Miniature LED display manufacturing device

Abstract

The present embodiment includes: a substrate chuck on which a substrate is disposed; a transfer head having an adsorption plate for adsorbing the donor and transferring the LED chip transferred to the donor to a substrate; and a visual sensor disposed below the substrate chuck. The adsorption plate is provided with a light source that irradiates the donor with light.

Description

Technical Field

[0001] The invention relates to a micro LED display manufacturing device. Background Art

[0002] Recently, in the field of display technology, display devices having excellent characteristics such as thinness and flexibility are being developed. In contrast, the main displays currently commercialized are represented by LCD (Liguid Crystal Display) and AMOLED (Active Matrix Organic Light Emitting Diodes).

[0003] However, in the case of LCD, there are problems such as slow response time and difficulty in achieving flexibility, and in the case of AMOLED, there are weaknesses such as short lifespan and poor mass production yield.

[0004] On the other hand, light emitting diodes (LEDs) are well-known semiconductor light emitting devices that convert current into light. Since the commercialization of red LEDs using GaAsP (gallium arsenide phosphide) compound semiconductors, they have been used together with GaP:N series green LEDs as light sources for displaying images in electronic devices represented by information and communication equipment. Therefore, a solution to the above-mentioned problem can be proposed by implementing a display (i.e., LED display) using the semiconductor light emitting device. Compared with filament-based light emitting devices, such light emitting diodes have various advantages such as long life, low power consumption, excellent initial driving characteristics, and high vibration resistance.

[0005] On the other hand, recently, micro LEDs (μLEDs) with a size of 10 to 100 micrometers (μm) and one-tenth the length and about one-hundredth the area of ​​ordinary light emitting diode (LED) chips have gradually increased.

[0006] Compared to existing LEDs, such micro-LEDs (μLEDs) have the advantages of fast response speed, low power consumption, support for high brightness, and will not break when bent when applied to displays.

[0007] The display manufacturing apparatus using the micro LED (μLED) can implement a LED chip transfer process of transferring the LED chip provided to a donor to a substrate after the LED chip is provided to the donor. Summary of the invention

[0008] Problems to be solved by the invention

[0009] The purpose of this embodiment is to provide a micro LED display manufacturing device in which a visual sensor can simultaneously capture a substrate and a donor, and the substrate and the donor can be aligned together.

[0010] Technical solutions to the problem

[0011] This embodiment includes: a substrate chuck for placing a substrate; a transfer head having an adsorption plate for adsorbing a donor, transferring the LED chip transferred to the donor to the substrate; and a visual sensor arranged below the substrate chuck; a light source for irradiating light toward the donor is arranged on the adsorption plate.

[0012] The substrate chuck may include: a panel chuck formed with a plurality of suction holes; a pin movably disposed on the panel chuck to lift and lower the substrate; and a plurality of aligners to align the substrate.

[0013] The panel chuck may be disposed on the upper side of the vision sensor, and the panel chuck may be made of Pyrex material.

[0014] The upper end of the pin may be a curved surface.

[0015] The plurality of aligners may include a left side aligner and a right side aligner spaced apart in the left-right direction; and a front side aligner and a right side aligner spaced apart in the front-back direction.

[0016] The aligner may include: a polyurethane roller; a connecting rod configured with the polyurethane roller; and a motor to actuate the connecting rod.

[0017] The adsorption plate may be formed with a light source accommodating portion for inserting and accommodating the light source.

[0018] The adsorption plate may include: an adsorption plate body formed with a plurality of suction holes, the light source accommodating part being separated from the suction holes; and a fixing plate body disposed on the top surface of the adsorption plate body and covering the light source accommodating part.

[0019] The transfer head may further include: a driving module; a connecting bracket connected to the driving module, the lower portion of the connecting bracket being connected to the adsorption plate; a lifting plate disposed on the upper portion of the driving module; and a lifting mechanism to lift and lower the lifting plate.

[0020] The driving module can be a five-axis module, which can have an X-axis driving source, a Y-axis driving source, a θ-axis driving source, a Tx-axis driving source and a Ty-axis driving source, so that the connecting bracket moves along the X-axis and the Y-axis, and rotates along the Tx-axis, the Ty-axis and the θ-axis.

[0021] The transfer head may also include a displacement sensor for calculating the height or tilt between the substrate and the donor.

[0022] A gap may be formed between the adsorption plate and the driving module, and the displacement sensor may be accommodated in the gap.

[0023] Effects of the Invention

[0024] According to this embodiment, the light source disposed on the adsorption plate can backlight the donor adsorbed on the adsorption plate, so that the visual sensor on the lower side of the substrate can reliably identify the alignment key of the substrate and the alignment key of the donor at the same time.

[0025] In addition, the light source is arranged on the adsorption plate, so that the inspection and repair of the light source are convenient.

[0026] In addition, since the panel chuck is made of Pyrex material, the vision sensor can have high reliability.

[0027] In addition, since the upper end of the pin is a curved surface, the contact area between the substrate and the pin can be minimized.

[0028] In addition, the substrate chuck includes a plurality of aligners for aligning the substrate so that the substrate and the donor can be aligned at the same time, and the plurality of aligners can correct the alignment key of the substrate and the alignment key of the donor at the same time.

