Cooling structure, power unit, energy storage system and electric device

Abstract

The invention provides a cooling structure, a power unit, an energy storage system and a power utilization device, the cooling structure comprises a main board, the main board comprises two opposite side surfaces, the two side surfaces are respectively provided with a flow channel, the main board is provided with a communication part penetrating through the main board, and the flow channels of the two side surfaces are communicated through the communication part. According to the cooling structure provided by the technical scheme, the liquid medium flows on the two side surfaces through the communication part, and the device on the other side is cooled by utilizing the residual cooling efficiency on one side, so that the cooling effect provided by the two side surfaces is more adaptive to the actual cooling requirements of the devices on the two sides, the cooling effect is improved, and the cooling efficiency is improved. Meanwhile, the cooling efficiency of the liquid medium is fully utilized.

Description

Technical Field

[0001] The present application belongs to the field of liquid cooling technology, and more specifically, relates to a cooling structure, a power unit, an energy storage system and an electrical device. Background Art

[0002] The cold plate cools the device to be cooled from opposite sides.

[0003] The cold liquid flow distribution on both sides of the cold plate is consistent, and the cooling effect tends to be consistent. For the situation where the heat flux density distribution of the devices on the opposite sides is inconsistent, the existing cold plate is difficult to meet. In other words, the cooling effect provided by the two sides of the existing cold plate is difficult to adapt to the actual cooling needs of the devices on both sides, resulting in poor cooling effect. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a cooling structure, a power unit, an energy storage system and an electrical device to solve the technical problem that the cooling effect provided on both sides of the existing cold plate is difficult to adapt to the actual cooling requirements of the devices on both sides, resulting in poor cooling effect.

[0005] To achieve the above purpose, the technical solution adopted in the embodiment of the present application is:

[0006] A cooling structure is provided. The cooling structure comprises a main board. The main board comprises two side surfaces arranged opposite to each other. The two side surfaces are respectively provided with flow channels. The flow channels of the two side surfaces are connected to form a fluid path.

[0007] The cooling structure provided by the technical solution has a liquid medium flowing on two sides through a connecting part, and uses the remaining cooling efficiency on one side to cool the device on the other side, so that the cooling effect provided by the two sides is more adapted to the actual cooling requirements of the devices on both sides, thereby improving the cooling effect and making full use of the cooling efficiency of the liquid medium.

[0008] In some embodiments, the main board is provided with a connecting portion penetrating the main board, and the flow channels on the two side surfaces are connected through the connecting portion.

[0009] The flow channels on the two sides are connected by the connecting part penetrating through the main board, thereby improving the convenience of the fluid path.

[0010] In some embodiments, on one of the fluid paths, the difference between the sum of the numbers of the flow channels on the two side surfaces and the number of the connecting portions is equal to one.

[0011] The difference between the sum of the number of flow channels on the two side surfaces and the number of connecting parts is equal to one, so that the two side surfaces can be connected in series one-to-one or one-to-many through the connecting parts. The liquid medium flows between the two side surfaces to complete the heat exchange, which has a better cooling effect on the devices on both sides and makes more full use of the cooling efficiency of the liquid medium.

[0012] In some embodiments, the main board is provided with at least two fluid paths connected in parallel.

[0013] The liquid medium is made to flow between the two sides through multiple fluid paths, thereby further improving the cooling effect and making full use of the cooling efficiency of the liquid medium.

[0014] In some embodiments, the flow channels on the two sides are connected in series one by one.

[0015] The liquid medium first flows in the flow channel on one side, cools the device on that side, and then enters the flow channel on the other side through the connecting part to cool the device on the other side. The flow sequence is achieved by series connection, the cooling effect is improved, and the cooling efficiency of the liquid medium is fully utilized.

[0016] In some embodiments, the flow channel includes a third flow channel arranged on one side of the main board and a fourth flow channel arranged on the other side of the main board, and the number of at least one of the third flow channel and the fourth flow channel is multiple; on one of the fluid paths, the third flow channel and the fourth flow channel are alternately connected in series.

[0017] The third flow channel and the fourth flow channel are alternately connected in series, and the liquid medium flows alternately through the two sides, so that the cooling effect on the devices on both sides is better and the cooling effect of the cooling structure is more uniform.

[0018] In some embodiments, on one of the fluid paths, the number of the third flow channels is two, and the number of the fourth flow channel is one.

[0019] The liquid medium enters the fourth flow channel from the third flow channel through the connecting flow channel, flows through the third flow channel and then enters the fourth flow channel through the connecting flow channel, that is, it flows from one side through the other side and then back to one side, which simplifies the flow channel structure and improves the cooling effect.

[0020] In some embodiments, the flow channel on at least one side of the main board is spirally arranged.

[0021] The flow channel is spirally arranged to make the flow of the liquid medium smoother, thereby reducing the flow resistance and facilitating the layout of the flow channel in the center of the main board.

[0022] In some embodiments, the two side surfaces are respectively provided with a first flow channel and a second flow channel, the first flow channel and the second flow channel are both spirally arranged, and an inner end of the first flow channel is connected to an inner end of the second flow channel.

[0023] The first flow channel and the second flow channel on both sides are spirally arranged, so that the flow smoothness of the liquid medium on the entire path is better, and the inner ends of the flow channels on the two sides are connected, that is, they are connected in the central area of ​​the area where the flow channels are located, which is beneficial to improve the cooling effect on the parts to be cooled corresponding to the central area.

[0024] In some embodiments, a first flow channel and a second flow channel are respectively provided on each side of the main board, and the first flow channel and the second flow channel on the same side are spirally arranged in parallel.

[0025] The first flow channel and the second flow channel on the same side are mutually embedded in parallel spirals, so that the component to be cooled can be cooled with high density, thereby improving the cooling effect.

[0026] In some embodiments, the flow channel includes two third flow channels disposed on one side of the main board and one fourth flow channel disposed on the other side of the main board, and the third flow channel and the fourth flow channel are alternately connected in series;

[0027] The two third flow channels are arranged in parallel in a spiral manner, the fourth flow channel is arranged in a spiral manner, the fourth flow channel is arranged on the inner side of the two third flow channels, and the inner ends of the two third flow channels are respectively connected to the two outer ends of the fourth flow channel.

[0028] The two first flow channels are mutually embedded in parallel spirals, and the second flow channel is spirally arranged, which can perform high-density cooling on the cooling component, improve the cooling effect, and facilitate the layout of the second flow channel with the center of the first flow channel.

[0029] In some embodiments, the fourth flow channel includes two sub-flow channels which are spirally arranged in parallel, the inner ends of the two sub-flow channels are connected, and the outer ends of the two sub-flow channels are respectively connected to the inner ends of the two third flow channels.

[0030] The two sub-flow channels are mutually embedded in parallel spirals, which can perform high-density cooling on the cooling component and improve the cooling effect.

[0031] In some embodiments, the flow channel includes two sections, and the two sections are arranged in parallel to form parallel flow channel sections; at least two parallel flow channel sections are provided on one side of the main board, and in different parallel flow channel sections, the spacing between adjacent flow channel walls on the two sections is different.

[0032] Due to the different distribution densities or cooling requirements of the components to be cooled, the spacing between the adjacent flow channel walls on different parallel flow channel sections is set differently, so that they have different density designs to adapt to the different distribution densities or different cooling requirements of the components to be cooled. For example, if the distribution density of the components to be cooled is high or the cooling requirement is high, the spacing between the corresponding adjacent flow channel walls is designed to be a smaller spacing, and if the distribution density of the components to be cooled is low or the cooling requirement is low, the spacing between the corresponding adjacent flow channel walls is designed to be a larger spacing.

[0033] In some embodiments, the location where the flow channels on the two side surfaces are connected is arranged in the middle area of ​​the main board; the distance between adjacent flow channel walls on two sections in the parallel flow channel section close to the middle area is smaller than the distance between adjacent flow channel walls on two sections in the parallel flow channel section away from the middle area.

[0034] The components to be cooled corresponding to the middle area of ​​the mainboard have high density or high cooling demand, while the components to be cooled corresponding to the outer area of ​​the mainboard have low density or low cooling demand, so that the flow channel design of the middle area and the outer area is more adapted to the distribution density or cooling demand of the corresponding components to be cooled, thereby further improving the cooling efficiency and making fuller use of the cooling performance of the liquid medium.

[0035] In some embodiments, the flow channel is arranged in a spiral shape, and along the spiral direction of the flow channel from the outside to the inside, the distance between adjacent flow channel walls on the two sections gradually decreases.

