Signal transmission method and related device

Abstract

The invention discloses a signal transmission method and a related device. The invention provides an optical transmission scheme, and information interaction between a large board and a small board in the foldable electronic equipment is completed by using optical signals. The optical transmission scheme can enhance the reliability of a foldable part such as a rotating shaft in the foldable electronic equipment, can also realize the space flexibility, and reserves sufficient space for the optimization design of the rotating shaft and a battery.

Description

Technical Field

[0001] The present application relates to the field of electronic technology and optical transmission, and in particular to a signal transmission method and related devices. Background Art

[0002] Electronic devices equipped with foldable screens (such as foldable screen mobile phones) are increasingly used in people's daily life and work. They not only meet users' needs for large display screens, but are also easy to carry.

[0003] Some foldable electronic devices are equipped with two main boards, and various signals are exchanged between the two main boards to realize the various functions of the foldable screen device. Signal transmission between the two main boards is achieved through board-to-board connectors (BTB) on a flexible printed circuit (FPC). The FPC with BTB is wider and needs to pass through the foldable part of the foldable screen, such as the hinge. Therefore, this signal transmission method creates obstacles to the optimal design of the hinge in space. The position of BTB also brings obstacles to battery optimization, and the combination of FPC and hinge has a certain impact on reliability. Summary of the invention

[0004] The present application provides a signal transmission method and related devices, which can not only enhance the reliability of foldable parts such as hinges in foldable electronic devices, but also achieve spatial flexibility, leaving sufficient space for the optimized design of hinges and batteries.

[0005] In a first aspect, an optical transmission structure is provided, including a transmitting module, a receiving module, and n optical fibers, wherein the transmitting module includes: m light sources, m optical splitters, and n transmitting structures, wherein one light source is coupled to one optical splitter, and each transmitting structure is coupled to the m optical splitters; the n transmitting structures include a first transmitting structure, and the first transmitting structure includes: m electrical chips, m optical modulators, and a coupler, wherein one electrical chip is coupled to one optical modulator, one optical modulator is used to couple to one optical splitter, and the m optical modulators are all coupled to the coupler; the receiving module includes n receiving structures, and the n receiving structures include a first receiving structure, and the first receiving structure includes: a demultiplexer, m photodetectors, and the demultiplexer is coupled to the m photodetectors; one optical fiber is coupled to a coupler in a transmitting structure and a demultiplexer in a receiving structure;

[0006] Among them, different light sources are used to emit light of different wavelengths, and the spectrometer is used to separate the light emitted by the coupled light source into multiple light rays; an optical modulator is used to receive a light ray separated by the coupled spectrometer; an electrical chip is used to receive an electrical signal and control the coupled optical modulator to modulate the light ray received by the coupled optical modulator into an optical signal, and the optical signal carries the information carried by the electrical signal; the coupler is used to couple m optical signals modulated by m optical modulators into one optical signal, and the first optical fiber among the multiple optical fibers is used to transmit the optical signal coupled by the coupler to the demultiplexer in the receiving module; the demultiplexer is used to receive the optical signal coupled by the coupler from the first optical fiber, and separate the optical signal coupled by the coupler into m optical signals of different wavelengths; a photodetector is used to receive the optical signal separated by the demultiplexer, and convert the optical signal separated by the demultiplexer into an electrical signal.

[0007] The optical transmission structure of the first aspect can use optical signals to complete information transmission.

[0008] In combination with the first aspect, in some implementations, the rates of the m electrical signals received by the m electrical chips may be the same or different.

[0009] In combination with the first aspect, in some embodiments, the first receiving structure may also include m electrical chips, one of which is coupled to a photodetector, and one of which is used to amplify and restore an electrical signal output by the coupled photodetector, and output the processed electrical signal.

[0010] In a second aspect, an optical transmission structure is provided, including: a transmitting module, a receiving module, and an optical fiber, wherein the transmitting module includes: a signal aggregation chip, a driving chip, and a light source, wherein the signal aggregation chip, the driving chip, and the light source are coupled in sequence; the receiving module includes: a photodetector, a depolymerization chip, wherein the photodetector and the depolymerization chip are coupled; and the optical fiber couples the light source and the photodetector;

[0011] Among them, the signal aggregation chip is used to receive multiple electrical signals and aggregate the multiple electrical signals into one electrical signal; the driving chip is used to drive the light source to output an optical signal according to the electrical signal, and the optical signal carries the information carried by the electrical signal; the optical fiber is used to transmit the optical signal to the photodetector; the photodetector is used to receive the optical signal from the optical fiber and convert the optical signal into an electrical signal; the deaggregation chip is used to deaggregate the electrical signal output by the photodetector into multiple electrical signals.

[0012] The optical transmission structure of the second aspect can use optical signals to complete information transmission.

[0013] In conjunction with the second aspect, in some implementations, the signal aggregation chip is used to receive multiple low-speed electrical signals.

[0014] In combination with the second aspect, in some embodiments, the receiving module may also include an electrical chip, which is coupled to the photodetector and the depolymerization chip. The electrical chip is used to amplify and restore an electrical signal output by the coupled photodetector, and output the processed electrical signal to the depolymerization chip.

[0015] In combination with the second aspect, in some embodiments, the receiving module may also include multiple electrical chips, one electrical chip is coupled to the deaggregation chip, the multiple electrical chips are used to amplify and restore multiple electrical signals output by the coupled deaggregation chips, and one electrical chip is used to amplify and restore one electrical signal output by the deaggregation chip.

[0016] In a third aspect, an optical transmission structure is provided, including: a transmitting module, a receiving module, and x optical fibers, wherein the transmitting module includes: a driver chip, x light sources, and the driver chip is coupled to the multiple light sources; the receiving module includes: x photodetectors; one optical fiber is coupled to one light source and the photodetector;

[0017] Among them, a driver chip is used to receive multiple electrical signals, and drives a light source to output an optical signal according to the electrical signal, and the electrical signal carries the information carried by the electrical signal; an optical fiber is used to transmit an optical signal output by a coupled light source to a coupled photodetector; a photodetector is used to receive an optical signal from a coupled optical fiber and convert the optical signal into an electrical signal.

[0018] The optical transmission structure of the third aspect can use optical signals to complete information transmission.

[0019] In conjunction with the third aspect, in some implementations, the driver chip is used to receive multiple high-speed electrical signals.

[0020] In combination with the third aspect, in some embodiments, the receiving module may further include multiple electrical chips, one electrical chip is coupled to a photodetector, and the electrical chip is used to amplify and restore an electrical signal output by the coupled photodetector.

[0021] In a fourth aspect, a foldable electronic device is provided, which comprises: a first main board, a second main board and a screen; the screen of the foldable electronic device comprises: a first screen, a second screen and a third screen, and the first screen and the second screen are connected by a folding component; when the device form of the foldable electronic device is in an open state, the display surface of the first screen and the display surface of the second screen are on the same side of the foldable electronic device, and the display surface of the third screen is located on the opposite side of the foldable electronic device as the display surface of the first screen and the display surface of the second screen; the first main board is used to control the first screen and the second screen, and the second main board is used to control the third screen; the foldable electronic device comprises a first optical transmission structure, the first optical transmission structure is the optical transmission structure of the first aspect or any one embodiment of the first aspect, the transmitting module in the first optical transmission structure is arranged on the first main board, the receiving module in the first optical transmission structure is arranged on the second main board, and the n optical fibers in the first optical transmission structure pass through the folding component.

[0022] The foldable electronic device of the fourth aspect can utilize the optical transmission structure of the first aspect to realize information transmission from the first main board to the second main board.

[0023] In combination with the fourth aspect, in some embodiments, n optical fibers are laid on an FPC board, and the FPC passes through a folding component. The solution of laying the optical fibers on the FPC to transmit signals can reduce the width of the FPC. After reducing the width of the FPC, it can not only enhance the reliability of the foldable parts of the foldable electronic device, such as the hinge, but also achieve spatial flexibility, leaving sufficient space for the optimized design of the hinge and the battery.

[0024] In conjunction with the fourth aspect, in some embodiments, the foldable electronic device further includes a second optical transmission structure, the second optical transmission structure is the optical transmission structure of the first aspect or any one of the embodiments of the first aspect, the transmitting module in the second optical transmission structure is arranged on the second main board, the receiving module in the second optical transmission structure is arranged on the first main board, and the n optical fibers in the second optical transmission structure pass through the folding component. In this way, the optical transmission structure of the first aspect can be used to realize information transmission from the second main board to the first main board.

[0025] In combination with the fourth aspect, in some embodiments, the m first electrical chips in the transmitting module in the first optical transmission structure are used to receive electrical signals of different rates.

