Sub-chassis structure

Abstract

The present invention discloses a compartment-type chassis structure, including a plurality of compartment boxes, which are arranged adjacent to each other, the plurality of compartment boxes are used to accommodate a plurality of electronic components, and a distance space is arranged between the plurality of compartment boxes, and the distance space can be used as an air inlet channel of one of the plurality of compartment boxes. The compartment-type chassis structure of the present invention can change the chassis structure by adopting a layered configuration, and the original chassis space is divided into two or even more independent compartments, so that the water-cooled exhaust is physically isolated from the CPU and graphics card with larger heat generation, and independent heat dissipation is realized, thereby achieving a better heat dissipation effect.

Description

Technical Field

[0001] The invention relates to the field of heat dissipation of electronic equipment, in particular to a compartment-type chassis structure. Background Art

[0002] The water cooling radiator of a traditional chassis is usually installed on the top of the chassis, such as Figures 1 to 4 As shown, the fan on the water cooling radiator 101 of the traditional chassis 1 is generally installed in a way of blowing air to the water cooling radiator, and the air passes through the water cooling radiator and then is discharged from the chassis. As the power consumption of graphics cards increases, there is a problem with this structure, that is, the air will be heated by the graphics card, causing the air temperature entering the cooling fan to be much higher than the room temperature. At the same time, the upward air duct will also affect the air duct of the graphics card, causing the temperature of the entire machine to rise, and the heat dissipation system to run at a high load, which brings a bad user experience.

[0003] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the invention and should not be regarded as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art. Summary of the invention

[0004] The purpose of the present invention is to provide a compartment-type chassis structure, which changes the chassis structure by adopting a layered configuration, dividing the original chassis space into two or even more independent compartments, so that the water-cooled exhaust is physically isolated from the CPU and graphics card that generate more heat, realizing independent heat dissipation, thereby achieving better heat dissipation effect.

[0005] To achieve the above-mentioned purpose, the present invention provides a cabin-type chassis structure, including multiple cabin boxes, which are arranged adjacent to each other, the multiple cabin boxes are used to accommodate multiple electronic components, and distance spaces are arranged between the multiple cabin boxes. The distance space can serve as an air inlet channel for one of the multiple cabin boxes.

[0006] In a preferred embodiment, the multiple cabin boxes include a first cabin box and a second cabin box; the first cabin box is used to accommodate a part of the multiple electronic components; the second cabin box is arranged above the first cabin box, and the second cabin box is used to accommodate a part of the multiple electronic components; wherein the distance space between the first cabin box and the second cabin box can serve as an air inlet channel for the second cabin box.

[0007] In a preferred embodiment, the first cabin box includes an upper cover plate, which is arranged on the top of the first cabin box and is used to block the heat of the first cabin box from flowing into the second cabin box; the second cabin box includes an upper cabin cover, which is arranged on the top of the second cabin box, and ventilation holes are opened on the upper cabin cover. Air flow enters the interior of the second cabin box from the air inlet channel of the second cabin box, and then flows out from the ventilation holes of the upper cabin cover to form a heat dissipation duct of the second cabin box.

[0008] In a preferred embodiment, the cabin-type chassis structure further includes a gallery bridge, which is disposed between adjacent cabin boxes. The gallery bridge is used to connect the first cabin box and the second cabin box and form a distance space therebetween.

[0009] In a preferred embodiment, the second cabin box body includes two cabin panels and a cover plate; the two cabin panels are arranged at the front of the second cabin box body; the cover plate is buckled at the rear of the corridor bridge, and the space enclosed by the cover plate and the corridor bridge can be used to accommodate the passage of the heat dissipation pipeline.

[0010] In a preferred embodiment, the compartment-type chassis structure also includes a bracket and a connecting column; the bracket is arranged on the top of the second cabin box, and the bracket is used for connecting the upper hatch cover and the second cabin box; the connecting column is arranged at the corridor bridge, and the connecting column is used to fix the corridor bridge between the bottom of the second cabin box and the top of the first cabin box.

[0011] In a preferred embodiment, the compartment-type chassis structure also includes a water-cooled radiator, which includes a cooling water row and a cooling fan. The cooling fan is arranged at the top or bottom of the cooling water row, and the airflow formed by the cooling fan flows from the bottom of the second compartment box body to the top of the second compartment box body to form a cooling air duct.

