A temperature control system and a temperature control method

By introducing a heat accumulator and a subcooled liquid receiver into the temperature control equipment, combined with valve control, rapid heating and cooling can be achieved, solving the problem of long waiting time for heating and cooling equipment, improving production efficiency and reducing energy consumption.

CN119512268BActive Publication Date: 2025-11-07BEIJING JINGYI AUTOMATION EQUIP CO LTD
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Patent Information

Application Number
CN202411665486.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-11-20
Publication Date
2025-11-07
Estimated Expiration
2044-11-20

AI Technical Summary

Technical Problem

Existing temperature control equipment has a long waiting time during the heating and cooling process, which affects production efficiency.

Method used

A temperature control system including a refrigeration unit and a circulation unit is adopted. The heat storage unit stores the heat energy for heating, and the subcooling receiver performs subcooling treatment and storage. Combined with valves to control the flow of refrigerant and circulating liquid, rapid heating and cooling can be achieved.

Benefits of technology

Without increasing the power of the compressor, condenser, and evaporator, the waiting time for heating and cooling can be reduced, production efficiency can be improved, energy consumption can be reduced, equipment production costs can be lowered, and equipment miniaturization can be facilitated.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a temperature control system and a temperature control method. The system comprises a refrigeration device and a circulating device. The refrigeration device comprises a compressor, a heat accumulator, a condenser, an evaporator and a supercooling liquid accumulator. The heat accumulator stores heat energy. In the temperature rising process, the heat accumulator can be used for temperature rising, so that the temperature rising speed is improved. The supercooling liquid accumulator is used for supercooling treatment and storage of refrigerant. In the temperature falling process, the supercooling liquid accumulator can be used for temperature falling, so that the temperature falling speed is improved. In this way, the temperature rising and falling waiting time can be reduced without increasing the power of the compressor, the condenser and the evaporator, the production efficiency is improved, energy consumption is reduced, the production cost of equipment is reduced, and the miniaturization of equipment is facilitated.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of control, in particular to a temperature control system and a temperature control method. BACKGROUND

[0002] As an important equipment in the process of semiconductor integrated circuit manufacturing, the semiconductor temperature control device is required to provide the required temperature output for controlling the temperature of the etching equipment process cavity in the etching process of integrated circuit manufacturing. The semiconductor temperature control device accurately controls the temperature through the refrigeration and heating links in actual use. The etching equipment process cavity needs different temperatures in the whole process to meet the production process, and the temperature is generally switched periodically within-20℃ to 90℃. Therefore, the semiconductor temperature control device needs to switch different temperatures according to the process requirements, and the corresponding process production can be carried out only when the process cavity temperature reaches the target value. In the temperature rising and falling process, there will be a waiting time. The waiting time is relatively long when using the traditional temperature control device to switch from high temperature to low temperature or from low temperature to high temperature, which affects the production efficiency. SUMMARY

[0003] Therefore, the purpose of the present application is to provide a temperature control system and a temperature control method to solve the problem of long waiting time in temperature rising and falling of the existing temperature control equipment, which affects the production efficiency.

[0004] The embodiment of the present application provides a temperature control system, which comprises a refrigeration device and a circulating device; the refrigeration device comprises a compressor, a heat accumulator, a condenser, an evaporator and a subcooled liquid accumulator;

[0005] The outlet end of the first heat exchange channel in the evaporator is connected to the inlet end of the compressor; the outlet end of the compressor comprises two paths, the first path is connected to the inlet end of the first heat exchange channel in the heat accumulator, and the second path is connected to the inlet end of the second heat exchange channel in the condenser and the inlet end of the first heat exchange channel in the evaporator together with the outlet end of the first heat exchange channel in the heat accumulator;

[0006] The outlet end of the second heat exchange channel in the condenser is connected to the inlet end of the subcooled liquid accumulator, and the outlet end of the subcooled liquid accumulator is connected to the inlet end of the first heat exchange channel in the evaporator;

[0007] The outlet end of the second heat exchange channel in the evaporator is connected to the inlet end of the circulating device, and the outlet end of the circulating device comprises two paths, the first path is connected to the inlet end of the second heat exchange channel in the heat accumulator, and the second path is connected to the inlet end of the second heat exchange channel in the evaporator together with the outlet end of the second heat exchange channel in the heat accumulator;

[0008] The heat accumulator stores heating energy, and the supercooling liquid accumulator stores and supercools refrigerant; the temperature of the circulating liquid is adjusted by controlling the temperature rising and falling of the refrigerant in the refrigeration device and the heat exchange between the circulating liquid in the circulating device and the heat accumulator and / or the evaporator, so that the circulating liquid controls the temperature of the load device.

[0009] Further, the circulating device includes a water tank, a water pump and a heater.

[0010] The inlet end of the water tank is the inlet end of the circulating device, the outlet end of the water tank is connected to the inlet end of the water pump, the outlet end of the water pump is connected to the inlet end of the heater, the outlet end of the heater is connected to the corresponding liquid inlet of the load device, and the corresponding liquid outlet of the load device is the outlet end of the circulating device.

[0011] Further, the outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the external cooling pipeline of the supercooling liquid accumulator, and the outlet end of the external cooling pipeline is connected to the inlet end of the compressor.

[0012] The external cooling pipeline is arranged outside the liquid storage space in the supercooling liquid accumulator and is used to cool the coolant stored in the liquid storage space.

[0013] Further, the outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the first heat exchange channel in the evaporator.

