Electronic device

Abstract

The present disclosure relates to an electronic device. The electronic device comprises a rotating mechanism, a middle frame and a circuit board. One side of the middle frame is connected with the rotating mechanism, and the circuit board is arranged on the other side of the middle frame. The circuit board comprises a first sub-circuit board and a second sub-circuit board stacked in a first direction. The first sub-circuit board comprises a first part and a second part connected in a second direction. The first sub-circuit board comprises a first surface and a second surface arranged oppositely. The second surface of the first part is opposite to the second sub-circuit board, and at least a part of the second surface of the second part is used to be opposite to the middle frame. The design of the second part of the first sub-circuit board of the present disclosure increases the area of the circuit board, reduces the layout length of the stacked circuit board, and further reduces the overall size of the electronic device or increases the volume of the battery module.

Description

Technical Field

[0001] This disclosure relates to the field of electronic product technology, and more particularly to an electronic device. Background Technology

[0002] In recent years, as the technology in the field of electronic devices has become more and more mature, foldable screen devices have also increasingly pursued a thinner and more portable design. In order to achieve the above-mentioned technical effects, the solution adopted in related technologies is to shorten the width of the hinge area of ​​the foldable screen and to set the mid-frame of the foldable screen and the circuit board side by side.

[0003] However, such a solution is difficult to implement and ignores the empty space above the hinge area. The existence of empty space above the hinge area is not conducive to the development of thinner and more portable electronic devices. Summary of the Invention

[0004] To overcome the aforementioned technical problems in related technologies, this disclosure provides an electronic device.

[0005] According to a first aspect of the present disclosure, an electronic device is provided, including a rotating mechanism; a mid-frame, one side of which is connected to the rotating mechanism; and a circuit board disposed on the other side of the mid-frame, the circuit board including a first sub-circuit board and a second sub-circuit board stacked on top of each other in a first direction, the first sub-circuit board including a first part and a second part connected to each other in a second direction.

[0006] The first sub-circuit board includes a first surface and a second surface disposed opposite to each other in the first direction, the second surface of the first part is opposite to the second sub-circuit board, and at least a portion of the second surface of the second part is opposite to the middle frame.

[0007] In some embodiments, the circuit board includes a support portion disposed at a position where the first portion and the second portion of the first sub-circuit board are connected, and the support portion is located on the second surface of the first sub-circuit board.

[0008] In some embodiments, the circuit board includes an adapter plate disposed between the first sub-circuit board and the second sub-circuit board. The adapter plate includes a first side and a second side disposed opposite to each other. The first side forms a receiving space for accommodating electronic components with the first sub-circuit board and the second sub-circuit board. The support portion is connected to at least a portion of the second side of the adapter plate.

[0009] In some embodiments, the first sub-circuit board includes a contact layer disposed on the second surface of the second portion.

[0010] In some embodiments, the middle frame includes a third part and a fourth part, the circuit board is disposed on the third part, wherein at least a portion of the second side of the second part of the first sub-circuit board is opposite to the fourth part of the middle frame.

[0011] In some embodiments, the fourth part includes a third surface and a fourth surface disposed opposite to each other in the first direction, the third surface being in contact with the contact layer.

[0012] In some embodiments, the middle frame includes an adhesive layer disposed on the third surface, the adhesive layer being in contact with the contact layer.

[0013] In some embodiments, the third part is provided with a receiving groove, at least a portion of the circuit board is disposed in the receiving groove, the receiving groove includes a sidewall, the sidewall includes a clearance portion, and the clearance portion is disposed opposite to the support portion.

[0014] In some embodiments, the avoidance portion corresponds one-to-one with the support portion.

[0015] In some embodiments, the circuit board further includes a shield disposed on the first side of the first sub-circuit board, the shield covering at least a portion of the second part.

[0016] In some embodiments, the rotating mechanism includes a hinge mechanism and a linkage mechanism, the linkage mechanism being rotatable relative to the hinge mechanism and connected to the middle frame to support the middle frame.

[0017] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0018] The electronic device circuit board provided in the embodiments of this disclosure includes a first sub-circuit board and a second sub-circuit board. The second side of the first part of the first sub-circuit board is opposite to the second sub-circuit board. At least a portion of the second side of the second part of the first sub-circuit board is used to face the middle frame, so that the second part of the first sub-circuit board presents a suspended design. Thus, the second part of the first sub-circuit board can occupy the empty space above the middle frame. The suspended second part of the first sub-circuit board increases the area of ​​the circuit board, which can reduce the layout length of the stacked circuit boards, thereby reducing the overall size of the electronic device or increasing the volume of the battery module.

