Raw material comprising hyphae, products produced therefrom, and methods of forming products therefrom

Abstract

The feedstock for molding may include a plurality of feed components. The plurality of feed components may comprise hyphae. The feedstock may further include a binder. The plurality of feed components may be coated and / or impregnated with the adhesive. The adhesive, when activated, may be adapted to bond the plurality of feed components together. Methods of making the feedstock and methods for making products formed from the feedstock are also disclosed.

Description

Technical Field

[0001] The present invention relates to a raw material comprising mycelium for molding and products produced therefrom, a method of molding the raw material, and a method of preparing the raw material. Background Art

[0002] Mycelium-based materials can be used to mold products. The raw materials may include a strain that may require a pre-growth period that may last for multiple days. After the pre-growth is complete, the strain is then placed into a mold where the mycelium grows into a molded shape defined by the mold over another multiple day period. Therefore, the amount of time between the preparation of the strain and the production of the molded product can be quite long. The requirement for the strain to grow for multiple days within the mold also severely limits production throughput.

[0003] Mycelium-colonized particles and / or fibers can be used as feedstock for a hot press mold. When the feedstock is pressed in the mold, the water in the feedstock evaporates and saturates the naturally occurring glucan within the fungal cell wall. This allows the glucan to flow like a resin to bind the feedstock into a molded shape.

[0004] Although pellet / fiber based feedstocks can provide increased throughput compared to feedstocks that need to be grown in a mold for a period of time, pellet / fiber based feedstocks also have several disadvantages. For example, they must contain at least 40% moisture content so that when molded in a heated platen press, sufficient steam is generated to allow the glucan to flow. This moisture content significantly increases the overall density of the feedstock and makes the feedstock more expensive to transport and handle due to the increased weight. High moisture content can also limit the shelf life of pellet / fiber based feedstocks by allowing bacteria or other fungi to colonize and contaminate the feedstock.

[0005] While particle / fiber based feedstocks can be dehydrated and processed using a steam injection heated platen press, this can also present disadvantages. First, the need to inject steam into a heated platen press limits the number and variety of molds that particle / fiber based feedstocks are compatible with. Second, while the feedstock can be initially dehydrated, it will immediately begin to absorb moisture from the atmosphere following the dehydration process. As a result, the feedstock will gradually become denser and more amenable to contamination by bacteria or fungi, increasing shipping / handling costs and shortening the shelf life of the feedstock. Summary of the invention

[0006] In some configurations, the raw material for molding may include a plurality of feed components containing mycelium; and a binder; wherein: the plurality of feed components are coated and / or impregnated with the binder, and the binder is suitable for bonding the plurality of feed components together when activated.

[0007] Further configurations may be achieved according to any of the dependent claims.

[0008] In a further configuration, a method of forming a product may include providing a feedstock to a mold, the feedstock comprising a plurality of feed components containing mycelium, the plurality of feed components being coated and / or impregnated with a binder, molding the feedstock, and before, after, or during molding of the feedstock, activating the binder to bond the plurality of feed components together.

[0009] Further configurations may be achieved according to any of the dependent claims.

[0010] In a further configuration, a method of producing a feedstock for molding may include preparing a plurality of feed components comprising mycelium, and coating and / or impregnating the plurality of feed components with a binder; wherein the binder is suitable for binding the plurality of feed components together when activated.

[0011] Further configurations may be achieved according to any of the dependent claims.

[0012] In a further configuration, a method of producing a feedstock for molding may include colonizing a growth substrate with mycelium, the growth substrate comprising a binder distributed throughout the growth substrate; and processing the colonized growth substrate to produce a plurality of feed components; wherein the binder is distributed in each feed component, and wherein the binder is suitable for bonding the plurality of feed components together when activated.

[0013] Further configurations may be achieved according to any of the dependent claims.

[0014] In a further configuration, a method of producing a feedstock for molding may include preparing a plurality of feed components by colonizing a plurality of growth substrates with mycelium, each growth substrate comprising a binder distributed throughout the growth substrate; wherein the binder is distributed in each feed component, and wherein the binder is suitable for bonding the plurality of feed components together when activated.

[0015] Further configurations may be achieved according to any of the dependent claims.

[0016] In a further configuration, a method for continuously producing a feed component may include providing a growth material to an extrusion line, colonizing the growth material with a fungal inoculum, wherein the colonized growth material is maintained in-line, allowing mycelium to grow throughout the colonized growth material to produce a feed component material, and extruding the feed component material.

[0017] Further configurations may be achieved according to any of the dependent claims.

[0018] In a further configuration, a shaped product molded at least in part from a feedstock may include: a plurality of feed components including mycelium, and a binder; wherein the plurality of feed components are bound together by the binder.

[0019] Further configurations may be achieved according to any of the dependent claims.

[0020] It is understood that the terms "comprises," "comprising," and "containing" may be given exclusive or inclusive meanings in different jurisdictions. For the purposes of this specification, unless otherwise indicated, these terms are intended to have an inclusive meaning—that is, they will be understood to mean including the listed components directly referenced when used, and may also include other unspecified components or elements.

[0021] The reference to any document in this specification does not constitute an admission that it is prior art, can be effectively combined with other documents or forms part of the common general knowledge. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate examples of the invention and, together with the summary of the invention given above and the detailed description of the examples given below, serve to explain the principles of the invention, in which:

[0023] Figure 1 A schematic diagram depicting the raw materials used for molding.

