Liquid ejecting head, liquid ejecting apparatus, and method of manufacturing liquid ejecting head

Abstract

The invention relates to a liquid ejecting head, a liquid ejecting apparatus, and a method of manufacturing the liquid ejecting head. In a liquid ejecting head including a liquid ejecting substrate configured to eject a liquid, the liquid ejecting substrate is configured to include a first substrate in which a channel for the liquid is formed, and a second substrate bonded to a first surface of the first substrate via an adhesive, when viewed in a direction perpendicular to the first surface, the first substrate has: a channel region including a plurality of channels for the liquid and partitions separating adjacent channels for the liquid from each other; and a bonding region, the bonding region being adjacent to the channel region and including a recess opening on the first surface, the adhesive being accommodated in the recess.

Description

Technical Field

[0001] The present disclosure relates to a liquid ejecting head and a liquid ejecting apparatus, and in detail, to a technique of laminating a plurality of substrates forming the liquid ejecting head and bonding them to each other. Background Art

[0002] Among the liquid ejection heads, there is a liquid ejection head formed by stacking a channel substrate on a support substrate, the channel substrate being a substrate in which a channel for supplying a liquid such as ink to an ejection port or the like is formed. Japanese Patent Laid-Open No. 2023-061022 describes bonding these stacked substrates to each other with an adhesive. In detail, the undulation of the adhesive layer when the adhesive layer is transferred to the substrate is controlled to suppress protrusion of the adhesive from the adhesive portion.

[0003] However, the protrusion of the adhesive is desirable in some cases. Specifically, the protruding adhesive moves on the walls of the partition forming the channel in the supporting substrate and the channel forming substrate, and forms an adhesive layer not only in the adhesive portion of the partition but also in the portion continuous with the adhesive portion. Therefore, by the above-mentioned protrusion, a part of the adhesive layer that prevents ink leakage can be made larger, and ink can be prevented from leaking through the partition between adjacent channels. From this point of view, it can be said that it is desirable for the adhesive to protrude a lot onto the walls of the partition and the supporting substrate as long as there is no adverse effect such as channel clogging.

[0004] However, in the case where the amount of adhesive is increased to increase the protrusion of the adhesive formed around the separator, a large amount of adhesive is also put into the portion of the channel-forming substrate such as the separator where the channel is not formed (for example, the bonding area to be bonded with the support substrate). Therefore, there is a possibility that a large amount of adhesive protrudes into the channel adjacent to the bonding area, etc., and an adverse effect such as channel clogging occurs. Summary of the invention

[0005] In a liquid ejection head including a liquid ejection substrate configured to eject liquid in the present disclosure, the liquid ejection substrate is configured to include a first substrate and a second substrate, a channel for the liquid is formed in the first substrate, the second substrate is bonded to a first surface of the first substrate via an adhesive, and when observed in a direction perpendicular to the first surface, the first substrate has: a channel area, the channel area including a plurality of channels for the liquid and partitions separating adjacent channels for the liquid from each other; and a bonding area, the bonding area being adjacent to the channel area and including a recess opening on the first surface, the adhesive being accommodated in the recess.

[0006] Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a perspective view showing a portion of a liquid ejection substrate forming a liquid ejection head according to a first embodiment of the present disclosure, in cross section;

[0008] Figure 2 yes Figure 1 a cross-sectional view of the portion of the liquid ejection substrate shown in ;

[0009] Figure 3 It shows Figure 2 A diagram of a portion A of a liquid ejection substrate shown;

[0010] Figure 4A When viewed from the bottom surface of the channel forming substrate Figure 1 A diagram of a channel forming substrate of a liquid ejection substrate is shown;

[0011] Figure 4B yes Figure 4A An enlarged view of part B in FIG.

[0012] Figure 5 It shows two Figure 4A A diagram showing a state in which the liquid ejection substrates are joined to each other;

[0013] Figure 6 yes Figure 5 An enlarged view of part C in FIG.