[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0021] Figure 1 This is a schematic diagram of a circuit board structure according to an exemplary embodiment.

[0022] Figure 2 This is a schematic diagram of the structure of a mid-frame according to an exemplary embodiment.

[0023] Figure 3 This is a schematic diagram of an assembly structure of an electronic device according to an exemplary embodiment.

[0024] Figure 4 This is a partially enlarged schematic diagram of the connection between a circuit board and a mid-frame, according to an exemplary embodiment.

[0025] Figure 5 This is a schematic diagram illustrating the assembly of a middle frame and a rotating mechanism according to an exemplary embodiment.

[0026] Figure label:

[0027] Circuit board 1, middle frame 2, electronic equipment 3;

[0028] First sub-circuit board 10, first surface 101, second surface 102, first part 110, second part 120, contact layer 130, second sub-circuit board 20, support part 30, adapter plate 40, first side 401, second side 402, first shielding cover 510, second shielding cover 520;

[0029] Third part 210, receiving groove 211, side wall 212, clearance part 213, fourth part 220, third surface 221, fourth surface 222, adhesive layer 230;

[0030] Rotating mechanism 60, hinge mechanism 610, linkage mechanism 620. Detailed Implementation

[0031] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the claims.

[0032] In recent years, as the technology in the field of electronic devices has become more and more mature, various electronic devices have shown a trend towards being lighter and more portable. Foldable screen devices are also increasingly pursuing a thinner and more portable design. In order to achieve the above-mentioned technical effects, the solution adopted in related technologies is to shorten the width of the hinge area of ​​the foldable screen as much as possible, and to set the middle frame of the foldable screen and the circuit board side by side.

[0033] However, such a solution involves issues such as the transmission of hinge mechanisms and linkage mechanisms, which are difficult to implement. It also ignores the empty space above the pivot area of ​​the middle frame. The existence of empty space above the pivot area is not conducive to the development of thinner and more portable electronic devices.

[0034] To address the aforementioned technical problems, an electronic device is provided according to embodiments of this disclosure.

[0035] The electronic device disclosed herein includes a rotating mechanism; a mid-frame, one side of which is connected to the rotating mechanism; and a circuit board disposed on the other side of the mid-frame. The circuit board includes a first sub-circuit board and a second sub-circuit board stacked on top of each other in a first direction. The first sub-circuit board includes a first part and a second part connected to each other in a second direction. The first sub-circuit board includes a first surface and a second surface disposed opposite to each other in the first direction. The second surface of the first part is opposite to the second sub-circuit board, and at least a portion of the second surface of the second part is opposite to the mid-frame.

[0036] In this disclosure, the first direction and the second direction can be different. The first direction can be the thickness direction of the electronic device. For example, the electronic device may include a display screen, and the direction in which the display surface of the display screen faces the back can be considered the thickness direction of the electronic device. Alternatively, the direction from the display screen towards the mid-frame can be the thickness direction of the electronic device. The second direction can be a direction parallel to an extending plane of the electronic device. For example, the second direction can be a direction parallel to an extending plane of the display screen.

[0037] The circuit board provided in the embodiments of this disclosure has a second side of the first part of the first sub-circuit board facing the second sub-circuit board. At least a portion of the second side of the second part of the first sub-circuit board is used to face the middle frame, so that the second part of the first sub-circuit board presents a suspended design. Thus, the second part of the first sub-circuit board can occupy the empty space above the middle frame. The design of the second part increases the surface area of ​​the circuit board, which can reduce the board length of the stacked circuit boards, thereby reducing the overall size of the electronic device or increasing the volume of the battery module.

[0038] Figure 1 This is a schematic diagram of a circuit board structure according to an exemplary embodiment.

[0039] Reference Figure 1 As shown, an electronic device 3 is provided. The electronic device 3 may include a rotating mechanism 60, a middle frame 2, and a circuit board 1. One side of the middle frame 2 is connected to the rotating mechanism 60, and the circuit board 1 is disposed on the other side of the middle frame 2. The circuit board 1 may include a first sub-circuit board 10 and a second sub-circuit board 20 stacked on each other in a first direction. The first sub-circuit board 10 may include a first part 110 and a second part 120 connected to each other in a second direction.

[0040] The first sub-circuit board 10 may include a first surface 101 and a second surface 102 disposed opposite to each other in a first direction. The second surface 102 of the first part 110 is opposite to the second sub-circuit board 20, and at least a portion of the second surface 102 of the second part 120 is used to be opposite to the middle frame 2.