[0029] In addition, the aligner includes a polyurethane roller made of polyurethane, thereby minimizing damage to the substrate caused by the aligner.

[0030] In addition, the light source is inserted into and accommodated in the light source accommodating portion formed on the adsorption plate, so that the light source can be reliably protected compared to a case where the light source protrudes.

[0031] In addition, the light source accommodated in the adsorption plate body can be protected by the fixing plate body, so that the light of the light source can reliably illuminate the donor.

[0032] In addition, the displacement sensor is accommodated in the gap between the adsorption plate and the driving module, thereby minimizing damage to the displacement sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a three-dimensional diagram of the micro LED display manufacturing device of this embodiment.

[0034] Figure 2 4 is a top view of the micro LED display manufacturing device of this embodiment.

[0035] Figure 3 3 is a diagram showing the transfer process of the micro LED display manufacturing device of this embodiment.

[0036] Figure 4 It is a three-dimensional view of the panel carrier of this embodiment.

[0037] Figure 5 It is a three-dimensional diagram of the panel ejection (Pop-up) mechanism of this embodiment.

[0038] Figure 6 This is a front view of the panel ejection mechanism of this embodiment when the substrate is bent.

[0039] Figure 7 1 is a perspective view of the aligner of this embodiment.

[0040] Figure 8 1 is a perspective view showing the panel vision alignment mechanism of this embodiment.

[0041] Fig. 9 4 is a three-dimensional diagram of the transfer head of this embodiment.

[0042] Fig.10 1 is a perspective view showing a suction plate of a transfer head according to the present embodiment.

[0043] Fig.11 3D is a perspective view showing a suction plate and a light source of a transfer head according to the present embodiment.

[0044] Fig.12 1 is a perspective view showing a driving module of a transfer head according to the present embodiment.

[0045] Fig.13 It is a perspective view showing the lifting mechanism of the transfer head according to this embodiment. DETAILED DESCRIPTION

[0046] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0047] Figure 1 is a three-dimensional diagram of the micro LED display manufacturing device of this embodiment, Figure 2 is a top view of the micro LED display manufacturing device of this embodiment, Figure 3 3 is a diagram showing the transfer process of the micro LED display manufacturing device of this embodiment.

[0048] The micro LED display manufacturing device can provide the donor 1 (refer to Figure 3 ) is transferred to the substrate 2. The micro LED display manufacturing device can be a transfer device for transferring the LED chip 3 to the substrate 2.

[0049] like Figure 1 and Figure 2 As shown, the micro LED display manufacturing device may include a panel carrier 5, a donor loader 6, a transfer head 7, a disassembly head 8 and a donor unloader 9.

[0050] The donor 1 may be an interposer provided with an LED chip 3 on one side. The donor 1 may be loaded on the substrate 2 to transfer the LED chip 3 to the substrate 2. Preferably, the donor 1 is formed of a transparent material or a translucent material.

[0051] The donor 1 may be provided with an alignment key, and may be loaded into a micro LED display manufacturing device in a state provided with the alignment key.

[0052] Figure 2 The reference symbol DI shown in FIG. 1 is the direction in which the donor 1 is loaded onto the substrate 2. Figure 2 The reference symbol DO shown in FIG. 2 is a direction in which the donor 1 is unloaded from the substrate 2 .

[0053] like Figure 1 and Figure 2 As shown, the substrate 2 can be placed on the panel carrier 5.

[0054] like Figure 3 As shown, as an example, the substrate 2 may include a panel 2a and an adhesive 2b formed on the top surface of the panel 2a.

[0055] As an example, the panel 2a may be a CID (Central Information Display) panel. The panel 2a may be made of glass. Preferably, the panel 2a is made of a transparent material or a semi-transparent material.

[0056] The adhesive 2 b may be formed in plurality on the top surface of the panel 2 a , and the plurality of adhesives 2 b may be spaced apart from each other.

[0057] The panel 2 a of the substrate 2 may be placed on the panel stage 5 , and the panel 2 a may be chucking on the panel stage 5 .

[0058] As an example, the substrate 2 may further include a light guide 2c. The light guide 2c may be a partition wall that separates the LED chips 3. The light guide 2c may be a reflection layer or a reflection sheet that reflects light from the LED chips 3.

[0059] When the substrate 2 is placed on the panel stage 5, a plurality of light guides 2c may be formed on the top surface of the panel 2a, and the plurality of adhesives 2b may be separated from each other by the light guides 2c. When the plurality of LED chips 3 are transferred to the substrate 2, the light guides 2c may be located between the plurality of LED chips 3.

[0060] The substrate 2 may be provided with an alignment key, and may be loaded onto the panel stage 5 in a state provided with the alignment key.

[0061] Figure 2 The reference numeral SI shown in FIG. 1 is the direction in which the substrate 2 is loaded onto the panel stage 5. Figure 2 Reference symbol SO shown in is a direction in which the substrate 2 is unloaded from the panel stage 5.

[0062] like Figure 2As shown, the substrate 2 can move forward along the front-rear direction Y on the panel stage 5 , and can move backward along the front-rear direction Y on the panel stage 5 .