[0024] Figure 2 Depicted Figure 1 Schematic diagram of the raw material during the molding process.

[0025] Figure 3 An example of a method of molding stock is depicted.

[0026] Figure 4 Examples of methods of preparing feedstocks are depicted.

[0027] Figure 5 Another example of a method of preparing a feedstock is depicted.

[0028] Figure 6 Another example of a method of preparing a feedstock is depicted.

[0029] Figure 7 An example of an extrusion system for continuous production of feedstock is depicted. DETAILED DESCRIPTION

[0030] Raw materials for molding

[0031] Figure 1A schematic diagram of an example of a feedstock 1 for molding is depicted. The feedstock 1 may include a plurality of feed components 10 including mycelium. The feedstock 1 may further include a binder 20. The plurality of feed components 10 may be coated and / or impregnated with the binder 20, which, when activated, may be suitable for bonding the plurality of feed components 10. The feedstock 1 is depicted as having been placed in a mold 98 for molding.

[0032] In this particular illustration, the binder 20 is schematically represented as an exaggerated coating around each feed component 10, but it should be understood that the respective proportions of the feed components 10 and the coating of the binder 20 may vary. Furthermore, in other examples, the feed components 10 may have little or no coating of the binder 20, while the binder 20 is substantially or completely impregnated within each feed component 10.

[0033] The raw material 1 can be suitable for molding into a shaped shape, and once the binder is activated, the plurality of individual feed components are bonded together by the binder. As described in more detail herein, the binder can be activated before, during or after molding of the raw material 1.

[0034] Figure 2 A schematic diagram of a feedstock after activation of a binder 20 in a mold 98 is depicted. A press plate 99 has formed the feedstock into a shape defined by the mold. In this particular illustration, the activated binder 20 is depicted as a matrix in which the feedstock components 10 are embedded. It should be understood that this is exaggerated for illustrative purposes and is not limiting; although in some examples of feedstocks, the activated binder 20 may form a matrix, the relative sizes and / or volumes of the activated binder 20 and the feedstock components 10 may be different. In other examples, the activated binder 20 may not substantially form a matrix after activation (e.g., if the binder 20 does not melt or flow when activated).

[0035] The feed component 10 is typically a discrete component comprising a growth substrate that has been intentionally colonized by one or more fungi. The one or more colonizing fungi can be grown so that the feed component comprises mycelium or hyphae. Several exemplary methods for producing the feed component are described in more detail herein.

[0036] exist Figure 1 and 2 In the schematic diagram of , the feed component 10 is generally pelletized and may have a diameter of about 0.1 cm to 1 cm. However, it should be understood that this is not a limitation. The shape and / or size of the feed component 10 may vary depending on the shape and / or size of the final molded product, the size and / or shape of the mold, the properties of the matrix used to produce the feed component 10, and other factors. For example, if the matrix contains discrete components (e.g., wood chips), the size of these discrete components may determine the minimum size of the feed component 10.

[0037] In some examples, feed components 10 may take the form of pellets, granules, powders, sheets, chunks, chips, spheres, microparticles, chips, shavings, and / or flakes. The shape and size of feed components 10 may depend at least on the desired application of feedstock 1.

[0038] For example, if the shaped product to be produced by the molding process has complex features requiring high resolution, the feed components 10 may be small pellets or granules such that when the feedstock 1 is molded, the size of the feed components 10 is such that the features are adequately resolved.

[0039] In another example, if the formed product is a flat planar structure (e.g., a sheet material for construction or insulation applications), the feed component 10 can be a sheet of material. In still other examples, the feed component 10 of the raw material 1 can have any combination of different shapes and sizes. For example, in addition to granules or pellets, the feed component 10 can also include a planar sheet of material.

[0040] Adhesives

[0041] Once activated, the adhesive 20 can bond the feed components 10 together. For example, the adhesive 20 can be cross-linked and / or heat-cured when activated. In other examples, the adhesive 20 can be or act as a hot melt adhesive. Once the raw material 1 has been molded, the adhesive 20 can also affect the material properties of the feed components 10 and / or the molded product. Exemplary adhesives 20 can include thermoplastics (such as PBAT or PETG), PLA, PBS, PPS, bio-polyethylene and bio-plastics.

[0042] The feed component 10 may be coated and / or impregnated with the binder 20. In some examples, the feed component 10 may be prepared without any initial binder present in the growth substrate, and may subsequently be post-processed to coat and / or impregnate the feed component 10 with the binder 20. For example, the binder 20 may be applied to the feed component 10 by spraying, rolling, immersing, or soaking the feed component 10 with the binder 20.

[0043] The duration of treatment of the feed component 10, the amount of binder 20 used during treatment, and the properties of the feed component 10 and binder 20 (e.g., their absorbency and viscosity, respectively) may at least partially determine the extent to which the feed component 10 is impregnated with the binder 20 (and / or the extent to which the feed component 10 is coated with the binder 20). In some examples, the feed component 10 may be substantially free of a coating, with most or all of the binder 20 impregnated within the feed component 10.

