Method for producing a sensor module and sensor module

Abstract

The invention relates to a method for producing a sensor module (1) comprising at least a sensor head (6), a metal cover (3), a connector module (4) and a connector element (2), comprising the following steps: providing (S1) the connector element (2) and the metal cover (3); applying (S2) a connector element (2) to the metal cover (3), the connector element (2) having a meltable material (5) in at least one partial region on the side (2a) facing the metal cover (3), and the metal cover (3) having a region (F) to which the meltable material (5) of the connector element (2) is applied in at least one partial region on the side (3a) facing the connector element (2); heating the metal cover (3) on a side (3b) of the metal cover (3) facing away from the connector element (2), the meltable material (5) melting as a result of the heating; forming (S4) a connection between the connector element (2) and the metal cover (3) by means of a meltable material (5), at least in an area (F) provided on the metal cover (3); -fastening (S5) the sensor head (6) to the metal cover (3).

Description

Technical Field

[0001] The invention relates to a method for producing a sensor module and a sensor module produced by this method. Background Art

[0002] As the development of partially automated vehicles progresses to fully automated vehicles, the number of sensor modules required in a vehicle is steadily increasing. In addition, the specifications and tasks of the modules are constantly changing. Many sensors are mounted externally and therefore must be waterproof and resistant to dirt / dust and chemicals. The performance of the sensors required for automated driving has also increased.

[0003] For example, it is known from the prior art to seal the gap between the connector and the metal plate with an adhesive or a potting material. It is also known to seal the gap with the aid of an O-ring or a similar seal and to attach the connector to the metal plate by a threaded connection or a similar fastening process. Another known variant is to overmold the connector on the metal plate with the aid of an injection molding process.

[0004] The problem with these methods is that, for example, the potting process is a very complex process and there are many influencing factors in order to always obtain good results, such as contaminants on the material, etc. In addition, sealing with O-rings or similar seals may enhance the surge mechanism of the sensor. Moisture in the sensor will lead to reduced performance. Summary of the invention

[0005] It is therefore an object of the present invention to provide a method by means of which a sensor module having a high robustness and waterproofness can be produced at low cost.

[0006] This object is achieved by the subject matter of claims 1 and 4 .

[0007] Further advantageous designs and embodiments are the subject matter of the dependent claims.

[0008] First of all, it should be considered that the integration of the plastic connector into the sensor and the sealing are essential process steps. Therefore, these steps in particular should be improved and also optimized with regard to costs.

[0009] Therefore, according to the present invention, a method for producing a sensor module consisting of at least a sensor head, a metal cover, a connector module and a connector element is proposed, the method having the following steps:

[0010] -Provide connector elements and metal covers;

[0011] - applying a connector element to the metal cover, the connector element having a meltable material in at least one partial region on the side facing the metal cover, and the metal cover having a region on at least one partial region on the side facing the connector element to which the meltable material of the connector element is applied;

[0012] - heating the metal cover on its side facing away from the connector element, the meltable material melting due to the heating;

[0013] - forming a connection between the connector element and the metal cover, at least in a region provided on the metal cover, by means of the meltable material;

[0014] - Fasten the sensor head to the metal cover.

[0015] The connector element is designed, for example, as a plastic housing for the connector module.The connector element is designed such that the connector module can be plugged into the connector element.

[0016] In the proposed method, the connector element is pressed onto the metal cover, the meltable material is located directly above the area of ​​the metal cover, and the material and the area of ​​the metal cover have substantially the same geometry. At the same time, the metal cover is heated on the side of the metal cover facing away from the connector element to melt the meltable material. After melting, the meltable material flows onto the area prepared for it and thus forms a connection between the metal cover and the connector element.

[0017] The connector modules can feature all common connector interfaces relevant to the automotive industry.

[0018] In a preferred design, in order to form the connection on the area of ​​the metal cover, a structure is provided for the molten meltable material to flow in. This structure is particularly advantageous because it has, for example, grooves or generally depressions into which the liquid material can flow. This advantageously forms a more robust connection between the connector element and the metal cover.

[0019] Preferably, the heating of the metal cover is carried out by means of a laser, a heating plate or induction. These methods are preferred possibilities that allow particularly uniform and rapid heating of the metal cover.

[0020] In addition, according to the present invention, a sensor module is proposed, which includes at least a sensor head, a metal cover, a connector module and a connector element, the connector element has a meltable material in at least one partial area on the side facing the metal cover, the metal cover has an area on which the meltable material is applied in at least one partial area on the side facing the connector element, the connector element and the metal plate each have a central recess into which the connector module can be inserted, and by heating the metal cover, a connection is formed between the connector element and the metal plate due to the melting of the meltable material on the area of ​​the metal cover.