[0026] In conjunction with the fourth aspect, in some embodiments, the foldable electronic device further includes a third optical transmission structure, the third optical transmission structure is the optical transmission structure of the second aspect or any one of the embodiments of the second aspect, the transmitting module in the third optical transmission structure is arranged on the first main board, the receiving module in the third optical transmission structure is arranged on the second main board, and the optical fiber in the third optical transmission structure passes through the folding component. In this way, the optical transmission structure of the second aspect can be used to realize information transmission from the first main board to the second main board.

[0027] In conjunction with the fourth aspect, in some embodiments, the foldable electronic device further includes a fourth optical transmission structure, the fourth optical transmission structure is the optical transmission structure of the second aspect or any one of the embodiments of the second aspect, the transmitting module in the fourth optical transmission structure is arranged on the second main board, the receiving module in the fourth optical transmission structure is arranged on the first main board, and the optical fiber in the fourth optical transmission structure passes through the folding component. In this way, the optical transmission structure of the second aspect can be used to realize information transmission from the second main board to the first main board.

[0028] In some embodiments, the signal aggregation chip in the third optical transmission structure is used to receive multiple low-speed electrical signals, and the rate of the low-speed electrical signals is less than the first value.

[0029] In conjunction with the fourth aspect, in some embodiments, the foldable electronic device further includes a fifth optical transmission structure, the fifth optical transmission structure is the optical transmission structure of the third aspect or any one of the embodiments of the third aspect, the transmitting module in the fifth optical transmission structure is arranged on the first main board, the receiving module in the fifth optical transmission structure is arranged on the second main board, and the x optical fibers in the fifth optical transmission structure pass through the folding component. In this way, the optical transmission structure of the third aspect can be used to realize information transmission from the first main board to the second main board.

[0030] In conjunction with the fourth aspect, in some embodiments, the foldable electronic device further includes a sixth optical transmission structure, the sixth optical transmission structure is the optical transmission structure of the third aspect or any one of the embodiments of the third aspect, the transmitting module in the sixth optical transmission structure is arranged on the second main board, the receiving module in the sixth optical transmission structure is arranged on the first main board, and the x optical fibers in the sixth optical transmission structure pass through the folding component. In this way, the optical transmission structure of the third aspect can be used to realize information transmission from the second main board to the first main board.

[0031] In some embodiments, the driver chip in the fifth optical transmission structure is used to receive multiple high-speed electrical signals, and the rate of the high-speed electrical signals is greater than the second value.

[0032] In a fifth aspect, a foldable electronic device is provided, comprising: a first main board, a second main board and a screen; the screen of the foldable electronic device comprises: a first screen, a second screen and a third screen, and the first screen and the second screen are connected by a folding component; when the device form of the foldable electronic device is in an open state, the display surface of the first screen and the display surface of the second screen are on the same side of the foldable electronic device, and the display surface of the third screen is located on the opposite side of the foldable electronic device as the display surface of the first screen and the display surface of the second screen; the first main board is used to control the first screen and the second screen, and the second main board is used to control the third screen; the foldable electronic device comprises a third optical transmission structure, the third optical transmission structure is the optical transmission structure of the second aspect or any one of the embodiments of the second aspect, the transmitting module in the third optical transmission structure is arranged on the first main board, the receiving module in the third optical transmission structure is arranged on the second main board, and the optical fiber in the first optical transmission structure passes through the folding component.

[0033] In combination with the fifth aspect, in some embodiments, the foldable electronic device also includes a fourth optical transmission structure, and the fourth optical transmission structure is the optical transmission structure of the second aspect or any one of the embodiments of the second aspect, the transmitting module in the fourth optical transmission structure is arranged on the second main board, the receiving module in the fourth optical transmission structure is arranged on the first main board, and the optical fiber in the fourth optical transmission structure passes through the folding component.

[0034] In a sixth aspect, a foldable electronic device is provided, comprising: a first main board, a second main board and a screen; the screen of the foldable electronic device comprises: a first screen, a second screen and a third screen, and the first screen and the second screen are connected by a folding component; when the device form of the foldable electronic device is in an open state, the display surface of the first screen and the display surface of the second screen are on the same side of the foldable electronic device, and the display surface of the third screen is located on the opposite side of the foldable electronic device as the display surface of the first screen and the display surface of the second screen; the first main board is used to control the first screen and the second screen, and the second main board is used to control the third screen; the foldable electronic device also includes a fifth optical transmission structure, the fifth optical transmission structure is the optical transmission structure of the third aspect or any one of the embodiments of the third aspect, the transmitting module in the fifth optical transmission structure is arranged on the first main board, the receiving module in the fifth optical transmission structure is arranged on the second main board, and the x optical fibers in the fifth optical transmission structure pass through the folding component.

[0035] In combination with the sixth aspect, in some embodiments, the foldable electronic device also includes a sixth optical transmission structure, which is the optical transmission structure of the third aspect or any one of the embodiments of the third aspect. The transmitting module in the sixth optical transmission structure is arranged on the second main board, the receiving module in the sixth optical transmission structure is arranged on the first main board, and the x optical fibers in the sixth optical transmission structure pass through the folding component.

[0036] In the seventh aspect, a signal transmission method is provided, which is applied to the foldable electronic device of the fourth aspect or any one embodiment of the fourth aspect. The method may include: a first mainboard in the foldable electronic device generates a first signal; the foldable electronic device transmits the first signal to a second mainboard through a first optical transmission structure.

[0037] In combination with the seventh aspect, in some embodiments, the method is applied to the foldable electronic device of the first embodiment of the fourth aspect, and the method may also include: a second mainboard in the foldable electronic device generates a second signal; the foldable electronic device transmits the second signal to the first mainboard through a second optical transmission structure.

[0038] In an eighth aspect, a signal transmission method is provided, which is applied to a foldable electronic device of the fifth aspect or any one embodiment of the fifth aspect. The method may include: a first mainboard in the foldable electronic device generates a first signal; and the foldable electronic device transmits the first signal to a second mainboard through a third optical transmission structure.

[0039] In combination with the eighth aspect, in some embodiments, the method is applied to the foldable electronic device of the first embodiment of the fifth aspect, and the method may also include: a second mainboard in the foldable electronic device generates a second signal; the foldable electronic device transmits the second signal to the first mainboard through a fourth optical transmission structure.

[0040] In the ninth aspect, a signal transmission method is provided, which is applied to the foldable electronic device of the sixth aspect or any one embodiment of the sixth aspect. The method may include: a first mainboard in the foldable electronic device generates a first signal; and the foldable electronic device transmits the first signal to a second mainboard through a fifth optical transmission structure.

[0041] In combination with the ninth aspect, in some embodiments, the method is applied to the foldable electronic device of the first embodiment of the fifth aspect, and the method may also include: a second mainboard in the foldable electronic device generates a second signal; the foldable electronic device transmits the second signal to the first mainboard through a sixth optical transmission structure.

[0042] In combination with any implementation of the seventh aspect, the eighth aspect, the ninth aspect, or any of the above aspects, the first signal may include screen display information sent by the first mainboard to the second mainboard when the foldable electronic device switches from the unfolded state and the first screen and the second screen display content to the inward folded state. The second signal may include screen display information sent by the second mainboard to the first mainboard when the foldable electronic device switches from the inward folded state and the third screen displays screen content to the unfolded state. The second signal may also include image data sent by the second mainboard to the first mainboard after the camera on the third screen captures the image.

[0043] In the tenth aspect, a computer-readable storage medium is provided, comprising instructions, which, when executed on an electronic device, causes the electronic device to execute a method executed by a foldable electronic device in the seventh aspect or any one of the embodiments of the seventh aspect, the eighth aspect or any one of the embodiments of the eighth aspect, or the ninth aspect or any one of the embodiments of the ninth aspect.

[0044] In the eleventh aspect, a computer program product is provided. When the computer program product runs on a computer, it enables the computer to execute a method executed by a foldable electronic device such as the seventh aspect or any one of the embodiments of the seventh aspect, the eighth aspect or any one of the embodiments of the eighth aspect, or the ninth aspect or any one of the embodiments of the ninth aspect.