[0014] The embodiment of the present application also provides a temperature control method, which is applied to a temperature control system; the temperature control system includes a refrigeration device and a circulating device; the refrigeration device includes a compressor, a heat accumulator, a condenser, an evaporator, a supercooling liquid accumulator and a plurality of valves; the circulating device includes a plurality of circulating valves; the heat accumulator stores heating energy, and the supercooling liquid accumulator stores and supercools refrigerant; the method includes the following steps:

[0015] According to the received temperature adjustment instruction of the load device, the temperatures of the valves in the temperature control system are controlled, so that the refrigerant in the refrigeration device rises and falls in each component of the temperature control system and exchanges heat with the circulating liquid in the circulating device in the heat accumulator and / or the evaporator, so as to adjust the temperature of the circulating liquid, so that the circulating liquid controls the temperature of the load device.

[0016] Further, the plurality of valves in the refrigeration device comprises a first valve, a second valve, a third valve, a fourth valve, a fifth valve and a sixth valve; a first path of the outlet end of the compressor is connected to the inlet end of the first heat exchange channel in the heat accumulator through the first valve; a second path of the outlet end of the compressor is connected to the outlet end of the first heat exchange channel in the heat accumulator through the second valve, and is commonly connected to the inlet end of the first heat exchange channel in the evaporator through the third valve; the outlet end of the subcooler is connected to the inlet end of the first heat exchange channel in the evaporator through the fourth valve; the outlet end of the second heat exchange channel in the condenser is connected to the inlet end of the external cooling pipeline of the subcooler through the fifth valve; the outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the first heat exchange channel in the evaporator through the sixth valve; the plurality of circulating valves in the circulating device comprises a first circulating valve and a second circulating valve; a first path of the outlet end of the circulating device is connected to the inlet end of the second heat exchange channel in the heat accumulator through the first circulating valve, and a second path is commonly connected to the inlet end of the second heat exchange channel in the evaporator through the outlet end of the second heat exchange channel in the heat accumulator through the second circulating valve;

[0017] The control of the valves in the temperature control system according to the received temperature adjustment instruction of the load device comprises:

[0018] When the temperature adjustment instruction is a temperature increasing instruction, the first valve, the fourth valve, the second circulating valve and the sixth valve are closed, and the second valve, the third valve and the first circulating valve are opened.

[0019] When it is determined that the temperature of the circulating liquid increases to meet a preset condition, the first circulating valve is closed and the second circulating valve is opened.

[0020] Further, it is determined that the temperature of the circulating liquid increases to meet a preset condition by the following way:

[0021] The first circulating liquid temperature at the outlet end of the circulating device and the second circulating temperature at the outlet end of the second heat exchange channel in the heat accumulator are collected;

[0022] It is determined that the temperature difference between the second circulating temperature and the first circulating liquid temperature;

[0023] If the temperature difference is less than a preset threshold, it is determined that the temperature of the circulating liquid increases to meet a preset condition.

[0024] Further, the control of the valves in the temperature control system according to the received temperature adjustment instruction of the load device comprises:

[0025] When the temperature adjustment instruction is a cooling instruction, the second valve, the third valve, the first circulation valve and the sixth valve are closed, and the first valve, the second circulation valve and the fourth valve are opened.

[0026] Further, before controlling the valves in the temperature control system according to the received temperature adjustment instruction of the load device, the method further comprises:

[0027] After the temperature control system is started, a temperature control preparation phase is entered and lasts for a predetermined time length, so that the heat accumulator stores heating energy, and the supercooling liquid accumulator performs supercooling treatment on the refrigerant and stores the refrigerant;

[0028] In the temperature control preparation phase, the second valve, the third valve, the first circulation valve and the fourth valve are closed, and the first valve and the second circulation valve are opened. Actual values in the temperature control system are collected, and the opening degrees of the fifth valve and the sixth valve are adjusted according to the difference between the actual values and set values.

[0029] Further, the actual values in the temperature control system are collected, and the opening degrees of the fifth valve and the sixth valve are adjusted according to the difference between the actual values and set values, comprising:

[0030] The first refrigeration temperature at the inlet end of the compressor, the first refrigeration pressure at the outlet end of the first heat exchange channel in the evaporator and the third circulation temperature at the outlet end of the second heat exchange channel in the evaporator are collected.

[0031] According to the first refrigeration temperature and the first refrigeration pressure, a superheat difference value between an actual superheat value and a preset superheat value is determined.

[0032] A temperature difference value between the third circulation temperature and a preset temperature value is determined.

[0033] According to the superheat difference value, the opening degree of the fifth valve is adjusted.

[0034] According to the temperature difference value, the opening degree of the sixth valve is adjusted.

[0035] The embodiment of the application further provides an electronic device, comprising a processor, a memory and a bus, the memory stores machine readable instructions executable by the processor, when the electronic device is running, the processor and the memory communicate through the bus, and the machine readable instructions are executed by the processor to perform the steps of the temperature control method as described above.

[0036] The embodiment of the present application further provides a computer readable storage medium, and the computer readable storage medium stores a computer program. The computer program is run by a processor to execute the steps of the temperature control method.

[0037] The temperature control system and the temperature control method provided by the embodiment of the present application can store heat energy in the heat accumulator, and the heat accumulator can be used to increase the temperature in the temperature increasing process, so that the temperature increasing speed is improved. The supercooling liquid accumulator is used to supercool and store the refrigerant, and the supercooling liquid accumulator can be used to decrease the temperature in the temperature decreasing process, so that the temperature decreasing speed is improved. In this way, the waiting time for temperature increasing and decreasing can be reduced without increasing the power of the compressor, the condenser and the evaporator, the production efficiency is improved, energy consumption is reduced, the production cost of the equipment is reduced, and the equipment is miniaturized.

