Heat dissipation device based on optical module

Abstract

The embodiment of the invention provides a heat dissipation device based on an optical module. The heat dissipation device comprises a circuit board and a heat conduction substrate. Wherein the circuit board is provided with an accommodating cavity for accommodating an optical module and a radiator; a first opening is formed in one end of the accommodating cavity, and the optical module enters the accommodating cavity through the first opening; a second opening is formed in the top end of the accommodating cavity; at least two first through holes are formed in the periphery of the heat conducting substrate; a screw rod penetrates through the first through hole; the screw rod penetrates through the first through hole and is fixedly connected with the circuit board; the bottom end of the heat conduction substrate is provided with a heat conduction boss and a first heat pipe groove used for containing a heat pipe. The heat conduction boss passes through the second opening to be in contact with the optical module; the heat pipe is connected with the radiator. The radiator is prevented from being placed above the heat conduction substrate, the height of the heat dissipation device is further prevented from being increased by times, the height size of the heat conduction substrate is effectively reduced, and flattening of the heat dissipation device is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of optical devices, and in particular to a heat dissipation device based on an optical module. Background Art

[0002] As the design of optical module boards becomes increasingly miniaturized and flat, the space occupancy rate of boards has received more attention. The largest device on an optical module board is the optical module. Taking the heat dissipation of optical module components as an example, how to design the optical module components to achieve a good heat dissipation effect while meeting the requirements of flattening and miniaturization of the board has become a hot issue in the field of optical communication technology. However, there is currently no effective solution to this problem. Summary of the invention

[0003] In view of this, an embodiment of the present application provides a heat dissipation device based on an optical module, which aims to effectively reduce the height dimension of the thermal conductive substrate and realize the flattening of the heat dissipation device.

[0004] The technical solution of the embodiment of the present application is implemented as follows:

[0005] The embodiment of the present application provides a heat dissipation device based on an optical module, the heat dissipation device comprising a circuit board and a heat conductive substrate; wherein,

[0006] The circuit board is provided with a receiving cavity and a heat sink for receiving the optical module; a first opening is provided at one end of the receiving cavity, and the optical module enters the receiving cavity through the first opening; a second opening is provided at the top of the receiving cavity;

[0007] At least two first through holes are arranged around the thermally conductive substrate; the first through holes are used to pass through the screws; the screws are fixedly connected to the circuit board through the first through holes; a thermally conductive boss and a first heat pipe groove for placing a heat pipe are arranged at the bottom end of the thermally conductive substrate; the thermally conductive boss contacts the optical module through the second opening; and the heat pipe is connected to the radiator.

[0008] In the above scheme, at least two fixing blocks are arranged on the top of the circuit board, each of which is provided with a threaded hole; the screw includes a tail portion, the tail portion is provided with threads, and the threads of the screw are fixedly connected to the threaded holes of the fixing blocks.

[0009] In the above solution, the heat pipe includes a first end and a second end, the first end is placed in the first heat pipe groove; and the second end is connected to the radiator.

[0010] In the above solution, the first through hole is used for fixed connection with the rivet column, and the bottom end of the rivet column is provided with a second through hole, and the second through hole is used for passing the screw rod.

[0011] In the above scheme, the thermal conductive substrate includes at least a first part and a second part; the first part includes a first screw hole, and the second part includes a second screw hole; the screw includes a first screw and a second screw; the first screw passes through the first screw hole in at least two first through holes; the second screw passes through the second screw hole in at least two first through holes.

[0012] In the above scheme, an elastic member is provided in the rivet column; an open retaining ring is provided at the bottom end of the rivet column; the screw rod includes a head and a middle part, and the middle part includes a positioning groove; the open retaining ring is engaged with the positioning groove; one end of the elastic member contacts the second through hole, the middle part passes through the elastic member, and the other end of the elastic member contacts the bottom end of the head.

[0013] In the above solution, a second heat pipe groove is arranged at the bottom end of the heat conductive substrate, a heat conductive slow-motion block is arranged in the second heat conductive slow-motion block, and the heat conductive boss is arranged at the bottom end of the heat conductive slow-motion block.

[0014] In the above scheme, the inner diameter of the second heat pipe groove is larger than the inner diameter of the first heat pipe groove; the first side wing and the second side wing are respectively provided at two ends of the thermally conductive slow-motion block adjacent to the bottom end of the thermally conductive slow-motion block; the first side wing and the second side wing are respectively in contact with the top end of the second heat pipe groove.