[0063] A plurality of LED chips 3 may be provided to the donor 1. The LED chips 3 provided to the donor 1 may be micro LED chips, and a plurality of micro LED chips may be provided to one side of the donor 1. In a state where the LED chips 3 are provided to the bottom surface of the donor 1, they may be loaded into a micro LED display manufacturing device.

[0064] Hereinafter, each structure of the micro LED display manufacturing device will be described.

[0065] The panel stage 5 may include a substrate chuck 11 on which the substrate 2 is placed.

[0066] The substrate chuck 11 can be located between the donor loader 6 and the donor unloader 9 in the left-right direction X, and can clamp the substrate 2 horizontally. Figure 1 and Figure 2 As shown, the LED chip 3 can be transferred from the donor 1 while the substrate 2 is placed on the substrate chuck 11 .

[0067] The panel stage 5 can align the position of the substrate 2. The panel stage 5 can align the substrate 2 and the donor 1 at the same time. The panel stage 5 can absorb the substrate 2, and can absorb a large substrate.

[0068] The panel stage 5 may be formed long in the left-right direction X. The panel stage 5 may be formed long in the front-back direction Y. The length of the panel stage 5 in the left-right direction X may be longer than the length of the panel stage 5 in the front-back direction Y. When the panel stage 5 is viewed from above, it may be in a rectangular shape long in the left-right direction X.

[0069] The donor loader 6 can load the donor 1. The donor loader 6 can load the donor 1 to the transfer head 7.

[0070] The donor loader 6 may be disposed on the panel stage 5, and may be disposed biased to one side (eg, the right side) of the panel stage 6. The donor loader 6 may be separated from the substrate chuck 11 and the donor unloader 9 in the left-right direction X.

[0071] The donor loader 6 may include an invertor that can invert the donor 1. The donor loader 6 may include a rotating device that can rotate the donor 1. The donor loader 6 can invert and rotate the donor 1.

[0072] The donor loader 6 may include a barcode recognition part that recognizes a barcode formed on the donor 1, and may recognize the barcode while tracking the donor 1. The donor loader 6 may align the position of the donor 1. The donor loader 6 may align the donor 1 before the transfer head 7 adsorbs the donor 1.

[0073] like Figure 3 As shown in (a), the donor 1 can be adsorbed on a vacuum plate and can be sensed by a visual sensor. The visual sensor can sense the pre-vision alignment of the LED chip 3 provided on the bottom surface of the donor 1 and the donor 1.

[0074] like Figure 3 As shown in (a), the adsorption plate 30 ′ may be the adsorption plate 30 of the transfer head 7 , or may be provided separately instead of being provided together with the adsorption plate 30 of the transfer head 7 .

[0075] like Figure 3 As shown in (a), the visual sensor 26 ′ may be the visual sensor 26 disposed on the lower side of the substrate chuck 11 , or may be provided separately instead of being provided together with the visual sensor 26 disposed on the lower side of the substrate chuck 11 .

[0076] The transfer head 7 may transfer the LED chip 3 transferred to the donor 1 to the substrate 2 .

[0077] The transfer head 7 may transfer the LED chip 3 to the substrate 2 after receiving the donor 1 from the donor loader 6 .

[0078] The transfer head 7 can adsorb the donor 1 and can move the adsorbed donor 1 up and down. The transfer head 7 can be movably arranged on the panel stage 5. The transfer head 7 can be arranged to move along the left-right direction X on the panel stage 5.

[0079] The transfer head 7 can correct the parallelism between the donor 1 and the substrate 2. The transfer head 7 can control the Z axis (up and down direction) according to the bonding section.

[0080] The transfer head 7 may move to an upper side of the donor loader 6 , and may move to an upper side of the substrate chuck 11 .

[0081] like Figure 3 As shown in (b), the transfer head 7 can move the donor 1 to the upper position of the substrate 2, and can lower the donor 1 toward the substrate 2 at the upper position of the substrate 2. The transfer head 7 can adjust the angle of the donor 1, and can adjust the donor 1 to be parallel to the substrate 2.

[0082] A plurality of transfer heads 7 may be provided. The plurality of transfer heads 7 may be arranged in a row. The plurality of transfer heads 7 may be arranged in a row along the front-rear direction Y.

[0083] The micro LED display manufacturing device may include a transfer head installation portion for installing a plurality of transfer heads 7 , and the plurality of transfer heads 7 may be arranged in a row along the front-to-back direction Y in the transfer head installation portion.

[0084] The micro LED display manufacturing device may further include a transfer head setting part moving mechanism for moving the transfer head setting part in the left-right direction X. The transfer head setting part moving mechanism may be installed on the panel stage 2. The transfer head setting part moving mechanism may include a driving source such as a motor and at least one power transmission member connected to the driving source and the transfer head setting part. The transfer head setting part moving mechanism may include a linear guide rail for guiding the power transmission member.