[0044] For example, the feed component 10 may be treated by lightly spraying the feed component with the binder 20 such that the treated feed component 10 is only lightly or partially coated with the binder 20. In other examples, the feed component 10 may be soaked in a sufficient amount of the binder 20 for a sufficient period of time such that the binder 20 saturates a substantial portion of the feed component 10 and / or is applied as a relatively thick coating on the feed component 10. The feed component 10 may also or alternatively be coated in a sufficiently thick layer to effectively create a matrix of the binder 20 in which the feed component 10 is embedded.

[0045] In other examples, the feed component 10 may not be processed separately with the binder 20, and may be prepared with the binder 20 already dispersed throughout the feed component 10. For example, the binder 20 may be initially incorporated into a growth substrate that may be colonized by fungi to produce the feed component 10, as described herein.

[0046] Furthermore, in some examples, a combination of multiple types of binders 20 may be used. A combination of treatment processes (eg, spraying, rolling, dipping) may also be used to coat and / or impregnate the feed component 10 with the binder 20 (or multiple binders).

[0047] The details of the activation of the adhesive 20 may depend on the choice and properties of the adhesive 20. These may depend on the requirements of the raw material 1 and / or the corresponding product formed from the raw material 1.

[0048] In some examples, the adhesive 20 can be selected so that it is activated by heating. For example, the adhesive 20 can be a thermoplastic that melts and activates at a sufficient temperature, and the corresponding raw material 1 can be used in combination with a heated mold. The adhesive 20 can then be activated during the molding of the raw material 1 in the heated mold, thereby bonding the multiple feed components 10 together during the molding process of the raw material 1. This may be advantageous because heat-activated adhesives can be used with conventional molds (for example, polystyrene) without any significant modifications.

[0049] In other examples, adhesive 20 can have a different activation mechanism. For example, adhesive 20 can be selected so that it is activated by pressure, chemical catalysis, radiation curing, and / or ultraviolet curing. In other examples, adhesive 20 can be activated by one or more mechanisms that can be used as alternatives, or can be activated by a combination of multiple mechanisms (e.g., both heat and pressure).

[0050] Furthermore, in some examples, adhesive 20 may be activated before, during, or after the molding process, as described in greater detail herein.

[0051] In some examples, adhesive 20 can be compostable and / or biodegradable. Because feed component 10 itself can be compostable and / or biodegradable, compostable / biodegradable adhesive can be used to produce compostable / biodegradable raw material 1 and / or the formed product made of raw material 1. For example, raw material 1 and / or the formed product made of raw material 1 can be home compostable and / or industrial compostable. For example, in a typical home composting environment, raw material 1 and / or the product made of it may decompose within 45 to 90 days. In other examples, in a typical home composting environment, raw material 1 and / or the product made of it may decompose within up to 6 months. In still other examples, in a typical home composting environment, raw material 1 and / or the product made of it may decompose within up to 12 months.

[0052] The raw material 1 and / or the shaped products made from the raw material 1 can also be certified to be compostable and / or biodegradable. For example, the raw material 1 and / or the shaped products made therefrom can comply with EN 13432, ASTM D6400 and / or AS4736 standards.

[0053] For example, the adhesive 20 can be compostable, so that the adhesive 20, the feedstock 1 and / or the shaped products made from the feedstock can be quickly decomposed. This can be particularly advantageous if the feedstock 1 is used, for example, to produce packaging materials as a replacement for polystyrene or other conventional plastic-based packaging materials. Conventional plastic-based packaging materials have a serious impact on the environment and present an ongoing waste management problem. The feedstock 1 can also be used to produce alternative materials for other applications that use polystyrene.

[0054] The bonding between the feed components 10 due to the activation of the binder 20 can produce a much stronger bond between the feed components 10 than would otherwise be achievable without the binder 20, which means that the feedstock 1 can be used to produce shaped products with greater strength and favorable properties compared to mycelium-based feedstocks lacking an activated binder. Furthermore, the material properties of the binder 20 can affect the material properties of shaped products produced from the feedstock 1 independently of the increased mechanical bonding between the feed components 10.

[0055] For example, the inclusion of binder 20 can increase the material strength of a product formed at least in part from feedstock 1. The shaped product can have higher impact resistance and / or higher shock absorption than a shaped product produced using a mycelium-based feedstock lacking an activated binder. Similarly, products formed from feedstock 1 can have higher sound and / or thermal insulation, and can also or alternatively be hydrophobic and / or fire resistant.

[0056] Binder 20 can also affect the rate at which raw material 1 absorbs moisture from the atmosphere and / or the maximum moisture content of raw material 1. In the example of raw material 1, where feed components 10 are first prepared before coating and / or impregnation with binder 20 (this is discussed herein), feed components 10 can be dehydrated until they are substantially free of residual moisture or have a relatively low moisture level (by weight). If feed components 10 are exposed to ambient conditions for a long enough time, they will gradually absorb moisture from the atmosphere. This will increase the density of feed components 10 (thereby increasing the costs associated with transportation / handling of raw materials), and will also reduce the shelf life of feed components 10, because relatively high moisture content will allow bacteria and other unexpected fungi to contaminate feed components 10.

[0057] To this end, the binder 20 can function to retard or prevent the absorption of atmospheric moisture by the feed component 10. For example, the binder 20 can act as an impermeable coating for the feed component 10, thereby preventing the feed component 10 from absorbing atmospheric moisture. The binder 20 can also plasticize and / or waterproof a certain volume of the feed component 10 by impregnating the feed component 10, thereby preventing the absorption of atmospheric moisture.