[0036] The spacing between the flow channel walls gradually decreases, the tightness of the flow channel gradually increases, the cooling effect gradually increases, and the cooling effect shows a gradual trend, making it more adaptable to the gradually changing cooling requirements of the components to be cooled.

[0037] In some embodiments, the two sections are separated and formed by a main fin, and the two adjacent flow channel walls are arranged on both sides of the main fin.

[0038] Flow channels are formed between adjacent main fins, and the main fins are used to transfer heat and improve the cooling efficiency of the liquid medium.

[0039] In some embodiments, the main board is provided with a first port and a second port, the flow channel of at least one of the side surfaces is connected to the first port, and the flow channel of at least one of the side surfaces is connected to the second port; wherein the first port and the second port are axially symmetrical structures with each other.

[0040] The first port and the second port are axially symmetrical structures with each other, and it is not necessary to distinguish between the first port and the second port during assembly, thereby improving the assembly flexibility and maintainability of the mainboard.

[0041] In some embodiments, the main board further includes a peripheral wall surface, the peripheral wall surface connects the two side surfaces, and the peripheral wall surface is configured with the first port and the second port.

[0042] The first port and the second port are arranged on the peripheral wall surface. The space provided by the side of the peripheral wall surface can be used for convenient maintenance of the first port and the second port, and is also conducive to the first port and the second port being connected to the external system of the liquid medium by using the space.

[0043] In some embodiments, the two side surfaces are respectively configured with the first opening and the second opening.

[0044] By flipping the mainboard, the first port and the second port can be interchanged. That is, there is no need to distinguish between the first port and the second port when assembling the mainboard, thereby improving the assembly flexibility and maintainability of the mainboard.

[0045] In some embodiments, at least a section of the flow channel is provided with a partition rib, and the partition rib divides the section into two parallel branch flow channels.

[0046] The dividing rib divides at least a portion of the flow channel into two parallel branch flow channels, so as to increase the area of ​​the flow channel and improve the cooling efficiency per unit time.

[0047] In some embodiments, the cooling structure includes two cover plates, which are disposed on two sides of the main board and are respectively attached to the two side surfaces to seal the flow channels on the two side surfaces.

[0048] The flow channels on the two sides are sealed by two cover plates, thereby improving the sealing performance of the flow channels and providing the use reliability of the cooling structure.

[0049] Another object of an embodiment of the present application is to provide a power unit, wherein the power unit includes the cooling structure as described above.

[0050] Since the power unit provided in the embodiment of the present application adopts the cooling structure provided in the embodiment of the present application, the cooling structure can fully utilize the cooling efficiency of the liquid medium, and the provided cooling efficiency is high, which can meet the heat dissipation requirements of large-capacity power units, thereby improving the working efficiency and use safety of the power unit, and extending the service life of the power unit.

[0051] Another object of an embodiment of the present application is to provide an energy storage system, which includes the power unit as described above.

[0052] Since the energy storage system provided in the present application adopts the power unit provided in the present application, the cooling structure in the power unit can fully utilize the cooling efficiency of the liquid medium, and the provided cooling efficiency is high, which can meet the heat dissipation requirements of a large-capacity energy storage system.

[0053] Another object of an embodiment of the present application is to provide an electrical device, wherein the electrical device includes the energy storage system as described above, and the energy storage system also includes a battery electrically connected to the power unit.

[0054] The electrical device provided in the embodiment of the present application adopts the energy storage system provided in the embodiment of the present application. Its beneficial effects compared with the prior art are consistent with the beneficial effects of the energy storage system compared with the prior art, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0056] Figure 1 A schematic diagram of a mainboard provided for some embodiments of the present application;

[0057] Figure 2 A schematic diagram of a mainboard provided for some embodiments of the present application;

[0058] Figure 3 A schematic diagram of a mainboard provided for some embodiments of the present application;

[0059] Figure 4 for Figure 3 The provided motherboard is cut away from one of the right angles;

[0060] Figure 5 for Figure 3 A cross-sectional view of the main board provided along the thickness direction;

[0061] Figure 6 A schematic diagram of the direction of a fluid path of a liquid cooling plate;

[0062] Figure 7 A schematic diagram of the direction of the fluid path provided in some embodiments of the present application;

[0063] Figure 8 A schematic diagram of a mainboard provided for some embodiments of the present application;

[0064] Fig. 9 for Figure 8 A schematic diagram of the identification of the flow channels of the main board provided in alternating series;

[0065] Fig.10 A schematic diagram of a mainboard provided for some embodiments of the present application;

[0066] Fig.11A schematic diagram of a disassembled cooling structure provided in some embodiments of the present application;

[0067] Fig.12 A schematic diagram of a mainboard provided for some embodiments of the present application;

[0068] Fig.13 A schematic diagram of the adaptation of the cooling structure and the power device provided in some embodiments of the present application;

[0069] Fig.14 A schematic diagram of a power unit provided for some embodiments of the present application;

[0070] Fig.15 A schematic diagram of an energy storage system provided for some embodiments of the present application.

[0071] Among them, the reference numerals in the figure are:

[0072] 10. Cooling structure; 100. Power unit; 1000. Energy storage system;

[0073] 11. Main board; 12. Cover plate; 111. First side surface; 112. Second side surface; 113. Peripheral wall surface; 114a. First flow channel; 114b. Second flow channel; 115a. Third flow channel; 115b. Fourth flow channel; 116. Connecting portion; 117. First port; 118. Second port; 119. Branch flow channel; 1110. Sub-flow channel; 1111. Separation rib; 1112. Separation rib; 1113. Main rib; 1161. First connecting portion; 1162. Second connecting portion; 1163. Third connecting portion; 1164. Fourth connecting portion; 1111a. First flow channel wall; 1111b. Second flow channel wall;

[0074] a, first parallel flow channel section; a1, first section; a2, second section;

[0075] b, second parallel flow channel section; b1, third section; b2, fourth section;

[0076] 1001, power module; 1001a, power device;

[0077] 10001.Battery. DETAILED DESCRIPTION

[0078] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0079] Unless otherwise defined, all technical and scientific terms used in this application have the same meanings as those commonly understood by technicians in the technical field of this application; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned drawings and any variations thereof are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order or a primary and secondary relationship.

[0080] Reference to "embodiment" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments.

[0081] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "attached" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0082] The term "and / or" in this application is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this application generally indicates that the associated objects before and after are in an "or" relationship.

[0083] In the embodiments of the present application, the same reference numerals represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, width and other dimensions of various components in the embodiments of the present application shown in the drawings, as well as the overall thickness, length, width and other dimensions of the integrated device are only exemplary descriptions and should not constitute any limitation to the present application.

[0084] The term "plurality" used in the present application refers to two or more (including two).

[0085] With the rapid development of large-capacity energy storage devices, the demand for high-voltage and high-power IGBTs (Insulated Gate Bipolar Transistor) is increasing, including the increasing requirements for the capacity and reliability of power devices.

[0086] Among them, power devices will generate a lot of heat when working. The amount of heat depends on the capacity of IGBT. The larger the capacity, the higher the heat dissipation requirement. In addition to affecting its working efficiency, the heat dissipation problem of power devices also directly affects its reliability and service life. As a large-capacity energy storage device, the battery's charge and discharge control strategy is based on power devices. The heat dissipation problem of power devices also affects the reliability of the battery.

[0087] Generally, liquid cooling is used to dissipate heat from power devices, for example, based on a liquid cooling plate. A flow channel is provided on opposite sides of the liquid cooling plate to cool the devices on both sides respectively. The flow channels on both sides are symmetrically arranged, and the cooling effects of the flow channels on both sides tend to be consistent.

[0088] However, in actual applications, the power device losses on both sides of the liquid cooling plate are asymmetric. For example, for the power charging and discharging characteristics of ultra-high voltage energy storage batteries, suitable power devices are arranged on both sides of the liquid cooling plate, with the heat on one side reaching about 5kW, while the heat on the other side is only a few hundred watts. The flow channels on both sides of the existing liquid cooling plate are arranged symmetrically. For the side with high heat flux density, the cooling efficiency tends to be insufficient, and it is difficult to meet the actual heat dissipation requirements of this side. For the side with low heat flux density, the cooling efficiency tends to be redundant, exceeding the actual heat dissipation requirements of this side, and the cooling efficiency of this side cannot be fully utilized.

[0089] Based on the above considerations, in order to enable the devices on both sides with different heat flux densities to obtain corresponding cooling efficiency so as to respectively meet the actual heat dissipation needs of the devices on both sides, a cooling structure is designed, which includes a main board, and the main board includes two side surfaces arranged opposite to each other, and the two side surfaces are respectively provided with flow channels, and the flow channels on the two side surfaces are connected to form a fluid path.