[0041] Specifically, the first sub-circuit board 10 and the second sub-circuit board 20 are stacked in a first direction, and the first sub-circuit board 10 and the second sub-circuit board 20 have different extension lengths in a second direction. The first part 110 of the first sub-circuit board 10 is stacked opposite to the second sub-circuit board 20, and the second part 120 of the first sub-circuit board 10 is suspended. At least a portion of the second surface 102 of the second part 120 of the first sub-circuit board 10 is used to face the middle frame 2. The overall shape of the circuit board 1 is such that the first part 110 of the first sub-circuit board 10 is stacked with the second sub-circuit board 20 in the first direction, and the second part 120 of the first sub-circuit board 10 extends outward in the second direction from the position where the first part 110 and the second part 120 of the first sub-circuit board 10 meet, and is in a suspended state.

[0042] It should be noted that, structurally, the first sub-circuit board 10 is not limited to printed circuit boards (PCBs) or flexible printed circuit boards (FPCs). Functionally, the first sub-circuit board 10 is not limited to motherboards, module boards, frame boards, radio frequency boards (RFPCBs), etc. In this disclosure, no specific limitations are made on the material, structure, or function of the first sub-circuit board 10.

[0043] Structurally, the second sub-circuit board 20 is not limited to printed circuit boards (PCBs) or flexible printed circuit boards (FPCs). Functionally, the second sub-circuit board 20 is not limited to motherboards, module boards, frame boards, radio frequency boards (RFPCBs), etc. In this disclosure, no specific limitations are made on the material, structure, or function of the second sub-circuit board 20.

[0044] In an exemplary embodiment of this disclosure, the circuit board 1 may include a support portion 30, which is disposed at the position where the first part 110 and the second part 120 of the first sub-circuit board 10 are connected, and the support portion 30 is located on the second surface 102 of the first sub-circuit board 10.

[0045] Specifically, the support portion 30 is located at the junction of the first part 110 and the suspended second part 120 of the first sub-circuit board 10. The support portion 30 can strengthen the connection between the first part 110 and the second part 120, thereby improving the structural strength of the first sub-circuit board 10. The support portion 30 can also distribute stress, reducing stress concentration at the junction of the first part 110 and the second part 120 of the first sub-circuit board 10. The support portion 30 can also improve vibration resistance. The first sub-circuit board 10 is often exposed to vibration and impact environments, and the support portion 30 can prevent loosening or breakage of the first sub-circuit board 10 under vibration and impact conditions.

[0046] It should be noted that this disclosure does not specifically limit the function of the support part 30, and the specific function of the support part 30 can be one or more of the above-mentioned functions.

[0047] This disclosure does not specifically limit the manufacturing process of the support portion 30, such as dispensing, welding, reinforcing ribs, etc. In the following embodiments, unless otherwise specified, the support portion 30 is described using the dispensing process. This disclosure does not specifically limit the shape of the support portion 30, which can be one or more of the following: triangular, circular, rectangular, irregular polygonal. This disclosure does not specifically limit the number of support portions 30, which can be one or more, and can be matched and set according to factors such as the length, width, and stress distribution of the second portion 120.

[0048] In an exemplary embodiment of this disclosure, the circuit board 1 may include an adapter plate 40, which may be disposed between the first sub-circuit board 10 and the second sub-circuit board 20. The adapter plate 40 includes a first side 401 and a second side 402 disposed opposite to each other. The first side 401 and the first sub-circuit board 10 and the second sub-circuit board 20 form a receiving space for accommodating electronic components. The support portion 30 is connected to at least a portion of the second side 402 of the adapter plate 40.

[0049] Specifically, the first side 401 of the adapter plate 40 forms a certain space with the second surface 102 of the first part 110 of the first sub-circuit board 10 and the surface of the second sub-circuit board 20, which can be used to accommodate electronic components on the first sub-circuit board 10 or the second sub-circuit board 20. The adapter plate 40 can increase the electronic component capacity of the circuit board 1.

[0050] In an exemplary embodiment of this disclosure, the support portion 30 may be connected to a portion of the second side 402 of the adapter plate 40. The connection of the second side 402 of the adapter plate 40 to the support portion 30 ensures the stability of the support portion 30 without disrupting the normal connection between the adapter plate 40 and the first sub-circuit board 10.

[0051] However, this disclosure is not limited thereto. In some other exemplary embodiments of this disclosure, the support portion 30 may be fully connected to the second side 402 of the adapter plate 40.

[0052] This disclosure does not specifically limit the area of ​​the connection portion between the second side 402 of the adapter plate 40 and the support portion 30. The connection portion can be a part of the second side 402 of the adapter plate 40, that is, the support portion 30 is connected to a part of the second side 402 of the adapter plate 40; the connection portion can also be the entire second side 402 of the adapter plate 40, that is, the support portion 30 is completely connected to the second side 402 of the adapter plate 40.