[0015] In the above solution, the first heat pipe groove is arranged between the heat conducting boss and the first side wing or the second side wing.

[0016] In the above solution, the first heat pipe groove is arranged between the heat conductive boss and the first part or the second part.

[0017] The embodiment of the present application provides a heat dissipation device based on an optical module, the heat dissipation device includes a circuit board and a heat-conducting substrate; wherein, a receiving cavity and a heat sink for receiving the optical module are installed on the circuit board; a first opening is provided at one end of the receiving cavity, and the optical module enters the receiving cavity through the first opening; a second opening is provided at the top of the receiving cavity; at least two first through holes are provided around the thermally conductive substrate; the first through hole is used to pass a screw; the screw passes through the first through hole and is fixedly connected to the circuit board; a heat-conducting boss and a first heat pipe groove for placing a heat pipe are provided at the bottom end of the thermally conductive substrate; the heat-conducting boss contacts the optical module through the second opening; the heat pipe is connected to the heat sink. The technical solution of the embodiment of the present application is adopted, by providing a first heat pipe groove in the heat dissipation device, placing the heat pipe in the first heat pipe groove, and connecting the heat pipe to the heat sink, so as to avoid placing the heat sink above the thermally conductive substrate, further avoiding the height of the heat dissipation device from increasing exponentially, effectively reducing the height dimension of the thermally conductive substrate, and realizing the flattening of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the composition structure of a heat dissipation device based on an optical module according to an embodiment of the present application;

[0019] Figure 2 This is a schematic diagram of the composition structure of another heat dissipation device based on an optical module according to an embodiment of the present application;

[0020] Figure 3 This is a schematic diagram of the screw structure of the heat dissipation device based on the optical module according to an embodiment of the present application;

[0021] Figure 4 This is a schematic diagram of the composition structure of another heat dissipation device based on an optical module according to an embodiment of the present application;

[0022] Figure 5 This is a schematic diagram of the composition structure of another heat dissipation device based on an optical module according to an embodiment of the present application;

[0023] Figure 6 The present invention also provides a schematic diagram of the composition structure of a heat dissipation device based on an optical module in an embodiment of the present application. DETAILED DESCRIPTION

[0024] To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the specific technical solution of the invention will be further described in detail below in conjunction with the drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0025] In the related art, the commonly used optical module heat dissipation device is as follows: a panel is provided in the optical module board, a circuit board and an optical module cage are installed on the panel, a heat sink is fixed to the cage by a retaining spring, and the optical module enters the cage through an opening on the panel. In order to dissipate the heat of the optical module, the heat dissipation fins on the heat sink will extend upward away from the optical module. This heat dissipation structure will cause the height of the entire optical module board to increase exponentially, which is not conducive to the goal of miniaturization and flattening of the board. At the same time, the related art uses an elastic retaining spring structure to fix the heat sink to the main heat dissipation surface of the optical module. The pressure of the contact interface is relatively small, which will produce uneven force, thereby increasing the thermal contact resistance of the heat conduction, which is not conducive to the heat dissipation of the optical module.

[0026] The present application embodiment provides a heat dissipation device based on an optical module. Figure 1-Figure 6To illustrate by way of example, the heat dissipation device includes a circuit board 300 and a heat-conducting substrate 120; wherein, a receiving cavity 110 for receiving an optical module and a heat sink 200 are installed on the circuit board 300; a first opening is provided on one side of the receiving cavity 110, and the optical module 100 enters the receiving cavity 110 through the first opening; a second opening 111 is provided at the top of the receiving cavity 110; at least two first through holes 123 are provided around the heat-conducting substrate 120; the first through hole 123 is used to pass a screw 130; the screw 130 is fixedly connected to the circuit board 300 through the first through hole 123; a heat-conducting boss 121 and a first heat pipe groove 122 for placing a heat pipe 140 are provided at the bottom end of the heat-conducting substrate 120; the heat-conducting boss 121 contacts the optical module 100 through the second opening 111; and the heat pipe 140 is connected to the heat sink 200.

[0027] Exemplarily, the heat-conducting substrate 120 can be determined according to actual conditions, and is not limited here. As an example, it can be a substrate for transferring heat of the optical module 100. The material of the heat-conducting substrate 120 can be determined according to actual conditions, and is not limited here. The accommodating cavity 110 can be determined according to actual conditions, and is not limited here. As an example, it can be a mouse cage.