[0085] The disassembly head 8 can disassemble the donor 1 after the LED chip 3 is transferred to the substrate 2. The disassembly head 8 can disassemble the donor 1 after the LED chip 3 is separated (i.e., the transfer is completed). The disassembly head 8 can disassemble the donor 1 after the LED chip 3 is separated (i.e., the transfer is completed) by adsorption / grasping, and can transport the donor 1 located on the upper side of the substrate 2 to the donor unloader 9.

[0086] The removal head 8 may be movably disposed on the panel stage 5. The transfer head 7 may be disposed to move along the left-right direction X on the panel stage 5.

[0087] The detachment head 8 may move to the upper side of the donor unloader 9. The detachment head 8 may transfer the donor 1 on the upper side of the substrate chuck 11 to the donor unloader 9.

[0088] A plurality of disassembly heads 8 may be provided. The plurality of disassembly heads 8 may be arranged in a row. The plurality of disassembly heads 8 may be arranged in a row along the front-rear direction Y.

[0089] The micro LED display manufacturing device may include a disassembly head setting part for installing a plurality of disassembly heads 8, and the plurality of disassembly heads 8 may be arranged in a row along the front-to-back direction Y in the disassembly head setting part.

[0090] The micro LED display manufacturing device may further include a disassembly head setting part moving mechanism for moving the disassembly head setting part in the left-right direction X. The disassembly head setting part moving mechanism may be installed on the panel carrier 2. The disassembly head setting part moving mechanism may include a driving source such as a motor and at least one power transmission member connected to the driving source and the disassembly head setting part. The disassembly head setting part moving mechanism may include a linear guide rail for guiding the power transmission member.

[0091] The donor unloader 9 can unload the donor 1 .

[0092] The donor unloader 9 may be disposed on the panel stage 5, and may be disposed biased to the other side (eg, the left side) of the panel stage 6. The donor unloader 9 may be separated from the substrate chuck 11 and the donor unloader 9 in the left-right direction X.

[0093] The donor unloader 9 may align the donor 1. The donor unloader 9 may include an invertor that may invert the donor 1. The donor unloader 9 may include a rotating device that may rotate the donor 1. The donor unloader 9 may invert and rotate the donor 1.

[0094] The micro LED display manufacturing apparatus may include a visual sensor 20 (see Figure 3 (b)).

[0095] The visual sensor 26 can capture an image of the substrate 2 and an image of the LED chip 3 from a lower position of the substrate 2 placed on the substrate chuck 11. The visual sensor 26 can capture the LED chip 3 located on the bottom surface of the donor 1 through a light-transmissive area (opening or transparent portion) in the substrate chuck 11, and can capture the panel 2.

[0096] The micro LED display manufacturing apparatus can correct the position of the LED chip 3 or the angle of the donor 1 or the position of the substrate 2 according to the sensing result of the visual sensor 26 , and can transfer the LED chip 3 to a predetermined position on the substrate 2 .

[0097] In micro-LED display manufacturing equipment, such as Figure 1 and Figure 2 As shown, after the substrate 2 is placed on the substrate chuck 11 of the panel stage 5, as shown in Figure 3 As shown in (b), the donor 1 may be located on the upper side of the substrate 2. Figure 3 As shown in (c), the donor 1 descends toward the substrate 2, and the LED chip 3 is moved onto the substrate 2, especially the adhesive 2b, and as shown in Figure 3 As shown in (d), the LED chip 3 can be adhered to the substrate 2 by the adhesive 2b. Figure 3 As shown in (e), the donor 1 can be lifted up and away from the substrate 2, and can be removed from the substrate 2.

[0098] Figure 4 It is a three-dimensional view of the panel carrier of this embodiment. Figure 5 is a three-dimensional diagram of the panel ejection mechanism of this embodiment, Figure 6 This is a front view of the panel ejection mechanism of this embodiment when the substrate is bent.

[0099] like Figure 4 As shown, the substrate chuck 11 may include a panel chuck 12 and a panel ejection mechanism 13 .

[0100] like Figure 4 As shown, the panel stage 5 may further include a table 14 having legs 14 a , and the substrate chuck 11 may be disposed on the table 14 .

[0101] The substrate chuck 11 may further include a setting member 15 and transfer mechanisms 14 b and 14 c .

[0102] The setting member 15 can be arranged on the table 14, and a panel chuck placement portion 15a for placing the panel chuck 12 can be formed on the setting member 15. The panel chuck placement portion 15a can be formed protruding on the top surface of the setting member 15. An opening portion or a transparent portion can be formed in the center of the panel chuck placement portion 15a. The area near the edge of the panel chuck 12 can be placed in the panel chuck placement portion 15a.

[0103] The setting member 15 may be arranged on the table 14 so as to be movable in the horizontal direction. The table 14 may be provided with a motor or other transport mechanism 14b, 14c for moving the setting member 15. The motor or other transport mechanism 14b, 14c may include a left-right transport mechanism that can move the setting member 15 in the left-right direction X. The motor or other transport mechanism 14b, 14c may include a front-back transport mechanism that can move the setting member 15 in the front-back direction Y.

[0104] The panel chuck 12 may be seated in the panel chuck seating portion 15 a and supported by the setting member 15 . The panel chuck 12 may be disposed on the stage 14 .