[0045] In the twelfth aspect, a chip system is provided, which includes at least one processor for implementing a method executed by a foldable electronic device as in the seventh aspect or any one of the embodiments of the seventh aspect, the eighth aspect or any one of the embodiments of the eighth aspect, or the ninth aspect or any one of the embodiments of the ninth aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1A-1B A foldable electronic device provided in an embodiment of the present application;

[0047] Figure 1C-Figure 1D Several folding methods of a foldable electronic device are exemplarily shown;

[0048] Figure 2A An optical transmission structure provided in an embodiment of the present application;

[0049] Figure 2B Based on Figure 2A A flow chart of a signal transmission method of an optical transmission structure shown;

[0050] Figure 3A Another optical transmission structure provided in an embodiment of the present application;

[0051] Figure 3B Based on Figure 3A A flow chart of a signal transmission method of an optical transmission structure shown;

[0052] Figure 4A Another optical transmission structure provided in an embodiment of the present application;

[0053] Figure 4B Based on Figure 4A A flow chart of a signal transmission method of an optical transmission structure shown;

[0054] Figure 5 A hardware structure block diagram of a foldable electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0055] The terms used in the following embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0056] Figure 1A-1B The foldable electronic device provided by the embodiment of the present application is exemplarily shown.

[0057] like Figure 1A As shown, the foldable electronic device 100 may include: a screen 120. The screen 120 can be bent at a position 131. The screen 120 may include the following screens: a screen 120A and a screen 120B. The sizes of the screens may be the same or different. The screen 120A and the screen 120B may be two independent screens, wherein the screen 120A and the screen 120B are connected by a folding component and can be bent at a position 131 around the folding component. The folding component may be, for example, a rotating shaft, a hinge, etc. The screen 120 may also be a whole flexible screen, and the screens 120A and 120B are several parts of the whole flexible screen.

[0058] One or more screens (such as screen 120A) may also be provided with a front camera 112, an earpiece 113, a proximity light sensor (not shown), etc. The front camera 112 may also be provided in screen 120B.

[0059] like Figure 1B As shown, the foldable electronic device 100 may also include: a rear shell 110, a screen 140. The rear shell 110 is located on the back of the screen 120B and is used to support the screen 120A. The material of the rear shell 110 can be a metal material, such as an aluminum-magnesium alloy, or a non-metallic material. The rear shell 110 may be provided with a rear camera. For example, a rear camera 111 is provided on the surface where the rear shell 110 is located, and the rear camera 111 may include a plurality of rear cameras, such as a rear camera 111A, a rear camera 111B, and a rear camera 111C. The rear camera 111A, the rear camera 111B, and the rear camera 111C may be an ultra-wide-angle camera, a wide-angle camera, and a telephoto camera, respectively. The side where the rear shell 110 is located may also have a flash 115, an anti-flicker light (flicker) sensor, a color temperature sensor, a focus system, and the like.

[0060] The screen 140 is located at the back of the screen 120A. The screen 140 may be provided with a front camera 116, an earpiece 117, a proximity light sensor (not shown), etc.

[0061] The rear cover 110 and the screen 140 are divided at a position 131 and can be bent at the position 131 .

[0062] In addition to supporting the screen, the rear shell 110 can also protect the internal components of the electronic device. The subsequent embodiments will introduce the electronic structure of the foldable electronic device 100 and explain what components it includes, which will not be expanded here. In addition to the screen 120, the FPC inside the foldable electronic device can also be bent at position 131, thereby supporting the entire foldable electronic device to bend at position 131. In this article, Figure 1A-1B The foldable electronic device 100 shown may also be referred to as a “two-fold electronic device.” Not limited to two-fold electronic devices, the signal transmission method provided in the present application may also be applicable to three-fold electronic devices or electronic devices with more folds.

[0063] Next, a folding method of the foldable electronic device 100 is introduced.

[0064] The folding method of the foldable electronic device 100 may include one or more of the following: inward folding and outward folding. Compared with outward folding, inward folding reduces the exposure of the screen to the outside.

[0065] Figure 1C A simplified diagram shows a folding method of the screen 120. Figure 1C As shown, the screen 120 is folded outward at position 131, specifically, the screen 120A rotates outward around the folding member, and the rotation direction is indicated by mark 121A. In this way, the screen 120A is no longer on the same plane as the screen 120B. If the folding angle reaches 180°, the rear housing 110 and the screen 140 will come into contact and overlap and become invisible to the outside.

[0066] Figure 1D A simplified diagram shows a method of folding the screen 120 inward. Figure 1D As shown, the screen 120 is folded inward at position 131, specifically, the screen 120A rotates inward around the folding member, and the rotation direction is shown by mark 122A. In this way, the rear housing 110 is no longer on the same plane as the screen 140. If the inward folding angle reaches 180°, the screen 120A and the screen 120B will come into contact and overlap and become invisible to the outside.

[0067] The screen 120 may also be referred to as an inner screen, and the screen 140 may also be referred to as an outer screen.

[0068] The foldable electronic device of the present application includes two main boards, a large board and a small board. The large board is used to control the inner screen and the front camera, earpiece, proximity light sensor, etc. on the inner screen, and the hardware signals unique to the inner screen are processed by the large board. The small board is used to control the outer screen and the front camera, earpiece, proximity light sensor, etc. on the outer screen, and the hardware signals unique to the outer screen are processed by the small board.

[0069] The main system on chip (SoC) in a foldable electronic device is located on the large board. The main SoC may include an application processor (AP), a modem processor, a graphics processor (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, a neural-network processing unit (NPU), a random access memory (RAM), etc.

[0070] The screen 120A may be referred to as a first screen, the screen 120B may be referred to as a second screen, and the screen 140 may be referred to as a third screen. The large board may be referred to as a first main board, and the small board may be referred to as a second main board.

[0071] Various signals need to be exchanged between the large board and the small board to realize various functions of the folding screen device. When the inner screen and the outer screen switch to display, the screen display information is transmitted between the large board and the small board. For example, when the foldable electronic device 100 switches from the unfolded state with the inner screen displaying content to the state shown in the figure, Figure 1D In the inward folded state shown, the large board transmits the screen display information to the small board to switch the screen content from the inner screen to the outer screen. For another example, when the foldable electronic device is switched from the inward folded state and the outer screen displays the screen content to the unfolded state, the small board transmits the screen display information to the large board to switch the screen content from the outer screen to the inner screen. For another example, after the front camera on the outer screen captures the image, if image processing is required, the small board sends the image data to the large board, which is processed by the main SoC in the large board and then sent back to the small board. In the present application, the signal transmitted from the large board to the small board can be referred to as the first signal, and the signal transmitted from the small board to the large board can be referred to as the second signal.

[0072] The present application provides an optical transmission solution, which uses optical signals to complete the information exchange between the large board and the small board. The optical signal is transmitted in the optical fiber. Compared with the BTB laid on the FPC to transmit the signal, the solution of laying the optical fiber on the FPC to transmit the signal can reduce the width of the FPC. After reducing the width of the FPC, it can not only enhance the reliability of the foldable parts of the foldable electronic device such as the hinge, but also achieve spatial flexibility, leaving sufficient space for the optimized design of the hinge and the battery.

[0073] The present application is introduced below with three embodiments.

[0074] Example 1

[0075] In this embodiment, the foldable electronic device first aggregates the electrical signal and then converts the aggregated electrical signal into an optical signal for transmission.

[0076] Figure 2A The light transmission structure in Embodiment 1 is shown.

[0077] like Figure 2A As shown, the optical transmission structure includes a transmitting module 11 and a receiving module 12 .

[0078] The transmitting module 11 includes: a signal aggregation chip 111, a driving chip 112, a light source 113, and an optical fiber interface 114, which are coupled in sequence. The receiving module 12 includes: an optical fiber interface 121, a photodetector 122, an electrical chip 124, and a deaggregation chip 123, which are coupled in sequence. The transmitting module 11 and the receiving module 12 are connected via an optical fiber 13, and the optical fiber 13 connects the optical fiber interface 114 and the optical fiber interface 121. Optical waveguides can be set between the light source 113 and the optical fiber interface 114, and between the optical fiber interface 121 and the photodetector 122, for transmitting optical signals. In this article, coupling includes direct electrical connection and indirect electrical connection with a conductive device (such as a resistor) or a conductive circuit in series.

[0079] The optical fiber between the transmitting module 11 and the receiving module 12 can be arranged on the FPC, which can reduce the width of the FPC, thereby enhancing the reliability of the foldable parts of the foldable electronic device, such as the hinge, and leaving sufficient space for the optimized design of the hinge and the battery.

[0080] The transmitting module 11 can be arranged in the large board, and the receiving module 12 can be arranged in the small board, so as to transmit signals from the large board to the small board. Alternatively, the transmitting module 11 can be arranged in the small board, and the receiving module 12 can be arranged in the large board, so as to transmit signals from the small board to the large board. Alternatively, both the large board and the small board are provided with the transmitting module 11 and the receiving module 12, so as to realize bidirectional signal transmission between the large board and the small board.