[0058] Due to the inclusion of the binder 20, the raw material 1 can have a moisture content of substantially equal to or less than 20% by weight; substantially equal to or less than 10% by weight; and / or substantially about 0% by weight. In addition, the moisture content of the raw material 1 may not increase over time. Since moisture absorption is prevented by the binder 20, the shelf life of the raw material 1 can be virtually indefinite.

[0059] From raw materials to products

[0060] The feedstocks described herein may be suitable for molding or forming into shaped products. Figure 3 Example methods of forming products are depicted.

[0061] A feedstock is provided to a mold at 300. The feedstock may include a plurality of feed components including mycelium, the plurality of feed components being coated and / or impregnated with a binder.

[0062] Then, at 320, the raw material is molded using a mold. The mold can define a cavity or void occupied by the raw material, thereby producing a molded product having the original shape of the mold. For example, the mold can be a forming mold or a block mold.

[0063] The adhesive may be activated to bond the plurality of feed components together. Activation of the adhesive may occur before the raw material is molded (ie at 310), during the raw material is molded (ie at 330), or after the raw material is molded (ie at 340).

[0064] The final result is a shaped product at least partially molded from a raw material, the shaped product comprising a plurality of feed components containing mycelium and a binder, wherein the plurality of feed components are bound together by the binder. The shape and / or size of the shaped product can be determined by the mold according to the requirements of the shaped product.

[0065] In some examples, the molded product can be post-processed after molding. For example, if the raw material is molded using a block mold, the molded product can be a large, monolithic block of material. The molded block of material can then be cut into sheets or other discrete components. Thus, multiple sheets or other components of custom shapes and sizes can be produced by post-processing the molded product without the need for a dedicated molding mold for each sheet / component.

[0066] The activation mechanism of the adhesive (occurring at 310, 330 or 340) may depend at least in part on the characteristics of the adhesive. As already described, the adhesive may be activated using, for example, heat, pressure, chemical catalysis, radiation curing and / or UV curing.

[0067] For example, the adhesive may be activated by heat and / or pressure, and the mold to which the raw material is provided at 300 may be a heated molding mold. Then, at 330, in the molding process 320, the adhesive may be activated when the heated mold presses the raw material. Then, the molded product removed from the mold contains the activated adhesive and a plurality of feed components bonded together by the activated adhesive.

[0068] In other examples, the binder can be activated by heating, but can also be activated before or after the feedstock is molded. For example, the feedstock 1 can first be molded into a formed shape at 320 before the binder is activated at 340. The formed shape can then be removed from the mold and the binder within the feedstock can be activated at 340 after molding by exposing the formed shape to sufficient heat for a sufficient period of time to sinter, thereby bonding the feedstock components together. Alternatively, if the activated binder / feedstock has sufficient ductility to assume and maintain the shape impressed by the mold at 320, the binder can be activated at 310 before the feedstock is molded.

[0069] Depending on the application of the feedstock, adhesives that are not heat activated may also be activated before, during, or after the molding process at 310, 330, or 340. For example, if the adhesive is activated by UV curing, the feedstock may be molded into a formed shape at 320 before the adhesive is activated. The formed shape may then be removed from the mold and exposed to UV light at 340 to cure and activate the adhesive within the feedstock, thereby bonding the multiple feedstock components together. At 340, the adhesive may similarly be exposed to a chemical catalyst, radiation curing, and / or heat / pressure, depending on the activation mechanism of the adhesive.

[0070] Preparation of feed components and raw materials

[0071] Figure 4 An example method of producing a feedstock for molding is depicted. A plurality of feed components including mycelium may be prepared at 400. The plurality of feed components may then be coated and / or impregnated with a binder at 450. When activated, the binder may be adapted to bind the plurality of feed components together.

[0072] In some examples, the feed components may be prepared at 400 by preparing a growth substrate and allowing one or more fungi to colonize the growth substrate. In other examples, the feed components may be prepared at 400 using other techniques.

[0073] The one or more growth substrates typically comprise organic matter and / or cellulose, which may be prepared at 410. For example, the growth substrate may at least partially comprise shredded cardboard, straw, sawdust, hardwood or softwood chips / fibers or pulp thereof, organic material, sugar cane / bagasse, textiles, and / or coffee grounds. Other organic wastes, such as food waste, dried food / juice fibers, and / or the husks or skins of food (such as rice husks, coconut shells, etc.), may also be at least partially incorporated into the materials used to prepare the growth substrate.

[0074] The material for preparing the growth matrix can also optionally be mixed with one or more nutrients, as at 430. Nutrients can be used to accelerate the mycelial growth of colonization fungi. Mycelium can grow on various nutrients (comprising sugar, starch, lignin, fat, protein and nitrogen). The composition of nutrients can depend on the material for example for forming the growth matrix, for inoculating the fungal strain or the kind of the growth matrix, and the final application of the growth matrix / raw material.