[0014] Figure 7 It is schematically shown Figure 4B An illustration of some recesses in the joining region of FIG.

[0015] Figure 8 is a diagram showing a liquid ejection substrate according to a second embodiment of the present disclosure;

[0016] Fig. 9 is a perspective view showing a liquid ejection head according to an embodiment of the present disclosure; and

[0017] Fig.10 is a perspective view schematically showing an inkjet printing apparatus according to one embodiment of a liquid ejection apparatus. DETAILED DESCRIPTION

[0018] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. Note that the size, material, and shape of each component in the embodiments described below, as well as the arrangement of the components relative to each other, etc., can be appropriately changed according to the configuration of the liquid ejection substrate, etc. in the liquid ejection head to which the present disclosure is applied and various conditions. The scope of the present disclosure is not limited to the embodiments described below.

[0019] (Example 1)

[0020] Figure 1 is a perspective view showing a portion of a liquid ejection substrate forming a liquid ejection head according to the present embodiment in cross section, Figure 2 yes Figure 1 A cross-sectional view of the portion of the liquid ejection substrate shown in FIG. Figure 1 and Figure 2 As shown, the liquid injection substrate 10 includes a channel forming substrate (hereinafter also referred to as a first substrate) 100, a supporting substrate (hereinafter also referred to as a second substrate) 300 bonded to the channel forming substrate 100 via an adhesive 200, and an energy generating element 400 disposed on the channel forming substrate 100 and configured to generate energy for injecting liquid.

[0021] The liquid ejection substrate 10 of the present embodiment is used by being attached to an inkjet printing apparatus as a liquid ejection apparatus, and ejects ink as a liquid.

[0022] The channel layer 150 and the nozzle layer 160 are stacked on the upper surface (hereinafter also referred to as the first surface) 111 of the channel forming substrate 100 in a range corresponding to the portion to be formed by the channel layer 150 and the nozzle layer 160, and are formed with the ejection port 120, the pressure chamber 118, etc. The lower surface (hereinafter also referred to as the second surface) 112 of the channel forming substrate 100 is bonded to the support substrate 300 via the adhesive 200 according to each portion described later. In addition, a pitch conversion channel 320 connected to the common channel 132 formed in the channel forming substrate 100 is formed in the support substrate 300.

[0023] like Figure 2 As shown, the liquid ejection substrate 10 according to the embodiment described above is divided into a channel region 130 and a bonding region 140 in a direction orthogonal to the arrangement direction of the ejection ports 120 .

[0024] In the channel region 130, there are a common channel 132 for supplying liquid to the energy generating element 400, individual channels 134 communicating with the common channel 132, and a pressure chamber 118 in which the energy generating element 400 is disposed. The liquid reaches the pressure chamber 118 from the common channel 132 by passing through the individual channels 134, and the energy generating element 400 generates energy so that the liquid reaching the pressure chamber 118 is ejected from the ejection port 120 communicating with the pressure chamber 118. In addition, the common channel 132 includes a supply channel 132a for supplying liquid to the energy generating element 400 and a collection channel 132b for collecting liquid supplied to the energy generating element 400 and not used in ejection. As described above, the channel region 130 is a region in which the lower surface 112 at the partition 136 for forming the channel is bonded to the support substrate 300 by the adhesive 200. Figure 3 It shows Figure 2 Schematic diagram of part A of the liquid injection substrate shown. The lower surface 112 at the partition 136 in the channel forming substrate 100 is bonded to the upper surface (hereinafter also referred to as the third surface) 311 of the supporting substrate 300 via the adhesive 200. In this case, the protruding adhesive moves to the lower parts of the two side walls 136a and 136b of the partition 136 forming the common channel 132, and moves to a part of the upper surface 311 of the supporting substrate 300 adjacent to the partition 136, and is cured. Therefore, the ink leakage path IP (which is a path that prevents ink from flowing in and out between channels) can be made longer, and a liquid injection head with high reliability without unnecessary ink flowing in or out can be obtained. Note that in the form of different kinds of liquids flowing through the common channel 132, the protrusion of the adhesive in the part of the partition 136 can also prevent adverse effects such as liquid mixing and a reduction in the circulation flow of each different kind of liquid.