[0053] It should be noted that the width of the adapter board 40 is less than or equal to the width of the first part 110 of the first sub-circuit board 10, so as to ensure that the second part 120 can extend outward and be in a suspended state.

[0054] However, this disclosure is not limited thereto. In some other exemplary embodiments of this disclosure, the adapter plate 40 may be disposed between a plurality of second sub-circuit boards 20. The width of the adapter plate 40 is less than or equal to the width of the second sub-circuit boards 20. The first side 401 of the adapter plate 40 and two adjacent second sub-circuit boards 20 form a receiving space for setting electronic components. The electronic components on the second sub-circuit boards 20 may be disposed in the receiving space.

[0055] This disclosure does not specify the number of the second sub-circuit board 20, but can match and set it according to the number, shape, size and other factors of the electronic components required by the circuit board 1 to meet the corresponding functions.

[0056] It should be noted that the adapter board 40 may include an adapter board 40 disposed between the first sub-circuit board 10 and the second sub-circuit board 20, and an adapter board 40 disposed between multiple second sub-circuit boards 20. This disclosure does not specifically limit the number of adapter boards 40, and the number can be matched and set according to factors such as the number, shape, and size of electronic components to be accommodated in the first sub-circuit board 10 and the second sub-circuit board 20, and the number of second sub-circuit boards 20.

[0057] In an exemplary embodiment of this disclosure, the first sub-circuit board 10 may include a contact layer 130, which is disposed on the second surface 102 of the second part 120 of the first sub-circuit board 10. At least a portion of the second surface 102 of the second part 120 is used to face the middle frame 2, and the contact layer 130 is used to contact the middle frame 2.

[0058] Specifically, the contact layer 130 has low adhesion characteristics. The contact layer 130 is disposed on the second surface 102 of the second part 120 of the first sub-circuit board 10. At least a portion of the second surface 102 of the second part 120 is opposite to the middle frame 2, so the contact layer 130 can contact the middle frame 2. At the same time, the low adhesion characteristics of the contact layer 130 make the contact layer 130 and the middle frame 2 detachably connected, so as to form a detachable connection between the circuit board 1 and the middle frame 2. This can prevent the circuit board 1 from being damaged or even failing due to the connection relationship with the middle frame 2 during the disassembly of the circuit board 1, so that the circuit board 1 has reworkability.

[0059] It should be noted that this disclosure does not specifically limit the function of the contact layer 130. The contact layer 130 may serve one or more of the following functions: interference fit, buffering, and sealing. This disclosure does not specifically limit the material of the contact layer 130; it may be Teflon (polytetrafluoroethylene, PTFE), polyurethane (PU), polyethylene (PE), PTFE aluminum foil, etc. This disclosure does not specifically limit the area of ​​the contact layer 130. The contact layer 130 may be disposed on all positions of the second surface 102 of the second part 120 of the first sub-circuit board 10, or it may be disposed on only a portion of the second surface 102 of the second part 120 of the first sub-circuit board 10.

[0060] Figure 2 This is a schematic diagram of the structure of a mid-frame according to an exemplary embodiment.

[0061] In exemplary embodiments of this disclosure, reference is made to Figure 2 As shown, the middle frame 2 may include a third part 210 and a fourth part 220. The circuit board 1 may be disposed in the third part 210, wherein at least a portion of the second surface 102 of the second part 120 of the first sub-circuit board 10 is opposite to the fourth part 220 of the middle frame 2.

[0062] Circuit board 1 is disposed in the third part 210. The second part 120 of the first sub-circuit board 10 extends toward the fourth part of the middle frame 2 and is suspended. At least a portion of the second surface 102 of the second part 120 of the first sub-circuit board 10 is opposite to the fourth part 220 of the middle frame 2, that is, at least a portion of the second part 120 of the first sub-circuit board 10 is disposed opposite to the fourth part 220 of the middle frame 2.

[0063] Figure 3 This is a schematic diagram of an assembly structure of an electronic device according to an exemplary embodiment.

[0064] Figure 4 This is a partially enlarged schematic diagram of the connection between a circuit board and a mid-frame, according to an exemplary embodiment.

[0065] In an exemplary embodiment of this disclosure, the fourth part 220 includes a third surface 221 and a fourth surface 222 disposed opposite to each other in the first direction, the third surface 221 being in contact with the contact layer 130.

[0066] Specifically, at least a portion of the second surface 102 of the second part 120 of the first sub-circuit board 10 is opposite to the third surface 221 of the fourth part 220 of the middle frame 2, and the contact layer 130 is disposed on the second surface 102 of the second part 120 of the first sub-circuit board 10, and the third surface 221 of the fourth part 220 of the middle frame 2 is in contact with the contact layer 130.