[0081] The signal aggregation chip 111 is also coupled to other hardware modules managed by the large board or the small board, and is used to receive electrical signals from other hardware modules. For example, when the transmitting module 11 is set in the large board, the signal aggregation chip 111 is coupled to the inner screen to receive the screen display information of the inner screen. The signal aggregation chip 111 is used to receive multiple electrical signals, aggregate the multiple electrical signals into one electrical signal, and then send the one electrical signal to the driver chip 112. There are many ways to aggregate multiple electrical signals into one electrical signal, such as speeding up the signal frequency, or aggregating multiple electrical signals into one electrical signal through a certain algorithm, etc., which is not limited in this application. Optionally, the signal aggregation chip 111 can be used to aggregate multiple low-speed electrical signals into one high-speed electrical signal. The high-speed signal here can refer to a signal with a transmission rate of one billion bytes (Gbps), and the low-speed signal can refer to a signal with a transmission rate of one million bytes (Mbps) such as a general-purpose input / output (GPIO) signal, input and output I / O signal, etc. The signal aggregation chip 111 may be implemented as a field-programmable gate array (FPGA).

[0082] The driving chip 112 is used to output a driving signal (such as a driving voltage) to the light source according to an electrical signal output by the signal aggregation chip 111, and control the brightness, amplitude, intensity, phase, frequency, polarization and other parameters of the light signal emitted by the light source, so as to modulate the information carried by the electrical signal onto the optical signal.

[0083] The light source 113 is used to receive the driving signal output by the driving chip 112, and emits an optical signal modulated with information carried by an electrical signal under the drive of the driving signal. Since only one electrical signal needs to be modulated, the light source 113 may include only one light source. The light source 113 may adopt an edge-emitting laser (EEL), a vertical-cavity surface-emitting laser (VCSEL), a super luminescent diode, a light-emitting diode (LED), etc. Among them, VCSE and EEL have high intensity, EEL has good unidirectionality, and LED and super luminescent diode have low power consumption.

[0084] The optical signal output by the light source 113 is transmitted to the optical fiber interface 114, and then transmitted to the optical fiber interface 121 via the optical fiber 13. The light source 113 only needs to output one optical signal, and the optical fiber 13 may only include one optical fiber.

[0085] The photodetector 122 is used to receive the optical signal through the optical fiber interface 121 and the optical waveguide, generate an electrical signal according to the optical signal, and complete the conversion of the optical signal to the electrical signal. The electrical signal obtained after the conversion carries the information of the optical signal. The photoelectric conversion process performed by the photodetector 122 is the reverse process of the driver chip 112 driving the light source 113 to modulate the signal. The photodetector 122 is also used to output the converted electrical signal to the electrical chip 124, which amplifies and restores the electrical signal and outputs it to the depolymerization chip 123.

[0086] The deaggregation chip 123 is used to receive an electrical signal output by the photodetector 122, and deaggregate the electrical signal into multiple electrical signals. The process of deaggregation of the electrical signal by the deaggregation chip 123 is the reverse process of aggregating the electrical signal by the signal aggregation chip 111. The deaggregation chip 123 is also coupled to other hardware modules managed by the large board or the small board, and is used to send the deaggregated electrical signal to other hardware modules. For example, when the receiving module 12 is set in the small board, the deaggregation chip 123 is coupled to the external screen, and is used to transmit the deaggregated screen display information to the external screen. The deaggregation chip 123 can be implemented as an FPGA.

[0087] The present invention is not limited to amplifying and restoring the electrical signal before the electrical signal enters the de-aggregation chip 123. In other embodiments, the electrical chip may be coupled to the de-aggregation chip 123, and multiple electrical chips may be provided to amplify and restore the multi-channel electrical signals output by the de-aggregation chip 123. In addition, the multiple electrical chips may be coupled to other hardware modules managed by the large board or the small board to send the electrical signals obtained by de-aggregation and restoration to other hardware modules.

[0088] Since the power consumption of low-speed signal aggregation is low, Figure 2A When the optical transmission structure shown is used to aggregate multiple low-speed electrical signals into one high-speed electrical signal, the transmission of multiple signals can be completed with lower power consumption. Figure 2A The optical transmission structure shown requires only one optical fiber and one light source, and requires low power consumption. The low-speed signal may refer to a signal whose transmission speed is lower than the first value.

[0089] Figure 2B Shown based on Figure 2A The signal transmission method of the optical transmission structure shown.

[0090] like Figure 2B As shown, the method may include:

[0091] S11, the signal aggregation chip 111 aggregates multiple electrical signals into one electrical signal.

[0092] S12, the driving chip 112 drives the light source 113 to convert one electrical signal into one optical signal.

[0093] S13 , an optical signal output by the light source 113 is transmitted to the photodetector 122 via the optical fiber interface 114 , the optical fiber 13 , and the optical fiber interface 114 .

[0094] S14, the photodetector 122 converts one optical signal into one electrical signal.

[0095] S15, the deaggregation chip 123 deaggregates one electrical signal into multiple electrical signals.

[0096] Optionally, the electrical signal converted by the depolymerization chip 123 enters the electrical chip 124, which amplifies and restores the electrical signal and outputs the original electrical signal. Alternatively, before the depolymerization chip 123, the electrical chip 124 first receives the electrical signal output by the photodetector 122, completes the amplification and restoration of the electrical signal, and then outputs it to the depolymerization chip 123.

[0097] At this point, through optical transmission, signal transmission is completed between the transmitting module 11 and the receiving module 12. The receiving module 12 can send the depolymerized multi-channel electrical signals to other coupled hardware modules, and the other hardware modules can further work according to the received electrical signals.

[0098] Example 2

[0099] In this embodiment, the foldable electronic device converts each electrical signal into an optical signal and transmits them separately.

[0100] Figure 3A The light transmission structure in Embodiment 2 is shown.

[0101] like Figure 3A As shown, the optical transmission structure includes a transmitting module 21 and a receiving module 22 .

[0102] The transmitting module 11 includes: a driving chip 212, multiple light sources 213, and multiple optical fiber interfaces 214. The driving chip 212, the light sources 213, and the optical fiber interfaces 214 are coupled in sequence, one light source is coupled to one optical fiber interface, and an optical waveguide is arranged between the light source and the optical fiber interface for transmitting optical signals.

[0103] The receiving module 22 includes: a plurality of optical fiber interfaces 221, a plurality of photodetectors 222, and a plurality of electrical chips 223. The optical fiber interfaces 221, the photodetectors 222, and the electrical chips 223 are coupled in sequence, one optical fiber interface 221 is coupled to one photodetector 222, one photodetector 222 is coupled to one electrical chip 223, and an optical waveguide is arranged between the optical fiber interfaces 221 and the photodetectors 222 for transmitting optical signals.

[0104] The transmitting module 11 and the receiving module 22 are connected via an optical fiber 23. The optical fiber 23 includes a plurality of optical fibers, and one optical fiber is connected to one optical fiber interface 114 and one optical fiber interface 121.

[0105] A light source 213, a fiber optic interface 214, an optical fiber, a fiber optic interface 221 and a photodetector 222 form a light path. Figure 3A The light transmission structure shown includes multiple light paths.

[0106] The multiple optical fibers included in the optical fiber 23 can be arranged on the FPC, which can reduce the width of the FPC, thereby enhancing the reliability of the foldable parts of the foldable electronic device, such as the hinge, and leaving sufficient space for the optimized design of the hinge and the battery.

[0107] The case where the transmitting module 21 and the receiving module 22 are arranged in the large board and the small board can refer to the first embodiment.

[0108] The driver chip 212 is also coupled to other hardware modules managed by the large board or the small board, and is used to receive electrical signals from other hardware modules. For example, when the transmitting module 21 is set in the large board, the driver chip 212 is coupled to the inner screen to receive the screen display information of the inner screen. The driver chip 212 is used to receive multiple electrical signals, output drive signals to multiple light sources 213 respectively according to the multiple electrical signals, and modulate the information carried by the multiple electrical signals onto multiple optical signals respectively. Among them, the driver chip 212 outputs a drive signal to a light source 213 according to one electrical signal, controls the brightness, amplitude, intensity, phase, frequency, polarization and other parameters of the optical signal emitted by the one light source 213, so as to modulate the information carried by the one electrical signal onto the optical signal output by the light source 213. Optionally, the driver chip 212 can be used to receive multiple high-speed electrical signals. A high-speed signal can refer to a signal with a transmission speed higher than a second value.

[0109] The light source 213 is used to receive the driving signal output by the driving chip 212, and emits an optical signal modulating the information carried by an electrical signal under the drive of the driving signal. Since multiple electrical signals need to be modulated, the number of light sources 213 is multiple. The light source 213 can be an EEL, a VCSEL, a superluminescent diode, an LED, etc.