[0038] In order to make the above objectives, characteristics and advantages of the present application more apparent, clear and easy to understand, the following preferred embodiments are specifically described below, and the accompanying drawings are referred to, and the detailed description is as follows. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be considered as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0040] Figure 1 Fig. 1 shows a structural schematic diagram of a temperature control system provided by the embodiment of the present application;

[0041] Figure 2 Fig. 2 shows a flow chart of a temperature control method provided by the embodiment of the present application;

[0042] Figure 3 Fig. 3 shows a structural schematic diagram of an electronic device provided by the embodiment of the present application. DETAILED DESCRIPTION

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. Based on the embodiments of this application, every other embodiment obtained by those skilled in the art without inventive effort falls within the scope of protection of this application.

[0044] Research has shown that semiconductor temperature control devices, as crucial equipment in the semiconductor integrated circuit manufacturing process, are required to provide the necessary temperature output to control the temperature of the etching equipment's process chamber during the etching process. In practical use, semiconductor temperature control devices precisely control the temperature through cooling and heating processes. The etching equipment's process chamber requires different temperatures throughout the entire process to meet production needs, typically switching periodically between -20℃ and 90℃. This necessitates the semiconductor temperature control device switching temperatures according to process requirements. Production can only proceed when the process chamber temperature reaches the target value. This involves waiting time during the heating and cooling processes. Traditional temperature control devices experience long waiting times when switching from high to low temperatures or vice versa, impacting production efficiency.

[0045] Based on this, the present application provides a temperature control system to solve the problem that the existing temperature control equipment has a long waiting time for heating and cooling, which affects production efficiency.

[0046] Please see Figure 1 , Figure 1 This is a schematic diagram of a temperature control system provided in an embodiment of this application. Figure 1 As shown in the illustration, the temperature control system provided in this application embodiment includes a refrigeration device 100 and a circulation device 200. The refrigeration device 100 includes a compressor 112, a heat accumulator 111, a condenser 113, an evaporator 115, and a subcooled liquid receiver 114. The refrigeration device 100 contains a refrigerant, and the temperature of the refrigerant can be controlled by controlling the flow of the refrigerant through the various components in the refrigeration device 100 to raise and lower the temperature. The circulation device 200 contains a circulating liquid, which continuously circulates in the circulation device 200 to raise and lower the temperature of the load device 300. By controlling the heat exchange between the refrigerant in the refrigeration device 100 and the circulating liquid in the circulation device 200, the temperature of the circulating liquid can be adjusted, thereby controlling the temperature of the load device 300.

[0047] The outlet end of the first heat exchange channel in the evaporator 115 is connected to the inlet end of the compressor 112; the outlet end of the compressor 112 includes two paths, the first path is connected to the inlet end of the first heat exchange channel in the heat accumulator 111, and the second path is connected to the inlet end of the second heat exchange channel in the condenser 113 and the inlet end of the first heat exchange channel in the evaporator 115 together with the outlet end of the first heat exchange channel in the heat accumulator 111.

[0048] The outlet end of the second heat exchange channel in the condenser 113 is connected to the inlet end of the subcooler 114, and the outlet end of the subcooler 114 is connected to the inlet end of the first heat exchange channel in the evaporator 115.

[0049] The outlet end of the second heat exchange channel in the evaporator 115 is connected to the inlet end of the circulating device 200, and the outlet end of the circulating device 200 includes two paths, the first path is connected to the inlet end of the second heat exchange channel in the heat accumulator 111, and the second path is connected to the inlet end of the second heat exchange channel in the evaporator 115 together with the outlet end of the second heat exchange channel in the heat accumulator 111.

[0050] The compressor 112 absorbs the low-temperature and low-pressure gaseous refrigerant in the evaporator 115 through mechanical energy and then compresses it into high-temperature and high-pressure gaseous refrigerant. This process increases the pressure and temperature of the refrigerant, enabling it to effectively release heat. The first heat exchange channel in the condenser 113 is connected to the factory water to cool and condense the refrigerant in the second heat exchange channel.

[0051] By controlling the temperature rise and fall of the refrigerant in the refrigeration device 100 in each component of the refrigeration device 100 and the heat exchange between the circulating liquid in the circulating device 200 and the heat accumulator 111 and / or the evaporator 115, the temperature of the circulating liquid is adjusted to control the temperature of the load equipment 300.

[0052] On the one hand, the heat accumulator 111 stores heating energy. Specifically, the high-temperature and high-pressure gaseous refrigerant obtained after being compressed by the compressor 112 can heat the heat storage medium in the heat accumulator 111 through the first heat exchange channel; in this way, when the circulating liquid flows through the second heat exchange channel, the heat storage medium can heat the circulating liquid. Optionally, to improve the heat exchange efficiency, the heat release end (the end flowing through the refrigerant, i.e., the first heat exchange channel end) adopts a coil pipe to increase the heat exchange surface area, because the heat absorption end (the end flowing through the circulating liquid, i.e., the second heat exchange channel end) has a larger flow and lower pressure, in order to reduce the pressure drop and increase the heat exchange area, a column pipe type design is adopted.

[0053] The existing temperature control device can only increase temperature through the hot gas discharged by the compressor and the heater device, and the temperature increasing speed is slow. If the temperature increasing speed is increased, the installed power of each component has to be increased, thus resulting in problems of large energy consumption, high cost and being not conducive to miniaturization of the device. In the embodiment of the present application, the heat accumulator 111 is additionally provided, and the heat storage medium in the heat accumulator 111 can first increase the temperature of the circulating liquid. The circulating liquid that has been once heated by the heat accumulator 111 is then introduced into the evaporator 115 to be twice heated, so that the circulating liquid increases the temperature by continuously circulating and absorbing heat, thereby increasing the temperature increasing speed of the circulating liquid.