[0021] The connector element is designed, for example, as a plastic housing for the connector module.The connector element is designed such that the connector module can be plugged into the connector element.

[0022] In the proposed method, the connector element is pressed onto the metal cover, the meltable material is located directly above the area of ​​the metal cover, and the material and the area of ​​the metal cover have substantially the same geometry. At the same time, the metal cover is heated on the side of the metal cover facing away from the connector element to melt the meltable material. After melting, the meltable material flows onto the area prepared for it and thus forms a connection between the metal cover and the connector element.

[0023] The metal cover is formed, for example, from the aluminum alloy AL99.5. However, other materials are also conceivable.

[0024] The connector modules can feature all common connector interfaces relevant to the automotive industry.

[0025] In a particularly preferred embodiment, a region of the metal cover has a structure designed such that a meltable material flows into the structure to form a connection between the metal cover and the connector element. This structure is particularly advantageous because the structure has, for example, a groove or generally a depression into which the liquid material can flow. This advantageously forms a more robust connection between the connector element and the metal cover.

[0026] Particularly preferably, the structure of the region of the metal cover is produced by means of a laser, by punching or milling. These methods are preferred material processing methods, by means of which the structuring of the metal cover in the predetermined region can be achieved particularly easily. Other metal processing methods are also conceivable, by means of which the structure can be produced.

[0027] In another preferred design, the area is arranged in the form of a ring around the recess for the connector module. This is advantageous because in this way the size of the required sealing area can be reduced to the necessary minimum size, which in turn has an impact on the required amount of meltable material.

[0028] Furthermore, the meltable material is particularly preferably arranged in the form of a ring around the recess for the connector module on the connector element. Arranging in the form of a ring is advantageous because in this way the amount of meltable material can be advantageously reduced and an adequate seal can still be ensured.

[0029] Other geometries of the regions and meltable material are also contemplated, although if the geometry is altered it must be ensured that the two geometries substantially match.

[0030] Preferably, when connecting the metal plate to the connector element, the connector module is arranged on the metal plate or in the connector element. Prior to the connecting step, the connector module can correspondingly already be integrated in the connector element or arranged in a recess in the metal plate. There is no difference when making the connection, which is why these variants can be used as alternatives without further adjustments.

[0031] Preferably, the meltable material is a plastic. Basically, any plastic having a melting point below the melting point of the connector element can be used here. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Further advantageous embodiments are the subject of the drawings.

[0033] In the attached picture:

[0034] Figure 1 A schematic flow chart of a method according to an embodiment of the present invention is shown;

[0035] Figure 2a shows a schematic illustration of a connector element according to one embodiment of the present invention;

[0036] Figure 2b shows another schematic illustration of a connector element according to another embodiment of the present invention;

[0037] Figure 3a shows a schematic illustration of a metal cover according to one embodiment of the present invention;

[0038] Figure 3b shows another schematic illustration of a metal cover according to another embodiment of the present invention;

[0039] Figure 4 shows a schematic illustration of a connector element combined with a metal cover according to one embodiment of the present invention;

[0040] Figure 5 A schematic diagram of a sensor module according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0041] Figure 1A schematic flow chart of a method according to an embodiment of the present invention is shown. In step S1, a connector element 2 and a metal cover 3 are provided. In step S2, the connector element 2 is applied to the metal cover 3, the connector element 2 having a meltable material 5 in at least one partial region on the side 2a facing the metal cover 3, and the metal cover 3 has a region F on at least one partial region on the side 3a facing the connector element 2 where the meltable material 5 of the connector element 2 is applied. In step S3, the metal cover 3 is heated on the side 3b facing away from the connector element, and the meltable material 5 is melted by the heating. In step S4, a connection is formed between the connector element 2 and the metal cover 3, at least in the region F provided on the metal cover, by the meltable material 5. In step S5, the sensor head 6 is fastened to the metal cover 3.

[0042] Figure 2a and Figure 2b Each shows a schematic representation of a connector element according to one embodiment of the invention. Figure 2a The connector element 2 has a meltable material 5 on the side 2a facing the metal cover. Figure 2a In the design of , the connector module 4 has been integrated into the connector element 2. Figure 2b The diagram basically corresponds to Figure 2a , just in Figure 2b In the embodiment shown in FIG. 2 , the connector module 4 is not arranged in the connector element 2 , but the connector element only has the recess A2 .