[0110] The optical signal output by the light source 213 is transmitted to the coupled optical fiber interface 114, and then transmitted to the optical fiber interface 121 via one of the coupled optical fibers 23. The light source 113 needs to output multiple optical signals, and the optical fiber 23 may include multiple optical fibers, and one optical fiber transmits one optical signal.

[0111] The photodetector 222 is used to receive an optical signal transmitted through the coupled optical fiber interface 221 and the optical waveguide, generate an electrical signal according to the optical signal, and complete the conversion from the optical signal to the electrical signal. The converted electrical signal carries the information of the optical signal. Multiple photodetectors 222 are used to complete the photoelectric conversion of multiple optical signals.

[0112] The electrical signal converted by the photodetector 222 enters the electrical chip 223, which amplifies and restores the electrical signal and outputs the original electrical signal. The electrical chip 223 is also coupled to other hardware modules managed by the large board or the small board to send the electrical signal obtained by photoelectric conversion to other hardware modules. For example, when the receiving module 22 is set in the small board, the electrical chip 223 is coupled to the external screen to transmit the depolymerized screen display information to the external screen.

[0113] Figure 3A The optical transmission structure shown adopts a multi-light source method to convert multiple electrical signals into optical signals and transmit them separately. There is no need to aggregate the electrical signals, which can reduce the power consumption required for aggregation.

[0114] exist Figure 3A In the optical transmission structure shown, the number of light sources, the number of photodetectors and the number of optical fibers can all be x, where x is a positive integer greater than or equal to 2.

[0115] Figure 3B Shown based on Figure 3A The signal transmission method of the optical transmission structure shown.

[0116] like Figure 3B As shown, the method may include:

[0117] S21 , the driving chip 212 drives the multiple light sources 213 to convert multiple electrical signals into multiple optical signals, and one electrical signal is converted into one optical signal by one light source 113 .

[0118] S22 , the multiple optical signals output by the multiple light sources 213 are transmitted to the multiple photodetectors 222 via the multiple optical fiber interfaces 214 , the optical fibers 23 , and the multiple optical fiber interfaces 214 .

[0119] S23, the multiple photodetectors 222 convert the multiple optical signals into multiple electrical signals, and one optical signal is converted into one electrical signal by one photodetector 222.

[0120] Optionally, the electrical signal converted by the photodetector enters an electrical chip, which amplifies and restores the electrical signal and outputs the original electrical signal.

[0121] At this point, through optical transmission, signal transmission is completed between the transmitting module 21 and the receiving module 22. The receiving module 22 can send the multiple electrical signals converted by the multiple photodetectors 222 to other coupled hardware modules, and the other hardware modules can further work according to the received electrical signals.

[0122] Example 3

[0123] In this embodiment, the foldable electronic device is configured with multiple light sources that can emit light of different wavelengths, the light output by each light source is divided into multiple light rays, and the conversion of electrical signals to optical signals is completed through silicon photonics technology.

[0124] Figure 4A The light transmission structure in Example 3 is shown.

[0125] like Figure 4A As shown, the optical transmission structure includes: a transmitting module 31 and a receiving module 32. The transmitting module 31 and the receiving module 32 are coupled by multiple optical fibers ( Figure 4A Only one optical fiber is shown), both the transmitting module 31 and the receiving module 32 may be provided with an optical fiber interface to connect the optical fiber.

[0126] The transmitting module 31 includes: a plurality of light sources and a plurality of optical splitters.

[0127] Multiple light sources are used to emit light of different wavelengths. For example, the transmitting module 31 may include a light source 311A, a light source 311B, a light source 311C, and a light source 311D, and the wavelengths of light emitted by any two of the four light sources are different. The light source may be a superluminescent diode, EEL, VCSEL, LED, etc. Among them, if the light source is an LED or a superluminescent diode, it can not only meet the signal strength required for short-distance transmission, but also reduce power consumption as much as possible.

[0128] The spectrometer is used to split a light beam output by a light source into multiple light beams. The number of splits depends on the number of electrical signals carried by the light beam emitted by the light source. The maximum value of this number is related to the hardware connection relationship inside the device and the number of electrical signals currently required to be transmitted. The number of splits must also ensure that after splitting, the intensity of each light beam is greater than or equal to the minimum recognition intensity of the receiving module 32, so as to ensure the reliability of information transmission. The number of light beams split by each light source can be the same or different.

[0129] Each light source is coupled to a beam splitter, for example, light source 311A ​​is coupled to beam splitter 312A, light source 311B is coupled to beam splitter 312B, light source 311C is coupled to beam splitter 312C, and light source 311D is coupled to beam splitter 312D.

[0130] For example, Figure 4AAs shown, the light emitted by the light source 311A ​​passes through the beam splitter 312A and is divided into 7 light rays. Each light ray corresponds to a signal transmission channel, that is, Figure 4A A signal interface in the transmitter module 31 shown. The signal interface is Figure 4A In the figure, a circle represents a signal interface of other hardware modules managed by a large board or a small board, which is used to receive an electrical signal sent by other hardware modules. The light splitting conditions of light source 311B, light source 311C, and light source 311D are similar to those of light source 311A, but Figure 4A Not shown. For example, the light separated by the light source 311A ​​corresponds to the first column signal interface in the transmitting module 311, the light separated by the light source 311B corresponds to the second column signal interface in the transmitting module 311, the light separated by the light source 311C corresponds to the third column signal interface in the transmitting module 311, and the light separated by the light source 311D corresponds to the fourth column signal interface in the transmitting module 311. Each column signal interface can be used to receive electrical signals of the same or similar speeds, and different column signal interfaces are used to receive electrical signals of different speeds. For example, the first column signal interface is used to receive GPIO signals, the second column signal interface is used to receive I / O signals, and the third column signal interface is used to receive mobile industry processor interface (MIPI) signals, etc. Of course, in other embodiments, the speed of the signals received by each column or row signal interface may not be limited.

[0131] For each row of signal interfaces in the transmitting module 31, any two signal interfaces correspond to light of different wavelengths, and any two signal interfaces are used to receive electrical signals of different speeds. Figure 4A The figure on the upper right side of the figure shows the transmitting structure corresponding to the last row signal interface (such as signal interface ad) in the transmitting module 31, which is used to modulate multiple electrical signals of different speeds received by the row signal interface onto light lines of different wavelengths. Figure 4A As shown, the transmitting structure includes: multiple optical modulators, multiple electrical chips, and a coupler 315. The number of optical modulators is the same as the number of light sources. For example, the multiple optical modulators include optical modulators 313A-313D. The number of multiple electrical chips is also the same as the number of light sources. For example, the multiple electrical chips may include electrical chips 314A-314D. An optical modulator is coupled to an electrical chip, each optical modulator is coupled to a coupler, and the coupler is coupled to an optical fiber (such as Figure 4A Fiber 316) shown coupled.

[0132] like Figure 4AAs shown, one path of light (such as the four paths of light in the figure) separated from each of the multiple light sources enters the emission structure through the optical waveguide, and one path of light enters an optical modulator. A row of signal interfaces corresponds to multiple electrical signals of different speeds received entering the emission structure, and one electrical signal enters an electrical chip. The electrical chip outputs a modulation current to the coupled optical modulator according to the waveform information of the received electrical signal. The optical modulator uses the plasma dispersion effect to change the phase of the received optical signal according to the modulation current, thereby modulating the information carried by the electrical signal onto the optical signal, thereby realizing the conversion of the electrical signal to the optical signal. After the multiple optical modulators output multiple modulated optical signals of different wavelengths, the multiple optical signals enter the coupler via the optical waveguide, and the coupler couples the multiple optical signals of different wavelengths into one optical signal, and then the one optical signal enters an optical fiber 316 for further transmission. Optical signals of different wavelengths will not interfere in the same optical fiber 316, and the use of one optical fiber can save the number of optical fibers.

[0133] The light source and the electronic chip can be arranged in parallel, which has the following effects: 1. The optical path can be better designed by opening a light window on the side of the electronic chip without the need for optical waveguide steering; 2. When arranged in parallel, temperature measurement units and cooling units can be added around the light source to accurately measure and control the temperature of the light source, thereby avoiding the influence of excessive temperature on the emission power of the light source and maintaining the stability of the light output of the light source.

[0134] Each row of signal interfaces in the transmitting module 31, that is, multiple signal interfaces corresponding to multiple different wavelengths, has Figure 4A The emission structure shown is for the sake of simplicity of the drawings. Figure 4A Not all are shown. For example, Figure 4A Each light source separates 7 rays, so there are 7 corresponding emission structures. The coupler in each emission structure is coupled to an optical fiber, and multiple optical fibers coupled to multiple emission structures connect the emission module 31 and the receiving module 32. The number of multiple rays is equal to the number of multiple emission structures.