[0054] On the other hand, the supercooling liquid accumulator 114 performs supercooling treatment on the refrigerant, and the liquid refrigerant obtained after the supercooling treatment is stored in the supercooling liquid accumulator 114. If the existing temperature control device wants to increase the cooling speed, the power of the compressor needs to be increased, at this time, the condenser and the evaporator also need to be increased accordingly, at this time, the energy consumption of the device is increased, the size is increased, and the cost of the device is increased. In the embodiment of the present application, the supercooling liquid accumulator 114 is additionally provided, and the refrigerant cooled by the condenser 113 can be subjected to supercooling treatment, and the second cooling can improve the supercooling degree of the refrigerant, improve the refrigeration capacity and the cooling speed, and avoid waste of energy.

[0055] Further, the outlet end of the second heat exchange channel in the condenser 113 is also connected to the inlet end of the external cooling pipeline of the supercooling liquid accumulator 114, and the outlet end of the external cooling pipeline is connected to the inlet end of the compressor 112.

[0056] The external cooling pipeline is arranged outside the liquid storage space in the supercooling liquid accumulator 114, and is used for cooling the coolant stored in the liquid storage space.

[0057] In this way, the liquid storage space in the supercooling liquid accumulator 114 is cooled through the external cooling pipeline, which can further reduce the temperature of the refrigerant in the liquid storage space and improve the refrigeration speed, and indirectly achieve the purpose of improving the cooling speed of the circulating liquid.

[0058] Further, the outlet end of the second heat exchange channel in the condenser 113 is also connected to the inlet end of the first heat exchange channel in the evaporator 115.

[0059] Further, the refrigeration device 100 further comprises a first valve 101, a second valve 102, a third valve 103, a fourth valve 104, a fifth valve 105 and a sixth valve 106. Optionally, each valve is an electromagnetic valve, and can be controlled by an electromagnetic signal to be switched on and off and to be adjusted in opening degree.

[0060] The first path of the outlet end of the compressor 112 is connected to the inlet end of the first heat exchange channel in the heat accumulator 111 via the first valve 101; the second path of the outlet end of the compressor 112 is connected to the outlet end of the first heat exchange channel in the heat accumulator 111 via the second valve 102, and is connected to the inlet end of the first heat exchange channel in the evaporator 115 via the third valve 103; the outlet end of the subcooled liquid receiver 114 is connected to the inlet end of the first heat exchange channel in the evaporator 115 via the fourth valve 104; the outlet end of the second heat exchange channel in the condenser 113 is connected to the inlet end of the external cooling pipe of the subcooled liquid receiver 114 via the fifth valve 105; the outlet end of the second heat exchange channel in the condenser 113 is also connected to the inlet end of the first heat exchange channel in the evaporator 115 via the sixth valve 106.

[0061] By controlling the opening and closing of each valve, the flow direction and components of the refrigerant in the refrigeration unit 100 can be adjusted, thereby controlling the temperature rise and fall of the refrigerant in each component of the refrigeration unit 100. Specifically, during each stage of system operation (including heating, cooling, and temperature control preparation), the opening of valve 105 is adjusted according to the superheat to subcool the refrigerant in the subcooled receiver 114, maintaining system stability. Specifically, the first refrigeration temperature at the inlet of the compressor 112 and the first refrigeration pressure at the outlet of the first heat exchange channel in the evaporator 115 are collected to determine the actual superheat value; the opening of the fifth valve 105 is adjusted based on the superheat difference between the actual superheat value and the preset superheat value.

[0062] On the other hand, such as Figure 1 As shown, the circulation device 200 includes a water tank 206, a water pump 207, and a heater 208.

[0063] The inlet end of the water tank 206 serves as the inlet end of the circulation device 200. The outlet end of the water tank 206 is connected to the inlet end of the water pump 207. The outlet end of the water pump 207 is connected to the inlet end of the heater 208. The outlet end of the heater 208 is connected to the corresponding liquid inlet of the load device 300. The corresponding liquid outlet of the load device 300 serves as the outlet end of the circulation device 200.

[0064] Under the power of the water pump 207, the circulating liquid is drawn from the water tank 206 and sucked into the water pump 207, and discharged from the water pump 207 to the heater 208. The circulating liquid at the outlet of the heater 208 enters the corresponding position of the load device 300 and exchanges heat with the load device 300. After that, the circulating liquid returns to the water tank 206 or returns to the water tank 206 through the second heat exchange channel of the heat accumulator 111.

[0065] Here, the temperature T205 of the circulating liquid at the inlet end of the water tank 206 (i.e., the third circulating temperature at the outlet end of the second heat exchange channel in the evaporator) can be collected by the temperature sensor 205, and the temperature T209 of the circulating liquid at the corresponding inlet of the load device 300 can be collected by the temperature sensor 209. By comparing T205 and T209, the heater 208 can be controlled to heat the circulating liquid.

[0066] Further, the circulating device 200 further includes a first circulating valve 201 and a second circulating valve 202. Optionally, each valve is an electromagnetic valve, which can be switched and controlled by an electromagnetic signal.

[0067] The first path at the outlet end of the circulating device 200 is connected to the inlet end of the second heat exchange channel in the regenerator 111 through the first circulating valve 201, and the second path is connected to the outlet end of the second heat exchange channel in the regenerator 111 through the second circulating valve 202, and is further connected to the inlet end of the second heat exchange channel in the evaporator 115.

[0068] By controlling the opening and closing of each valve, the flow direction and the components through which the circulating liquid flows in the circulating device 200 can be adjusted, and whether the circulating liquid flows through the regenerator 111 can be controlled, i.e., whether the circulating liquid and the refrigerant exchange heat in the regenerator 111 and / or the evaporator 115.