[0012] In a preferred embodiment, the compartment-type chassis structure also includes a water cooling head, which is fitted to at least one heat source of multiple electronic components in the first compartment box, and the water cooling head is connected to the heat dissipation water drain through a heat dissipation pipeline.

[0013] In a preferred embodiment, the first cabin box includes a left side panel, a right side panel, a cabin panel, a front fan and a rear fan; the left side panel cover is arranged on the left side of the first cabin box; the right side panel cover is arranged on the right side of the first cabin box; the front fan is arranged at the front of the first cabin box; a cabin panel cover is arranged on the front side of the first cabin box and is located in front of the front fan; the rear fan is arranged at the rear of the first cabin box; wherein the front fan and the rear fan are used to form a heat dissipation duct running through the first cabin box from front to back.

[0014] In a preferred embodiment, the multiple cabin boxes also include a third cabin box arranged below the first cabin box and used to accommodate a part of the multiple electronic components; wherein the third cabin box is connected to the first cabin box via a corridor bridge, and the corridor bridge forms a distance space between the third cabin box and the first cabin box that can serve as an air inlet channel for the third cabin box.

[0015] In a preferred embodiment, the multiple cabin boxes include a first cabin box and a second cabin box; the first cabin box is used to accommodate a part of the multiple electronic components; the second cabin box is arranged on one side of the top of the first cabin box, and the second cabin box is used to accommodate a part of the multiple electronic components; wherein the air flow flows from one side of the second cabin box to the other side and forms a heat dissipation duct of the second cabin box.

[0016] Compared with the prior art, the compartment-type chassis structure of the present invention has the following beneficial effects: this solution changes the chassis structure by adopting a layered configuration, dividing the original chassis space into two or even more independent compartments, wherein the CPU's heat dissipation water cooling radiator and fan are independently placed in the upper compartment, the water cooling head and water pump placed in the lower compartment are connected to the upper compartment through water pipes passing through the hollow gallery, and hardware such as the motherboard power supply and graphics card are placed in the lower compartment. The purpose is to allow the water cooling radiator fan in the upper compartment to directly inhale room temperature air, so that the CPU and graphics card with higher heat generation are physically isolated from the CPU's heat dissipation water cooling radiator and fan, so as to achieve independent heat dissipation without interfering with each other. The compartment architecture utilizes the advantages of heat conduction of the water pipes of the water-cooled radiator, and separates the heat dissipation components originally in one compartment into two or even more compartments that can directly use room temperature air for heat dissipation, thereby greatly improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figures 1 to 4 It is a structural schematic diagram of a box structure according to an implementation method of the prior art;

[0018] Figure 5 is a perspective exploded schematic diagram of a box structure according to an embodiment of the present invention;

[0019] Figure 6 to Figure 7 is a three-dimensional exploded schematic diagram of another viewing angle of the box structure according to one embodiment of the present invention;

[0020] Figures 8 to 12 is a schematic diagram of the heat dissipation airflow direction of the upper cabin box of the box structure according to one embodiment of the present invention;

[0021] Fig.13a 2 is a schematic diagram of the heat dissipation airflow direction of the upper cabin box of the box structure according to an embodiment of the present invention (single fan);

[0022] Fig.13bis a schematic diagram of the heat dissipation airflow direction of the upper cabin box of the box structure according to another embodiment of the present invention (dual fans);

[0023] Fig.13c is a schematic diagram of the heat dissipation airflow direction of the upper cabin box of the box structure according to another embodiment of the present invention (side-mounted water drain);

[0024] Fig.13d is a schematic diagram of the heat dissipation airflow direction of the upper cabin box of the box structure according to another embodiment of the present invention (side-mounted water drain);

[0025] Figures 14a to 14c It is a three-dimensional structural schematic diagram of a three-compartment box structure according to an embodiment of the present invention.

[0026] Description of main reference numerals:

[0027] 10-first cabin box, 101-left side panel, 102-right side panel, 103-first cabin panel, 104-upper cover, 105-front fan, 106-rear fan, 107-support leg, 20-second cabin box, 201-upper cabin cover, 2011-ventilation hole, 202-bridge, 2021-connecting column, 203-cover, 204-bracket, 205-second cabin panel, 30-third cabin box, 40-water cooling head, 50-heat dissipation pipeline, 60-water cooling radiator. DETAILED DESCRIPTION

[0028] The specific implementation modes of the present invention are described in detail below in conjunction with the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific implementation modes.