[0135] The receiving module 32 includes: a plurality of receiving structures.

[0136] The multiple receiving structures are respectively connected to the multiple light beams of the transmitting module 31, and one receiving structure is connected to one optical fiber. One receiving structure is used to divide one optical signal containing different wavelengths transmitted from the transmitting module 31 through one optical fiber into multiple optical signals with different wavelengths, and convert them into electrical signals respectively. Figure 4AAs shown, the receiving structure may include: a demultiplexer 317, multiple photodetectors, and multiple electrical chips. The number of the multiple photodetectors is the same as the number of light sources, for example, the multiple photodetectors include photodetectors 318A-318D. The number of the multiple electrical chips is the same as the number of light sources, for example, the multiple electrical chips include electrical chips 319A-319D. The demultiplexer 317 is coupled to the multiple photodetectors, and one photodetector is coupled to an electrical chip.

[0137] like Figure 4A As shown, the demultiplexer 317 is connected to an optical fiber (such as optical fiber 316) in the transmitting module 31, and is used to separate one optical signal containing different wavelengths in the optical fiber into multiple optical signals with different wavelengths. The multiple optical signals with different wavelengths enter the photodetector through the optical waveguide, and one optical signal enters one photodetector. The photodetector is used to detect the optical signal and convert the detected optical signal into an electrical signal. The electrical signal converted by the photodetector enters the electrical chip, which amplifies and restores the electrical signal and outputs the original electrical signal. The electrical signal output by the electrical chip is transmitted to the signal interface of the hardware module managed by the large board or the small board. As shown Figure 4A As shown, a circle in the receiving module 32 represents a signal interface of other hardware modules managed by the large board or the small board, which is used to output the electrical signal output by the electrical chip to other hardware modules. Figure 4A As shown, a plurality of electrical chips of the receiving structure shown therein can be coupled to the signal interface eh of the first row.

[0138] Each signal interface in the transmitting module 31 and the receiving module 32 has a corresponding relationship. The electrical signal received by the signal interface a in the transmitting module 31 is finally output to the signal interface corresponding to the signal interface in the receiving module 32. This corresponding relationship is determined by the hardware connection relationship between the transmitting module 31 and the receiving module 32. For example, refer to Figure 4A , the signal interface of the first row and first column of the transmitting module 31 corresponds to Figure 4A The transmission structure shown in the figure, the electrical signal received by the signal interface passes through the electrical chip 314A, is modulated into an optical signal by the optical modulator 313A, and then input to the optical fiber 316. Figure 4A The receiving structure shown is split by the multiplexer 317, detected by the photodetector 318A and converted into an electrical signal, and then amplified and restored by the electrical chip 319B. The output end of the electrical chip 319B is coupled to the signal interface of the hardware module (i.e., signal interface e). The above example process shows the corresponding relationship between the signal interface a and the signal interface e.

[0139] Not limited to Figure 4AA row of circles in the transmitter module 31 shown corresponds to electrical signals of the same or similar speed, a row of circles corresponds to electrical signals of different speeds, and a row of circles in the receiver module 32 corresponds to electrical signals of multiple different speeds. There may also be other signal port arrangements, which are not limited in the present application. For example, the circles corresponding to electrical signals of the same or similar speeds may be arranged in a circular shape, etc.

[0140] Figure 4A The optical transmission structure shown splits the light emitted by the light source, which can fully utilize the light source and reduce power consumption; and optical signals of different wavelengths are multiplexed into the same optical fiber for transmission, which reduces the amount of optical fiber used and further reduces the width of the FPC.

[0141] Figure 4A The optical transmission structure shown adopts a multi-light source splitting method to make full use of the light source, and uses silicon photonics technology to modulate a variety of electrical signals at different speeds into optical signals, and then synthesize the multiple optical signals into one optical signal, which can be used to transmit multiple signals at different speeds.

[0142] exist Figure 4A In the optical transmission structure shown, the number of light sources, the number of splitters, the number of electrical chips in each emission structure, and the number of optical modulators and photodetectors can all be m, where m is a positive integer greater than or equal to 2. Figure 4A The number of transmitting structures and the number of receiving structures included in the optical transmission structure shown can both be n, where n is a positive integer greater than or equal to 2. Figure 4A The multiple transmitting structures may include a first transmitting structure, and the multiple receiving structures may include a first receiving structure.

[0143] Figure 4B Shown based on Figure 4A The signal transmission method of the optical transmission structure shown.

[0144] like Figure 4B As shown, the method may include:

[0145] S31, multiple optical modulators in the emission structure receive multiple light rays, where the multiple light rays are light rays of different wavelengths separated from multiple light sources, and one light ray corresponds to one light source.

[0146] S32, the multiple electrical chips in the transmitting structure output modulation currents to the multiple optical modulators respectively according to the multiple electrical signals, so as to convert the multiple electrical signals into multiple optical signals.

[0147] S33, the coupler in the transmitting structure couples the multiple optical signals into one optical signal, and transmits the one optical signal to the demultiplexer in the receiving structure through the optical fiber.

[0148] S34, the demultiplexer in the receiving structure separates one optical signal into multiple optical signals with different wavelengths.

[0149] S35, multiple photodetectors in the receiving structure detect the multiple optical signals and convert the multiple optical signals into multiple electrical signals.

[0150] Optionally, S36, multiple electrical chips in the receiving structure amplify and restore multiple electrical signals, and then finally output multiple electrical signals.

[0151] At this point, through optical transmission, signal transmission is completed between the transmitting module 31 and the receiving module 32. The receiving module 32 can send the multi-channel electrical signals restored by multiple electrical chips to other coupled hardware modules, and the other hardware modules can further work according to the received electrical signals.

[0152] Figure 5 The hardware structure of the foldable electronic device 100 provided in an embodiment of the present application is exemplified.

[0153] like Figure 5 As shown, the foldable electronic device 100 may include a processor 101, a memory 102, a wireless communication module 103, a mobile communication module 104, an antenna 103A, an antenna 104A, a power switch 105, a sensor module 106, a focus motor 107, a camera 108, a display screen 109, etc. Among them, the sensor module 106 may include a gyroscope sensor 106A, an acceleration sensor 106B, an ambient light sensor 106C, an image sensor 106D, a distance sensor 106E, etc. Among them, the wireless communication module 103 may include a WLAN communication module, a Bluetooth communication module, etc. The above multiple parts can transmit data through a bus.

[0154] The processor 101 may include one or more processing units, for example, the processor 101 may include an application processor (AP), a modem processor, a graphics processor (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Different processing units may be independent devices or integrated into one or more processors.

[0155] The memory 102 may be used to store computer executable program codes, and the executable program codes may include instructions. The processor 101 executes various functional applications and data processing of the foldable electronic device 100 by running the instructions stored in the memory 102. The memory 102 may include a program storage area and a data storage area. In a specific implementation, the memory 102 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more disk storage devices, flash memory devices, or other non-volatile solid-state storage devices.

[0156] The wireless communication function of the foldable electronic device 100 can be implemented through the antenna 103A, the antenna 104A, the mobile communication module 104, the wireless communication module 103, the modem processor and the baseband processor.

[0157] Antenna 103A and antenna 104A can be used to transmit and receive electromagnetic wave signals. Each antenna in foldable electronic device 100 can be used to cover a single or multiple communication frequency bands. Different antennas can also be reused to improve the utilization of the antennas.

[0158] The mobile communication module 104 can provide solutions for wireless communications including 2G / 3G / 4G / 5G, etc., applied to the foldable electronic device 100. The mobile communication module 104 may include at least one filter, a switch, a power amplifier, a low noise amplifier (LNA), etc. The mobile communication module 104 can receive electromagnetic waves through the antenna 104A, and filter, amplify, etc. the received electromagnetic waves, and transmit them to the modulation and demodulation processor for demodulation. The mobile communication module 104 can also amplify the signal modulated by the modulation and demodulation processor, and convert it into electromagnetic waves for radiation through the antenna 104A.

[0159] The modulation and demodulation processor may include a modulator and a demodulator. The modulator is used to modulate the low-frequency baseband signal to be transmitted into a medium-high frequency signal. The demodulator is used to demodulate the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After the low-frequency baseband signal is processed by the baseband processor, it is transmitted to the application processor. The application processor outputs a sound signal through an audio device, or displays an image or video through the display screen 109.

[0160] The wireless communication module 103 can provide wireless communication solutions including wireless local area networks (WLAN), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR), etc., which are applied to the foldable electronic device 100. The wireless communication module 103 can be one or more devices integrating at least one communication processing module. The wireless communication module 103 receives electromagnetic waves via the antenna 103A, modulates the frequency of the electromagnetic wave signal and performs filtering, and sends the processed signal to the processor 101. The wireless communication module 103 can also receive the signal to be sent from the processor 101, modulate the frequency of the signal, amplify it, and convert it into electromagnetic waves for radiation through the antenna 103A.