[0069] The temperature control system provided by the embodiments of the present application can store heat energy in the regenerator, and can be heated by the regenerator during the heating process to improve the heating speed. The supercooled liquid storage device can supercool and store the refrigerant, and can be cooled by the supercooled liquid storage device during the cooling process to improve the cooling speed. In this way, the waiting time for heating and cooling can be reduced without increasing the power of the compressor, the condenser and the evaporator, the production efficiency can be improved, energy consumption can be reduced, the production cost of the equipment can be reduced, and the miniaturization of the equipment is facilitated.

[0070] The embodiments of the present application also provide a temperature control method, which can be applied to the temperature control system of any of the above-mentioned embodiments, and can be a controller in the temperature control system. The refrigeration device 100 includes a compressor 112, a regenerator 111, a condenser 113, an evaporator 115, a supercooled liquid storage device 114 and a plurality of valves. The circulating device 200 includes a plurality of circulating valves. The controller can communicate with each component in the temperature control system to obtain the current operating parameters of each component, and send control instructions to each component to adjust the operating parameters of each component.

[0071] Specifically, the temperature control method includes:

[0072] According to the received temperature regulation instruction of the load device, the valves in the temperature control system are controlled, so that the refrigerant in the refrigeration device 100 is heated and cooled in each component of the temperature control system, and the circulating liquid in the circulating device 200 exchanges heat with the circulating liquid in the heat accumulator 111 and / or the evaporator 115, so as to regulate the temperature of the circulating liquid, so that the circulating liquid controls the temperature of the load device 300.

[0073] The heat storage energy in the heat accumulator 111 can be heated by the heat accumulator 111 during the heating process to improve the heating speed; the supercooled liquid accumulator 114 performs supercooling treatment on the refrigerant and stores it, and can be cooled by the supercooled liquid accumulator 114 during the cooling process to improve the cooling speed. In this way, without increasing the power of the compressor 112, the condenser 113 and the evaporator 115, the waiting time for heating and cooling can be reduced, the production efficiency can be improved, the energy consumption can be reduced, the equipment production cost can be reduced, and the equipment miniaturization is beneficial.

[0074] Here, the type of temperature regulation instruction can include a heating instruction and a cooling instruction; the execution process of the temperature control method for each type of temperature regulation instruction will be described in detail below.

[0075] In one possible implementation, please refer to Figure 2 , Figure 2 A flow chart of a temperature control method provided by another embodiment of the application. As shown in Figure 2 , the temperature control method provided by the embodiment of the application comprises:

[0076] Step a1, when the temperature regulation instruction is a heating instruction, the first valve 101, the fourth valve 104, the second circulating valve 202 and the sixth valve 106 are closed, and the second valve 102, the third valve 103 and the first circulating valve 201 are opened.

[0077] When the load device 300 needs high temperature, the temperature control system needs to be heated, at this time, a heating instruction is generated, and the target value of heating can be set in the heating instruction (which can be the temperature target value of the circulating liquid at the liquid inlet of the load device 300, that is, the temperature T209 collected by the temperature sensor 209 in Figure 1 ).

[0078] Please refer to Figure 1 , at this time, the valves 101, 104, 202 and 106 are closed, and the valves 102, 103 and 201 are opened. The circulating liquid returned from the outlet end of the circulating device 200 enters the heat absorption end heat exchange pipe of the heat accumulator 111 through the valve 201, and exchanges heat with the heat storage medium in the heat accumulator 111, so that the heat storage medium heats the circulating liquid once.

[0079] The cycle fluid which is once heated by the heat accumulator 111 enters the second heat exchange channel of the evaporator 115, while the hot gas (high-temperature gaseous refrigerant) discharged by the compressor 112 enters the first heat exchange channel of the evaporator 115 through the valve 103, and the cycle fluid is heated twice by the hot gas flowing through one side of the evaporator 115. In this way, the cycle fluid is continuously heated and its temperature is continuously increased.

[0080] Step a2, when it is determined that the temperature of the cycle fluid is increased to meet the preset condition, the first circulation valve 201 is closed and the second circulation valve 202 is opened.

[0081] Here, the preset condition refers to the temperature of the cycle fluid being increased until the heat accumulator 111 can no longer effectively heat the cycle fluid as the heat energy stored in the heat accumulator 111 is released.

[0082] At this time, the valve 202 should be opened and the valve 201 should be closed, so that the cycle fluid directly enters the evaporator 115 to exchange heat with the high-temperature hot gas discharged by the compressor 112 to increase the temperature, that is, the first heating process of the cycle fluid by the heat accumulator 111 is cut off.

[0083] Specifically, the temperature of the cycle fluid can be determined to meet the preset condition by the following method:

[0084] Step a21, collecting the first circulation temperature at the outlet end of the circulation device 200 and the second circulation temperature at the outlet end of the second heat exchange channel of the heat accumulator 111.

[0085] In this step, the first circulation temperature T204 can be collected by the temperature sensor 204 arranged at the outlet end of the circulation device 200, and the second circulation temperature T203 can be collected by the temperature sensor 203 arranged at the outlet end of the second heat exchange channel of the heat accumulator 111.

[0086] Step a22, determining the temperature difference between the second circulation temperature and the first circulation temperature.

[0087] Step a23, if the temperature difference is less than a preset threshold value, it is determined that the temperature of the cycle fluid is increased to meet the preset condition.

[0088] For the above two steps, the temperature difference TA=T203-T204 will obviously decrease as the heat of the heat storage medium is released; when TA≤TB, it is considered that the heat of the heat storage medium in the heat accumulator 111 is basically released, and at this time it is determined that the temperature of the cycle fluid is increased to meet the preset condition. Here, TB represents the preset threshold value, which is an empirical value, such as 2-5℃, and can be set according to different temperature control systems, which is not limited in the present application.

[0089] It should be noted that when the temperature rises to the target value set by the temperature rising instruction, the temperature rising process ends. Correspondingly, the temperature control system enters the working mode, at this time the system only needs small energy consumption to maintain the current temperature. For example, the system can adjust the valve opening degree and the power of each component according to the target value and the actual detected temperature value by using the existing control algorithm such as PID, so as to make the system run in a stable state.