[0090] The cooling structure provided by the technical solution has a liquid medium flowing on two sides through the connecting part, and the remaining cooling efficiency on one side is used to cool the device on the other side, so that the cooling efficiency provided by the two sides is more adapted to the actual cooling requirements of the devices on both sides, thereby improving the cooling effect and making full use of the cooling efficiency of the liquid medium.

[0091] The cooling structure provided in the embodiment of the present application can be used, but not limited to, in electrical devices such as vehicles, ships or aircraft. A power unit with the cooling structure provided in the embodiment of the present application can be used to form an energy storage system, and an energy storage system with the power unit provided in the embodiment of the present application can be used to form a power supply system for electrical devices, which is beneficial to improving the cooling effect on the power unit and the energy storage system, effectively improving the safety and reliability of the energy storage system during use, and at the same time helping to extend the service life of the power unit and the energy storage system.

[0092] In some embodiments, the energy storage system may be a battery, which refers to a physical module including one or more battery cells and providing voltage and capacitance. For example, it may include a battery cell, a battery module, or a battery pack. Generally, a battery includes a single cell and a box for accommodating the single cell. The box is used to accommodate and encapsulate one or more battery cells or battery modules. The box is used to protect the battery cells and prevent liquids or other foreign matter from affecting the charging or discharging of the battery cells.

[0093] The battery cell may include a lithium-ion secondary battery, a lithium-ion primary battery, a lithium-sulfur battery, a sodium-lithium-ion battery, a sodium-ion battery or a magnesium-ion battery, etc., which is not limited in the embodiments of the present application. The battery cell may be cylindrical, flat, rectangular or other shapes, etc., which is not limited in the embodiments of the present application. The battery cell is divided into three types according to the packaging method: cylindrical battery cells, square battery cells and soft-pack battery cells, which is not limited in the embodiments of the present application.

[0094] A battery cell refers to the smallest unit that makes up a battery. In a battery, there can be multiple battery cells, and multiple battery cells can be connected in series, in parallel, or in a mixed connection. A mixed connection means that multiple battery cells are connected in series and in parallel. Multiple battery cells can be directly connected in series, in parallel, or in a mixed connection, and then the whole composed of multiple battery cells is placed in a box. Of course, the battery can also be a battery module formed by connecting multiple battery cells in series, in parallel, or in a mixed connection, and then multiple battery modules are connected in series, in parallel, or in a mixed connection to form a whole, and placed in a box.

[0095] The electric device provided in the embodiment of the present application may be, but is not limited to, a mobile phone, a tablet, a laptop computer, an electric toy, an electric tool, a battery car, an electric car, a ship, a spacecraft, etc. Among them, the electric toy may include a fixed or mobile electric toy, such as a game console, an electric car toy, an electric ship toy, and an electric airplane toy, etc., and the spacecraft may include an airplane, a rocket, a space shuttle, and a spacecraft, etc.

[0096] Among them, the vehicle can be a fuel vehicle, a gas vehicle or a new energy vehicle, and the new energy vehicle can be a pure electric vehicle, a hybrid vehicle or an extended-range vehicle, etc. A battery is arranged inside the vehicle, and the battery can be arranged at the bottom, head or tail of the vehicle. The battery can be used to power the vehicle, for example, the battery can be used as an operating power source for the vehicle. The vehicle may also include a controller and a motor, and the controller is used to control the battery to power the motor, for example, for the starting, navigation and working power requirements of the vehicle during driving. In some embodiments, the battery can be used not only as the operating power source of the vehicle, but also as the driving power source of the vehicle, replacing or partially replacing fuel or natural gas to provide driving power for the vehicle.

[0097] The cooling structure 10, the power unit 100, the energy storage system 1000 and the electrical device provided in the embodiment of the present application are now described.

[0098] See also Figures 1 to 12 As shown, the cooling structure 10 provided in the embodiment of the present application includes a main board 11. The main board 11 includes two side surfaces arranged opposite to each other. The two side surfaces are respectively provided with flow channels. The flow channels on the two side surfaces are connected to form a fluid path.

[0099] The main board 11 is a plate-like structure having a certain thickness and two side surfaces arranged opposite to each other along the thickness direction. The two side surfaces each have a certain extension area, and the ratio of the extension area of ​​the side surface to the thickness of the main board is relatively large.

[0100] Generally, the thickness of the main board 11 is uniform, that is, the thickness of each part of the main board 11 is consistent. The thickness of the main board 11 can also be non-uniform, that is, the thickness of each part of the main board 11 is inconsistent, or changes regularly.

[0101] Generally, the two sides are of equal shape and equal area. The areas and shapes of the two sides may also be different. The shape of the mainboard 11 is not limited, including but not limited to polygonal, circular, other regular shapes or irregular shapes.

[0102] The flow channel refers to a groove-shaped structure integrally opened on the side, which is recessed from the side toward the inside of the main board 11. The groove-shaped structure has a certain length, width and depth, and the ratio of the length to the width is relatively large, and the ratio of the length to the depth is relatively large.

[0103] Alternatively, the flow channel refers to a pipe of the tube structure, and the tube structure is arranged on the side, thereby forming a flow channel arranged on the side. Generally, the tube structure has a certain length dimension and radial dimension, and the ratio of the length dimension to the radial dimension is large. The cross-sectional shape of the tube structure includes but is not limited to polygonal, circular, elliptical or other regular shapes. For example, in some embodiments, a circular groove is provided on the side of the main board, and the circular tube structure is spirally wound and embedded in the groove.

[0104] Generally, the flow channel is arranged on the side in a set manner, for example, arranged in a spiral manner, arranged in an S shape, or arranged in a plurality of nested U-shaped shapes, and the plurality of U-shaped shapes are connected in sequence. The flow channel can be formed by connecting a plurality of straight sections in sequence, or by connecting a plurality of curved sections in sequence, or by connecting a plurality of straight sections and a plurality of curved sections alternately.

[0105] The fluid path refers to a conductive path for fluid to flow through.

[0106] Reference Figure 6 As shown, Figure 6 A liquid cooling plate is shown, where the liquid medium enters both sides of the mainboard, flows through both sides of the mainboard, and then flows out of the mainboard from both sides of the mainboard. The solid line and the dotted line arranged relatively parallel in the figure respectively indicate that the liquid medium flows through both sides of the mainboard.

[0107] Reference Figure 7 As shown, compared to Figure 6 The liquid cooling plate shown in the figure, the cooling structure 10 provided in this embodiment, the liquid medium flows on two sides, and the cooling efficiency remaining on one side is used to cool the device on the other side, so that the cooling effect provided by the two sides is more adapted to the actual cooling requirements of the devices on both sides, the cooling effect is improved, and the cooling efficiency of the liquid medium is fully utilized. Among them, the intersecting solid lines and dotted lines in the figure represent a fluid path of the liquid medium respectively, and each fluid path enters the other side of the mainboard from one side of the mainboard.

[0108] In some embodiments, the intersection does not mean that the two fluid paths actually intersect, but that the two fluid paths are actually independent, and the intersection is merely to show that the two fluid paths flow through the two sides from different directions.

[0109] In some embodiments, intersection may also refer to the actual intersection of two fluid paths, which may also achieve the purpose of fluid reaching from one side to the other side.

[0110] In some embodiments, by removing any one of the fluid paths represented by the solid line or the dotted line and leaving only one fluid path, it is also possible to achieve fluid entering from one side of the mainboard to the other side.

[0111] In some embodiments, Fig.13 and Fig.14As shown, the cooling structure 10 is applied to a power unit 100. The power unit 100 includes a power module 1001 relatively arranged on both sides of the cooling structure 10, and the power module 1001 may include one or more power devices 1001a. The power device 1001a may be an IGBT device or a diode. The power module 1001 may include only an IGBT device, only a diode, or both an IGBT device and a diode. Among them, the IGBT device generates more heat, and the diode generates less heat.

[0112] Therefore, different power modules 1001 contain different types, quantities or distribution densities of power devices 1001a, and different power modules 1001 have different cooling requirements, that is, the cooling requirements of the power modules 1001 arranged on both sides of the cooling structure 10 may be different, which requires that both sides of the cooling structure 10 can provide cooling performance adapted to different power modules 1001.

[0113] In some embodiments, the power unit 100 is applied to an energy storage system 1000, such as an electric energy storage system, and the charging and discharging of the battery 10001 is controlled by continuously switching the switching state of at least part of the power device 1001a.