[0028] For example, the first through hole 123 can be determined according to actual conditions and is not limited here. As an example, it can be a through hole set to a single diameter; as another example, it can also be a stepped hole with a first diameter set at the upper part and a second diameter set at the lower part, and the first diameter is greater than the second diameter; wherein the length of the upper part of the first diameter can also be less than or equal to the length of the lower part of the second diameter, and the length of the upper part of the first diameter can be greater than the length of the lower part of the second diameter.

[0029] Exemplarily, the heat-conducting boss 121 may be in contact with the main heat-dissipating surface 101 of the optical module 100 . The heat pipe 140 may be connected to the heat-dissipating substrate 201 of the heat sink 200 .

[0030] In some embodiments, the thermally conductive substrate 120 can be a beam structure with an elasticity. By designing an elastic beam structure, the thermally conductive substrate 120 can be directly fixed above the optical module 100 and the accommodating cavity 110 by means of a screw 130, thereby reducing the number of parts and the complexity of the heat dissipation system. In addition, by tightening the screw 130, the pressure between the thermally conductive boss 121 provided on the thermally conductive substrate 120 and the main heat dissipation surface 101 of the optical module 100 can be increased, thereby reducing the contact thermal resistance of the contact interface between the thermally conductive boss 121 and the main heat dissipation surface 101, which is beneficial to efficiently extracting the heat from the optical module 100.

[0031] In an application example, at least two fixing blocks 160 are disposed at the top of the circuit board 300, each fixing block 160 is provided with a threaded hole; the screw rod 130 includes a tail portion 134, the tail portion 134 is provided with a thread, and the thread of the tail portion 134 is fixedly connected to the threaded hole of the fixing block 160, so as to realize the fixed connection between the screw rod 130 and the circuit board 300.

[0032] In an application example, the heat pipe 140 includes a first end 141 and a second end 142 , wherein the first end 141 is placed in the first heat pipe slot 122 ; and the second end 142 is connected to the heat sink 200 .

[0033] For example, the first end 141 can be determined according to actual conditions, and is not limited here. As an example, it can be an evaporation end, and the first end 141 can be fixed in the first heat pipe groove 122 by welding or the like. The second end 142 can be determined according to actual conditions, and is not limited here. As an example, it can be a condensation end, and the second end 142 can be connected to the heat dissipation substrate 201 of the radiator 200.

[0034] In some embodiments, an upper surface of the first end 141 is flush with an upper surface of the thermally conductive substrate 120 .

[0035] In an application example, the first through hole 123 is used to be fixedly connected to the rivet column 150 , and a second through hole is provided at the bottom end of the rivet column 150 , and the second through hole is used to pass the screw rod 130 .

[0036] For example, the rivet column 150 can be determined according to actual conditions and is not limited here. As an example, it can be a pressure riveted nut column, also known as a pressure riveted stud or a nut column, and the top of the pressure riveted nut column is hexagonal and the bottom is cylindrical. The rivet column 150 is fixed to the first through hole 123 of the thermal conductive substrate 120 by riveting. Specifically, the bottom end of the top of the rivet column 150 contacts the top of the lower part of the first through hole 123.

[0037] For example, the second through hole can be determined according to actual conditions and is not limited here. As an example, it can be a stepped hole with the upper portion set to the third diameter and the lower portion set to the fourth diameter, and the third diameter is greater than the fourth diameter; wherein the length of the upper portion of the third diameter can also be less than or equal to the length of the lower portion of the fourth diameter, and the length of the upper portion of the third diameter can be greater than the length of the lower portion of the fourth diameter. The screw 130 passes through the upper and lower portions of the second through hole.

[0038] In an application example, the thermal conductive substrate 120 includes at least a first part 125 and a second part 126; the first part 125 includes a first screw hole, and the second part 126 includes a second screw hole; the screw 130 includes a first screw and a second screw; the first screw passes through the first screw hole in at least two first through holes; the second screw passes through the second screw hole in at least two first through holes.

[0039] In an application example, an elastic member 170 is disposed inside the rivet column 150; an open retaining ring 180 is disposed at the bottom end of the rivet column 150; the screw 130 includes a head 131 and a middle portion 132, and the middle portion 132 includes a locking groove 133; the open retaining ring 180 is engaged with the locking groove 133; one end of the elastic member 170 contacts the second through hole, the middle portion 132 passes through the elastic member 170, and the other end of the elastic member 170 contacts the bottom end of the head 131.