[0075] The materials used to prepare the growth substrate can be pasteurized or sterilized (using a combination of, for example, pressure and heating) at 420, and can be mixed together with nutrients (if applicable) at 430 to produce a growth substrate. The growth substrate can then be inoculated with a strain of fungi that will colonize the growth substrate at 440. Several different genera and species of fungi can be used to colonize the growth substrate, examples of which include turkey tail mushrooms (Trametes versicolor), oyster mushrooms (Pleurotus sp.), and ganoderma (Ganoderma sp.). The selected fungi then colonize and grow throughout the growth substrate, thereby forming a matrix of mycelium and hyphae. The strains can typically grow for 1 to 14 days, although this may depend on several factors, including the size / size of the growth substrate, the fungal strain, the materials and nutrients that make up the growth substrate, etc.

[0076] Once the growth substrate is sufficiently colonized by the selected fungus, the growth substrate can be dehydrated to prevent further growth of the mycelium and to remove moisture from the growth substrate. For example, the growth substrate can be dehydrated in a dehydrator, autoclave, drying oven, or heated conveyor, although other dehydration machines can also be used. The growth substrate can typically be exposed to a temperature of 60°C to 100°C for 4 to 10 hours, although the dehydration temperature and time period can depend at least on the size of the material to be cured, as well as other factors. The final product after dehydration is a feed component containing mycelium that is lightweight and has a low moisture content.

[0077] Then, the feed components prepared at 400 can be coated and / or impregnated with an adhesive at 450. As discussed herein, when activated, the adhesive can be suitable for bonding the multiple feed components together. At 450, any adhesive discussed herein can be used to treat the feed components. The adhesive can be applied to the feed components at 450 by, for example, spraying, rolling, immersing or soaking the prepared feed components with an adhesive. This can be done with the adhesive at room temperature (if the adhesive is liquid at that temperature), or if the adhesive is solid at room temperature, it can be done at an elevated temperature.

[0078] In some examples, the prepared growth substrate can be formed into the final shape of the feed component before the growth substrate is inoculated at 440. For example, if a sheet-shaped planar feed component is to be prepared at 400, the growth substrate can be formed into the shape of the sheet before inoculating the fungus at 440. The fungi can then colonize the growth substrate to produce a feed component having the shape of the growth substrate.

[0079] In other examples, the colonized growth substrate can be processed (e.g., mechanically processed) after inoculation or colonization to produce feed components. For example, if the feed components are desired to be in pellet form, a larger inoculated or colonized growth substrate (e.g., a piece of growth material) can be processed (e.g., chopped or shredded) into multiple smaller pellet-sized substrates. These can then be dehydrated at 400 (once or if fully colonized) to prepare the feed components. Alternatively, at 400, the larger feed components can be processed into smaller feed components after dehydration to produce smaller feed components.

[0080] In other examples, the feedstock for molding can be prepared by incorporating a binder into a growth substrate that is colonized by fungi. Figure 5 An example of this approach is depicted.

[0081] At 500, a plurality of feed components can be prepared by colonizing a plurality of growth substrates with hyphae. Figure 4 In the same manner as 410 and 430, a growth matrix can be prepared using a growth matrix material (prepared at 510) optionally together with nutrients (at 530). If desired, the growth matrix can also be formed into the shape of the final desired feed component. However, the difference in preparation is that a binder is also introduced into the growth matrix material at 515, so that each of the prepared growth matrices in the plurality of growth matrices contains a binder distributed throughout the growth matrix. When activated, the binder can be suitable for bonding the plurality of feed components together.

[0082] For example, at 540, by mixing the adhesive solution into the growth material and / or nutrients before inoculation, the adhesive can be incorporated into the material for the growth matrix. For example, the adhesive can be a water-soluble adhesive (e.g., PVA) that dissolves and mixes throughout the growth material and / or nutrients. Alternatively, the adhesive can be distributed throughout the growth matrix in the form of adhesive particles suspended in the matrix of the growth matrix material and / or nutrients. For example, at 540, before being inoculated by fungi, before being mixed by the growth material and / or nutrients, the adhesive can be granulated or pulverized.

[0083] After the growth substrates have been prepared such that the binder is distributed throughout each growth substrate, at 540, the growth substrates may be inoculated with the inoculum and colonized by the fungi to prepare a plurality of feed components, such as with respect to Figure 4As previously described, after the fungus has grown sufficiently, the colonized growth substrate can be dehydrated to reduce the moisture content of the feed components. Because the binder has been incorporated into the feed components during dehydration, the dehydration process can be modified to prevent premature activation of the binder. For example, if the binder distributed throughout the growth substrate is heat and / or pressure activated, the dehydration process can be carried out at a reduced temperature and / or reduced pressure.

[0084] The end result is a feedstock comprising a plurality of feed components with the binder distributed throughout each feed component. When activated, the binder may be adapted to bind the plurality of feed components together. The feed components do not need to be treated with additional binder since the binder is incorporated into each feed component, although this may be done if desired (e.g., by adding an additional binder coating to the feed components, or by adding a different type of binder to the feedstock).

[0085] In other examples, a larger growth substrate containing a binder can be colonized and processed to produce multiple feed components. Examples of this approach are Figure 6 Depicted in.

[0086] At 600, a growth substrate including an adhesive distributed therein may be colonized by hyphae. The growth substrate may be as described with respect to Figure 5 The growth substrate is initially prepared as described in 510, 515, 520 and 530 of the present invention (i.e., by mixing the growth substrate material (and optional nutrients) with the binder so that the binder is distributed throughout the growth substrate). The growth substrate is then colonized with mycelium by, for example, inoculating the prepared growth substrate with a fungal species (with respect to Figure 5 in a similar manner to 540).