[0114] For example, the charging process of the battery is started by turning on the power device 1001a, or the discharging process of the battery 10001 is started by turning off the power device 1001a. When the power device 1001a is in the on state, the heat generation is high and the cooling demand is large. When the power device 1001a is in the off state, the heat generation is small and the cooling demand is small. Therefore, when the same or different power modules 1001 arranged on both sides of the cooling structure 10 are in different working states, their cooling requirements are also different, which requires that both sides of the cooling structure 10 can provide cooling efficiency adapted to the cooling requirements of the power module 1001.

[0115] In some embodiments, in a power unit 100, the power modules 1001 disposed on both sides of the cooling structure 10, one of the power modules 1001 is disposed opposite to one side of the mainboard 11, and the other power module 1001 is disposed opposite to the other side of the mainboard 11. The cooling requirement of one of the power modules 1001 is large, for example, the distribution density of the power devices 1001a on the one of the power modules 1001 is high, and its heat flux density is high, then the corresponding actual cooling requirement is high. The cooling requirement of the other power module 1001 is small, for example, the distribution density of the power devices 1001a on the other power module 1001 is low, and its heat flux density is low, then the corresponding actual cooling requirement is low.

[0116] In some embodiments, the liquid medium first flows in the flow channel on one side to cool one of the power modules 1001 , and then flows into the flow channel on the other side to cool the other power module 1001 .

[0117] One of the power modules 1001 has a large cooling requirement, and most of the cooling efficiency of the liquid medium is used. A small amount of cooling efficiency remains in the liquid medium, which just meets the cooling requirement of the other power module 1001. This improves the cooling effect while making full use of the cooling efficiency of the liquid medium and reducing the redundancy of the cooling efficiency of the liquid medium.

[0118] In some embodiments, the liquid medium first flows in the flow channel on the other side to cool the other power module 1001 , and then flows into the flow channel on one side to cool one of the power modules 1001 .

[0119] The cooling requirement of the other power module 1001 is small, and a small part of the cooling efficiency of the liquid medium is used. The liquid medium has most of the remaining cooling efficiency, which just meets the cooling requirement of one of the power modules 1001. This improves the cooling effect while making full use of the cooling efficiency of the liquid medium and reducing the redundancy of the cooling efficiency of the liquid medium.

[0120] In some embodiments, in a power unit 100, power modules 1001 are arranged on both sides of the cooling structure 10, one power module 1001 is arranged opposite to one side of the mainboard 11, and the other power module 1001 is arranged opposite to the other side of the mainboard 11, and the actual cooling requirements of one power module 1001 and the other power module 1001 tend to be consistent.

[0121] In some embodiments, the liquid medium first flows in the flow channel on one side to cool one of the power modules 1001 facing the one side, and then flows into the flow channel on the other side to cool the other power module 1001 facing the other side. One of the power modules 1001 uses half of the cooling efficiency of the liquid medium, and the other half of the cooling efficiency of the liquid medium is left, which just meets the needs of the other power module 1001. While improving the cooling effect, the cooling efficiency of the liquid medium is fully utilized, and the redundancy of the cooling efficiency of the liquid medium is reduced.

[0122] In some embodiments, the main board 11 is provided with a connecting portion 116 penetrating the main board, and the flow channels on the two sides are connected through the connecting portion 116 .

[0123] The connecting portion 116 refers to a structure that connects two side surfaces and is disposed on the main board 11. Penetrating the main board 11 refers to a structure that hollows out part of the material of the main board 11 along the thickness direction. The structure formed after the material is hollowed out is the connecting portion 116. The connecting portion 116 can connect two side surfaces or be a structure disposed on two side surfaces.

[0124] The structure of the connecting portion 116 is not limited, and it can penetrate the main board 11 in a straight path along the thickness direction, or in a curved path along the thickness direction. The connecting portion 116 passes from one side to another to meet the connection requirements.

[0125] The flow channels on the two sides are connected by the connecting portion 116 penetrating through the main board, thereby improving the convenience of the fluid path.

[0126] In some embodiments, the flow channels on the two sides are connected in series one by one.

[0127] Series connection refers to a method in which each structure is connected in sequence one by one, that is, the flow channel on one side, the connecting portion 116, and the flow channel on the other side are connected in sequence one by one.

[0128] The liquid medium first flows in the flow channel on one side to cool the device on that side, and then enters the flow channel on the other side through the connecting portion 116 to cool the device on the other side. The series connection realizes the flow sequence, improves the cooling effect, and fully utilizes the cooling efficiency of the liquid medium.

[0129] In some embodiments, the flow channels on the two sides may also be connected in series in other ways. For example, the two sides of the main board 11 are distinguished, and the two sides are respectively a first side 111 and a second side 112. The first side 111 is provided with at least one flow channel, and the second side 112 is provided with at least two flow channels.

[0130] In some embodiments, one flow channel is provided on the first side 111 , multiple flow channels on the second side 112 are connected in parallel, and one flow channel on the first side 111 is connected in series with multiple flow channels on the second side 112 .

[0131] For example, through a connecting portion 116 connected in series, one end of the connecting portion 116 is connected to a flow channel of the first side surface 111 , and the other end opposite to the one end is connected to multiple flow channels of the second side surface 112 .

[0132] Alternatively, multiple connecting parts 116 are connected in series, one end of the multiple connecting parts 116 is connected to a flow channel of the first side 111, and the other end of the multiple connecting parts 116 opposite to the one end is respectively connected to multiple flow channels of the second side 112.

[0133] In some embodiments, the first side 111 is provided with multiple flow channels, the multiple flow channels of the first side 111 are connected in parallel, the multiple flow channels of the second side 112 are connected in parallel, and the multiple flow channels of the first side 111 and the multiple flow channels of the second side 112 are connected in series.

[0134] For example, through a connecting portion 116 connected in series, one end of the connecting portion 116 is connected to multiple flow channels of the first side 111, and the other end opposite to the one end is connected to multiple flow channels of the second side 112. The number of flow channels of the first side 111 and the number of flow channels of the second side 112 may be the same or different.

[0135] Alternatively, the plurality of connecting portions 116 are connected, and the plurality of one ends of the plurality of connecting portions 116 can be at least partially interconnected, and the plurality of one ends are respectively connected to the plurality of flow channels of the first side surface 111, and the plurality of other ends of the plurality of connecting portions 116 opposite to the one end can be at least partially interconnected, and the plurality of other ends are respectively connected to the plurality of flow channels of the second side surface 112. The number of flow channels of the first side surface 111 and the number of flow channels of the second side surface 112 can be the same or different, and the number of connecting portions 116 can be less than or equal to the number of flow channels on the first side surface 111, and can also be less than or equal to the number of flow channels on the second side surface 112. 。

[0136] In some embodiments, on a fluid path, the difference between the sum of the number of flow channels on two sides and the number of connecting portions is equal to one.

[0137] For example, a connecting portion 116 is connected between two adjacent flow channels, and a flow channel is connected between adjacent connecting portions 116, so that multiple flow channels on two sides can be connected in series in sequence through the connecting portion 116, and the liquid medium can flow back and forth between the two sides to complete multiple heat exchanges, thereby achieving a better cooling effect on the devices on both sides and making more effective use of the cooling efficiency of the liquid medium.

[0138] In some embodiments, on a fluid path, the flow channels on the first side 111 and the flow channels on the second side 112 are connected in series one-to-one through the connecting parts 116, and the difference between the sum of the number of flow channels on the two sides and the number of connecting parts is equal to one.

[0139] In some embodiments, on a fluid path, the flow channel of the first side 111 and the flow channel of the second side 112 are connected in series in a one-to-many manner through the connecting portion 116. For example, the number of the flow channel of the first side 111 is one, the number of the flow channels of the second side 112 is multiple, the number of the connecting portions 116 is multiple, and the number of the flow channels of the second side 112 is the same as the number of the connecting portions 116. One end of the connecting portion 116 is connected to one flow channel of the first side 111, and the other end opposite to the one end is connected to multiple flow channels of the second side 112. The difference between the sum of the number of flow channels of the two sides and the number of connecting portions is equal to one.

[0140] In some embodiments, on a fluid path, the difference between the sum of the number of flow channels on two sides and the number of connecting portions is greater than one.

[0141] In some embodiments, one flow channel of the first side 111 is connected to multiple flow channels of the second side 112 via one connecting portion 116 , and the difference between the sum of the number of flow channels on the two sides and the number of connecting portions 116 is greater than one.

[0142] In some embodiments, the plurality of flow channels on the first side 111 are connected to the plurality of flow channels on the second side 112 via a connecting portion 116 , and the difference between the sum of the number of flow channels on the two sides and the number of connecting portions 116 is greater than one.