[0161] The power switch 105 may be used to control the supply of power to the foldable electronic device 100 .

[0162] The gyroscope sensor 106A can be used to determine the motion posture of the foldable electronic device 100. In some embodiments, the angular velocity of the foldable electronic device 100 around three axes (i.e., x, y, and z axes) can be determined by the gyroscope sensor 106A. The gyroscope sensor 106A can be used for anti-shake shooting. For example, when the shutter is pressed, the gyroscope sensor 106A detects the angle of the shaking of the foldable electronic device 100, calculates the distance that the lens module needs to compensate based on the angle, and allows the lens to offset the shaking of the foldable electronic device 100 through reverse movement to achieve anti-shake. The gyroscope sensor 106A can also be used for navigation and somatosensory game scenes.

[0163] The acceleration sensor 106B can detect the magnitude of acceleration of the foldable electronic device 100 in various directions (generally three axes). When the foldable electronic device 100 is stationary, the magnitude and direction of gravity can be detected. It can also be used to identify the posture of the electronic device. For example, the acceleration sensor 106B can be applied to applications such as horizontal and vertical screen switching, pedometers, etc.

[0164] The ambient light sensor 106C is used to sense the brightness of the ambient light. The foldable electronic device 100 can adaptively adjust the brightness of the display screen 109 according to the perceived brightness of the ambient light. The ambient light sensor 106C can also be used to automatically adjust the white balance when taking pictures.

[0165] The image sensor 106D, also known as a photosensitive element, can utilize the photoelectric conversion function of the photoelectric device to convert the light image on the photosensitive surface into an electrical signal that is proportional to the light image. The image sensor can be a charge coupled device (CCD) sensor or a complementary metal-oxide-semiconductor (CMOS) sensor.

[0166] The distance sensor 106E can be used to measure the distance. The foldable electronic device 100 can measure the distance by infrared or laser. In some shooting scenarios, the foldable electronic device 100 can use the distance sensor 106E to measure the distance to achieve fast focusing.

[0167] The focus motor 107 can be used for fast focusing. The foldable electronic device 100 can control the movement of the lens through the focus motor 107 to achieve automatic focusing.

[0168] The foldable electronic device 100 can realize the shooting function through ISP, camera 108, video codec, GPU, display screen 109 and application processor.

[0169] The ISP is used to process the data fed back by the camera 108. For example, when taking a photo, the shutter is opened, and the light is transmitted to the camera photosensitive element through the lens. The light signal is converted into an electrical signal, and the camera photosensitive element transmits the electrical signal to the ISP for processing and converts it into an image visible to the naked eye. The ISP can also perform algorithm optimization on the noise and brightness of the image. The ISP can also optimize the exposure, color temperature and other parameters of the shooting scene. In some embodiments, the ISP can be set in the camera 108.

[0170] The camera 108 can be used to capture still images or videos. The object generates an optical image through the lens and projects it onto the image sensor. The image sensor can convert the optical signal into an electrical signal, and then transmit the electrical signal to the ISP to convert it into a digital image signal. The ISP can output the digital image signal to the DSP for processing. The DSP converts the digital image signal into an image signal in a standard RGB, YUV or other format. In some embodiments, the foldable electronic device 100 may include 1 or N cameras 193, where N is a positive integer greater than 1.

[0171] The video codec is used to compress or decompress digital images. The foldable electronic device 100 may support one or more image codecs. In this way, the foldable electronic device 100 can open or save pictures or videos in multiple encoding formats.

[0172] The foldable electronic device 100 can realize the display function through a GPU, a display screen 109, and an application processor. The GPU is a microprocessor for image processing, which connects the display screen 109 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. The processor 101 may include one or more GPUs, which execute program instructions to generate or change display information.

[0173] The display screen 109 is used to display images, videos, etc. The display screen 109 includes a display panel. The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), Miniled, MicroLed, Micro-oLed, a quantum dot light-emitting diode (QLED), etc. In some embodiments, the foldable electronic device 100 may include 1 or N display screens 109, where N is a positive integer greater than 1.

[0174] The display screen 194 includes the screen 120 and the screen 140 mentioned in the above embodiment. The screen 120 may include the following screens: screen 120A, screen 120B, or more screens. The sizes of screen 120A and screen 120B may be the same or different. Screen 120A and screen 120B may be independent screens, which are connected by a folding component and can be bent around the folding component at a folding position. Screen 120A and screen 120B may also be a whole flexible screen, and each screen is several parts of this whole flexible screen.

[0175] It is understood that the structure illustrated in the embodiment of the present invention does not constitute a specific limitation on the foldable electronic device 100. In other embodiments of the present application, the foldable electronic device 100 may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware.

[0176] In some embodiments, the foldable electronic device 100 may only be provided with the optical transmission structure shown in Example 1, such as a transmitting module 11 is provided on the large board, and a receiving module 12 is provided on the small board, so as to transmit signals from the large board to the small board; at the same time, a transmitting module 11 is provided on the small board, and a receiving module 12 is provided on the large board, so as to transmit signals from the small board to the large board.

[0177] In some embodiments, the foldable electronic device 100 may only be provided with the optical transmission structure shown in Example 2, such as a transmitting module 21 is provided on the large board, and a receiving module 22 is provided on the small board, so as to transmit signals from the large board to the small board; at the same time, a transmitting module 21 is provided on the small board, and a receiving module 22 is provided on the large board, so as to transmit signals from the small board to the large board.

[0178] In some embodiments, the foldable electronic device 100 may only be provided with the optical transmission structure shown in Example 3, such as a transmitting module 31 is provided on the large board, and a receiving module 32 is provided on the small board, so as to transmit signals from the large board to the small board; at the same time, a transmitting module 31 is provided on the small board, and a receiving module 32 is provided on the large board, so as to transmit signals from the small board to the large board.

[0179] In some implementations, the electronic device may be provided with the optical transmission structures shown in Examples 1 to 3 at the same time. When there are multiple low-speed signals to be transmitted, the optical transmission structure shown in Example 1 is selected to transmit the signals; when there are multiple high-speed signals to be transmitted, the optical transmission structure shown in Example 2 is selected to transmit the signals; when there are multiple signals of different speeds to be transmitted, the optical transmission structure shown in Example 3 is selected to transmit the signals.

[0180] The optical transmission structures introduced in the above-mentioned Examples 1 to 3 are all used to realize unidirectional transmission, such as transmitting signals from a large board to a small board, or from a small board to a large board. To realize bidirectional transmission, the optical transmission structure in any of Examples 1 to 3 can be set up in two sets, one set for transmitting signals from a large board to a small board, and the other set for transmitting signals from a small board to a large board.

[0181] It should be understood that each step in the above method embodiment can be completed by an integrated logic circuit of hardware in a processor or by instructions in the form of software. The method steps disclosed in the embodiments of the present application can be directly embodied as being executed by a hardware processor, or by a combination of hardware and software modules in a processor.

[0182] The present application also provides an electronic device, which may include: a memory and a processor. The memory may be used to store a computer program; the processor may be used to call the computer program in the memory so that the electronic device executes the method executed by the electronic device side in any of the above embodiments.

[0183] The present application also provides an electronic device, which may include: a memory and a processor. The memory may be used to store a computer program; the processor may be used to call the computer program in the memory so that the electronic device executes the method executed by the electronic device side in any of the above embodiments.

[0184] The present application also provides a chip system, which includes at least one processor for implementing the functions involved in the electronic device side in any of the above embodiments.

[0185] In one possible design, the chip system also includes a memory, which is used to store program instructions and data, and the memory is located inside or outside the processor.

[0186] The chip system may be composed of the chip, or may include the chip and other discrete devices.

[0187] Optionally, the processor in the chip system may be one or more. The processor may be implemented by hardware or by software. When implemented by hardware, the processor may be a logic circuit, an integrated circuit, etc. When implemented by software, the processor may be a general-purpose processor implemented by reading software code stored in a memory.

[0188] Optionally, the memory in the chip system may also be one or more. The memory may be integrated with the processor or may be separately arranged with the processor, which is not limited in the embodiments of the present application. Exemplarily, the memory may be a non-transient processor, such as a read-only memory ROM, which may be integrated with the processor on the same chip or may be arranged on different chips respectively. The embodiments of the present application do not specifically limit the type of memory and the arrangement of the memory and the processor.

[0189] Exemplarily, the chip system can be a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a system on chip (SoC), a central processor unit (CPU), a network processor (NP), a digital signal processor (DSP), a microcontroller unit (MCU), a programmable logic device (PLD) or other integrated chips.