[0043] Figure 3a and Figure 3b Each shows a schematic diagram of a metal cover according to an embodiment of the present invention. Figure 3a In the illustration of , the metal cover 3 has an area F on the side 3a facing the connector element, to which the meltable material 5 of the connector element 2 is applied. This area F can have a structure for better connection durability. In the center of the metal cover 3 is shown a recess A3, into which the connector module 4 can be inserted. Figure 3b The diagram basically corresponds to Figure 3a , just in Figure 3b In the embodiment, the sensor module 4 is arranged in the recess A3 in the metal cover 3 .

[0044] Figure 4 A schematic illustration of a connector element in combination with a metal cover according to one embodiment of the invention is shown. In this case, the connector element 2 is applied to the metal cover 3 under a pressure P. In this illustration, a meltable material 5 can be seen between the connector element 2 and the metal cover 3. The metal cover 3 is heated at a high temperature T on its side 3b facing away from the connector element 2 in order to melt the meltable material 5.

[0045] Figure 5 A schematic illustration of a sensor module according to one embodiment of the invention is shown. Here, the sensor module 1 comprises a connector element 2 with a meltable material 5, and a metal cover 3 having an area F to which the meltable material 5 is applied. Furthermore, in this embodiment, a connector module 4 is arranged in the metal cover 3. As previously shown, the connector module 4 can also be arranged in the connector element 2 before the connector element 2 is connected to the metal cover 3. Furthermore, the sensor module 1 is also provided with a sensor head 6, which is connected to the metal cover 3.

[0046] List of reference numerals:

[0047] 1 Sensor module

[0048] 2 Connector components

[0049] 2a Side facing the metal cover

[0050] 3 Metal cover

[0051] 3a Side facing the connector element

[0052] 3b Side facing away from connector element

[0053] 4 Connector modules

[0054] 5 Meltable Materials

[0055] 6 Sensor head

[0056] A2 Recess in connector element

[0057] A3 recess in metal cover

[0058] F Area

[0059] P Pressure

[0060] S1 to S5 Method steps

[0061] T Temperature

Claims

1. A method for producing a sensor module (1), the sensor module comprising at least a sensor head (6), a metal cover (3), a connector module (4) and a connector element (2), the method comprising the following steps: - providing (S1) the connector element (2) and the metal cover (3); - applying (S2) the connector element (2) to the metal cover (3), the connector element (2) having a meltable material (5) in at least one partial region on the side (2a) facing the metal cover (3), and the metal cover (3) having a region (F) on which the meltable material (5) of the connector element (2) is applied in at least one partial region on the side (3a) facing the connector element (2); - heating the metal cover (3) on the side (3b) of the metal cover (3) facing away from the connector element (2), the meltable material (5) melting due to the heating; - forming (S4) a connection between the connector element (2) and the metal cover (3) by means of the meltable material (5), at least in a region (F) provided on the metal cover (3); - Fastening (S5) the sensor head (6) to the metal cover (3).

2. The method according to claim 1, It is characterized in that In order to form a connection on the region (F) of the metal cover (3), a structure is provided for the molten meltable material (5) to flow in.

3. The method according to claim 1, It is characterized in that The heating of the metal cover (3) is carried out by means of a laser, a heating plate or induction.

4. A sensor module (1), which comprises at least a sensor head (6), a metal cover (3), a connector module (4) and a connector element (2), wherein the connector element (2) has a meltable material (5) in at least one partial area on the side (2a) facing the metal cover (3), and the metal cover (3) has an area (F) on which the meltable material (5) is applied in at least one partial area on the side (3a) facing the connector element (2), the connector element (2) and the metal plate (3) each have a central recess (A2, A3) into which the connector module (4) can be inserted, and by heating the metal cover (3), a connection is formed between the connector element (2) and the metal plate (3) due to the melting of the meltable material (5) in the area of ​​the metal cover (3).

5. The sensor module (1) according to claim 4, It is characterized in that The region (F) of the metal cover (3) has a structure designed so that the meltable material (5) flows into the structure to form a connection between the metal cover (3) and the connector element (2).

6. The sensor module (1) according to claim 5, It is characterized in that The structure of the region (F) of the metal cover (3) is produced by means of a laser, by punching or by milling.

7. The sensor module (1) according to claim 5 or 6, It is characterized in that The region (F) is arranged in the form of a ring around the recess (A3) for the connector module (4).

8. The sensor module (1) according to claim 4, It is characterized in that The meltable material (5) is arranged in the form of a ring on the connector element (2) around the recess (A2) for the connector module (4).

9. The sensor module (1) according to any one of claims 4 to 8, It is characterized in that When the metal cover (3) is connected to the connector element (2), the connector module (4) is arranged on the metal cover (3) or in the connector element (2).

10. The sensor module (1) according to claim 4, It is characterized in that The meltable material (5) is plastic.

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