[0025] Reference again Figure 1 and Figure 2 , the bonding area 140 is an area adjacent to the channel on only one side of the channel forming substrate 100. Specifically, a part of the area (in which the lower surface 112 of the channel forming substrate 100 is bonded to the supporting substrate 300) is an area where ink cannot flow through the bonding part. In this area, a plurality of recesses (grooves) 142 for receiving the adhesive are provided on the lower surface side of the channel forming substrate 100. Specifically, in the case where the lower surface 112 of the channel forming substrate 100 is bonded to the upper surface 311 of the supporting substrate 300 via the adhesive 200, the recess 142 particularly receives the adhesive 200 applied to the portion of the bonding area 140 adjacent to the common channel 132. This can suppress the adhesive from protruding toward the common channel 132 adjacent to the bonding area 140, and prevent the channel from being clogged with the adhesive.

[0026] Note that although the energy generating element 400 in the present embodiment is a heating resistor, the energy generating element 400 may have another form and may be, for example, a piezoelectric element. In addition, wiring for supplying power to the energy generating element 400, pads for electrode connection, and the like are not shown. It is preferred to use a material having high adhesion to the channel forming substrate 100 and the supporting substrate 300 as the adhesive 200. The adhesive 200 is preferably a material having high coating performance and very few mixed bubbles, etc., and is preferably a material with low viscosity so that the adhesive 200 can be easily made into a material with a small thickness. For example, the adhesive 200 may include any resin selected from the group consisting of epoxy resin, acrylic resin, silicone resin, benzocyclobutene resin, polyamide resin, polyimide resin, and polyurethane resin.

[0027] The adhesive 200 may be cured by heat curing or delayed ultraviolet curing. Note that ultraviolet curing may be used as the adhesive 200 curing method when the channel forming substrate 100 or the supporting substrate 300 can transmit ultraviolet rays.

[0028] In addition, an adhesive transfer method utilizing the substrate used can be given as a method for applying the adhesive 200. Specifically, a transfer substrate is prepared, and the adhesive 200 is thinly and evenly applied to the transfer substrate by a spin coating method or a slit coating method. Then, the second surface 112 of the channel forming substrate 100 is contacted with the applied adhesive 200, so that the adhesive 200 can be transferred only to the second surface 112 of the channel forming substrate 100. The size of the transfer substrate is preferably equal to or greater than the size of the channel forming substrate 100. It is preferred to use a film of silicon, glass, PET, PEN, PI, etc. as a transfer substrate. In addition, screen printing and distribution coating can be given as a method for directly forming the adhesive 200 on the channel forming substrate 100. Although the above description is given by using the channel forming substrate 100, the adhesive can be applied to the third surface 311 of the supporting substrate 300 for bonding with the channel forming substrate 100 as the same coating method.

[0029] Note that the bonding of the support substrate 300 and the channel forming substrate 100 coated with the adhesive 200 is performed such that the channel forming substrate 100 and the support substrate 300 are heated to a predetermined temperature in a bonding device and then subjected to pressurization at a certain pressure for a certain time. These bonding parameters are appropriately set according to the adhesive material. In addition, it is preferred to bond the channel forming substrate 100 and the support substrate 300 in a vacuum to suppress the mixing of bubbles into the bonding portion of the channel forming substrate 100 and the support substrate 300.