[0040] Exemplarily, the elastic member 170 can be determined according to actual conditions and is not limited here. As an example, it can be a spring. One end of the elastic member 170 contacts the top of the lower part of the second through hole, and the open retaining ring 180 contacts the bottom end of the bottom of the rivet column 150. Through the combination of the spring 170, the screw 130 and the open retaining ring 180, the floating design of the heat-conducting substrate 120 is realized, and by tightening the screw 130, the pressure of the heat-conducting boss 121 on the main heat dissipation surface 101 of the optical module 100 can be increased, and the contact thermal resistance of the contact interface between the heat-conducting boss 121 and the main heat dissipation surface 101 can be reduced, which is conducive to efficiently exporting the heat of the optical module 100.

[0041] In some embodiments, the head 131 contacts the inner wall of the top of the rivet post 150 . In other embodiments, the bottom end of the head 131 contacts the top end of the top of the rivet post 150 , and the head 131 contacts the inner wall of the top of the first through hole 123 .

[0042] In an application example, a second heat pipe groove 124 is disposed at the bottom end of the heat conductive substrate 120 , a heat conductive slow motion block 190 is disposed in the second heat conductive slow motion block 190 , and a heat conductive boss 121 is disposed at the bottom end of the heat conductive slow motion block 190 .

[0043] For example, the fixing method of the first end 141 can be determined according to actual conditions and is not limited here. As an example, the first end 141 can be fixed in the first heat pipe groove 122 by welding or the like, and the first end 141 can be fixed on the thermally conductive slow-motion block 190 by welding or the like.

[0044] In an application example, the inner diameter of the second heat pipe groove 124 is larger than the inner diameter of the first heat pipe groove 122; the first side wing 191 and the second side wing 192 are respectively provided at the two ends of the thermally conductive slow-release block 190 adjacent to the bottom end of the thermally conductive slow-release block 190; the first side wing 191 and the second side wing 192 are respectively in contact with the top end of the second heat pipe groove 124.

[0045] In an application example, the first heat pipe groove 122 is disposed between the heat conducting boss 121 and the first side wing 191 or the second side wing 192 .

[0046] In an application example, the first heat pipe groove 122 is disposed between the heat conductive boss 121 and the first portion 125 or the second portion 126 .

[0047] The embodiment of the present application can apply the force generated by the spring and the screw to the contact interface between the optical module and the thermally conductive boss through the coupling of the thermally conductive substrate and the slow-motion block, thereby increasing the contact pressure and reducing the contact thermal resistance; it can also reduce the height dimension of the thermally conductive substrate and realize the flattening of the board through the design and arrangement of the heat pipe; it can also reduce the number of parts and the complexity of the board system while achieving the heat dissipation effect of the heat dissipation system through the integrated elastic beam structure design.

[0048] In order to understand the embodiments of the present invention, an optical module single board heat dissipation device is taken as an example for description below, wherein the optical module single board is also called an optical module card.

[0049] Application Example 1: Figure 1 , Figure 2 and Figure 3 As shown, the optical module card is provided with a cage 110 and a circuit board 300 , the circuit board 300 is fixed on the card panel, the cage 110 is mounted on the circuit board 300 , and the optical module 100 is inserted into the cage 110 along the inside of the cage 110 .

[0050] The heat-conductive substrate 120 is provided with a first heat pipe groove 122, and the heat pipe 140 is provided with an evaporation end 141 and a condensation end 142. The evaporation end 141 of the heat pipe 140 is fixed in the first heat pipe groove 122 by welding or the like, and the condensation end 142 of the heat pipe 140 is fixed to the heat dissipation substrate 201 of the radiator 200 fixed on the circuit board 300.

[0051] The thermal conductive substrate 120 is provided with first through holes 123 around its interior, which may be stepped holes with a first diameter at the top and a second diameter at the bottom, and the first diameter being larger than the second diameter; the bottom end of the top of the rivet column 150 is riveted and fixed to the top end of the lower part of the first through hole 123 by riveting.

[0052] A spring 170 is provided inside the rivet post 150 , and a second through hole is designed in the rivet post 150 . The tail 134 of the screw rod 130 is provided with threads, and the threads of the tail 134 pass through the second through hole of the rivet post 150 and are connected and fixed to the threaded hole inside the fixing block 160 on the circuit board 300 .