[0143] In some embodiments, the plurality of flow channels on the first side 111 are connected to the plurality of flow channels on the second side 112 through the plurality of connecting portions 116. The number of flow channels on the first side 111 may be the same as or different from the number of flow channels on the second side 112. The number of connecting portions 116 may be less than or equal to the number of flow channels on the first side 111, and may also be less than or equal to the number of flow channels on the second side 112. ， The difference between the sum of the number of flow channels on the two side surfaces and the number of the communication portions 116 is greater than one.

[0144] In some embodiments, the main board 11 is provided with at least two fluid paths connected in parallel.

[0145] Parallel connection refers to at least two identical or different flow paths being independently arranged, and at least two flow paths can allow liquid media to flow in parallel without interfering with each other during the flow process.

[0146] The liquid medium is made to flow between the two sides through multiple fluid paths, thereby further improving the cooling effect and making full use of the cooling efficiency of the liquid medium.

[0147] In some embodiments, the flow channel includes a first flow channel 114a disposed on one side of the main board 11 and a second flow channel 114b disposed on the other side of the main board 11. In one fluid path, there is only one first flow channel 114a and one second flow channel 114b.

[0148] The liquid medium enters the second flow channel 114b from the first flow channel 114a, or the liquid medium enters the first flow channel 114a from the second flow channel 114b, which simplifies the flow channel structure and improves the cooling effect.

[0149] In some embodiments, the first flow channel 114a and the second flow channel 114b are connected through the connecting portion 116, and the liquid medium enters the second flow channel 114b from the first flow channel 114a through the connecting portion 116, or enters the first flow channel 114a from the second flow channel 114b through the connecting portion 116.

[0150] In some embodiments, the main board 11 is provided with two parallel fluid paths. A first flow channel 114a and a second flow channel 114b are provided on each side of the main board 11, and a fluid path includes the first flow channel 114a on one side of the main board and the second flow channel 114b on the other side of the main board.

[0151] By setting up a double path, the cooling effect is further improved, and the cooling efficiency of the liquid medium is further fully utilized.

[0152] Two sides of the main board 11 are distinguished, and the two sides are respectively a first side 111 and a second side 112. In some embodiments, the first side 111 is configured with a first flow channel 114a and a second flow channel 114b, and the second side 112 is configured with a first flow channel 114a and a second flow channel 114b, so as to form a double fluid path on the main board 11, so as to further improve the cooling efficiency.

[0153] The first flow channel 114a of the first side surface 111 and the second flow channel 114b of the second side surface 112 are connected through the connecting portion 116, and the connecting portion 116 may be a first connecting portion 1161. The second flow channel 114b of the first side surface 111 and the first flow channel 114a of the first side surface 111 are connected through the connecting portion 116, and the connecting portion may be a second connecting portion 1162.

[0154] In some embodiments, the main board 11 is of a regular shape, such as a square plate, and the first connecting portion 1161 and the second connecting portion 1162 may be arranged at intervals along a certain radial direction of the main board 11 , and may be arranged symmetrically about the center of the main board 11 .

[0155] In some embodiments, the first flow channel 114a and the second flow channel 114b on the same side are spirally arranged in parallel, and the inner ends of the first flow channel 114a and the second flow channel 114b are connected to the first connecting portion 1161 and the second connecting portion 1162 respectively.

[0156] A spiral refers to a structure that rotates around a center in a plane and continuously approaches the center. In some embodiments, the flow channel is arranged in a spiral manner on the side, and the center of the spiral can be close to the center of the main board 11 or coincide with the center of the main board 11.

[0157] Parallel helices refer to two structures that are parallel and spiral in the same direction.

[0158] The inner end refers to the port located on the inner side of the spirally arranged flow channel.

[0159] The flow channel is spirally arranged to make the flow of the liquid medium smoother, thereby reducing the flow resistance, and the spiral arrangement facilitates the overall layout of the flow channel.

[0160] In some embodiments, the flow channel includes a third flow channel 115a disposed on one side of the main board 11 and a fourth flow channel 115b disposed on the other side of the main board 11, and at least one of the third flow channel 115a and the fourth flow channel 115b is plural. In one fluid path, the third flow channel 115a and the fourth flow channel 115b are alternately connected in series.

[0161] like Fig. 9 As shown, alternating series connection refers to a manner in which at least two different structures are connected one by one in an alternating order, that is, the third flow channel 115a, the fourth flow channel 115b, the third flow channel 115a, the fourth flow channel 115b, and so on are connected one by one, or the fourth flow channel 115b, the third flow channel 115a, the fourth flow channel 115b, the third flow channel 115a, and so on are connected one by one.

[0162] The third flow channel 115a and the fourth flow channel 115b are alternately connected in series, and the liquid medium flows alternately through the two sides, so that the cooling effect on the components on both sides is better and the cooling effect of the cooling structure is more uniform.

[0163] In some embodiments, the third flow channel 115a and the fourth flow channel 115b are connected via the connecting portion 116, and the liquid medium enters the fourth flow channel 115b from the third flow channel 115a through the connecting portion 116, and then enters the third flow channel 115a from the fourth flow channel 115b through the connecting portion 116.

[0164] In some embodiments, on one fluid path, the number of the third flow channels 115 a is two, and the number of the fourth flow channel 115 b is one.

[0165] The liquid medium enters the fourth flow channel 115b from the third flow channel 115a, flows through the fourth flow channel 115b and then enters the third flow channel 115a, that is, it flows from one side through the other side and then back to one side, which simplifies the flow channel structure and improves the cooling effect.

[0166] In some embodiments, two sides of the main board 11 are distinguished, namely a first side 111 and a second side 112. The first side 111 is provided with two third flow channels 115a and one fourth flow channel 115b, and the second side 112 is provided with two third flow channels 115a and one fourth flow channel 115b.

[0167] The two ends of the fourth flow channel 115b of the first side surface 111 are connected to the two third flow channels 115a of the second side surface 112 through two connecting parts 116 to form a fluid path. The two connecting parts 116 are respectively the first connecting part 1161 and the second connecting part 1162.

[0168] The two ends of the fourth flow channel 115b of the second side 112 are connected to the two third flow channels 115a of the first side 111 through two connecting parts respectively, thereby forming a fluid path. The two connecting parts 116 are the third connecting part 1163 and the fourth connecting part 1164 respectively.

[0169] In some embodiments, the connecting portion 116 is disposed in the middle region of the main board 11, and the fourth flow channel 115b is disposed in the region between the two connecting portions 116 connected thereto. The connecting portion 116 is disposed in the middle region of the main board 11, and the fourth flow channel 115b is disposed in the region between the two connecting portions 116, so as to improve the cooling effect on the device to be cooled corresponding to the middle region. The two connecting portions 116 can be disposed at a certain radial interval of the main board 11, and can be disposed symmetrically about the center of the main board 11.

[0170] For example, Fig.13 As shown, in the power module 1001, the front of the power device 1001a located in the middle area is directly opposite to the flow channel, and its side is surrounded by other power devices 1001a located in the periphery. The power device 1001a located in the middle area relies on the front to dissipate heat. The front of the power device 1001a located in the peripheral area is opposite to the flow channel, and part of its side faces outward. The side facing outward is not surrounded by other devices, so the device located in the peripheral area relies on the front and part of the side to dissipate heat.

[0171] Therefore, the heat flux density of the power device 1001a in the middle area is higher than that of the power device 1001a in the peripheral area, that is, the cooling requirement of the power device 1001a in the middle area is higher than that of the power device 1001a in the peripheral area.

[0172] The fourth flow channel 115b is arranged in the area between the two connecting parts 116. The liquid medium enters the fourth flow channel 115b from a third flow channel 115a through the connecting part 116, flows through the fourth flow channel b and then enters another third flow channel 115a through the connecting part 116. After the cooling efficiency provided by the liquid medium when flowing through the fourth flow channel 115b is used to cool the devices in the middle area, the remaining cooling efficiency can be used when entering another third flow channel 115a. Therefore, when the liquid medium flows through the fourth flow channel 115b, the devices in the middle area can be fully cooled to meet their cooling needs.

[0173] In some embodiments, the two third flow channels 115a are arranged in parallel spirally, and the fourth flow channel 115b includes two sub-flow channels 1110 arranged in parallel spirally, the inner ends of the two sub-flow channels 1110 are connected, and the outer ends of the two sub-flow channels 1110 are respectively connected to the inner ends of the two third flow channels 115a.

[0174] The outer end refers to the port located on the outer side of the spirally arranged flow channel.

[0175] The two third flow channels 115a are interlocked by being arranged in parallel spirals, and the two sub-flow channels 1110 are interlocked by being arranged in parallel spirals, so that the component to be cooled can be cooled with high density, thereby improving the cooling effect.