[0087] After the growth substrate is colonized by hyphae, the growth substrate can be processed at 610 to produce a plurality of feed components. For example, the growth substrate colonized at 600 can be a whole or relatively large piece of colonized growth substrate, and the growth substrate can be mechanically chopped or processed into a plurality of smaller components (e.g., pellet-sized components). These can then be dehydrated or processed as previously described to produce a plurality of feed components. Alternatively, a larger growth substrate can be dehydrated or processed before processing the growth substrate.

[0088] The end result is a feedstock comprising a plurality of feed components, each of which comprises a binder distributed therein. When activated, the binder may be suitable for bonding the plurality of feed components together. The feedstock may then be used to mold a shaped product as described herein.

[0089] Continuous production of feed components

[0090] In some examples, feed components for the feedstock can be produced using a continuous process.

[0091] Figure 7 An example of an extrusion system 700 configured for continuous production of feed components is depicted. The extrusion system 700 may include a hopper 710 for feeding materials into an extrusion line 790. The feed material may include materials for a growth substrate and nutrients for fungal growth. If desired, a binder may also be introduced into the feed material / hopper 710. Although Figure 7 A single hopper 710 is depicted in FIG, but other extrusion systems may include multiple hoppers. Other examples of extrusion systems may use other devices to introduce feed material (eg, an auger).

[0092] The extrusion system 700 may include one or more grinders or mixers 720 downstream of the hopper 710. The grinder or mixer 720 may be configured to grind or mix feed materials introduced into the extrusion line 790 via the hopper 710. Similarly, the extrusion system 700 may include an in-line sterilization unit 730 for sterilizing the materials provided to the extrusion line 790 by the hopper 710. For example, the sterilization unit 730 may include a heating unit, an autoclave, or other devices suitable for sterilizing the materials fed by the hopper 710. The grinder or mixer 720 and the sterilization unit 730 may be omitted in some examples of the extrusion system 700, where pre-ground, pre-mixed, and / or pre-sterilized materials are provided exclusively to the extrusion line 790.

[0093] The extrusion system 700 can further include an inoculator 740 downstream of the sterilization unit 730. The inoculator 740 can be configured to inoculate the material provided to the extrusion line 790 with a fungal inoculant. For example, the inoculator 740 can include a feed unit 745 that stores a reservoir of bacterial strains that can be gradually introduced into the extrusion line 790. In some examples, the bacterial strains can include grain strains and / or liquid strains. If desired, the strains or other fungal inoculants introduced into the extrusion line 790 can be mixed with the feed material using a mixer 750. If desired, the inoculator 740 can also include a water source, such as a sprayer ( Figure 7 not depicted in Figure 3) to increase the moisture content of the inoculated feed material.

[0094] The extrusion system can further include a plurality of growth lines 760 downstream of the inoculator 740. The growth lines 760 can be configured to store the colonized growth material, which remains in the line while the fungal inoculum colonizes the growth material. Then, as the colonized growth material gradually moves downstream through the growth lines 760, hyphae can grow throughout the colonized growth material.

[0095] The plurality of growth lines 760 can be configured so that once the colonized growth material present in a given growth line 760 reaches the end of the growth line 760, the mycelium has grown sufficiently so that the colonized growth material can be used as a feed component material. The feed component material can then be extruded from the growth line 760 and can be processed (e.g., chopped) into the desired size of the feed component for the raw material. The processed feed material can then be cured or dehydrated to produce the feed component. These can then be processed to be coated and / or impregnated with an adhesive. Alternatively, if the adhesive has been introduced into the feed material through the hopper 710, the feed component may not need to be processed with an adhesive.

[0096] Thus, the extrusion system 700 can be used to continuously produce feed components. The growth material can be provided to the extrusion line by the hopper 710 or other means. The growth material can then be colonized with the fungal inoculum provided by the inoculator 740. With the colonized growth material remaining online, mycelium can grow throughout the colonized growth material to produce feed component materials. The feed component materials can then be extruded from the extrusion line 790.

[0097] In summary, the feedstocks for molding disclosed herein can be transported to a production site and processed in a mold within minutes because they do not require any pre-growth period or growth within the mold. In contrast, other types of mycelium-based feedstocks must be injected or placed in a mold prior to mycelium growth, which requires time and resources.

[0098] The feedstock can be lightweight and, due to the presence of a binder within the feedstock, can have a very long (or even indefinite) shelf life. In contrast, other mycelium-based feedstocks processed directly in a mold can have a high moisture content, which can shorten shelf life and increase shipping and handling expenses. The binder can also increase the material strength of the product formed from the feedstock and can alter or enhance other material properties of the resulting product.

[0099] In applications where polystyrene or other plastics are traditionally used, the raw materials can be used to make alternative materials (such as packaging materials). However, the raw materials and products produced therefrom can be biodegradable and / or compostable, which is a significant advantage over conventional polystyrene or plastic-based materials. In addition, the raw materials disclosed herein can be adapted to existing molds and / or tools, including conventional molds for molding polystyrene. The raw materials can also be used in other applications that do not traditionally use polystyrene.