[0053] One end of the spring 170 contacts the top of the lower part of the second through hole of the rivet column 150, and contacts the inner side of the upper part of the second through hole of the rivet column 150; the other end of the spring 170 contacts the bottom of the head 131 of the screw 130, and the middle part 132 of the screw 130 passes through the spring 170, and the middle part 132 of the screw 130 is provided with a locking groove 133; the open retaining ring 180 is locked in the locking groove 133 and contacts the bottom end of the bottom of the rivet column 150.

[0054] The heat-conducting substrate 120 is provided with a heat-conducting boss 121, which passes through the second opening 111 at the upper end of the cage 110 and contacts the main heat dissipation surface 101 of the optical module 100. The upper surface of the heat-conducting substrate 120 is flush with the upper surface of the heat pipe 140.

[0055] When the optical module 100 is not inserted into the cage 110 , the spring 170 is compressed by tightening the screw 130 , and the spring 170 applies pressure to the rivet 150 and transmits the pressure to the thermal conductive substrate 120 , so that the thermal conductive substrate 120 is pressed above the cage 110 .

[0056] When the optical module 100 is inserted into the cage 110 , the main heat dissipation surface 101 of the optical module 100 lifts the thermal conductive boss 121 on the thermal conductive substrate 120 , and the compressed spring 170 is partially relaxed but still in a compressed state, so that the thermal conductive boss 121 is tightly pressed against the main heat dissipation surface 101 of the optical module 100 .

[0057] The floating design of the heat-conducting substrate 120 is realized by the combination of the spring 170, the screw 130 and the open retaining ring 180, and the pressure of the heat-conducting boss 121 on the main heat dissipation surface 101 of the optical module 100 can be increased by tightening the screw 130, and the contact thermal resistance of the contact interface between the heat-conducting boss 121 and the main heat dissipation surface 101 of the optical module 100 can be reduced, which is beneficial to the heat dissipation of the optical module 100.

[0058] The heat pipe 140 adopts a rectangular cross-sectional structure, which reduces the height of the thermal conductive substrate 120 that fixes the heat pipe. In addition, through the design of the heat pipe 140, the heat can be directly conducted to the heat sink 200 on the rear side of the single board, without the need to add heat dissipation fins above the thermal conductive substrate 120 to achieve heat dissipation, which is beneficial to the miniaturization and flattening of the optical module board.

[0059] Application Example 2: Figure 4As shown, the optical module card is provided with a cage 110 and a circuit board 300 , the circuit board 300 is fixed on the card panel, the cage 110 is mounted on the circuit board 300 , and the optical module 100 is inserted into the cage 110 along the inside of the cage 110 .

[0060] The heat-conducting substrate 120 is provided with a first heat pipe groove 122, the heat pipe 140 is provided with an evaporation end 141 and a condensation end 142, the bottom end of the heat-conducting substrate 120 is provided with a second heat pipe groove 124, a heat-conducting slow-motion block 190 is provided in the second heat pipe groove 124, and a heat-conducting boss 121 is provided at the bottom end of the heat-conducting slow-motion block 190. The evaporation end 141 of the heat pipe 140 is placed in the first heat pipe groove 122 of the heat-conducting substrate 120, and the evaporation end 141 of the heat pipe 140 is fixed to the heat-conducting slow-motion block 190 by welding or the like. The condensation end 142 of the heat pipe 140 is fixed to the heat-dissipating substrate 201 of the heat sink 200 fixed on the circuit board 300.

[0061] The thermal conductive substrate 120 is provided with first through holes 123 around its interior, which may be stepped holes with a first diameter at the top and a second diameter at the bottom, and the first diameter being larger than the second diameter; the bottom end of the top of the rivet column 150 is riveted and fixed to the top end of the lower part of the first through hole 123 by riveting.

[0062] A spring 170 is provided inside the rivet post 150, a second through hole is designed in the rivet post 150, a thread is provided at the tail 134 of the screw 130, the thread of the tail 134 passes through the second through hole of the rivet post 150, and is connected and fixed with the threaded hole inside the fixing block 160 on the circuit board 300. The bottom end of the head 131 contacts the top of the top of the rivet post 150, and the head 131 contacts the inner wall of the top of the first through hole 123.

[0063] One end of the spring 170 contacts the top of the lower part of the second through hole of the rivet column 150, and contacts the inner side of the upper part of the second through hole of the rivet column 150; the other end of the spring 170 contacts the bottom of the head 131 of the screw 130, and the middle part 132 of the screw 130 passes through the spring 170, and the middle part 132 of the screw 130 is provided with a locking groove 133; the open retaining ring 180 is locked in the locking groove 133 and contacts the bottom end of the bottom of the rivet column 150.

