail, and the scraper telescopic component 27 is a cylinder; the scraper lateral movement component 25 and the scraper lifting component 26 cooperate to adjust the scraper position laterally and vertically, the scraper rotation mechanism can adjust the scraper angle, and the scraper telescopic component 27 can be activated to adjust the front and rear position of the scraper. The camera 28 and the infrared sensor 29 capture the scraper position and transmit the information to the control panel 19, which moves to the appropriate scraper position after calculation.

[0046] Thus, the fixed groove 30 is fixedly connected to the output end of the scraper telescopic component 27, the scraper rotating component 31 is disposed on one side of the fixed groove 30, the scraper plate 32 is rotatably connected to the fixed groove 30 and is located inside the fixed groove 30, the output end of the scraper rotating component 31 is fixedly connected to the scraper plate 32, and the camera 28 and the infrared sensor 29 are symmetrically disposed on both sides of the scraper plate 32. The fixed groove 30 supports the scraper rotating component 31, which is a self-locking motor. When the scraper rotating component 31 is started, it drives the scraper plate 32 to rotate, adjusts the scraping angle, and relies on the scraper plate 32 to scrape glue from the glue application areas of the electronic component 4 and the substrate 5, smoothing the glue after application, thereby improving the quality of glue application, ensuring glue application uniformity, and further removing bubbles formed during glue application.

[0047] Finally, the two clamping units are symmetrically arranged on the base 1; the clamping component 33 is arranged above the base 1 and located on one side of the turntable 18. The output end of the clamping component 33 is fixedly connected to the support plate 34. The pressure sensor 35 is arranged on one side of the support plate 34, and the rubber protective layer 36 is arranged on one side of the pressure sensor 35. The clamping component 33 is a pneumatic cylinder. When the clamping component 33 is activated, it drives the support plate 34 to move, contacting the substrate 5 through the rubber protective layer 36, thereby clamping and fixing the substrate 5 to prevent displacement. The pressure sensor 35 detects the clamping pressure to prevent damage to the substrate 5 due to excessive clamping force.

[0048] When using an electronic component packaging device of the present embodiment, glue is added to the feed tube 3 and the electronic component 4 is placed on the substrate 5; the stirring claw 6 stirs the glue, and after the stirring is completed, the pressing plate 7 and the stirring claw 6 are moved to the same horizontal line, and then the pressing plate 7 is pressed down, and the stirring claw 6 moves down together to press the glue, so that the glue flows out from the circulation hole 9, and then returns to the bottom of the glue storage box 2 through the inclined groove 10, squeezing out the bubbles inside the glue; after the extrusion is completed, the lifting speed of the pressing plate 7 is accelerated, and the glue is patted to discharge the internal bubbles; at the same time, the vacuum pump 8 is started to extract the air inside the glue storage box 2 to avoid repeated formation of bubbles; the regulating machine is started The structure adjusts the position of the dispensing head 14, and then starts the glue pump 12 to extract glue and dispense glue to the connection between the electronic component 4 and the substrate 5; the turntable 18 rotates, driving the electronic component 4 and the substrate 5 to rotate and adjust the angle until the dispensing operation is completed; at this time, the scraper 32 is used to scrape the glue on the dispensing points of the electronic component 4 and the substrate 5, so as to flatten the glue after dispensing, thereby improving the dispensing quality, ensuring the uniformity of dispensing, and further discharging bubbles formed during dispensing; through the above-mentioned structural setting, the stored glue is stirred, pressed and patted, and the air in the glue storage box 2 is extracted at the same time, so as to effectively avoid the formation of bubbles during dispensing, thereby greatly improving the dispensing quality and effect.

[0049] See also Figure 8 The present invention also provides an electronic component packaging method, comprising the following steps:

[0050] S1: Add glue to the feed pipe 3 and place the electronic component 4 on the substrate 5;

[0051] S2: The stirring claw 6 stirs the glue, and the pressing plate 7 presses down, moving downward together with the stirring claw 6 to press the glue, or speeding up the lifting and lowering speed to beat the glue to expel internal bubbles;

[0052] S3: After the pressing plate 7 is pressed down, the glue flows out from the circulation hole 9, and then returns to the bottom of the glue storage box 2 through the chute 10, and the process repeats.