[0067] In exemplary embodiments of this disclosure, circuit board 1 may include a shielding cover, such as... Figure 1 As shown, the shielding cover can be a first shielding cover 510. The first shielding cover 510 is disposed on the first surface 101 of the first sub-circuit board 10. The first shielding cover 510 can shield external signals that interfere with the electronic components on the first surface 101 of the first sub-circuit board 10 inside the first shielding cover 510, and protect the normal operation of the electronic components.

[0068] In an exemplary embodiment of this disclosure, the first shield 510 covers a portion of the second part 120, the first shield 510 is non-detachably connected to the first sub-circuit board 10, and the first shield 510 can support the second part 120 of the first sub-circuit board 10.

[0069] However, this disclosure is not limited thereto. In some other exemplary embodiments of this disclosure, the first shielding cover 510 covers the entire second part 120. In this case, the connection between the first shielding cover 510 and the first sub-circuit board 10 is located at the end of the second part 120, and the fixed connection between the first shielding cover 510 and the first sub-circuit board 10 can provide support for the second part 120.

[0070] It should be noted that this disclosure does not specifically limit the area of ​​the first part 110 of the first sub-circuit board covered by the first shielding cover 510.

[0071] In an exemplary embodiment of this disclosure, the first shielding cover 510 does not cover the first part 110 of the first sub-circuit board 10. At this time, the first shielding cover 510 only covers at least a part of the second part 120. The first shielding cover 510 only protects the electronic components of the second part 120 within its coverage area from interference by external interference signals, thus protecting the normal operation of the electronic components.

[0072] In an exemplary embodiment of this disclosure, the first shield 510 covers a portion of the first part 110 of the first sub-circuit board 10. In this case, the first shield 510 can protect the electronic components of the first part 110 within its coverage area from interference by external interference signals and protect the normal operation of the electronic components.

[0073] In an exemplary embodiment of this disclosure, the first shield 510 completely covers the first part 110 of the first sub-circuit board 10. At this time, the first shield 510 can protect the electronic components of the first part 110 within its coverage area from interference by external interference signals, and protect the normal operation of the electronic components, that is, protect all electronic components of the first surface 101 of the first part 110 of the first sub-circuit board 10.

[0074] In an exemplary embodiment of this disclosure, the circuit board may further include a second shielding cover 520, which is disposed on the second sub-circuit board 20. The second shielding cover 520 can shield external signals that interfere with the electronic components on the second sub-circuit board 20 within the second shielding cover 520, thereby protecting the normal operation of the electronic components.

[0075] It should be noted that this disclosure does not specifically limit the shielding area of ​​the second shielding cover 520. The second shielding cover 520 may cover a part of the second sub-circuit board 20 or it may cover the entire second sub-circuit board 20.

[0076] This disclosure does not impose specific limitations on the shape of the shielding covers (including the first shielding cover 510 and the second shielding cover 520), which can be one or more of the following: triangular, circular, rectangular, and irregular polygonal. This disclosure does not impose specific limitations on the material of the shielding covers; the material is not limited to metal, metal alloy, or composite material. This disclosure does not impose specific limitations on the number of shielding covers, which can be matched and set according to factors such as the area of ​​the first sub-circuit board 10 and the second sub-circuit board 20, the number of electronic components, and the working relationship between the electronic components.

[0077] It is understandable that the shape, material, and quantity of the first shielding cover 510 and the second shielding cover 520 can be the same or different.

[0078] In an exemplary embodiment of this disclosure, the middle frame 2 includes an adhesive layer 230 disposed on the third surface 221, and the adhesive layer 230 contacts the contact layer 130.

[0079] Specifically, the adhesive layer 230 can be a curable adhesive. In its original state, the adhesive layer 230 is liquid. The adhesive layer 230 is in contact with the contact layer 130. The adhesive layer 230 can flow to a suitable position according to the height of the suspended position of the second part 120 of the first sub-circuit board 10. After curing, the adhesive layer 230 plays a supporting role for the second part 120 of the first sub-circuit board 10.

[0080] Meanwhile, due to the low-adhesion properties of the contact layer 130, the contact between the adhesive layer 230 and the contact layer 130 can be separated. The second part 120 of the first sub-circuit board 10 and the fourth part 220 of the middle frame 2 are detachably connected to form a detachable connection between the circuit board 1 and the middle frame 2. This can prevent damage or even failure of the circuit board 1 due to its connection with the middle frame 2 during the disassembly of the circuit board 1, thus enabling the circuit board 1 to be reworkable.