[0176] In some embodiments, the first connecting portion 1161 , the second connecting portion 1162 , the third connecting portion 1163 and the fourth connecting portion 1164 are disposed in a central region of the main board 11 , and the two third flow channels 115 a are disposed in a region between the four connecting portions 116 .

[0177] In some embodiments, Figure 8 As shown, two through-hole structures penetrating the thickness can be provided on the main board 11, and partition ribs 1112 are respectively provided in the through-hole structures, and one partition rib 1112 divides one through-hole structure into a first connecting portion 1161 and a third connecting portion 1163. Another partition rib 1112 divides another through-hole structure into a second connecting portion 1162 and a fourth connecting portion 1164. The two through-hole structures can be arranged at a certain radial interval of the main board 11, and can be arranged symmetrically about the center of the main board 11.

[0178] In some embodiments, the flow channel on at least one side of the main board 11 is spirally arranged.

[0179] The flow channel is spirally arranged to make the flow of the liquid medium smoother, thereby reducing the flow resistance and facilitating the layout of the flow channel around the center of the main board 11 .

[0180] like Figure 3As shown, in some embodiments, the two sides are respectively provided with a first flow channel 114a and a second flow channel 114b, the first flow channel 114a and the second flow channel 114b are both spirally arranged, and the inner end of the first flow channel 114a is connected to the inner end of the second flow channel 114b.

[0181] The first flow channel 114a and the second flow channel 114b disposed on both sides are spirally arranged, so that the flow smoothness of the liquid medium on the entire path is better, and the inner ends of the flow channels on the two sides are connected, that is, connected in the central area of ​​the area where the flow channels are located, which is beneficial to improve the cooling effect on the components to be cooled corresponding to the central area.

[0182] In some embodiments, the flow channels on the two sides are spirally arranged, the outer ends of the flow channels on the two sides are connected, and the liquid medium flows into or out of the flow channel at the center of the flow channel.

[0183] like Figure 8 As shown, in some embodiments, a first flow channel 114a and a second flow channel 114b are respectively provided on each side of the main board 11, and the first flow channel 114a and the second flow channel 114b on the same side are spirally arranged in parallel.

[0184] The first flow channel 114a and the second flow channel 114b on the same side are interlocked by being arranged in parallel spirals, so as to perform high-density cooling on the component to be cooled, thereby improving the cooling effect.

[0185] In some embodiments, the flow channel includes two third flow channels 115a provided on one side of the main board 11 and a fourth flow channel 115b provided on the other side of the main board 11, and the third flow channels 115a and the fourth flow channels 115b are alternately connected in series. The two third flow channels 115a are arranged in parallel and spirally, and the fourth flow channel 115b is arranged in spirally, and the fourth flow channel 115b is arranged on the inner side of the two third flow channels 115a, and the inner ends of the two third flow channels 115a are respectively connected to the two outer ends of the fourth flow channel 115b.

[0186] The two third flow channels 115a are mutually embedded in parallel spirals, and the fourth flow channel 115b is spirally arranged, which can perform high-density cooling on the cooling component, improve the cooling effect, and facilitate the layout of the fourth flow channel 115b around the center of the third flow channel 115a.

[0187] In some embodiments, the fourth flow channel 115b includes two sub-flow channels 1110 arranged in parallel spirally, the inner ends of the two sub-flow channels 1110 are connected, and the outer ends of the two sub-flow channels 1110 are connected to the inner ends of the two third flow channels 115a respectively.

[0188] The two sub-channels 1110 are interlocked by being arranged in parallel spirals, which can perform high-density cooling on the component to be cooled and improve the cooling effect.

[0189] In some embodiments, the flow channel includes two sections, which are arranged in parallel to form parallel flow channel sections. At least two parallel flow channel sections are provided on one side of the main board. In different parallel flow channel sections, the spacing between adjacent flow channel walls on the two sections is different.

[0190] Due to the different distribution densities or cooling requirements of the components to be cooled, the spacing between the adjacent flow channel walls on different parallel flow channel sections is set differently, so that they have different density designs to adapt to the different distribution densities or different cooling requirements of the components to be cooled. For example, if the distribution density of the components to be cooled is high or the cooling requirement is high, the spacing between the corresponding adjacent flow channel walls is designed to be a smaller spacing, and if the distribution density of the components to be cooled is low or the cooling requirement is low, the spacing between the corresponding adjacent flow channel walls is designed to be a larger spacing.

[0191] In some embodiments, the location where the flow channels on the two sides are connected is set in the middle area of ​​the main board 11; the distance between adjacent flow channel walls on two sections in the parallel flow channel section close to the middle area is smaller than the distance between adjacent flow channel walls on two sections in the parallel flow channel section away from the middle area.

[0192] The density of the components to be cooled corresponding to the middle area of ​​the main board 11 is high or the cooling demand is high, while the density of the components to be cooled corresponding to the outer area of ​​the main board 11 is low or the cooling demand is low. Therefore, the flow channel design of the middle area and the outer area is more adapted to the distribution density or cooling demand of the corresponding components to be cooled, thereby further improving the cooling efficiency and making fuller use of the cooling performance of the liquid medium.

[0193] In some embodiments, the flow channel is arranged in a spiral, and along the spiral direction of the flow channel from the outside to the inside, the distance between the flow channel walls adjacent to each other in two sections gradually decreases.

[0194] The spacing between the flow channel walls gradually decreases, the tightness of the flow channel gradually increases, the cooling effect gradually increases, and the cooling effect shows a gradual trend, making it more adaptable to the gradually changing cooling requirements of the components to be cooled.

[0195] In some embodiments, the two sections are separated by a main fin 1113 , and two adjacent flow channel walls are disposed on both sides of the main fin 1113 .

[0196] like Figure 3 and Fig.12 As shown, in some embodiments, a first flow channel 114a and a second flow channel 114b are provided on one side of the main board, and the first flow channel 114a and the second flow channel 114b are arranged in parallel and spirally.

[0197] Along the spiral direction of the flow channel from outside to inside, in the area located on the outside, that is, away from the middle area, in the flow channel section between the two dotted lines, a partial section of the first flow channel 114a is used as the first section a1, and a partial section of the second flow channel 114b is used as the second section a2. The first section a1 and the second section a2 are arranged in parallel to form a first parallel flow channel section a. The first parallel flow channel section a is separated by the main fins 1113. The two adjacent flow channel walls on the first section a1 and the second section a2 are the first flow channel walls 1111a. The distance between the two first flow channel walls 1111a is L1.

[0198] In the area located on the inner side, that is, close to the middle area, in the flow channel section between the two dotted lines, a partial section of the first flow channel 114a serves as the third section b1, and a partial section of the second flow channel 114b serves as the fourth section b2. The third section b1 and the fourth section b2 are arranged in parallel to form a second parallel flow channel section b. The second parallel flow channel section b is formed by separating the main fins 1113. The two adjacent flow channel walls on the third section b1 and the fourth section b2 are second flow channel walls 1111b. The distance between the two second flow channel walls 1111b is L2, and L1>L2.

[0199] In some embodiments, the flow channel extends continuously in the spiral direction, and the distance between the two flow channel walls changes continuously and gradually, for example Fig.12 As shown, along the spiral direction of the flow channel from outside to inside, the distance between the two flow channel walls decreases continuously.

[0200] In some embodiments, along the spiral direction of the flow channel from the outside to the inside, the distance between two flow channel walls can be reduced in a gradient manner. For example, there are multiple parallel flow channel sections in sequence along the spiral direction from the outside to the inside, and the distance between two flow channel walls in the multiple parallel flow channel sections decreases successively.

[0201] Flow channels are formed between adjacent main fins 1113 , and the main fins 1113 are used to transfer heat to improve the cooling efficiency of the liquid medium.

[0202] In some embodiments, a main fin 1113 is provided between adjacent flow channels, and the distance between two opposite side walls on the main fin 1113 gradually decreases along the spiral direction of the flow channel from the outside to the inside, and the side wall is the flow channel wall of the flow channel. The distance between two opposite side walls on the main fin 1113 gradually decreases, and the flow channel is more compact in the center area of ​​the spiral. Under the same cooling effect, compared with the unchanged distance between the main fins 1113, the distance between the main fins 1113 gradually decreases, which greatly reduces the length of the flow channel, reduces the flow resistance of the liquid medium, and meets the purpose of matching the center area of ​​the spiral with the device with high heat flux density.

[0203] For example, Fig.13As shown, in the power module 1001, the front of the power device 1001a located in the middle area is directly opposite to the flow channel, and its side is surrounded by other power devices located in the periphery. The power device 1001a located in the middle area relies on the front to dissipate heat. The front of the power device 1001a located in the peripheral area is opposite to the flow channel, and part of its side faces outward. The side facing outward is not surrounded by other devices, so the device located in the peripheral area relies on the front and part of the side to dissipate heat.