[0100] Although the present invention has been illustrated by the description of its embodiments, and the embodiments have been described in detail, applicants do not intend to limit or in any way restrict the scope of the appended claims to such details. Additional advantages and modifications will be readily apparent to those skilled in the art. Therefore, the present invention in its broader aspects is not limited to the specific details, representative apparatus and methods, and illustrative examples shown and described. Therefore, departures from these details may be made without departing from the spirit or scope of applicants' overall inventive concept.

Claims

1. A raw material for molding, comprising: a plurality of feed components comprising mycelium; and Adhesives, wherein: The plurality of feed components are coated and / or impregnated with the binder, and The binder, when activated, is adapted to bind the plurality of feed components together.

2. The feedstock of claim 1, wherein the feed components at least partially comprise pellets.

3. A feedstock according to claim 1 or claim 2, wherein the feed components at least partially comprise particles.

4. The feedstock according to any one of claims 1 to 3, wherein the feed components at least partially comprise powders.

5. The feedstock according to any one of claims 1 to 4, wherein the feed components at least partially comprise flakes.

6. The feedstock according to any one of claims 1 to 5, wherein the feed components at least partially comprise lumps.

7. A feedstock according to any one of claims 1 to 6, wherein the feed components at least partially comprise debris.

8. A feedstock according to any one of claims 1 to 7, wherein the feed components at least partially comprise spheres.

9. The feedstock according to any one of claims 1 to 8, wherein the feed components at least partially comprise particulates.

10. The feedstock according to any one of claims 1 to 9, wherein the feed components at least partially comprise fragments.

11. The feedstock according to any one of claims 1 to 10, wherein the feed component at least partially comprises wood chips.

12. A feedstock according to any one of claims 1 to 11, wherein the feed components at least partially comprise flakes.

13. The feedstock according to any one of claims 1 to 12, wherein the binder is compostable.

14. The feedstock according to any one of claims 1 to 13, wherein the binder is thermoplastic.

15. The feedstock according to any one of claims 1 to 14, wherein the binder is PBAT.

16. The stock according to any one of claims 1 to 14, wherein the binder is PETG.

17. The feedstock according to any one of claims 1 to 14, wherein the binder is PLA.

18. A feedstock according to any one of claims 1 to 14, wherein the binder is PBS.

19. The feedstock according to any one of claims 1 to 14, wherein the binder is PPS.

20. The feedstock of any one of claims 1 to 14, wherein the binder is biopolyethylene.

21. The feedstock of any one of claims 1 to 14, wherein the binder is a bioplastic.

22. The feedstock of any one of claims 1 to 13, wherein the binder is activated by heating.

23. The feedstock of any one of claims 1 to 13, wherein the binder is activated by pressure.

24. The feedstock of any one of claims 1 to 13, wherein the binder is activated by chemical catalysis.

25. The feedstock according to any one of claims 1 to 13, wherein the binder is activated by radiation curing.

26. The feedstock according to any one of claims 1 to 13, wherein the binder is activated by UV curing.

27. The feedstock of any one of claims 1 to 26, wherein the binder is applied to the feed components via spraying.

28. The feedstock of any one of claims 1 to 26, wherein the binder is applied to the feed components via roller compaction.

29. The feedstock of any one of claims 1 to 26, wherein the binder is applied to the feed components via immersion.

30. The feedstock of any one of claims 1 to 26, wherein the binder is applied to the feed components via soaking.

31. The feedstock according to any one of claims 1 to 30, wherein the mycelium is grown from Versicolor versicolor.

32. The feedstock of any one of claims 1 to 30, wherein the mycelium is grown from a Pleurotus species.

33. The feedstock of any one of claims 1 to 30, wherein the mycelium is grown from a Ganoderma species.

34. The feedstock of any one of claims 1 to 33, wherein the feedstock is compostable.

35. The feedstock of claim 34, wherein the feedstock is compostable within 45 to 90 days.

36. The feedstock according to any one of claims 1 to 35, wherein the feedstock has a moisture content by weight substantially equal to or less than 20%.

37. The feedstock according to any one of claims 1 to 36, wherein the feedstock has a moisture content by weight substantially equal to or less than 10%.

38. The feedstock according to any one of claims 1 to 37, wherein the feedstock has a moisture content by weight substantially equal to 0%.

39. A method of forming a product, the method comprising: providing a feedstock to a mold, the feedstock comprising a plurality of feed components containing mycelium, the plurality of feed components being coated and / or impregnated with a binder, molding the raw material, and The adhesive is activated before, after or during molding of the feedstock to bond the plurality of feedstock components together.

40. The method of claim 39, wherein the feed components at least partially comprise pellets, granules, powders, flakes, chunks, chips, spheres, microparticles, chips, shavings and / or flakes.

41. A method according to claim 39 or claim 40, wherein the adhesive is a thermoplastic, PBAT, PETG, PLA, PBS, PPS, biopolyethylene and / or bioplastic.

42. A method according to any one of claims 39 to 41, wherein the adhesive is activated by heat, pressure, chemical catalysis, radiation curing and / or UV curing.

43. The method of any one of claims 39 to 42, wherein the hyphae are grown from Versicolor, Pleurotus spp. and / or Ganoderma spp.

44. The method of any one of claims 39 to 43, wherein the moisture content by weight of the feedstock is substantially equal to or lower than 20%, substantially equal to or lower than 10%, and / or substantially equal to 0%.