[0105] A plurality of suction holes may be formed in the panel chuck 12. The panel chuck 12 may be a vacuum plate for adsorbing the substrate 2.

[0106] A suction pipe may be connected to the panel chuck 12. The suction pipe may be connected to the suction hole and the suction device of the panel chuck 12, and the substrate 2 placed on the top surface of the panel chuck 12 may be adsorbed to the panel chuck 12 by the suction pipe and the suction device.

[0107] The panel chuck 12 may be divided into a plurality of regions. A plurality of suction holes may be formed in each of the plurality of regions. As an example, the plurality of regions may be 12 regions. The panel chuck 12 may absorb or float the substrate 2 flatly.

[0108] The panel chuck 12 may be located at an upper side of the vision sensor 26 , and may cover the vision sensor 26 from the upper side.

[0109] The panel chuck 12 may be made of a ceramic material or a tempered glass material. For example, the panel chuck 12 may be made of Pyrex material. The panel chuck 12 may be transparent or translucent.

[0110] Preferably, the panel chuck 12 meets the transparency condition of being penetrable by the precision vision of the visual sensor 26. The panel chuck 12 is made of Pyrex material, and the top surface of the Pyrex can be polished.

[0111] On the other hand, a pin through hole through which the pin 16 of the panel ejection mechanism 13 passes may be formed in the panel chuck 12. The pin through hole may be separated from the suction hole of the suction substrate 2.

[0112] The panel ejection mechanism 13 may be a mechanism capable of lifting or bending the substrate 2 placed on the panel chuck 12 .

[0113] like Figures 4 to 6 As shown, the panel ejection mechanism 13 may include a pin 16. The pin 16 may be configured to be liftable on the panel chuck 12. The pin 16 may protrude toward the upper side of the panel chuck 12 through the pin through hole of the panel chuck 12, and may descend toward the pin through hole of the panel chuck 12. Such a pin 16 may enable the substrate 2 located on the panel chuck 12 to be lifted or lowered.

[0114] The upper end 16a of the pin 16 may be a curved surface. The upper end 16a of the pin 16 may be a contact surface with the substrate 2. When the upper end 16a of the pin 16 is a curved surface, the contact area between the substrate 2 and the pin 16 can be minimized.

[0115] The panel ejection mechanism 13 may include a drive source 17 such as a motor or a cylinder that raises and lowers the pin 16. The drive source 17 may be a servo motor that raises and lowers the pin 16, and may servo-control the pin 16 in the Z axis. The drive source 17 and the pin 16 may be connected by a power transmission member.

[0116] The power transmission member can convert the rotational motion of the drive source 17 into the up and down linear motion of the pin 16, and can include a gear, a connecting rod, a lead screw, a belt, etc. As long as the power transmission member is a structure capable of converting the rotational motion of the drive source 17 into the up and down linear motion of the pin 16, its type is not limited.

[0117] The panel ejection mechanism 13 may include an ejection base 18. The ejection base 18 may support the panel ejection mechanism 13. The ejection base 18 may be disposed on the ground.

[0118] An ejector frame 19 may be disposed on the ejector base 18. The ejector frame 19 may be a combination of a plurality of components.

[0119] The panel ejection mechanism 13 may include a plurality of pins 16 and a plurality of driving sources 17 .

[0120] The panel ejection mechanism 13 may include a plurality of ejection units 13A, 13B, 13C, 13D, 13E, 13F, 13G, and 13H having a pin 16 and a driving source 17 .

[0121] In the case where eight of the plurality of ejection units 13A, 13B, 13C, 13D, 13E, 13F, 13G, and 13H are provided, the panel ejection mechanism 13 can lift and lower eight regions of the substrate 2 differently.

[0122] The plurality of ejection units 13A, 13B, 13C, 13D, 13E, 13F, 13G, and 13H may be controlled so that the upper end heights of some of the plurality of pins 16 are different from the upper end heights of the remaining pins 16 .

[0123] The plurality of ejection units 13A, 13B, 13C, 13D, 13E, 13F, 13G, 13H may include: outer ejection units 13A, 13B, 13C, 13D, 13E, 13F, including pins 16a that contact an area near an edge of the substrate 2; and inner ejection units 13G, 13H, including pins 16a that contact an area near a center of the substrate 2.

[0124] The raised height of the pins 16 of the inner ejection units 13G and 13H may be lower than the raised height of the pins 16 of the outer ejection units 13A, 13B, 13C, 13D, 13E, and 13F. In this case, the substrate 2 may be supported in a shape in which the height of the edge portion is higher than the height of the center. The substrate 2 may be bent in a shape close to a U-shape.

[0125] Figure 7 1 is a perspective view of the aligner of this embodiment.

[0126] The substrate chuck 11 may further include an aligner 20 for aligning the substrate 2. The panel chuck 12 may be provided with a plurality of aligners 20.

[0127] like Figure 4 As shown, a plurality of aligners 20 may be disposed around the periphery of the panel chuck 12 .

[0128] The plurality of aligners 20 may include a left aligner 20A and a right aligner 20B spaced apart in the left-right direction X; and a front aligner 20C and a rear aligner 20D spaced apart in the front-rear direction Y.