[0090] In another possible implementation, the temperature control method comprises:

[0091] Step b, when the temperature adjusting instruction is the temperature lowering instruction, the second valve 102, the third valve 103, the first circulating valve 201 and the sixth valve 106 are closed, and the first valve 101, the second circulating valve 202 and the fourth valve 104 are opened.

[0092] When the load device 300 needs low temperature, the temperature control system needs to operate in the temperature lowering mode, at this time the temperature lowering instruction is generated, and the target value of the temperature lowering (which can be the target value of the circulating liquid at the liquid inlet of the load device 300, i.e. Figure 1 temperature T209 collected by the temperature sensor 209) can be set in the temperature lowering instruction.

[0093] Referring back to Figure 1 At this time, the valves 102, 103, 201 and 106 are closed, and the valves 101, 202 and 104 are opened. The refrigerant stored in the supercooling liquid storage device 114 and subjected to supercooling treatment enters the first heat exchange channel of the evaporator 115 through the valve 104. At this time, the high-temperature circulating liquid in the circulating device 200 flows through the second heat exchange channel of the evaporator 115 through the valve 202. The supercooled refrigerant is gasified in the evaporator 115 to absorb heat and rapidly lower the temperature of the circulating liquid.

[0094] At the same time of the temperature lowering, the hot gas discharged by the compressor 112 enters the first heat exchange channel of the heat accumulator 111 through the valve 101 to exchange heat with the heat accumulator medium, so as to accumulate heat for the next temperature rising. At this time, the temperature of the heat accumulator medium is increased, and the refrigerant gas is also lowered in temperature once. After being lowered in temperature twice in the condenser 113, the refrigerant enters the supercooling liquid storage device 114 to be subjected to supercooling treatment. Here, the supercooling degree of the refrigerant is also indirectly increased by the heat exchange with the heat accumulator medium in the heat accumulator 111, so that the refrigeration capacity is increased while the energy waste is avoided, thereby achieving the energy saving effect.

[0095] It should be noted that when the temperature decreases to the target value set by the temperature reduction instruction, the temperature reduction process ends. Correspondingly, the temperature control system enters the working mode, at which time the system only needs a small amount of energy consumption to maintain the current temperature. For example, the system can adjust the valve opening degree and the power of each component according to the target value and the actual detected temperature value by using the existing control algorithm such as PID, so as to make the system run in a stable state.

[0096] Further, before controlling each valve in the temperature control system according to the received temperature adjustment instruction of the load device, the temperature control method further comprises:

[0097] Step c, after the temperature control system is started, entering a temperature control preparation stage and lasting for a predetermined time length, so that the heat storage device 111 stores heating energy, and the supercooling reservoir 114 performs supercooling treatment on the refrigerant and stores it.

[0098] In this way, after running for a predetermined time length, the heat storage device 111 and the supercooling reservoir 114 store sufficient heating energy and refrigeration energy, and the temperature rising and falling mode for the load device 300 can be entered. The predetermined time length can be set according to the energy storage capacity of the heat storage device 111 and the supercooling reservoir 114, which is not limited in the present application.

[0099] In the temperature control preparation stage, the second valve 102, the third valve 103, the first circulating valve 201 and the fourth valve 104 are closed, and the first valve 101 and the second circulating valve 202 are opened; the actual value in the temperature control system is collected, and the opening degree of the fifth valve 105 and the sixth valve 106 is adjusted according to the difference between the actual value and the set value.

[0100] In the temperature control preparation stage, the temperature control system has been started, and the compressor 112 and the water pump 207 are running. At this time, the system is generally in an idle state (i.e., without connecting the load device 300). The default temperature T209 can be set as an initial value of 20°C, at which time the valves 102, 103, 201 and 104 are in a closed state.

[0101] At this time, the hot gas discharged by the compressor 112 enters the heat storage device 111 through the valve 101 to warm the heat storage medium. The initial temperature of the heat storage medium is equivalent to the ambient temperature, while the temperature of the hot gas discharged by the compressor 112 is generally 80-90°C. The high-temperature hot gas is heat-exchanged in the heat storage device 111, and the temperature of the heat storage medium is increased while the hot gas is cooled down for the first time. The hot gas cooled down for the first time is cooled down for the second time in the condenser 113; the refrigerant cooled down for the second time in the condenser 113 is liquefied after the supercooling treatment in the supercooling reservoir 114, and is stored in the supercooling reservoir 114 in a large amount.

[0102] In this stage, the supercooling of the refrigerant in the supercooling reservoir 114 can be controlled by using a PID control algorithm to obtain an output signal from the difference between the set value of the superheat degree at the inlet end of the compressor 112 and the actual superheat degree feedback value, and controlling the opening of the valve 105 according to the output signal; and the stability of the system can be maintained by using a PID control algorithm to obtain an output signal from the difference between the set value of the temperature at the outlet end of the second heat exchange passage of the evaporator and the actual temperature feedback value, and controlling the opening of the valve 106 according to the output signal.

[0103] In a specific implementation, collecting actual values in the temperature control system and adjusting the openings of the fifth valve 105 and the sixth valve 106 according to the difference between the actual values and the set values can include:

[0104] Step c1: collecting a first refrigeration temperature at the inlet end of the compressor 112, a first refrigeration pressure at the outlet end of the first heat exchange passage of the evaporator 115, and a third circulation temperature at the outlet end of the second heat exchange passage of the evaporator 115.