[0030] In the case where the adhesive 200 is a thermosetting adhesive, the adhesive 200 can be heated until it is cured in the bonding device. The curing of the adhesive 200 can be promoted by taking out the substrate bonding body after bonding and heating the substrate bonding body separately in an oven or the like. Meanwhile, in the case where the adhesive 200 is a delayed ultraviolet curing type adhesive, before bonding the channel forming substrate 100 and the supporting substrate 300, the adhesive 200 is irradiated with a limited amount of ultraviolet rays, and then the supporting substrate 300 is bonded to the channel forming substrate 100. After the supporting substrate 300 is bonded to the channel forming substrate 100, it is preferred to further heat the substrate bonding body to fully promote the curing of the adhesive 200. In the case where the adhesive 200 is an ultraviolet curing type adhesive, the channel forming substrate 100 and the supporting substrate 300 are bonded to each other, and then, the adhesive 200 on the substrate (channel forming substrate 100 and / or supporting substrate 300) that transmits ultraviolet rays is irradiated with a limited amount of ultraviolet rays to cure the adhesive 200. After the support substrate 300 is bonded to the channel-forming substrate 100 , the substrate bonded body is preferably further heated to sufficiently promote the curing of the adhesive 200 .

[0031] Figure 4A When viewed from the lower surface side of the channel forming substrate 100 of the liquid ejecting substrate 10 Figure 1 A diagram of a channel-forming substrate 100 is shown. Figure 4B Shows Figure 4A This is an enlarged view of part B in Figure 1. Figure 4A and Figure 4B As shown, a plurality of recesses 142 are arranged in a staggered pattern, and this arrangement maintains the rigidity of the substrate. Specifically, in the case where the longitudinal direction of the common channel 132 is the first direction D1, the recesses 142 are continuously arranged in the first direction D1, while every other row is aligned with the recesses 142 in the second direction D2 orthogonal to the first direction D1. In addition, in the present embodiment, the recesses 142 are arranged along the longitudinal direction end 121a of the channel forming substrate 100.

[0032] Figure 5 It shows two Figure 4A A diagram showing a state in which the liquid ejection substrates are bonded to each other, and in Figure 5 The support substrate 300 is omitted in the illustration. Figure 6 yes Figure 5 This is an enlarged view of part C in Figure 1. Figure 5 and Figure 6As shown, the recess 142 is formed in the bonding area 140 where the common channel 132 is not formed. In this case, the distance L1 between the end of each recess 142 closest to the common channel in the array of recesses 142 and the end of the common channel 132 adjacent to the recess 142 is set to be longer than the width 136c of the partition 136. Thus, it is possible to ensure a bonding surface area that allows the channel forming substrate 100 and the support substrate 300 to be stably bonded. Therefore, the bonding surface area of ​​the region of the distance L1 between the recess 142 and the partition 136 can be made larger than the bonding surface area of ​​one partition 136, and a liquid ejection head with high reliability can be obtained.

[0033] Furthermore, in the configuration of the present embodiment, a case is assumed in which the recess 142 is not provided in the channel forming substrate 100. In this case, if the length of the region coated with the adhesive in the same direction as the above-mentioned distance L1 is 150 μm or more, and the thickness of the adhesive 200 is between 0.5 μm and 4.0 μm, the adhesive that will not be accommodated in the recess due to the lack of the recess 142 may protrude toward the common channel 132 and block the common channel 132. Specifically, in the case in which the above-mentioned length of the coated region is 150 μm or more and the thickness of the adhesive 200 is 0.5 μm to 4.0 μm, it is desirable to provide the recess 142 in the bonding region 140 of the channel forming substrate 100.