45. A method according to any one of claims 39 to 44, wherein the shaped product is compostable.

46. ​​A method of producing a raw material for molding, the method comprising: preparing a plurality of feed components comprising mycelium, and coating and / or impregnating the plurality of feed components with a binder; wherein the adhesive is adapted to bind the plurality of feed components together when activated.

47. The method of claim 46, wherein the feed components at least partially comprise pellets, granules, powders, flakes, chunks, chips, spheres, microparticles, chips, shavings and / or flakes.

48. A method according to claim 46 or claim 47, wherein the adhesive is a thermoplastic, PBAT, PETG, PLA, PBS, PPS, biopolyethylene and / or bioplastic.

49. A method according to any one of claims 46 to 48, wherein the adhesive is activated by heat, pressure, chemical catalysis, radiation curing and / or UV curing.

50. The method of any one of claims 46 to 49, wherein the hyphae are grown from Versicolor, Pleurotus spp. and / or Ganoderma spp.

51. A method according to any one of claims 46 to 50, wherein the binder is applied to the feed components via spraying, rolling, immersion and / or soaking.

52. The method of any one of claims 46 to 51, wherein the moisture content of the produced feedstock by weight is substantially equal to or less than 20%, substantially equal to or less than 10%, and / or substantially equal to 0%.

53. The method of any one of claims 46 to 52, wherein the produced feedstock is compostable.

54. A method of producing a raw material for molding, the method comprising: colonizing a growth substrate with hyphae, the growth substrate comprising a binder distributed throughout the growth substrate; as well as processing the colonized growth substrate to produce a plurality of feed components; wherein the binder is distributed in each feed component, and wherein the adhesive is adapted to bind the plurality of feed components together when activated.

55. The method of claim 54, wherein processing the colonized growth substrate comprises mechanically processing the colonized growth substrate.

56. A method according to claim 54 or claim 55, wherein the feed components at least partially comprise pellets, granules, powder, flakes, chunks, chips, spheres, microparticles, chips, shavings and / or flakes.

57. A method according to any one of claims 54 to 56, wherein the adhesive is a thermoplastic, PBAT, PETG, PLA, PBS, PPS, biopolyethylene and / or bioplastic.

58. A method according to any one of claims 54 to 57, wherein the adhesive is activated by heat, pressure, chemical catalysis, radiation curing and / or UV curing.

59. The method of any one of claims 54 to 58, wherein the mycelium is grown from Versicolor, Pleurotus spp. and / or Ganoderma spp.

60. The method of any one of claims 54 to 59, wherein the produced feedstock has a moisture content by weight substantially equal to or less than 20%, substantially equal to or less than 10%, and / or substantially equal to 0%.

61. The method of any one of claims 54 to 60, wherein the produced feedstock is compostable.

62. A method of producing a raw material for molding, the method comprising: preparing a plurality of feed components by colonizing a plurality of growth substrates with hyphae, each growth substrate comprising a binder distributed throughout the growth substrate; wherein the binder is distributed in each feed component, and wherein the adhesive is adapted to bind the plurality of feed components together when activated.

63. The method of claim 62, wherein the feed components at least partially comprise pellets, granules, powders, flakes, chunks, chips, spheres, microparticles, chips, shavings and / or flakes.

64. A method according to claim 62 or claim 63, wherein the adhesive is a thermoplastic, PBAT, PETG, PLA, PBS, PPS, biopolyethylene and / or bioplastic.

65. A method according to any one of claims 62 to 64, wherein the adhesive is activated by heat, pressure, chemical catalysis, radiation curing and / or UV curing.

66. The method of any one of claims 62 to 65, wherein the mycelium is grown from Versicolor, Pleurotus spp. and / or Ganoderma spp.

67. The method of any one of claims 62 to 66, wherein the moisture content of the produced feedstock by weight is substantially equal to or less than 20%, substantially equal to or less than 10%, and / or substantially equal to 0%.

68. The method of any one of claims 62 to 67, wherein the produced feedstock is compostable.

69. A method for continuously producing a feed component, the method comprising: Supplying growing material to the extrusion line, colonizing the growth material with a fungal inoculum, wherein the colonized growth material is maintained in-line and mycelium is allowed to grow throughout the colonized growth material to produce a feed component material, and The feed component materials are extruded.

70. The method of claim 69, wherein the mycelium is grown from Versicolor, Pleurotus spp., and / or Ganoderma spp.

71. The method of claim 69 or 70, wherein the feed component materials are compostable.

72. A shaped product at least partially molded from stock material, the shaped product comprising: a plurality of feed components comprising mycelium, and Adhesives; The plurality of feed components are bonded together by the binder.

73. A shaped product according to claim 72, wherein the feed components at least partially comprise pellets, granules, powders, sheets, chunks, crumbs, spheres, microparticles, chips, shavings and / or flakes.

74. A shaped product according to claim 72 or claim 73, wherein the binder is a thermoplastic, PBAT, PETG, PLA, PBS, PPS, biopolyethylene and / or bioplastic.

75. The shaped product according to any one of claims 72 to 74, wherein the mycelium is grown from Coriolus versicolor, Pleurotus species and / or Ganoderma species.

76. The shaped product of any one of claims 72 to 75, wherein the shaped product is compostable.

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