[0029] Unless explicitly stated otherwise, throughout the specification and claims, the term “comprise” or variations such as “include” or “comprising”, etc., will be understood to include the stated elements or components but not to exclude other elements or components.

[0030] like Figures 5 to 7 As shown, a compartment-type chassis structure according to a preferred embodiment of the present invention includes a plurality of cabin boxes, which are arranged adjacent to each other (stacked on each other or arranged horizontally, preferably stacked on each other), and the plurality of cabin boxes are used to accommodate a plurality of electronic components, including but not limited to CPU, GPU, motherboard, graphics card, sound card, power supply and water-cooled radiator 60, etc., and a distance space is provided between the plurality of cabin boxes, which can serve as an air inlet channel for one of the plurality of cabin boxes.

[0031] like Figures 8 to 12 See also Figures 5 to 7In some embodiments, the multiple cabin boxes include a first cabin box 10 and a second cabin box 20; the first cabin box 10 is used to accommodate a part of the multiple electronic components (for example, but not limited to, a CPU, a GPU, a motherboard, a graphics card, a sound card, and a power supply, etc.); the second cabin box 20 is arranged above the first cabin box 10, and the second cabin box 20 is used to accommodate a part of the multiple electronic components (for example, a water-cooled radiator 60 including a cooling water row and a cooling fan, etc.); wherein the distance space between the first cabin box 10 and the second cabin box 20 can serve as an air inlet channel for the second cabin box 20.

[0032] In some embodiments, the first cabin box 10 includes an upper cover plate 104, which is disposed on the top of the first cabin box 10 and is used to block the heat of the first cabin box 10 from flowing into the second cabin box 20; the second cabin box 20 includes an upper cabin cover 201, which is disposed on the top of the second cabin box 20, and a ventilation hole 2011 is provided on the upper cabin cover 201. The airflow enters the interior of the second cabin box 20 from the air inlet channel of the second cabin box 20, and then flows out from the ventilation hole 2011 of the upper cabin cover 201 to form a heat dissipation duct of the second cabin box 20.

[0033] In some embodiments, the cabin-type chassis structure further includes a gallery bridge 202, which is disposed between adjacent cabin boxes. The gallery bridge 202 is used to connect the first cabin box 10 and the second cabin box 20 and form a distance space therebetween.

[0034] In some embodiments, the second cabin box 20 includes a second cabin panel 205 and a cover plate 203; the second cabin panel 205 is disposed at the front of the second cabin box 20; the cover plate 203 is buckled at the rear of the corridor bridge 202, and the space enclosed by the cover plate 203 and the corridor bridge 202 can be used to accommodate the passage of the heat dissipation pipeline 50. In addition, the space enclosed by the cover plate 203 and the corridor bridge 202 can also be used for the control circuit or the power circuit to pass through, and of course the control circuit and the power circuit can also pass through other places, such as the wire hole (not shown) on the upper cover plate 104.

[0035] In some embodiments, the compartment-type chassis structure further includes a bracket 204 and a connecting column 2021; the bracket 204 is disposed on the top of the second cabin box 20, and the bracket 204 is used to connect the upper hatch 201 and the second cabin box 20; the connecting column 2021 is disposed at the gallery bridge 202, and the connecting column 2021 is used to fix the gallery bridge 202 between the bottom of the second cabin box 20 and the top of the first cabin box 10. The bracket 204 and the connecting column 2021 are mainly used to ensure the strength and firmness of the connection between the first cabin box 10 and the second cabin box 20.

[0036] In some embodiments, the compartment-type chassis structure also includes a water-cooled radiator 60, which includes a cooling water row and a cooling fan. The cooling fan is arranged at the top or bottom of the cooling water row, or at both the top and the bottom. The airflow formed by the cooling fan flows from the bottom of the second compartment box body 20 to the top of the second compartment box body 20 to form a cooling air duct.