[0034] Figure 7 It is schematically shown Figure 4B 142 in the joining region of FIG. Figure 7 As shown, the recesses 142a, 142b, 142c and 142d have a square shape, in which the length L of one side is in the range of 10μm to 50μm, and the four corners 143 of each recess 142 may have an arc shape. In addition, the opening rate of the recesses 142a, 142b, 142c and 142d per unit area in the bonding area 140 is 5% to 30%. Specifically, the area of ​​the recesses 142a, 142b, 142c and 142d is 5% to 30% of the unit area of ​​the bonding area 140. As shown in FIG. Figure 7 As shown, the unit area is the area of ​​a quadrilateral shape including four recesses 142a, 142b, 142c and 142d and having two sides with lengths of 2A. The above opening ratio may be determined comprehensively in consideration of the amount of adhesive 200 to be transferred, the opening shape of the channel, the allowable protrusion amount of the adhesive, etc.

[0035] Furthermore, in the present embodiment, the length L of one side of the recesses 142a, 142b, 142c and 142d is 30 μm, and the arc length R of the corner 143 is 6 μm. The distance A1 between the centers of two adjacent recesses 142a and 142b along the longitudinal direction end 121a of the channel forming substrate 100 is 90 μm, and the distance A2 between the centers of two adjacent recesses 142a and 142c along the lateral direction end 121b of the channel forming substrate 100 is 90 μm. Figure 4B ) The offset B between the centers of two adjacent recesses 142a and 142c is 37.5 μm.

[0036] In such Figure 7 In the case where four recesses 142a, 142b, 142c and 142d are set as a group, the group has a square shape, the length 2A of one side of the group is 180 μm, and the group is arranged inside the bonding area 140, as shown in FIG. Figure 4B The opening ratio of the recesses 142a, 142b, 142c and 142d per unit area in this case is 10%. Specifically, the area of ​​the recesses 142a, 142b, 142c and 142d is about 10% of the unit area of ​​the bonding region 140. Other size examples are shown in Table 1 below.

[0037]

[0038] Unit [μm]

[0039] (Table 1)

[0040] Regarding the method of manufacturing the liquid ejection substrate of the liquid ejection head in the present embodiment, an energy generating element 400 for ejecting liquid droplets and made of tantalum silicon nitride (TaSiN), a circuit (not shown) for driving the energy generating element 400, and an electrical connection portion (not shown) electrically connected to an electrical connection substrate are formed in a channel forming substrate 100. In detail, the channel forming substrate 100 may be made of silicon, and is subjected to a thickness reduction process by a grinding device until the thickness of the substrate reaches 625 μm.

[0041] In addition, a channel for allowing liquid to flow and a recess 142 for accommodating an adhesive 200 are formed in the channel forming substrate 100. Specifically, a Bosch process (which is a type of reactive ion etching) or anisotropic etching using TMAH or KOH is performed to form a recess 142 for accommodating an adhesive 200 or a channel for allowing liquid to flow. In the Bosch process, vertical etching grooves can be formed in the channel forming substrate 100 by alternately performing coating and etching. In addition, blind holes can be formed and the thickness of the channel forming substrate 100 can be reduced by back grinding or CMP to make these holes penetrate the channel forming substrate 100.

[0042] In detail, the following case is assumed: the resist is patterned from the second surface 112 of the channel-forming substrate 100 by photolithography, and the channel-forming substrate 100 is processed by dry etching using a Bosch process to process the common channel 132, for example, at a depth of 475 μm. In this case, the recess 142 can be processed to have a depth of 250 to 300 μm. Due to the different micro-load effects depending on the opening area, the recess 142 is shallower than the common channel 132. In addition, although the recess 142 can be formed by performing patterning and etching simultaneously with the common channel 132, in the case where the internal volume of the recess 142 is to be adjusted individually, the recess 142 and the common channel 132 can be subjected to patterning and etching treatment individually.

[0043] Similarly, the individual channels 134 are processed from the first surface 111 of the channel-forming substrate 100 , and the common channel 132 and the individual channels 134 are made to communicate with each other.