[0204] Therefore, the heat flux density of the power device 1001a in the middle area is higher than that of the power device 1001a in the peripheral area, that is, the cooling requirement of the power device 1001a in the middle area is higher than that of the power device 1001a in the peripheral area.

[0205] Along the flow channel spiraling from outside to inside, the distance between the two opposite side walls on the main fin 1113 gradually decreases, that is, the flow channel design in the spiral center area is relatively tight, with high cooling efficiency, which is suitable for the cooling needs of power devices located in the middle area. The flow channel design in the peripheral area is relatively loose, with low cooling efficiency, which is suitable for the cooling needs of power devices located in the peripheral area.

[0206] In some embodiments, the main board 11 is provided with a first port 117 and a second port 118, and at least one side channel is connected to the first port 117, and at least one side channel is connected to the second port 118. The first port 117 and the second port 118 are mutually axisymmetric structures.

[0207] The first port 117 and the second port 118 are axially symmetrical structures with each other, so there is no need to distinguish between the first port 117 and the second port 118 during assembly, thereby improving the assembly flexibility and maintainability of the mainboard.

[0208] In some embodiments, the main board 11 is of a regular shape, has an axis of symmetry, and the first opening 117 and the second opening 118 are symmetrically arranged about the axis of symmetry. For example, the main board 11 is a quadrilateral, has a central axis that can bisect the main board 11, and the central axis serves as the axis of symmetry.

[0209] In some embodiments, the main board 11 further includes a peripheral wall surface 113 , the peripheral wall surface 113 connects the two side surfaces, and the peripheral wall surface 113 is configured with a first opening 117 and a second opening 118 .

[0210] The peripheral wall surface 113 refers to the outer surface of the main board 11 that connects the two side surfaces, and also refers to the outer surface of the main board 11 that extends along the thickness direction. The two side surfaces and the peripheral wall surface 113 constitute the entire outer surface of the main board 11 .

[0211] The first port 117 and the second port 118 are arranged on the peripheral wall surface 113. The space provided on the side of the peripheral wall surface 113 can be used for convenient maintenance of the first port 117 and the second port 118, and is also conducive to the first port 117 and the second port 118 using the space to connect with the external system of the liquid medium.

[0212] In some embodiments, the peripheral wall surface 113 is a regular annular surface, the peripheral wall surface 113 has a symmetry axis, and the first port 117 and the second port 118 are symmetrically arranged about the symmetry axis. For example, the peripheral wall surface 113 is a square annular surface, the peripheral wall surface 113 has a central axis that can bisect the peripheral wall surface 113, and the central axis serves as the symmetry axis.

[0213] In some embodiments, the two side surfaces are respectively configured with a first opening 117 and a second opening 118 .

[0214] By turning over the mainboard, the first port 117 and the second port 118 can be interchangeably assembled, that is, it is not necessary to distinguish between the first port 117 and the second port 118 when assembling the mainboard, thereby improving the assembly flexibility and maintainability of the mainboard.

[0215] In some embodiments, the first opening 117 and the second opening 118 are respectively disposed on two side surfaces, and along the thickness direction of the main board, one of the first opening 117 and the second opening 118 is projected onto the other.

[0216] In some embodiments, Fig.10 As shown, the first opening 117 and the second opening 118 are respectively arranged on two side surfaces, and the two are staggered. When the main board 11 is turned over along the central axis, the first opening 117 and the second opening 118 can be interchanged.

[0217] In some embodiments, when the main board 11 is configured with one fluid path, two third flow channels 115 a are configured on the same side, one third flow channel 115 a is connected to the first port 117 , and the other third flow channel 115 a is connected to the second port 118 .

[0218] like Figure 8 As shown, in some embodiments, when the main board 11 is configured with two fluid paths, one of the third flow channels 115 a on the two side surfaces is communicated with the first port 117 , and the other third flow channels 115 a on the two side surfaces is communicated with the second port 118 .

[0219] like Figure 1 and Figure 2 As shown, in some embodiments, when the main board 11 is provided with a fluid path, the two sides are provided with a first flow channel 114a and a second flow channel 114b respectively. The first flow channel 114a on one side is connected to the first port 117, and the second flow channel 114b on the other side is connected to the second port 118.

[0220] like Figure 3 As shown, in some embodiments, when the main board 11 is provided with two fluid paths, a first flow channel 114a and a second flow channel 114b are provided on one side, wherein the first flow channels 114a on both sides are connected to the first port 117, and the second flow channels 114b on both sides are connected to the second port 118.

[0221] In some embodiments, at least a section of the flow channel is provided with a partition rib 1112 , and the partition rib 1112 divides the section into two parallel branch flow channels 119 .

[0222] The partition rib 1112 divides at least a portion of the flow channel into two parallel branch flow channels 119 to increase the area of ​​the flow channel and improve the cooling efficiency per unit time.

[0223] In some embodiments, the cooling structure 10 includes two cover plates 12 , which are disposed on two sides of the main board 11 and are respectively attached to the two side surfaces to seal the flow channels on the two side surfaces.

[0224] The two cover plates 12 are used to seal the flow channels on the two sides, thereby improving the sealing performance of the flow channels and providing the reliability of the cooling structure.

[0225] In some embodiments, the sides of the cover plate 12 and the main board 11 that are in contact with each other are connected and sealed by welding. In some embodiments, based on the welding method, the cover plate 12 and the main board 11 are welded face to face, so that the connection reliability and connection sealing of the two are better.

[0226] Reference Fig.13 and Fig.14 As shown, another object of the embodiment of the present application is to provide a power unit 100, which includes the cooling structure 10 as described above.

[0227] Since the power unit 100 provided in the embodiment of the present application adopts the cooling structure 10 provided in the embodiment of the present application, the cooling structure 10 can fully utilize the cooling efficiency of the liquid medium, and the provided cooling efficiency is high, which can meet the heat dissipation requirements of the large-capacity power unit 100, thereby improving the working efficiency and use safety of the power unit 100, and can extend the service life of the power unit 100.

[0228] like Fig.14 As shown, in some embodiments, the power unit 100 includes at least two power modules 1001 and at least one cooling structure 10, and the at least two power modules 1001 and at least one cooling structure 10 are alternately arranged in sequence. Each power module 1001 has two opposite sides, and each side is configured with one or more power devices 1001a.

[0229] A cooling structure 10 is configured between two power modules 1001, and a power module 1001 is configured between the two cooling structures 10. The power device 1001a on the opposite side of a power module 1001 is cooled by the opposite sides of two adjacent cooling structures 10, and the flow channel on the opposite side of a cooling structure 10 is used to cool the opposite sides of two adjacent power modules 1001.

[0230] Among them, at least two power modules 1001 may be at least partially identical or completely different, and the working timings of at least two power modules 1001 may be at least partially identical or completely different. On a power module 1001, the number, type, and layout of power devices 1001a on different sides may be the same or different.

[0231] For example, on a power module 1001, the number, type and layout of power devices 1001a on opposite sides are the same. In one embodiment, the power devices 1001a on opposite sides of the power module 1001 are symmetrically arranged, that is, the structures on both sides of the power module 1001 are the same.

[0232] For another example, on a power module 1001 , at least one of the number, type and layout of the power devices 1001 a on the opposite sides is different. In one implementation, the power devices 1001 a on the opposite sides of the power module 1001 are asymmetrically arranged.

[0233] In some embodiments, when the power devices 1001 a on two opposite sides of two adjacent power modules 1001 are consistent, the actual cooling requirements of the power devices 1001 a on the two opposite sides tend to be consistent.

[0234] The cooling structure 10 is arranged between the two adjacent power modules 1001. The liquid medium flows in the flow channel on one side thereof, cools the power device 1001a opposite to the one side, and then enters the flow channel on the other side through the connecting portion 116 and flows therein, cooling the power device 1001a opposite to the other side.

[0235] The power device 1001a facing the one side uses nearly half of the cooling efficiency of the liquid medium, and the liquid medium has the remaining half of the cooling efficiency, which just meets the needs of the power device 1001a facing the other side, thereby improving the cooling effect while making full use of the cooling efficiency of the liquid medium and reducing or avoiding the redundancy of the cooling efficiency of the liquid medium.

[0236] In other embodiments, when the power devices 1001a on opposite sides of two adjacent power modules 1001 are inconsistent, the actual cooling requirements of the power devices 1001a on the opposite sides tend to be inconsistent, the heat flux density of the power device 1001a on one side is higher, and the corresponding actual cooling requirement is high, while the heat flux density of the power device 1001a on the other side is lower, and the corresponding actual cooling requirement is low.