[0053] S4: The vacuum pump 8 is started to extract the air inside the glue storage box 2 to prevent bubbles from forming repeatedly;

[0054] S5: Starting the dispensing unit to dispense glue on the connection between the electronic component 4 and the substrate 5;

[0055] S6: The placement and rotation unit drives the electronic component 4 and the substrate 5 to rotate and adjust the angle until the dispensing operation is completed;

[0056] S7: The electronic component 4 and the substrate 5 are taken out for subsequent curing and testing, and finally the packaging is completed.

[0057] Among them, the feed tube 3 adds glue and places the electronic component 4 on the substrate 5; the stirring claw 6 stirs the glue, and the pressing plate 7 is pressed down, and moves down together with the stirring claw 6 to press the glue, or speeds up the lifting and lowering speed to beat the glue to expel internal bubbles; after the pressing plate 7 is pressed down, the glue flows out from the circulation hole 9, and then passes through the inclined groove 10 and returns to the bottom of the glue storage box 2, and repeats this process; the vacuum pump 8 is started to extract the air inside the glue storage box 2 to avoid repeated formation of bubbles; the glue dispensing unit is started to dispense glue to the connection between the electronic component 4 and the substrate 5; the placement rotation unit drives the electronic component 4 and the substrate 5 to rotate and adjust the angle until the glue dispensing operation is completed; the electronic component 4 and the substrate 5 are taken out for subsequent curing and testing, and finally the packaging is completed.

[0058] The above disclosure is merely one or more preferred embodiments of the present application and is not intended to limit the scope of the present application. A person skilled in the art will understand that all or part of the processes of the above embodiments and equivalent changes made in accordance with the claims of the present application are still within the scope of the present application.

Claims

1. An electronic component packaging device, comprising a base, a glue storage box, a feed pipe, a glue dispensing unit, a placement and rotation unit, an electronic component, and a substrate, wherein the glue storage box is placed above the base, the feed pipe is connected to the top of the glue storage box, the glue dispensing unit is connected to one side of the glue storage box, the placement and rotation unit is arranged on the base, the substrate is placed on the placement and rotation unit, and the electronic component is placed above the substrate, characterized in that: Also includes a bubble removal assembly; The debubble assembly includes a stirring claw, a pressing plate and a vacuum pump, the pressing plate having a plurality of flow holes, an inclined groove above the pressing plate and the stirring claw, the stirring claw is arranged inside the glue storage box, the pressing plate is arranged inside the glue storage box and sleeved on the outside of the stirring claw, the stirring claw and the pressing plate are adapted to each other, and the vacuum pump is arranged above the glue storage box; The dispensing unit includes a telescopic hose, a glue pump, a mobile pipe, a glue dispensing head and an adjustment mechanism. The glue pump is arranged on one side of the glue storage box. The two ends of the telescopic hose are respectively connected to the glue pump and one end of the mobile pipe. The other end of the mobile pipe is connected to the glue dispensing head. The adjustment mechanism is arranged on the glue dispensing head. The bubble removal assembly further includes a scraper unit, and the scraper unit is disposed on the base; The scraper unit includes a scraper transverse moving component, a scraper lifting component, a scraper telescopic component, a scraper rotation mechanism, a camera and an infrared sensor. The scraper transverse moving component is arranged above the base, the scraper lifting component is arranged at the output end of the scraper transverse moving component, the scraper telescopic component is arranged at the output end of the scraper lifting component, the scraper rotation mechanism is arranged at the output end of the scraper telescopic component, and the camera and the infrared sensor are both arranged on the scraper rotation mechanism; The electronic component is placed on the substrate; the stirring claw stirs the glue, the pressing plate is pressed down, and the stirring claw moves down together to press the glue, or the lifting speed is increased to beat the glue to expel internal bubbles; after the pressing plate is pressed down, the glue flows out from the circulation hole, and then returns to the bottom of the glue storage box through the chute, and this process is repeated; the vacuum pump is started to extract the air inside the glue storage box to avoid the repeated formation of bubbles; the glue dispensing unit is started to dispense glue to the connection between the electronic component and the substrate; the placement rotation unit drives the electronic component and the substrate to rotate and adjust the angle until the glue dispensing operation is completed; The electronic components and the substrate are taken out for subsequent curing and testing, and finally the packaging is completed.