[0044] The support substrate 300 is made of silicon, and the thickness of the support substrate 300 is 725 μm. The resist is patterned from the fourth surface 312 opposite to the third surface 311 to be bonded to the channel forming substrate 100 by using the same photolithography technology as the channel forming substrate 100, and the blind hole is processed to have a depth of 320 μm by dry etching using a Bosch process. Then, the thickness of the substrate is reduced to 300 μm from the third surface 311 by back grinding or CMP, so that the blind hole penetrates the support substrate 300, and the pitch conversion channel 320 to be connected to the common channel 132 is formed.

[0045] Next, an adhesive transfer substrate was prepared, and a benzocyclobutene solution was spin-coated to a thickness of 7 μm as an adhesive 200. A PET film was used as a transfer substrate. In addition, after coating, the adhesive 200 was subjected to a baking treatment at 100° C. for five minutes to volatilize the solvent. The adhesive 200 was transferred to the channel-forming substrate 100 by contacting the adhesive formed on the transfer substrate with the second surface 112 of the channel-forming substrate 100 while applying heat to the second surface 112. After being transferred to the channel-forming substrate 100, the thickness of the adhesive 200 was 2.5 μm.

[0046] In addition, the channel forming substrate 100 and the supporting substrate 300 are heated in a vacuum while being aligned with each other using a bonding alignment device to be bonded to each other. For example, the bonding may be performed at a vacuum degree of 100 Pa or less and a temperature of 150° C. After the bonding is checked, the adhesive protrudes into the common channel 132, and the thickness of the adhesive protrusion at the partition 136 forming the common channel 132 is equal to or less than the thickness of the adhesive protrusion in the portion of the common channel 132 where the partition 136 is not formed.

[0047] The channel-forming substrate 100 and the supporting substrate 300 were bonded and cooled, and then taken out of the apparatus and subjected to heat treatment at 250° C. for one hour in an oven under a nitrogen atmosphere to cure the adhesive.

[0048] Next, the dried film is transferred to the first surface 111 of the channel forming substrate 100, and the dried film is formed by spin-coating a substance in which a negative photosensitive resin is dissolved in a PGMEA solvent onto a PET film and drying the spin-coated substance at 100°C with an oven. Then, the PET film is peeled off to form a photosensitive resin layer. A pattern to be a channel is exposed in the photosensitive resin layer, and then PEB is performed to obtain a latent image state. Next, the dried film is similarly stacked, and a pattern to be a nozzle is exposed. Then, the channel and the nozzle are simultaneously developed by performing PEB, and a wafer for a liquid ejection head is completed.

[0049] In a wafer for a liquid jet head, a plurality of modified layers are formed inside a silicon substrate along the thickness direction of a substrate (a channel forming substrate 100 or a supporting substrate 300) by invisible cutting using a laser, and an external force is applied to the wafer so that cracks advance between modified portions. Thus, the wafer is cut to obtain a liquid jet substrate.

[0050] (Example 2)

[0051] Figure 81 is a diagram showing a liquid ejection substrate according to a second embodiment of the present disclosure, and the liquid ejection substrate is shown from the support substrate side, wherein the support substrate is omitted. In the present embodiment, the recess 142 is provided in an area adjacent to the longitudinal direction end of the common channel 132. In detail, in a case where the distance 130a between the end 133 of each common channel 132 in the channel area 130 formed by bonding the channel forming substrate 100 and the support substrate 300 with the adhesive 200 and the lateral direction end 121b of the channel forming substrate 100 is 150 μm or more and the thickness of the adhesive 200 is between 0.5 μm and 4.0 μm, the recess 142 is preferably provided. If the recess 142 is not provided in this dimensional relationship, there is a possibility that the adhesive protrudes into the common channel 132 and the protrusion causes channel clogging, etc.