[0064] The thermally conductive slow-motion block 190 is provided with a first side wing 191 and a second side wing 192, and the first side wing 191 and the second side wing 192 are respectively in contact with the top of the second heat pipe groove 124. The thermally conductive boss 121 on the thermally conductive slow-motion block 190 passes through the second opening 111 at the upper end of the cage 110 and contacts the main heat dissipation surface 101 of the optical module 100. The upper surface of the thermally conductive substrate 120 is flush with the upper surface of the heat pipe 140.

[0065] When the optical module 100 is not inserted into the squirrel cage 110, the spring 170 is compressed by tightening the screw 130 on one side, and the spring 170 applies pressure to the rivet column 150 and transmits it to the thermal conductive substrate 120. At the same time, the screw 130 on one side applies pressure F1 to the thermal conductive substrate 120. The thermal conductive substrate 120 acts as a beam structure and applies pressure F1 to the thermal conductive slow block 190. By tightening the screw 130 on the other side of the thermal conductive substrate 120, the spring 170 is compressed, and a pressure F2 is applied to the thermal conductive substrate 120, and is transmitted to the thermal conductive slow block 190 through the thermal conductive substrate 120, so that the force applied to the thermal conductive slow block 190 is F (i.e., the sum of F1 and F2), so that the thermal conductive substrate 120 is pressed above the squirrel cage 110.

[0066] When the optical module 100 is inserted into the cage 110, the main heat dissipation surface 101 of the optical module 100 lifts the heat-conducting boss 121 on the heat-conducting slow block 190, and the compressed spring 170 is partially relaxed, but still in a compressed state, so that the heat-conducting boss 121 is tightly pressed against the main heat dissipation surface 101 of the optical module 100. By adjusting the screws 130 on both sides, the forces F1 and F2 are balanced, so that the pressure at the contact interface between the heat-conducting boss 121 on the heat-conducting slow block 190 and the main heat dissipation surface 101 of the optical module 100 can be enhanced, and the contact thermal resistance of the contact interface between the heat-conducting boss 121 and the main heat dissipation surface 101 of the optical module 100 can be reduced, which is beneficial to the heat dissipation of the optical module 100.

[0067] The thermally conductive slow-motion block 190 can be made of a high thermally conductive material and can be fixed to the evaporation end 141 of the heat pipe 140 by welding, or can be integrally formed with the evaporation end 141 of the heat pipe 140. The first side wing 191 and the second side wing 192 of the thermally conductive slow-motion block 190 can extend downward to contact the cage 110 to achieve auxiliary support.

[0068] Application Example 3: Figure 5 As shown, the optical module card is provided with a cage 110 and a circuit board 300 , the circuit board 300 is fixed on the card panel, the cage 110 is mounted on the circuit board 300 , and the optical module 100 is inserted into the cage 110 along the inside of the cage 110 .

[0069] The thermal conductive substrate 120 is provided with first through holes 123 around its interior, which may be stepped holes with a first diameter at the top and a second diameter at the bottom, and the first diameter being larger than the second diameter; the bottom end of the top of the rivet column 150 is riveted and fixed to the top end of the lower part of the first through hole 123 by riveting.

[0070] A spring 170 is provided inside the rivet post 150, a second through hole is designed in the rivet post 150, a thread is provided at the tail 134 of the screw 130, the thread of the tail 134 passes through the second through hole of the rivet post 150, and is connected and fixed with the threaded hole inside the fixing block 160 on the circuit board 300. The bottom end of the head 131 contacts the top of the top of the rivet post 150, and the head 131 contacts the inner wall of the top of the first through hole 123.

[0071] One end of the spring 170 contacts the top of the lower part of the second through hole of the rivet column 150, and contacts the inner side of the upper part of the second through hole of the rivet column 150; the other end of the spring 170 contacts the bottom of the head 131 of the screw 130, and the middle part 132 of the screw 130 passes through the spring 170, and the middle part 132 of the screw 130 is provided with a locking groove 133; the open retaining ring 180 is locked in the locking groove 133 and contacts the bottom end of the bottom of the rivet column 150.