[0081] It should be noted that this disclosure does not specifically limit the area of ​​the adhesive layer 230. The adhesive layer 230 can be disposed at a portion of the third surface 221 of the fourth part 220, or it can be disposed on the entire third surface 221 of the fourth part. This disclosure does not specifically limit the material of the adhesive layer 230. The material of the adhesive layer 230 can be one or more of the following: thermosetting adhesive, UV-curable adhesive, two-component adhesive, and hot-melt adhesive.

[0082] In an exemplary embodiment of this disclosure, the third part 210 may be provided with a receiving groove 211, and at least a portion of the circuit board 1 is disposed in the receiving groove 211.

[0083] Specifically, the second shield 520 is disposed on the outermost second sub-circuit board 20. The outermost second sub-circuit board 20 is disposed opposite to the bottom of the receiving groove 211. The length of the outermost second sub-circuit board 20 in the second direction is less than the length of the receiving groove 211 in the second direction. At this time, at least a portion of the second shield 520, the second sub-circuit board 20, and the electronic components on the second sub-circuit board 20 are disposed in the receiving groove 211.

[0084] In an exemplary embodiment of this disclosure, the adapter plate 40 may be disposed in the receiving groove 211. The length of the adapter plate 40 in the second direction is less than or equal to the width of the outermost second sub-circuit board 20, and the length of the outermost second sub-circuit board 20 in the second direction is less than the length of the receiving groove 211 in the second direction. In this case, the adapter plate 40, the outermost second sub-circuit board 20, and the second shielding cover 520 are disposed in the receiving groove 211.

[0085] It should be noted that the adapter board 40 includes an adapter board 40 disposed between the first sub-circuit board 10 and the second sub-circuit board 20 and an adapter board 40 disposed between a plurality of second sub-circuit boards 20.

[0086] This disclosure does not impose a specific limitation on the number of the second sub-circuit board 20 and the adapter board 40 disposed in the receiving slot 211.

[0087] In an exemplary embodiment of this disclosure, the circuit board 1 includes a support portion 30, which is disposed at the position where the first part 110 and the second part 120 of the first sub-circuit board 10 are connected, and the support portion 30 is located on the second surface 102 of the first sub-circuit board 10.

[0088] Specifically, the support portion 30 is located at the junction of the first part 110 and the suspended second part 120 of the first sub-circuit board 10. The support portion 30 can enhance the connection between the first part 110 and the second part 120 and improve the structural strength of the first sub-circuit board 10. The support portion 30 can also disperse stress and reduce stress concentration at the junction of the first part 110 and the second part 120 of the first sub-circuit board 10. The support portion 30 can also improve the vibration resistance performance. The first sub-circuit board 10 often faces vibration and impact environments. The support portion 30 can prevent the first sub-circuit board 10 from loosening or breaking under vibration.

[0089] It should be noted that this disclosure does not specifically limit the function of the support part 30, and the specific function of the support part 30 can be one or more of the above-mentioned functions.

[0090] This disclosure does not specifically limit the process of the support part 30, such as dispensing, welding, reinforcing ribs, etc. In the following embodiments, unless otherwise specified, the support part 30 is described using the dispensing process. This disclosure does not specifically limit the shape of the support part 30, which can be one or more of the following: triangle, circle, rectangle, irregular polygon. This disclosure does not specifically limit the number of support parts 30, which can be one or more, and can be matched and set according to factors such as the length and width of the second part 120.

[0091] In an exemplary embodiment of this disclosure, the receiving groove 211 may include a side wall 212, and the side wall 212 may include a clearance portion 213, which is disposed opposite to the support portion 30.

[0092] The receiving groove 211 may include a sidewall 212 extending in a first direction, and the bottom of the receiving groove 211 extending in a second direction. This disclosure does not specifically limit the extension length of the sidewall 212 in the first direction, and it can be matched and set according to the extension lengths of the first sub-circuit board 10, the second sub-circuit board 20, and the adapter plate 40 in the second direction, and the position of the support portion 30. It is understood that different sidewalls 212 may also extend to different lengths in the first direction.

[0093] The side wall 212 may include a clearance portion 213, which is disposed at the connection between the side wall 212 of the receiving groove 211 and the fourth part 220 of the middle frame 2. At this time, the clearance portion 213 is disposed opposite to the support portion 30.

[0094] In the exemplary embodiments of this disclosure, the avoidance part 213 corresponds one-to-one with the support part 30.