[0037] like Figure 13a to Figure 13b As shown, in some embodiments, Fig.13a The embodiment is that the heat sink is only equipped with a set of heat sink fans, which are installed on the top or bottom of the heat sink; Fig.13b The thickness of the second compartment box 20 of the embodiment is obviously greater than Fig.13a This is because the heat sink of this embodiment is equipped with two sets of heat dissipation fans, which are respectively arranged at the top and bottom of the heat dissipation fans. The heat dissipation fan at the bottom blows air toward the heat dissipation water drain, and the heat dissipation fan at the top blows air away from the heat dissipation water drain. Whether the heat dissipation water drain is equipped with a single set of heat dissipation fans or a double set of heat dissipation fans depends on the heat dissipation requirements.

[0038] See also Fig. 9 and Fig.10 In some embodiments, the compartment-type chassis structure further includes a water cooling head 40, which is arranged at least at one heat source of the plurality of electronic components in the first compartment box 10, and the water cooling head 40 is connected to the heat dissipation water drain through the heat dissipation pipeline 50. Multiple water cooling heads 40 can be provided, for example, but not limited to, respectively arranged at heat sources such as a motherboard or a graphics card, and multiple water cooling heads 40 can be connected to the heat dissipation water drain through the heat dissipation pipeline 50.

[0039] See also Figures 5 to 7 In some embodiments, the first cabin box 10 includes a left side panel 101, a right side panel 102, a cabin panel 103, a front fan 105 and a rear fan 106; the left side panel 101 is covered on the left side of the first cabin box 10; the right side panel 102 is covered on the right side of the first cabin box 10; the front fan 105 is arranged at the front of the first cabin box 10; the cabin panel 103 is covered on the front side of the first cabin box 10 and is located in front of the front fan 105; the rear fan 106 is arranged at the rear of the first cabin box 10; wherein the front fan 105 and the rear fan 106 are used to form a heat dissipation duct that runs through the first cabin box 10 from front to back.

[0040] like Figures 13c to 13dAs shown, in some embodiments, the plurality of cabin boxes include a first cabin box 10 and a second cabin box 20; the first cabin box 10 is used to accommodate a portion of the plurality of electronic components; the second cabin box 20 is disposed on one side of the top of the first cabin box 10, and the second cabin box 20 is used to accommodate a portion of the plurality of electronic components; wherein the airflow flows from one side of the second cabin box 20 to the other side and forms a heat dissipation duct of the second cabin box 20. The heat dissipation airflow of the water-cooled radiator 60 of this embodiment does not flow from bottom to top, but flows from left to right or from right to left, and the heat dissipation water row of this embodiment can also be configured with a single group of heat dissipation fans or a double group of heat dissipation fans.

[0041] like Figures 14a to 14c As shown, in some embodiments, the multiple cabin boxes also include a third cabin box 30 disposed below the first cabin box 10, and used to accommodate a portion of the multiple electronic components (such as but not limited to a power supply and a power supply fan, etc.); wherein the third cabin box 30 is connected to the first cabin box 10 via a bridge 202, and the bridge 202 forms a distance space between the third cabin box 30 and the first cabin box 10 that can serve as an air inlet channel for the third cabin box 30.

[0042] In summary, the compartment-type chassis structure of the present invention has the following advantages: this solution changes the chassis structure by adopting a layered configuration, dividing the original chassis space into two or even more independent compartments, wherein the CPU's heat dissipation water cooling radiator and fan are independently placed in the upper compartment, the water cooling head and water pump placed in the lower compartment are connected to the upper compartment through water pipes passing through the hollow gallery, and hardware such as the motherboard power supply and graphics card are placed in the lower compartment. The purpose is to allow the water cooling radiator fan in the upper compartment to directly inhale room temperature air, so that the CPU and graphics card with higher heat generation are physically isolated from the CPU's heat dissipation water cooling radiator and fan, so as to achieve independent heat dissipation without interfering with each other. The compartment architecture utilizes the advantages of heat conduction of the water pipes of the water-cooled radiator, and separates the heat dissipation components originally in one compartment into two or even more compartments that can directly use room temperature air for heat dissipation, thereby greatly improving the heat dissipation efficiency.

[0043] The foregoing description of specific exemplary embodiments of the present invention is for the purpose of illustration and demonstration. These descriptions are not intended to limit the present invention to the precise form disclosed, and it is clear that many changes and variations can be made based on the above teachings. The purpose of selecting and describing the exemplary embodiments is to explain the specific principles of the present invention and its practical application, so that those skilled in the art can realize and utilize various different exemplary embodiments of the present invention and various different selections and changes. The scope of the present invention is intended to be limited by the claims and their equivalents.