[0072] The thermally conductive slow-motion block 190 is provided with a first side wing 191 and a second side wing 192, and the first side wing 191 and the second side wing 192 are respectively in contact with the top of the second heat pipe groove 124. The thermally conductive boss 121 on the thermally conductive slow-motion block 190 passes through the second opening 111 at the upper end of the cage 110 and contacts the main heat dissipation surface 101 of the optical module 100. The upper end of the thermally conductive slow-motion block 190 is flush with the upper end of the thermally conductive substrate 120.

[0073] The heat pipe 140 is provided with an evaporation end 141 and a condensation end 142. The condensation end 142 of the heat pipe 140 is fixed to the heat dissipation substrate 201 of the heat sink 200 fixed to the circuit board 300. A first heat pipe groove 122 is provided between the second side wing 192 of the thermally conductive slow-motion block 190 and the thermally conductive boss 121. The evaporation end 141 of the heat pipe 140 is placed in the first heat pipe groove 122 of the thermally conductive slow-motion block 190, and the evaporation end 141 of the heat pipe 140 is fixed to the thermally conductive slow-motion block 190 by welding or the like.

[0074] The evaporation end 141 of the heat pipe 140 is arranged on one side of the thermal boss 121 in the thermally conductive slow-motion block 190. The heat pipe 140 is placed in the space between the thermally conductive slow-motion block 190 and the squirrel cage 110, which is beneficial to thinning the upper end height of the thermally conductive slow-motion block 190 and also beneficial to reducing the upper end height of the thermally conductive substrate 120, thereby realizing the miniaturization and flattening of the optical module board.

[0075] When the optical module 100 is not inserted into the squirrel cage 110, the spring 170 is compressed by tightening the screw 130 on one side, and the spring 170 applies pressure to the rivet column 150 and transmits it to the thermal conductive substrate 120. At the same time, the screw 130 on one side applies pressure F1 to the thermal conductive substrate 120. The thermal conductive substrate 120 acts as a beam structure and applies pressure F1 to the thermal conductive slow block 190. By tightening the screw 130 on the other side of the thermal conductive substrate 120, the spring 170 is compressed, and a pressure F2 is applied to the thermal conductive substrate 120, and is transmitted to the thermal conductive slow block 190 through the thermal conductive substrate 120, so that the force applied to the thermal conductive slow block 190 is F (i.e., the sum of F1 and F2), so that the thermal conductive substrate 120 is pressed above the squirrel cage 110.

[0076] When the optical module 100 is inserted into the cage 110, the main heat dissipation surface 101 of the optical module 100 lifts the heat-conducting boss 121 on the heat-conducting slow block 190, and the compressed spring 170 is partially relaxed, but still in a compressed state, so that the heat-conducting boss 121 is tightly pressed against the main heat dissipation surface 101 of the optical module 100. By adjusting the screws 130 on both sides, the forces F1 and F2 are balanced, so that the pressure at the contact interface between the heat-conducting boss 121 on the heat-conducting slow block 190 and the main heat dissipation surface 101 of the optical module 100 can be enhanced, and the contact thermal resistance of the contact interface between the heat-conducting boss 121 and the main heat dissipation surface 101 of the optical module 100 can be reduced, which is beneficial to the heat dissipation of the optical module 100.

[0077] As a part of the heat conduction system, the heat conduction block 190 conducts the heat of the optical module 100 to the heat pipe 140 on the side of the heat conduction boss 121, and takes away the heat through the heat pipe 140. By increasing the cross-sectional width of the heat pipe 140 and utilizing the lateral displacement of the heat pipe 140, the reduction in thermal efficiency caused by the interface between the heat conduction block 190 and the heat pipe 140 can be alleviated to a certain extent.

[0078] Application Example 4: Figure 6 As shown, the optical module card is provided with a cage 110 and a circuit board 300 , the circuit board 300 is fixed on the card panel, the cage 110 is mounted on the circuit board 300 , and the optical module 100 is inserted into the cage 110 along the inside of the cage 110 .

[0079] The heat conductive substrate 120 is surrounded by first through holes 123 , which may be through holes with a single diameter. The thread of the tail 134 of the screw rod 130 passes through the first through hole 123 and is connected and fixed to the threaded hole inside the fixing block 160 on the circuit board 300 .