[0052] In the present embodiment, the recess 142 is provided along the transverse direction end 121b of the channel forming substrate 100 when the distance 130a is 150 μm or more and the thickness of the adhesive 200 is 0.5 μm to 4.0 μm. In addition, in the present embodiment, there are a plurality of channel regions 130, an extension 146 of the bonding region 140 is formed between each two adjacent channel regions 130, and the recess 142 is also provided in the extension 146. The bonding region 140 is desirably spaced apart from the common channel 132 adjacent to the bonding region 140 by a distance L2. For example, in order to ensure a bonding surface area that enables the channel forming substrate 100 and the supporting substrate 300 to be stably bonded, the distance L2 may be made longer than the width 136c of the partition 136 that partitions the common channel 132. This can ensure a state in which the bonding surface area of ​​the adhesive 200 to the region between the recess 142 and the partition 136 is larger than the bonding surface area of ​​the adhesive 200 to one partition 136, and the reliability of the liquid ejection head can be improved.

[0053] In the present embodiment, a distance 130a between an end 133 of the common channel 132 and a lateral end 121b of the channel forming substrate 100 is 150 μm or more, and a distance 137 between two adjacent channel regions 130 is 150 μm or more.

[0054] In the present embodiment, in the case where the channel forming substrate 100 is bonded to the supporting substrate 300 via the adhesive 200, the recess 142 is provided in the channel forming substrate 100 to suppress the adhesive from protruding toward the common channel 132 adjacent to the bonding area 140 of the channel forming substrate 100 while maintaining the protruding amount of the adhesive of the partition 136 that partitions the common channel 132. Thus, leakage between the common channels 132 can be prevented, and a liquid ejection substrate with high reliability can be obtained.

[0055] Fig. 91 is a perspective view showing a liquid ejection head according to an embodiment of the present disclosure. Fig. 9 As shown, the liquid ejection head 3 is formed by joining a plurality of liquid ejection substrates 10 having the above-mentioned configuration. In detail, the liquid ejection head 3 is a line-type liquid ejection head in which 17 liquid ejection substrates 10 capable of ejecting ink are arranged (arranged in a row). The liquid ejection head 3 includes a signal input terminal and a power supply terminal electrically connected to each liquid ejection substrate 10 via a flexible wiring board 40.

[0056] Fig.10 1 is a perspective view schematically showing an inkjet printing apparatus according to an embodiment of a liquid ejecting apparatus. The inkjet printing apparatus 1000 includes a liquid ejecting head 3 that ejects cyan (C), magenta (M), yellow (Y), and black (Bk) ink. The printing apparatus 1000 prints an image on a printing medium P by ejecting ink from the liquid ejecting head 3 to the printing medium P according to print data. Fig.10 In the figure, the X direction is the conveying direction of the printing medium P, the Y direction is the width direction of the printing medium, and the Z direction is the vertical upward direction.

[0057] Note that the liquid ejection device is not limited to the printing device described above. For example, the liquid ejection device may be a single-function printer having only a printing function, or a multi-function printer having multiple functions (e.g., a printing function, a fax function, and a scanner function). In addition, the liquid ejection device may be a manufacturing device for manufacturing a color filter, an electronic device, an optical device, a microstructure, etc. by a predetermined printing method, a device for generating micro bubbles, etc.

[0058] According to the above configuration, it is possible to suppress adhesive from protruding from the bonding area into a portion (eg, partition) where no channel is formed, while allowing adhesive to protrude when substrates are bonded to each other in a liquid ejection head.

[0059] (Other embodiments)

[0060] As is apparent from the above description, any combination of the above-described first and second embodiments is included in the embodiments of the present invention unless the combination is contrary to the spirit of the present invention.

[0061] While the present disclosure has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.The scope of the following claims is to be accorded the broadest interpretation so as to encompass all modifications and equivalent structures and functions.

Claims

1. A liquid ejection head, comprising a liquid ejection substrate configured to eject liquid, wherein The liquid ejection substrate is configured to include a first substrate and a second substrate, a channel for the liquid is formed in the first substrate, and the second substrate is bonded to a first surface of the first substrate via an adhesive, When viewed along a direction perpendicular to the first surface, the first substrate has: a channel region including a plurality of channels for the liquid and partitions separating adjacent channels for the liquid from each other, and a bonding region adjacent to the channel region and comprising a recess opening on the first surface, and The adhesive is accommodated in the recess.