Claims

1. A compartment-type chassis structure, characterized in that: It comprises a plurality of cabin boxes, which are arranged adjacent to each other, the plurality of cabin boxes are used to accommodate a plurality of electronic components, and a distance space is arranged between the plurality of cabin boxes, and the distance space can be used as an air inlet channel of one of the plurality of cabin boxes; The plurality of cabin boxes include: A first chamber box, which is used to accommodate a portion of the plurality of electronic components; and A second cabin box, which is arranged above the first cabin box, and the second cabin box is used to accommodate a part of the plurality of electronic components; The distance space between the first cabin box and the second cabin box can serve as an air inlet channel for the second cabin box; The first cabin box includes an upper cover plate, which is arranged on the top of the first cabin box and is used to block the heat of the first cabin box from flowing into the second cabin box; the second cabin box includes an upper hatch, which is arranged on the top of the second cabin box, and the upper hatch is provided with ventilation holes, so that air flows from the air inlet channel of the second cabin box into the interior of the second cabin box, and then flows out from the ventilation holes of the upper hatch to form a heat dissipation duct of the second cabin box; The compartment-type chassis structure includes a gallery bridge, which is arranged between adjacent compartment boxes, and the gallery bridge is used to connect the first compartment box and the second compartment box and form a distance space between the two; The air inlet passage is a passage open on all sides, which can directly introduce air outside the multiple cabin boxes into the cabin boxes for heat dissipation.

2. The compartment-type chassis structure according to claim 1, characterized in that: The second cabin box comprises: A second cabin panel, which is arranged at the front of the second cabin box; and A cover plate is buckled on the rear part of the gallery bridge, and a space enclosed by the cover plate and the gallery bridge can be used to accommodate a heat dissipation pipeline to pass through.

3. The compartment-type chassis structure according to claim 2, characterized in that: Also includes: A bracket, which is arranged on the top of the second cabin box, and the bracket is used for connecting the upper hatch cover and the second cabin box; as well as A connecting column is arranged at the gallery bridge, and the connecting column is used to fix the gallery bridge between the bottom of the second cabin box and the top of the first cabin box.

4. The compartment-type chassis structure according to claim 2, characterized in that: It also includes a water-cooled radiator, which includes a cooling water row and a cooling fan. The cooling fan is arranged on the top or bottom of the cooling water row. The airflow formed by the cooling fan flows from the bottom of the second cabin box to the top of the second cabin box to form a cooling air duct.

5. The compartment-type chassis structure according to claim 4, characterized in that: It also includes a water cooling head, which is attached to at least one heat source of the plurality of electronic components in the first compartment box, and the water cooling head is connected to the heat dissipation water drain through the heat dissipation pipeline.

6. The compartment-type chassis structure according to claim 1, characterized in that: The first cabin box comprises: A left side plate, the cover of which is arranged on the left side of the first cabin box; A right side plate, the cover of which is arranged on the right side of the first cabin box; A front fan, which is arranged at the front of the first cabin box; a cabin panel, the cover of which is arranged on the front side of the first cabin box and is located in front of the front fan; and A rear fan is arranged at the rear part of the first cabin box; wherein the front fan and the rear fan are used to form a heat dissipation duct running through the first cabin box from front to back.

7. The compartment-type chassis structure according to claim 1, characterized in that: The plurality of chamber boxes further include a third chamber box, which is arranged below the first chamber box and is used to accommodate a part of the plurality of electronic components; The third cabin box is connected to the first cabin box via a gallery bridge, and the gallery bridge forms a distance space between the third cabin box and the first cabin box that can serve as an air inlet channel for the third cabin box.

8. The compartment-type chassis structure according to claim 1, characterized in that: The plurality of cabin boxes include: A first chamber box, which is used to accommodate a portion of the plurality of electronic components; and A second cabin box, which is arranged on one side of the top of the first cabin box, and the second cabin box is used to accommodate a part of the plurality of electronic components; The airflow flows from one side of the second cabin box to the other side and forms a heat dissipation duct of the second cabin box.

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