2. The electronic component packaging device according to claim 1, wherein: The adjustment mechanism includes a dispensing lifting component and a dispensing telescopic component. The dispensing lifting component is arranged above the base, and the dispensing telescopic component is arranged at the output end of the dispensing lifting component. The output end of the dispensing telescopic component is fixedly connected to the dispensing head.

3. The electronic component packaging device according to claim 2, wherein: The rotating unit includes a rotating component and a turntable. The rotating component is arranged below the base. The output end of the rotating component passes through the base and is fixedly connected to the turntable. The turntable is rotatably connected to the base, and the substrate is placed above the turntable.

4. The electronic component packaging device according to claim 3, wherein: The bubble removal assembly also includes a control panel, an air detector and a telescopic rod. The control panel is arranged on one side of the base, the air detector is arranged on the inner top wall of the glue storage box, and the two ends of the telescopic rod are respectively fixedly connected to the movable pipe and one side of the glue storage box.

5. The electronic component packaging device according to claim 4, wherein: The debubble assembly also includes an adjustment unit, which includes a stirring drive component, a stirring lifting component and two pressing lifting components. The stirring drive component is arranged on the inner top wall of the glue storage box, the stirring lifting component is fixedly connected to the output end of the stirring drive component, and the output end of the stirring lifting component is fixedly connected to the stirring claw. The two pressing lifting components are sequentially arranged above the glue storage box, and the output ends of the two pressing lifting components both pass through the glue storage box and are fixedly connected to the pressing plate.

6. The electronic component packaging device according to claim 5, wherein: The scraper rotation mechanism includes a fixed groove, a scraper rotating component and a scraper plate. The fixed groove is fixedly connected to the output end of the scraper telescopic component. The scraper rotating component is arranged on one side of the fixed groove. The scraper plate is rotatably connected to the fixed groove and is located inside the fixed groove. The output end of the scraper rotating component is fixedly connected to the scraper plate. The camera and the infrared sensor are symmetrically arranged on both sides of the scraper plate.

7. The electronic component packaging device according to claim 6, wherein: The debubble assembly further includes two clamping units, which are symmetrically arranged on the base; The clamping unit includes a clamping component, a support plate, a pressure sensor and a rubber protective layer. The clamping component is arranged above the base and located on one side of the turntable. The output end of the clamping component is fixedly connected to the support plate. The pressure sensor is arranged on one side of the support plate, and the rubber protective layer is arranged on one side of the pressure sensor.

8. An electronic component packaging method, using the electronic component packaging device according to claim 7, characterized in that: The steps include: Add glue to the feed tube and place the electronic component on the substrate; The stirring claw stirs the glue, and the pressing plate presses down and moves down together with the stirring claw to press the glue, or accelerates the lifting speed to beat the glue to expel internal bubbles; After the pressing plate is pressed down, the glue flows out from the flow hole and then returns to the bottom of the glue storage box through the chute, and the process repeats. The vacuum pump is started to extract the air inside the glue storage box to avoid repeated formation of bubbles; Starting the dispensing unit to dispense glue on the connection between the electronic component and the substrate; The placement and rotation unit drives the electronic component and the substrate to rotate and adjust the angle until the dispensing operation is completed; The electronic components and the substrate are taken out for subsequent curing and testing, and finally the packaging is completed.

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