[0190] The present application also provides a computer program product, which includes: a computer program (also referred to as code, or instruction), which, when executed, enables a computer to execute the method executed by the electronic device side in any of the above embodiments.

[0191] The present application also provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program (also referred to as code or instruction). When the computer program is executed, the computer executes the method executed by the electronic device side in any of the above embodiments.

[0192] The various implementation modes of the present application can be combined arbitrarily to achieve different technical effects.

[0193] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from a website site, computer, server or data center to another website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.) mode. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that includes one or more available media integrated. The available medium can be a magnetic medium (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state disk (SSD)), etc.

[0194] Those skilled in the art can understand that to implement all or part of the processes in the above-mentioned embodiments, the processes can be completed by computer programs to instruct related hardware, and the programs can be stored in computer-readable storage media. When the programs are executed, they can include the processes of the above-mentioned method embodiments. The aforementioned storage media include: ROM or random access memory RAM, magnetic disk or optical disk and other media that can store program codes.

[0195] In the description of the embodiments of the present application, unless otherwise specified, “ / ” means or, for example, A / B can mean A or B; the “and / or” in the text is merely a description of the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, “multiple” refers to two or more than two.

[0196] The terms "first" and "second" are used for descriptive purposes only and should not be understood to imply or suggest relative importance or implicitly indicate the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more.

[0197] In short, the above is only an embodiment of the technical solution of this application, and is not intended to limit the protection scope of this application. Any modification, equivalent replacement, improvement, etc. made according to the disclosure of this application shall be included in the protection scope of this application.

Claims

1. A light transmission structure, characterized in that: include: Transmitter module, receiving module, n optical fibers, The transmitting module comprises: m light sources, m optical splitters, and n transmitting structures, one light source is coupled to one optical splitter, and each transmitting structure is coupled to the m optical splitters; the n transmitting structures comprise a first transmitting structure, and the first transmitting structure comprises: m electrical chips, m optical modulators, and a coupler, one electrical chip is coupled to one optical modulator, one optical modulator is used to couple to one optical splitter, and the m optical modulators are all coupled to the coupler; The receiving module includes n receiving structures, the n receiving structures include a first receiving structure, the first receiving structure includes: a demultiplexer, m photodetectors, the demultiplexer is coupled to the m photodetectors; An optical fiber couples a coupler in a transmitting structure and a demultiplexer in a receiving structure; in, Different light sources are used to emit light of different wavelengths, and the beam splitter is used to separate the light emitted by the coupled light source into multiple light beams; an optical modulator for receiving a light beam separated by the coupled optical splitter; An electrical chip is used to receive an electrical signal and control a coupled optical modulator to modulate a light received by the coupled optical modulator into an optical signal, wherein the optical signal carries information carried by the electrical signal; the coupler is used to couple the m optical signals modulated by the m optical modulators into an optical signal, and the first optical fiber among the multiple optical fibers is used to transmit the optical signal coupled by the coupler to the demultiplexer in the receiving module; The demultiplexer is used to receive one optical signal coupled by the coupler from the first optical fiber, and separate the one optical signal coupled by the coupler into m optical signals of different wavelengths; a photodetector is used to receive one optical signal separated by the demultiplexer, and convert the one optical signal separated by the demultiplexer into one electrical signal.

2. A light transmission structure, characterized in that: include: Transmitter module, receiving module, optical fiber, The transmitting module comprises: a signal aggregation chip, a driving chip, and a light source, wherein the signal aggregation chip, the driving chip, and the light source are coupled in sequence; The receiving module comprises: a photodetector and a depolymerization chip, wherein the photodetector and the depolymerization chip are coupled; The optical fiber couples the light source and the photodetector; in, The signal aggregation chip is used to receive multiple electrical signals and aggregate the multiple electrical signals into one electrical signal; The driving chip is used to drive the light source to output an optical signal according to the electrical signal, wherein the optical signal carries the information carried by the electrical signal; The optical fiber is used to transmit the optical signal to the photodetector; The photoelectric detector is used to receive the optical signal from the optical fiber and convert the optical signal into an electrical signal; The depolymerization chip is used to depolymerize one channel of electrical signals output by the photoelectric detector into multiple channels of electrical signals.

3. A light transmission structure, characterized in that: include: Transmitter module, receiving module, x optical fibers, The transmitting module comprises: a driving chip, x light sources, the driving chip and the multiple light sources are coupled; The receiving module includes: x photoelectric detectors; An optical fiber is coupled to a light source and a photodetector; in, The driving chip is used to receive multiple electrical signals, and drive a light source to output an optical signal according to one electrical signal, wherein the electrical signal carries the information carried by the electrical signal; An optical fiber is used to transmit an optical signal output by a coupled light source to a coupled photodetector; A photodetector is used to receive an optical signal from the coupled optical fiber and convert the optical signal into an electrical signal.

4. A foldable electronic device, characterized in that: The foldable electronic device comprises: a first main board, a second main board and a screen; The screen of the foldable electronic device includes: a first screen, a second screen and a third screen, wherein the first screen and the second screen are connected via a foldable component; when the device form of the foldable electronic device is in an open state, the display surface of the first screen and the display surface of the second screen are on the same side of the foldable electronic device, and the display surface of the third screen is located on the opposite side of the foldable electronic device to the display surface of the first screen and the display surface of the second screen; The first mainboard is used to control the first screen and the second screen, and the second mainboard is used to control the third screen; The foldable electronic device includes a first optical transmission structure, which is the optical transmission structure described in claim 1. The transmitting module in the first optical transmission structure is arranged on the first main board, the receiving module in the first optical transmission structure is arranged on the second main board, and n optical fibers in the first optical transmission structure pass through the folding component.

5. The foldable electronic device according to claim 4, characterized in that: The foldable electronic device also includes a second optical transmission structure, which is the optical transmission structure described in claim 1, wherein the transmitting module in the second optical transmission structure is arranged on the second main board, the receiving module in the second optical transmission structure is arranged on the first main board, and the n optical fibers in the second optical transmission structure pass through the folding component.

6. The foldable electronic device according to claim 4 or 5, characterized in that: The m first electrical chips in the transmitting module in the first optical transmission structure are used to receive electrical signals of different rates.

7. The foldable electronic device according to any one of claims 4 to 6, characterized in that: The foldable electronic device also includes a third optical transmission structure, which is the optical transmission structure described in claim 2. The transmitting module in the third optical transmission structure is arranged on the first main board, the receiving module in the third optical transmission structure is arranged on the second main board, and the optical fiber in the third optical transmission structure passes through the folding component.

8. The foldable electronic device according to any one of claims 4 to 7, characterized in that: The foldable electronic device also includes a fourth optical transmission structure, which is the optical transmission structure described in claim 2, wherein the transmitting module in the fourth optical transmission structure is arranged on the second main board, the receiving module in the fourth optical transmission structure is arranged on the first main board, and the optical fiber in the fourth optical transmission structure passes through the folding component.

9. The foldable electronic device according to claim 7, characterized in that: The signal aggregation chip in the third optical transmission structure is used to receive multiple low-speed electrical signals, and the rate of the low-speed electrical signals is less than the first value.

10. The foldable electronic device according to any one of claims 4 to 9, characterized in that: The foldable electronic device also includes a fifth optical transmission structure, which is the optical transmission structure described in claim 3. The transmitting module in the fifth optical transmission structure is arranged on the first main board, the receiving module in the fifth optical transmission structure is arranged on the second main board, and the x optical fibers in the fifth optical transmission structure pass through the folding component.

11. The foldable electronic device according to any one of claims 4 to 10, characterized in that: The foldable electronic device also includes a sixth optical transmission structure, which is the optical transmission structure described in claim 3. The transmitting module in the sixth optical transmission structure is arranged on the second main board, the receiving module in the sixth optical transmission structure is arranged on the first main board, and the x optical fibers in the sixth optical transmission structure pass through the folding component.

12. The foldable electronic device according to claim 10, characterized in that: The driving chip in the fifth optical transmission structure is used to receive multiple high-speed electrical signals, and the rate of the high-speed electrical signals is greater than the second value.

13. A signal transmission method, characterized in that: The method is applied to the foldable electronic device according to any one of claims 4 to 12, and the method comprises: A first mainboard in the foldable electronic device generates a first signal; The foldable electronic device transmits the first signal to the second mainboard through the first optical transmission structure.

14. The method according to claim 13, characterized in that The method is applied to the foldable electronic device according to claim 5, and the method further comprises: A second mainboard in the foldable electronic device generates a second signal; The foldable electronic device transmits the second signal to the first mainboard through the second optical transmission structure.

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