[0105] Referring back to Figure 1 The first refrigeration temperature T109 at the inlet end of the compressor 112 can be collected by the temperature sensor 109, the first refrigeration pressure P110 at the outlet end of the first heat exchange passage of the evaporator 115 can be collected by the pressure sensor 110, and the third circulation temperature T205 at the outlet end of the second heat exchange passage of the evaporator 115 can be collected by the temperature sensor 205.

[0106] Step c2: determining a superheat degree difference between an actual superheat degree value and a preset superheat degree value according to the first refrigeration temperature and the first refrigeration pressure.

[0107] In this step, the actual superheat degree value can be obtained from the saturation temperature of the refrigerant (i.e., the temperature at which the refrigerant is completely evaporated at the pressure) and the first refrigeration temperature according to the first refrigeration pressure P110 at the outlet end of the evaporator 115. In the embodiment of the present application, the actual superheat degree value = the first refrigeration temperature (T109) at the inlet end of the compressor - the saturation temperature of the refrigerant. Finally, the deviation between the actual superheat degree value and the preset superheat degree value is determined for input of the control algorithm.

[0108] Step c3: determining a temperature difference between the third circulation temperature and a preset temperature value.

[0109] In this step, the temperature difference between the third circulation temperature and the preset temperature value (the set T209 target value) is determined for input of the control algorithm.

[0110] Step c4: adjusting the opening of the fifth valve 105 according to the superheat degree difference.

[0111] Step c5, adjusting the opening of the sixth valve according to the temperature difference.

[0112] Here, when the superheat difference is too large (the actual value of the subcooling degree is too high), the opening of the fifth valve 105 can be increased to take away the heat of the refrigerant in the subcooling accumulator 114, and to supplement the refrigerant in the evaporator 115, so as to reduce the superheat degree and ensure the stability of the system operation. When the temperature difference is too large (the actual value of the third cycle temperature is too high), the opening of the sixth valve 106 can be increased.

[0113] The temperature control method provided by the embodiment of the present application can store heat energy in the heat accumulator, and can be heated by the heat accumulator in the heating process, so as to improve the heating speed. The subcooling accumulator can perform subcooling treatment on the refrigerant and store the refrigerant, and can be cooled by the subcooling accumulator in the cooling process, so as to improve the cooling speed. In this way, the waiting time for heating and cooling can be reduced without increasing the power of the compressor, the condenser and the evaporator, the production efficiency can be improved, energy consumption can be reduced, the production cost of the equipment can be reduced, and the miniaturization of the equipment is facilitated.

[0114] Please refer to Figure 3 , Figure 3 The embodiment of the present application provides a structural schematic diagram of an electronic device. As shown in Figure 3 , the electronic device 300 includes a processor 310, a memory 320 and a bus 330.

[0115] The memory 320 stores machine readable instructions executable by the processor 310. When the electronic device 300 is running, the processor 310 and the memory 320 communicate through the bus 330. When the machine readable instructions are executed by the processor 310, the steps of the temperature control method in the method embodiment shown in the above Figure 2 The specific implementation can be referred to the method embodiment, and will not be described here.

[0116] The embodiment of the present application further provides a computer readable storage medium, and the computer readable storage medium stores a computer program. When the computer program is run by the processor, the steps of the temperature control method in the method embodiment shown in the above Figure 2 The specific implementation can be referred to the method embodiment, and will not be described here.

[0117] Those skilled in the art can clearly understand that, for the convenience and brevity of the description, the specific working process of the above-described system, device and unit can refer to the corresponding process in the foregoing method embodiment, and will not be described here.

[0118] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented in other manners. The described device embodiments are merely schematic, for example, the division of the units is only a logical function division, and there can be another division manner in actual implementation, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections between different units, or the among different units, can be indirect couplings or communication connections through some interfaces, devices or units, and can be in electrical, mechanical or other forms.

[0119] The units described as separated components can or can not be physically separated, and the components displayed as units can or can not be physical units, i.e., can be located in one place, or can be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purposes of the embodiments of the present application.

[0120] In addition, each functional unit in the embodiments of the present application can be integrated in one processing unit, or each unit can exist physically as a separate unit, or two or more units can be integrated in one unit.

[0121] If the functions are implemented in the form of software function units and sold or used as independent products, they can be stored in a non-volatile computer readable storage medium executable by a processor. Based on this understanding, the technical solutions of the present application or the parts of the technical solutions that make essential contributions to the prior art can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various media that can store program codes.

[0122] Finally, it should be noted that the above-described embodiments are merely specific embodiments of the present application, which are used to illustrate the technical solutions of the present application, but not to limit the same. The protection scope of the present application is not limited thereto. Although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that any skilled person in the art can still modify or easily think of changes to the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some of the technical features, within the technical scope disclosed by the present application. The modifications, changes or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A temperature control system, characterized by, The system comprises a refrigeration device and a circulating device; the refrigeration device comprises a compressor, a heat accumulator, a condenser, an evaporator and a subcooling accumulator; an outlet end of the first heat exchange channel in the evaporator is connected to an inlet end of the compressor; an outlet end of the compressor comprises two paths, a first path is connected to an inlet end of the first heat exchange channel in the heat accumulator, and a second path is connected to an inlet end of the second heat exchange channel in the condenser and an inlet end of the first heat exchange channel in the evaporator together with an outlet end of the first heat exchange channel in the heat accumulator; an outlet end of the second heat exchange channel in the condenser is connected to an inlet end of the subcooling accumulator, and an outlet end of the subcooling accumulator is connected to an inlet end of the first heat exchange channel in the evaporator; an outlet end of the second heat exchange channel in the evaporator is connected to an inlet end of the circulating device, and an outlet end of the circulating device comprises two paths, a first path is connected to an inlet end of the second heat exchange channel in the heat accumulator, and a second path is connected to an inlet end of the second heat exchange channel in the evaporator together with an outlet end of the second heat exchange channel in the heat accumulator; wherein the heat accumulator stores heating energy, and the subcooling accumulator stores and subcools refrigerant; by controlling the refrigerant in the refrigeration device to rise and fall in temperature in each component of the refrigeration device and to exchange heat with circulating liquid in the circulating device in the heat accumulator and / or the evaporator, the temperature of the circulating liquid is adjusted to control the temperature of the load device by the circulating liquid.