[0095] Specifically, since this disclosure does not specifically limit the number of support portions 30, it can be matched and set to one or more according to factors such as the length and width of the second part 120 of the first sub-circuit board 10. Therefore, the number of clearance portions 213 corresponds one-to-one with the number of support portions 30. Since this disclosure does not specifically limit the shape of the support portion 30, it can be one or more of the following: triangle, circle, rectangle, irregular polygon. The shape of the clearance portion 213 is adapted to the shape of its corresponding support portion 30 to reserve sufficient space to meet the installation requirements when installing the circuit board 1 and the middle frame 2.

[0096] The clearance section 213 is designed to meet the installation, maintenance, movement and safety requirements of the circuit board 1 and the middle frame 2, and to ensure good coordination and interaction between the circuit board 1 and the middle frame 2.

[0097] Figure 5 This is a schematic diagram illustrating the assembly of a middle frame and a rotating mechanism according to an exemplary embodiment.

[0098] In exemplary embodiments of this disclosure, reference is made to Figure 5 As shown, the rotating mechanism 60 may include a hinge mechanism 610 and a linkage mechanism 620. The linkage mechanism 620 is rotatable relative to the hinge mechanism 610 and can be connected to the middle frame 2 to support the middle frame 2.

[0099] Specifically, the hinge mechanism 610 can provide stable rotation and swing motion for the linkage mechanism 620, the linkage mechanism 620 can rotate relative to the hinge mechanism 610, the linkage mechanism 620 can be connected to the middle frame 2, and the linkage mechanism 620 can support the middle frame 2 and drive the middle frame 2 to rotate together.

[0100] It should be noted that this disclosure does not specifically limit the technical principles and structural forms of the hinge mechanism 610 and the linkage mechanism 620 involved in the rotation mechanism 60. The hinge mechanism 610 and the linkage mechanism 620 work together to achieve the rotational movement of the middle frame 2.

[0101] In an exemplary embodiment of this disclosure, the electronic device 3 may include a rotating mechanism 60, a middle frame 2, and a circuit board 1. One side of the middle frame 2 is connected to the rotating mechanism 60, and the circuit board 1 is disposed on the other side of the middle frame 2. The circuit board 1 may include a first sub-circuit board 10 and a second sub-circuit board 20 stacked on top of each other in a first direction. The middle frame 2 may include a third part 210 and a fourth part 220.

[0102] The first sub-circuit board 10 may include a first part 110 and a second part 120 connected to each other in a second direction. The first sub-circuit board 10 may include a first surface 101 and a second surface 102 disposed opposite to each other. The second surface 102 of the first part 110 is opposite to the second sub-circuit board 20. At least a portion of the second surface 102 of the second part 120 is used to be opposite to the fourth part 220 of the middle frame 2.

[0103] The circuit board 1 may include a support portion 30 and an adapter plate 40. The support portion 30 is disposed at the position where the first part 110 and the second part 120 of the first sub-circuit board 10 are connected, and the support portion 30 is located on the second side 102 of the first sub-circuit board 10. The adapter plate 40 may be disposed between the first sub-circuit board 10 and the second sub-circuit board 20, and the support portion 30 is connected to at least a portion of the second side 402 of the adapter plate 40.

[0104] The third part 210 of the middle frame 2 may be provided with a receiving groove 211. The second sub-circuit board 20 is disposed in the receiving groove 211. The receiving groove 211 may include a side wall 212. The side wall 212 may include a clearance part 213. The clearance part 213 is disposed opposite to the support part 30, and the clearance part 213 corresponds to the support part 30 one by one.

[0105] The first sub-circuit may include a contact layer 130, which is disposed on the second surface 102 of the second part 120 of the first sub-circuit board 10. At least a portion of the second surface 102 of the second part 120 is used to face the fourth part 220 of the middle frame 2. The fourth part 220 of the middle frame 2 includes a third surface 221 and a fourth surface 222 disposed opposite to each other. An adhesive layer 230 is disposed on the third surface 221. The adhesive layer 230 of the fourth part 220 of the middle frame 2 contacts the contact layer 130 of the second surface 102 of the second part 120 of the first sub-circuit board 10.

[0106] The low-adhesion property of the contact layer 130 makes the contact layer 130 and the fourth part 220 of the middle frame 2 detachably connected to form a detachable connection between the circuit board 1 and the middle frame 2. This can prevent the circuit board 1 from being damaged or even failing due to the connection relationship with the middle frame 2 during the disassembly process, and make the circuit board 1 reworkable.

[0107] The rotating mechanism 60 may include a hinge mechanism 610 and a linkage mechanism 620. The hinge mechanism 610 can provide stable rotation and swing motion for the linkage mechanism 620. The linkage mechanism 620 can rotate relative to the hinge mechanism 610. The linkage mechanism 620 can be connected to the middle frame 2. The linkage mechanism 620 can support the middle frame 2 and drive the middle frame 2 to rotate together.