[0129] The plurality of aligners 20 may be spaced apart from each other. A panel cartridge receiving space S for receiving the panel cartridge 12 may be formed between the left aligner 20A, the right aligner 20B, the front aligner 20C, and the rear aligner 20D.

[0130] The aligner 20 may include: a polyurethane roller 21 ; a connecting rod 22 configured with the polyurethane roller 21 ; and a motor 25 to actuate the connecting rod 22 .

[0131] The outer peripheral surface of the urethane roller 21 may be in contact with the peripheral edge of the substrate 2 , or may be in contact with the peripheral edge of the panel chuck 12 .

[0132] The connecting rod 22 may include: a main connecting rod 23 disposed along the periphery of the panel chuck 12 ; and a plurality of sub-connecting rods 24 disposed on the main connecting rod 23 and facing the periphery of the panel chuck 12 .

[0133] The polyurethane roller 21 may be rotatably mounted on the secondary link 24. The polyurethane roller 21 may be spaced apart from the main roller 23.

[0134] As an example, the motor 25 may be a servo motor and may be servo-controlled. The motor 25 may rotate or linearly move the connecting rod 22.

[0135] Each of the substrate 2 and the panel chuck 12 may include four peripheries (left periphery, right periphery, front periphery, rear periphery). The polyurethane roller 21 of each of the plurality of aligners 20 may contact the periphery of the substrate 2 or the periphery of the panel chuck 12.

[0136] When the plurality of aligners 20 include the urethane rollers 21 , when the substrate 2 is aligned using the plurality of aligners 20 , damage to the substrate 2 made of glass can be minimized.

[0137] The plurality of aligners 20 can align the four circumferential surfaces of the placement position of the substrate 2. The four surfaces of the substrate 2 can be individually aligned and driven, and the alignment position can be adjusted by servo control.

[0138] Figure 8 1 is a perspective view showing the panel vision alignment mechanism of this embodiment.

[0139] The micro LED display manufacturing apparatus may include a panel vision alignment mechanism 27 having a vision sensor 26 .

[0140] The visual alignment mechanism 27 can simultaneously photograph the alignment keys of the substrate 2 and the alignment keys of the donor 1 from the bottom of the substrate 2, and the micro LED display manufacturing device can simultaneously calibrate the donor 1 and the substrate 2.

[0141] The vision sensor 26 may include a high-resolution camera sensor, and the rectangularity may be adjusted to within 5 μm.

[0142] In the vision alignment mechanism 27 , four high-resolution camera sensors may constitute a group, and each of the four high-resolution camera sensors in the group may be driven individually along the X-axis, the Y-axis, and the Z-axis.

[0143] The visual alignment mechanism 27 may include a visual sensor setting unit 28 provided with a visual sensor 26, and may include: an X-axis driving unit 29a, which can drive the visual sensor setting unit 28 along the X-axis; a Y-axis driving unit 29b, which can drive the visual sensor setting unit 28 along the Y-axis; and a Z-axis driving unit 29c, which can drive the visual sensor setting unit 28 along the Z-axis.

[0144] Fig. 9 is a three-dimensional diagram of the transfer head of this embodiment, Fig.10 is a three-dimensional diagram showing the adsorption plate of the transfer head of this embodiment, Fig.11 is a three-dimensional diagram showing the adsorption plate and light source of the transfer head of this embodiment, Fig.12 1 is a perspective view showing a driving module of a transfer head according to the present embodiment.

[0145] The transfer head 7 may include an adsorption plate 30 that adsorbs the donor 1 .

[0146] The adsorption plate 30 may be provided with a light source 40 for irradiating light toward the donor 1 .

[0147] The adsorption plate 30 may be formed with a light source receiving portion 31 into which the light source 40 is inserted and received.

[0148] The adsorption plate 30 may be a combination of a plurality of components, and may include an adsorption plate body 32 and a fixing plate body 34. The adsorption plate 30 may be in a hexahedral shape as a whole.

[0149] A plurality of suction holes 33 may be formed on the adsorption plate 32 (see Fig.11 The suction hole 33 may be formed through the adsorption plate 32. The top surface of the donor 1 may be adsorbed on the bottom surface of the adsorption plate 32.

[0150] Preferably, the suction hole 33 has a diameter capable of sucking the donor 1 .

[0151] In order to ensure the flatness of the donor 1 when adsorbing the donor 1, preferably, the adsorption plate 32 is configured to ensure the flatness itself. As an example, the diameter of the suction hole 33 may be 0.7 mm. The adsorption plate 32 may be a vacuum plate having a plurality of suction holes 33 with a diameter of 0.7 mm.

[0152] A light source receiving portion 31 may be formed on the adsorption plate body 32. Fig.11 As shown, the light source accommodating portion 31 may be formed in a shape that is recessed in the adsorption plate body 32. The light source accommodating portion 31 may be formed in a shape that is open on the top surface and the side surface in the adsorption plate body 32. The light source accommodating portion 31 may be formed in a plurality in the adsorption plate body 32, and the plurality of light source accommodating portions 31 may be formed spaced apart from each other.