2. The system of claim 1, wherein, The circulating device comprises a water tank, a water pump and a heater; an inlet end of the water tank serves as an inlet end of the circulating device, an outlet end of the water tank is connected to an inlet end of the water pump, an outlet end of the water pump is connected to an inlet end of the heater, an outlet end of the heater is connected to a corresponding liquid inlet of the load device, and a corresponding liquid outlet of the load device serves as an outlet end of the circulating device.

3. The system of claim 1, wherein, The outlet end of the second heat exchange channel in the condenser is also connected to an inlet end of an external cooling pipeline of the subcooling accumulator, and the outlet end of the external cooling pipeline is connected to the inlet end of the compressor; wherein the external cooling pipeline is arranged outside a liquid storage space in the subcooling accumulator to cool the coolant stored in the liquid storage space.

4. The system of claim 3, wherein, The outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the first heat exchange channel in the evaporator.

5. A temperature control method characterized by, The method is applied to the temperature control system as claimed in any one of claims 1 to 4; the temperature control system comprises a refrigeration device and a circulating device; the refrigeration device comprises a compressor, a heat accumulator, a condenser, an evaporator, a subcooling accumulator and a plurality of valves; the circulating device comprises a plurality of circulating valves; the heat accumulator stores heating energy, and the subcooling accumulator stores and subcools refrigerant; the method comprises: According to the received temperature regulation instruction of the load device, the valves in the temperature control system are controlled, so that the refrigerant in the refrigeration device is used to adjust the temperature of the circulating liquid in the circulating device by being heated or cooled in the components of the temperature control system and performing heat exchange with the circulating liquid in the heat accumulator and / or the evaporator.

6. The method of claim 5, wherein, The valves in the refrigeration device include a first valve, a second valve, a third valve, a fourth valve, a fifth valve and a sixth valve; a first path of the outlet end of the compressor is connected to the inlet end of the first heat exchange channel in the heat accumulator through the first valve; a second path of the outlet end of the compressor is connected to the outlet end of the first heat exchange channel in the heat accumulator through the second valve, and is commonly connected to the inlet end of the first heat exchange channel in the evaporator through the third valve; the outlet end of the subcooler is connected to the inlet end of the first heat exchange channel in the evaporator through the fourth valve; the outlet end of the second heat exchange channel in the condenser is connected to the inlet end of the external cooling pipeline of the subcooler through the fifth valve; the outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the first heat exchange channel in the evaporator through the sixth valve; the circulating valves in the circulating device include a first circulating valve and a second circulating valve; a first path of the outlet end of the circulating device is connected to the inlet end of the second heat exchange channel in the heat accumulator through the first circulating valve, and a second path is commonly connected to the inlet end of the second heat exchange channel in the evaporator through the outlet end of the second heat exchange channel in the heat accumulator through the second circulating valve; The method further comprises the following steps before controlling the valves in the temperature control system according to the received temperature regulation instruction of the load device: when the temperature regulation instruction is a heating instruction, the first valve, the fourth valve, the second circulating valve and the sixth valve are closed, and the second valve, the third valve and the first circulating valve are opened; when it is determined that the temperature of the circulating liquid is increased to meet the preset condition, the first circulating valve is closed and the second circulating valve is opened.

7. The method of claim 6, wherein, The temperature of the circulating liquid is determined to be increased to meet the preset condition in the following way: the first circulating temperature of the outlet end of the circulating device and the second circulating temperature of the outlet end of the second heat exchange channel in the heat accumulator are collected; the temperature difference between the second circulating temperature and the first circulating temperature is determined; if the temperature difference is less than a preset threshold, it is determined that the temperature of the circulating liquid is increased to meet the preset condition.

8. The method of claim 6, wherein, The method further comprises the following steps before controlling the valves in the temperature control system according to the received temperature regulation instruction of the load device: when the temperature regulation instruction is a cooling instruction, the second valve, the third valve, the first circulating valve and the sixth valve are closed, and the first valve, the second circulating valve and the fourth valve are opened.

9. The method of claim 6, wherein, The method further comprises the following steps before controlling the valves in the temperature control system according to the received temperature regulation instruction of the load device: After the temperature control system is started, a temperature control preparation phase is entered and lasts for a predetermined time length, so that the heat accumulator stores heat energy, the supercooling reservoir supercools refrigerant and stores the supercooled refrigerant; In the temperature control preparation phase, the second valve, the third valve, the first circulating valve and the fourth valve are closed, and the first valve and the second circulating valve are opened; actual values in the temperature control system are collected, and the opening degrees of the fifth valve and the sixth valve are adjusted according to differences between the actual values and set values.

10. The method of claim 9, wherein, Collecting actual values in the temperature control system and adjusting the opening degrees of the fifth valve and the sixth valve according to differences between the actual values and set values includes: Collecting a first refrigeration temperature at an inlet end of the compressor, a first refrigeration pressure at an outlet end of a first heat exchange channel in the evaporator and a third circulating temperature at an outlet end of a second heat exchange channel in the evaporator; Determining a superheat difference value between an actual superheat value and a preset superheat value according to the first refrigeration temperature and the first refrigeration pressure; Determining a temperature difference value between the third circulating temperature and a preset temperature value; Adjusting the opening degree of the fifth valve according to the superheat difference value; Adjusting the opening degree of the sixth valve according to the temperature difference value.

Citation Information

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