[0108] The electronic devices involved in this disclosure may also be referred to as user equipment (UE), mobile station (MS), mobile terminal (MT), etc. Exemplarily, electronic products may be mobile terminals such as smartphones, tablets, wearable devices (e.g., smartwatches, Bluetooth headsets), in-vehicle devices, augmented reality (AR) / virtual reality (VR) devices, ultra-mobile personal computers (UMPCs), netbooks, personal digital assistants (PDAs), etc., or they may be professional shooting equipment such as digital cameras, SLR cameras / mirrorless cameras, gimbal cameras, action cameras, drones, etc. It should be understood that this disclosure does not specifically limit the specific technologies or device forms used in the electronic devices. In the description of the above embodiments, a mobile phone is used as an example, but this disclosure is not limited thereto.

[0109] It is understood that the electronic device provided in this disclosure includes hardware structures and / or software modules corresponding to each function in order to achieve the above-mentioned functions. In conjunction with the units of the various examples disclosed in this disclosure, this disclosure can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed by hardware or by computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the technical solutions of this disclosure.

[0110] It is understood that in this disclosure, "multiple" refers to two or more, and other quantifiers are similar. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. The singular forms "a," "the," and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0111] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "first," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.

[0112] It is further understood that the terms “center,” “longitudinal,” “lateral,” “front,” “rear,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation.

[0113] It can be further understood that, unless otherwise specified, "connection" includes both direct connections where no other components exist between the two parties and indirect connections where other components exist between them.

[0114] It is further understood that although operations are described in a specific order in the accompanying drawings in the embodiments of this disclosure, this should not be construed as requiring these operations to be performed in the specific order or serial order shown, or requiring all of the shown operations to be performed to obtain the desired result. In certain environments, multitasking and parallel processing may be advantageous.

[0115] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the solutions disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following scope of claims.

[0116] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. An electronic device, comprising: include: Rotating mechanism; A middle frame, one side of which is connected to the rotating mechanism; A circuit board, disposed on the other side of the middle frame, includes a first sub-circuit board and a second sub-circuit board stacked on top of each other in a first direction. The first sub-circuit board includes a first part and a second part interconnected in a second direction. The first sub-circuit board includes a first surface and a second surface disposed opposite to each other in the first direction. The second surface of the first part is opposite to the second sub-circuit board, and at least a portion of the second surface of the second part is opposite to the middle frame and suspended relative to the middle frame.

2. The electronic device according to claim 1, characterized in that, The circuit board includes a support portion disposed at the position where the first portion and the second portion of the first sub-circuit board are connected, and the support portion is located on the second surface of the first sub-circuit board.

3. The electronic device according to claim 2, characterized in that, The circuit board includes an adapter board disposed between the first sub-circuit board and the second sub-circuit board. The adapter board includes a first side and a second side disposed opposite to each other. The first side, together with the first sub-circuit board and the second sub-circuit board, forms a receiving space for accommodating electronic components. The support portion is connected to at least a portion of the second side of the adapter plate.

4. The electronic device according to claim 2, characterized in that, The first sub-circuit board includes a contact layer, which is disposed on the second surface of the second part.

5. The electronic device according to claim 4, characterized in that, The middle frame includes a third part and a fourth part, and the circuit board is disposed in the third part. Wherein, at least a portion of the second side of the second part of the first sub-circuit board is opposite to the fourth part of the middle frame.

6. The electronic device according to claim 5, characterized in that, The fourth part includes a third surface and a fourth surface disposed opposite to each other in the first direction, wherein the third surface is in contact with the contact layer.

7. The electronic device according to claim 6, characterized in that, The middle frame includes an adhesive layer disposed on the third surface, and the adhesive layer is in contact with the contact layer.

8. The electronic device according to claim 5, characterized in that, The third part is provided with a receiving groove, at least a portion of the circuit board is disposed in the receiving groove, the receiving groove includes a side wall, the side wall includes a clearance portion, and the clearance portion is disposed opposite to the supporting part.

9. The electronic device according to claim 8, characterized in that, The avoidance part corresponds to the support part one by one.

10. The electronic device according to claim 1, characterized in that, The circuit board includes a shielding cover disposed on the first side of the first sub-circuit board, and the shielding cover covers at least a portion of the second part.

11. The electronic device according to claim 1, characterized in that, The rotating mechanism comprises a hinge mechanism and a connecting rod mechanism, the connecting rod mechanism is rotatable relative to the hinge mechanism, and the connecting rod mechanism is connected with the middle frame to support the middle frame.

Images