[0153] The light source accommodating portion 31 may be formed to be spaced apart from the suction hole 33 .

[0154] The adsorption plate 32 is configured to allow the light generated by the light source 40 to be irradiated downward. The adsorption plate 32 may have a light-transmitting opening formed on the lower side of the light source accommodating portion 31 , or may have a transparent portion.

[0155] The light source 40 may constitute a white backlight so that the visual sensor 26 can simultaneously identify the alignment key of the substrate 2 and the alignment key of the donor 1 .

[0156] When the light source 40 is located on the upper side of the donor 1 but not below the substrate chuck 11 , the light source 40 can be closer to the donor 1 and the visual sensor 26 can more reliably sense the alignment key of the donor 1 and the alignment key of the substrate 2 .

[0157] A plurality of light sources 40 may be provided on the adsorption plate 32. Preferably, at least four light sources 40 are provided.

[0158] like Fig.10 As shown, the fixing plate 34 may be disposed on the top surface of the adsorption plate 32. The fixing plate 34 may cover the top surface of the adsorption plate 32. The fixing plate 34 may be fastened to the adsorption plate 32 by fastening members such as bolts.

[0159] The fixing plate body 34 may cover the light source accommodating portion 31 . The light source 40 may be hidden by the fixing plate body 34 .

[0160] The fixing plate 34 can be connected to the connecting bracket 60 of the transfer head 7 (refer to Fig. 9 )connect.

[0161] like Fig. 9 As shown, the transfer head 7 may further include a driving module 50 , a connecting bracket 60 , a lifting plate 70 and a lifting mechanism 80 .

[0162] The driving module 50 may be disposed on an upper side of the connection bracket 60 and may be connected to the connection bracket 60. The output shaft 56 of the driving module 50 may be connected to the connection bracket 60.

[0163] like Fig.12 As shown, the driving module 50 may have an X-axis driving source 51, a Y-axis driving source 52, a θ-axis driving source 53, a Tx-axis driving source 54, and a Ty-axis driving source 55. The driving module 50 may be a five-axis module capable of moving and rotating the connecting bracket 60 in five axes. The driving module 50 may move the output shaft 56 along the X-axis and the Y-axis, and rotate along the Tx-axis, the Ty-axis, and the θ-axis.

[0164] The X-axis movement may be the left-right direction X movement of the output shaft 56 , and the Y-axis movement may be the front-back direction Y movement.

[0165] The θ-axis rotation may be a rotation of the output shaft 56 around a vertical first central axis.

[0166] The Tx-axis rotation may be that the output shaft 56 rotates around a horizontal second central axis, and the second central axis may be a central axis in the left-right direction X.

[0167] The Ty-axis rotation may be that the output shaft 56 rotates around a horizontal third central axis, and the third central axis may be the central axis in the front-rear direction Y.

[0168] like Fig. 9 As shown, the driving module 50 may be spaced apart from the adsorption plate 30 along the up-down direction Z on the upper side of the adsorption plate 30 , and a gap G may be formed between the adsorption plate 30 and the driving module 50 .

[0169] The upper portion of the connecting bracket 60 may be connected to the driving module 50, and the lower portion of the connecting bracket 60 may be connected to the adsorption plate 30. The connecting bracket 60 may be long in the vertical direction, and the driving module 50 and the adsorption plate 30 may be separated from each other in the vertical direction by the connecting bracket 60.

[0170] The upper portion of the connecting bracket 60 may be connected to the output shaft 56 of the driving module 50 . The lower portion of the connecting bracket 60 may be connected to the fixing plate 34 .

[0171] The lifting plate 70 may be disposed on the upper portion of the driving module 50. The driving module 50 may be installed on the lifting plate 70 in a manner of being suspended on the lifting plate 70. The lifting plate 70 may be larger than the driving module 50, and the driving module 50 may be protected by the lifting plate 70.

[0172] The lifting mechanism 80 may be a Z-axis moving member capable of moving the driving module 50 along the Z-axis direction.

[0173] The lifting mechanism 80 is connected to the lifting plate 70 and can lift the lifting plate 70. As long as the lifting mechanism 80 can lift the lifting plate 70, its type is not limited.

[0174] As an example, the lifting mechanism 80 may include: a lifting guide 81; a lifting plate 82 guided by the lifting guide 81; a connecting member 83 connecting the lifting plate 82 and the lifting plate 70; and a lifting drive source 84 that generates a driving force to lift the lifting plate 82.

[0175] The lifting guide 81 may be a linear guide rail formed long in the up-down direction.

[0176] The lifting guide 81 may be installed on the transfer head setting portion.

[0177] As an example, the lifting drive source 84 may be a servo motor.

[0178] The transfer head 7 may further include a displacement sensor 90. The displacement sensor 90 may calculate the height or tilt between the substrate 2 and the donor 1.

[0179] As an example, the displacement sensor 90 may be a laser displacement sensor, which may be a spectroscopic sensor with a resolution of 0.25 μm. The displacement sensor 90 may be a manual stage structure capable of finely adjusting the X-axis, Y-axis, and Z-axis.