2. A liquid ejection head, comprising a liquid ejection substrate configured to eject liquid, wherein The liquid ejection substrate is configured to include a first substrate and a second substrate, a channel for the liquid is formed in the first substrate, and the second substrate is bonded to the first substrate via an adhesive, The first substrate includes a bonding area which is an area bonded to the second substrate and adjacent to the channel on only one side of the first substrate, and a recess is formed in the bonding area, and The adhesive is accommodated in the recess.

3. The liquid ejecting head according to claim 2, wherein: The first substrate includes a partition configured to form a channel for the liquid.

4. The liquid ejecting head according to claim 1 or 3, wherein: A distance between the recess and the partition adjacent to the recess is greater than a width of the partition.

5. The liquid ejecting head according to claim 1 or 2, wherein: The opening of the recess has a quadrilateral shape.

6. The liquid ejecting head according to claim 1 or 2, wherein: In the bonding region, an opening ratio per unit area of ​​the recess is 5% to 30%.

7. The liquid ejecting head according to claim 1 or 2, wherein: The recessed portion is provided along an end portion in the longitudinal direction of the first substrate.

8. The liquid ejecting head according to claim 1 or 2, wherein: The recessed portion is provided along an end portion in a lateral direction of the first substrate.

9. The liquid ejecting head according to claim 1 or 2, wherein: A plurality of the recesses are provided, the recesses are arranged in the longitudinal direction of the channel and are aligned with every other row in a direction orthogonal to the longitudinal direction of the channel.

10. The liquid ejecting head according to claim 1 or 3, wherein: A distance between an end of the recess in the bonding region and an end of the channel region adjacent to the bonding region is 150 μm or more.

11. The liquid ejecting head according to claim 1, wherein When viewed along a direction perpendicular to the first surface, The plurality of channels and the partitions extend along a first direction, and The junction region is adjacent to the channel region in a second direction orthogonal to the first direction. 12 . The liquid ejection head according to claim 1 , further comprising a nozzle layer bonded to a second surface side of the first substrate which is a surface opposite to the first surface of the first substrate and including nozzles for ejecting the liquid.

13. The liquid ejecting head according to claim 12, wherein: The channel is a common channel for supplying the liquid to the plurality of nozzles.

14. A liquid ejection device, comprising a liquid ejection head, the liquid ejection head comprising a liquid ejection substrate configured to eject liquid, wherein The liquid ejection substrate is configured to include a first substrate and a second substrate, a channel for the liquid is formed in the first substrate, and the second substrate is bonded to a first surface of the first substrate via an adhesive, When viewed along a direction perpendicular to the first surface, the first substrate comprises: a channel region including a plurality of channels for the liquid and partitions separating adjacent channels for the liquid from each other, and a bonding region adjacent to the channel region and comprising a recess opening on the first surface, The adhesive is received in the recess, and The liquid ejection apparatus performs printing by ejecting ink from the liquid ejection head toward a printing medium.

15. A method for manufacturing a liquid ejection head, the liquid ejection head comprising a liquid ejection substrate configured to eject liquid, wherein The liquid ejection substrate is configured to include a first substrate and a second substrate, a channel for the liquid being formed in the first substrate, When viewed along a direction perpendicular to the first surface, the first substrate has: a channel region including a plurality of channels for the liquid and partitions separating adjacent channels for the liquid from each other, and a bonding region adjacent to the channel region and comprising a recess opening on the first surface, The method includes bonding to the first surface of the first substrate via an adhesive, wherein the adhesive is received in the recess.

16. The method according to claim 15, wherein: In the case where the second substrate is bonded to the bonding region of the first substrate, the adhesive has a thickness of 0.5 to 4.0 μm.

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