[0080] The heat-conducting substrate 120 is an integrated elastic beam structure. The first part 125 and the second part 126 of the heat-conducting substrate 120 are respectively fixed to the screw 130 through the first through hole 123. The heat-conducting substrate 120 is provided with a heat-conducting boss 121. The heat-conducting boss 121 passes through the second opening 111 at the upper end of the squirrel cage 110 and contacts the main heat dissipation surface 101 of the optical module 100. A first heat pipe groove 122 is provided on the lower side of the heat-conducting boss 121 and the second part 126 of the heat-conducting substrate. The heat pipe 140 is provided with an evaporation end 141 and a condensation end 142. The evaporation end 141 of the heat pipe 140 is fixed in the first heat pipe groove 122 by welding or the like, and the condensation end 142 of the heat pipe 140 is fixed to the heat dissipation substrate 201 of the heat sink 200 fixed on the circuit board 300.

[0081] By designing the heat-conducting substrate 120 as an elastic beam structure, and directly fixing the elastic beam above the optical module 100 and the squirrel cage 110 through the screw 130, the number of parts and the complexity of the heat dissipation system are reduced, and the heat pipe 140 can move laterally on one side or the other side of the heat-conducting boss 121. In this way, the thermal resistance of the lateral heat transfer from the heat-conducting boss 121 to the heat pipe 140 through the heat-conducting substrate 120 can be minimized. By arranging the heat pipe in the lower end space of the heat-conducting boss 121 and the second part 126 of the heat-conducting substrate 120, the upper end height of the heat-conducting substrate 120 can be reduced, which is conducive to the miniaturization and flattening of the optical module board.

[0082] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention.

Claims

1. A heat dissipation device based on an optical module, characterized in that: The heat dissipation device comprises a circuit board and a heat-conducting substrate; wherein, The circuit board is provided with a receiving cavity and a heat sink for receiving the optical module; a first opening is provided at one end of the receiving cavity, and the optical module enters the receiving cavity through the first opening; a second opening is provided at the top of the receiving cavity; At least two first through holes are arranged around the thermally conductive substrate; the first through holes are used to pass through the screws; the screws are fixedly connected to the circuit board through the first through holes; a thermally conductive boss and a first heat pipe groove for placing a heat pipe are arranged at the bottom end of the thermally conductive substrate; the thermally conductive boss contacts the optical module through the second opening; and the heat pipe is connected to the radiator.

2. The device according to claim 1, characterized in that At least two fixing blocks are arranged at the top of the circuit board, and each of the fixing blocks is provided with a threaded hole; the screw rod comprises a tail portion, and the tail portion is provided with threads, and the threads of the screw rod are fixedly connected with the threaded holes of the fixing blocks.

3. The device according to claim 1, characterized in that The heat pipe comprises a first end and a second end, wherein the first end is placed in the first heat pipe groove; and the second end is connected to the radiator.

4. The device according to claim 1, characterized in that The first through hole is used for fixed connection with the rivet column, and the bottom end of the rivet column is provided with a second through hole, and the second through hole is used for passing the screw rod.

5. The device according to claim 1, characterized in that The thermally conductive substrate includes at least a first part and a second part; the first part includes a first screw hole, and the second part includes a second screw hole; the screw includes a first screw and a second screw; the first screw passes through the first screw hole in at least two first through holes; the second screw passes through the second screw hole in at least two first through holes.

6. The device according to claim 4, characterized in that An elastic member is arranged inside the rivet column; an open retaining ring is arranged at the bottom end of the rivet column; the screw rod comprises a head and a middle portion, the middle portion comprises a positioning groove; the open retaining ring is engaged with the positioning groove; one end of the elastic member contacts the second through hole, the middle portion passes through the elastic member, and the other end of the elastic member contacts the bottom end of the head.

7. The device according to claim 1, characterized in that A second heat pipe groove is arranged at the bottom end of the heat conductive substrate, a heat conductive slow-motion block is arranged in the second heat pipe groove, and the heat conductive boss is arranged at the bottom end of the heat conductive slow-motion block.

8. The device according to claim 7, characterized in that The inner diameter of the second heat pipe groove is larger than the inner diameter of the first heat pipe groove; the first side wing and the second side wing are respectively provided at two ends of the thermally conductive slow-motion block adjacent to the bottom end of the thermally conductive slow-motion block; the first side wing and the second side wing are respectively in contact with the top end of the second heat pipe groove.

9. The device according to claim 8, characterized in that The first heat pipe groove is arranged between the heat conducting boss and the first side wing or the second side wing.

10. The device according to claim 5, characterized in that The first heat pipe groove is arranged between the heat conducting boss and the first part or the second part.

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