[0237] The cooling structure 10 is arranged between the two adjacent power modules 1001. The liquid medium flows in the flow channel on one side thereof, cools the power device 1001a on one side, and then enters the flow channel on the other side through the connecting portion 116 and flows therein to cool the power device 1001a on the other side.

[0238] The power device 1001a on one side uses most or a small part of the cooling efficiency of the liquid medium, and the liquid medium has a small part or most of the remaining cooling efficiency, which just meets the needs of the power device 1001a on the other side, thereby improving the cooling effect while making full use of the cooling efficiency of the liquid medium and reducing or avoiding the redundancy of the cooling efficiency of the liquid medium.

[0239] In some embodiments, Fig.13 and Fig.14 As shown, the cooling structure 10 is applied to a power unit 100. The power unit 100 includes a power module 1001 relatively arranged on both sides of the cooling structure 10, and the power module 1001 may include one or more power devices 1001a. The power device 1001a may be an IGBT device or a diode. The power module 1001 may include only an IGBT device, only a diode, or both an IGBT device and a diode. Among them, the IGBT device generates more heat, and the diode generates less heat.

[0240] Therefore, different power modules 1001 contain different types, quantities or distribution densities of power devices 1001a, and different power modules 1001 have different cooling requirements, that is, the cooling requirements of the power modules 1001 arranged on both sides of the cooling structure 10 may be different, which requires that both sides of the cooling structure 10 can provide cooling performance adapted to different power modules 1001.

[0241] In some embodiments, the power unit 100 is applied to an energy storage system 1000, such as an electric energy storage system, and the charging and discharging of the battery 10001 is controlled by continuously switching the switching state of at least part of the power device 1001a.

[0242] For example, the charging process of the battery is started by turning on the power device 1001a, or the discharging process of the battery 10001 is started by turning off the power device 1001a. When the power device 1001a is in the on state, the heat generation is high and the cooling demand is large. When the power device 1001a is in the off state, the heat generation is small and the cooling demand is small. Therefore, when the same or different power modules 1001 arranged on both sides of the cooling structure 10 are in different working states, their cooling requirements are also different, which requires that both sides of the cooling structure 10 can provide cooling efficiency adapted to the cooling requirements of the power module 1001.

[0243] like Fig.15 As shown, another object of the embodiment of the present application is to provide an energy storage system 1000, which includes the power unit 100 as described above.

[0244] Since the energy storage system 1000 provided in the embodiment of the present application adopts the power unit 100 provided in the embodiment of the present application, the cooling structure 10 in the power unit 100 can fully utilize the cooling efficiency of the liquid medium, and the provided cooling efficiency is high, which can meet the heat dissipation requirements of the large-capacity energy storage system 1000.

[0245] like Fig.15 As shown, in some embodiments, the energy storage system 1000 includes a battery 10001, and the power module 1001 in the power unit 100 may include one or more power devices 1001a. For example, the power device 1001a may be a three-terminal semiconductor switching device. The power module 1001 controls the switching and working state of the battery 10001 through one or more power devices 1001a.

[0246] Another object of the embodiments of the present application is to provide an electrical device, wherein the electrical device includes the energy storage system 1000 as described above, and the energy storage system 1000 also includes a battery 10001 electrically connected to the power unit 100 .

[0247] The electric device provided in the embodiment of the present application adopts the energy storage system provided in the embodiment of the present application. The beneficial effects thereof compared with the prior art are consistent with the beneficial effects of the energy storage system compared with the prior art, and will not be repeated here.

[0248] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A cooling structure, characterized in that: The cooling structure comprises a main board, and the main board comprises two side surfaces arranged opposite to each other; The two side surfaces are respectively provided with flow channels, and the flow channels on the two side surfaces are connected to form a fluid path.

2. The cooling structure according to claim 1, characterized in that: The main board is provided with a connecting portion penetrating the main board, and the flow channels on the two side surfaces are connected through the connecting portion.

3. The cooling structure according to claim 2, characterized in that: On one of the fluid paths, a difference between a sum of the numbers of the flow channels on the two side surfaces and a number of the communication portions is equal to one.

4. The cooling structure according to any one of claims 1 to 3, characterized in that: The main board is provided with at least two fluid paths connected in parallel.

5. The cooling structure according to any one of claims 1 to 4, characterized in that: On one of the fluid paths, the flow channels on the two side surfaces are connected in series one by one.

6. The cooling structure according to any one of claims 1 to 5, characterized in that: The flow channel includes a third flow channel provided on one side of the main board and a fourth flow channel provided on the other side of the main board, and at least one of the third flow channel and the fourth flow channel is multiple in number; On one of the fluid paths, the third flow passages and the fourth flow passages are alternately connected in series.

7. The cooling structure according to claim 6, characterized in that: On one of the fluid paths, the number of the third flow channels is two, and the number of the fourth flow channel is one.

8. The cooling structure according to any one of claims 1 to 5, characterized in that: The flow channel on at least one side of the main board is spirally arranged.

9. The cooling structure according to claim 8, characterized in that: The two side surfaces are respectively provided with a first flow channel and a second flow channel, the first flow channel and the second flow channel are both spirally arranged, and the inner end of the first flow channel is connected with the inner end of the second flow channel.

10. The cooling structure according to claim 9, characterized in that: A first flow channel and a second flow channel are respectively provided on each side of the main board, and the first flow channel and the second flow channel on the same side are arranged in parallel and spirally.

11. The cooling structure according to claim 8, characterized in that: The flow channel includes two third flow channels arranged on one side of the main board and a fourth flow channel arranged on the other side of the main board, and the third flow channel and the fourth flow channel are alternately connected in series; The two third flow channels are arranged in parallel in a spiral manner, the fourth flow channel is arranged in a spiral manner, the fourth flow channel is arranged on the inner side of the two third flow channels, and the inner ends of the two third flow channels are respectively connected to the two outer ends of the fourth flow channel.

12. The cooling structure according to claim 11, characterized in that: The fourth flow channel includes two sub-flow channels which are arranged in parallel spirally, the inner ends of the two sub-flow channels are connected, and the outer ends of the two sub-flow channels are connected to the inner ends of the two third flow channels respectively.

13. The cooling structure according to any one of claims 1 to 12, characterized in that: The flow channel comprises two sections, and the two sections are arranged in parallel to form a parallel flow channel section; At least two parallel flow channel sections are provided on one side of the main board, and in different parallel flow channel sections, the distances between adjacent flow channel walls on the two sections are different.

14. The cooling structure according to claim 13, characterized in that: The position where the flow channels on the two side surfaces communicate is set in the middle area of ​​the main board; The distance between adjacent flow channel walls on two sections of the parallel flow channel section close to the middle area is smaller than the distance between adjacent flow channel walls on two sections of the parallel flow channel section away from the middle area.

15. The cooling structure according to claim 14, characterized in that: The flow channel is arranged in a spiral, and along the spiral direction of the flow channel from the outside to the inside, the distance between adjacent flow channel walls on the two sections gradually decreases.

16. The cooling structure according to any one of claims 13 to 15, characterized in that: The two sections are separated and formed by a main fin, and the two adjacent flow channel walls are arranged on both sides of the main fin.

17. The cooling structure according to any one of claims 1 to 16, characterized in that: The main board is provided with a first port and a second port, the flow channel of at least one of the side surfaces is connected to the first port, and the flow channel of at least one of the side surfaces is connected to the second port; Wherein, the first port and the second port are axisymmetric structures with respect to each other.

18. The cooling structure according to claim 17, characterized in that: The main board further includes a peripheral wall surface, the peripheral wall surface connects the two side surfaces, and the peripheral wall surface is configured with the first port and the second port.

19. The cooling structure according to claim 17, characterized in that: The two side surfaces are respectively configured with the first opening and the second opening.

20. The cooling structure according to any one of claims 1 to 19, characterized in that: At least a section of the flow channel is provided with a partition rib, and the partition rib divides the section into two parallel branch flow channels.

21. The cooling structure according to any one of claims 1 to 20, characterized in that: The cooling structure comprises two cover plates, which are respectively arranged on two sides of the main board and respectively adhered to the two side surfaces to seal the flow channels on the two side surfaces.

22. A power unit, characterized in that: The power unit comprises a cooling structure according to any one of claims 1-21.

23. An energy storage system, characterized in that: The energy storage system comprises the power unit as claimed in claim 22.

24. An electrical device, characterized in that: The electrical device comprises the energy storage system as claimed in claim 23; The energy storage system also includes a battery electrically connected to the power unit.

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