[0180] The displacement sensor 90 can irradiate laser light to the donor 1 or substrate 2 from the upper side of the adsorption plate 30 through the opening of the adsorption plate 30 , and can sense the distance between the donor 1 and the substrate 2 , or the degree of inclination of the donor 1 or the substrate 2 .

[0181] The displacement sensor 90 may be accommodated in the gap G between the adsorption plate 30 and the driving module 50 , and may be protected by the adsorption plate 30 and the driving module 50 .

[0182] The displacement sensor 90 may be located around the connection bracket 60, and a plurality of displacement sensors 90 may be disposed around the connection bracket 60. The plurality of displacement sensors 90 may be disposed around the connection bracket 60 at intervals.

[0183] Fig.13 It is a perspective view showing the lifting mechanism of the transfer head according to this embodiment.

[0184] The lifting mechanism 80 of the transfer head 7 may further include a lead screw 85 and a lifting connector 86 .

[0185] The lead screw 85 may be connected to the lifting drive source 84. The lead screw 85 may be formed long in the up-down direction Z, and may be connected to the rotation shaft of the lifting drive source 84.

[0186] The lifting connection member 86 can be lifted and lowered along the lead screw 85 and can be connected to the lifting plate body 82 .

[0187] When the lifting drive source 84 is driven, the lead screw 85 rotates, and the lifting connection member 86 can be lifted and lowered along the lead screw 85 along the outer peripheral surface of the lead screw 85 .

[0188] The lifting mechanism 80 of the transfer head 7 may further include a coding ruler 87 .

[0189] The encoder ruler 87 may be a ruler of full closed-loop control mode, and can be controlled within 0.1 μm by a precision ruler, so that the adsorption plate 30 can be driven precisely along the Z-axis direction.

[0190] The lifting mechanism 80 of the transfer head 7 may further include a photoelectric sensor 88. The photoelectric sensor 88 may sense the lifting plate 82, and the micro LED display manufacturing device may control the lifting height of the lifting plate 82.

[0191] The above description is only an example of the technical concept of the present invention. A person skilled in the art in the technical field to which the present invention belongs may make various modifications and variations without departing from the essential characteristics of the present invention.

[0192] Therefore, the embodiments disclosed in the present invention are not intended to limit the technical concept of the present invention but are intended to explain the present invention, and the technical concept of the present invention is not limited to such embodiments.

[0193] The protection scope of the present invention should be interpreted by the attached claims, and should be interpreted as all technical ideas within the equivalent scope thereof belong to the right scope of the present invention.

Claims

1. A micro LED display manufacturing device, wherein: include: A substrate chuck for placing a substrate; A transfer head having an adsorption plate for adsorbing a donor, and transferring the LED chip transferred to the donor to the substrate; as well as A visual sensor is disposed below the substrate chuck; The adsorption plate is provided with a light source for irradiating light toward the donor.

2. The micro LED display manufacturing device according to claim 1, wherein: The substrate chuck comprises: A panel chuck is formed with a plurality of suction holes; A pin is disposed on the panel chuck in a liftable manner to lift and lower the substrate; and A plurality of aligners align the substrate.

3. The micro LED display manufacturing device according to claim 1, wherein: The panel chuck is arranged on the upper side of the visual sensor; The panel chuck is made of Pyrex material.

4. The micro LED display manufacturing device according to claim 1, wherein: The upper end of the pin is a curved surface.

5. The micro LED display manufacturing device according to claim 1, wherein: The plurality of aligners include: a left aligner and a right aligner, spaced apart in the left-right direction; and The front side aligner and the right side aligner are spaced apart in the front-to-back direction.

6. The micro LED display manufacturing device according to claim 2, wherein: The aligner comprises: Polyurethane roller; a connecting rod provided with the polyurethane roller; and The motor actuates the connecting rod.

7. The micro LED display manufacturing device according to claim 1, wherein: The adsorption plate is formed with a light source accommodating portion for inserting and accommodating the light source.

8. The micro LED display manufacturing device according to claim 7, wherein: The adsorption plate comprises: The adsorption plate body is formed with a plurality of suction holes, and the light source accommodating portion is separated from the suction holes; and The fixing plate is arranged on the top surface of the adsorption plate and covers the light source accommodating part.

9. The micro LED display manufacturing device according to claim 1, wherein: The transfer head also includes: Driver module; A connecting bracket connected to the driving module, wherein the lower portion of the connecting bracket is connected to the adsorption plate; A lifting plate, arranged on the upper part of the driving module; and The lifting mechanism enables the lifting plate to move up and down.

10. The micro LED display manufacturing device according to claim 9, wherein: The driving module is a five-axis module having an X-axis driving source, a Y-axis driving source, a θ-axis driving source, a Tx-axis driving source and a Ty-axis driving source, so that the connecting bracket moves along the X-axis and the Y-axis, and rotates the connecting bracket along the Tx-axis, the Ty-axis and the θ-axis.

11. The micro LED display manufacturing device according to claim 1, wherein: The transfer head further includes a displacement sensor for calculating a height or tilt between the substrate and the donor.

12. The micro LED display manufacturing device according to claim 11, wherein: A gap is formed between the adsorption plate and the driving module; The displacement sensor is accommodated in the gap.

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